CN117438345A - Chip jacking module - Google Patents
Chip jacking module Download PDFInfo
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- CN117438345A CN117438345A CN202311531046.1A CN202311531046A CN117438345A CN 117438345 A CN117438345 A CN 117438345A CN 202311531046 A CN202311531046 A CN 202311531046A CN 117438345 A CN117438345 A CN 117438345A
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- 238000007789 sealing Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip jacking module, which comprises: the driving unit is arranged on the base and is used for providing jacking power and negative film suction pressure; the jacking unit is arranged above the driving unit, the jacking unit and the driving unit are detachably connected through a quick-release structure, the jacking unit can be quickly switched according to different chips, a jacking rod is arranged in the jacking unit, a thimble is arranged at the upper end of the jacking rod, jacking power provided by the driving unit acts on the lower end of the jacking rod so as to jack up the chips on the blue film through the thimble, and film suction negative pressure provided by the driving unit acts on the blue film on the wafer through the jacking unit so as to downwards adsorb the blue film. The invention has the advantages that the driving unit is connected with the jacking unit in a quick-dismantling way, and the jacking unit can be quickly switched according to the requirement.
Description
Technical Field
The invention belongs to the technical field of chip mounting, and particularly relates to a chip jacking module.
Background
When the lead frame is used for mounting chips, the chips are required to be taken down one by one from the wafer and then mounted, and the jacking module is required to jack the chips in the process so as to take the chips.
However, the jacking modules with corresponding sizes are needed to be adopted for jacking for different chips, and as the physical mechanism is needed to be used for jacking up and down and negative pressure for adsorption during jacking, the jacking modules can only be replaced integrally, and the whole equipment is low in disassembly and assembly efficiency.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the invention provides the chip jacking module which has the advantages that the driving unit is quickly detached from the jacking unit, and the jacking unit can be quickly switched according to the requirement.
According to an embodiment of the invention, a chip jacking module comprises: the driving unit is arranged on the base and is used for providing jacking power and negative film suction pressure; the jacking unit is installed above the driving unit, the jacking unit is detachably connected with the driving unit through a quick-release structure, the jacking unit can be quickly switched according to different chips, a jacking rod is arranged in the jacking unit, a thimble is arranged at the upper end of the jacking rod, jacking power provided by the driving unit acts on the lower end of the jacking rod so as to jack up the chips on the blue film through the thimble, and film suction negative pressure provided by the driving unit acts on the blue film on a wafer through the jacking unit so as to downwards adsorb the blue film.
According to one embodiment of the invention, the drive unit comprises a voice coil motor mounted within the base; and the thrust shaft is arranged at the output end of the voice coil motor, and the voice coil motor drives the thrust shaft to move along the vertical direction.
According to one embodiment of the invention, a reading head is arranged on one side of the base, a detection support is arranged on the base in a sliding mode, the detection support is connected with the thrust shaft, moves along the vertical direction along with the thrust shaft, and triggers the reading head when moving.
According to one embodiment of the invention, the quick release structure comprises a base plate mounted on the base; the magnets are arranged in the bottom plate, and the upper surfaces of the magnets are exposed to adsorb and fix the jacking unit; the limiting column is arranged on the upper surface of the bottom plate and used for positioning the jacking unit.
According to one embodiment of the invention, a negative pressure connector is arranged on one side of the bottom plate, a first vacuum channel is arranged on the bottom plate, the negative pressure connector is communicated with one end of the first vacuum channel, and the other end of the first vacuum channel is communicated into the jacking unit.
According to one embodiment of the invention, the jacking unit comprises a mounting seat, the lower surface of the mounting seat is attached to the upper surface of the bottom plate, a limit matching part is arranged on the mounting seat, and the limit matching part is in positioning matching with the limit column; the shell is arranged above the mounting seat, and the jacking rod and the thimble are both positioned in the shell.
According to one embodiment of the invention, the mounting seat is provided with a second vacuum channel, one end of the second vacuum channel is communicated with the first vacuum channel, the other end of the second vacuum channel is communicated with the inside of the shell, and a first sealing ring is arranged at the joint of the second vacuum channel and the first vacuum channel.
According to one embodiment of the invention, the upper end of the shell is provided with a plurality of holes, the middle hole is used for the thimble to pass through, and the rest holes are used for negative pressure to adsorb the blue film.
According to one embodiment of the invention, a second sealing ring is arranged between the shell and the mounting seat.
According to one embodiment of the invention, the upper end of the jacking rod is provided with a mounting block, the mounting block is provided with a clamp, the thimble is vertically arranged on the clamp, and the periphery of the clamp is locked by a locking cap.
According to one embodiment of the invention, a sealing element is arranged between the mounting seat and the jacking rod, the sealing element is clamped in the mounting seat through a baffle plate, and the jacking rod protrudes downwards from the baffle plate and is propped against the upper end of the thrust shaft.
According to one embodiment of the invention, the lifting rod is provided with a limit ring and a spring, the lower end of the spring is propped against the limit ring, and the upper end of the spring is propped against the mounting seat.
According to one embodiment of the invention, the installation seat is connected with the middle part of the jacking rod in a sliding guide way through a sliding limiting sleeve.
The invention has the beneficial effects that the structure is simple and compact, the driving unit and the jacking unit of the chip jacking module are designed to be connected in a quick-dismantling way, the jacking unit can be quickly replaced according to chips with different sizes, and the whole jacking module is not required to be replaced, so that the mold changing speed and the production efficiency are improved; according to the invention, the voice coil motor is used for driving to realize the lifting motion in the vertical direction, and meanwhile, the reading head is used for accurately detecting the lifting height, so that the lifting height is more accurate and reliable; the jacking unit is sealed for multiple times, so that the stability of negative pressure adsorption is ensured.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a chip lifting module according to the present invention;
fig. 2 is a schematic view of the internal structure of the driving unit of the present invention;
fig. 3 is a schematic structural view of the driving unit of the present invention;
FIG. 4 is a schematic diagram of a jack unit according to the present invention;
FIG. 5 is a schematic cross-sectional view of a jacking unit of the present invention;
reference numerals: base 531, voice coil motor 5311, thrust shaft 5312, read head 5313, detection bracket 5314, bottom plate 532, magnet 5321, spacing post 5322, negative pressure connector 5323, first vacuum channel 5324, mount 533, second vacuum channel 5331, seal ring No. one 5332, spacing mating portion 5333, housing 534, seal ring No. two 5341, hole 5342, seal 535, baffle 536, spring 537, spacing collar 538, jacking rod 539, sliding spacing sleeve 5391, clamp 5392, locking cap 5393, mounting block 5394, thimble 5395.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The chip lifting module according to the embodiment of the invention is specifically described below with reference to the accompanying drawings.
As shown in fig. 1 to 4, a chip lifting module according to an embodiment of the present invention includes: the driving unit and the jacking unit are arranged on the base 531, and the driving unit is used for providing jacking power and negative film suction pressure; the jacking unit is installed above the driving unit, the jacking unit and the driving unit are detachably connected through a quick-release structure, the jacking unit can be quickly switched according to different chips, a jacking rod 539 is arranged in the jacking unit, an ejector pin 5395 is arranged at the upper end of the jacking rod 539, jacking power provided by the driving unit acts on the lower end of the jacking rod 539 so as to jack up the chips on the blue film through the ejector pin 5395, and film suction negative pressure provided by the driving unit acts on the blue film on the wafer through the jacking unit so as to downwards adsorb the blue film.
In other words, the driving unit and the jacking unit are connected in a quick-dismantling manner, the driving unit provides power of the jacking chip and negative pressure for adsorbing the blue film, when the jacking unit is replaced, the power of the jacking chip and the negative pressure for adsorbing the blue film are disconnected with the jacking unit, and connection is reestablished after the jacking unit is replaced.
In this embodiment, the driving unit includes a voice coil motor 5311 and a thrust shaft 5312, the voice coil motor 5311 being mounted in the base 531; the thrust shaft 5312 is mounted at the output of the voice coil motor 5311, and the voice coil motor 5311 drives the thrust shaft 5312 to move in the vertical direction.
Further, a reading head 5313 is provided on one side of the base 531, a detection support 5314 is slidably provided on the base 531, the detection support 5314 is connected to the thrust shaft 5312, and the detection support 5314 moves along the vertical direction along with the thrust shaft 5312 and triggers the reading head 5313 when moving.
That is, the voice coil motor 5311 is vertically disposed, and the direct driving thrust shaft 5312 reciprocates in the vertical direction, so that compared with the mode of horizontally disposing the motor and driving by using the cam mechanism, the direct driving structure is simpler, and meanwhile, the speed during jacking is more stable, and the jacking precision is higher; meanwhile, the reading head 5313 is used for detecting the lifting height of the detection support 5314, namely the lifting height of the ejector pin 5395 is detected in real time, so that the chip lifting height is monitored and regulated in real time, and the applicability is wider.
The quick-release structure comprises a base plate 532, a plurality of magnets 5321 and a limiting column 5322, wherein the base plate 532 is arranged on the base 531; a plurality of magnets 5321 disposed in the bottom plate 532, wherein the upper surfaces of the magnets 5321 are exposed to adsorb and fix the jacking unit; the limiting column 5322 is mounted on the upper surface of the bottom plate 532, and the limiting column 5322 is used for positioning the jacking unit.
The through hole is offered at the middle part on the bottom plate 532, and the through hole is used for supplying thrust axle 5312 to pass through, and the quantity of spacing post 5322 is two, and two spacing posts 5322 are located the left and right sides of through-hole, and spacing post 5322 is the locating pin in this embodiment, carries out two-point location to the drive unit, and the location is more accurate.
Preferably, a negative pressure connector 5323 is disposed on one side of the bottom plate 532, a first vacuum channel 5324 is formed in the bottom plate 532, the negative pressure connector 5323 is connected to one end of the first vacuum channel 5324, and the other end of the first vacuum channel 5324 is led into the jacking unit. The other end of the first vacuum passage 5324 is located on the upper surface of the base plate 532, and the docking of the first vacuum passage 5324 and the docking of the thrust shaft 5312 are simultaneously completed at the time of the replacement of the driving unit.
In this embodiment, the jacking unit includes a mounting seat 533 and a housing 534, the lower surface of the mounting seat 533 is attached to the upper surface of the bottom plate 532, the mounting seat 533 is provided with a limit fitting portion 5333, and the limit fitting portion 5333 is in positioning fit with the limit post 5322; housing 534 is mounted over mount 533, with both lift rod 539 and ejector pin 5395 being located within housing 534. The limit matching parts 5333 are semicircular surfaces, the number of the limit matching parts 5333 is two, the two limit matching parts 5333 are respectively matched with the two limit posts 5322, and when the jacking unit is replaced, the mounting base 533 is dismounted along the vertical direction, so that the semicircular surfaces and the limit posts 5322 are matched in an inserting mode and positioned.
Further, a second vacuum channel 5331 is formed on the mounting seat 533, one end of the second vacuum channel 5331 is communicated with the first vacuum channel 5324, the other end of the second vacuum channel 5331 is communicated with the inside of the casing 534, and a first sealing ring 5332 is arranged at the connection part of the second vacuum channel 5331 and the first vacuum channel 5324. A second seal ring 5341 is further provided between the housing 534 and the mount 533.
Further, the upper end of the housing 534 is provided with a plurality of holes 5342, the middle hole 5342 is used for the passage of the ejector pin 5395, and the rest holes 5342 are used for negative pressure adsorption of the blue film.
The plurality of holes 5342 are uniformly arranged in a circular array, and negative pressure sequentially acts on the blue film through the first vacuum channel 5324, the second vacuum channel 5331, the housing 534, and the holes 5342. A first seal 5332 is provided between the upper surface of the base plate 532 and the lower surface of the mount 533 to seal when the mount 533 is attracted by the magnet 5321.
According to one embodiment of the present invention, the upper end of the jacking rod 539 is provided with a mounting block 5394, the mounting block 5394 is provided with a clamp 5392, the ejector pin 5395 is vertically arranged on the clamp 5392, and the periphery of the clamp 5392 is locked by a locking cap 5393. In this embodiment, the installation block 5394 is sleeved on the upper end of the jacking rod 539, the side surface of the installation block 5394 passes through the installation block 5394 through a screw and then abuts against the jacking rod 539 to fix the installation block 5394, the clamp 5392 is provided with a plurality of clamping blocks arranged along the circumferential direction, the locking cap 5393 is sleeved on the clamp 5392, and the clamping blocks are tightened inwards during locking, so that the thimble 5395 is clamped.
Wherein, be provided with the sealing member 535 between mount pad 533 and the jacking rod 539, the sealing member 535 is located in the mount pad 533 through the separation blade 536 card, and the jacking rod 539 is protruding behind the separation blade 536 downwards and is offset with the upper end of thrust shaft 5312.
Further, a stopper 538 and a spring 537 are provided on the jacking rod 539, the lower end of the spring 537 abuts against the stopper 538, and the upper end of the spring 537 abuts against the mount 533.
In other words, the mounting seat 533 is provided with two-stage stepped holes, the sealing member 535 is placed at the opening of the stepped hole and is limited and fixed by the baffle 536, the outer circumferential surface of the sealing member 535 is sealed with the mounting seat 533, and the inner circumferential surface of the sealing member 535 is sealed with the jacking rod 539, so that the sealing performance can be ensured during the jacking movement of the jacking rod 539, and the vacuum adsorption effect is improved. On the other hand, a spring 537 is provided at the bottom of the stepped hole, and a downward force is applied to the jacking rod 539 by the elastic force of the spring 537, so that the jacking rod 539 is ensured to always be supported downward on the thrust shaft 5312, and thus the jacking rod 539 can fall down following the thrust shaft 5312 after the jacking is completed.
Further, the mounting seat 533 is slidably connected to the middle portion of the lifting rod 539 through a sliding stop 5391.
That is, the sliding stop sleeve 5391 is mounted on the inner wall of the mounting seat 533 and is slidably connected with the middle part of the jacking rod 539, the sliding stop sleeve 5391 is a ball spline, that is, the sliding stop sleeve 5391 can guide the up-and-down motion of the jacking rod 539, so that the stability during jacking is ensured, meanwhile, the jacking rod 539 can be prevented from rotating during jacking, and the chip jacking is prevented from rotating, so that the influence on the chip mounting angle can be effectively avoided.
In summary, the invention has simple and compact structure, and the driving unit and the jacking unit of the chip jacking module are designed to be connected in a quick-dismantling way, so that the jacking unit can be quickly replaced according to chips with different sizes, and the whole jacking module is not required to be replaced, thereby improving the mold replacing speed and the production efficiency; according to the invention, the voice coil motor 5311 is used for driving to realize the lifting motion in the vertical direction, and meanwhile, the reading head 5313 is used for accurately detecting the lifting height, so that the lifting height is more accurate and reliable; the jacking unit is sealed for multiple times, so that the stability of negative pressure adsorption is ensured; according to the invention, the spring 537 is used for applying pressure to the jacking rod 539, so that the motion of the jacking rod 539 and the motion of the driving unit are unified, and meanwhile, the sliding limiting sleeve 5391 is used for guiding the jacking rod 539 in the vertical direction and limiting the jacking rod in the circumferential direction, so that the jacking effect is improved.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (13)
1. A chip lifting module, comprising:
the driving unit is arranged on the base (531) and is used for providing jacking power and negative film suction pressure;
the jacking unit is installed above the driving unit, the jacking unit is detachably connected with the driving unit through a quick-release structure, the jacking unit can be quickly switched according to different chips, a jacking rod (539) is arranged in the jacking unit, an ejector pin (5395) is arranged at the upper end of the jacking rod (539), jacking power provided by the driving unit acts on the lower end of the jacking rod (539) so as to jack up the chips on the blue film through the ejector pin (5395), and film suction negative pressure provided by the driving unit acts on the blue film on a wafer through the jacking unit so as to downwards adsorb the blue film.
2. The chip lifting module of claim 1, wherein the driving unit comprises
A voice coil motor (5311), said voice coil motor (5311) being mounted within said chassis (531);
and a thrust shaft (5312), wherein the thrust shaft (5312) is mounted at the output end of the voice coil motor (5311), and the voice coil motor (5311) drives the thrust shaft (5312) to move along the vertical direction.
3. The chip lifting module according to claim 2, characterized in that a reading head (5313) is arranged on one side of the base (531), a detection support (5314) is slidably arranged on the base (531), the detection support (5314) is connected with the thrust shaft (5312), and the detection support (5314) moves along the thrust shaft (5312) along the vertical direction and triggers the reading head (5313) when moving.
4. The chip lifting module according to claim 2, wherein the quick release structure comprises
-a base plate (532), said base plate (532) being mounted on said base (531);
a plurality of magnets (5321), wherein the magnets (5321) are arranged in the bottom plate (532), and the upper surfaces of the magnets (5321) are exposed to adsorb and fix the jacking unit;
and the limiting column (5322) is arranged on the upper surface of the bottom plate (532), and the limiting column (5322) is used for positioning the jacking unit.
5. The chip lifting module according to claim 4, wherein a negative pressure connector (5323) is arranged on one side of the bottom plate (532), a first vacuum channel (5324) is formed in the bottom plate (532), the negative pressure connector (5323) is connected to one end of the first vacuum channel (5324), and the other end of the first vacuum channel (5324) is led into the lifting unit.
6. The chip lifting module according to claim 5, wherein the lifting unit comprises
The mounting seat (533), the lower surface of the mounting seat (533) is attached to the upper surface of the bottom plate (532), a limit matching part (5333) is arranged on the mounting seat (533), and the limit matching part (5333) is matched with the limit column (5322) in a positioning way;
the shell (534), the shell (534) is installed above mount pad (533), jacking rod (539) and thimble (5395) are all located in shell (534).
7. The chip lifting module according to claim 6, wherein a second vacuum channel (5331) is formed in the mounting base (533), one end of the second vacuum channel (5331) is communicated with the first vacuum channel (5324), the other end of the second vacuum channel (5331) is communicated with the inside of the casing (534), and a first sealing ring (5332) is arranged at a connection part of the second vacuum channel (5331) and the first vacuum channel (5324).
8. The chip lifting module according to claim 7, wherein a plurality of holes (5342) are formed in an upper end of the housing (534), the middle hole (5342) is used for the ejector pin (5395) to pass through, and the rest holes (5342) are used for negative pressure to adsorb blue film.
9. The chip lifting module according to claim 6, wherein a second sealing ring (5341) is arranged between the housing (534) and the mounting base (533).
10. The chip jacking module according to claim 1, wherein a mounting block (5394) is arranged at the upper end of the jacking rod (539), a clamp (5392) is mounted on the mounting block (5394), the ejector pin (5395) is vertically mounted on the clamp (5392), and the periphery of the clamp (5392) is locked by a locking cap (5393).
11. The chip lifting module according to claim 6, wherein a sealing member (535) is disposed between the mounting base (533) and the lifting rod (539), the sealing member (535) is clamped in the mounting base (533) by a baffle (536), and the lifting rod (539) protrudes downwards beyond the baffle (536) and abuts against the upper end of the thrust shaft (5312).
12. The chip lifting module according to claim 11, wherein a limit ring (538) and a spring (537) are provided on the lifting rod (539), the lower end of the spring (537) is abutted against the limit ring (538), and the upper end of the spring (537) is abutted against the mounting base (533).
13. The chip lifting module according to claim 11, wherein the mounting base (533) is slidably guided to the middle of the lifting rod (539) by a sliding stop collar (5391).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311531046.1A CN117438345A (en) | 2023-11-15 | 2023-11-15 | Chip jacking module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311531046.1A CN117438345A (en) | 2023-11-15 | 2023-11-15 | Chip jacking module |
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| Publication Number | Publication Date |
|---|---|
| CN117438345A true CN117438345A (en) | 2024-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311531046.1A Pending CN117438345A (en) | 2023-11-15 | 2023-11-15 | Chip jacking module |
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| CN (1) | CN117438345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117855134A (en) * | 2024-03-04 | 2024-04-09 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Automatic thimble switching device |
-
2023
- 2023-11-15 CN CN202311531046.1A patent/CN117438345A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117855134A (en) * | 2024-03-04 | 2024-04-09 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Automatic thimble switching device |
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