CN117440221A - 成像系统镜头安装结构 - Google Patents
成像系统镜头安装结构 Download PDFInfo
- Publication number
- CN117440221A CN117440221A CN202310905851.XA CN202310905851A CN117440221A CN 117440221 A CN117440221 A CN 117440221A CN 202310905851 A CN202310905851 A CN 202310905851A CN 117440221 A CN117440221 A CN 117440221A
- Authority
- CN
- China
- Prior art keywords
- lens
- support
- lens holder
- imaging system
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 163
- 239000012790 adhesive layer Substances 0.000 claims description 71
- 239000000853 adhesive Substances 0.000 claims description 46
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 25
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 37
- WBHQEUPUMONIKF-UHFFFAOYSA-N PCB180 Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl WBHQEUPUMONIKF-UHFFFAOYSA-N 0.000 description 28
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 17
- 238000010276 construction Methods 0.000 description 12
- JHJMZCXLJXRCHK-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1 JHJMZCXLJXRCHK-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- TYEDCFVCFDKSBK-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl TYEDCFVCFDKSBK-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2210755.1A GB2620792A (en) | 2022-07-22 | 2022-07-22 | An imaging system and a lens mounting arrangement |
GB2210755.1 | 2022-07-22 | ||
EP23183744.4 | 2023-07-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117440221A true CN117440221A (zh) | 2024-01-23 |
Family
ID=84540430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202310905851.XA Pending CN117440221A (zh) | 2022-07-22 | 2023-07-21 | 成像系统镜头安装结构 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240027878A1 (zh) |
EP (1) | EP4311250A1 (zh) |
CN (1) | CN117440221A (zh) |
GB (1) | GB2620792A (zh) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674833B1 (ko) * | 2005-02-16 | 2007-01-26 | 삼성전기주식회사 | 카메라 모듈 |
US7997812B2 (en) * | 2006-08-22 | 2011-08-16 | Lg Innotek Co., Ltd. | Camera module |
US8482664B2 (en) * | 2008-10-16 | 2013-07-09 | Magna Electronics Inc. | Compact camera and cable system for vehicular applications |
FR3082633B1 (fr) * | 2018-06-18 | 2021-10-01 | Delphi Tech Llc | Dispositif optique pour vehicule comprenant un element de chauffage |
KR102247933B1 (ko) * | 2019-10-18 | 2021-05-04 | 주식회사 엠씨넥스 | 정전기 방지 기능을 구비한 카메라 |
DE102020208805A1 (de) * | 2020-07-15 | 2022-01-20 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kameramodul, Verfahren zur Herstellung eines Kameramoduls |
CN114070966B (zh) * | 2020-08-04 | 2023-07-07 | 宁波舜宇光电信息有限公司 | 摄像模组以及终端设备 |
CN111815807A (zh) * | 2020-08-05 | 2020-10-23 | 深圳市豪恩汽车电子装备股份有限公司 | 行车记录仪 |
CN216905047U (zh) * | 2022-02-18 | 2022-07-05 | 浙江水晶光电科技股份有限公司 | 一种摄像头防静电组件及摄像头 |
-
2022
- 2022-07-22 GB GB2210755.1A patent/GB2620792A/en active Pending
-
2023
- 2023-07-05 EP EP23183744.4A patent/EP4311250A1/en active Pending
- 2023-07-19 US US18/355,204 patent/US20240027878A1/en active Pending
- 2023-07-21 CN CN202310905851.XA patent/CN117440221A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
GB202210755D0 (en) | 2022-09-07 |
GB2620792A (en) | 2024-01-24 |
EP4311250A1 (en) | 2024-01-24 |
US20240027878A1 (en) | 2024-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Country or region after: Luxembourg Address after: Luxembourg Applicant after: Aptiv Technology (2) Co. Address before: Babado J San Michael Applicant before: Aptiv Technologies Ltd. Country or region before: Barbados |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240307 Address after: Luxembourg Applicant after: Aptiv Manufacturing Management Services Co. Country or region after: Luxembourg Address before: Luxembourg Applicant before: Aptiv Technology (2) Co. Country or region before: Luxembourg |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240326 Address after: Schaffhausen Applicant after: APTIV Technology Co.,Ltd. Country or region after: Switzerland Address before: Luxembourg Applicant before: Aptiv Manufacturing Management Services Co. Country or region before: Luxembourg |