CN117457551A - Die bonder with double-swing-arm structure and method - Google Patents
Die bonder with double-swing-arm structure and method Download PDFInfo
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- CN117457551A CN117457551A CN202311801689.3A CN202311801689A CN117457551A CN 117457551 A CN117457551 A CN 117457551A CN 202311801689 A CN202311801689 A CN 202311801689A CN 117457551 A CN117457551 A CN 117457551A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000001179 sorption measurement Methods 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims description 42
- 238000009833 condensation Methods 0.000 claims description 26
- 230000005494 condensation Effects 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 18
- 230000009977 dual effect Effects 0.000 claims description 11
- 239000000498 cooling water Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 230000003139 buffering effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a die bonder with a double swing arm structure and a method thereof, and relates to the technical field of die bonders. The invention discloses a die bonder with a double swing arm structure and a die bonder method, wherein a wafer adsorption structure and a die bonding structure are respectively arranged below a double swing arm, when a driving motor II drives a first swing arm and a second swing arm to rotate 180 degrees, a die bonding process can be completed, meanwhile, the first swing arm and the second swing arm are distributed at 180 degrees, after the die bonding at a designated position is completed, a wafer can be rotated to the upper part of the die bonding position after the driving motor II rotates 180 degrees, an electric telescopic rod II is adjusted to drive the wafer to move to the die bonding position, die bonding operation can be completed quickly, and in the operation process, the condition that deviation exists between the die bonding position and the die placing position is avoided, so that the die bonding efficiency of the die bonder is improved, and the error rate is reduced.
Description
Technical Field
The invention relates to the technical field of die bonders, in particular to a die bonder with a double-swing-arm structure and a method.
Background
The die bonder is mainly used for lead frame pressing plates of various gold wire ultrasonic welding equipment, various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, through pins, motors, carbon brushes, encoders, driving belts of various chip mounting equipment, various parts of automatic equipment, instruments, meters and the like.
In the operation process of the existing die bonder, the wafer is adsorbed through an adsorption structure on the swing arm, then the wafer is rotated to the dispensing position, the wafer is placed on the dispensing position, the repeated rotation of the single swing arm is matched with the dispensing mechanism to perform the dispensing operation, the single swing arm has the deviation between the dispensing position and the placing position of the wafer, and meanwhile, the single swing arm is operated, the time required for completing one-time dispensing operation is long, so that the die bonder has lower use value.
Disclosure of Invention
The invention discloses a die bonder with a double-swing-arm structure, which aims to solve the technical problems that in the operation process of the existing die bonder, a wafer is adsorbed through an adsorption structure on a swing arm, then the wafer is rotated to a dispensing position, the wafer is placed on the dispensing position, the repeated rotation of a single swing arm is matched with a dispensing mechanism to perform dispensing operation, the single swing arm has the deviation between the dispensing position and the placing position of the wafer, and meanwhile, the single swing arm is operated, so that the time required for one-time dispensing operation is long.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a contain solid brilliant machine of two swing arm structures, includes the operation panel, the top fixedly connected with driving motor two of operation panel, and driving motor two's output shaft passes through shaft coupling fixedly connected with drive shaft two, and the top fixedly connected with installation plectane of drive shaft two, and fixedly connected with two risers on the installation plectane are equipped with two swing arm operating unit on two risers, two swing arm operating unit includes swing arm and No. two swing arms, and swing arm and No. two swing arms are fixedly connected with in the outside of two risers respectively, the top fixedly connected with electric telescopic handle two of installation plectane is kept away from to swing arm, and electric telescopic handle two's output fixedly connected with lifting column, and vacuum adsorption dish has been placed to lifting column below, the top fixedly connected with electric telescopic handle one of installation plectane is kept away from to the swing arm two, and electric telescopic handle one's output fixedly connected with glue the mouth, and the outside that the point glue mouth is close to the bottom passes through flange joint and has the solenoid valve.
Through being provided with double pendulum arm operating unit, wafer adsorption structure and some glued structure have been laid respectively to double pendulum arm below, after driving motor second drive swing arm and No. two swing arms rotate 180, can accomplish a solid brilliant process, simultaneously, be 180 distributions between swing arm and No. two swing arms, after appointed position point is glued and is accomplished, driving motor second rotate 180 back, the wafer can rotate to some glue position top, adjust electric telescopic handle second and drive the wafer and remove to some glue position department, can accomplish solid brilliant operation fast, in this operation process, the circumstances that the deviation appears in some glue position and wafer placement position can not exist, thereby improve solid brilliant efficiency of this solid brilliant machine and reduce the error rate, and then improve the use value of this solid brilliant machine.
In a preferred scheme, the top fixedly connected with glue storage box of No. two swing arms, and one side fixedly connected with pump ring frame of glue storage box, the inside fixedly connected with delivery pump of pump ring frame, the delivery end fixedly connected with conveying pipeline of delivery pump, the conveying pipeline is pegged graft in the inside of point gum mouth, and the feed end of delivery pump passes through the inside of pipe connection in glue storage box.
In a preferred scheme, the outside fixedly connected with link of lift post, and the outside fixedly connected with rotatory rail of link, the inboard fixedly connected with inner frame of rotatory rail, the bottom fixedly connected with driving motor of inner frame is first, driving motor's output shaft passes through shaft coupling fixedly connected with drive shaft is first, the top fixedly connected with connecting rod of drive shaft is first, the both sides of connecting rod are all fixedly connected with rotatory slider, the inside in rotatory rail of equal sliding connection of two rotatory sliders, the outside of two rotatory sliders is all fixedly connected with follow-up frame, vacuum adsorption dish fixedly connected with is in the bottom of one of them follow-up frame, the top fixedly connected with vacuum pump of vacuum adsorption dish is first, the evacuation end of vacuum pump is passed through the inside of vacuum adsorption dish, the bottom of vacuum adsorption dish is opened there is adsorption hole first, the outside fixedly connected with pneumatic cylinder second of another follow-up frame, the output fixedly connected with fixed block of pneumatic cylinder second, the bottom fixedly connected with cavity of fixed block presses the cover, the top fixedly connected with air compressor of cavity press cover, the output of air compressor is through the inside of pipeline connection in cavity press cover, the bottom of cavity press cover is opened.
In a preferred scheme, the top that the operation panel is close to the rotation rail is equipped with the wafer and fills the subassembly, and the wafer fills the subassembly and include the smooth material frame, the outside fixedly connected with mount pad of smooth material frame face below, mount pad fixedly connected with in the top of operation panel, one side fixedly connected with pneumatic cylinder one of mount pad, the output fixedly connected with of pneumatic cylinder one promotes the cushion, the equidistant fixedly connected with buffering arc piece of the inner wall of smooth material frame, the top fixedly connected with locating frame that the mount pad is located smooth material frame below.
Through being provided with the wafer and filling the subassembly, when carrying out solid brilliant operation, adjust the wafer that the pneumatic cylinder is located in the sliding frame and promote to promote the wafer in the locating frame, realize the position location of wafer, simultaneously, when being located the wafer of below and being removed the back, then the wafer on the sliding frame begins to slide downwards, and each buffering arc piece plays a raise cushioning effect, guarantees that the wafer can not appear the circumstances of quick slip and collision damage at the in-process of gliding.
In a preferred scheme, the bottom fixedly connected with grounding frame of operation panel, and the top fixedly connected with of operation panel adjusts rail one, adjusts one side fixedly connected with end plate one of rail one, and one side fixedly connected with cylinder one of end plate one, and the output fixedly connected with of cylinder one adjusts slider one, adjusts slider one sliding connection on adjusting rail one.
In a preferred scheme, the top fixedly connected with of adjusting slider one adjusts the rail two, and adjusts the sliding connection on the rail two and adjust slider two, adjusts the top fixedly connected with of slider two and places the frame, adjusts one side fixedly connected with end plate two of rail two, and end plate two faces one side fixedly connected with cylinder two of adjusting slider two, and the output fixedly connected with of cylinder two is in the outside of adjusting slider two.
In a preferred scheme, the operation panel is located the equal fixedly connected with control base in top at an adjusting rail both ends, and all is equipped with the arm on two control bases, and the equal fixedly connected with of tip of two arms snatchs the mouth, and the absorption hole second has all been opened to the bottom of snatching the mouth, and the top fixedly connected with vacuum pump second of snatch mouth, and the evacuation end of vacuum pump second passes through the pipe connection in the inside of snatching the mouth, and one of them snatchs the outside fixedly connected with frame of mouth, the bottom fixedly connected with industry camera of frame, industry camera's camera face the operation panel.
In a preferred scheme, the operation panel is located first outside department of regulation rail and is equipped with the cooling auxiliary assembly, and the industry camera is kept away from to the cooling auxiliary assembly, and the cooling auxiliary assembly includes the portal frame, and portal frame fixed connection is in the top of operation panel, and the portal frame strides over regulation rail first, and the portal frame is towards the top inner wall fixedly connected with condensation frame of regulation rail first.
In a preferred scheme, the bottom of condensation frame is opened there is the condensation hole, and the top inner wall fixedly connected with two guide plates of condensation frame, the condensation frame is located the inside fixedly connected with condenser pipe between two guide plates, two open ends of condenser pipe are connected with cooling water circulation system, the top fixedly connected with lantern ring of portal frame, the inside fixedly connected with air pump of lantern ring, the inlet end fixedly connected with intake pipe of air pump, the portal frame is close to the top fixedly connected with air filter cartridge of intake pipe, the intake pipe is pegged graft in the inside of air filter cartridge, the gas transmission end of air pump passes through the inside of pipe connection in the condensation frame.
Through being provided with cooling auxiliary assembly, after the solid brilliant operation on same equipment is accomplished, the frame is placed in the cylinder second drive moves to regulation rail second intermediate position, and the cylinder is driven to place the frame and is slided to cooling auxiliary assembly below on regulation rail first, starts the air pump, and the air pump is with gaseous leading-in condensation frame, and the cooling water of circulation in the condenser pipe carries out the cooling to the air and handles, and then through each condensation Kong Guchu, the solidification of glue is accelerated in the bulge of cold gas, avoids the glue solidification to incompletely appear the circumstances that the wafer drops.
A method for operating a die bonder with a double swing arm structure, using a die bonder with a double swing arm structure as described above, comprising the steps of:
step one: placing the equipment needing die bonding in a placing frame, and then adjusting the equipment in two directions through a first cylinder and a second cylinder to enable the die bonding position to move to the position below the dispensing nozzle;
step two: the electromagnetic valve is opened, glue is sprayed out of the glue dispensing nozzle to finish single-position glue dispensing operation, the driving motor II is started, after driving the swing arm I and the swing arm II to rotate 180 degrees, a wafer adsorbed below the vacuum adsorption disc rotates to a die bonding position, the electric telescopic rod II is regulated to drive the wafer to move to the glue dispensing position, the wafer is released to be adsorbed, the wafer falls into the glue, then the driving motor I is started, the driving motor I drives the vacuum adsorption disc and the hollow pressing cover to rotate 180 degrees, the hollow pressing cover is quickly rotated to the upper part of the die bonding position, the air compressor is started, compressed air is blown out through the pressing air holes below the hollow pressing cover, and the wafer is pressed by the compressed air to finish single die bonding operation;
step three: after the die bonding operation on the same equipment is finished, the second air cylinder drives the placing frame to move to the middle position of the second adjusting rail, the first air cylinder drives the placing frame to slide to the lower part of the cooling auxiliary assembly on the first adjusting rail, the air pump is started, the air pump guides air into the condensing frame, cooling water circulated in the condensing pipe cools the air, then the cooling water is blown out through each condensation Kong Guchu to accelerate the solidification of glue, the corresponding mechanical arm operates, the equipment is adsorbed and grabbed, and the cooling water is guided into the next procedure to finish the die bonding operation.
Therefore, the die bonder with the double-swing-arm structure provided by the invention has the advantages that the wafer adsorption structure and the dispensing structure are respectively arranged below the double-swing-arm, when the driving motor II drives the first swing arm and the second swing arm to rotate 180 degrees, the die bonding process can be completed, meanwhile, the first swing arm and the second swing arm are distributed at 180 degrees, after dispensing at the designated position is completed, the wafer can be rotated to the position above the dispensing position after the driving motor II rotates 180 degrees, the electric telescopic rod II is regulated to drive the wafer to move to the position of dispensing, the die bonding operation can be completed quickly, and in the operation process, the condition that deviation exists between the dispensing position and the wafer placement position is avoided, so that the die bonding efficiency of the die bonder is improved, and the technical effect of error rate is reduced.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a die bonder with a dual swing arm structure according to the present invention.
Fig. 2 is a bottom view of the whole structure of a die bonder with a dual swing arm structure according to the present invention.
Fig. 3 is a schematic diagram of a dual swing arm operation assembly of a die bonder with a dual swing arm structure according to the present invention.
Fig. 4 is a schematic diagram of a combination structure of a first swing arm and a rotating rail of a die bonder with a dual swing arm structure according to the present invention.
Fig. 5 is a schematic diagram of a combination structure of a vacuum adsorption tray and a hollow pressing cover of a die bonder with a double-swing-arm structure according to the present invention.
Fig. 6 is a schematic diagram of a cooling auxiliary assembly of a die bonder with a dual swing arm structure according to the present invention.
Fig. 7 is a cross-sectional view of a condensation frame of a die bonder with a dual swing arm structure according to the present invention.
Fig. 8 is a schematic diagram of a combination structure of a first adjusting rail and a second adjusting rail of a die bonder with a double-swing arm structure according to the present invention.
Fig. 9 is a schematic diagram of a wafer filling assembly of a die bonder with a dual swing arm structure according to the present invention.
Fig. 10 is a schematic diagram of a combined structure of a mechanical arm and a gripper nozzle of a die bonder with a dual swing arm structure according to the present invention.
In the figure: 1. an operation table; 2. a wafer filling assembly; 201. a slide frame; 202. a mounting base; 203. buffering the arc piece; 204. a first hydraulic cylinder; 205. pushing the cushion block; 206. a positioning frame; 3. a double swing arm operating assembly; 301. a first swing arm; 302. a second swing arm; 303. a glue storage box; 304. a material conveying pump; 305. a pump ring frame; 306. an electric telescopic rod I; 307. dispensing nozzle; 308. an electromagnetic valve; 309. a rotating rail; 310. lifting columns; 311. an electric telescopic rod II; 312. a connecting frame; 313. a hollow pressing cover; 314. pressing the air hole; 315. driving a first motor; 316. an inner frame; 317. adsorption holes I; 318. a vacuum adsorption plate; 319. a first vacuum pump; 320. a follow-up frame; 321. a first driving shaft; 322. a connecting rod; 323. an air compressor; 324. a fixed block; 325. a second hydraulic cylinder; 326. rotating the slide block; 4. a cooling aid assembly; 401. a portal frame; 402. a condensing frame; 403. an air pump; 404. a collar; 405. an air inlet pipe; 406. an air filter cartridge; 407. a deflector; 408. a condensing tube; 409. a condensing hole; 5. placing a frame; 6. a mechanical arm; 7. an end plate I; 8. adjusting the first rail; 9. a grounding frame; 10. a second driving motor; 11. a second driving shaft; 12. mounting a circular plate; 13. a vertical plate; 14. adjusting a second rail; 15. adjusting a second sliding block; 16. an end plate II; 17. a second cylinder; 18. an adjusting slide block I; 19. a first cylinder; 20. a control base; 21. adsorption holes II; 22. an industrial camera; 23. a frame; 24. a grabbing nozzle; 25. and a vacuum pump II.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
The invention discloses a die bonder with a double-swing-arm structure, which is mainly applied to the prior die bonder in the operation process, wherein a wafer is adsorbed through an adsorption structure on a swing arm, then the wafer is rotated to a dispensing position, the wafer is placed on the dispensing position, the repeated rotation of a single swing arm is matched with a dispensing mechanism to perform the dispensing operation, the single swing arm has the condition that the dispensing position and the wafer placement position deviate, and meanwhile, the single swing arm operates to finish the scene with longer time required by one-time dispensing operation.
Referring to fig. 1-10, a die bonder with a double swing arm structure comprises an operation table 1, wherein a driving motor two 10 is fixedly connected to the top of the operation table 1, an output shaft of the driving motor two 10 is fixedly connected with a driving shaft two 11 through a coupling, a mounting circular plate 12 is fixedly connected to the top of the driving shaft two 11, two vertical plates 13 are fixedly connected to the mounting circular plate 12, a double swing arm operation assembly 3 is arranged on the two vertical plates 13, the double swing arm operation assembly 3 comprises a first swing arm 301 and a second swing arm 302, the first swing arm 301 and the second swing arm 302 are respectively and fixedly connected to the outer sides of the two vertical plates 13, the first swing arm 301 is far away from the top of the mounting circular plate 12 and is fixedly connected with an electric telescopic rod two 311, the output end of the electric telescopic rod two 311 is fixedly connected with a lifting column 310, a vacuum adsorption disc 318 is arranged below the lifting column 310, the second swing arm 302 is far away from the top of the mounting circular plate 12 and is fixedly connected with an electric telescopic rod one 306, the output end of the electric telescopic rod one 306 is fixedly connected with a glue dispensing nozzle 307, and the outer side of the glue dispensing nozzle 307 is close to the bottom end is connected with an electromagnetic valve 308 through a flange.
In a specific application scene, a wafer adsorption structure and a dispensing structure are respectively arranged below the double swing arms, when the driving motor II 10 drives the first swing arm 301 and the second swing arm 302 to rotate 180 degrees, a die bonding process can be completed, meanwhile, the first swing arm 301 and the second swing arm 302 are distributed at 180 degrees, after dispensing at a designated position is completed, the driving motor II 10 rotates 180 degrees, a wafer can rotate to the upper part of a dispensing position, the electric telescopic rod II 311 is adjusted to drive the wafer to move to the dispensing position, die bonding operation can be completed rapidly, and in the operation process, the conditions that deviation occurs between the dispensing position and the wafer placement position are avoided, so that the die bonding efficiency of the die bonding machine is improved, the error rate is reduced, and the use value of the die bonding machine is further improved.
Referring to fig. 1, 2 and 3, in a preferred embodiment, the top of the second swing arm 302 is fixedly connected with a glue storage box 303, one side of the glue storage box 303 is fixedly connected with a pump ring frame 305, the inside of the pump ring frame 305 is fixedly connected with a material conveying pump 304, the material conveying end of the material conveying pump 304 is fixedly connected with a material conveying pipe, the material conveying pipe is inserted into the glue dispensing nozzle 307, and the material feeding end of the material conveying pump 304 is connected to the inside of the glue storage box 303 through a pipeline.
Referring to fig. 1-5, in a preferred embodiment, the outer side of the lifting column 310 is fixedly connected with a connecting frame 312, the outer side of the connecting frame 312 is fixedly connected with a rotating rail 309, the inner side of the rotating rail 309 is fixedly connected with an inner frame 316, the bottom of the inner frame 316 is fixedly connected with a first driving motor 315, an output shaft of the first driving motor 315 is fixedly connected with a first driving shaft 321 through a coupling, the top of the first driving shaft 321 is fixedly connected with a connecting rod 322, both sides of the connecting rod 322 are fixedly connected with rotating sliders 326, both rotating sliders 326 are slidably connected inside the rotating rail 309, the outer sides of both rotating sliders 326 are fixedly connected with a following frame 320, a vacuum suction disc 318 is fixedly connected to the bottom of one of the following frames 320, the top of the vacuum suction disc 318 is fixedly connected with a vacuum pump 319, a vacuumizing end of the vacuum pump 319 is connected inside the vacuum suction disc 318 through a pipeline, the bottom of the vacuum suction disc 318 is provided with a suction hole 317, the outer side of the other following frame 320 is fixedly connected with a second hydraulic cylinder 325, the output end of the second hydraulic cylinder 325 is fixedly connected with a fixed block 324, the bottom of the fixed block 324 is fixedly connected with a hollow air hole 313, and the hollow air outlet 313 is fixedly connected with the hollow air hole 313 is pressed against the hollow cover 313.
Specifically, after the single die bonding operation is completed, the first driving motor 315 is started, the first driving motor 315 drives the vacuum adsorption disc 318 and the hollow pressing cover 313 to rotate 180 degrees, the hollow pressing cover 313 is rapidly rotated to the upper portion of the wafer fixing position, the air compressor 323 is started, compressed air is blown out from the air compressor 323 through the pressing air holes 314 below the hollow pressing cover 313, the compressed air presses the wafer, the bonding degree between the wafer and glue is improved, and accordingly the die bonding effect is improved.
Referring to fig. 1, 2 and 9, in a preferred embodiment, the top of the operation table 1 near the rotation rail 309 is provided with a wafer filling assembly 2, and the wafer filling assembly 2 includes a slide frame 201, an outer side of the slide frame 201 facing downward is fixedly connected with a mounting seat 202, the mounting seat 202 is fixedly connected to the top of the operation table 1, one side of the mounting seat 202 is fixedly connected with a first hydraulic cylinder 204, an output end of the first hydraulic cylinder 204 is fixedly connected with a pushing cushion block 205, an inner wall of the slide frame 201 is fixedly connected with a buffer arc piece 203 at equal distance, and a top of the mounting seat 202 below the slide frame 201 is fixedly connected with a positioning frame 206.
It should be noted that, during the die bonding operation, the first hydraulic cylinder 204 is adjusted to drive the wafer located in the slide frame 201 to push, so as to push the wafer into the positioning frame 206, to position the wafer, and meanwhile, when the lowest wafer is removed, the wafer on the slide frame 201 begins to slide downwards, and each buffer arc piece 203 plays a role in lifting and buffering, so that the wafer is ensured not to slide quickly and collide and be damaged in the process of sliding downwards.
Referring to fig. 1, 2 and 8, in a preferred embodiment, the bottom of the console 1 is fixedly connected with the grounding frame 9, the top of the console 1 is fixedly connected with the first adjusting rail 8, one side of the first adjusting rail 8 is fixedly connected with the first end plate 7, one side of the first end plate 7 is fixedly connected with the first cylinder 19, the output end of the first cylinder 19 is fixedly connected with the first adjusting slide block 18, the first adjusting slide block 18 is slidably connected to the first adjusting rail 8, the top of the first adjusting slide block 18 is fixedly connected with the second adjusting rail 14, the second adjusting slide block 14 is slidably connected with the second adjusting slide block 15, the top of the second adjusting slide block 15 is fixedly connected with the placement frame 5, one side of the second adjusting rail 14 is fixedly connected with the second end plate 16, one side of the second end plate 16 facing the second adjusting slide block 15 is fixedly connected with the second cylinder 17, and the output end of the second cylinder 17 is fixedly connected to the outer side of the second adjusting slide block 15.
Referring to fig. 1, 2 and 10, in a preferred embodiment, the top of the console 1 at two ends of the first adjusting rail 8 is fixedly connected with the control bases 20, the two control bases 20 are respectively provided with the mechanical arms 6, the end parts of the two mechanical arms 6 are respectively fixedly connected with the grabbing nozzles 24, the bottoms of the grabbing nozzles 24 are respectively provided with the second adsorption holes 21, the top of the grabbing nozzles 24 is fixedly connected with the second vacuum pump 25, the vacuumizing end of the second vacuum pump 25 is connected to the inside of the grabbing nozzles 24 through a pipeline, the outer side of one grabbing nozzle 24 is fixedly connected with the frame 23, the bottom of the frame 23 is fixedly connected with the industrial camera 22, and the lens of the industrial camera 22 faces the console 1.
Referring to fig. 1, 2, 6 and 7, in a preferred embodiment, the operation table 1 is provided with a cooling auxiliary assembly 4 at the outer side of the first adjusting rail 8, and the cooling auxiliary assembly 4 is far away from the industrial camera 22, the cooling auxiliary assembly 4 comprises a portal frame 401, the portal frame 401 is fixedly connected to the top of the operation table 1, the portal frame 401 spans the first adjusting rail 8, the top inner wall of the portal frame 401 facing the first adjusting rail 8 is fixedly connected with a condensation frame 402, the bottom of the condensation frame 402 is provided with a condensation hole 409, the top inner wall of the condensation frame 402 is fixedly connected with two guide plates 407, the inside of the condensation frame 402 between the two guide plates 407 is fixedly connected with a condensation pipe 408, two open ends of the condensation pipe 408 are connected with a cooling water circulation system, the top of the portal frame 401 is fixedly connected with a collar 404, the inside of the collar 404 is fixedly connected with an air pump 403, the air inlet pipe 405 is fixedly connected to the top of the portal frame 401 near the air inlet pipe 405, the air inlet pipe 405 is spliced in the inside of the air filter cylinder 406, and the air delivery end of the air pump 403 is connected to the inside of the condensation frame 402 through a pipeline.
Specifically, after the die bonding operation on the same equipment is completed, the second cylinder 17 drives the placing frame 5 to move to the middle position of the second adjusting rail 14, the first cylinder 19 drives the placing frame 5 to slide to the lower part of the cooling auxiliary assembly 4 on the first adjusting rail 8, the air pump 403 is started, the air pump 403 guides air into the condensing frame 402, cooling water circulated in the condensing pipe 408 cools the air, and then the air is bulged through each condensing hole 409, so that solidification of glue is accelerated by bulge of the cold air, and the situation that a wafer falls off due to incomplete solidification of the glue is avoided.
The operation method of the die bonder with the double-swing-arm structure comprises the following steps of:
step one: placing the equipment needing die bonding in the placement frame 5, and then adjusting the equipment in two directions through a first cylinder 19 and a second cylinder 17 to enable the die bonding position to move to the position below the dispensing nozzle 307;
step two: the solenoid valve 308 is opened, glue is sprayed out of the glue dispensing nozzle 307 to finish single-position glue dispensing operation, the driving motor II 10 is started, after the driving motor II 10 drives the first swing arm 301 and the second swing arm 302 to rotate 180 degrees, the wafer adsorbed below the vacuum adsorption disc 318 rotates to the die bonding position, the electric telescopic rod II 311 is regulated to drive the wafer to move to the glue dispensing position, the adsorption of the wafer is released, the wafer falls into the glue, the driving motor I315 is started, the driving motor I315 drives the vacuum adsorption disc 318 and the hollow pressing cover 313 to rotate 180 degrees, the hollow pressing cover 313 is quickly rotated to the upper part of the wafer fixing position, the air compressor 323 is started, compressed air is blown out through the pressing air hole 314 below the hollow pressing cover 313, and the compressed air compressor 323 presses the wafer to finish single-time die bonding operation;
step three: after the die bonding operation on the same equipment is completed, the second cylinder 17 drives the placing frame 5 to move to the middle position of the second adjusting rail 14, the first cylinder 19 drives the placing frame 5 to slide to the lower part of the cooling auxiliary assembly 4 on the first adjusting rail 8, the air pump 403 is started, the air pump 403 guides air into the condensing frame 402, cooling water circulated in the condensing pipe 408 cools the air, then the air is bulged through each condensing hole 409, solidification of glue is accelerated by bulge of the cold air, the corresponding mechanical arm 6 operates, the equipment is adsorbed and grabbed, and the air is guided into the next procedure to complete the die bonding operation.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. A die bonder with a double-swing arm structure, which comprises an operation table (1) and is characterized in that, a second driving motor (10) is fixedly connected to the top of the operating platform (1), and the output shaft of the second driving motor (10) is fixedly connected with a second driving shaft (11) through a coupling, the top of the second driving shaft (11) is fixedly connected with a mounting circular plate (12), the mounting circular plate (12) is fixedly connected with two vertical plates (13), the two vertical plates (13) are provided with double swing arm operation assemblies (3), the double-swing-arm operation assembly (3) comprises a first swing arm (301) and a second swing arm (302), and the first swing arm (301) and the second swing arm (302) are respectively and fixedly connected to the outer sides of the two vertical plates (13), an electric telescopic rod II (311) is fixedly connected with the top of the first swing arm (301) far away from the mounting circular plate (12), and the output end of the electric telescopic rod II (311) is fixedly connected with a lifting column (310), a vacuum adsorption disc (318) is arranged below the lifting column (310), an electric telescopic rod I (306) is fixedly connected to the top of the second swing arm (302) far away from the mounting circular plate (12), and the output end of the first electric telescopic rod (306) is fixedly connected with a dispensing nozzle (307), and the outer side of the dispensing nozzle (307) close to the bottom end is connected with an electromagnetic valve (308) through a flange.
2. The die bonder with the double-swing-arm structure according to claim 1, wherein the top of the second swing arm (302) is fixedly connected with a glue storage box (303), one side of the glue storage box (303) is fixedly connected with a pump ring frame (305), the inside of the pump ring frame (305) is fixedly connected with a material conveying pump (304), the material conveying end of the material conveying pump (304) is fixedly connected with a material conveying pipe, the material conveying pipe is inserted into the inside of the glue dispensing nozzle (307), and the material feeding end of the material conveying pump (304) is connected into the inside of the glue storage box (303) through a pipeline.
3. The die bonder with the double-swing-arm structure according to claim 2, wherein the outer side of the lifting column (310) is fixedly connected with a connecting frame (312), the outer side of the connecting frame (312) is fixedly connected with a rotating rail (309), the inner side of the rotating rail (309) is fixedly connected with an inner frame (316), the bottom of the inner frame (316) is fixedly connected with a first driving motor (315), an output shaft of the first driving motor (315) is fixedly connected with a first driving shaft (321) through a coupling, the top of the first driving shaft (321) is fixedly connected with a connecting rod (322), both sides of the connecting rod (322) are fixedly connected with rotating sliding blocks (326), both sides of the two rotating sliding blocks (326) are fixedly connected with a following frame (320), a vacuum adsorption disc (318) is fixedly connected with the bottom of one following frame (320), the top of the vacuum adsorption disc (318) is fixedly connected with a first vacuum pump (319), a vacuumizing end of the first vacuum pump (319) is connected with the inner side of the vacuum adsorption disc (318) through a pipeline, both sides of the two rotating sliding blocks (326) are fixedly connected with the outer sides of the other following frame (325) and the other side of the two rotating sliding blocks (325) are fixedly connected with the other following frame (325), the bottom fixedly connected with of fixed block (324) is pressed cover (313), and the top fixedly connected with air compressor machine (323) of cover (313) is pressed to the cavity, and the output of air compressor machine (323) is pressed the inside of cover (313) through the pipe connection in the cavity, and the bottom that cover (313) was pressed to the cavity is opened has and is pressed gas pocket (314).
4. The die bonder with the double-swing-arm structure according to claim 3, wherein the top of the operation table (1) close to the rotating rail (309) is provided with a wafer filling assembly (2), the wafer filling assembly (2) comprises a sliding frame (201), an installation seat (202) is fixedly connected to the outer side of the sliding frame (201) facing downwards, the installation seat (202) is fixedly connected to the top of the operation table (1), a hydraulic cylinder I (204) is fixedly connected to one side of the installation seat (202), the output end of the hydraulic cylinder I (204) is fixedly connected with a pushing cushion block (205), buffer arc pieces (203) are fixedly connected to the inner wall of the sliding frame (201) at equal intervals, and a positioning frame (206) is fixedly connected to the top of the installation seat (202) below the sliding frame (201).
5. The die bonder with the double-swing-arm structure according to claim 4, wherein the bottom of the operation table (1) is fixedly connected with a grounding frame (9), the top of the operation table (1) is fixedly connected with an adjusting rail I (8), one side of the adjusting rail I (8) is fixedly connected with an end plate I (7), one side of the end plate I (7) is fixedly connected with a cylinder I (19), the output end of the cylinder I (19) is fixedly connected with an adjusting slide block I (18), and the adjusting slide block I (18) is slidably connected to the adjusting rail I (8).
6. The die bonder with the double-swing-arm structure according to claim 5, wherein the top of the first adjusting slide block (18) is fixedly connected with a second adjusting rail (14), the second adjusting slide block (15) is connected to the second adjusting rail (14) in a sliding manner, the top of the second adjusting slide block (15) is fixedly connected with a placement frame (5), one side of the second adjusting rail (14) is fixedly connected with a second end plate (16), one side of the second end plate (16) facing the second adjusting slide block (15) is fixedly connected with a second air cylinder (17), and the output end of the second air cylinder (17) is fixedly connected to the outer side of the second adjusting slide block (15).
7. The die bonder with the double swing arm structure according to claim 6, wherein the operation table (1) is located at the top of two ends of the first adjusting rail (8) and is fixedly connected with the control base (20), mechanical arms (6) are arranged on the two control bases (20), the end parts of the two mechanical arms (6) are fixedly connected with the grabbing nozzles (24), the bottoms of the grabbing nozzles (24) are provided with the second adsorption holes (21), the top of the grabbing nozzles (24) is fixedly connected with the second vacuum pump (25), the vacuumizing end of the second vacuum pump (25) is connected to the inside of the grabbing nozzles (24) through a pipeline, one grabbing nozzle (24) is fixedly connected with the rack (23) at the outer side, the bottom of the rack (23) is fixedly connected with the industrial camera (22), and the lens of the industrial camera (22) faces the operation table (1).
8. The die bonder with the double swing arm structure according to claim 7, wherein the operation table (1) is provided with a cooling auxiliary assembly (4) at the outer side of the first adjusting rail (8), the cooling auxiliary assembly (4) is far away from the industrial camera (22), the cooling auxiliary assembly (4) comprises a portal frame (401), the portal frame (401) is fixedly connected to the top of the operation table (1), the portal frame (401) spans the first adjusting rail (8), and a condensation frame (402) is fixedly connected to the inner wall of the top of the portal frame (401) facing the first adjusting rail (8).
9. The die bonder with the double swing arm structure according to claim 8, wherein a condensation hole (409) is formed in the bottom of the condensation frame (402), two guide plates (407) are fixedly connected to the inner wall of the top of the condensation frame (402), a condensation pipe (408) is fixedly connected to the inside of the condensation frame (402) between the two guide plates (407), a cooling water circulation system is connected to two opening ends of the condensation pipe (408), a lantern ring (404) is fixedly connected to the top of the portal frame (401), an air pump (403) is fixedly connected to the inside of the lantern ring (404), an air inlet pipe (405) is fixedly connected to the air inlet end of the air pump (403), an air filter cylinder (406) is fixedly connected to the top of the portal frame (401) close to the air inlet pipe (405), the air inlet pipe (405) is inserted into the air filter cylinder (406), and the air delivery end of the air pump (403) is connected to the inside of the condensation frame (402) through a pipeline.
10. A method of operating a die bonder having a dual swing arm structure using a die bonder having a dual swing arm structure as defined in claim 9, said method comprising the steps of:
step one: placing the equipment needing die bonding in a placement frame (5), and then adjusting the equipment in two directions through a first cylinder (19) and a second cylinder (17) to enable the die bonding position to move to the position below a dispensing nozzle (307);
step two: the electromagnetic valve (308) is opened, glue is sprayed out of the glue dispensing nozzle (307) to finish single-position glue dispensing operation, the driving motor II (10) is started, the driving motor II (10) drives the first swing arm (301) and the second swing arm (302) to rotate 180 degrees, then the wafer adsorbed below the vacuum adsorption disc (318) rotates to the die bonding position, the electric telescopic rod II (311) is regulated to drive the wafer to move to the glue dispensing position, the adsorption of the wafer is released, the wafer falls into the glue, then the driving motor I (315) is started, the driving motor I (315) drives the vacuum adsorption disc (318) and the hollow pressing cover (313) to rotate 180 degrees, the hollow pressing cover (313) is quickly rotated to the upper part of the wafer fixing position, the air compressor (323) is started, the air compressor (323) presses the wafer through the pressing air hole (314) below the hollow pressing cover (313), and single die bonding operation is finished;
step three: after the die bonding operation on the same equipment is finished, the second air cylinder (17) drives the placing frame (5) to move to the middle position of the second adjusting rail (14), the first air cylinder (19) drives the placing frame (5) to slide below the cooling auxiliary assembly (4) on the first adjusting rail (8), the air pump (403) is started, the air pump (403) guides air into the condensing frame (402), cooling water circulated in the condensing pipe (408) cools the air, and then bulges out through each condensing hole (409), the bulge of the cold air accelerates the solidification of glue, the corresponding mechanical arm (6) operates, the equipment is adsorbed and grabbed, and the next procedure is guided into, so that the die bonding operation is finished.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311801689.3A CN117457551B (en) | 2023-12-26 | 2023-12-26 | Die bonder with double-swing-arm structure and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311801689.3A CN117457551B (en) | 2023-12-26 | 2023-12-26 | Die bonder with double-swing-arm structure and method |
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| CN117457551B CN117457551B (en) | 2024-03-01 |
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| CN102709214A (en) * | 2012-05-07 | 2012-10-03 | 深圳翠涛自动化设备股份有限公司 | Multihead rotary chip bonder |
| CN103367183A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Double-swing-arm die bonder welding head mechanism and die bonder |
| CN103871910A (en) * | 2014-03-15 | 2014-06-18 | 深圳翠涛自动化设备股份有限公司 | Glue coating crystal solidifying equipment |
| CN113921434A (en) * | 2021-09-23 | 2022-01-11 | 苏州斯尔特微电子有限公司 | High-efficiency automatic feeding and discharging die bonding device of LED die bonder and die bonding method thereof |
| CN117096066A (en) * | 2023-10-17 | 2023-11-21 | 深圳新控半导体技术有限公司 | Full-automatic coil stock high-speed high-precision eutectic and dispensing switchable equipment |
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2023
- 2023-12-26 CN CN202311801689.3A patent/CN117457551B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709214A (en) * | 2012-05-07 | 2012-10-03 | 深圳翠涛自动化设备股份有限公司 | Multihead rotary chip bonder |
| CN103367183A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Double-swing-arm die bonder welding head mechanism and die bonder |
| CN103871910A (en) * | 2014-03-15 | 2014-06-18 | 深圳翠涛自动化设备股份有限公司 | Glue coating crystal solidifying equipment |
| CN113921434A (en) * | 2021-09-23 | 2022-01-11 | 苏州斯尔特微电子有限公司 | High-efficiency automatic feeding and discharging die bonding device of LED die bonder and die bonding method thereof |
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| CN117457551B (en) | 2024-03-01 |
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