CN117476656A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN117476656A
CN117476656A CN202310047284.9A CN202310047284A CN117476656A CN 117476656 A CN117476656 A CN 117476656A CN 202310047284 A CN202310047284 A CN 202310047284A CN 117476656 A CN117476656 A CN 117476656A
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CN
China
Prior art keywords
layer
packaging
display panel
area
thickness
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Pending
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CN202310047284.9A
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Chinese (zh)
Inventor
齐飞
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202310047284.9A priority Critical patent/CN117476656A/en
Publication of CN117476656A publication Critical patent/CN117476656A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application provides a display panel and display device, including functional area and the edge encapsulation district around the functional area, display panel includes: a substrate including a first portion located in the functional region and a second portion located in the edge packaging region, the thickness of the first portion being greater than the thickness of the second portion; a dielectric layer disposed on a surface of the substrate; the retaining wall is arranged above the dielectric layer and positioned at the boundary of the functional area close to the edge packaging area; and the packaging layer is arranged on the dielectric layer and the baffle wall. The thickness of the substrate positioned in the functional area is larger than that of the substrate positioned in the edge packaging area, so that planes which are not parallel to the plane where the display panel is positioned are formed in the edge packaging area, the occupied space of the edge packaging area in the horizontal direction of the display panel is reduced while the effective area of the edge packaging area is ensured to be large enough, and the organic packaging layer can be prevented from overflowing only by arranging one retaining wall, so that the occupied space of the retaining wall is effectively reduced, the reducible space of the frame is effectively increased, and the narrow frame effect of the display screen is improved.

Description

Display panel and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
With the increasing popularity of display devices, users have not only increased requirements on functions and performances of the display devices, but also increased requirements on the appearance of display screens in the display devices, for example, narrower frames are required for the display screens, so as to ensure that the display screens have a larger effective display area, thereby providing better visual experience for users.
In order to improve the packaging reliability of the display panel, a packaging area for blocking water and oxygen is generally arranged in a frame of the display panel (in order to ensure the effectiveness of the packaging area, the length of the packaging area is generally set longer in the horizontal direction of the display panel), in addition, a packaging material is coated on the surface of a substrate positioned in the frame to form a packaging layer, and in the preparation process of the packaging layer, a double-retaining wall structure connected with the packaging area is generally arranged in the frame to block the packaging material from overflowing the display panel, so that the space occupied by the packaging area and the double-retaining wall structure is larger, and the reducible space of the current frame is limited, thereby resulting in poor narrow frame effect of the display screen.
Disclosure of Invention
The application provides a display panel and display device for alleviate the technical problem that the narrow frame effect of current display screen is poor.
In order to solve the technical problems, the application provides the following technical scheme:
the application provides a display panel, including functional area and around the edge encapsulation district of functional area, the display panel includes:
a substrate comprising a first portion located in the functional region and a second portion located in the edge-packaging region, the thickness of the first portion being greater than the thickness of the second portion;
the dielectric layer is arranged on the surface of the substrate;
the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area;
the packaging layer is arranged on the dielectric layer and the retaining wall; the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall, which faces the functional area.
In some embodiments of the present application, the thickness of the second portion decreases gradually in a direction away from the functional region.
In some embodiments of the present application, the surface of the second portion is one of a plane, a concave curved surface, or a convex curved surface.
In some embodiments of the present application, the thickness of the first inorganic encapsulation layer on the surface of the second portion is constant, and the thickness of the second inorganic encapsulation layer on the surface of the second portion is constant.
In some embodiments of the present application, the thickness of the first inorganic encapsulation layer on the surface of the second portion is the same as the thickness of the second inorganic encapsulation layer on the surface of the second portion.
In some embodiments of the present application, the thickness of the second portion is constant in a direction away from the functional region.
In some embodiments of the present application, the second portion forms a right angle structure or an undercut structure with the first portion.
In some embodiments of the present application, the thickness of the first inorganic encapsulation layer decreases in a direction toward the second portion, and the thickness of the second inorganic encapsulation layer decreases in a direction toward the second portion.
In some embodiments of the present application, the display panel further includes a cutting area located at a side of the edge sealing area away from the functional area and in close proximity to the edge sealing area.
The application also provides a display device, including a functional area and an edge packaging area surrounding the functional area, and the display panel, the display panel includes:
a substrate comprising a first portion located in the functional region and a second portion located in the edge-packaging region, the thickness of the first portion being greater than the thickness of the second portion;
the dielectric layer is arranged on the surface of the substrate;
the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area;
the packaging layer is arranged on the dielectric layer and the retaining wall; the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall, which faces the functional area.
The application provides a display panel and display device, including the functional area and around the edge encapsulation district of functional area, display panel includes: a substrate including a first portion located in the functional region and a second portion located in the edge packaging region, the thickness of the first portion being greater than the thickness of the second portion; the dielectric layer is arranged on the surface of the substrate; the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area; the packaging layer is arranged on the dielectric layer and the retaining wall and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall facing the functional area. The thickness of the substrate positioned in the functional area is larger than that of the substrate positioned in the edge packaging area, so that a plane which is not parallel to the plane where the display panel is positioned is formed at the edge of the edge packaging area, which is close to the functional area, so that the occupied space of the edge packaging area in the horizontal direction of the display panel is effectively reduced while the edge packaging area is ensured to have a large enough effective area.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a display panel frame in the prior art according to an embodiment of the present application.
Fig. 3 is another schematic structural diagram of a display panel according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a substrate according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel provided in an embodiment of the present application, where the display panel provided in the embodiment of the present application includes a functional area 1 and an edge packaging area 2 surrounding the functional area, and the display panel includes: a substrate 11 including a first portion located in the functional region 1 and a second portion located in the edge packaging region 2, the first portion having a thickness greater than that of the second portion; a dielectric layer 12 disposed on the surface of the substrate 11; the retaining wall 13 is arranged above the dielectric layer 12 and is positioned at the boundary of the functional area 1, which is close to the edge packaging area 2; the encapsulation layer 14 is disposed on the dielectric layer 12 and the retaining wall 13, wherein the encapsulation layer 14 includes a first inorganic encapsulation layer 141, an organic encapsulation layer 142, and a second inorganic encapsulation layer 143, and the organic encapsulation layer 142 is disposed on a side of the retaining wall 13 facing the functional area 1.
Wherein the dielectric layer 12 is used for realizing electric insulation of the internal devices of the display panel and providing isolation protection for the surrounding environment; the retaining wall 13 is used for blocking the organic encapsulation layer 142 from overflowing the display panel; the encapsulation layer 14 is used for reducing the external impurities such as water vapor and oxygen from entering the display panel, so as to reduce the influence of the external impurities such as water vapor and oxygen on the display panel, realize effective encapsulation, and improve the encapsulation reliability.
In the display panel currently produced on the market, as shown in fig. 2, the display panel includes a packaging area 20, a substrate 21, an inorganic layer 22, a double-wall structure 23 and a packaging layer 24 which are sequentially stacked, specifically, the double-wall structure 23 is used for blocking organic materials in the packaging layer 24 from overflowing the display panel, in addition, in order to ensure the effectiveness of the packaging area 20, the length of the packaging area 20 is generally set longer in the horizontal direction of the display panel, so that the space occupied by the packaging area 20 and the double-wall structure 23 is larger, and therefore, when the frame of the display screen is manufactured in the practical application process, enough space needs to be reserved for the frame to ensure that the size of the frame is large enough, so that the reducible space of the frame is limited, and the narrow frame effect of the display screen is poor.
In order to avoid the above-mentioned situation, in this embodiment, the thickness of the first portion is greater than the thickness of the second portion by setting the substrate to be greater than the thickness of the first portion, so that there is a thickness difference between the functional area and the edge packaging area, and an area corresponding to the thickness difference is located in the edge packaging area, that is, a plane which is not parallel to a plane where the display panel is located is formed at an edge, which is close to the functional area, in the edge packaging area, so that the occupation space of the edge packaging area in the horizontal direction of the display panel is reduced while the edge packaging area is ensured to have a sufficiently large effective area.
Specifically, during the actual process, the second portion may be subjected to cutting treatment so that the thickness of the second portion is smaller than that of the first portion, optionally, during the cutting, the thickness of the second portion is gradually reduced in a direction away from the functional area 1 while ensuring that the thickness of the second portion is smaller than that of the first portion everywhere, or the thickness of the second portion is unchanged in a direction away from the functional area.
Specifically, in the first embodiment, as shown in fig. 1, the thickness of the second portion gradually decreases in a direction away from the functional area 1, that is, a plane inclined from the functional area 1 to the edge packaging area 2 to the lower right is formed at the edge of the edge packaging area 2 near the functional area 1, and an angle between the plane and the plane in which the display panel is located may be set according to practical application requirements, for example, the thickness of the second portion gradually decreases in a direction away from the functional area 1, and a plane inclined downward from the functional area 1 to the edge packaging area 2 is formed, and an angle between the plane and the plane in which the display panel is located is 45 °.
Optionally, the surface of the second portion is one or a combination of a plane, a concave curved surface or a convex curved surface, which can be selected according to practical application requirements, so the surface morphology of the second portion is not specifically limited herein. Because the effective area of the substrate surface can be further increased by the concave curved surface/the convex curved surface, when the surface of the second part comprises the concave curved surface or the convex curved surface, the effective area of the edge packaging area can be further increased, so that the reducible space of the frame is further increased, and the narrow frame effect of the display screen is better.
In a second embodiment, as shown in fig. 3, the thickness of the second portion is constant in a direction away from the functional area 1, i.e. a plane is formed in the edge packaging area 2 near the edge of the functional area 1 vertically downwards from the functional area 1 to the edge packaging area 2, so that the second portion forms a right angle structure with the first portion, where the angle between the plane and the plane in which the display panel is located is 90 °.
In the third embodiment, as shown in fig. 4, the thickness of the second portion is unchanged in the direction away from the functional area 1, and a plane inclined from the edge packaging area 2 to the functional area 1 to the lower left is formed in the edge packaging area 2 near the functional area 1, that is, the second portion and the first portion form an undercut structure, and likewise, the angle of the undercut structure (that is, the angle between the plane and the plane in which the display panel is located) may be set according to practical requirements, for example, the thickness of the second portion is unchanged in the direction away from the functional area 1, and a plane inclined from the edge packaging area 2 to the lower left of the functional area 1 is formed in the edge packaging area 2 near the functional area 1, and the angle between the plane and the plane in which the display panel is located is 135 °.
Further, since the organic encapsulation layer 142 is a flexible component, in this embodiment, the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 are sandwiched between two sides of the organic encapsulation layer 142 to protect and support the organic encapsulation layer 142, and in the practical application process, the first inorganic encapsulation layer 141 may be deposited on the surface of the dielectric layer 12 by chemical vapor deposition, and the second inorganic encapsulation layer 143 may be deposited on the surface of the organic encapsulation layer 142; the organic encapsulation layer 142 may be formed by fabricating an organic material on the first inorganic encapsulation layer 141 by means of IJP (Ink Jet Printing), spin coating, spray coating, or the like, and performing photo-curing or thermal curing, and the organic encapsulation layer 142 is formed after the organic material is cured. Alternatively, the materials of the first and second inorganic encapsulation layers 141 and 143 include silicon nitride, silicon oxide, aluminum oxide, and the like; the organic material used to prepare the organic encapsulation layer 142 may include an acrylic-based polymer, a silicon-based polymer, an epoxy-based polymer, or the like.
It should be noted that, in the embodiment of the present application, the encapsulation layer 14 is only described by taking the three-layer structure as an example, however, the encapsulation layer 14 may also have a five-layer, seven-layer or other layer structure, and the film structure of the encapsulation layer 14 may be determined based on actual requirements in the actual application process, so the film structure of the encapsulation layer 14 is not specifically limited herein.
Specifically, when the thickness of the second portion gradually decreases in a direction away from the functional region, as shown in fig. 1, the thickness of the first inorganic encapsulation layer 141 on the surface of the second portion is unchanged, the thickness of the second inorganic encapsulation layer 143 on the surface of the second portion is unchanged, and the thickness of the first inorganic encapsulation layer 141 on the surface of the second portion is the same as the thickness of the second inorganic encapsulation layer 143 on the surface of the second portion; when the thickness of the second portion is constant in a direction away from the functional region, as shown in fig. 3 or 4, the thickness of the first inorganic encapsulation layer 141 decreases in a direction toward the second portion, and the thickness of the second inorganic encapsulation layer 143 decreases in a direction toward the second portion.
In addition, the display panel provided in this embodiment further includes a cutting area (not shown in the drawing), where the cutting area is located at a side of the edge packaging area 2 away from the functional area 1 and is adjacent to the edge packaging area 2, and considering that a gap exists between the first inorganic packaging layer 141 and the second inorganic packaging layer 143 at the location of the retaining wall 13 possibly due to process limitations in the practical application process, in this scenario, the organic material in the overflowing portion of the organic packaging layer 142 flows through the edge packaging area 2 through the gap and finally flows to the cutting area, and only the cutting area is needed to cut off the organic material in the portion, so that the organic material in the overflowing portion is finally cut off in the edge packaging area 2, thereby ensuring that the organic material cannot overflow the display panel.
The application provides a display panel, including the functional region and around the edge encapsulation district of functional region, display panel includes: a substrate including a first portion located in the functional region and a second portion located in the edge packaging region, the thickness of the first portion being greater than the thickness of the second portion; the dielectric layer is arranged on the surface of the substrate; the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area; the packaging layer is arranged on the dielectric layer and the retaining wall and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall facing the functional area.
Through setting the substrate to the thickness of first portion be greater than the thickness of second portion for there is thickness difference between functional region and the edge encapsulation district, the region that this thickness difference corresponds is located the edge encapsulation district, also make the edge department that is close to the functional region in the edge encapsulation district form the plane that is not parallel to each other that the display panel is located, therefore when guaranteeing that the edge encapsulation district has great enough effective area, still reduced the occupation space of edge encapsulation district in the display panel horizontal direction, in addition, owing to only set up a barricade and can prevent that organic encapsulation layer from spilling over, so effectively reduced the occupation space of barricade, thereby effectively increase the reducible space of frame, and then improve the narrow frame effect of display screen.
The embodiment of the application also provides a display device, which comprises a functional area, an edge packaging area surrounding the functional area and a display panel, wherein the display panel comprises: a substrate including a first portion located in the functional region and a second portion located in the edge packaging region, the thickness of the first portion being greater than the thickness of the second portion; the dielectric layer is arranged on the surface of the substrate; the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area; the packaging layer is arranged on the dielectric layer and the retaining wall; the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall facing the functional area.
Further, in the actual display panel manufacturing process, the following requirements are required for the properties of the substrate: the material has strong wear resistance, excellent plastic deformation capability, strong high temperature resistance, high pressure resistance, corrosion resistance, radiation resistance, rust resistance and impact resistance, and therefore, in the embodiment, PI (Polyimide) with the above properties is selected as the material of the substrate. It should be noted that one or more combinations of polyether sulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polycarbonate, and polymer resin of cellulose acetate propionate may be used as the material of the substrate, and the embodiment of the present invention is not particularly limited thereto.
Specifically, as shown in fig. 5, in the present embodiment, the substrate includes a thin film transistor layer 51 and a light-emitting layer 52 which are sequentially stacked. The thin film transistor layer 51 includes an active layer 511, a gate insulating layer 512, a gate electrode 513, an interlayer insulating layer 514, a source/drain layer 515, a planarization layer 516, a pixel electrode 517, and a pixel defining layer 518, which are sequentially stacked, and the active layer 511 includes a channel region 5111, and a source region 5112 and a drain region 5113 located at both sides of the channel region 5111. The gate insulating layer 512 overlies the active layer 511, the gate electrode 513 is disposed on the gate insulating layer 512, and the gate electrode 513 is disposed corresponding to the channel region 5111.
The interlayer insulating layer 514 is disposed on the gate 513 and the gate insulating layer 512, the source/drain layer 515 is disposed on the interlayer insulating layer 514, the source/drain layer 515 is patterned to form a source 5151, a drain 5152, a data line 5153, and the like, the source 5151 is connected to the source region 5112 through a via of the interlayer insulating layer 514, and the drain 5152 is connected to the drain region 5113 through another via of the interlayer insulating layer 514.
The planarization layer 516 is covered on the source/drain layer 515 and the interlayer insulating layer 514, and the planarization layer 516 is provided to provide a flat film surface for the substrate, so as to improve the stability of preparing the light emitting layer 52. The pixel electrode 517 is disposed on the planarization layer 516 and is connected to the source 5151 or the drain 5152 through a via hole of the planarization layer 516.
It should be noted that, the structure of the thin film transistor layer 51 in the present application is not limited to that illustrated in the present embodiment, the thin film transistor layer 51 in the present application may further include more or less film layers, and the positional relationship of each film layer is not limited to that illustrated in the present embodiment, for example, the gate 513 may also be located below the active layer 511 to form a bottom gate structure.
The light emitting layer 52 includes a light emitting unit 521 and a cathode 522, the cathode 522 covers the light emitting unit 521, the light emitting unit 521 is formed by disposing the entire surface of the light emitting material of different colors on the surface of the thin film transistor layer 51, the light emitting unit 521 emits light under the combined action of the pixel electrode 517 and the cathode 522, the light emitting unit 521 of different colors emits light of different colors, and the thin film transistor layer 51 is used for providing a driving voltage to the light emitting layer 52 to make the light emitting layer 52 emit light.
According to the above embodiment, the display device provided by the present application includes a functional area, an edge packaging area surrounding the functional area, and a display panel, wherein the display panel includes: a substrate including a first portion located in the functional region and a second portion located in the edge packaging region, the thickness of the first portion being greater than the thickness of the second portion; the dielectric layer is arranged on the surface of the substrate; the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area; the packaging layer is arranged on the dielectric layer and the retaining wall and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall facing the functional area.
Through setting the substrate to the thickness of first portion be greater than the thickness of second portion for there is thickness difference between functional region and the edge encapsulation district, the region that this thickness difference corresponds is located the edge encapsulation district, also make the edge department that is close to the functional region in the edge encapsulation district form the plane that is not parallel to each other that the display panel is located, therefore when guaranteeing that the edge encapsulation district has great enough effective area, still reduced the occupation space of edge encapsulation district in the display panel horizontal direction, in addition, owing to only set up a barricade and can prevent that organic encapsulation layer from spilling over, so effectively reduced the occupation space of barricade, thereby effectively increase the reducible space of frame, and then improve the narrow frame effect of display screen.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing embodiments of the present application have been described in detail, and specific examples have been employed herein to illustrate the principles and embodiments of the present application, the above embodiments being provided only to assist in understanding the technical solutions of the present application and their core ideas; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A display panel comprising a functional area and an edge encapsulation area surrounding the functional area, the display panel comprising:
a substrate comprising a first portion located in the functional region and a second portion located in the edge-packaging region, the thickness of the first portion being greater than the thickness of the second portion;
the dielectric layer is arranged on the surface of the substrate;
the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area;
the packaging layer is arranged on the dielectric layer and the retaining wall; the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall, which faces the functional area.
2. The display panel according to claim 1, wherein the thickness of the second portion gradually decreases in a direction away from the functional region.
3. The display panel of claim 2, wherein the surface of the second portion is one of planar, concave curved, or convex curved.
4. The display panel of claim 2, wherein a thickness of the first inorganic encapsulation layer on the surface of the second portion is constant and a thickness of the second inorganic encapsulation layer on the surface of the second portion is constant.
5. The display panel according to claim 4, wherein a thickness of the first inorganic encapsulation layer on the surface of the second portion is the same as a thickness of the second inorganic encapsulation layer on the surface of the second portion.
6. The display panel according to claim 1, wherein a thickness of the second portion is constant in a direction away from the functional region.
7. The display panel of claim 6, wherein the second portion forms a right angle structure or an undercut structure with the first portion.
8. The display panel of claim 6, wherein the first inorganic encapsulation layer decreases in thickness in a direction toward the second portion and the second inorganic encapsulation layer decreases in thickness in a direction toward the second portion.
9. The display panel of any one of claims 1 to 8, further comprising a cut-out region located on a side of the edge encapsulation region remote from the functional region and immediately adjacent to the edge encapsulation region.
10. A display device comprising a functional area and an edge encapsulation area surrounding the functional area, and a display panel according to any one of claims 1-9, the display panel comprising:
a substrate comprising a first portion located in the functional region and a second portion located in the edge-packaging region, the thickness of the first portion being greater than the thickness of the second portion;
the dielectric layer is arranged on the surface of the substrate;
the retaining wall is arranged above the dielectric layer and is positioned at the boundary of the functional area, which is close to the edge packaging area;
the packaging layer is arranged on the dielectric layer and the retaining wall; the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, and the organic packaging layer is arranged on one side of the retaining wall, which faces the functional area.
CN202310047284.9A 2023-01-31 2023-01-31 Display panel and display device Pending CN117476656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310047284.9A CN117476656A (en) 2023-01-31 2023-01-31 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310047284.9A CN117476656A (en) 2023-01-31 2023-01-31 Display panel and display device

Publications (1)

Publication Number Publication Date
CN117476656A true CN117476656A (en) 2024-01-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310047284.9A Pending CN117476656A (en) 2023-01-31 2023-01-31 Display panel and display device

Country Status (1)

Country Link
CN (1) CN117476656A (en)

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