JPH0182169U - - Google Patents
Info
- Publication number
- JPH0182169U JPH0182169U JP1987178088U JP17808887U JPH0182169U JP H0182169 U JPH0182169 U JP H0182169U JP 1987178088 U JP1987178088 U JP 1987178088U JP 17808887 U JP17808887 U JP 17808887U JP H0182169 U JPH0182169 U JP H0182169U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- tape
- electronic component
- storing
- embossed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は本考案の上記実施例でエンボステープに封止
する電子部品の一例を示す底面からみた斜視図、
第３図は従来のエンボステープの一例を示す斜視
図である。
１……キヤリアテープ、２……凹所、４……ガ
イド孔、１１……透孔、１２……端子。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view from the bottom showing an example of the electronic component sealed in the embossed tape in the above embodiment of the present invention.
FIG. 3 is a perspective view showing an example of a conventional embossed tape. 1...Carrier tape, 2...Recess, 4...Guide hole, 11...Through hole, 12...Terminal.
Claims (1)
で形成した多数の部品収納用の凹所と、 各凹所に収納される電子部品と、 上記各凹所を封止するカバーテープと、 上記電子部品の端子に対応して上記キヤリアテ
ープの凹所の底部に穿設され上記電子部品を検査
するプローブを挿入する複数の透孔とを具備する
ことを特徴とするエンボステープ。[Scope of Claim for Utility Model Registration] In an embossed tape for storing electronic components, a number of recesses for storing components formed at regular intervals along the longitudinal direction of the carrier tape, and electronic components stored in each recess. a cover tape for sealing each of the recesses, and a plurality of through holes formed at the bottom of the recesses of the carrier tape corresponding to the terminals of the electronic component into which probes for inspecting the electronic component are inserted. An embossed tape comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178088U JPH0182169U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178088U JPH0182169U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0182169U true JPH0182169U (en) | 1989-06-01 |
Family
ID=31469722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987178088U Pending JPH0182169U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0182169U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022264480A1 (en) * | 2021-06-14 | 2022-12-22 | 日東電工株式会社 | Container for wiring circuit board |
-
1987
- 1987-11-20 JP JP1987178088U patent/JPH0182169U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022264480A1 (en) * | 2021-06-14 | 2022-12-22 | 日東電工株式会社 | Container for wiring circuit board |
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