CN117483962A - Method, system, device and equipment for laser drilling through hole - Google Patents
Method, system, device and equipment for laser drilling through hole Download PDFInfo
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- CN117483962A CN117483962A CN202311171435.8A CN202311171435A CN117483962A CN 117483962 A CN117483962 A CN 117483962A CN 202311171435 A CN202311171435 A CN 202311171435A CN 117483962 A CN117483962 A CN 117483962A
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- 238000000034 method Methods 0.000 title claims abstract description 98
- 238000005520 cutting process Methods 0.000 claims abstract description 138
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 11
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- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention relates to the field of laser processing, in particular to a method, a system, a device and equipment for drilling a through hole by using laser, wherein the method comprises the steps of determining the axial position of a target through hole on a plate to be drilled with glue, and performing rotary cutting and drilling on the plate by using drilling laser with the axial position of the target through hole as the center to obtain a guide through hole with radius Rd; and (3) taking the axis position of the guide through hole as the center, and carrying out rotary cutting, reaming and drilling on the target through hole on the plate around the guide through hole by using drilling laser to obtain the target through hole with the diameter D. When the plate with the adhesive layer is drilled, the guide through hole is drilled at the position of the target through hole in advance, so that plasma and chip discharge space is provided for reaming, rotary-cut drilling of the target through hole; the heat accumulation in the hole during the drilling of the guide through hole and the rotary cutting reaming of the target through hole is greatly reduced, and the shrinkage of the inner wall of the target through hole and the depth of cracks on the inner wall can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a method, a system, a device and equipment for drilling a through hole by laser.
Background
At present, the laser is used for drilling the through holes of the circuit board, but when the laser is used for drilling the through holes of the circuit board with the adhesive layer, obvious shrinkage phenomenon exists, and the shrinkage directly brings the unreliability of subsequent electroplating. Therefore, laser drilling of glued circuit boards is currently difficult to achieve in a wide range of applications. If mechanical drilling is adopted, the friction heat caused by the rotation of the mechanical drilling drill needle also directly causes the shrinkage of the glue-containing through hole, so that the mechanical drilling is difficult and heavy for the glue-containing circuit board. No matter laser drilling or mechanical drilling is carried out, no good solution is provided for the drilling of the glue-containing circuit board in the circuit board industry, and the problem of glue shrinkage caused by the drilling can not be solved.
Disclosure of Invention
The invention aims to provide a method, a system, a device and equipment for drilling a through hole by laser, which can solve the problem of shrinkage of a glue-containing plate during drilling the through hole.
In a first aspect, the present invention provides a method of laser drilling a through hole, the method comprising the steps of:
determining the axis position of a target through hole on a plate to be drilled, and performing rotary cutting drilling on the guide through hole on the plate by using drilling laser with the axis position of the target through hole as the center to obtain a guide through hole with radius Rd;
Performing rotary-cut reaming and drilling on the plate around the guide through hole by using the drilling laser with the axis position of the guide through hole as the center to obtain a target through hole with the diameter D;
wherein the plate is a glue-containing plate or a single or composite multi-layer material plate with the softening temperature lower than 300 ℃;
in the process of the rotary-cut reaming and drilling of the target through hole, a negative pressure space channel for discharging scraps of the rotary-cut reaming and drilling of the target through hole is arranged below the guide through hole;
the method for setting the negative pressure space channel comprises the following steps: a jig plate is placed below the plate, a negative pressure through hole is machined in advance on the jig plate, the negative pressure through hole is communicated with the guide through hole, the jig plate is placed on a drilling platform honeycomb plate, the drilling platform honeycomb plate is connected with a negative pressure equipment system, negative pressure is formed in the drilling platform honeycomb plate to enable the jig plate and the plate to be adsorbed and fixed, so that negative pressure is formed in the negative pressure through hole, air flow passes through the guide through hole, and the air flow flows from the upper side of the plate to the direction of a corresponding hole in place on the jig plate.
In a second aspect, the present invention provides a system for laser drilling a through hole, the system comprising a module,
the guide through hole rotary-cut drilling module is used for determining the axis position of a target through hole on a plate to be drilled, and carrying out rotary-cut drilling on the guide through hole on the plate by using drilling laser with the axis position of the target through hole as the center to obtain a guide through hole with radius Rd;
the target through hole rotary-cut reaming and drilling module is used for carrying out target through hole rotary-cut reaming and drilling on the plate around the guide through hole by using the drilling laser with the axis position of the guide through hole as the center, so as to obtain a target through hole with the diameter D;
wherein the plate is a glue-containing plate or a single or composite multi-layer material plate with the softening temperature lower than 300 ℃;
in the process of the rotary-cut reaming and drilling of the target through hole, a negative pressure space channel for discharging scraps of the rotary-cut reaming and drilling of the target through hole is arranged below the guide through hole;
the method for setting the negative pressure space channel comprises the following steps: a jig plate is placed below the plate, a negative pressure through hole is machined in advance on the jig plate, the negative pressure through hole is communicated with the guide through hole, the jig plate is placed on a drilling platform honeycomb plate, the drilling platform honeycomb plate is connected with a negative pressure equipment system, negative pressure is formed in the drilling platform honeycomb plate to enable the jig plate and the plate to be adsorbed and fixed, so that negative pressure is formed in the negative pressure through hole, air flow passes through the guide through hole, and the air flow flows from the upper side of the plate to the direction of a corresponding hole in place on the jig plate.
In a third aspect, the present invention provides a device for laser drilling a through hole in a circuit board, the device comprising a processor, a memory and a computer program stored in the memory and operable on the processor, the computer program implementing the method steps described above when being run.
In a fourth aspect, the invention provides a device for drilling a through hole on a circuit board by using laser, which comprises a machine table, a laser and the device for drilling the through hole by using the laser, wherein the device for drilling the through hole by using the laser is electrically connected with the laser;
the machine is used for placing processing materials;
the laser is used for generating a processing light beam;
the device for laser drilling the through holes is used for controlling the laser to operate according to the method steps so as to finish laser processing of the plate.
The method, the system, the device and the equipment for drilling the through hole by the laser have the beneficial effects that: when the plate containing the adhesive layer or the plate which is not resistant to temperature is drilled, the guide through hole is drilled at the position of the target through hole in advance, plasma and chip discharge space is provided for the target through hole reaming and rotary-cut drilling, and a no-light time period is set in the processes of the guide through hole rotary-cut drilling and the target through hole rotary-cut reaming and drilling, which is also a cooling time period in the hole, so that heat accumulation in the hole when the guide through hole rotary-cut drilling and the target through hole rotary-cut reaming are carried out is greatly reduced, and the shrinkage of the inner wall of the target through hole and the crack depth of the inner wall can be greatly reduced.
Drawings
FIG. 1 is a flow chart of a method of laser drilling a via according to the present invention;
FIG. 2 is a schematic diagram of the entire drilling process in the method of the present invention;
FIG. 3 is another schematic diagram of the entire drilling process in the method of the present invention;
FIG. 4 is a cross-sectional view of a pilot hole-wide circular groove rotary-cut borehole in the method of the present invention;
FIG. 5 is a schematic view of a cross-section of a pilot hole in the method of the present invention;
FIG. 6 is a view of a guide Kong Poumian in the method of the present invention;
FIG. 7 is a cross-sectional view of a pilot hole in a narrow circular ring groove rotary-cut borehole in accordance with the method of the present invention;
FIG. 8 is a schematic diagram of a rotary-cut reaming and drilling process for a target through-hole in the method of the present invention;
FIG. 9 is another schematic diagram of a rotary-cut reaming and drilling process for a target through-hole in the method of the present invention;
FIG. 10 is a view showing the mating of a plate and a jig plate during rotary-cut reaming and drilling of a target through hole in the method of the present invention;
fig. 11 is a block diagram of a system for laser drilling a via according to the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
1. the device comprises a target through hole, 2, a third movement track, 3, a first movement track, 4, a second movement track, 5, a guide hole, 6, a first laser focus spot, 7, a second laser focus spot, 8, a thin-wall area, 9, a third laser focus spot, 10, a plate, 11, a second circular groove, 12, a first circular groove, 13, a guide Kong Lizhu, 14, a single laser focus spot, 21, a third circular groove, 22, a guide hole site, 33, a negative pressure through hole, 34 and a jig plate.
Detailed Description
The principles and features of the present invention are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
As shown in fig. 1, a method of laser drilling a through hole, comprising the steps of,
determining the axis position of a target through hole on a plate to be drilled, and guiding Kong Xuanqie to drill holes on the plate by using drilling laser with the axis position of the target through hole as the center to obtain guide holes with radius Rd;
performing rotary-cut reaming and drilling on the plate around the guide hole by using the drilling laser with the axis position of the guide hole as the center to obtain a target through hole with the diameter D;
wherein the plate is a glue-containing plate or a single or composite multi-layer material plate with softening temperature lower than 300 ℃.
In addition, the guide hole is a guide through hole or a guide blind hole.
The board may be, but not limited to, a circuit board, but may be any material having a softening temperature of less than 300 degrees, or a composite multi-layer material having a softening temperature of less than 300 degrees. For example, PET material cutting drilling, prepreg rotary cutting drilling, LCP (liquid crystal polymer, the most promising material for 5G circuit boards) rotary cutting drilling, ferrite cutting drilling with upper and lower surfaces covered with organic protective films, and the like.
The guide hole is a guide through hole or a guide blind hole. When the guide hole is a guide through hole, the drilling laser drills through the plate to obtain the guide through hole; when the guide hole is a guide blind hole, the drilling laser keeps the lowest layer of material of the plate not to drill through, and at the moment, the guide blind hole can provide a plasma chip removal space and a heat dissipation space for the reaming and telemechanical movement of the target through hole of the drilling laser. And the purpose of selecting not to drill through the plate is to reduce the drilling time of the target through hole.
Preferably, in the process of drilling the guide Kong Xuanqie, the drilling laser performs rotary cutting movement in two concentric circular tracks, and the guide hole is rotary-cut.
Preferably, the drilling laser performs rotary cutting movement in two concentric circular tracks, the specific process of rotary cutting the guide hole is that,
determining the axis position of the target through hole on the plate, and performing rotary cutting movement of concentric circle tracks with the radius of R1 and R2 on the plate by taking the axis position of the target through hole as the center at the laser focus spot center of the drilling laser to obtain the guide hole;
wherein R1 is less than or equal to R2, rd=R2+r2, R2-R1 is less than or equal to r1+r2, R1 is the effective light spot radius when the drilling laser drills the circular track with the rotary cutting radius R1 of the guide hole, and R2 is the effective light spot radius when the drilling laser drills the circular track with the rotary cutting radius R2 of the guide hole;
The rotary cutting mode of the drilling laser on the plate material for concentric circular tracks with the radiuses of R1 and R2 is rotary cutting in turn, and the sequence and the times of rotary cutting in turn are set at will.
In this embodiment, the board is a circuit board at least comprising two copper layers and one adhesive layer; fig. 2 is a schematic diagram of the whole drilling process in the method of the present invention, 10 in fig. 2 is the board, the board 10 is specifically a multilayer circuit board, and the structure from top to bottom is "copper-PI-glue-PI-copper", wherein PI is a polyimide material, and glue is a semi-cured glue in the field of circuit boards; the thickness of the sheet 10 in this example is 330 microns.
In this embodiment, the method of the present invention comprises the following steps:
firstly, obtaining a laser processing image file;
the target hole diameter D set by the laser processing pattern is determined, that is, 1 in fig. 2 is a target hole, and the diameter of the target hole 1 is D, in this embodiment, D is 150 micrometers.
The drilling parameter radiuses R1 and R2 of the guide Kong Xuanqie are determined, as shown in fig. 2, 5 is a guide hole, 4 is a first movement track of the laser focus spot center when the drilling laser drills the circular track with the radius R1 of the guide hole 5, the first movement track 4 is a circle with the radius R1, 3 is a second movement track of the laser focus spot center when the drilling laser drills the circular track with the radius R2 of the guide hole 5, and the second movement track 3 is a circle with the radius R2.
And determining a rotary-cut reaming radius parameter R of the target through hole 1, wherein as shown in fig. 2, 2 is a third movement track of the center of a laser focus spot when the drilling laser drills a circular track with the rotary-cut reaming radius R of the target through hole 1, and the third movement track 2 is a circle with the radius R.
Radius parameters R1, R2 and R are respectively the distances from the center of rotary cutting movement of the laser focus to the center of a laser focus spot of the corresponding rotary cutting path; in this embodiment, the center of rotation of the laser focus is the axis of the target through hole 1, and the guide hole 5 is theoretically coaxial with the axis of the target through hole 1.
In the process of rotary cutting and drilling of the guide hole 5 and in the process of rotary cutting and reaming and drilling of the target through hole 1, laser parameters of different rotary cutting paths can be different, so that effective light spot radiuses of corresponding drilling lasers in machining of different paths are also different, when the drilling lasers drill a circular track with the rotary cutting radius R1 of the guide hole 5, the effective light spot radius of the drilling lasers is R1, as shown in fig. 2, 6 is a first laser focus light spot when the drilling lasers drill the circular track with the rotary cutting radius R1 of the guide hole 5, and the first laser focus light spot 6 is a solid circle with the radius R1; when the drilling laser drills the circular track with the radius R2 of the guide hole 5, the effective spot radius of the drilling laser is R2, as shown in fig. 2, 7 is a second laser focus spot when the drilling laser drills the circular track with the radius R2 of the guide hole 5, and the second laser focus spot 7 is a solid circle with the radius R2; when the drilling laser performs the circular track of the rotary-cut reaming motion radius R of the target through hole 1, the effective light spot radius of the drilling laser is R, as shown in fig. 2, 9 is a third laser focus light spot when the drilling laser drills the circular track of the rotary-cut reaming motion radius R of the target through hole 1, and the third laser focus light spot 9 is a solid circle with the radius R.
It can be seen that the radius of the guide hole 5 is rd=r2+r2.
The parameters satisfy the following relationship:
D＝2*(R+r)；R2-R1≤r1+r2；R-R2≤r+r2+⊿；
as shown in fig. 2, the thin-walled region 8 between the target through-hole 1 and the guide hole 5, which is cut by the drill laser, separates the target through-hole 1 and the guide hole 5 by the thickness of Δ.
Secondly, the laser focus spot center of the drilling laser is used for carrying out rotary cutting movement on the guide hole 5 Kong Nalun with the circular track with the radius of R1 and R2 by taking the axis position of the target through hole 1 on the plate 10 as the center until the guide hole 5 is drilled or a guide blind hole is generated. In this embodiment, the guiding hole 5 is a guiding through hole, and the guiding hole 5 may also be a guiding blind hole, at this time, the plate is not drilled through, and the part of the material that is not drilled through generally belongs to a relatively temperature-resistant material, and at the final stage of reaming the target through hole, the material may be directly and rotatably drilled through by adopting a conventional drilling mode.
For example, in fig. 2, the first movement locus 4, the second movement locus 3, and the third movement locus 2 are concentric circles centering on the axial center position of the target through hole 1; the first laser focus spot 6 of the drilling laser rotates and drills along the first movement track 4, after rotating and cutting for one circle, the laser focus is switched to the second movement track 3, the second laser focus spot 7 of the drilling laser rotates and drills along the second movement track 3, and at the moment, the laser pulse energy of the drilling laser can be the same or different; if the laser pulse energy of the drilling laser is different, r1 is not equal to r2; if the laser pulse energy of the drilling laser is the same, r1=r2; the radius difference relationship between the first movement locus 3 and the second movement locus 4 is as follows: R2-R1 is less than or equal to r1+r2, so that the inner ring and the outer ring of the drilling laser rotary cutting are ensured to keep certain contact, as shown in fig. 4 and 11, a second circular groove formed by processing a second laser focus spot 7 on a plate 10 along a second movement track 3; 12 is a first ring groove formed by processing the first laser focus spot 6 on the plate 10 along the first movement track 4; the second annular groove 11 and the first annular groove 12 may partially overlap.
The rotary cutting movement of the guide hole 5 in turn is that after the first laser focus spot 6 rotates on the first movement track 4 for one or more circles, the laser focus is switched to the second movement track 3 to rotate on the second laser focus spot 7 for one or more circles, and then the laser focus returns to the first movement track 4 to finish one rotary cutting movement in turn; and then the laser focus continuously rotates and cuts for a set circle on the first movement track 4 by the first laser focus spot 6, and enters the next rotation and cuts. Typically, after the first movement track 4 rotates about 1 turn with the first laser focus spot 6, the laser focus is switched to the second laser focus spot 7 to rotate about the second movement track 3, and then returns to the first movement track 4 to rotate about the next turn. In practice, the rotary cutting can be performed on the second motion track 3 firstly, then the rotary cutting is performed on the first motion track 4, and the rotary cutting is sequentially performed in a rotating way. In practice, the parameters of the rotary cutting on the second motion track 3 and the first motion track 4, including the rotary cutting speed, the number of rotary cutting turns, the laser pulse energy, the laser pulse repetition frequency and the like, can be set independently, and are combined together to form a round of rotary cutting of the guide holes 5 in turn, and then the cyclic rotary cutting of the guide holes 5 is performed for a plurality of times according to the cycle until the guide holes 5 are drilled or the guide blind holes are obtained.
The circular wheel cutting means that one wheel of the present guide Kong Nalun flow cutting is completed at one guide hole, the drilling laser is switched to other guide holes to perform corresponding guide Kong Nalun flow cutting, and one circular wheel cutting is completed until the corresponding wheel cutting is completed in a plurality of guide hole holes; after one or more of the circulation rounds, a corresponding series of pilot hole drillings is completed.
Thirdly, the center of a focus spot of the drilling laser takes the axis of the guide hole 5 as the center, circular track rotary-cut reaming motion with the radius of R is carried out around the guide hole 5, and reaming rotary-cut drilling is carried out on the target through hole 1. In the reaming and rotary-cutting drilling process of the target through hole, after each reaming and rotary-cutting step is performed for N circles, no light time (cooling time in the hole) in the hole is set, more than 100 microseconds is generally recommended, and the next round of rotary-cutting and reaming movement of the target through hole 1 is performed until the plate 10 is penetrated by the reamer, and N is more than or equal to 1. In the process of rotary-cut reaming movement of the target through hole 1, plasma sparks generated by rotary-cut reaming and drilling can be sprayed to the hole opening on the surface of the plate, on the one hand, plasma explosion waves generated by laser focus reaming and rotary-cut can break a thin-wall area 8 with the thickness delta between the guide hole and the target through hole, so that the plasma sparks generated by rotary-cut reaming and drilling can be sprayed into the guide hole 5, and the delta is generally less than or equal to 10 microns.
The radius difference between the radius R of the third movement track 2 and the radius Rd of the guide hole 5 is smaller than the sum of the radius R of the third laser focus spot 9 and the thickness delta of the thin-walled region 8, expressed by the formula: R-Rd=R- (R2+r2). Ltoreq.r+delta.can also be represented by the radius difference between the third movement track 2 and the second movement track 3: R-R2 is less than or equal to r+r2+ (delta); in this way, when reaming is ensured, the outer side of the third laser focus spot 9 is positioned in the guide hole 5, or the third laser focus spot 9 can burst or burst away the thin-wall region 8 with delta thickness facing the guide hole 5, so that the high-temperature plasma and chips for rotary cutting reaming are convenient to discharge, and the shrinkage degree and the crack quantity of the inner wall of the target through hole after finishing are greatly reduced.
In the rotary cutting reaming process of the drilling laser for rotary cutting the drilling guide hole 5 and the target through hole 1, the laser parameters of different rotary cutting paths can be the same, and the effective laser spot radiuses of the same laser parameters are the same.
In this embodiment, the thickness of the plate 10 is 330 micrometers, the aperture D of the target through hole 1 is 150 micrometers, r=67.5 micrometers, the turning radius R2 is 50 micrometers, the turning radius R1 is 30 micrometers, r1=r2=10 micrometers, r=7.5 micrometers, and Δ=0. The diameter Rd of the guide through hole 5 is 60 μm.
For further understanding of the method of the present invention, pilot Kong Xuanqie is drilled further.
When concentric circular tracks with the radius R2 and the radius R1 are rotated in turn, the sequence of the focal spot center of the drilling laser can be reversed, and when each round of cutting is performed, the processing parameters such as the laser rotary cutting times and/or the rotary cutting speed corresponding to the paths R1 and R2 can be determined according to the needs.
As shown in fig. 3, the drilling laser can firstly rotate along the first motion track 4 and then jump to the second motion track 3 for rotation; or firstly, rotary cutting is carried out on the second motion track 3, and then the rotary cutting is switched to rotary cutting of the first motion track 4. The number of times of rotary cutting of the drilling laser on the first motion track 4 and the second motion track 3, the rotary cutting speed, drilling laser parameters and the like can be independently set. The number of times of rotary cutting and the rotary cutting speed can be set to be the same parameters for general convenience; the number of times the drilling laser rotates on the second motion track 3 and the first motion track 4 is preferably that one circle or two circles of the drilling laser rotate continuously on one path to jump to the other path.
As shown in fig. 4, 11 is a second ring groove formed by processing the second laser focus spot 7 on the plate 10 along the second movement track 3; 12 is a first ring groove formed by processing the first laser focus spot 6 on the plate 10 along the first movement track 4; the second circular groove 11 and the first circular groove 12 form a relatively wide circular groove together, so that the bottom materials of the second circular groove 11 and the first circular groove 12 are conveniently sprayed out under the action of the first laser focus light spot 6 and the second laser focus light spot 7, the explosion impact of the first laser focus light spot 6 and the second laser focus light spot 7 at the bottom of the current groove and the two sides of the bottom of the heating groove are reduced, and cracks and shrinkage of an adhesive layer at the inner side of the wall of the guide hole 5 are reduced, or other soft materials with lower temperature are shrunk inwards. Reference numeral 13 denotes a guide Kong Lizhu formed in the guide hole 5 without laser processing in the middle. Under the action of the first laser focus spot 6 and the second laser focus spot 7, the second circular ring groove 11 and the first circular ring groove 12 are drilled through by rotary cutting, the guide hole upright post 13 can lose support to leave the original position in the guide hole 5, as shown in fig. 5, the guide hole upright post 13 disappears to form a cavity, and finally a guide hole position 22 in fig. 6 is formed, corresponding to the guide hole 5 in fig. 2.
For some special circuit boards with high-temperature adhesives, the second movement track 3 and the first movement track 4 can be overlapped, the first laser focus light spot 6 and the second laser focus light spot 7 are overlapped, the cross section of the carved narrow circular groove is shown as figure 7, and in the situation, when the circular groove is carved by drilling laser in a rotary cutting mode, the temperature in the circular groove is relatively high, so that the circuit board is only suitable for laser drilling of some circuit boards with high-temperature adhesives.
In fig. 7, the single laser focus spot 14 is adopted to spin on a spin-cut radius path, which has a relatively large disadvantage that when the single laser focus spot 14 acts on the material of the groove bottom of the plate 10, plasma explosion shock waves are generated, similar to a deep-water bomb, the explosion shock is performed on the groove bottom and the two sides of the groove, heat is accumulated relatively easily to cause shrinkage, or impact cracks are caused on the side wall of the guide hole, if the cracks are too deep, the side wall of the target through hole is cracked, so that electroplating liquid medicine remains in the cracks in the hole after the electroplating of the target through hole, and the reliability problem exists on the circuit board. Therefore, on one hand, the single-path rotary cutting is only suitable for plates with high-temperature-resistant adhesive partially adopted, and the cooling time of the guide holes 5 Kong Naxuan cutting holes is preferably set; of course, in the cooling time of the guide hole, under the switching of the scanning galvanometer, the drilling laser can process other guide holes, and after a certain processing amount or processing time is completed, the drilling laser returns to the guide hole for the next round of rotary cutting drilling processing; this iterative process is continued until the pilot hole is drilled.
On the other hand, the drilling of the guide hole suggests that most circuit boards adopt a combined path rotary cutting grooving method shown in fig. 4, so that the impact effect of deep-water bombs with drilling laser focuses at the bottom of a deep groove on the side wall of the guide hole is reduced, and the number and depth of cracks on the side wall of the guide hole are reduced. The crack depth direction is perpendicular to the laser transmission direction.
Further, the described disadvantage of the embodiment of fig. 7 shows that for sheet materials containing materials with low softening temperatures, a drilling method of first drilling the pilot holes 5 and then rotary-cut reaming must be used. By adopting the drilling method, plasma impact and high-temperature accumulation generated in the plate when the drilling laser focus is used for drilling thicker plates are avoided, so that an inner wall adhesive layer or an inner shrinkage and microcrack of a non-temperature-resistant material layer are generated in the inner wall of the target through hole.
Preferably, Δ= 0, r—r2+.r+r2.
As shown in fig. 3; therefore, when the target through hole 1 is reamed and drilled, the outer side of the third laser focus spot 9 is positioned in the guide hole 5, the discharge of high-temperature plasma and chips for rotary cutting and reaming is absolutely facilitated, the impact and heating of the third laser focus spot 9 on the side wall of the outer target through hole 1 are greatly reduced, and the shrinkage degree and the crack quantity of the inner wall of the target through hole are greatly reduced.
Preferably, the inner wall of the guide hole is provided with a shrinkage size of X micrometers, the radius of the guide hole is Rd, rd=R2+r2, and Rd+X-D/2 is less than or equal to 12 micrometers.
The invention aims to reduce shrinkage as much as possible when a through hole is drilled in a multilayer board. In the 5G era, the adopted low-dielectric-coefficient materials are not resistant to temperature, the softening temperature is generally about 200-300 ℃, and particularly, certain viscose materials and LCP materials (liquid crystal polymers) are adopted. Therefore, the shrinkage or the non-heat-resistant material layer of the guide hole cannot exceed the 12 micrometers of the inner wall of the target through hole formed by final reaming, otherwise, the final target through hole is shrunk by more than 12 micrometers, and the quality is judged as defective products. The more stringent criteria is that the shrinkage after copper plating of the vias be less than 12 microns, which is more demanding than the present invention. Since new shrinkage is introduced during some of the column treatments prior to copper plating.
Preferably, during the drilling of said guide Kong Xuanqie, a period of no light is provided for the hole between every adjacent two cycles of rotary cutting movement.
The time phase of the no light time is set, and is used for cooling in the holes, and the cooling time in the holes is set arbitrarily according to the requirement.
See fig. 7. If r2=r1 in fig. 2, the first laser focus spot 6 and the second laser focus spot 7 are combined into one, that is, the same laser focus spot, corresponding to the single laser focus spot 14 in fig. 7. In the rotary cutting and drilling process of the guide hole 5, after 1 or more circles of rotary cutting, the single laser focus spot 14 can stop the light emitting of the hole drilling laser for a period of time (cooling time in the hole), and the drilling laser performs the next round of rotary cutting and drilling movement at the position of the guide hole 5 until the machining of the guide hole is completed.
For another example, the drilling laser rotates one circle according to the first motion track 4 and the second motion track 3, the drilling is cooled for a period of time, for example, 200 microseconds, or 1 millisecond, and the drilling laser rotates one circle according to the first motion track 4 and the second motion track 3; and so on.
For another example, the drilling laser rotates and cuts N1 circle and N2 circle respectively according to the first motion track 4 and the second motion track 3, the drilling laser cools for a period of time, for example 200 microseconds, or 1 millisecond, etc., and then the drilling laser rotates and cuts N1 circle and N2 circle respectively according to the first motion track 4 and the second motion track 3; and so on. The number of turns of N1 and N2 is not less than 1, and is not necessarily the whole number of turns.
Preferably, during the drilling of the guide Kong Xuanqie, and during the no-light period in the hole of the guide hole, the drilling laser is switched into another guide hole or another object to be processed for laser processing.
The laser processing may be rotary cutting and drilling of the corresponding guide hole or other types of laser processing of the corresponding guide hole, such as laser cleaning, etc.
The laser processing of other objects to be processed herein includes, but is not limited to: cutting and drilling of a groove-shaped hole, cutting and drilling of a circuit board non-functional hole (without processing requirements on the inner wall of the hole, only drilling through the hole), cutting of a special-shaped curve, drilling of a positioning hole (without processing requirements on the inner wall of the hole, only drilling through the hole), and the like.
In the time period of no light time in the hole, the drilling laser can be switched to the drilling position of the guide hole corresponding to other target through holes by the scanning vibrating mirror in a jumping way to conduct corresponding guide Kong Xuanqie drilling movement or conduct other types of laser processing, and after a certain circle or time of guiding Kong Xuanqie of other through holes or after the other types of laser processing are completed, the drilling laser is switched to the drilling position of the guide hole by the scanning vibrating mirror in a jumping way to continue the next round of circulating rotary cutting drilling movement in turn.
See fig. 7. If r2=r1 in fig. 2, the first laser focus spot 6 and the second laser focus spot 7 are combined into one, that is, the same laser focus spot, corresponding to the single laser focus spot 14 in fig. 7. In the rotary cutting and drilling process of the guide hole 5, after 1 or more circles of rotary cutting, the single laser focus spot 14 can stop the light emission of the hole drilling laser for a period of time (cooling time in the hole), and in the period of time, the drilling laser can be switched to other guide holes by the scanning galvanometer to perform rotary cutting and drilling for a certain circle (or time), and then switched back to the guide hole 5 by the scanning galvanometer to perform the next round of rotary cutting and drilling movement. The number of the other guide holes may be one or a plurality of.
For another example, the drilling laser is respectively rotated by N1 circles and N2 circles according to the first motion track 4 and the second motion track 3, the drilling laser is switched to other guide through holes by the scanning galvanometer to perform the drilling processing of the guide through holes, and after a certain circle or time is processed, the drilling laser is switched back to the guide through holes by the scanning galvanometer, and then is respectively rotated by N1 circles and N2 circles according to the first motion track 4 and the second motion track 3. The drilling laser is then switched to another location for processing, the next cycle, and so on until all pilot holes are processed. The number of turns of N1 and N2 is not less than 1, and is not necessarily the whole number of turns.
Preferably, during the drilling of the guide Kong Xuanqie, the hole is set to have no light time period, i.e. the guide Kong Xuanqie is set to have a cooling time period in the hole, on the premise that the guide Kong Xuanqie only needs one circular path rotary-cut drilling, r1=r2.
The Kong Xuanqie drill hole is guided, and the cooling time stage in the hole is set, so that on the premise that the heat of the drill hole of the guide hole of the drill hole is controllable, the drill hole laser only needs to spin-cut the through hole according to a circular path, at this moment, r1=r2, the drill hole laser rotates each round of drill hole of the guide hole, and each round can select one round or multiple rounds of spin-cutting. In the processing of sheet materials of some temperature resistant materials, this can reduce laser processing time.
Preferably, the specific process of the rotary-cut reaming and drilling of the target through hole is that,
the center of a laser focus spot of the drilling laser takes the axis position of the guide hole as the center, and a plurality of intermittent rotary cutting and reaming motions with the radius of R are carried out on the plate around the guide hole until the plate is penetrated by a reamer, so that the target through hole is obtained;
wherein d=2 (r+r), R-r2 is equal to or less than r+r2+delta, delta is equal to or less than 0 and equal to or less than 10 micrometers, R is an effective spot radius when the drilling laser performs the rotary-cut reaming drilling movement of the target through hole, and delta is the thickness of a thin-wall area between the target through hole and the guide hole.
The multi-wheel intermittent rotary cutting and reaming motion means that after each wheel of rotary cutting and reaming of the drilling laser in the guide hole is carried out for N circles, a no-light time period is arranged in the hole, and then the next wheel of rotary cutting and reaming motion is carried out, wherein N is more than or equal to 1.
Preferably, during the process of the rotary-cut reaming and drilling of the target through hole, and during the period of no light in the hole, the drilling laser is switched to the side of other guide holes and corresponding rotary-cut reaming and drilling of the target through hole is performed around the other guide holes.
When the drilling laser performs rotary-cut reaming and drilling on the target through hole 1, after each round of rotary-cut N (N is more than or equal to 1) turns, a time stage without light time (in-hole cooling time) is arranged in the hole, the drilling laser can be switched to other target through holes to be reamed by the scanning vibrating mirror to perform reaming and rotary-cut movement on the target through hole, and after a certain number of rounds or time of reaming and rotary-cut, the drilling laser is switched to the target through hole by the scanning vibrating mirror in a jumping mode to continue the next round of reaming and drilling movement.
Specifically, in the rotary-cut reaming and drilling process of the target through hole 1, after a certain number of turns or time of the rotary-cut drilling laser light-emitting, the drilling laser light-emitting is stopped; or after the drilling laser rotates a certain number of turns or time at the position of the target through hole, the drilling laser is switched to other target through holes by the scanning galvanometer to perform rotary cutting reaming of the corresponding target through holes. For the target through hole, every time no light exists in the target through hole, the target through hole is subjected to the reaming of the wheel, and the cooling time stage in the target through hole is entered. One round of reaming of the target through-hole 1 may be one or more rounds of rotary reaming. The target through hole 1 can be completely reamed only by multiple rounds of drilling laser rotary-cut reaming.
The setting of the cooling time period in the target through hole greatly reduces the accumulation of the target through hole Kong Nare during rotary cutting and reaming, so that the temperature in the hole is always lower than the softening temperature of the material in the inner wall of the target hole, or only a few materials overheat, and the shrinkage of the material in the target through hole or the shrinkage of the material which is not resistant to temperature is greatly reduced.
In fig. 8, 21 is a third annular groove that is rotationally cut by the third laser focus spot 9 along the third movement track 2, and the outer side of the third annular groove 21 is the inner wall of the target through hole 1; a thin-wall region 8 with the thickness delta is arranged between the inner side of the third circular groove 21 and the guide hole 5; when the third laser focus spot 9 is subjected to rotary cutting reaming, generated high-temperature plasmas and cuttings explosion impact can impact and push away the thin-wall area 8 with the adjacent inner side thickness of delta on the plate 10, and a communication space between the third circular groove 21 and the hole site 22 of the guide hole is opened, so that the high-temperature plasmas and cuttings generated by laser processing of the bottom of the third circular groove 21 are discharged to the hole opening and also discharged to the guide hole 5, and the heating of the high temperature generated by reaming to the inner wall of the through hole of the target through hole 1 is greatly reduced, and the shrinkage degree of the inner wall of the target through hole can be reduced.
The difference between fig. 9 and fig. 8 is that the thin-walled region 8 with the thickness delta cut between the guide hole 5 and the target through hole 1 does not exist, namely delta=0, so that the target through hole 1 in fig. 2 is communicated with the guide hole 5, and high-temperature plasmas and chips generated by the third laser focus spot 9 during rotary cutting and reaming are discharged into the guide hole 5 besides being discharged into an orifice, so that the heating of the side wall of the through hole 1 by the high temperature generated by reaming and the impact of the explosion shock wave on the inner wall of the target through hole 1 are greatly reduced, the intact inner wall of the target through hole can be kept, and the shrinkage and crack depth of the inner wall of the target through hole are reduced.
Preferably, when the guide hole is a guide through hole, a negative pressure space channel for discharging the scraps of the rotary-cut reaming and drilling of the target through hole is arranged below the guide through hole in the rotary-cut reaming and drilling process of the target through hole.
The negative pressure space channel is used for discharging scraps of through hole reaming, rotary cutting and drilling.
Generally, a jig plate is placed below the plate, holes with the same distribution are machined in advance on the jig plate, the hole diameter is larger, a machine table honeycomb plate platform is arranged below the jig plate, and the machine table honeycomb plate is connected with an exhaust system, so that the guide holes 5 are machined, air flows pass through the guide holes 5, and flow from the upper side of the plate to the direction of the corresponding hole in place on the jig plate, so that when the through hole is subjected to rotary-cut reaming and drilling, formed cuttings can be discharged downwards, and simultaneously the cuttings are discharged to take away reaming and drilling heat, thereby being beneficial to reducing the temperature in the hole and reducing the shrinkage of the hole wall of the through hole after the rotary-cut reaming of the target through hole.
As shown in fig. 10, 34 is a jig plate, the jig plate 34 is provided with a negative pressure through hole 33, the negative pressure through hole 33 is communicated with the guide hole 5 drilled on the circuit board 10, the jig plate 34 is arranged on a honeycomb plate (not labeled in the figure) of a drilling platform, the honeycomb plate is connected with a negative pressure equipment system, and negative pressure is formed in the honeycomb plate to adsorb and fix the jig plate 34 and the plate 10, so that the negative pressure is arranged in the negative pressure through hole 33, and the discharge of processing scraps in the guide hole is facilitated.
Preferably, the board is a circuit board at least comprising two copper layers and one adhesive layer; in the process of rotary-cut reaming and drilling the target through hole, when the rotary-cut reaming motion depth exceeds the last adhesive layer in the drilling depth direction, different rotary-cut speeds and/or laser powers are adopted to drill through subsequent material layers on the plate.
The subsequent material layer is a relatively temperature resistant insulating layer and/or a metal layer.
The invention aims to reduce the shrinkage of a drilled hole of a glue-containing multilayer board, in particular to the shrinkage problem after copper plating, and once a glue layer is formed in laser drilling, the insulation material and the conductive material of the subsequent circuit board belong to relatively temperature-resistant materials, and the drilling efficiency of the whole through hole can be relatively improved by adopting relatively high laser power, relatively high rotary cutting speed and relatively high continuous rotary cutting times.
Preferably, in the process of the rotary-cut drilling of the guide hole or/and the rotary-cut reaming drilling of the target through hole, the laser focus of the drilling laser is positioned on the surface or/and the inside of the plate.
Preferably, in the process of the rotary-cut drilling of the guide hole or/and the rotary-cut reaming drilling of the target through hole, a plurality of laser focus positions are arranged along the depth direction of the drilling hole, and the laser focus positions are lowered along with the deepening of the drilling hole; during the drilling process of the guide Kong Xuanqie, each laser focus position corresponds to one or more times of rotary cutting motions among different paths in the hole; or/and, in the rotary reaming and drilling process of the target through hole, each laser focus position corresponds to one or more times of rotary reaming and rotary cutting motions among holes in turn.
The common glue-containing circuit board is a multilayer board, and the thickness is thicker than the focal depth length of drilling laser, so that a plurality of laser focus positions are required to be arranged in the drilling process. For example, if the sheet 10 is 200 microns thick, we can directly place the laser focus 100 microns below the sheet surface; this can be done if the sheet has a thickness of 400 microns: firstly, drilling a guide hole, wherein a laser focus is positioned on the surface of a plate; secondly, when the rotary cutting depth of the guide hole exceeds 100 microns, the laser focus is lowered by 100 microns; thirdly, when the rotary cutting depth of the guide hole exceeds 200 microns, the laser focus is lowered by 100 microns; and fourthly, when the rotary cutting depth of the guide hole exceeds 300 microns, the laser focus is lowered by 100 microns until the guide hole is drilled. At this time, the laser focus returns to the surface of the circuit board material again, and the target through hole rotary-cut reaming and drilling is carried out, and the target through hole rotary-cut reaming and drilling can be divided into the following steps: firstly, rotary-cut reaming and drilling, wherein a laser focus can be positioned at a position 100 micrometers below the surface of a plate; and secondly, when the rotary cutting depth of the reaming rotary-cut drilling hole exceeds 200 microns, the laser focus is lowered to the position of 200 microns, and the laser focus continues rotary-cut reaming drilling until the required through hole is drilled. The laser focal depth is generally about 100 microns to 200 microns, so that whether a plurality of laser focal positions are required to be set in actual plate drilling or not can be set in software in advance according to actual drilling requirements.
Preferably, in the process of guiding Kong Xuanqie, the drilling laser rotates the guiding hole in a spiral line motion, or rotates the guiding hole in a rotary cutting motion in turn in more than two concentric circular tracks.
The guide hole drilling can be used for spirally rotating and cutting the guide hole 5, or more than two concentric circular tracks can be used for rotating and cutting the guide hole.
In fig. 2, a rotary cutting track of the laser focusing light spot center of the first movement track 4 and the second movement track 3 is adopted, a guide hole is drilled by carrying out wide circular groove width, and if a plate is relatively thin, for example, 200 microns or less than 300 microns, the first movement track 4 and the second movement track 3 can be overlapped, and a guide hole with acceptable shrinkage degree of the inner wall of the hole can also be processed.
When the guide hole is machined, the spiral line can be used for machining a wide circular groove, for example, the spiral line with the inner radius r1 and the outer radius r2 is repeated for a plurality of times until the guide hole is machined.
When more than two concentric circular tracks are adopted to spin-cut the guide holes, the spin-cutting process of any two adjacent concentric circular tracks is the same as the process of spin-cutting the guide holes by adopting the two concentric circular tracks.
Preferably, in the process of the rotary-cut drilling of the guide hole or/and the rotary-cut reaming drilling of the target through hole, laser parameters of the drilling lasers on different rotary-cut paths are the same or different.
In a further embodiment, as shown in fig. 11, the present invention provides a system for laser drilling a through hole, the system comprising the following modules,
the guiding Kong Xuanqie drilling module is used for determining the axis position of a target through hole on a plate to be drilled, and guiding Kong Xuanqie drilling is carried out on the plate by using drilling laser with the axis position of the target through hole as the center to obtain a guiding hole with radius Rd;
the target through hole rotary-cut reaming and drilling module is used for carrying out target through hole rotary-cut reaming and drilling on the plate around the guide hole by using the drilling laser with the axis position of the guide hole as the center to obtain a target through hole with the diameter of D;
the plate is a glue-containing plate or a single or composite multi-layer material plate with the softening temperature lower than 300 ℃, and the guide holes are guide through holes or guide blind holes.
In a further embodiment, the invention provides a circuit board laser via drilling device comprising a processor, a memory and a computer program stored in the memory and executable on the processor, the computer program implementing the method steps described above when running.
In another embodiment, the invention provides a device for laser drilling a through hole on a circuit board, which comprises a machine table, a laser and the device for laser drilling the through hole, wherein the device for laser drilling the through hole is electrically connected with the laser;
the machine is used for placing processing materials;
the laser is used for generating a processing light beam;
the device for laser drilling the through holes is used for controlling the laser to operate according to the method steps so as to finish laser processing of the plate.
In particular, the apparatus may further include necessary photographing means and displacement means for alignment, optical path means, and the like.
The method, the system, the device and the equipment for drilling the through hole by the laser have the following advantages:
1. when the plate through hole with the adhesive layer is drilled, a guide hole is drilled at the position of the target through hole in advance, so that a plasma and chip discharge space is provided for reaming and rotary-cut drilling of the target through hole, heat accumulation in the hole during rotary-cut drilling of the target through hole is greatly reduced, and the shrinkage of the inner wall of the target through hole and the depth of cracks on the inner wall are greatly reduced;
2. the guide hole drilling adopts different rotary cutting radius paths and certain overlapping rate is met among the different paths, so that a relatively wide rotary cutting drilling circular groove can be obtained, the injection removal of the lower layer material before the guide hole drilling is convenient, the deep sea bomb effect of a laser focus in the material during the guide hole drilling is avoided, and the heat accumulation and the side wall shrinkage and crack depth of the guide hole during the guide hole drilling are reduced;
3. The method is characterized in that a plurality of rounds of rotary-cut drilling holes are adopted in rotary-cut reaming of the target through hole, a time period of no light time (cooling time in the hole) in the hole is set between adjacent rounds of rotary-cut reaming of the same target through hole, heat brought by rotary-cut reaming holes of each round of rotary-cut reaming holes is cooled, heat accumulation of laser drilling holes brought by rotary-cut reaming of the target through hole is further reduced, and shrinkage of hole walls of the target through hole after reaming is further reduced;
4. the negative pressure space channels are arranged below the guide holes and are used for discharging the scraps of the reaming, rotary-cut and drilling of the target through holes, the scraps are in an extremely high-temperature state when generated, and the negative pressure chip removing channels further reduce heat accumulation of the hole walls of the through holes when the target through holes are reamed, so that the shrinkage of the hole walls of the target through holes after the reaming is further reduced.
The reader will appreciate that in the description of this specification, a description of terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (16)
1. A method of laser drilling a through hole, characterized by: comprises the steps of,
determining the axis position of a target through hole on a plate to be drilled, and performing rotary cutting drilling on the guide through hole on the plate by using drilling laser with the axis position of the target through hole as the center to obtain a guide through hole with radius Rd;
performing rotary-cut reaming and drilling on the plate around the guide through hole by using the drilling laser with the axis position of the guide through hole as the center to obtain a target through hole with the diameter D;
wherein the plate is a glue-containing plate or a single or composite multi-layer material plate with the softening temperature lower than 300 ℃;
In the process of the rotary-cut reaming and drilling of the target through hole, a negative pressure space channel for discharging scraps of the rotary-cut reaming and drilling of the target through hole is arranged below the guide through hole;
the method for setting the negative pressure space channel comprises the following steps: a jig plate is placed below the plate, a negative pressure through hole is machined in advance on the jig plate, the negative pressure through hole is communicated with the guide through hole, the jig plate is placed on a drilling platform honeycomb plate, the drilling platform honeycomb plate is connected with a negative pressure equipment system, negative pressure is formed in the drilling platform honeycomb plate to enable the jig plate and the plate to be adsorbed and fixed, so that negative pressure is formed in the negative pressure through hole, air flow passes through the guide through hole, and the air flow flows from the upper side of the plate to the direction of a corresponding hole in place on the jig plate.
2. The method of laser drilling a through hole according to claim 1, wherein: in the process of rotary cutting and drilling the guide through hole, the drilling laser performs rotary cutting movement in two concentric circle tracks, and the guide through hole is rotary cut.
3. A method of laser drilling a through hole according to claim 2, wherein: the drilling laser carries out rotary cutting movement in two concentric circular tracks, the specific process of rotary cutting the guide through hole is that,
Determining the axis position of the target through hole on the plate, and performing rotary cutting movement of concentric circle tracks with the radius of R1 and R2 on the plate by taking the axis position of the target through hole as the center at the laser focus spot center of the drilling laser to obtain the guide through hole;
wherein R1 is less than or equal to R2, rd=R2+r2, R2-R1 is less than or equal to r1+r2, R1 is the effective light spot radius when the drilling laser drills the circular track of the guide through hole rotary cutting radius R1, and R2 is the effective light spot radius when the drilling laser drills the circular track of the guide through hole rotary cutting radius R2;
the rotary cutting mode of the drilling laser on the plate material for concentric circular tracks with the radiuses of R1 and R2 is rotary cutting in turn, and the sequence and the times of rotary cutting in turn are set at will.
4. A method of laser drilling a through hole according to claim 3, wherein: and if the shrinkage size of the inner wall of the guide through hole is X micrometers, rd+X-D/2 is less than or equal to 12 micrometers.
5. A method of laser drilling a through hole according to claim 3, wherein: in the process of rotary cutting and drilling the guide through hole, a no-light time period is arranged in the hole between every two adjacent rotary cutting motions in turn.
6. A method of laser drilling a through hole according to any one of claims 5, wherein: and in the process of rotary cutting and drilling the guide through holes, and in the period of no light in the holes of the guide through holes, the drilling laser is switched into other guide through holes or other objects to be processed for laser processing.
7. A method of laser drilling a through hole according to any one of claims 3 to 6, characterized in that: the specific process of the rotary-cut reaming and drilling of the target through hole is that,
the center of a laser focus spot of the drilling laser takes the axis position of the guide through hole as the center, and a plurality of intermittent rotary cutting and reaming motions with radius of R are carried out on the plate around the guide through hole until the plate is penetrated by a reamer, so that the target through hole is obtained;
wherein d=2 (r+r), R-r2 is equal to or less than r+r2+Δ,0 is equal to or less than or equal to 10 μm, R is an effective spot radius when the drilling laser performs the rotary-cut reaming drilling movement of the target through hole, and Δ is a thickness of a thin-wall region between the target through hole and the guide through hole;
the multi-wheel intermittent rotary cutting and reaming motion refers to that in the process of drilling the target through hole by the drilling laser, after each wheel of rotary cutting for N circles in the hole, a no-light time period is set in the hole, and then the next wheel of rotary cutting and reaming motion is carried out, wherein N is more than or equal to 1.
8. The method of laser drilling a through hole according to claim 7, wherein: and in the process of the rotary-cut reaming and drilling of the target through hole, and in the period of no light in the hole, the drilling laser is switched to the side of other guide through holes and corresponding rotary-cut reaming and drilling of the target through hole is carried out around the other guide through holes.
9. The method of laser drilling a through hole according to claim 7, wherein: the board is a circuit board which at least comprises two copper layers and one adhesive layer; in the process of rotary-cut reaming and drilling the target through hole, when the rotary-cut reaming motion depth exceeds the last adhesive layer in the drilling depth direction, different rotary-cut speeds and/or laser powers are adopted to drill through subsequent material layers on the plate.
10. The method of laser drilling a through hole according to claim 7, wherein: and in the process of the rotary cutting and drilling of the guide through hole or/and the rotary cutting and reaming and drilling of the target through hole, the laser focus of the drilling laser is positioned on the surface or/and the inside of the plate.
11. The method of laser drilling a through hole according to claim 10, wherein: in the process of the rotary cutting and drilling of the guide through hole or/and the rotary cutting and reaming and drilling of the target through hole, a plurality of laser focus positions are arranged along the depth direction of the drilling hole, and the laser focus positions are lowered along with the deepening of the drilling hole;
In the rotary cutting and drilling process of the guide through hole, each laser focus position corresponds to one or more rotary cutting motions among different paths in the hole;
or/and the combination of the two,
and in the rotary reaming and drilling process of the target through hole, each laser focus position corresponds to one or more times of rotary reaming and rotary cutting motions among holes in turn.
12. The method of laser drilling a through hole according to claim 1, wherein: in the process of rotary cutting and drilling the guide through hole, the drilling laser rotates and cuts the guide through hole in a spiral line motion or rotates and cuts the guide through hole in turn in more than two concentric circle tracks.
13. A method of laser drilling a through hole according to any one of claims 1 to 6, characterized in that: and in the process of the rotary cutting and drilling of the guide through hole or/and the rotary cutting and reaming and drilling of the target through hole, the laser parameters of the drilling lasers on different rotary cutting paths are the same or different.
14. A system for laser drilling a through hole, comprising: comprising the following modules, wherein the modules are arranged in a row,
the guide through hole rotary-cut drilling module is used for determining the axis position of a target through hole on a plate to be drilled, and carrying out rotary-cut drilling on the guide through hole on the plate by using drilling laser with the axis position of the target through hole as the center to obtain a guide through hole with radius Rd;
The target through hole rotary-cut reaming and drilling module is used for carrying out target through hole rotary-cut reaming and drilling on the plate around the guide through hole by using the drilling laser with the axis position of the guide through hole as the center, so as to obtain a target through hole with the diameter D;
wherein the plate is a glue-containing plate or a single or composite multi-layer material plate with the softening temperature lower than 300 ℃;
in the process of the rotary-cut reaming and drilling of the target through hole, a negative pressure space channel for discharging scraps of the rotary-cut reaming and drilling of the target through hole is arranged below the guide through hole;
the method for setting the negative pressure space channel comprises the following steps: a jig plate is placed below the plate, a negative pressure through hole is machined in advance on the jig plate, the negative pressure through hole is communicated with the guide through hole, the jig plate is placed on a drilling platform honeycomb plate, the drilling platform honeycomb plate is connected with a negative pressure equipment system, negative pressure is formed in the drilling platform honeycomb plate to enable the jig plate and the plate to be adsorbed and fixed, so that negative pressure is formed in the negative pressure through hole, air flow passes through the guide through hole, and the air flow flows from the upper side of the plate to the direction of a corresponding hole in place on the jig plate.
15. A device for laser drilling of a through hole, characterized in that: comprising a processor, a memory and a computer program stored in the memory and executable on the processor, which computer program when run carries out the method steps of any one of claims 1 to 13.
16. An apparatus for laser drilling a through hole, characterized in that: a device for drilling a through hole by laser according to claim 15, comprising a machine table, a laser, and the device for drilling a through hole by laser is electrically connected with the laser;
the machine is used for placing processing materials;
the laser is used for generating a processing light beam;
the device for laser drilling through holes is used for controlling the laser to operate according to the method steps of any one of claims 1 to 13 so as to finish the laser processing of the plate.
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| CN201910915620.0A CN110695549B (en) | 2019-09-26 | 2019-09-26 | Method, system, device and equipment for laser drilling through hole |
| CN202311171435.8A CN117483962A (en) | 2019-09-26 | 2019-09-26 | Method, system, device and equipment for laser drilling through hole |
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| CN111185665A (en) * | 2020-01-21 | 2020-05-22 | 武汉铱科赛科技有限公司 | Circuit structure etching method, device, system and equipment |
| CN111375903A (en) * | 2020-04-13 | 2020-07-07 | 中国航空制造技术研究院 | Method for processing small hole by laser |
| CN111968510A (en) * | 2020-08-26 | 2020-11-20 | 合肥维信诺科技有限公司 | Preparation method of display panel |
| CN112074096A (en) * | 2020-10-13 | 2020-12-11 | 安捷利（番禺）电子实业有限公司 | Drilling method for 5G high-frequency LCP material |
| CN113172354A (en) * | 2021-05-13 | 2021-07-27 | 深圳力星激光智能装备有限公司 | Laser processing method for hole-shaped structure of brittle sheet |
| CN114535834B (en) * | 2022-03-15 | 2024-03-19 | 武汉锐科光纤激光技术股份有限公司 | Control method and device of drilling equipment, storage medium and electronic device |
| CN114523196B (en) * | 2022-04-22 | 2022-07-15 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
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| JP4694349B2 (en) * | 2005-11-07 | 2011-06-08 | 日立ビアメカニクス株式会社 | Printed wiring board using laser processing and manufacturing method thereof |
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| JP5994954B1 (en) * | 2015-09-25 | 2016-09-21 | 旭硝子株式会社 | Manufacturing method of glass substrate having through hole, manufacturing method of glass substrate having through electrode, and manufacturing method of interposer |
| WO2019038860A1 (en) * | 2017-08-23 | 2019-02-28 | 三菱電機株式会社 | Laser machining method and laser machining device |
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