CN117479430A - Device for improving warping of circuit board - Google Patents
Device for improving warping of circuit board Download PDFInfo
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- CN117479430A CN117479430A CN202311316577.9A CN202311316577A CN117479430A CN 117479430 A CN117479430 A CN 117479430A CN 202311316577 A CN202311316577 A CN 202311316577A CN 117479430 A CN117479430 A CN 117479430A
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- workbench
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- circuit board
- plate
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- 230000002457 bidirectional effect Effects 0.000 claims abstract description 9
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 206010063659 Aversion Diseases 0.000 description 1
- 206010040007 Sense of oppression Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a device for improving the warpage of a circuit board, which belongs to the technical field of circuit board processing and comprises a workbench, wherein two pushing plates are arranged on the workbench and are arranged at the left end part and the right end part of the workbench in a longitudinal mirror image manner, and a bidirectional driving mechanism is also arranged on the workbench; a first limiting plate is further arranged at the rear end part above the workbench and is perpendicular to the two pushing plates; a type frame is arranged on the workbench, a supporting plate is arranged below the type frame, a linear driving mechanism sliding along the left-right direction is arranged on the type frame, a plurality of rollers are arranged below the supporting plate, the rollers are transversely and equidistantly arranged, the length direction of each roller is consistent with the front-back direction of the workbench, and each roller is rotationally arranged and is elastically connected with the supporting plate in the vertical direction; through the synchronous opposite movement of the two push plates, the circuit boards with different warping degrees can be driven to move below the plurality of rollers and limit the circuit boards.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a device for improving warpage of a circuit board.
Background
The printed circuit board is warped due to various reasons, such as improper operation, temperature and materials in the production process, or bending during placement, and the like, and in the PCB manufacturing process, the board with relatively large warping degree is picked out and is flattened in time by a roll-type flattening machine, and then is put into the next working procedure.
The invention of China patent publication No. CN114501784A provides a device for improving the warpage of a circuit board, the device comprises a base, the rear end of the top of the base is fixedly provided with an adjusting plate through bolts, the front end of the adjusting mechanism is connected with two symmetrically distributed positioning side plates, the top of the base is fixedly provided with a base plate through bolts, the base plate is arranged between the two positioning side plates, the front end of the top of the base is provided with a guide groove, a guide block is slidably connected in the guide groove, the top of the guide block is fixedly provided with a supporting rod through bolts, the top of the supporting rod is fixedly provided with a push plate through bolts, a first screw is rotationally connected in the guide groove through a bearing, the first screw is in threaded connection with the guide block, the front end of the first screw penetrates through the base, the first screw is connected with a transmission mechanism, and a leveling mechanism is arranged on the base, and drives the first screw to rotate through the transmission mechanism when the circuit board is leveled, so that the push plate is fixed on the circuit board, and the leveling efficiency is improved, but the device has the following defects:
1. because the whole circuit board is in a bending state after being warped, both end parts of the circuit board are in arc shapes, when the warping degree of the circuit board is different, the radian at the end parts of the circuit board is also different, in addition, the difference of the warping degree of the circuit board can also lead to the difference of the whole coverage area of the circuit board (the coverage area of the circuit board with high warping degree is small), so that the circuit board with certain warping degree is insufficient to be inserted into the positioning groove;
2. when the circuit board is pressed by the pressing plate, the pressing plate can cause great abrasion on the surface of the circuit board, and when the circuit board is pressed by the pressing plates, the pressing plates are always in the same plane, so that a few (or one) pressing rollers are abutted against the surface of the circuit board before the circuit board is pressed by the pressing plates, and the two positioning side plates are only elastically limited to the circuit board, so that when the circuit board is pressed by the pressing plates, the circuit board is possibly offset to a certain positioning side plate due to relative sliding between the pressing rollers and the warping surface of the circuit board, and the circuit board is influenced.
In order to solve the above problems, the present invention provides an apparatus for improving warpage of a circuit board.
Disclosure of Invention
The embodiment of the invention provides a device for improving the warpage of a circuit board, which is used for solving the problems in the prior art.
The embodiment of the invention adopts the following technical scheme: the device for improving the warpage of the circuit board comprises a workbench, wherein two pushing plates are arranged on the workbench and are arranged at the left end part and the right end part of the workbench in a longitudinal mirror image mode, and a bidirectional driving mechanism for driving the two pushing plates to move relatively is further arranged on the workbench;
a first limiting plate is further arranged at the rear end part above the workbench, and the first limiting plate is perpendicular to the two pushing plates;
install type frame on the workstation, type frame's below is provided with the backup pad, type frame is last to be provided with one along the gliding straight line actuating mechanism of left and right directions, the below of backup pad is provided with a plurality of cylinders, and a plurality of cylinders are transversely equidistant to be arranged and the length direction of each cylinder is all unanimous with the front and back direction of workstation, and each cylinder all rotates the setting and is in vertical direction elastic connection with the backup pad.
Through the synchronous opposite movement of two push plates, can drive the circuit board homoenergetic of warpage degree difference and remove to the below of a plurality of cylinders and to the circuit board is spacing, avoids leading to the difficulty of locating between the two parties of circuit board because the circuit board warpage degree is different.
Further, a plurality of through holes are longitudinally formed in the supporting plate, a round rod is slidably arranged in each through hole, the end part of each roller corresponds to one round rod, and a baffle is arranged at the top of each round rod;
the lower end of each round rod is provided with a transverse plate, and the lower end of the transverse plate is provided with a side plate extending longitudinally;
the end part of each round rod is rotatably arranged on the side plate at the corresponding position.
Through all being provided with the second limiting plate on every diaphragm, can give certain accommodation space of first spring from this, avoid the excessive extrusion between backup pad and a plurality of diaphragm and cause the damage of first spring.
Further, each round rod is provided with a first spring, and the first springs are positioned between the supporting plate and the corresponding transverse plate;
and each transverse plate is also provided with two second limiting plates extending upwards.
Further, an electric linear sliding table is arranged on the frame and used for driving the linear driving mechanism to move along the left-right direction.
Further, the linear driving mechanism comprises a motor seat, a linear driver, a top plate and two connecting plates, wherein the motor seat is arranged at an executing part of the electric linear sliding table;
the linear driver is longitudinally arranged on the motor base, the top plate is positioned below the linear driver, and an output shaft of the linear driver is fixedly connected with the top plate;
the two connecting plates are longitudinally arranged at the upper ends of the supporting plates, and the top plate is arranged at the top of the two connecting plates.
Further, the bidirectional driving mechanism comprises a mounting frame, a linear cylinder, two right-angle frames and two sliding blocks;
the two right-angle frames are respectively arranged at the outer sides of the two push plates, and the two sliding blocks are respectively arranged at the lower ends of the two right-angle frames;
the left end part and the right end part of the workbench are transversely provided with linear sliding grooves, the two linear sliding grooves extend along the length direction of the workbench, and the two sliding blocks are respectively arranged in the two linear sliding grooves in a sliding manner;
the lower end of each sliding block is provided with a vertical block, the vertical blocks are positioned below the workbench, a linkage assembly is arranged between the two vertical blocks, and the linkage assembly can drive the two vertical blocks to move in opposite directions;
the mounting frame is arranged on the lower side of the workbench, the linear air cylinder is transversely arranged on the mounting frame, and the output shaft of the linear air cylinder is abutted against one of the vertical blocks;
the outside of each upright is provided with a group of elastic components for elastically supporting the upright.
The two pushing plates can be synchronously separated from each other through the operation of the linear cylinder.
Further, the linkage assembly comprises a linear guide rail, a hinge block and two connecting rods;
the linear guide rail is arranged at the lower end of the workbench, extends along the front-back direction of the workbench, and is arranged on the linear guide rail in a sliding manner;
the inner side of each vertical block is provided with a hinge seat, two connecting rods are transversely arranged, one end parts of the two connecting rods are respectively hinged to the two hinge seats, and the other end parts of the two connecting rods are respectively hinged to the left side and the right side of the hinge block.
Further, each group of elastic components comprises a vertical plate, a guide rod and a second spring, and the elasticity of the second spring is larger than that of the first spring;
the guide rods are arranged on the corresponding vertical blocks and extend along the left-right direction of the workbench;
the vertical plate is arranged on the lower side of the workbench, and a guide hole which is in sliding fit with the guide rod is formed in the vertical plate;
the second springs are arranged on the guide rods and are positioned between the corresponding vertical plates and the corresponding vertical blocks.
The two push plates can be self-adaptively close to each other through the elastic support of the second spring, so that the circuit boards with different warping degrees are centered.
The above at least one technical scheme adopted by the embodiment of the invention can achieve the following beneficial effects:
the circuit board leveling device can drive the circuit boards with different warping degrees to move below the rollers and limit the circuit boards when the two push plates synchronously move in opposite directions, so that difficulty in centering and positioning of the circuit boards due to different warping degrees of the circuit boards is avoided, meanwhile, the stability of the circuit boards in the leveling and correcting process can be ensured by elastically pressing the plurality of rollers on the top surfaces of the circuit boards, and irregular displacement of the circuit boards due to the fact that a single roller contacts the circuit boards and presses the circuit boards is avoided, and even poor leveling effect of the circuit boards can be caused.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a partial perspective view of the present invention;
FIG. 3 is a schematic diagram of a partial perspective view of the present invention;
FIG. 4 is a partial perspective view of the present invention;
FIG. 5 is a schematic view of a partial perspective view of a third embodiment of the present invention;
FIG. 6 is a schematic perspective view of a table and bi-directional drive mechanism of the present invention;
FIG. 7 is a schematic perspective view of the inventive riser and spring assembly;
FIG. 8 is a schematic perspective view of a riser and linkage assembly of the present invention;
reference numerals
1-a workbench; 11-a first limiting plate; 12-a linear chute; 2-pushing plate; 3-a bi-directional drive mechanism; 31-mounting frame; 32-a linear cylinder; 33-right angle frames; 34-a slider; 35-standing blocks; 351-hinge seats; 36-linkage assembly; 361-linear guide rail; 362-hinge blocks; 363-link; a 37-spring assembly; 371-riser; 372-guiding holes; 373-guide bar; 374-a second spring; 4- type rack; 41-supporting plates; 411-through holes; 42-a linear drive mechanism; 421-motor base; 422-linear drive; 423-top plate; 424-connecting plates; 43-round bar; 431-baffle; 432-a cross plate; 433-side plates; 434-a second limiting plate; 44-a first spring; 45-an electric linear sliding table; 5-a roller; 6-circuit board.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The following describes in detail the technical solutions provided by the embodiments of the present invention with reference to the accompanying drawings.
Referring to fig. 1 to 8, an embodiment of the present invention provides a device for improving warpage of a circuit board, including a workbench 1, wherein two pushing plates 2 are provided on the workbench 1, the two pushing plates 2 are arranged at left and right end portions of the workbench 1 in a longitudinal mirror image manner, and a bidirectional driving mechanism 3 for driving the two pushing plates 2 to move relatively is further provided on the workbench 1; a first limiting plate 11 is further arranged at the rear end part above the workbench 1, and the first limiting plate 11 is perpendicular to the two pushing plates 2; a type frame 4 is arranged on the workbench 1, a supporting plate 41 is arranged below the type frame 4, a linear driving mechanism 42 sliding along the left-right direction is arranged on the type frame 4, and the linear driving mechanism 42 is used for driving the supporting plate 41 to lift; an electric linear sliding table 45 is arranged on the frame 4, and the electric linear sliding table 45 is used for driving the linear driving mechanism 42 to move along the left-right direction; a plurality of rollers 5 are arranged below the supporting plate 41, the rollers 5 are transversely and equidistantly arranged, the length direction of each roller 5 is consistent with the front-back direction of the workbench 1, and each roller 5 is rotatably arranged and elastically connected with the supporting plate 41 in the vertical direction.
In this embodiment, the circuit board 6 is bent to a certain radian in one direction after being warped, the circuit board 6 is placed on the workbench 1 by a worker and is located between the two pushing plates 2, and it should be noted that when the circuit board 6 is placed, the bending surface of the circuit board 6 needs to be guaranteed to face the table top of the workbench 1, then two lowest points of the circuit board 6 are respectively located near the two pushing plates 2, the circuit board 6 is pushed and abutted against the first limiting plate 11 by the worker, then the two pushing plates 2 are mutually close under the driving action of the bidirectional driving mechanism 3, finally the circuit board 6 is stabilized between the two pushing plates 2, thus realizing the centering of the circuit board 6, and at the moment, the circuit board 6 is also located under the plurality of rollers 5, the supporting plate 41 is driven to descend along with the operation of the linear driving mechanism 42, the plurality of rollers 5 are also driven to descend synchronously along with the driving of the supporting plate 41, in this process, when one of the rollers 5 descends to the highest point of the circuit board 6, the rollers 5 elastically abut against the surface of the circuit board 6 as the supporting board 41 descends, the circuit board 6 still presents a curved state under the resisting action of the two pushing boards 2, after all the rollers 5 abut against the upper surface of the circuit board 6, the two pushing boards 2 are far away from the circuit board 6 through the bidirectional driving mechanism 3, so that the circuit board 6 is flattened by the rollers 5 under the downward elastic action of the rollers 5, and the produced circuit board 6 can slide along the left and right directions as a whole by the electric linear sliding table 45, so as to drive the rollers 5 to move transversely together as the rollers 5 repeatedly roll, the whole circuit board 6 can be completely flattened; this application is in synchronous opposite movement of two push pedal 2, can drive the circuit board 6 homoenergetic of warpage degree difference and remove to the below of a plurality of cylinders 5 and right circuit board 6 is spacing, avoids leading to circuit board 6's location difficulty placed in the middle because circuit board 6 warpage degree is different, supports simultaneously again through a plurality of cylinders 5 elasticity and presses on circuit board 6's top surface, can guarantee circuit board 6 and flatten the stability of correcting the in-process, avoids leading to circuit board 6's irregular aversion because of single cylinder 5 contact circuit board 6 and oppression circuit board 6, probably causes even circuit board 6's leveling effect not good, and the roll through cylinder 5 can also avoid scraping circuit board 6 surface to circuit board 6 simultaneously flattening.
Specifically, the supporting plate 41 is longitudinally provided with a plurality of through holes 411, each through hole 411 is internally provided with a round rod 43 in a sliding manner, the end part of each roller 5 corresponds to one round rod 43, and the top of each round rod 43 is provided with a baffle 431; a transverse plate 432 is arranged at the lower end of each round rod 43, and a side plate 433 extending longitudinally is arranged at the lower end of the transverse plate 432; the end of each round bar 43 is rotatably arranged on the side plate 433 at the corresponding position; each round bar 43 is provided with a first spring 44, and the first spring 44 is positioned between the supporting plate 41 and the corresponding transverse plate 432; each cross plate 432 is further provided with two second limiting plates 434 extending upwards; the linear driving mechanism 42 comprises a motor seat 421, a linear driver 422, a top plate 423 and two connecting plates 424, wherein the motor seat 421 is arranged at an executing part of the electric linear sliding table 45; the linear driver 422 is longitudinally arranged on the motor seat 421, the top plate 423 is positioned below the linear driver 422, and an output shaft of the linear driver 422 is fixedly connected with the top plate 423; both of the connection plates 424 are longitudinally installed at the upper ends of the support plates 41, and the top plate 423 is installed at the top of both connection plates 424.
In this embodiment, a rectangular housing is formed by the top plate 423, the support plate 41 and the two connection plates 424, and the plurality of round rods 43 and the baffle 431 move completely in the rectangular housing, the rectangular housing gives a certain movable space to the round rods 43, when the linear driver 422 operates to drive the top plate 423 to lift and lower the support plate 41, thereby realizing the lifting adjustment of the support plate 41, when the roller 5 abuts against the surface of the circuit board 6, the continuous lowering of the support plate 41 causes the distance between the roller 5 firstly contacting the circuit board 6 and the support plate 41 to be close, when all the rollers 5 abut against the surface of the circuit board 6, the bidirectional driving mechanism 3 operates to drive the two push plates 2 to be away from each other, thereby flattening the circuit board 6 under the elastic pressure of the roller 5, if the elasticity of the roller 5 cannot be flattened completely, the linear driver 422 continues to drive the support plate 41 to be lowered, when the second limiting plate 434 abuts against the lower end of the support plate 41, the first spring 44 at the corresponding position is compressed to the limit, the support plate 41 continues to be lowered, the roller 5 is driven to be lowered by the same distance, when the second limiting plate 434 abuts against the surface of the circuit board 6, and when all the second limiting plates 434 abut against the circuit board 6 are pressed against the surface of the circuit board 6, thereby achieving the effect of flattening the circuit board 6 repeatedly; through all being provided with the second limiting plate 434 on every diaphragm 432, can give first spring 44 certain accommodation space from this, avoid the excessive extrusion between backup pad 41 and a plurality of diaphragm 432 and cause the damage of first spring 44, rotate through cylinder 5 and set up on the curb plate 433 of corresponding position department, realized the technological effect that cylinder 5 rotated the setting from this, and realized the elastic connection between cylinder 5 and backup pad 41 through the vertical spacing of round bar 43 to cylinder 5 and the elastic support of first spring 44, can realize from this that a plurality of cylinders 5 homoenergetic elasticity conflict on the curved surface of circuit board 6.
Specifically, the bidirectional driving mechanism 3 includes a mounting frame 31, a linear cylinder 32, two right-angle frames 33, and two sliding blocks 34; the two right angle frames 33 are respectively arranged at the outer sides of the two push plates 2, and the two sliding blocks 34 are respectively arranged at the lower ends of the two right angle frames 33; the left end and the right end of the workbench 1 are transversely provided with linear sliding grooves 12, the two linear sliding grooves 12 extend along the length direction of the workbench 1, and two sliding blocks 34 are respectively arranged in the two linear sliding grooves 12 in a sliding manner; a vertical block 35 is arranged at the lower end of each sliding block 34, the vertical block 35 is positioned below the workbench 1, a linkage assembly 36 is arranged between the two vertical blocks 35, and the linkage assembly 36 can drive the two vertical blocks 35 to move in opposite directions; the mounting frame 31 is mounted on the lower side of the workbench 1, the linear air cylinder 32 is transversely mounted on the mounting frame 31, and an output shaft of the linear air cylinder 32 is abutted against one of the vertical blocks 35; the outside of each of the standing blocks 35 is provided with a set of elastic members 37 for elastically supporting the same.
In this embodiment, one of the vertical blocks 35 can be driven to move towards the outer side of the workbench 1 through the operation of the linear cylinder 32, so that the two vertical blocks 35 can be synchronously moved away from each other under the action of the linkage assembly 36, and the two push plates 2 can be synchronously moved away from each other through the operation of the linear cylinder 32 because the outer side of each vertical block 35 is provided with an elastic assembly 37 which elastically supports the vertical blocks, under the action of the two groups of elastic assemblies 37, when the linear driver 422 resets, the output shaft of the linear driver 422 is separated from the corresponding vertical block 35, and the two push plates 2 can be mutually moved close to each other under the elastic action of the elastic assembly 37, so that the self-centering positioning of the circuit plates 6 is realized, and the self-adaptive centering positioning of the circuit plates 6 with different warping degrees under the action of the two push plates 2 is ensured.
Specifically, the linkage assembly 36 includes a linear guide 361, a hinge block 362, and two links 363; the linear guide rail 361 is installed at the lower end of the workbench 1, the linear guide rail 361 extends along the front-back direction of the workbench 1, and the hinge block 362 is slidably arranged on the linear guide rail 361; the inner side of each vertical block 35 is provided with a hinging seat 351, two connecting rods 363 are transversely arranged, one end part of each connecting rod 363 is hinged to each hinging seat 351, and the other end part of each connecting rod 363 is hinged to the left side and the right side of each hinging block 362; each set of elastic members 37 includes a vertical plate 371, a guide bar 373, and a second spring 374; the guide rods 373 are mounted on the corresponding standing blocks 35, and the guide rods 373 extend in the left-right direction of the table 1; the vertical plate 371 is arranged at the lower side of the workbench 1, and a guide hole 372 which is in sliding fit with the guide rod 373 is formed in the vertical plate 371; the second springs 374 are mounted on the guide bars 373, and the second springs 374 are located between the corresponding standing plates 371 and the standing blocks 35.
In this embodiment, the elastic force of the second springs 374 should be much larger than that of the first springs 44, and the elastic force of the first springs 44 should be smaller, the second springs 374 should ensure that the elastic force of the second springs 374 should not drive the push plate 2 to press and break the warped circuit board 6 when the specification is selected, when the linear driver 422 operates, one of the upright blocks 35 is pushed by the linear driver 422 and causes the second springs 374 at the position of the upright block 35 to compress, under the action of the two connecting rods 363 and the hinge blocks 362, the two upright blocks 35 can synchronously keep moving towards each other, at this time, the distance between the two push plates 2 also reaches the maximum value, the worker can conveniently place the warped circuit board 6 between the two push plates 2, and along with the return of the linear driver 422, the output shaft of the linear driver 422 also breaks away from the upright blocks 35, so that under the action of the two second springs 374, the two push plates 2 are close to each other, thereby pushing the circuit board 6 to the center position of the workbench 1, then, and when the plurality of rollers 5 are pushed down and abut against the upper surface of the circuit board 6, the first springs 44 can be avoided, the elastic force of the first springs 374 is much smaller than the first springs 44, and the elastic force of the first springs 44 can be avoided.
It should be noted that, for simplicity of description, the foregoing embodiments are all illustrated as a series of acts, but it should be understood by those skilled in the art that the present invention is not limited by the order of acts, as some steps may be performed in other order or concurrently in accordance with the present invention. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, and such partitioning of the above-described elements may be implemented in other manners, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or communication connection shown or discussed as being between each other may be an indirect coupling or communication connection between devices or elements via some interfaces, which may be in the form of telecommunications or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention. It will be apparent that the described embodiments are merely some, but not all, embodiments of the invention. Based on these embodiments, all other embodiments that may be obtained by one of ordinary skill in the art without inventive effort are within the scope of the invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art may still combine, add or delete features of the embodiments of the present invention or make other adjustments according to circumstances without any conflict, so as to obtain different technical solutions without substantially departing from the spirit of the present invention, which also falls within the scope of the present invention.
Claims (8)
1. The utility model provides a device for improving circuit board warpage, includes workstation (1), be provided with two push pedal (2) on workstation (1), two push pedal (2) are vertical mirror image setting at the left and right sides both ends of workstation (1), its characterized in that:
the workbench (1) is also provided with a bidirectional driving mechanism (3) for driving the two pushing plates (2) to move relatively;
a first limiting plate (11) is further arranged at the rear end part above the workbench (1), and the first limiting plate (11) is perpendicular to the two pushing plates (2);
install type frame (4) on workstation (1), the below of type frame (4) is provided with backup pad (41), be provided with one on type frame (4) along the gliding straight line actuating mechanism (42) of left and right directions, the below of backup pad (41) is provided with a plurality of cylinders (5), and the horizontal equidistance of a plurality of cylinders (5) is arranged and the length direction of each cylinder (5) is all unanimous with the fore-and-aft direction of workstation (1), and each cylinder (5) all rotates the setting and is in vertical direction elastic connection with backup pad (41).
2. The device for improving the warpage of the circuit board according to claim 1, wherein a plurality of through holes (411) are longitudinally formed in the supporting plate (41), a round rod (43) is slidably arranged in each through hole (411), the end part of each roller (5) corresponds to one round rod (43), and a baffle plate (431) is arranged at the top part of each round rod (43);
a transverse plate (432) is arranged at the lower end of each round rod (43), and a side plate (433) extending longitudinally is arranged at the lower end of the transverse plate (432);
the end of each round rod (43) is rotatably arranged on a side plate (433) at a corresponding position.
3. A device for improving the warpage of circuit boards according to claim 2, characterized in that each round bar (43) is mounted with a first spring (44), said first spring (44) being located between the support plate (41) and the corresponding transverse plate (432);
two second limiting plates (434) extending upwards are further arranged on each transverse plate (432).
4. The device for improving the warpage of the circuit board according to claim 1, wherein an electric linear sliding table (45) is mounted on the type frame (4), and the electric linear sliding table (45) is used for driving the linear driving mechanism (42) to move in the left-right direction.
5. The apparatus for improving warpage of a circuit board according to claim 4, wherein the linear driving mechanism (42) comprises a motor base (421), a linear driver (422), a top plate (423) and two connection plates (424), the motor base (421) being mounted at an executing portion of the electric linear sliding table (45);
the linear driver (422) is longitudinally arranged on the motor base (421), the top plate (423) is positioned below the linear driver (422), and an output shaft of the linear driver (422) is fixedly connected with the top plate (423);
both connecting plates (424) are longitudinally installed at the upper ends of the supporting plates (41), and the top plate (423) is installed at the top of both connecting plates (424).
6. Device for improving the warpage of circuit boards according to claim 1, characterized in that the bi-directional driving mechanism (3) comprises a mounting frame (31), a linear cylinder (32), two right angle frames (33) and two sliding blocks (34);
the two right-angle frames (33) are respectively arranged at the outer sides of the two push plates (2), and the two sliding blocks (34) are respectively arranged at the lower ends of the two right-angle frames (33);
the left end part and the right end part of the workbench (1) are transversely provided with linear sliding grooves (12), the two linear sliding grooves (12) extend along the length direction of the workbench (1), and the two sliding blocks (34) are respectively arranged in the two linear sliding grooves (12) in a sliding manner;
a vertical block (35) is arranged at the lower end of each sliding block (34), the vertical blocks (35) are positioned below the workbench (1), a linkage assembly (36) is arranged between the two vertical blocks (35), and the linkage assembly (36) can drive the two vertical blocks (35) to move in opposite directions;
the mounting frame (31) is arranged at the lower side of the workbench (1), the linear air cylinder (32) is transversely arranged on the mounting frame (31), and an output shaft of the linear air cylinder (32) is abutted against one of the vertical blocks (35);
a set of elastic components (37) for elastically supporting the vertical blocks (35) are arranged on the outer side of each vertical block.
7. The apparatus for improving warpage of a circuit board according to claim 6, wherein the linkage assembly (36) comprises a linear guide rail (361), a hinge block (362) and two links (363);
the linear guide rail (361) is arranged at the lower end of the workbench (1), the linear guide rail (361) extends along the front-back direction of the workbench (1), and the hinge block (362) is arranged on the linear guide rail (361) in a sliding manner;
the inner side of each vertical block (35) is provided with a hinging seat (351), two connecting rods (363) are transversely arranged, one end part of each connecting rod (363) is hinged to each hinging seat (351), and the other end parts of each connecting rod (363) are hinged to the left side and the right side of each hinging block (362).
8. The apparatus for improving warpage of a circuit board according to claim 6, wherein each set of elastic members (37) comprises a vertical plate (371), a guide bar (373), and a second spring (374), and the second spring (374) has an elastic force greater than that of the first spring (44);
the guide rods (373) are arranged on the corresponding vertical blocks (35), and the guide rods (373) extend along the left-right direction of the workbench (1);
the vertical plate (371) is arranged on the lower side of the workbench (1), and a guide hole (372) which is in sliding fit with the guide rod (373) is formed in the vertical plate (371);
the second springs (374) are mounted on the guide rods (373), and the second springs (374) are located between the corresponding vertical plates (371) and the vertical blocks (35).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311316577.9A CN117479430B (en) | 2023-10-11 | 2023-10-11 | Device for improving warping of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311316577.9A CN117479430B (en) | 2023-10-11 | 2023-10-11 | Device for improving warping of circuit board |
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| CN117479430A true CN117479430A (en) | 2024-01-30 |
| CN117479430B CN117479430B (en) | 2024-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311316577.9A Active CN117479430B (en) | 2023-10-11 | 2023-10-11 | Device for improving warping of circuit board |
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| CN117479430B (en) | 2024-06-21 |
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