CN117491686B - Microstructure measurement positioning method and system for sample to be measured - Google Patents
Microstructure measurement positioning method and system for sample to be measured Download PDFInfo
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- CN117491686B CN117491686B CN202311841197.7A CN202311841197A CN117491686B CN 117491686 B CN117491686 B CN 117491686B CN 202311841197 A CN202311841197 A CN 202311841197A CN 117491686 B CN117491686 B CN 117491686B
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- 238000005259 measurement Methods 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000012545 processing Methods 0.000 claims abstract description 95
- 238000013461 design Methods 0.000 claims description 82
- 238000004891 communication Methods 0.000 claims description 10
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000010835 comparative analysis Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
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Abstract
The invention provides a method and a system for measuring and positioning microstructure of a sample to be measured, wherein the method comprises the following steps: the processing unit receives real scanning information of a sample to be detected, which is arranged on the supporting piece; the processing unit compares and analyzes the real scanning information of the sample to be detected with the recorded information of the sample to be detected, and generates fitting image information required by the sample to be detected; and the processing unit generates a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the record information of the sample to be detected. When the actual sample to be measured has defects or the specification does not meet the requirements and the information of the position to be measured of the sample to be measured is specific point location information, the positioning precision of the required measuring position of the sample to be measured is improved, the testing duration is reduced, and the testing efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of sample testing, and particularly relates to a method and a system for measuring and positioning microstructure of a sample to be tested.
Background
An atomic force microscope (Atomic Force Microscope, AFM) is an analytical instrument that can measure the microstructure of a sample to be measured.
In the process of measuring the microstructure of the sample to be measured by adopting an atomic force microscope, the position to be measured of the sample to be measured needs to be positioned firstly, and then the position to be measured of the sample to be measured is measured by adopting the atomic force microscope, and the specific method is as follows:
1. and adjusting the supporting workpiece to a horizontal position, and placing the sample to be tested on the supporting workpiece.
2. The atomic force microscope is set in a fixed position.
3. And moving the support workpiece, and adjusting the relative position of the sample to be detected on the support workpiece and the atomic force microscope to enable the sample to be detected to be located at the position to be detected.
4. And measuring the position to be measured of the sample to be measured by adopting an atomic force microscope.
When the actual sample to be measured has defects or the specification does not meet the requirements and the information of the position to be measured of the sample to be measured is specific point location information, in the actual measurement operation process of the step 3, an operator can judge the information of the specific measurement point location of the sample to be measured by human eyes based on the actual sample to be measured, so that the positioning precision of the position to be measured of the sample to be measured is low and the test time is long.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a method and a system for measuring and positioning a microstructure of a sample to be measured.
The invention is realized by the following technical scheme:
the invention provides a microstructure measurement positioning method of a sample to be measured, which comprises the following steps:
the processing unit receives real scanning information of a sample to be detected, which is arranged on the supporting piece;
the processing unit performs comparative analysis on the real scanning information of the sample to be detected and the record information of the sample to be detected, and generates fitting image information required by the sample to be detected;
and the processing unit generates a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the record information of the sample to be detected.
Further, the real scanning information of the sample to be detected includes: the actual edge profile of the sample to be measured, the actual size of the sample to be measured and the extending intersection point of the actual edge profile of the sample to be measured in the horizontal direction and the vertical direction.
Further, before the processing unit receives the real scan information of the sample to be measured placed on the support, the processing unit further includes:
storing the record information of the sample to be tested in the processing unit;
the sample record information to be measured comprises the item category of the sample to be measured, the model number of the sample to be measured and the theoretical design information of the sample to be measured;
the theoretical design information of the sample to be tested comprises the theoretical design edge outline of the sample to be tested, the theoretical design size of the sample to be tested and the theoretical design measurement position of the sample to be tested.
Further, the processing unit performs a comparative analysis on the real scanning information of the sample to be detected and the record information of the sample to be detected, and generates fitting image information required by the sample to be detected, including:
and the processing unit compares and analyzes the real scanning information of the sample to be detected with the theoretical design information of the sample to be detected, and generates fitting image information required by the sample to be detected.
Further, the processing unit performs a comparative analysis on the real scan information of the sample to be tested and the theoretical design information of the sample to be tested, and generates fitting image information required by the sample to be tested, including:
the processing unit compares and analyzes the real scanning information of the sample to be detected with theoretical design information of the sample to be detected, and generates preliminary fitting image information of the sample to be detected;
and the processing unit corrects the preliminary fitting image information of the sample to be detected according to the theoretical design information of the sample to be detected, so as to obtain the fitting image information required by the sample to be detected.
Further, the processing unit performs a comparative analysis on the real scanning information of the sample to be tested and the theoretical design information of the sample to be tested, and generates preliminary fitting image information of the sample to be tested, which specifically includes:
the processing unit compares the actual edge profile of the sample to be detected in the actual scanning information of the sample to be detected with the theoretical design edge profile of the sample to be detected;
if the edge contour difference of the two is within the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the real scanning information of the sample to be measured;
if the edge contour difference of the two is not in the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the corrected real scanning information of the sample to be measured;
the corrected real scanning information of the sample to be detected comprises the actual size of the sample to be detected and the theoretical design edge profile of the sample to be detected;
the information of the preliminary fitting image of the sample to be measured comprises the size of the preliminary fitting image of the sample to be measured, the edge contour of the preliminary fitting image of the sample to be measured and the angle difference between the preliminary fitting image of the sample to be measured and the horizontal X axis in the fitting measurement area.
Further, the processing unit corrects the preliminary fitting image information of the sample to be measured according to theoretical design information of the sample to be measured to obtain fitting image information required by the sample to be measured, and specifically includes:
the processing unit performs scaling operation on the preliminary fitting image of the sample to be measured in a fitting measurement area according to the theoretical design size of the sample to be measured, so that the size of the preliminary fitting image of the sample to be measured is consistent with the theoretical design size of the sample to be measured, and fitting image information required by the sample to be measured is obtained;
the information of the fitting image required by the sample to be measured comprises the size of the fitting image required by the sample to be measured, the edge contour of the fitting image required by the sample to be measured and the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area.
Further, the processing unit generates a measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be measured and the recording information of the sample to be measured, and the processing unit comprises:
the processing unit designs a measurement position according to the theory of the sample to be measured, marks the position to be measured required by the sample to be measured in fitting image information required by the sample to be measured, and generates a sample measurement positioning file to be measured;
the processing unit converts the measurement positioning file of the sample to be detected into the measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope.
Further, before the processing unit receives the real scan information of the sample to be measured placed on the support, the processing unit further includes:
a machine vision system is adopted to control the first moving assembly to drive the shooting unit to move above the sample to be detected;
the machine vision system controls the shooting unit to scan and image in the sample scanning area to be detected according to the received sample scanning area information to be detected, so as to obtain the real scanning information of the sample to be detected;
and the machine vision system sends the real scanning information of the sample to be tested to the processing unit.
Further, before the machine vision system is used for controlling the first moving assembly to drive the shooting unit to move above the sample to be detected, the machine vision system further comprises:
an infrared sensor is arranged on one side of the supporting piece, which is contacted with the sample to be detected;
when the infrared sensor acquires the identification information of the sample to be measured placed on the supporting piece, the identification information is sent to the machine vision system, so that the machine vision system controls the first moving assembly to drive the shooting unit to move to the position above the sample to be measured based on the identification information.
Further, before the machine vision system controls the shooting unit to perform scanning imaging in the sample scanning area to be detected according to the received sample scanning area information to be detected to obtain the real scanning information of the sample to be detected, the machine vision system further comprises:
and the processing unit sends the information of the scanning area of the sample to be detected to the machine vision system.
Further, before the processing unit generates the measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be measured and the record information of the sample to be measured, the processing unit further includes:
the processing unit sends a rotation operation instruction to the machine vision system based on the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area;
after the machine vision system receives the rotating operation instruction, the second moving assembly is controlled to drive the supporting piece to rotate, and when a fitting image required by the sample to be measured in the fitting measurement area and a horizontal X axis in the fitting measurement area are 0 degrees, the supporting piece stops rotating, and the sample to be measured is in a straightening state at the moment.
Further, the method also comprises the step of calibrating the alignment state of the sample to be tested.
Correspondingly, the invention also provides a microstructure measurement positioning system for the sample to be measured, which comprises a processing unit, wherein the processing unit performs the following operations:
receiving real scanning information of a sample to be detected, which is arranged on a supporting piece;
comparing and analyzing the real scanning information of the sample to be tested with the recorded information of the sample to be tested to generate fitting image information required by the sample to be tested;
and generating a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the record information of the sample to be detected.
Further, the real scanning information of the sample to be detected includes: the actual edge profile of the sample to be measured, the actual size of the sample to be measured and the extending intersection point of the actual edge profile of the sample to be measured in the horizontal direction and the vertical direction.
Further, the processing unit performs the following operations before receiving the real scan information of the sample to be measured placed on the support:
storing record information of a sample to be tested;
the sample record information to be measured comprises the item category of the sample to be measured, the model number of the sample to be measured and the theoretical design information of the sample to be measured;
the theoretical design information of the sample to be tested comprises the theoretical design edge outline of the sample to be tested, the theoretical design size of the sample to be tested and the theoretical design measurement position of the sample to be tested.
Further, the comparing the real scanning information of the sample to be measured with the recorded information of the sample to be measured to generate fitting image information required by the sample to be measured includes:
and comparing and analyzing the real scanning information of the sample to be tested with the theoretical design information of the sample to be tested, and generating fitting image information required by the sample to be tested.
Further, the comparing the real scan information of the sample to be tested with the theoretical design information of the sample to be tested to generate fitting image information required by the sample to be tested, includes:
comparing and analyzing the real scanning information of the sample to be tested with theoretical design information of the sample to be tested, and generating preliminary fitting image information of the sample to be tested;
and correcting the preliminary fitting image information of the sample to be tested according to the theoretical design information of the sample to be tested, and obtaining the fitting image information required by the sample to be tested.
Further, the comparing and analyzing the real scanning information of the sample to be tested with the theoretical design information of the sample to be tested to generate the preliminary fitting image information of the sample to be tested, specifically comprising:
comparing the actual edge contour of the sample to be detected in the real scanning information of the sample to be detected with the theoretical design edge contour of the sample to be detected;
if the edge contour difference of the two is within the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the real scanning information of the sample to be measured;
if the edge contour difference of the two is not in the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the corrected real scanning information of the sample to be measured;
the corrected real scanning information of the sample to be detected comprises the actual size of the sample to be detected and the theoretical design edge profile of the sample to be detected;
the information of the preliminary fitting image of the sample to be measured comprises the size of the preliminary fitting image of the sample to be measured, the edge contour of the preliminary fitting image of the sample to be measured and the angle difference between the preliminary fitting image of the sample to be measured and the horizontal X axis in the fitting measurement area.
Further, the correcting the preliminary fitting image information of the sample to be measured according to the theoretical design information of the sample to be measured to obtain the fitting image information required by the sample to be measured specifically includes:
according to the theoretical design size of the sample to be measured, scaling the preliminary fitting image of the sample to be measured in a fitting measurement area, so that the size of the preliminary fitting image of the sample to be measured is consistent with the theoretical design size of the sample to be measured, and fitting image information required by the sample to be measured is obtained;
the information of the fitting image required by the sample to be measured comprises the size of the fitting image required by the sample to be measured, the edge contour of the fitting image required by the sample to be measured and the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area.
Further, the generating a measurement positioning file of the sample to be measured, which can be identified by an atomic force microscope, based on the fitting image information required by the sample to be measured and the record information of the sample to be measured, includes:
according to the theoretical design measurement position of the sample to be measured, marking the position to be measured of the sample to be measured in fitting image information required by the sample to be measured, and generating a sample measurement positioning file to be measured;
and converting the measurement positioning file of the sample to be measured into the measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope.
Further, the camera also comprises a machine vision system, a first moving component and a shooting unit;
the machine vision system is in communication connection with the processing unit and a first mobile component, and the first mobile component is connected with the shooting unit;
the machine vision system controls the first moving assembly to drive the shooting unit to move above the sample to be detected;
the machine vision system controls the shooting unit to scan and image in the sample scanning area to be detected according to the received sample scanning area information to be detected, so as to obtain the real scanning information of the sample to be detected;
and the machine vision system sends the real scanning information of the sample to be tested to the processing unit.
Further, the infrared sensor is also included;
the infrared sensor is arranged on one side of the supporting piece, which is contacted with the sample to be detected, and is in communication connection with the machine vision system;
when the infrared sensor acquires the identification information of the sample to be measured placed on the supporting piece, the identification information is sent to the machine vision system, so that the machine vision system controls the first moving assembly to drive the shooting unit to move to the position above the sample to be measured based on the identification information.
Further, the processing unit is further configured to: and sending the information of the scanning area of the sample to be detected to the machine vision system.
Further, a second moving assembly is included;
the second mobile assembly is in communication with the machine vision system, the second mobile assembly being connected with the support;
the processing unit sends a rotation operation instruction to the machine vision system based on the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area;
after the machine vision system receives the rotating operation instruction, the second moving assembly is controlled to drive the supporting piece to rotate, and when a fitting image required by the sample to be measured in the fitting measurement area and a horizontal X axis in the fitting measurement area are 0 degrees, the supporting piece stops rotating, and the sample to be measured is in a straightening state at the moment.
Further, the calibration operation is performed on the alignment state of the sample to be measured.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
the invention provides a microstructure measurement positioning method of a sample to be measured, firstly, a processing unit receives real scanning information of the sample to be measured, which is arranged on a supporting piece; then, the processing unit compares and analyzes the real scanning information of the sample to be detected with the recorded information of the sample to be detected, and generates fitting image information required by the sample to be detected; and finally, the processing unit generates a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the record information of the sample to be detected. When the actual sample to be measured has defects or the specification does not meet the requirements and the information of the position to be measured of the sample to be measured is specific point location information, the real scanning information of the sample to be measured and the recorded information of the sample to be measured are compared and analyzed to correspondingly generate the fitting image information required by the sample to be measured, and then the point location information to be measured in the recorded information of the sample to be measured is combined to generate the measuring and positioning file of the sample to be measured, which can be identified by an atomic force microscope, so that the positioning precision of the measuring position required by the sample to be measured is improved, the testing time length is reduced, and the testing efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the connection of a structural block diagram of a microstructure measurement positioning system for a sample to be measured according to the present invention;
FIG. 2 is a schematic diagram of a part of a microstructure measurement positioning system for a sample to be measured according to the present invention;
FIG. 3 is a schematic diagram of a fitting measurement area showing the fitting image information required for a sample to be measured;
FIG. 4 is a flow chart of the microstructure measurement positioning method of the sample to be measured according to the present invention;
fig. 5 is a schematic diagram of real scan information of a sample to be measured.
The device comprises a 1-infrared sensor, a 2-shooting unit, a 3-supporting piece, a 4-X axis direction moving part, a 5-Y axis direction moving part, a 6-Z axis direction moving part, a 7-first driving motor, an 8-second driving motor, a 9-third driving motor and a 10-fourth driving motor.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms "first," "second," and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The terms "a," "an," and other similar words are not intended to mean that there is only one of the things, but rather that the description is directed to only one of the things, which may have one or more. In this document, the terms "comprise," "include," and other similar words are intended to denote a logical relationship, but not to be construed as implying a spatial structural relationship. For example, "a includes B" is intended to mean that logically B belongs to a, and not that spatially B is located inside a. In addition, the terms "comprising," "including," and other similar terms should be construed as open-ended, rather than closed-ended. For example, "a includes B" is intended to mean that B belongs to a, but B does not necessarily constitute all of a, and a may also include other elements such as C, D, E.
The terms "embodiment," "this embodiment," "preferred embodiment," "one embodiment," and the like herein do not denote that the descriptions are merely applicable to one particular embodiment, but rather denote that the descriptions are also applicable to one or more other embodiments. It will be appreciated by those skilled in the art that any descriptions of one embodiment herein may be substituted for, combined with, or otherwise combined with the descriptions of another embodiment or embodiments, such substitution, combination, or other combination resulting in a new embodiment as would be apparent to one of ordinary skill in the art and would be within the scope of this invention.
In the description herein, the meaning of "plurality" is at least two, such as two, three, etc., unless specifically defined otherwise.
As shown in fig. 1 and 2, the present invention provides a microstructure measuring and positioning system for a sample to be measured, which includes a processing unit, a machine vision system, an infrared sensor 1, a photographing unit 2, a first moving assembly, a second moving assembly, and a support 3.
The processing unit is in communication connection with the input end of the machine vision system, the output end of the machine vision system is in communication connection with the first moving assembly and the second moving assembly, the first moving assembly is connected with the shooting unit 2, and the second moving assembly is connected with the supporting piece 3.
One side of the supporting piece 3, which is contacted with the sample to be detected, is provided with an infrared sensor 1, and the output end of the infrared sensor 1 is in communication connection with the input end of the machine vision system. The number of the infrared sensors 1 provided on the support 3 is not limited to one, and may be plural, such as 4 infrared sensors 1 provided on the support 3 as shown in fig. 2.
For example, the first moving assembly may include an X-axis direction moving part 4, a Y-axis direction moving part 5, and a Z-axis direction moving part 6 that are stacked, where a first driving motor 7 is disposed on the X-axis direction moving part 4, a second driving motor 8,Z is disposed on the Y-axis direction moving part 5, and a third driving motor 9 is disposed on the Y-axis direction moving part 6, and the first driving motor 7, the second driving motor 8, and the third driving motor 9 are communicatively connected to an output end of the machine vision system.
The second moving part includes a fourth driving motor 10, a driving rack and a driving gear, wherein the fourth driving motor 10 is in communication connection with an output end of the machine vision system, and the fourth driving motor 10 is connected with the supporting member 3 through the driving rack and the driving gear.
And the processing unit stores record information of the sample to be detected.
The record information of the sample to be measured includes the item category of the sample to be measured, the model number of the sample to be measured, theoretical design information of the sample to be measured and scanning area information of the sample to be measured.
The category of the sample item to be measured and the model of the sample to be measured are recorded in the record information of the sample to be measured, so that the classification and arrangement of the measurement requirement information of different samples to be measured in different items can be facilitated.
Exemplary theoretical design information of the sample to be measured includes theoretical design edge profile of the sample to be measured, theoretical design size of the sample to be measured, and theoretical design measurement position of the sample to be measured.
For example, the sample scanning area to be measured is set by the sample scanning area to be measured information, and the sample scanning area to be measured can be correspondingly designed by a person skilled in the art according to the measurement requirements of different samples to be measured.
The support piece is placed horizontally and is used for placing a sample to be tested. The sample to be measured may be a grating structure, for example.
The infrared sensor is used for obtaining the identification information of the sample to be measured placed on the support piece, the output end of the infrared sensor sends the identification information of the sample to be measured placed on the support piece to the machine vision system, and the machine vision system controls the first moving assembly to drive the shooting unit to move to the position above the sample to be measured based on the received identification information.
And the machine vision system controls the shooting unit to scan and image in the sample scanning area to be detected according to the received sample scanning area information to be detected sent by the processing unit, so as to obtain the real scanning information of the sample to be detected and send the real scanning information to the processing unit.
The processing unit performs contrast analysis based on the real scanning information of the sample to be tested and the recorded information of the sample to be tested to generate fitting image information required by the sample to be tested, and then combines the position information to be tested in the recorded information of the sample to be tested to generate a sample to be tested measurement positioning file which can be identified by the atomic force microscope, so that the positioning precision of the required measurement position of the sample to be tested is improved, the test duration is reduced, and the test efficiency is improved.
The processing unit may be an existing computer, the machine vision system may be an existing device, and the infrared sensor may be an existing device. The shooting unit can adopt the existing equipment, such as the existing macro lens. The support member may be an existing tray.
The following describes the microstructure measurement positioning method of the sample to be measured by using the microstructure measurement positioning system of the sample to be measured in detail, as shown in fig. 4, specifically as follows:
s1, placing a sample to be tested on a support.
And S2, after the infrared sensor on the support member obtains the identification information of the sample to be detected placed on the support member, the identification information is sent to the machine vision system.
And S3, after receiving the identification information sent by the infrared sensor, the machine vision system controls the first moving assembly to drive the shooting unit to move above the sample to be detected.
And S4, the processing unit sends the information of the scanning area of the sample to be detected to the machine vision system.
And S5, controlling the first moving assembly to drive the shooting unit to scan and image in the sample scanning area according to the received sample scanning area information to be detected by the machine vision system, and obtaining the real scanning information of the sample to be detected. For example, the real scan information of the sample to be measured herein may include: the actual edge profile of the sample to be measured, the actual size of the sample to be measured and the intersection point of the actual edge profile of the sample to be measured in the edge extending direction. As shown in fig. 5, the actual edge profile of the sample to be measured is close to a rectangle, but the vertex angle of the rectangle is not a right angle, and is in a rounded shape, the length of the first edge is 0.14 μm, the length of the second edge is 0.37 μm, the length of the third edge is 0.12 μm, the length of the fourth edge is 0.41 μm, the first edge and the second edge form a junction point a in the edge extending direction, and the second edge and the third edge form a junction point b in the edge extending direction.
The machine vision system sends the real scanning information of the sample to be tested to the processing unit.
S6, after receiving the real scanning information of the sample to be detected, the processing unit performs the following operations:
s6-1 processing unit compares and analyzes the real scanning information of the sample to be tested with the record information of the sample to be tested stored in the processing unit, and generates fitting image information required by the sample to be tested. The record information of the sample to be tested comprises the item category of the sample to be tested, the model number of the sample to be tested and the theoretical design information of the sample to be tested. The theoretical design information of the sample to be tested comprises the theoretical design edge outline of the sample to be tested, the theoretical design size of the sample to be tested and the theoretical design measurement position of the sample to be tested.
The processing unit compares and analyzes the real scanning information of the sample to be tested with theoretical design information of the sample to be tested, and generates fitting image information required by the sample to be tested.
In a more specific example of this,
1. the processing unit is used for carrying out contrast analysis on the real scanning information of the sample to be detected and the theoretical design information of the sample to be detected to generate preliminary fitting image information of the sample to be detected, and specifically comprises the following steps:
the processing unit compares the actual edge profile of the sample to be detected in the real scanning information of the sample to be detected with the theoretical design edge profile of the sample to be detected, and judges whether the difference of the edge profiles of the actual edge profile and the theoretical design edge profile of the sample to be detected is within a set error range. Here the error range is the maximum acceptable range for both edge profile differences. The maximum acceptable range of the edge profile difference of the two can be correspondingly designed based on the test requirement of the sample to be tested.
If the edge contour difference of the two is within the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in the fitting measurement area according to the real scanning information of the sample to be measured.
If the edge contour difference of the two is not in the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in the fitting measurement area according to the corrected real scanning information of the sample to be measured.
The corrected real scan information of the sample to be measured includes the actual size of the sample to be measured and the theoretical design edge profile of the sample to be measured.
The information of the preliminary fitting image of the sample to be measured includes, for example, the size of the preliminary fitting image of the sample to be measured, the edge contour of the preliminary fitting image of the sample to be measured, and the angle difference between the preliminary fitting image of the sample to be measured and the horizontal X-axis in the fitting measurement area.
2. The processing unit corrects the preliminary fitting image information of the sample to be tested according to the theoretical design information of the sample to be tested to obtain the fitting image information required by the sample to be tested, and specifically comprises the following steps:
and the processing unit performs scaling operation on the preliminary fitting image of the sample to be measured in the fitting measurement area according to the theoretical design size of the sample to be measured, so that the size of the preliminary fitting image of the sample to be measured is consistent with the theoretical design size of the sample to be measured, and the fitting image information required by the sample to be measured is obtained.
The information of the fitting image required by the sample to be measured comprises the size of the fitting image required by the sample to be measured, the edge contour of the fitting image required by the sample to be measured and the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area. As shown in fig. 3, the required fitting image of the sample to be measured is rectangular, the length of the required fitting image of the sample to be measured is 0.52 μm, the width of the required fitting image of the sample to be measured is 0.15 μm, and the angle between the required fitting image of the sample to be measured and the horizontal X-axis in the fitting measurement area is 30 °.
Through the operation, the image edge contour and the image size of the fitting image required by the sample to be measured, which are obtained based on the real scanning information of the sample to be measured, correspond to the theoretical design edge contour of the sample to be measured and the theoretical design size of the sample to be measured, so that the accurate positioning measurement of the theoretical design position of the corresponding sample to be measured on the actual sample to be measured can be realized.
And S6-2, the processing unit sends a rotation operation instruction to the machine vision system based on the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area. For example, the rotation operation instruction herein may include a rotation direction and a rotation angle.
After the machine vision system receives the rotating operation instruction, the second moving assembly is controlled to drive the supporting piece to rotate. In the process, the processing unit controls fitting images required by fitting the sample to be measured in the measurement area to perform synchronous rotation operation based on the rotation operation instruction. When the fitting image required by the sample to be measured in the fitting measurement area and the horizontal X axis in the fitting measurement area are 0 degrees, the support piece stops rotating, and the sample to be measured is in a straightening state at the moment.
And S6-3, the processing unit generates a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the record information of the sample to be detected.
Exemplary, the operations are specifically as follows:
the processing unit designs a measurement position according to the theory of the sample to be measured, marks the position to be measured required by the sample to be measured in fitting image information required by the sample to be measured, and generates a sample to be measured measurement positioning file.
The processing unit converts the measurement positioning file of the sample to be measured into the measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope.
Through the S6-2 operation, the placement orientation of the sample to be measured on the support member is positioned when the fitting image of the sample to be measured, which is generated by the fitting measurement area in the processing unit, is horizontally placed, so that the position to be measured of the sample to be measured can be rapidly and accurately positioned after the subsequent atomic force microscope receives the sample to be measured measurement positioning file sent by the processing unit.
In order to further ensure that the fitting image required by the sample to be measured in the fitting measurement area and the horizontal X axis in the fitting measurement area are 0 degrees, as a preferred implementation step, the calibration operation can be performed on the alignment state of the sample to be measured, namely the operations S5-S6 are repeated, and the processing unit after the repeated operation sends the generated measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope, to the atomic force microscope based on the fitting image information required by the sample to be measured and the record information of the sample to be measured.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, one skilled in the art may make modifications and equivalents to the specific embodiments of the present invention, and any modifications and equivalents not departing from the spirit and scope of the present invention are within the scope of the claims of the present invention.
Claims (16)
1. The microstructure measurement positioning method for the sample to be measured is characterized by comprising the following steps of:
storing record information of a sample to be tested, including item types of the sample to be tested, model numbers of the sample to be tested and theoretical design information of the sample to be tested, in a processing unit; the theoretical design information of the sample to be tested comprises the theoretical design edge outline of the sample to be tested, the theoretical design size of the sample to be tested and the theoretical design measurement position of the sample to be tested;
the processing unit receives real scanning information of a sample to be detected, which is arranged on the supporting piece; the real scanning information of the sample to be detected comprises: the method comprises the steps that the actual edge profile of a sample to be detected, the actual size of the sample to be detected and the extending intersection point of the actual edge profile of the sample to be detected in the horizontal direction and the vertical direction;
the processing unit compares the actual edge profile of the sample to be detected with the theoretical design edge profile of the sample to be detected; if the edge contour difference of the two is within the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the real scanning information of the sample to be measured; if the edge contour difference of the two is not in the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the corrected real scanning information of the sample to be measured; the corrected real scanning information of the sample to be detected comprises the actual size of the sample to be detected and the theoretical design edge profile of the sample to be detected; the information of the preliminary fitting image of the sample to be measured comprises the size of the preliminary fitting image of the sample to be measured, the edge contour of the preliminary fitting image of the sample to be measured and the angle difference between the preliminary fitting image of the sample to be measured and the horizontal X axis in the fitting measurement area;
the processing unit corrects the preliminary fitting image information of the sample to be tested according to the theoretical design information of the sample to be tested to obtain fitting image information required by the sample to be tested;
and the processing unit generates a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the theoretical design measurement position of the sample to be detected.
2. The method for measuring and positioning microstructure of a sample to be measured according to claim 1, wherein the processing unit corrects the preliminary fitting image information of the sample to be measured according to theoretical design information of the sample to be measured, to obtain fitting image information required by the sample to be measured, and specifically comprises:
the processing unit performs scaling operation on the preliminary fitting image of the sample to be measured in a fitting measurement area according to the theoretical design size of the sample to be measured, so that the size of the preliminary fitting image of the sample to be measured is consistent with the theoretical design size of the sample to be measured, and fitting image information required by the sample to be measured is obtained;
the information of the fitting image required by the sample to be measured comprises the size of the fitting image required by the sample to be measured, the edge contour of the fitting image required by the sample to be measured and the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area.
3. The method for measuring and positioning a microstructure of a sample to be measured according to claim 1, wherein the processing unit generates a sample to be measured measurement positioning file identifiable by an atomic force microscope based on the fitting image information required by the sample to be measured and a theoretical design measurement position of the sample to be measured, and the method comprises the steps of:
the processing unit designs a measurement position according to the theory of the sample to be measured, marks the position to be measured required by the sample to be measured in fitting image information required by the sample to be measured, and generates a sample measurement positioning file to be measured;
the processing unit converts the measurement positioning file of the sample to be detected into the measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope.
4. The method of claim 1, wherein the processing unit further comprises, prior to receiving the true scan information of the sample to be measured placed on the support:
a machine vision system is adopted to control the first moving assembly to drive the shooting unit to move above the sample to be detected;
the machine vision system controls the shooting unit to scan and image in the sample scanning area to be detected according to the received sample scanning area information to be detected, so as to obtain the real scanning information of the sample to be detected;
and the machine vision system sends the real scanning information of the sample to be tested to the processing unit.
5. The method for positioning a microstructure of a sample to be measured according to claim 4, wherein before the machine vision system is used to control the first moving assembly to drive the photographing unit to move above the sample to be measured, the method further comprises:
an infrared sensor is arranged on one side of the supporting piece, which is contacted with the sample to be detected;
when the infrared sensor acquires the identification information of the sample to be measured placed on the supporting piece, the identification information is sent to the machine vision system, so that the machine vision system controls the first moving assembly to drive the shooting unit to move to the position above the sample to be measured based on the identification information.
6. The method for measuring and positioning microstructure of a sample to be measured according to claim 4, wherein before the machine vision system controls the photographing unit to perform scanning imaging in the sample scanning area to be measured according to the received sample scanning area information to be measured, the method further comprises:
and the processing unit sends the information of the scanning area of the sample to be detected to the machine vision system.
7. The method for measuring and positioning a microstructure of a sample to be measured according to claim 2, wherein before the processing unit generates a sample to be measured measurement positioning file that can be identified by an atomic force microscope based on the fitting image information required by the sample to be measured and the record information of the sample to be measured, the method further comprises:
the processing unit sends a rotation operation instruction to the machine vision system based on the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area;
after the machine vision system receives the rotating operation instruction, the second moving assembly is controlled to drive the supporting piece to rotate, and when a fitting image required by the sample to be measured in the fitting measurement area and a horizontal X axis in the fitting measurement area are 0 degrees, the supporting piece stops rotating, and the sample to be measured is in a straightening state at the moment.
8. The method for positioning a microstructure of a sample to be measured according to claim 7, further comprising performing a calibration operation on the alignment state of the sample to be measured.
9. A microstructure measurement positioning system for a sample to be measured, comprising a processing unit, the processing unit performing the following operations:
storing record information of a sample to be tested, including the item category of the sample to be tested, the model number of the sample to be tested and theoretical design information of the sample to be tested; the theoretical design information of the sample to be tested comprises the theoretical design edge outline of the sample to be tested, the theoretical design size of the sample to be tested and the theoretical design measurement position of the sample to be tested;
receiving real scanning information of a sample to be detected, which is arranged on a supporting piece; the real scanning information of the sample to be detected comprises: the method comprises the steps that the actual edge profile of a sample to be detected, the actual size of the sample to be detected and the extending intersection point of the actual edge profile of the sample to be detected in the horizontal direction and the vertical direction;
comparing the actual edge profile of the sample to be detected with the theoretical design edge profile of the sample to be detected; if the edge contour difference of the two is within the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the real scanning information of the sample to be measured; if the edge contour difference of the two is not in the set error range, the processing unit generates preliminary fitting image information of the sample to be measured in a fitting measurement area according to the corrected real scanning information of the sample to be measured; the corrected real scanning information of the sample to be detected comprises the actual size of the sample to be detected and the theoretical design edge profile of the sample to be detected; the information of the preliminary fitting image of the sample to be measured comprises the size of the preliminary fitting image of the sample to be measured, the edge contour of the preliminary fitting image of the sample to be measured and the angle difference between the preliminary fitting image of the sample to be measured and the horizontal X axis in the fitting measurement area;
correcting the preliminary fitting image information of the sample to be tested according to the theoretical design information of the sample to be tested to obtain fitting image information required by the sample to be tested;
and generating a measurement positioning file of the sample to be detected, which can be identified by the atomic force microscope, based on the fitting image information required by the sample to be detected and the theoretical design measurement position of the sample to be detected.
10. The microstructure measurement positioning system of claim 9, wherein the correcting the preliminary fitting image information of the sample according to the theoretical design information of the sample to be measured to obtain the fitting image information required by the sample to be measured specifically comprises:
according to the theoretical design size of the sample to be measured, scaling the preliminary fitting image of the sample to be measured in a fitting measurement area, so that the size of the preliminary fitting image of the sample to be measured is consistent with the theoretical design size of the sample to be measured, and fitting image information required by the sample to be measured is obtained;
the information of the fitting image required by the sample to be measured comprises the size of the fitting image required by the sample to be measured, the edge contour of the fitting image required by the sample to be measured and the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area.
11. The microstructure measurement positioning system of claim 9, wherein the generating a measurement positioning file of the sample to be measured that can be identified by an atomic force microscope based on the fitting image information required by the sample to be measured and the theoretical design measurement position of the sample to be measured includes:
according to the theoretical design measurement position of the sample to be measured, marking the position to be measured of the sample to be measured in fitting image information required by the sample to be measured, and generating a sample measurement positioning file to be measured;
and converting the measurement positioning file of the sample to be measured into the measurement positioning file of the sample to be measured, which can be identified by the atomic force microscope.
12. The system for measuring and positioning a microstructure of a sample to be measured according to claim 10, further comprising a machine vision system, a first moving assembly, and a photographing unit;
the machine vision system is in communication connection with the processing unit and a first mobile component, and the first mobile component is connected with the shooting unit;
the machine vision system controls the first moving assembly to drive the shooting unit to move above the sample to be detected;
the machine vision system controls the shooting unit to scan and image in the sample scanning area to be detected according to the received sample scanning area information to be detected, so as to obtain the real scanning information of the sample to be detected;
and the machine vision system sends the real scanning information of the sample to be tested to the processing unit.
13. The microstructure measurement positioning system of claim 12, further comprising an infrared sensor;
the infrared sensor is arranged on one side of the supporting piece, which is contacted with the sample to be detected, and is in communication connection with the machine vision system;
when the infrared sensor acquires the identification information of the sample to be measured placed on the supporting piece, the identification information is sent to the machine vision system, so that the machine vision system controls the first moving assembly to drive the shooting unit to move to the position above the sample to be measured based on the identification information.
14. The microstructure measurement positioning system of claim 12, wherein the processing unit is further configured to: and sending the information of the scanning area of the sample to be detected to the machine vision system.
15. The microstructure measurement positioning system of claim 12, further comprising a second moving assembly;
the second mobile assembly is in communication with the machine vision system, the second mobile assembly being connected with the support;
the processing unit sends a rotation operation instruction to the machine vision system based on the angle difference between the fitting image required by the sample to be measured and the horizontal X axis in the fitting measurement area;
after the machine vision system receives the rotating operation instruction, the second moving assembly is controlled to drive the supporting piece to rotate, and when a fitting image required by the sample to be measured in the fitting measurement area and a horizontal X axis in the fitting measurement area are 0 degrees, the supporting piece stops rotating, and the sample to be measured is in a straightening state at the moment.
16. The microstructure measurement positioning system of claim 15, wherein the calibration operation is performed on the alignment state of the sample to be measured.
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