CN117490268B - Carbon dioxide cooling system for chip cleaning and conveying system - Google Patents
Carbon dioxide cooling system for chip cleaning and conveying system Download PDFInfo
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- CN117490268B CN117490268B CN202311844527.8A CN202311844527A CN117490268B CN 117490268 B CN117490268 B CN 117490268B CN 202311844527 A CN202311844527 A CN 202311844527A CN 117490268 B CN117490268 B CN 117490268B
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 title claims abstract description 246
- 229910002092 carbon dioxide Inorganic materials 0.000 title claims abstract description 123
- 239000001569 carbon dioxide Substances 0.000 title claims abstract description 121
- 238000001816 cooling Methods 0.000 title claims abstract description 58
- 238000004140 cleaning Methods 0.000 title claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 85
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 69
- 238000003860 storage Methods 0.000 claims abstract description 63
- 239000003507 refrigerant Substances 0.000 claims abstract description 62
- 239000002994 raw material Substances 0.000 claims abstract description 40
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000012546 transfer Methods 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 125000003827 glycol group Chemical group 0.000 claims description 2
- 238000005057 refrigeration Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 11
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- 238000002309 gasification Methods 0.000 description 3
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- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000013526 supercooled liquid Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
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Abstract
The invention provides a cooling system and a conveying system of carbon dioxide for chip cleaning, wherein the cooling system of the carbon dioxide for chip cleaning comprises a raw material storage tank, a first conveying pipeline, a buffer storage tank, a diaphragm pump and a refrigerator, wherein the raw material storage tank, the first conveying pipeline and the buffer storage tank are sequentially communicated, the first conveying pipeline is used for conveying liquid carbon dioxide, the diaphragm pump is positioned on the first conveying pipeline between the raw material storage tank and the buffer storage tank, at least one section of the first conveying pipeline between the raw material storage tank and the diaphragm pump is a cooling pipeline, the cooling pipeline comprises a liquid conveying pipe and a refrigerant pipeline positioned outside the liquid conveying pipe, the refrigerant pipeline is communicated with the refrigerator, the liquid carbon dioxide is conveyed in the liquid conveying pipe, and glycol refrigerant flows in the refrigerant pipeline. The cooling system and the conveying system for the carbon dioxide for chip cleaning can ensure that the diaphragm pump can be started in time, and ensure the stability and the continuity of carbon dioxide supply.
Description
Technical Field
The invention belongs to the technical field of chip cleaning, and particularly relates to a cooling system and a conveying system of carbon dioxide for chip cleaning.
Background
The cleaning process is an important element throughout the entire semiconductor fabrication, and is one of the important factors affecting the performance and yield of the semiconductor device. Any contamination during the chip fabrication process can affect the performance of the semiconductor device and even cause failure. Therefore, almost before and after each process of chip manufacture, a cleaning process is needed to remove pollutants on the surface, so that the cleanliness of the surface of the wafer is ensured.
Because of the gradual reduction of the feature size of the integrated circuit, the device structure can require higher aspect ratio, and the conventional wet cleaning is difficult to enter the deep trench structure of the wafer due to surface tension, cannot meet the process requirement of thinner lines and the high aspect ratio structure, and directly influences the pollutant removal effect in the trench; the conventional wet etching has poor anisotropism, serious structural collapse and insignificant deep trench etching effect; the dry etching of the plasma has a series of problems such as slow etching rate, photoresist falling and adhesion, structural damage, waste gas treatment and the like.
The supercritical carbon dioxide cleaning can well solve the problems, and the carbon dioxide can reach a supercritical state at 7.39MPa and 31 ℃, and has the characteristics of high density, strong dissolution capacity and high mass transfer rate. Meanwhile, the method has the characteristics of abundant reserves, low cost, easy availability, no toxicity, inertness, easy recovery and recycling, and the like. The supercritical carbon dioxide is used as a weak polar solvent, has extremely strong dissolving capacity for nonpolar organic compounds, and can effectively remove weak polar organic pollutants such as silicone, hydrocarbon, grease and the like on the surface of a microscopic device. Patent publication No. CN 209000881U discloses a cleaning device for a Si-based HgCdTe chip before passivation. Carbon dioxide is used as a cleaning agent, and the low surface tension, high diffusivity and excellent dissolving capacity of the carbon dioxide on organic matters improve the cleaning efficiency of pollutants and shorten the cleaning time.
Unlike other fields in which carbon dioxide is used for cleaning, the supply of carbon dioxide is required to have better continuity in the field of chip cleaning, however, the technology of supercritical carbon dioxide for chip cleaning is currently less studied, and particularly, the continuous supply of carbon dioxide required for chip cleaning is hardly studied, and it is not easy to convey carbon dioxide meeting the requirements.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a cooling system and a conveying system of carbon dioxide for chip cleaning, which are good in carbon dioxide supply continuity.
The invention provides a carbon dioxide cooling system for chip cleaning, which comprises a raw material storage tank, a first conveying pipeline, a buffer storage tank, a diaphragm pump and a refrigerator, wherein the raw material storage tank, the first conveying pipeline and the buffer storage tank are sequentially communicated, the first conveying pipeline is used for conveying liquid carbon dioxide, the diaphragm pump is positioned on the first conveying pipeline between the raw material storage tank and the buffer storage tank, the working pressure of the first conveying pipeline between the raw material storage tank and the diaphragm pump is larger than the working pressure of the first conveying pipeline between the diaphragm pump and the buffer storage tank, the working pressure fluctuation of the first conveying pipeline between the raw material storage tank and the diaphragm pump is not more than +/-3 barg, the working pressure fluctuation of the first conveying pipeline between the diaphragm pump and the buffer storage tank is not more than +/-3 barg, at least one section of the first conveying pipeline between the raw material storage tank and the diaphragm pump is a cooling pipeline, the temperature of the liquid carbon dioxide close to the diaphragm pump in the cooling pipeline is controlled at-24 ℃ to-26 ℃, the cooling pipeline comprises a liquid conveying pipeline and a refrigerant outside the liquid conveying pipeline, the refrigerant in the liquid pipeline is communicated with the refrigerant pipeline, and the refrigerant in the refrigerant pipeline is in the refrigerant pipeline.
Preferably, the liquid carbon dioxide temperature at the inlet of the feed storage tank is between-19 ℃ and-22 ℃.
Preferably, the glycol refrigerant is a glycol solution, which comprises glycol and water, wherein the ratio of the glycol to the water is 1: (1.21-1.23).
Preferably, the cold tracing pipeline further comprises a cold pipe heat insulation layer and a cold pipe protection sleeve, the cold pipe heat insulation layer is wound outside the liquid conveying pipe, the cold pipe protection sleeve is wound outside the cold pipe heat insulation layer, the cold pipe protection sleeve is a stainless steel protection sleeve, and the refrigerant pipeline adopts a copper pipe.
Preferably, the cold pipe heat insulation layer is made of foaming polyurethane material, and the ratio between the thickness of the cold pipe heat insulation layer and the diameter of the liquid conveying pipe is 1: (1.2-1.4).
Preferably, the refrigerant pipeline comprises a working group pipeline and a standby group pipeline, the working group pipeline and the standby group pipeline do not work at the same time, the working group pipeline and the standby group pipeline comprise a refrigerant outflow pipe and a refrigerant return pipe, the refrigerant outflow pipe and the refrigerant return pipe are communicated with the refrigerator, and the glycol refrigerant flows from the refrigerator to the diaphragm pump through the refrigerant outflow pipe and flows back to the refrigerator through the refrigerant return pipe.
Preferably, the cooling pipeline is communicated with the diaphragm pump through a hose, and a filter is arranged between the hose and the cooling pipeline.
Preferably, a pre-pump return pipeline is further arranged between the raw material storage tank and the diaphragm pump, and the pre-pump return pipeline comprises the cooling pipeline.
Preferably, the working pressure of the first transfer line between the feed storage tank and the diaphragm pump is in the range 18 barg to 20barg.
The invention also provides a carbon dioxide conveying system for cleaning the chip, which comprises a heat tracing system and a heat tracing system of carbon dioxide for cleaning the chip, wherein the heat tracing system comprises a heating device and a second conveying pipeline, the working pressure of the first conveying pipeline between the diaphragm pump and the buffer storage tank is 61 barg-63 barg, liquid carbon dioxide flowing out of the buffer storage tank is changed into gaseous carbon dioxide after passing through the heating device and is conveyed through the second conveying pipeline, and carbon dioxide output by the second conveying pipeline is subcritical carbon dioxide.
The cooling system and the conveying system for the carbon dioxide for chip cleaning, which are provided by the invention, have the following beneficial effects:
1. and a diaphragm pump is used as a booster pump, so that metal ions can meet the requirement of chip cleaning.
2. The ethylene glycol refrigerant is adopted to cool the carbon dioxide liquid, so that the diaphragm pump is fully liquid before being further ensured, the diaphragm pump can be started at any time, and the liquid carbon dioxide liquid has certain viscosity and can be prevented from freezing by selecting the ethylene glycol solution, and has a very good effect on cooling and concomitant cooling of liquid carbon dioxide. The diaphragm pump can be started in time, and the stability and the continuity of carbon dioxide supply are ensured.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intentionally drawn to scale on actual size or the like, with emphasis on illustrating the principles of the invention.
Fig. 1 is a schematic diagram of a cooling system and a conveying system of carbon dioxide for chip cleaning according to an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the portion "A" in FIG. 1;
FIG. 3 is a schematic cross-sectional view of a trace cooling line;
FIG. 4 is a schematic view of the flow direction of the refrigerant outflow and return lines;
FIG. 5 is a schematic diagram of a pipeline conveying structure of a raw material storage tank;
FIG. 6 is a schematic diagram of a carbon dioxide delivery system for cleaning a chip according to an embodiment of the present invention;
fig. 7 is a schematic diagram of structural connection between a raw material storage tank and a booster heater according to an embodiment of the present invention.
In the drawings, 1-a raw material storage tank; 10-a material feeding device; 12-a material supply pipeline; 131-output channel; 132-input channel; 133-booster heater; 134-first line; 135-a second line; 136-a soft water supply system; 2-a buffer tank; 3-diaphragm pump; 31-a pre-pump return line; 311-a post-pump return line; 32-hose; 33-a filter; 4-a first delivery line; 40-a freezer; 41-a second transfer line; 51-a liquid delivery tube; 521 refrigerant outflow pipes; 522-refrigerant return line; 53-a cold pipe insulation layer; 54-cold tube protective sleeve; 6-a heating device; 7-pressure regulating device.
Detailed Description
In order that the invention may be understood more fully, the invention will be described with reference to the accompanying drawings.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to and integrated with the other element or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-7, an embodiment of the present invention provides a cooling system for carbon dioxide for chip cleaning, which includes a raw material storage tank 1, a first conveying pipeline 4, a buffer storage tank 2, a diaphragm pump 3 and a refrigerator 40, where the raw material storage tank 1, the first conveying pipeline 4 and the buffer storage tank 2 are sequentially communicated, the first conveying pipeline 4 is used for conveying liquid carbon dioxide, the diaphragm pump 3 is located on the first conveying pipeline 4 between the raw material storage tank 1 and the buffer storage tank 2, the working pressure of the first conveying pipeline 4 between the raw material storage tank 1 and the diaphragm pump 3 is greater than the working pressure of the first conveying pipeline 4 between the diaphragm pump 3 and the buffer storage tank 2, the working pressure fluctuation of the first conveying pipeline 4 between the raw material storage tank 1 and the diaphragm pump 3 is not more than ±3 barg, at least one section of the first conveying pipeline 4 between the raw material storage tank 1 and the diaphragm pump 3 is a cold pipeline, the temperature of the liquid carbon dioxide in the cooling pipeline near the diaphragm pump 3 is controlled to-24 ℃ to-26 ℃, the working pressure of the first conveying pipeline 4 between the diaphragm pump 1 and the diaphragm pump 3 is greater than the working pressure of the first conveying pipeline 4, the working pressure fluctuation of the first conveying pipeline 4 between the raw material storage tank 1 and the diaphragm pump 3 and the first conveying pipeline 4 is not more than ±3 barg 3 barg, the working pressure fluctuation of the first refrigerant is not more than ±3 barg 3 barg, at least 3 bara liquid refrigerant is located in the liquid refrigerant, and the liquid refrigerant is located inside the liquid refrigerant pipeline 51, and the liquid refrigerant is located inside the cold pipeline 51, and the liquid refrigerant pipeline is located inside the cold pipeline, and the refrigerant pipeline is located inside the pipeline and the liquid pipelines, and the refrigerant pipeline is 51 pipeline is located inside the pipeline, and the refrigerant pipeline is 51 pipeline is inside is 51 pipeline and is connected.
The cooling system and the conveying system for the carbon dioxide for chip cleaning provided by the embodiment firstly adopt the diaphragm pump 3 to carry out pressurization, supply pressurized carbon dioxide liquid for the rear end, ensure that the supply of the carbon dioxide has a certain pressure, and can be rapidly converted into supercritical carbon dioxide when the rear end needs to carry out chip cleaning. In the embodiment, the diaphragm pump 3 is adopted for pressurizing, and the supplied carbon dioxide can meet the requirement of metal ions through detection, so that the carbon dioxide is used as the incoming material for chip cleaning, and the cleaning effect is better.
Considering the problem of stable system transportation, in order to ensure that the diaphragm pump 3 can be started at any time under the condition of needs, carbon dioxide liquid needs to be ensured to be sufficient liquid before the diaphragm pump 3, so that the continuity of carbon dioxide maintenance supply can be ensured, in the embodiment, a cooling pipeline is arranged on a transportation pipeline between the raw material storage tank 1 and the diaphragm pump 3, and under the condition of stable pressure, the temperature of liquid carbon dioxide is ensured to be controlled between-24 ℃ and-26 ℃, so that the sufficient liquid of the liquid carbon dioxide can be realized. Considering that the temperature control is lower, the required refrigerant can have better refrigeration efficiency and a certain antifreezing effect, so that glycol solution is selected as glycol refrigerant, and the glycol solution is adopted to carry out cold insulation conveying on liquid carbon dioxide conveyed by a pipeline, so that the liquid carbon dioxide can be ensured to maintain sufficient liquid before the diaphragm pump 3, and the diaphragm pump 3 can be started at any time under the condition of need, and the stable and continuous supply of carbon dioxide is ensured.
In a preferred embodiment, the liquid carbon dioxide temperature at the inlet of the feed tank 1 is between-19 ℃ and-22 ℃. In this embodiment, the temperature of the incoming liquid carbon dioxide is between-19 ℃ and-22 ℃ to provide stable supply at the front end, the liquid carbon dioxide at the temperature has a risk of gasification, the liquid carbon dioxide needs to be cooled to between-24 ℃ and-26 ℃ after entering the cooling pipeline of this embodiment, the incoming liquid carbon dioxide belongs to a heat source, and the cooling system of this embodiment needs to select a heat source, and meanwhile, the problem of freezing prevention is also considered. The ethylene glycol solution is selected, so that the liquid carbon dioxide cooling agent has certain viscosity and can prevent freezing, and has a very good effect on cooling of liquid carbon dioxide.
In consideration of the influence of refrigerating capacity and viscosity, the proportion of the consumption of the ethylene glycol to the water in the ethylene glycol solution is controlled to be 1: (1.21-1.23).
The dosage ratio of the ethylene glycol to the water in the ethylene glycol solution needs to meet strict condition requirements, otherwise, the carbon dioxide liquid cannot be maintained at the temperature of between 24 ℃ below zero and 26 ℃ below zero. A section of 50-meter cooling pipeline is used for testing the cooling effect of different glycol solution proportions on carbon dioxide liquid. The carbon dioxide liquid feed temperature was-21 ℃ and the pressure was 19 barg, and after passing through the companion cooling line, the carbon dioxide liquid temperature was tested, and 5 sets of data were tested for each formulation, see table 1 below.
TABLE 1
When the proportion of ethylene glycol to water is 1:1.5, the cooling of liquid carbon dioxide can only be carried out at-19 ℃ to-22 ℃, and at the temperature, the liquid carbon dioxide is partially gasified, so that sufficient liquid before the diaphragm pump can not be ensured; if the dosage ratio of the ethylene glycol to the water is adjusted to 1:1.1, the ethylene glycol is higher in dosage, the overall ethylene glycol solution viscosity is higher, the flow resistance of the ethylene glycol solution in a pipeline is high, the cold insulation effect is affected, the cold insulation temperature stability is poor, and partial carbon dioxide gasification is possibly caused. Thus, the ratio of the amounts of ethylene glycol and water used in this example was controlled to be 1: (1.21-1.23), under the condition of the proportion, the glycol solution has proper refrigerating capacity and proper viscosity, can have very good cold insulation effect on liquid carbon dioxide, and can also have good antifreezing effect.
Referring to fig. 3, in a preferred embodiment, the companion cooling line further includes a cooling tube insulation layer 53 and a cooling tube protective sleeve 54, the cooling tube insulation layer 53 being wound around the liquid delivery tube 51, the cooling tube protective sleeve being a stainless steel protective sleeve around the cooling tube insulation layer 53. In this embodiment, a better cooling effect is achieved through the cold pipe heat insulating layer 53, the refrigerant pipeline adopts a copper pipe, the heat insulating layer adopts a foaming polyurethane material, and further, the ratio between the thickness of the cold pipe heat insulating layer 53 and the diameter of the liquid conveying pipe 51 is 1: (1.2-1.4) it can be ensured that the carbon dioxide liquid before the membrane pump 3 is sufficiently liquefied.
Referring to fig. 3-4, in a preferred embodiment, the refrigerant lines include a working group line and a backup group line that do not operate simultaneously, one backup. The working group pipeline and the standby group pipeline both comprise a refrigerant outflow pipe 521 and a refrigerant return pipe 522, the refrigerant outflow pipe 521 and the refrigerant return pipe 522 are both communicated with the refrigerator 40, and glycol refrigerant flows from the refrigerator 40 to the diaphragm pump 3 through the refrigerant outflow pipe 521 and then flows back into the refrigerator 40 through the refrigerant return pipe 522.
The high-temperature high-pressure refrigerant gas discharged by the compressor is condensed into medium-temperature supercooled liquid when the refrigerator 40 works, the medium-temperature supercooled liquid is throttled and decompressed by the low-temperature expansion valve to become a low-temperature low-pressure vapor-liquid two-phase mixture, the low-temperature low-pressure vapor-liquid two-phase mixture enters the evaporator, and the vapor-liquid two-phase mixture evaporates and absorbs heat of the refrigerating medium flowing through the evaporator in the evaporator, so that the refrigerating medium flowing through the evaporator is cooled, and vapor is sucked by the compressor after the refrigerating medium is vaporized, and the refrigerating medium is circulated continuously so as to achieve the cooling purpose; the refrigerator 40 can meet the stable cold source of 15Nm3/h,4 kg pressure and outlet-25 ℃, each device can stably supply 4 low-temperature CO2 pipelines before the diaphragm pump 3 and indirectly exchange heat with liquid CO2 pipelines before the pump, so that the liquid to the pump is liquefied enough, and the diaphragm pump 3 can be started at any time. The working group pipe and the backup group pipe realize that the two groups of pipes are used for one by one, and the refrigerant outflow pipe 521 and the refrigerant return pipe 522 are used for one by one, so that heat exchange is very sufficient.
Referring to fig. 2, in a preferred embodiment, the cooling line and the diaphragm pump 3 are in communication via a hose 32. A filter 33 is provided between the hose 32 and the quench line to prevent vibration energy transfer during start-up and operation and to reduce buffering.
Referring to fig. 2, in a preferred embodiment, a pre-pump return line 31 is further included between the raw material storage tank 1 and the diaphragm pump 3, the pre-pump return line 31 including the cooling line as in the previous embodiment. In this embodiment, the pipeline through which the liquid carbon dioxide flows back before the pump is also provided with the cooling device, so that the liquid carbon dioxide flowing back can be further cooled down in the storage tank, and the flowing-out carbon dioxide can be ensured to be in a complete liquid state.
Referring to fig. 1-2, in addition to the pre-pump return line 31, there is a post-pump return line 311 between the diaphragm pump rear end and the buffer tank 2. The back-pump return line 311 and the front-pump return line 31 both return to the raw material tank 1. The diaphragm pump is a standby pump, the frequency conversion is realized, the back flow of the pump can ensure that the back pressure of the pump can be monitored at any time, the overpressure is prevented, and the back flow to the raw material storage tank 1 can be controlled during the static state and the operation.
In a preferred embodiment the first transfer line 4 between the feed storage tank 1 and the membrane pump 3 operates at a pressure of 18-20 barg, at which the liquid carbon dioxide is maintained at a temperature of-24 ℃ to-26 ℃ to ensure that the liquid carbon dioxide is sufficiently liquid prior to the pump.
Referring to fig. 5 and 7, the raw material storage tank 1 provided in this embodiment is connected with a booster heater 133, liquid carbon dioxide in the raw material storage tank 1 flows from the tank bottom to the booster heater 133 through an output channel 131, and carbon dioxide gas after heating and gasification is input into the raw material storage tank 1 from the tank top through an input channel 132, so as to ensure the pressure stability of the raw material storage tank 1, ensure the stable output of the liquid carbon dioxide in the raw material storage tank 1, and ensure the continuity of supply. Meanwhile, the input pipeline comprises a first pipeline 134 and a second pipeline 135, so that the circulation is smooth, and the liquid carbon dioxide can be stably output. In this embodiment, the liquid in the storage tank is heated and gasified to be self-pressurized, so that the introduction of other gas pressurizing impurities can be avoided, and the control of the impurities is further ensured. Meanwhile, in order to avoid the pressure shortage of the storage tank caused by the shortage of the liquid supplied from the self, the booster heater 133 is also connected with a soft water supply system 136 for supplying soft water having a low calcium content. Ensuring a stable source of liquid for booster heater 133, stable operation, stable pressure supply for the reservoir, and further ensuring continuity of overall system delivery. Meanwhile, the feeding pipeline 12 of the raw material storage tank 1 is provided with a plurality of pressure control valves, so that stability of liquid conveying pressure is guaranteed.
Referring to fig. 6, an embodiment of the present invention further provides a carbon dioxide conveying system for cleaning a chip, including the carbon dioxide cooling system for cleaning a chip, the material supply device 10 and the heat tracing system mentioned in the foregoing embodiment, where the heat tracing system includes a heating device 6, a pressure regulating device 7 and a second conveying pipeline 41, the working pressure of the first conveying pipeline 4 between the diaphragm pump 3 and the buffer storage tank 2 is 61barg to 63 barg, the liquid carbon dioxide flowing out of the buffer storage tank 2 is changed into gaseous carbon dioxide after passing through the heating device, and is conveyed through the second conveying pipeline 41, and the carbon dioxide output by the second conveying pipeline is subcritical carbon dioxide.
In consideration of poor supercritical carbon dioxide conveying stability, the carbon dioxide conveying system provided by the embodiment conveys subcritical carbon dioxide which does not reach the supercritical carbon dioxide condition yet, but approaches the supercritical carbon dioxide condition, so that the supercritical carbon dioxide can be reached by the chip cleaning device only by slightly adjusting the temperature and the pressure, and the chip is cleaned. In order to realize continuous and stable supply of subcritical carbon dioxide, the carbon dioxide conveying system of the embodiment comprises a cooling system and a heat tracing system, the cooling system can enable incoming carbon dioxide to be pressurized and buffered for storage, stability of carbon dioxide conveying pressure is guaranteed, then liquid carbon dioxide is converted into gaseous subcritical carbon dioxide through the heat tracing system, the subcritical carbon dioxide is close to supercritical carbon dioxide, conveying is stable relative to supercritical carbon dioxide, and conveying continuity can be guaranteed. The subcritical carbon dioxide in this example was at a pressure of 55.+ -.4 barg and a temperature of 36.+ -.4 ℃.
In the description of the present specification, a description referring to the terms "preferred embodiment," "further embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (10)
1. The utility model provides a carbon dioxide's companion cold system for chip cleaning, its characterized in that includes raw materials storage tank, first transfer line, buffer tank, diaphragm pump and refrigerator, raw materials storage tank, first transfer line and buffer tank communicate in proper order, first transfer line is used for carrying liquid carbon dioxide, the diaphragm pump is located on the first transfer line between raw materials storage tank and the buffer tank, the operating pressure of first transfer line between raw materials storage tank and the diaphragm pump is greater than the operating pressure of first transfer line between diaphragm pump and the buffer tank, the operating pressure fluctuation of first transfer line between raw materials storage tank and the diaphragm pump is not more than + -3 barg, the operating pressure fluctuation of first transfer line between diaphragm pump and the buffer tank is not more than + -3 barg, at least one section of first transfer line between raw materials storage tank and the diaphragm pump is companion cold pipeline, be close to in the diaphragm pump liquid carbon dioxide temperature control of department is at-24 ℃ to-26 ℃, the cold pipeline includes liquid transfer line and is located the operating pressure of first transfer line between diaphragm pump and the buffer tank, the operating pressure fluctuation of first transfer line between the diaphragm pump is not more than + -3 barg, the operating pressure fluctuation of first transfer line between the liquid carbon dioxide, the refrigerant is the interior of liquid refrigerant, the refrigerant is the flow in the transfer line, the refrigerant is cooled.
2. The cooling system for carbon dioxide for chip cleaning according to claim 1, wherein the liquid carbon dioxide at the inlet of the raw material tank is at a temperature of-19 ℃ to-22 ℃.
3. The cooling system of carbon dioxide for chip cleaning according to claim 1, wherein the glycol refrigerant is a glycol solution comprising glycol and water in a ratio of 1: (1.21-1.23).
4. The cooling system of carbon dioxide for chip cleaning according to claim 1, wherein the cooling pipeline further comprises a cold pipe heat insulation layer and a cold pipe protection sleeve, the cold pipe heat insulation layer is wound outside the liquid conveying pipe, the cold pipe protection sleeve is wound outside the cold pipe heat insulation layer, the cold pipe protection sleeve is a stainless steel protection sleeve, and the refrigerant pipeline adopts a copper pipe.
5. The cooling system of carbon dioxide for chip cleaning according to claim 4, wherein the heat insulating layer of the cold pipe is made of foamed polyurethane material, and the ratio between the thickness of the heat insulating layer of the cold pipe and the diameter of the liquid conveying pipe is 1: (1.2-1.4).
6. The cooling system of carbon dioxide for chip cleaning according to claim 1, wherein the refrigerant line comprises a working line and a backup line, the working line and the backup line do not work simultaneously, the working line and the backup line each comprise a refrigerant outflow pipe and a refrigerant return pipe, the refrigerant outflow pipe and the refrigerant return pipe are both communicated with the refrigerator, and the glycol refrigerant flows from the refrigerator to the diaphragm pump through the refrigerant outflow pipe and then flows back to the refrigerator through the refrigerant return pipe.
7. The cooling system for carbon dioxide for chip cleaning according to claim 1, wherein the cooling line and the diaphragm pump are connected by a hose, and a filter is provided between the hose and the cooling line.
8. The cooling system for carbon dioxide for chip cleaning according to claim 1, further comprising a pre-pump return line between the raw material storage tank and the diaphragm pump, wherein the pre-pump return line comprises the cooling line.
9. The chip cleaning carbon dioxide refrigeration system according to claim 1, wherein the first transfer line between the raw material storage tank and the diaphragm pump operates at a pressure of 18 barg to 20barg.
10. A carbon dioxide conveying system for cleaning chips, which is characterized by comprising a heat tracing system and the carbon dioxide cooling system for cleaning chips according to any one of claims 1-9, wherein the heat tracing system comprises a heating device and a second conveying pipeline, the working pressure of a first conveying pipeline between a diaphragm pump and a buffer storage tank is 61 barg-63 barg, liquid carbon dioxide flowing out of the buffer storage tank is changed into gaseous carbon dioxide after passing through the heating device, and the gaseous carbon dioxide is conveyed through the second conveying pipeline, and carbon dioxide output by the second conveying pipeline is subcritical carbon dioxide.
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| CN202311844527.8A CN117490268B (en) | 2023-12-29 | 2023-12-29 | Carbon dioxide cooling system for chip cleaning and conveying system |
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