CN117484378A - Double-sided grinding equipment for semiconductor silicon wafer - Google Patents
Double-sided grinding equipment for semiconductor silicon wafer Download PDFInfo
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- CN117484378A CN117484378A CN202311651823.6A CN202311651823A CN117484378A CN 117484378 A CN117484378 A CN 117484378A CN 202311651823 A CN202311651823 A CN 202311651823A CN 117484378 A CN117484378 A CN 117484378A
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- round
- welded
- seat
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- 238000000227 grinding Methods 0.000 title claims abstract description 183
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000005507 spraying Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 50
- 230000001681 protective effect Effects 0.000 claims description 24
- 238000003860 storage Methods 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 13
- 239000011550 stock solution Substances 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims 8
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 230000002572 peristaltic effect Effects 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract 2
- 239000012530 fluid Substances 0.000 description 17
- 230000001105 regulatory effect Effects 0.000 description 10
- 230000008602 contraction Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses double-sided grinding equipment for a semiconductor silicon wafer, which comprises a support frame, a workbench, a lower grinding mechanism, an upper grinding mechanism and a water spraying mechanism, wherein the lower grinding assembly and the upper grinding assembly can be subjected to speed regulation through a first driving assembly and a second driving assembly, so that the lower grinding assembly and the upper grinding assembly can better grind the two sides of the silicon wafer, and in the speed regulation process, the current and the voltage do not need to be changed, so that the equipment is effectively protected; in the process of speed regulation, the first drive assembly can drive the third round bar, three connection round bars, three pressing balls rotate for three pressing balls orderly extrude the U-shaped hose, form peristaltic phenomenon, make things convenient for the inside lapping liquid of U-shaped hose extraction liquid reserve tank, and along with the rotational speed change of third round bar, the rate of extraction lapping liquid also can follow the change, thereby can cool down the work and grind the work to the semiconductor silicon chip of grinding effectively, improve grinding efficiency.
Description
Technical Field
The invention belongs to the technical field of semiconductor silicon wafer grinding equipment, and particularly relates to double-sided grinding equipment for a semiconductor silicon wafer.
Background
The silicon wafer is also called a silicon wafer, is an important material for manufacturing an integrated circuit, and can be manufactured into integrated circuits and various semiconductor devices by means of photoetching, ion implantation and the like, and when the silicon wafer is manufactured and processed, a semiconductor silicon wafer grinder is used for double-sided grinding equipment of the semiconductor silicon wafer, so that TTV value and thickness deviation of the silicon wafer reach a certain standard, and preparation is made for a subsequent polishing process; at present, the existing semiconductor silicon wafer grinding machine technology has the following problems: 1. the rotation speed ratio of the upper disc to the lower disc is a certain value, so that the adaptability of the equipment is narrowed; 2. the rolling bearing is adopted in the rotation of the shaft system in the equipment, and the grinding of the semiconductor silicon wafer has high requirements on the precision and stability of the equipment, particularly the runout value of the lower disc plane when the lower disc rotates, and the rolling bearing can generate certain abrasion after being used for a period of time, so that the lower disc rotates unstably and the runout value of the plane is out of tolerance;
the utility model discloses a semiconductor silicon wafer double-sided grinding equipment, which comprises a host machine, wherein the host machine comprises an upper disc component and a lower disc component which are arranged up and down, the upper disc component comprises an upper grinding disc, the lower disc component comprises a lower grinding disc which is arranged opposite to the upper grinding disc, a static pressure rotary supporting device which is used for driving the lower grinding disc to rotate steadily is arranged at the bottom of the lower grinding disc, and a first driving mechanism is arranged in connection with the static pressure rotary supporting device; the double-layer anti-falling device is adopted, so that the safe use reliability of the device can be greatly improved, various rotation speed ratios of the upper grinding disc and the lower grinding disc are realized, the supporting beam and the upper grinding disc on the supporting beam can be rotated out of the operating space of the device to facilitate the replacement of the upper grinding disc and the lower grinding disc, and the cantilever crane and the correction wheel library are configured to facilitate the taking, placing and storing of the correction wheels;
but still has problems: 1. although the upper grinding disc and the lower grinding disc are respectively provided with driving power and a driving mechanism to realize various rotation speed ratios of the upper grinding disc and the lower grinding disc, when the rotation speed is regulated, the input current and the voltage of the servo motor are required to be changed, so that equipment is easy to damage; 2. in the grinding process, the conveying efficiency of the grinding fluid is constant, so that the phenomenon of insufficient components or excessive components of the grinding fluid can easily occur during high-rotation-speed grinding or low-rotation-speed grinding, and the qualification rate of silicon wafer production is affected.
Disclosure of Invention
The invention aims to provide double-sided grinding equipment for semiconductor silicon wafers, which is used for solving the problems that the input current and voltage of a servo motor are changed, equipment damage is easy to cause, the conveying efficiency of grinding fluid is constant, insufficient components or excessive components of the grinding fluid are easy to occur during high-rotation-speed grinding or low-rotation-speed grinding, and the qualification rate of silicon wafer production is influenced.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a two-sided grinding equipment of semiconductor silicon chip, includes support frame, workstation, lower grinding mechanism, goes up grinding mechanism and hydrojet mechanism, be equipped with the lower grinding mechanism that is used for grinding of semiconductor silicon chip lower surface on the workstation, the upper surface middle part welding of workstation has the support frame, be equipped with the last grinding mechanism that is used for grinding of semiconductor silicon chip upper surface on the support frame, be equipped with the hydrojet mechanism that is used for grinding cooling and grinding work on the downside outer wall of going up grinding mechanism and the rear end face of workstation.
Preferably, the lower grinding mechanism comprises a first driving component and a lower grinding component, the first driving component is installed on the workbench, the lower grinding component is arranged on the upper surface of the workbench, and the first driving component drives the lower grinding component to finish grinding work.
Preferably, the first driving component comprises a second electric hydraulic rod, a mounting plate, a concave connecting frame, two through hole square seats and a gear, wherein the mounting plate is welded on the inner wall of the top of the workbench, the second electric hydraulic rod is mounted in the middle of the left end face of the mounting plate, the telescopic rod of the second electric hydraulic rod penetrates through the mounting plate, two first guide rods are welded on the upper side and the lower side of the right end of the mounting plate, two double-hole sliding blocks are sleeved on the outer wall of the upper two first guide rods and the outer wall of the lower side of the two first guide rods in a sliding manner, meanwhile, the right ends of the upper two first guide rods and the right ends of the lower side of the two first guide rods are welded with one through hole square seat, the upper through hole square seat is welded on the top of the workbench, the middle of the right end faces of the two double-hole sliding blocks are welded with the concave connecting frame, the concave connecting frame is positioned between the four first guide rods, the right side of the telescopic rod of the second electric hydraulic rod is sleeved with the left end face of the concave connecting frame, two double-hole sliding blocks are rotatably connected with a second round rod, the outer walls of the upper side and the lower side of the second round rod are sleeved with two semi-spheres, the lower surface of the double-hole sliding block at the lower side is provided with a second driving motor, the second driving motor drives the second round rod to rotate, a first round rod is rotatably connected between two through hole square seats, the top of the first round rod penetrates through the through hole square seat extending out of the upper side and the top of a workbench respectively, the outer wall of the upper side of the first round rod is sleeved with a gear, the gear is positioned on the upper surface of the workbench, the outer walls of the upper side and the lower side of the first round rod are slidably sleeved with two conical tables, the outer wall of the middle of the first round rod is sleeved with a first spring, and two ends of the first spring are contacted with the two conical tables.
Preferably, the outer wall of the front side of the first round bar is provided with a radial sliding rail, the middle part of the circular truncated cone is provided with a through hole matched with the first round bar, the front side of the through hole is provided with a sliding groove matched with the sliding rail, and the circular truncated cone drives the first round bar to rotate through the sliding rail.
Preferably, the lower grinding component comprises a lower grinding disc, a free star wheel, a central cylinder, three connecting circular shafts, a central cylinder and a plurality of first cylinders, wherein the central cylinder is welded at the middle part of the upper surface of the workbench, a plurality of second cylinders distributed in a ring shape are arranged on the upper surface of the central cylinder, the lower grinding disc is arranged on the outer wall of the central cylinder in a rotating sleeve manner, an annular groove is formed in the lower surface of the lower grinding disc, a plurality of annular distributed sawtooth grooves are formed in the inner wall of the annular groove, which is close to one side of the edge of the lower grinding disc, and are meshed with gears, the three connecting circular shafts are welded on the upper surface of the workbench, the three connecting circular shafts are located in the inner part of the annular groove, the outer wall of each connecting circular shaft is provided with a circular wheel, the wheel edge of each circular wheel is in contact with the inner wall of the annular groove, a plurality of first cylinders distributed in a ring shape are welded on the outer wall of the edge of the lower grinding disc, and the upper surface of the lower grinding disc is provided with a plurality of free star wheels which are meshed with a plurality of second cylinders and a plurality of first cylinders respectively.
Preferably, a plurality of silicon chip placing grooves are formed in the planetary wheel, a plurality of U-shaped clamping grooves which are distributed in an annular mode are formed in the edge of the planetary wheel, the planetary wheel is meshed with the second cylinder and the first cylinder respectively through the U-shaped clamping grooves, and meanwhile the planetary wheel rotates around the central cylinder.
Preferably, the upper grinding mechanism comprises a first electric hydraulic rod, a second driving component and an upper grinding component, the first electric hydraulic rod is installed in the middle of the upper surface of the supporting frame, a telescopic rod of the first electric hydraulic rod extends to the workbench after penetrating through the top of the supporting frame, the second driving component is installed on the outer wall of the lower side of the telescopic rod of the first electric hydraulic rod, the upper grinding component is installed on the outer wall of the lower side of the second driving component, and the second driving component drives the upper grinding component to finish grinding work.
Preferably, the second driving component comprises a mounting frame, a screw hole supporting seat and a screw rod, the second conical cylinder is rotationally connected at the inner center of the mounting frame, the lower end of the second conical cylinder penetrates through the bottom of the mounting frame, the first conical cylinder is rotationally connected at the left side of the inner part of the mounting frame, the first conical cylinder is positioned at the left side of the second conical cylinder, the longitudinal screw rod is rotationally connected at the right side of the inner part of the mounting frame, the top of the screw rod penetrates through the upper surface of the mounting frame, the screw hole supporting seat is connected with the outer wall of the screw rod in a threaded manner, the longitudinal second guide rods are slidingly connected at the front side and the rear side of the screw hole supporting seat, two ends of the two second guide rods are welded with the inner walls of the two sides of the mounting frame, four concave sliding groove seats are welded at the two sides of the left end of the screw rod, and transverse third guide rods are arranged inside the four concave sliding groove seats, the two ends of the third guide rod are respectively welded with the left end face of the screw hole supporting seat and the left inner wall of the concave chute seat, the outer wall sliding sleeves of the four third guide rods are provided with through hole sliding blocks, the through hole sliding blocks slide in the concave chute seat, first concave sleeve seats are welded between the four through hole sliding blocks, the number of the first concave sleeve seats is two, simultaneously, the two first concave sleeve seats slide between the four concave chute seats, the inner parts of the two first concave sleeve seats are rotationally connected with inclined plane circular rings, the inclined plane circular rings are sleeved on the outer wall of the second conical cylinder, the inner wall of the inclined plane circular rings are contacted with the outer wall of the second conical cylinder, the outer wall of the inclined plane circular rings is contacted with the outer wall of the first conical cylinder, the right outer wall of the inclined plane circular rings is sleeved with the second concave sleeve seats, the second concave sleeve seat and the screw hole supporting seat are provided with a second spring, a first driving motor is arranged on the left side of the upper surface of the installation frame, the first driving motor drives the first conical cylinder to rotate, a servo motor is arranged on the right side of the upper surface of the installation frame, and the servo motor drives the screw rod to rotate.
Preferably, the upper grinding assembly comprises an arc column and an upper grinding disc, a plurality of annular distributed through round holes are formed in the upper grinding disc, the arc column is welded on the upper surface of the upper grinding disc, and the through round holes are located on the inner side of the arc column.
Preferably, the hydrojet mechanism includes liquid reserve tank, stock solution seat, third round bar and protective housing, the third round bar welding is in the lower extreme of second conical cylinder, and the third round bar is located the downside of installing frame, simultaneously, go up the grinding disc and install on the downside outer wall of third round bar, the upside outer wall rotation of third round bar is connected with protective housing, and protective housing welding is at the installing frame lower surface, U type groove has been seted up to protective housing's inside, U type hose is equipped with in U type groove's inside, the upside outer wall welding of third round bar has three equidistant connecting round bars, and connects the round bar to be located the inside of U type groove, and the three the one end welding of connecting the third round bar that the round bar kept away from has the ball, and presses the ball extrusion U type hose, two water delivery holes have been seted up to protective housing's rear side, and the stock solution hole intercommunication have been welded to protective housing's rear end both sides, the outer wall welding of third round bar has the U type groove, the stock solution seat is close to one side of third round bar has the third round bar and is close to the second side at the welding of the connecting pipe, the stock solution seat is close to the third round bar and is close to the side of the connecting pipe, the welding is close to the end face of a supporting seat, and is connected with the pipe, the stock solution pipe is connected with the side through the pipe.
Compared with the prior art, the invention provides double-sided grinding equipment for semiconductor silicon wafers, which has the following beneficial effects:
1. according to the invention, the concave connecting frame and the two semicircular balls are driven to reciprocate through the expansion and contraction of the second electric hydraulic rod, and simultaneously, the two circular truncated cones are driven to move up and down on the outer wall of the first circular rod through the expansion and contraction of the first spring, and are driven to move up and down along the arc surfaces of the two semicircular balls, so that when the second driving motor drives the two circular truncated cones to rotate, the two semicircular balls, the first circular rod and the gear can be regulated, and the rotating speed of the lower grinding disc can be regulated, so that the lower grinding disc can grind the lower surface of a semiconductor silicon wafer, and the grinding effect and applicability are improved;
2. according to the invention, the screw hole supporting seat is driven to rotate by the servo motor, the screw hole supporting seat is driven to move up and down, and the four concave-shaped chute seats and the inclined plane circular ring are driven to move up and down, so that the inclined plane circular ring moves up and down on the outer wall of the second conical cylinder and the outer wall of the first conical cylinder, and simultaneously, the inclined plane circular ring is enabled to be always contacted with the outer wall of the second conical cylinder and the outer wall of the first conical cylinder through the expansion and contraction of the second spring in the process of moving the inclined plane circular ring up and down, and the direction of the second conical cylinder is opposite to that of the first conical cylinder, so that when the first driving motor drives the first conical cylinder to rotate at a uniform speed, the second conical cylinder is driven to rotate through the inclined plane circular ring, and the rotating speed of the second conical cylinder is also regulated, so that the rotating speed of the upper grinding disc is regulated, and the upper surface of a semiconductor wafer can be ground better, and the grinding effect and the applicability are improved;
3. when the second conical cylinder rotates, the third round rod is driven to rotate, so that three pressing balls are driven to rotate through the three connecting round rods, the three pressing balls can orderly extrude the U-shaped hose, the U-shaped hose forms a peristaltic phenomenon, the U-shaped hose conveniently extracts grinding fluid in the liquid storage tank and orderly conveys the grinding fluid to the inside of the liquid storage seat, the spray pipe is conveniently sprayed out, and meanwhile, the speed of the grinding fluid in the liquid storage tank extracted by the U-shaped hose is changed along with the change of the rotating speed of the third round rod, so that the ground semiconductor silicon wafer can be effectively cooled and ground, and the grinding efficiency of the semiconductor silicon wafer is improved;
4. in the speed regulation process, the invention does not need to change the current and voltage, thereby effectively protecting equipment.
Drawings
FIG. 1 is a schematic diagram of a double-sided lapping apparatus for semiconductor wafers according to the present invention;
FIG. 2 is a schematic perspective view of the other view of FIG. 1;
FIG. 3 is a schematic elevational view of the structure of FIG. 1 with the protective door removed;
FIG. 4 is a schematic perspective view of the support frame, upper grinding mechanism and intelligent controller of FIG. 1;
FIG. 5 is a schematic perspective view of the structure of FIG. 4 after removal of the first cylinder, lower abrasive disc and planet wheel;
FIG. 6 is a schematic perspective view of a first driving assembly;
FIG. 7 is a schematic elevational view of the structure of FIG. 6;
FIG. 8 is a schematic view of an assembled perspective view of the lower grinding disc, connecting circular shaft, gears and circular wheel;
FIG. 9 is a schematic perspective view of an upper grinding mechanism;
FIG. 10 is a schematic elevational view of the structure of FIG. 9;
FIG. 11 is a schematic perspective view of an assembled structure of the second drive assembly, the first electro-hydraulic stem, and the third round stem;
FIG. 12 is a schematic perspective view of the structure of FIG. 11 with the mounting frame, the first drive motor, the servo motor, and the first electro-hydraulic stem removed;
FIG. 13 is an enlarged schematic view of the portion A of FIG. 12;
FIG. 14 is a schematic perspective view of a liquid spraying mechanism;
fig. 15 is a schematic top view partially in section of the protective enclosure.
In the figure: 1. a support frame; 2. a first driving motor; 3. a first tapered cylinder; 4. arc column; 5. a grinding disc is arranged; 6. a first cylinder; 7. a protective door; 8. lock type universal wheels; 9. a work table; 10. an intelligent controller; 11. a first delivery tube; 12. a mounting frame; 13. a servo motor; 14. a first electric hydraulic lever; 15. a second tapered cylinder; 16. a liquid storage tank; 17. a second electric hydraulic lever; 18. a mounting plate; 19. a second driving motor; 20. a semicircle sphere; 21. conical frustum; 22. a lower grinding disc; 23. a star wheel; 24. a second cylinder; 25. a central cylinder; 26. connecting a circular shaft; 27. a gear; 28. a round wheel; 29. a first round bar; 30. a first guide bar; 31. a concave connecting frame; 32. a double-hole slider; 33. a through hole square seat; 34. a first spring; 35. a second round bar; 36. sawing tooth grooves; 37. an annular groove; 38. a liquid storage seat; 39. a through round hole; 40. a spray pipe; 41. a third round bar; 42. a second delivery tube; 43. a protective housing; 44. a screw hole supporting seat; 45. a screw rod; 46. a second guide bar; 47. concave chute seat; 48. an inclined plane ring; 49. a third guide bar; 50. a first concave sleeve seat; 51. a through-hole slider; 52. a second concave sleeve seat; 53. a second spring; 54. a connecting pipe; 55. a support cylinder; 56. connecting round rods; 57. a U-shaped hose; 58. ball pressing; 59. a water delivery hole; 60. u-shaped groove.
Detailed Description
The invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-15, the present invention provides a technical solution: the double-sided grinding equipment of the semiconductor silicon wafer comprises a support frame 1, a workbench 9, a lower grinding mechanism, an upper grinding mechanism and a liquid spraying mechanism, wherein the lower grinding mechanism for grinding the lower surface of the semiconductor silicon wafer is arranged on the workbench 9, the support frame 1 is welded in the middle of the upper surface of the workbench 9, the upper grinding mechanism for grinding the upper surface of the semiconductor silicon wafer is arranged on the support frame 1, the liquid spraying mechanism for grinding, cooling and grinding is arranged on the outer wall of the lower side of the upper grinding mechanism and the rear end surface of the workbench 9, and an intelligent controller 10 is arranged on the outer wall of the support frame 1;
the concave connecting frame 31 and the two semicircular balls 20 are driven to reciprocate through the expansion and contraction of the second electric hydraulic rod 17, meanwhile, the two truncated cones 21 are driven to move up and down on the outer wall of the first circular rod 29 through the expansion and contraction of the first spring 34, and the two truncated cones 21 are driven to move up and down along the arc surfaces of the two semicircular balls 20, so that when the second driving motor 19 drives the two truncated cones 21 to rotate, the two semicircular balls 20, the first circular rod 29 and the gears 27 can be regulated, and the rotating speed of the lower grinding disc 22 can be regulated, so that the lower grinding disc 22 can grind the lower surface of a semiconductor silicon wafer;
the screw hole supporting seat 44 is driven to move up and down by driving the screw rod 45 through the servo motor 13, and the four concave-shaped chute seats 47 and the inclined plane circular ring 48 are also driven to move up and down, so that the inclined plane circular ring 48 moves up and down on the outer wall of the second conical cylinder 15 and the outer wall of the first conical cylinder 3, and simultaneously, the inclined plane circular ring 48 is always contacted with the outer wall of the second conical cylinder 15 and the outer wall of the first conical cylinder 3 through the expansion and contraction of the second spring 53 in the process of moving the inclined plane circular ring 48 up and down, and the direction of the second conical cylinder 15 is opposite to the direction of the first conical cylinder 3, so that when the first driving motor 2 drives the first conical cylinder 3 to rotate at a constant speed, the second conical cylinder 15 is driven to rotate through the inclined plane circular ring 48, and the rotating speed of the second conical cylinder 15 is also regulated, so that the rotating speed of the upper grinding disc 5 is regulated, and the upper surface of a semiconductor silicon wafer can be ground better;
when the second conical cylinder 15 rotates, the third round rod 41 is driven to rotate, so that three pressing balls 58 are driven to rotate through three connecting round rods 56, the three pressing balls 58 can orderly extrude the U-shaped hose 57, the U-shaped hose 57 is enabled to form a peristaltic phenomenon, the U-shaped hose 57 is convenient for extracting grinding fluid in the liquid storage tank 16, the grinding fluid is orderly conveyed to the liquid storage seat 38, the spray pipe 40 is convenient to spray out, meanwhile, the speed of the grinding fluid in the liquid storage tank 16 extracted by the U-shaped hose 57 is changed along with the change of the rotating speed of the third round rod 41, so that the temperature reduction work and the grinding work can be effectively carried out on the ground semiconductor silicon wafers, and the grinding efficiency of the semiconductor silicon wafers is improved.
As shown in fig. 1-8, the lower grinding mechanism comprises a first driving component and a lower grinding component, as shown in fig. 3, 6 and 7, the first driving component is installed on the workbench 9, the first driving component comprises a second electric hydraulic rod 17, a mounting plate 18, a concave connecting frame 31, two through hole square seats 33 and a gear 27, the mounting plate 18 is welded on the top inner wall of the workbench 9, the second electric hydraulic rod 17 is installed in the middle of the left end face of the mounting plate 18, a telescopic rod of the second electric hydraulic rod 17 penetrates through the mounting plate 18, two first guide rods 30 are welded on the upper side and the lower side of the right end of the mounting plate 18, wherein the outer walls of the two first guide rods 30 on the upper side and the outer walls of the two first guide rods 30 on the lower side are respectively sleeved with a double-hole sliding block 32, simultaneously, the right ends of the two first guide rods 30 on the upper side and the right end of the two first guide rods 30 on the lower side are respectively welded with one through hole square seat 33, the upper through hole square seat 33 is welded at the top of the workbench 9, the middle parts of the right end surfaces of the two double-hole sliding blocks 32 are welded with the concave connecting frame 31, the concave connecting frame 31 is positioned between the four first guide rods 30, meanwhile, the right side of the telescopic rod of the second electric hydraulic rod 17 is sleeved with the left end surface of the concave connecting frame 31, the two double-hole sliding blocks 32 are rotationally connected with the second round rod 35, the outer walls of the upper side and the lower side of the second round rod 35 are sleeved with the two semicircular balls 20, the lower surface of the lower double-hole sliding block 32 is provided with the second driving motor 19, the second driving motor 19 drives the second round rod 35 to rotate, the first round rod 29 is rotationally connected between the two through hole square seats 33, the top of the first round rod 29 respectively penetrates through the upper through hole square seat 33 and the top of the workbench 9, the outer wall of the upper side of the first round rod 29 is sleeved with the gear 27, the gear 27 is positioned on the upper surface of the workbench 9, two conical tables 21 are sleeved on the outer walls of the upper side and the lower side of the first round rod 29 in a sliding manner, a first spring 34 is sleeved on the outer wall of the middle part of the first round rod 29, two ends of the first spring 34 are in contact with the two conical tables 21, the lower grinding assembly can be driven to finish grinding work through a first driving assembly, meanwhile, the lower grinding assembly can be also subjected to speed regulation work, as shown in fig. 4, 5, 6, 7 and 8, the lower grinding assembly is arranged on the upper surface of the workbench 9, the lower grinding assembly is driven by the first driving assembly to finish grinding work, the lower grinding assembly comprises a lower grinding disc 22, a star wheel 23, a central cylinder 25, three connecting round shafts 26, a central cylinder 25 and a plurality of first cylinders 6, the central cylinder 25 is welded on the middle part of the upper surface of the workbench 9, a plurality of second cylinders 24 which are annularly distributed are arranged on the upper surface of the central cylinder 25, the outer wall of the center cylinder 25 is rotationally sleeved with a lower grinding disc 22, the lower surface of the lower grinding disc 22 is provided with an annular groove 37, the inner wall of the annular groove 37, which is close to one side of the edge of the lower grinding disc 22, is provided with a plurality of annular distributed sawtooth grooves 36, the sawtooth grooves 36 are meshed with the gears 27, three connecting circular shafts 26 are welded on the upper surface of the workbench 9, the three connecting circular shafts 26 are positioned in the annular groove 37, the outer wall of the three connecting circular shafts 26 is rotationally sleeved with a circular wheel 28, the rim of the circular wheel 28 is contacted with the inner wall of the annular groove 37, the outer wall of the edge of the lower grinding disc 22 is welded with a plurality of first cylinders 6 which are distributed annularly, the upper surface of the lower grinding disc 22 is provided with a plurality of star wheels 23, the plurality of star wheels 23 are meshed with a plurality of second cylinders 24 and a plurality of first cylinders 6 respectively, through a lower grinding assembly, the lower surface of the silicon wafer can be better ground.
As shown in fig. 7, a radial slide rail is arranged on the outer wall of the front side of the first round bar 29, a through hole matched with the first round bar 29 is formed in the middle of the truncated cone 21, a slide groove matched with the slide rail is formed in the front side of the through hole, the truncated cone 21 drives the first round bar 29 to rotate through the slide rail, and the truncated cone 21 can slide up and down conveniently through the first round bar 29, and meanwhile, the gear 27 can also be driven to rotate.
As shown in fig. 4, a plurality of silicon wafer placing grooves are formed in the star wheel 23, a plurality of U-shaped clamping grooves which are distributed in a ring shape are formed in the edge of the star wheel 23, the star wheel 23 is meshed with the second cylinder 24 and the first cylinder 6 through the U-shaped clamping grooves, meanwhile, the star wheel 23 rotates around the center cylinder 25, and the silicon wafer placing work is facilitated through the star wheel 23 and the silicon wafer is driven to slowly move.
As shown in fig. 1, 2, 3, 9, 10, 11, 12 and 13, the upper grinding mechanism comprises a first electric hydraulic rod 14, a second driving component and an upper grinding component, the first electric hydraulic rod 14 is installed in the middle of the upper surface of the support frame 1, and the telescopic rod of the first electric hydraulic rod 14 extends to the workbench 9 after penetrating through the top of the support frame 1, the heights of the second driving component and the upper grinding component are better adjusted through the first electric hydraulic rod 14, the second driving component is installed on the outer wall of the lower side of the telescopic rod of the first electric hydraulic rod 14, the second driving component comprises a mounting frame 12, a screw hole supporting seat 44 and a screw rod 45, the second conical cylinder 15 is rotatably connected at the inner center of the mounting frame 12, the lower end of the second conical cylinder 15 penetrates through the bottom of the mounting frame 12, the inner left side of the installation frame 12 is rotationally connected with a first conical cylinder 3, the first conical cylinder 3 is positioned at the left side of a second conical cylinder 15, the inner right side of the installation frame 12 is rotationally connected with a longitudinal screw rod 45, the top of the screw rod 45 penetrates through the upper surface of the installation frame 12, the outer wall of the screw rod 45 is in threaded connection with a screw hole supporting seat 44, the front side and the rear side of the screw hole supporting seat 44 are in sliding connection with longitudinal second guide rods 46, two ends of the two second guide rods 46 are welded with the inner walls of two sides of the installation frame 12, four concave-shaped chute seats 47 are welded at the left end two sides of the screw rod 45, a transverse third guide rod 49 is arranged in the four concave-shaped chute seats 47, two ends of the third guide rod 49 are respectively welded with the left end face of the screw hole supporting seat 44 and the left inner wall of the concave-shaped chute seats 47, through hole sliding blocks 51 are sleeved on the outer walls of the four third guide rods 49, and the through-hole slider 51 slides in the inside of concave shape spout seat 47, the welding has first concave font cover seat 50 between four through-hole sliders 51, and the number of first concave font cover seat 50 is two, simultaneously, two first concave font cover seats 50 slide between four concave shape spout seats 47, and the inside rotation of two first concave font cover seats 50 is connected with inclined plane ring 48, and inclined plane ring 48 cover is established on the outer wall of second conical cylinder 15, the inner wall of inclined plane ring 48 and the outer wall contact of second conical cylinder 15, the outer wall of inclined plane ring 48 and the outer wall contact of first conical cylinder 3, the right side outer wall cover of inclined plane ring 48 is equipped with second concave font cover seat 52, be equipped with second spring 53 between second concave font cover seat 52 and the screw supporting seat 44, first driving motor 2 is installed in the upper surface left side of mounting frame 12, and first conical cylinder 3 is rotatory, servo motor 13 is installed on the upper surface right side of mounting frame 12, and servo motor 13 rotation 45 cover is established on the outer wall, the outer wall of second conical cylinder 48 contacts the outer wall, the upper and lower side of second conical cylinder 3 is equipped with second conical cylinder 39, the grinding wheel is equipped with the second concave font cover seat 52, be equipped with second round spring 53 between the second concave font cover seat 52 and the screw hole supporting seat 44, the upper surface grinding wheel assembly is located on the grinding wheel assembly is equipped with, the grinding wheel assembly is located on the grinding wheel assembly is better, the grinding wheel assembly is equipped with the round hole, the grinding wheel assembly is equipped with the round hole assembly, and the round hole is equipped with the round hole assembly, and the round hole assembly is equipped with the round hole grinding assembly and has the round hole assembly and the round hole.
As shown in fig. 1, 2, 14 and 15, the liquid spraying mechanism comprises a liquid storage tank 16, a liquid storage seat 38, a third round bar 41 and a protective housing 43, wherein the third round bar 41 is welded at the lower end of a second conical cylinder 15, the third round bar 41 is positioned at the lower side of a mounting frame 12, meanwhile, an upper grinding disc 5 is mounted on the outer wall of the lower side of the third round bar 41, the upper outer wall of the third round bar 41 is rotationally connected with the protective housing 43, the protective housing 43 is welded at the lower surface of the mounting frame 12, a U-shaped groove 60 is formed in the protective housing 43, a U-shaped hose 57 is arranged in the U-shaped groove 60, three equidistant connecting round bars 56 are welded at the outer wall of the upper side of the third round bar 41, the connecting round bars 56 are positioned in the U-shaped groove 60, a pressing ball 58 is welded at one end of the third round bar 41 far away from the connecting round bars 56, and the pressing ball 58 presses the U-shaped hose 57, two water delivery holes 59 are formed in the rear side of the protective shell 43, the water delivery holes 59 are communicated with the U-shaped hose 57, connecting pipes 54 are welded on two sides of the rear end of the protective shell 43, the connecting pipes 54 are communicated with the water delivery holes 59, one side, close to the protective shell 43, of the outer wall of the third round rod 41 is rotationally connected with a liquid storage seat 38, the liquid storage seat 38 is communicated with one connecting pipe 54 through a second conveying pipe 42, supporting cylinders 55 are welded on two sides, close to the protective shell 43, of the upper surface of the liquid storage seat 38, the supporting cylinders 55 are welded on the lower surface of the mounting frame 12, a plurality of spray pipes 40 are arranged on two sides, close to the third round rod 41, of the lower surface of the liquid storage seat 38, the liquid storage tank 16 is welded on the rear end face of the workbench 9, the liquid storage tank 16 is communicated with the other connecting pipe 54 through the first conveying pipe 11, and grinding liquid can be conveniently put into grinding work and cooling work well through a liquid spraying mechanism.
As shown in fig. 1 and 4, the front side of the workbench 9 is rotatably connected with two protective doors 7, and locking universal wheels 8 are mounted at four corners of the lower surface of the workbench 9, so that supporting work and protective work can be better performed through the workbench 9, and meanwhile, moving work is also performed for convenience.
In order to realize the electric control work, the intelligent controller 10 is electrically connected with the first driving motor 2, the servo motor 13, the first electric hydraulic rod 14, the second electric hydraulic rod 17 and the second driving motor 19 respectively through wires, and the intelligent controller 10 can better perform the intelligent control work.
The working principle and the using flow of the invention are as follows: before use, a worker firstly unlocks the four locking type universal wheels 8 and pushes the workbench 9 to enable the four locking type universal wheels 8 to move rotationally, so that the whole device moves to a designated position, then the worker can fix the whole device at the designated position by locking the four locking type universal wheels 8, then the worker stores grinding fluid in the liquid storage tank 16, then the worker electrically connects the intelligent controller 10 with an external power supply, and the setting of parameters (parameters such as rotating speed, height and the like corresponding to each silicon chip) is completed through the intelligent controller 10;
when the intelligent controller is used, a plurality of silicon wafers are firstly placed in a plurality of silicon wafer placing grooves of a plurality of star wheels 23 by a worker, then the worker operates the intelligent controller 10 according to the specification of the silicon wafers, so that the first electric hydraulic rod 14 extends to work, the second driving component and the upper grinding component move downwards, when the upper grinding disk 5 contacts, the intelligent controller 10 controls the first electric hydraulic rod 14 to stop working, and simultaneously, the intelligent controller 10 controls the servo motor 13, the second electric hydraulic rod 17, the first driving motor 2 and the second driving motor 19 to work firstly and secondly;
when the servo motor 13 works, the servo motor 13 drives the screw rod 45 to rotate, so that the four concave-shaped chute seats 47 and the inclined plane circular ring 48 are driven to move up and down, the inclined plane circular ring 48 moves up and down on the outer wall of the second conical cylinder 15 and the outer wall of the first conical cylinder 3, and simultaneously, in the process of moving up and down the inclined plane circular ring 48, the inclined plane circular ring 48 is always contacted with the outer wall of the second conical cylinder 15 and the outer wall of the first conical cylinder 3 through the expansion and contraction of the second spring 53; after the height adjustment of the concave chute seat 47 and the inclined plane circular ring 48 is completed, the intelligent controller 10 controls the first driving motor 2, when the first driving motor 2 works, the first driving motor 2 drives the first conical cylinder 3 to rotate at a constant speed, and the second conical cylinder 15 is driven to rotate through the inclined plane circular ring 48 when the first conical cylinder 3 rotates at a constant speed because the direction of the second conical cylinder 15 is opposite to the direction of the first conical cylinder 3, and the rotating speed of the second conical cylinder 15 is adjusted, so that the rotating speed of the upper grinding disc 5 is adjusted, and the upper grinding disc 5 can better grind the upper surface of a semiconductor silicon wafer;
when the second electric hydraulic rod 17 works, the second electric hydraulic rod 17 drives the concave connecting frame 31 and the two semicircular balls 20 to reciprocate, meanwhile, the two circular truncated cones 21 are driven to move up and down on the outer wall of the first circular rod 29 through the expansion and contraction of the first spring 34, the two circular truncated cones 21 are also driven to move up and down along the arc surfaces of the two semicircular balls 20, after the position adjustment work of the two semicircular balls 20 and the two circular truncated cones 21 is completed, the intelligent controller 10 controls the second driving motor 19 to work, when the second driving motor 19 works, the two circular truncated cones 21 are driven to rotate, and as the two semicircular balls 20 and the two circular truncated cones 21 complete the position adjustment work, the rotation speed of the lower grinding disc 22 is also regulated, and the lower grinding disc 22 can grind the lower surface of a semiconductor;
when the second conical cylinder 15 rotates, the third round rod 41 is driven to rotate, so that three pressing balls 58 are driven to rotate through three connecting round rods 56, the three pressing balls 58 can orderly extrude the U-shaped hose 57, so that the U-shaped hose 57 forms a peristaltic phenomenon, the U-shaped hose 57 is convenient for extracting grinding fluid in the liquid storage tank 16, the grinding fluid can be orderly conveyed into the liquid storage seat 38 through the peristaltic U-shaped hose 57, and is sprayed out through the spray pipe 40, meanwhile, the speed of the grinding fluid in the liquid storage tank 16 extracted by the U-shaped hose 57 is changed along with the rotation speed change of the third round rod 41, when the grinding fluid is sprayed out through the spray pipe 40, the grinding fluid flows to the lower grinding disc 22 through a plurality of through silicon wafers 39, and at the moment, the grinding fluid, the lower grinding disc 22 and the upper grinding disc 5 can better grind two sides of round holes and cool down;
in the grinding process, the lower grinding disc 22 drives the plurality of first cylinders 6 to rotate, and because the free star wheel 23 is respectively meshed with the second cylinders 24 and the first cylinders 6 through the U-shaped clamping grooves, when the plurality of first cylinders 6 rotate, the plurality of free star wheels 23 and the plurality of silicon wafers are driven to do central rotation work around the central cylinder 25, so that the lower grinding disc 22 and the upper grinding disc 5 can conveniently grind two sides of the plurality of silicon wafers;
after finishing the grinding work, the staff rethread is to intelligent control ware 10, and intelligent control ware 10 will control second driving motor 19 and first driving motor 2 stop work, simultaneously, also can control first electronic hydraulic stem 14 and shrink work for second drive assembly and last grinding assembly upwards move, thereby make things convenient for the staff to take the silicon chip after grinding, later, the staff just can continue grinding the silicon chip of same specification according to above-mentioned step.
Claims (10)
1. The utility model provides a double-sided grinding equipment of semiconductor silicon chip, includes support frame (1), workstation (9), lower grinding mechanism, goes up grinding mechanism and hydrojet mechanism, its characterized in that: the polishing device is characterized in that a lower polishing mechanism for polishing the lower surface of the semiconductor silicon wafer is arranged on the workbench (9), a support frame (1) is welded in the middle of the upper surface of the workbench (9), an upper polishing mechanism for polishing the upper surface of the semiconductor silicon wafer is arranged on the support frame (1), and a liquid spraying mechanism for polishing, cooling and polishing is arranged on the outer wall of the lower side of the upper polishing mechanism and the rear end face of the workbench (9).
2. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 1, wherein: the lower grinding mechanism comprises a first driving component and a lower grinding component, the first driving component is arranged on the workbench (9), the lower grinding component is arranged on the upper surface of the workbench (9), and the first driving component drives the lower grinding component to finish grinding work.
3. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 2, wherein: the first driving component comprises a second electric hydraulic rod (17), a mounting plate (18), a concave connecting frame (31), two through hole square seats (33) and a gear (27), wherein the mounting plate (18) is welded on the top inner wall of a workbench (9), the second electric hydraulic rod (17) is mounted at the middle part of the left end face of the mounting plate (18), the telescopic rod of the second electric hydraulic rod (17) penetrates through the mounting plate (18), two first guide rods (30) are welded on the upper side and the lower side of the right end of the mounting plate (18), a double-hole sliding block (32) is sleeved on the outer wall of the upper two first guide rods (30) and the outer wall of the lower two first guide rods (30), meanwhile, the right end of the upper two first guide rods (30) and the right end of the lower two first guide rods (30) are welded with one through hole square seat (33), the upper through hole square seat (33) is welded on the top of the workbench (9), two concave connecting frames (31) are welded between the two concave connecting frames (31) of the right end faces of the two first guide rods (32), the concave connecting frame (31) are connected between the two concave connecting frames (31) in a sleeved mode, the upper and lower both sides outer wall of second round bar (35) has cup jointed two semicircle balls (20), and the lower surface mounting of the diplopore slider (32) of downside has second driving motor (19), and second driving motor (19) drive second round bar (35) are rotatory, two rotate between through-hole square seat (33) and be connected with first round bar (29), and the top of stretching out through-hole square seat (33) and workstation (9) of upside respectively are run through at the top of first round bar (29), gear (27) have been cup jointed to the upside outer wall of first round bar (29), and gear (27) are located the upper surface of workstation (9), the upper and lower both sides outer wall slip cap of first round bar (29) is equipped with two conical tables (21), the middle part outer wall cover of first round bar (29) is equipped with first spring (34), and the both ends and two conical tables (21) contact of first spring (34).
4. A double-sided lapping apparatus for semiconductor wafers as claimed in claim 3, wherein: the outer wall of the front side of the first round rod (29) is provided with a radial sliding rail, the middle part of the circular truncated cone (21) is provided with a through hole matched with the first round rod (29), the front side of the through hole is provided with a sliding groove matched with the sliding rail, and the circular truncated cone (21) drives the first round rod (29) to rotate through the sliding rail.
5. A double-sided lapping apparatus for semiconductor wafers as claimed in claim 3, wherein: the lower grinding component comprises a lower grinding disc (22), an upstream star wheel (23), a central cylinder (25), three connecting circular shafts (26), the central cylinder (25) and a plurality of first cylinders (6), wherein the central cylinder (25) is welded on the middle part of the upper surface of the workbench (9), a plurality of second cylinders (24) which are annularly distributed are arranged on the upper surface of the central cylinder (25), the lower grinding disc (22) is rotatably sleeved on the outer wall of the central cylinder (25), an annular groove (37) is formed in the lower surface of the lower grinding disc (22), a plurality of annular distributed sawtooth grooves (36) are formed in the inner wall, close to one side of the edge of the lower grinding disc (22), of the annular groove (37) and meshed with the gear (27), three connecting circular shafts (26) are welded on the upper surface of the workbench (9), the three connecting circular shafts (26) are positioned in the annular groove (37), round wheels (28) are rotatably sleeved on the outer wall of the connecting circular shafts (26), the round wheels (28) are in contact with the inner wall of the annular groove (22), a plurality of annular grooves (22) are formed in the inner wall, and the inner wall, which is in contact with the annular groove (37), of the annular groove (22), a plurality of the inner walls (22) are welded on the inner wall of the annular groove (6), and a plurality of planet wheels (23) are respectively meshed with the plurality of second cylinders (24) and the plurality of first cylinders (6).
6. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 5, wherein: a plurality of silicon chip placing grooves are formed in the free wheel (23), a plurality of U-shaped clamping grooves which are distributed annularly are formed in the edge of the free wheel (23), the free wheel (23) is meshed with the second cylinder (24) and the first cylinder (6) through the U-shaped clamping grooves, and meanwhile the free wheel (23) rotates around the central cylinder (25).
7. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 1, wherein: the upper grinding mechanism comprises a first electric hydraulic rod (14), a second driving assembly and an upper grinding assembly, wherein the first electric hydraulic rod (14) is installed in the middle of the upper surface of the supporting frame (1), a telescopic rod of the first electric hydraulic rod (14) extends to the workbench (9) after penetrating through the top of the supporting frame (1), the second driving assembly is installed on the outer wall of the lower side of the telescopic rod of the first electric hydraulic rod (14), the upper grinding assembly is installed on the outer wall of the lower side of the second driving assembly, and the second driving assembly drives the upper grinding assembly to finish grinding work.
8. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 6, wherein: the second driving component comprises a mounting frame (12), a screw hole supporting seat (44) and a screw rod (45), the second conical cylinder (15) is rotationally connected to the inner center of the mounting frame (12), the lower end of the second conical cylinder (15) penetrates through the bottom of the mounting frame (12), the first conical cylinder (3) is rotationally connected to the left side of the inner part of the mounting frame (12), the first conical cylinder (3) is positioned on the left side of the second conical cylinder (15), the longitudinal screw rod (45) is rotationally connected to the right side of the inner part of the mounting frame (12), the top of the screw rod (45) penetrates through the upper surface of the mounting frame (12), the screw hole supporting seat (44) is connected to the outer wall threads of the screw rod (45), the front side and the rear side of the screw hole supporting seat (44) are slidably connected with longitudinal second guide rods (46), two ends of the two second guide rods (46) are welded with two inner walls of the two sides of the mounting frame (12), four concave sliding grooves (47) are welded on the left sides of the screw rod (45), four concave sliding grooves (47) are formed in the inner sides of the screw rod (47), the inner walls of the four concave guide rods (47) are welded with the inner walls (49) respectively, the left end faces (49) of the four sliding grooves (49) are welded with the inner walls (49) of the screw rod (47), and through-hole slider (51) are in the inside slip of concave shape spout seat (47), four welding has first concave font cover seat (50) between through-hole slider (51), and the number of first concave font cover seat (50) is two, simultaneously, two first concave font cover seats (50) slide between four concave shape spout seats (47), two the inside rotation of first concave font cover seat (50) is connected with inclined plane ring (48), and inclined plane ring (48) cover is established on the outer wall of second conical cylinder (15), the inner wall of inclined plane ring (48) and the outer wall contact of second conical cylinder (15), the outer wall of inclined plane ring (48) and the outer wall contact of first conical cylinder (3), the right side outer wall cover of inclined plane ring (48) is equipped with second concave font cover seat (52), be equipped with second spring (53) between second concave font cover seat (52) and screw supporting seat (44), the first rotary driving screw (13) of motor (12) on the upper surface mounting frame (12) have first rotary driving screw (13) on the right side (13).
9. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 7, wherein: the upper grinding assembly comprises an arc column (4) and an upper grinding disc (5), a plurality of annular through round holes (39) are formed in the upper grinding disc (5), the arc column (4) is welded on the upper surface of the upper grinding disc (5), and the through round holes (39) are located on the inner side of the arc column (4).
10. The double-sided lapping apparatus for semiconductor wafers as claimed in claim 8, wherein: the liquid spraying mechanism comprises a liquid storage tank (16), a liquid storage seat (38), a third round rod (41) and a protective shell (43), wherein the third round rod (41) is welded at the lower end of a second conical cylinder (15), the third round rod (41) is positioned at the lower side of an installation frame (12), meanwhile, an upper grinding disc (5) is installed on the outer wall of the lower side of the third round rod (41), the protective shell (43) is rotationally connected with the outer wall of the upper side of the third round rod (41), the protective shell (43) is welded at the lower surface of the installation frame (12), a U-shaped groove (60) is formed in the protective shell (43), a U-shaped hose (57) is arranged in the U-shaped groove (60), three equidistant connecting round rods (56) are welded on the outer wall of the upper side of the third round rod (41), the connecting round rods (56) are positioned in the U-shaped groove (60), one ends of the third round rods (41) far away from each other are provided with a pressing ball (58), the two connecting tubes (59) are welded with the connecting tubes (59), the two connecting tubes (59) are connected with the two water delivery holes (59) in the connecting tubes (59) in the two sides of the connecting tubes (59) in a connecting mode, and the two water delivery holes (59) are communicated with each connecting tube (59), the outer wall of third round bar (41) is close to one side rotation that protects shell (43) and is connected with stock solution seat (38), and stock solution seat (38) are through second conveyer pipe (42) and connecting pipe (54) intercommunication, the upper surface of stock solution seat (38) is close to both sides welding that protects shell (43) and has support cylinder (55), and support cylinder (55) welding be in with installing frame (12) lower surface, the lower surface of stock solution seat (38) is close to the both sides of third round bar (41) and is equipped with a plurality of spray pipes (40), stock solution case (16) welding is on the rear end face of workstation (9), stock solution case (16) are through first conveyer pipe (11) and another connecting pipe (54) intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311651823.6A CN117484378B (en) | 2023-12-05 | Double-sided grinding equipment for semiconductor silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311651823.6A CN117484378B (en) | 2023-12-05 | Double-sided grinding equipment for semiconductor silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117484378A true CN117484378A (en) | 2024-02-02 |
| CN117484378B CN117484378B (en) | 2024-05-17 |
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| CN111843816A (en) * | 2020-08-12 | 2020-10-30 | 青岛高测科技股份有限公司 | Semiconductor silicon wafer double-side grinding equipment |
| WO2022156020A1 (en) * | 2021-01-22 | 2022-07-28 | 宁波云德半导体材料有限公司 | Adjustable quartz grinding device |
| CN116900876A (en) * | 2023-09-13 | 2023-10-20 | 杭州泓芯微半导体有限公司 | Double-sided polishing device for special-shaped quartz piece of quartz DOME |
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