CN117440919A - Container for wired circuit board - Google Patents
Container for wired circuit board Download PDFInfo
- Publication number
- CN117440919A CN117440919A CN202280040864.9A CN202280040864A CN117440919A CN 117440919 A CN117440919 A CN 117440919A CN 202280040864 A CN202280040864 A CN 202280040864A CN 117440919 A CN117440919 A CN 117440919A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- wired circuit
- container
- accommodated
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004308 accommodation Effects 0.000 claims description 32
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
A wired circuit board container (1) for accommodating a wired circuit board (C) is provided with: a housing section (2A) capable of housing 1 wired circuit board (C); and a protrusion (23A) which is disposed in the housing portion (2A), wherein the protrusion (23A) extends in the thickness direction of the wired circuit board (C) in a state in which the wired circuit board (C) is housed in the housing portion (2A), and wherein the protrusion (23A) faces the edge (E1) of the wired circuit board (C) in a direction orthogonal to the thickness direction of the wired circuit board (C) in a state in which the wired circuit board (C) is housed in the housing portion (2A).
Description
Technical Field
The present invention relates to a container for a wired circuit board.
Background
Conventionally, a container for accommodating a wired circuit board is known. The container has a bottom wall and a peripheral side wall extending upwardly from a peripheral edge of the bottom wall. The wired circuit board has an extension portion constituted by an insulating layer. When the wired circuit board moves in the container, the protruding portion of the wired circuit board contacts the peripheral side wall. This suppresses contact between the peripheral edge of the metal support layer and the peripheral side wall, and suppresses generation of foreign matter due to contact between the peripheral edge of the metal support layer and the peripheral side wall (for example, refer to patent document 1 below).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2021-34481
Disclosure of Invention
Problems to be solved by the invention
In the case of the container disclosed in patent document 1, when a wired circuit board having no protruding portion is accommodated, the occurrence of foreign matter may not be suppressed.
Therefore, it is sometimes desirable to provide a container capable of suppressing the generation of foreign matter regardless of the presence or absence of the protruding portion of the wired circuit board.
The invention provides a container for a wired circuit board, which can inhibit foreign matters from being generated due to contact between the edge of the wired circuit board and a containing part.
Solution for solving the problem
The present invention [1] provides a wired circuit board container for accommodating a wired circuit board, the wired circuit board container comprising: a housing section capable of housing 1 wired circuit board; and a projection disposed in the accommodating portion, the projection extending in a thickness direction of the wired circuit board in a state where the wired circuit board is accommodated in the accommodating portion, the projection facing an edge of the wired circuit board in a direction orthogonal to the thickness direction of the wired circuit board in a state where the wired circuit board is accommodated in the accommodating portion.
With this configuration, when the wired circuit board is accommodated in the accommodating portion and conveyed, the movement of the wired circuit board in the accommodating portion can be prevented by the projection.
Therefore, contact between the edge of the wired circuit board and the side wall of the accommodating portion can be reduced.
As a result, the occurrence of foreign matter due to contact between the edge of the wiring circuit board and the side wall of the housing portion can be suppressed.
In the case of the wired circuit board container according to the above [1], the housing portion has a side wall facing the edge at an interval in a state where the wired circuit board is housed in the housing portion, and the projection is arranged between the edge and the side wall in a state where the wired circuit board is housed in the housing portion.
With this configuration, contact between the edge of the wired circuit board and the side wall of the housing portion can be suppressed by the projection.
In the invention [3], in addition to the wired circuit board container of [2], the housing portion has a bottom wall, and the projection has an inclined surface inclined in a direction away from the side wall as approaching the bottom wall.
With this configuration, when the wired circuit board is accommodated in the accommodating portion, the wired circuit board can be guided in a direction away from the side wall by the inclined surface.
As a result, even when the wired circuit board is accommodated in the accommodating portion, contact between the edge of the wired circuit board and the side wall of the accommodating portion can be suppressed.
In the invention [4] in addition to the wired circuit board container of [3], the housing portion has a housing area for housing the wired circuit board, the protrusion is disposed outside the housing area, and the inclined surface is capable of guiding the wired circuit board toward the housing area when the wired circuit board is housed in the housing portion.
With this configuration, the wired circuit board can be reliably accommodated in the accommodation region.
The invention [5] is the wired circuit board container according to any one of [1] to [4], wherein the wired circuit board has a plurality of the edges, and the wired circuit board container has at least 1 protrusion with respect to each of the plurality of the edges.
With this structure, contact with the side wall of the accommodating portion can be suppressed at all edges of the plurality of edges.
Therefore, the occurrence of foreign matter due to contact between the edge of the wiring circuit board and the side wall of the housing portion can be further suppressed.
In the invention [6] the container for wired circuit board according to any one of [1] to [5], the housing portion has a bottom wall having an opening, and the opening is used when the wired circuit board housed in the housing portion is inspected.
With this configuration, the wired circuit board can be inspected through the opening in a state where the wired circuit board is accommodated in the accommodating portion.
In the invention [7] the container for a wired circuit board according to [6], wherein the part of the edge overlaps the opening in the thickness direction of the wired circuit board in a state where the wired circuit board is accommodated in the accommodating portion.
With this configuration, the edge of the wired circuit board can be inspected through the opening in a state where the wired circuit board is accommodated in the accommodating portion.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the container for wired circuit board of the present invention, the occurrence of foreign matter due to contact between the edge of the wired circuit board and the side wall of the housing portion can be suppressed.
Drawings
Fig. 1 is a plan view of a wired circuit board container according to an embodiment of the present invention.
Fig. 2 is a perspective view of the accommodating portion shown in fig. 1.
Fig. 3 is a plan view showing a state in which the wired circuit board is accommodated in the accommodation portion shown in fig. 2.
Fig. 4 is a cross-sectional view of the wired circuit board container shown in fig. 3.
Detailed Description
1. Wired circuit board container
As shown in fig. 1, the wired circuit board container 1 includes at least 1 accommodating portion 2. In the present embodiment, the wired circuit board container 1 has a plurality of storage sections 2.
Each of the plurality of housing portions 2 is capable of housing 1 wired circuit board C. That is, the wired circuit board container 1 can accommodate a plurality of wired circuit boards C. The plurality of receiving parts 2 are arranged in the 1 st and 2 nd directions. The 2 nd direction is orthogonal to the 1 st direction. The 1 st direction and the 2 nd direction are orthogonal to the up-down direction. The wired circuit board C has a thickness in the up-down direction in a state where the wired circuit board C is accommodated in the accommodating portion 2. That is, in a state where the wired circuit board C is accommodated in the accommodating portion 2, the 1 st direction and the 2 nd direction are orthogonal to the thickness direction of the wired circuit board C. In the following, 1 storage unit 2A out of the plurality of storage units 2 will be described as an example.
As shown in fig. 2 and 3, in the present embodiment, the accommodating portion 2A has a rectangular shape. The shape of the housing portion 2A is not limited. The housing portion 2A has a housing area a, a plurality of side walls 21A, 21B, 21C, 21D, a bottom wall 22, and a plurality of protrusions 23A, 23B, 23C, 23D. In other words, the wired circuit board container 1 has a plurality of projections 23A, 23B, 23C, 23D.
(1) Accommodation region
The accommodation region a is a region accommodating the wired circuit board C. The accommodation area a is arranged in the center of the accommodation portion 2. The shape of the accommodation area a is the same as that of the wired circuit board C. In the present embodiment, the wired circuit board C has a rectangular shape. The wired circuit board C has a plurality of edges E1, E2, E3, E4.
In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the edge E1 is disposed at one end portion of the wired circuit board C in the 1 st direction. The edge E1 extends in the 2 nd direction.
In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the edge E2 is disposed at the other end portion of the wired circuit board C in the 1 st direction. The edge E2 extends in the 2 nd direction.
In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the edge E3 is disposed at one end portion of the wired circuit board C in the 2 nd direction. The edge E3 extends in the 1 st direction.
In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the edge E4 is disposed at the other end portion of the wired circuit board C in the 2 nd direction. The edge E4 extends in the 1 st direction.
(2) Side wall
The side wall 21A is disposed at one end of the accommodating portion 2 in the 1 st direction. The side wall 21A extends in the 2 nd direction. In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the side wall 21A faces the edge E1 of the wired circuit board C with a space therebetween in the 1 st direction. In addition, the side wall 21A separates two accommodation portions 2A, 2B adjacent in the 1 st direction.
The side wall 21B is disposed at the other end portion of the accommodating portion 2A in the 1 st direction. The side wall 21B extends in the 2 nd direction. In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the side wall 21B faces the edge E2 of the wired circuit board C with a space therebetween in the 1 st direction. In addition, the side wall 21B separates the two accommodation portions 2A, 2C adjacent in the 1 st direction.
The side wall 21C is disposed at one end of the accommodating portion 2A in the 2 nd direction. The side wall 21C extends in the 1 st direction. In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the side wall 21C faces the edge E3 of the wired circuit board C with a space therebetween in the 2 nd direction. In addition, the side wall 21C separates the two accommodation portions 2A, 2D adjacent in the 2 nd direction.
The side wall 21D is disposed at the other end portion of the accommodating portion 2A in the 2 nd direction. The side wall 21D extends in the 1 st direction. In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the side wall 21D faces the edge E4 of the wired circuit board C with a space therebetween in the 2 nd direction. In addition, the side wall 21D separates the two accommodation portions 2A, 2E adjacent in the 1 st direction.
(3) Bottom wall
As shown in fig. 4, the bottom wall 22 is disposed at the lower end of the housing portion 2A. The bottom wall 22 contacts the wired circuit board C in a state where the wired circuit board C is accommodated in the accommodating portion 2A. The bottom wall 22 supports the wired circuit board C in a state where the wired circuit board C is accommodated in the accommodating portion 2A. The bottom wall 22 extends in the 1 st and 2 nd directions. The bottom wall 22 has a plurality of openings 221A, 221B, 221C. The openings 221A, 221B, 221C are used for inspecting the wired circuit board C accommodated in the accommodating portion 2.
The opening 221A is used, for example, to check whether or not burrs are formed on the edge E1 of the wired circuit board C. The opening 221A is disposed at one end of the accommodation area a in the 1 st direction. In a state where the wired circuit board C is accommodated in the accommodating portion 2A, a part of the edge E1 overlaps the opening 221A in the thickness direction of the wired circuit board C.
The opening 221B is used, for example, to check whether or not burrs are formed on the edge E2 of the wired circuit board C. The opening 221B is disposed at the other end portion of the accommodation area a in the 1 st direction. In a state where the wired circuit board C is accommodated in the accommodating portion 2A, a part of the edge E2 overlaps the opening 221B in the thickness direction of the wired circuit board C.
The opening 221C is used, for example, for checking the position of the wired circuit board C in the housing portion 2A. The opening 221C is disposed at the other end portion of the accommodation area a in the 2 nd direction. In a state where the wired circuit board C is accommodated in the accommodating portion 2, a part of the edge E4 overlaps the opening 221C in the thickness direction of the wired circuit board C. The opening 221C has a rectangular shape. In a state where the wired circuit board C is properly accommodated in the accommodating portion 2, the edge E4 of the wired circuit board C extends along the edge of the opening 221C. Therefore, by confirming the degree of parallelism between the edge of the opening 221C and the edge E4 of the wired circuit substrate C, it is possible to check whether the wired circuit substrate C is accommodated obliquely.
The inspection using the openings 221A, 221B, 221C is not limited. The positions and sizes of the openings 221A, 221B, 221C are not limited. The positions and sizes of the openings 221A, 221B, 221C can be appropriately changed according to the inspection.
(4) Protrusions
In the wired circuit board container 1, at least 1 protrusion is provided for each of the plurality of edges E1, E2, E3, E4. In the present embodiment, the wired circuit board container 1 has two protrusions 23A with respect to the edge E1, two protrusions 23B with respect to the edge E2, two protrusions 23C with respect to the edge E3, and 1 protrusion 23D with respect to the edge E4. The plurality of projections 23A, 23B, 23C, 23D are disposed in the housing portion 2A. The plurality of projections 23A, 23B, 23C, 23D are arranged outside the accommodation area a.
In a state where the wired circuit board C is accommodated in the accommodation portion 2A, the projection 23A faces the edge E1 of the wired circuit board C in the 1 st direction. In the state where the wired circuit board C is accommodated in the accommodating portion 2A, the projection 23A is arranged between the edge E1 and the side wall 21A in the 1 st direction. In the present embodiment, the projection 23A is connected to the side wall 21A. The projection 23A is disposed on the opposite side of the side wall 21A from the projection 23B of the accommodating portion 2C. The projection 23A is aligned with the projection 23B of the accommodating portion 2C in the 1 st direction. The projection 23A is disposed at the same position as the projection 23B of the accommodating portion 2C in the 2 nd direction. Further, the projection 23A may be separated from the side wall 21A. The two protrusions 23A are arranged in the 2 nd direction with a space therebetween. The number of the protrusions 23A is not limited.
As shown in fig. 4, the projection 23A extends in the up-down direction. The projection 23A extends in the thickness direction of the wired circuit board C in a state where the wired circuit board C is accommodated in the accommodating portion 2A. In the present embodiment, the lower end portion of the projection 23A is connected to the bottom wall 22. Further, the lower end portion of the projection 23A may be separated from the bottom wall 22. The projection 23A has an inclined surface 231.
The inclined surface 231 is a side surface of the projection 23A on the accommodating area a side. The inclined surface 231 extends from the upper end portion to the lower end portion of the protrusion 23A. The inclined surface 231 is inclined in a direction away from the side wall 21A as approaching the bottom wall 22. Thus, when accommodating the wired circuit board C in the accommodating portion 2A, the inclined surface 231 can guide the wired circuit board C toward the accommodating area a.
The description about the protrusions 23B, 23C, 23D is the same as the description about the protrusion 23A. Therefore, the description about the protrusions 23B, 23C, 23D is omitted.
2. Effects of action
(1) According to the wired circuit board container 1, as shown in fig. 3, in a state where the wired circuit board C is accommodated in the accommodating portion 2A, the projection 23A faces the edge E1 of the wired circuit board C in the 1 st direction (the direction orthogonal to the thickness direction of the wired circuit board C).
Therefore, when the wired circuit board C is accommodated in the accommodating portion 2A and conveyed, the movement of the wired circuit board C in the accommodating portion 2A can be prevented by the projection 23A.
This can reduce contact between the edge E1 of the wired circuit board C and the side wall 21A of the housing portion 2A.
As a result, the occurrence of foreign matter due to contact between the edge E1 of the wired circuit board C and the side wall 21A of the housing portion 2A can be suppressed.
(2) According to the wired circuit board container 1, as shown in fig. 3, the projection 23A is disposed between the edge E1 and the side wall 21A in a state where the wired circuit board C is accommodated in the accommodating portion 2A.
Therefore, the edge E1 of the wired circuit board C can be restrained from contacting the side wall 21A of the housing portion 2A by the projection 23A.
(3) According to the wired circuit board container 1, as shown in fig. 4, the projection 23A has an inclined surface 231. The inclined surface 231 is inclined in a direction away from the side wall 21A as approaching the bottom wall 22.
Therefore, when accommodating the wired circuit board C in the accommodating portion 2A, the wired circuit board C can be guided in a direction away from the side wall 21A by the inclined surface 231.
As a result, even when the printed circuit board C is accommodated in the accommodating portion 2A, the edge E1 of the printed circuit board C can be prevented from coming into contact with the side wall 21A of the accommodating portion 2A.
(4) According to the wired circuit board container 1, as shown in fig. 3 and 4, when the wired circuit board C is accommodated in the accommodation portion 2A, the inclined surface 231 can guide the wired circuit board C toward the accommodation area a.
Accordingly, the wired circuit board C can be reliably accommodated in the accommodation area a.
(5) As shown in fig. 3, the wired circuit board container 1 has at least 1 protrusion 23 (protrusions 23A, 23B, 23C, 23D) for each of the plurality of edges E1, E2, E3, E4.
Therefore, contact with the side walls 21 (side walls 21A, 21B, 21C, 21D) of the housing portion 2A can be suppressed at all edges of the plurality of edges E1, E2, E3, E4.
Therefore, the occurrence of foreign matter due to contact between the edges E1, E2, E3, E4 of the wired circuit board C and the side wall 21 of the housing portion 2A can be further suppressed.
(6) According to the wired circuit board container 1, as shown in fig. 3, the bottom wall 22 has openings 221A, 221B, 221C. The openings 221A, 221B, 221C are used for inspecting the wired circuit board C accommodated in the accommodating portion 2A.
Accordingly, in a state where the wired circuit board C is accommodated in the accommodation portion 2A, the wired circuit board C can be inspected through the openings 221A, 221B, 221C.
(7) According to the wired circuit board container 1, as shown in fig. 3, in a state where the wired circuit board C is accommodated in the accommodating portion 2A, a part of the edge E1 overlaps the opening 221A and a part of the edge E2 overlaps the opening 221B in the thickness direction of the wired circuit board C.
Accordingly, in a state where the wired circuit board C is accommodated in the accommodation portion 2A, the edge E1 of the wired circuit board C can be inspected through the opening 221A, and the edge E2 of the wired circuit board C can be inspected through the opening 221B.
The above-described invention is provided as an exemplary embodiment of the present invention, but this is merely an example and not intended to limit the present invention. Variations of the present invention that are obvious to those skilled in the art are encompassed by the foregoing claims.
Industrial applicability
The container for wired circuit board of the present invention is used for accommodating a wired circuit board.
Description of the reference numerals
1. A container for wiring a circuit board; 2A, a containing part; 21A, sidewalls; 21B, sidewalls; 21C, sidewalls; 21D, sidewalls; 22. a bottom wall; 23A, protrusions; 23B, protrusions; 23C, protrusions; 23D, protrusions; 221A, openings; 221B, openings; 221C, openings; 231. an inclined surface; A. a receiving area; C. a wired circuit board; e1, edges; e2, edges; e3, edges; and E4, edge.
Claims (7)
1. A container for a wired circuit board for accommodating a wired circuit board, wherein,
the wired circuit board container is provided with:
a housing section capable of housing 1 wired circuit board; and
a projection disposed in the accommodating portion, the projection extending in a thickness direction of the wired circuit board in a state where the wired circuit board is accommodated in the accommodating portion,
in a state where the wired circuit board is accommodated in the accommodation portion, the projection faces an edge of the wired circuit board in a direction orthogonal to a thickness direction of the wired circuit board.
2. The container for wired circuit board according to claim 1, wherein,
the housing portion has a side wall facing the edge with a space therebetween in a state where the wired circuit board is housed in the housing portion,
the projection is disposed between the edge and the side wall in a state where the wired circuit board is accommodated in the accommodating portion.
3. The container for wired circuit board according to claim 2, wherein,
the receiving portion has a bottom wall and,
the protrusion has an inclined surface inclined in a direction away from the side wall as approaching the bottom wall.
4. The container for wired circuit board according to claim 3, wherein,
the housing portion has a housing area for housing the wired circuit board,
the protrusions are disposed outside the receiving area,
the inclined surface can guide the wired circuit board toward the accommodation area when the wired circuit board is accommodated in the accommodation portion.
5. The container for wired circuit board according to claim 1, wherein,
the wired circuit board has a plurality of the edges,
the container for wired circuit board has at least 1 protrusion with respect to each of the plurality of edges.
6. The container for wired circuit board according to claim 1, wherein,
the receiving portion has a bottom wall and,
the bottom wall has an opening, and the opening is used when inspecting the wired circuit board accommodated in the accommodating portion.
7. The container for a wired circuit board according to claim 6, wherein,
in a state where the wired circuit board is accommodated in the accommodating portion, a part of the edge overlaps the opening in a thickness direction of the wired circuit board.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021099003A JP2022190600A (en) | 2021-06-14 | 2021-06-14 | Wiring circuit board container |
| JP2021-099003 | 2021-06-14 | ||
| PCT/JP2022/003774 WO2022264480A1 (en) | 2021-06-14 | 2022-02-01 | Container for wiring circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117440919A true CN117440919A (en) | 2024-01-23 |
Family
ID=84526953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280040864.9A Pending CN117440919A (en) | 2021-06-14 | 2022-02-01 | Container for wired circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2022190600A (en) |
| CN (1) | CN117440919A (en) |
| TW (1) | TW202249547A (en) |
| WO (1) | WO2022264480A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61169088U (en) * | 1985-04-08 | 1986-10-20 | ||
| JPH0182169U (en) * | 1987-11-20 | 1989-06-01 | ||
| JP2002002869A (en) * | 2000-06-27 | 2002-01-09 | Hitachi Ltd | Storing container and storing and inspecting method for semiconductor device utilizing the same |
| JP3784637B2 (en) * | 2000-11-16 | 2006-06-14 | 株式会社ルネサステクノロジ | Semiconductor device, storage container thereof, and mounting structure |
| JP2006273333A (en) * | 2005-03-25 | 2006-10-12 | Sekisui Plastics Co Ltd | Tray for packing |
| JP4628297B2 (en) * | 2006-03-31 | 2011-02-09 | 株式会社 後島精工 | Electronic component storage tray |
| JP4607138B2 (en) * | 2007-03-16 | 2011-01-05 | シノン電気産業株式会社 | Tray for semiconductor integrated circuit |
| CN109533573A (en) * | 2019-01-17 | 2019-03-29 | 友达光电（苏州）有限公司 | For accommodating the pallet of electronic device |
-
2021
- 2021-06-14 JP JP2021099003A patent/JP2022190600A/en active Pending
-
2022
- 2022-02-01 WO PCT/JP2022/003774 patent/WO2022264480A1/en active Application Filing
- 2022-02-01 CN CN202280040864.9A patent/CN117440919A/en active Pending
- 2022-02-10 TW TW111104859A patent/TW202249547A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022190600A (en) | 2022-12-26 |
| TW202249547A (en) | 2022-12-16 |
| WO2022264480A1 (en) | 2022-12-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination |