CN117434793A - Photosensitive resin composition, cured product, method for producing cured product, light conversion layer, and light emitting device - Google Patents
Photosensitive resin composition, cured product, method for producing cured product, light conversion layer, and light emitting device Download PDFInfo
- Publication number
- CN117434793A CN117434793A CN202210823911.9A CN202210823911A CN117434793A CN 117434793 A CN117434793 A CN 117434793A CN 202210823911 A CN202210823911 A CN 202210823911A CN 117434793 A CN117434793 A CN 117434793A
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- China
- Prior art keywords
- resin composition
- photosensitive resin
- meth
- acrylate
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 80
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 116
- 239000011347 resin Substances 0.000 claims abstract description 116
- 150000001875 compounds Chemical class 0.000 claims abstract description 38
- 239000002904 solvent Substances 0.000 claims abstract description 38
- 239000003999 initiator Substances 0.000 claims abstract description 37
- 239000000049 pigment Substances 0.000 claims abstract description 29
- 239000000178 monomer Substances 0.000 claims abstract description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 32
- 239000004094 surface-active agent Substances 0.000 claims description 25
- 238000009835 boiling Methods 0.000 claims description 16
- -1 hydroxypropyl Chemical group 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 11
- 239000011737 fluorine Substances 0.000 claims description 11
- 229910052731 fluorine Inorganic materials 0.000 claims description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000012463 white pigment Substances 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 6
- 229910052801 chlorine Inorganic materials 0.000 claims description 6
- 125000001033 ether group Chemical group 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 229910052570 clay Inorganic materials 0.000 claims description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 claims description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
- 150000002431 hydrogen Chemical class 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 3
- 239000001095 magnesium carbonate Substances 0.000 claims description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 claims description 2
- 239000000047 product Substances 0.000 description 56
- 230000035515 penetration Effects 0.000 description 19
- 230000000740 bleeding effect Effects 0.000 description 17
- 238000000576 coating method Methods 0.000 description 14
- 239000002096 quantum dot Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XQAVYBWWWZMURF-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO XQAVYBWWWZMURF-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XUKSWKGOQKREON-UHFFFAOYSA-N 1,4-diacetoxybutane Chemical compound CC(=O)OCCCCOC(C)=O XUKSWKGOQKREON-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical group SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- XFQDAAPROSJLSX-UHFFFAOYSA-N 2-[4-(9h-fluoren-1-yl)phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1=CC=CC2=C1CC1=CC=CC=C21 XFQDAAPROSJLSX-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical compound CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- CCTFMNIEFHGTDU-UHFFFAOYSA-N 3-methoxypropyl acetate Chemical compound COCCCOC(C)=O CCTFMNIEFHGTDU-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical group CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- ZMFWEWMHABZQNB-UHFFFAOYSA-N 6-acetyloxyhexyl acetate Chemical compound CC(=O)OCCCCCCOC(C)=O ZMFWEWMHABZQNB-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- MLHOXUWWKVQEJB-UHFFFAOYSA-N Propyleneglycol diacetate Chemical compound CC(=O)OC(C)COC(C)=O MLHOXUWWKVQEJB-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Chemical group 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- TYKSSIDOMQWRPE-UHFFFAOYSA-N [3-[4-(9H-fluoren-1-yl)phenoxy]-2-hydroxypropyl] prop-2-enoate Chemical compound C(C=C)(=O)OCC(COC1=CC=C(C=C1)C1=CC=CC=2C3=CC=CC=C3CC12)O TYKSSIDOMQWRPE-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- VEIYJWQZNGASMA-UHFFFAOYSA-N cyclohex-3-en-1-ylmethanol Chemical compound OCC1CCC=CC1 VEIYJWQZNGASMA-UHFFFAOYSA-N 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optical Filters (AREA)
Abstract
The invention provides a photosensitive resin composition, a cured product, a method for producing the cured product, a light conversion layer and a light emitting device. The photosensitive resin composition comprises a resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a pigment (D) and a solvent (E). The resin (A) includes an alkali-soluble resin (A-1), other resins (A-2), or a combination thereof. The alkali-soluble resin (A-1) includes a structural unit represented by the following formula (A1). The photopolymerization initiator (C) includes a compound represented by the following formula (C1).
Description
Technical Field
The present invention relates to a resin composition, and more particularly, to a photosensitive resin composition, a cured product, a method for producing the cured product, a light conversion layer, and a light emitting device.
Background
With the development of display device technology, in order to improve the display quality of a display device, a light conversion layer containing quantum dots has been provided in the display device in recent years to improve the brightness and color purity of a display screen. In addition, in order to improve the flexibility of the display device, flexible substrates have been used in recent years instead of conventional glass substrates. However, the quantum dots and flexible substrates have a problem of not withstanding high temperature, thereby affecting the color purity and performance of the light conversion layer fabricated and the device using the same.
Disclosure of Invention
The invention provides a photosensitive resin composition, a cured product, a method for producing the cured product, a light conversion layer and a light emitting device, wherein the photosensitive resin composition has good ink seepage resistance and ink seepage resistance.
A photosensitive resin composition of the present invention comprises a resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a pigment (D), and a solvent (E). The resin (A) includes an alkali-soluble resin (A-1), other resins (A-2), or a combination thereof. The alkali-soluble resin (A-1) includes a structural unit represented by the following formula (A1). The photopolymerization initiator (C) includes a compound represented by the following formula (C1).
Wherein represents the bonding position.
In the formula (C1), R 1 Represents hydrogen or a methoxy group, and is preferably a hydroxyl group,
R 2 represents hydrogen, fluorine, chlorine, bromine, methyl or methoxy,
R 3 represents fluorine, chlorine, bromine, methyl or methoxy.
In one embodiment of the present invention, each of the alkali-soluble resin (A-1) and the other resin (A-2) has a weight average molecular weight of more than 13000 and less than or equal to 85000.
In one embodiment of the present invention, each of the alkali-soluble resin (A-1) and the other resin (A-2) has an acid value of 60mgKOH/g to 135mgKOH/g.
In one embodiment of the present invention, the alkali-soluble resin (A-1) includes one or more alkali-soluble resins comprising a structural unit represented by the formula (A1). In the alkali-soluble resin (a-1), the structural unit represented by the formula (A1) is 35 mol% to 65 mol% based on 100 mol% of the total of all the structural units included in each alkali-soluble resin containing the structural unit represented by the formula (A1).
In an embodiment of the present invention, the ethylenically unsaturated monomer (B) includes an alkyl (meth) acrylate, a hydroxyl group-containing (meth) acrylate, an ether group-containing (meth) acrylate, an alicyclic (meth) acrylate, or a combination thereof.
In one embodiment of the present invention, the ethylenically unsaturated monomer (B) includes (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, third butyl (meth) acrylate, lauryl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, ethoxyethyl (meth) acrylate, glycidyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, or a combination thereof.
In an embodiment of the present invention, the photopolymerization initiator (C) further includes a compound represented by the following formula (C2):
in the formula (C2), R 4 And R is R 5 Respectively represents methylamino, ethylamino, cyclohexylamino, hydroxyethylamino, methoxy, methylethylamino or diethylamino.
In one embodiment of the present invention, in the photopolymerization initiator (C), the weight ratio of the amount of the compound represented by the formula (C1) to the amount of the compound represented by the formula (C2) is 5:1 to 2:1
In one embodiment of the present invention, the pigment (D) includes a white pigment (D-1). The white pigment (D-1) is at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc, and montmorillonite.
In one embodiment of the present invention, the pigment (D) includes a black pigment (D-2). The black pigment (D-2) is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black.
In one embodiment of the present invention, the solvent (E) includes a low boiling point solvent (E-1). The boiling point of the low boiling point solvent (E-1) is 100 ℃ or lower.
In one embodiment of the present invention, the low boiling point solvent (E-1) is used in an amount of 25 to 100 parts by weight based on 100 parts by weight of the solvent (E).
In an embodiment of the invention, the photosensitive resin composition further includes a surfactant (F). The surfactant (F) is used in an amount of 1 to 5 parts by weight based on 100 parts by weight of the resin (a).
In an embodiment of the invention, the photosensitive resin composition further includes a surfactant (F). The surfactant (F) includes a fluorine-based surfactant.
In one embodiment of the present invention, the amount of the ethylenically unsaturated monomer (B) is 5 to 25 parts by weight, the amount of the photopolymerization initiator (C) is 0.1 to 5 parts by weight, the amount of the pigment (D) is 45 to 65 parts by weight, and the amount of the solvent (E) is 20 to 65 parts by weight, based on 100 parts by weight of the resin (a) described above.
The cured product of the present invention is obtained by curing the photosensitive resin composition.
The method for producing a cured product of the present invention comprises: the photosensitive resin composition is hard baked. The temperature of the hard bake is less than or equal to 150 ℃.
The light conversion layer of the present invention comprises the cured product described above or a cured product produced by the method for producing a cured product described above.
In an embodiment of the invention, the cured objects are a plurality of cured objects. The light conversion layer further includes a plurality of pattern layers. The plurality of hardening objects are inserted between the plurality of pattern layers, so that one of the plurality of pattern layers exists between every two adjacent hardening objects in the plurality of hardening objects.
In an embodiment of the invention, the light conversion layer further includes a plurality of pattern layers. The pattern layer is a red pattern layer, a green pattern layer or a scatterer pattern layer.
A light emitting device of the present invention includes the above-described light conversion layer.
In an embodiment of the invention, the light emitting device further includes a substrate and a backlight module. The light conversion layer is positioned on the substrate. The backlight module is arranged on one side of the substrate provided with the light conversion layer.
In an embodiment of the invention, the light emitting device further includes a filter layer. The filter layer is positioned between the substrate and the light conversion layer.
Based on the above, the photosensitive resin composition of the present invention includes the alkali-soluble resin (a-1) including the structural unit represented by the formula (A1) and the photopolymerization initiator (C) including the compound represented by the formula (C1). Thus, the photosensitive resin composition or a cured product formed from the photosensitive resin composition has good ink exudation resistance and ink penetration resistance, and is suitable for a light conversion layer and a light emitting device. In particular, the cured product of the photosensitive resin composition at a hard bake temperature of 150 ℃ or less can be provided with good ink bleeding resistance and ink penetration resistance.
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic view of a light emitting device according to an embodiment of the present invention.
Fig. 2 is a schematic view of a light emitting device according to another embodiment of the present invention.
FIG. 3 is a schematic view of the evaluation of ink bleeding resistance according to the present invention.
Fig. 4A and 4B are schematic diagrams for evaluating ink permeation resistance according to the present invention.
Description of the reference numerals
10. 20: light emitting device
120: substrate board
140: optical filter layer
142: red filter pattern
144: green filter pattern
146: blue filter pattern
148: shading pattern
160: light conversion layer
160P: pattern layer
162: red pattern layer
164: green pattern layer
166: scatterer pattern layer
168: cured product
200: backlight module
300: cured product
300A: opening pattern
300B: air bubble
300S: surface of hardened material
310: ink composition
h1: initial film thickness
h2: film thickness
Detailed Description
The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As will be recognized by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the invention. In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. Like reference numerals refer to like elements throughout the specification.
< photosensitive resin composition >
The invention provides a photosensitive resin composition, which comprises a resin (A), an ethylene unsaturated monomer (B), a photopolymerization initiator (C), a pigment (D) and a solvent (E). The photosensitive resin composition of the present invention may further comprise a surfactant (F) as needed. Hereinafter, the above-described various components will be described in detail.
Resin (A)
The resin (A) includes an alkali-soluble resin (A-1), other resins (A-2), or a combination thereof. The resin (a) may further include other suitable resins.
The alkali-soluble resin (A-1) includes a structural unit represented by the following formula (A1):
wherein represents the bonding position.
The alkali-soluble resin (A-1) may further comprise other structural units. The other structural units are not particularly limited, and an appropriate structural unit may be selected according to the need. For example, the alkali-soluble resin (a-1) may further include at least one of a structural unit derived from an acrylic compound, a structural unit derived from a styrene compound, and a structural unit derived from a maleimide compound. For example, the alkali-soluble resin (a-1) may further include at least one of structural units represented by the following formulas (A2) to (A8), wherein x represents a bonding position. The alkali-soluble resin (A-1) preferably further comprises at least one of the structural units represented by the formulae (A2) to (A6).
In this embodiment, the alkali-soluble resin (A-1) may include one or more alkali-soluble resins comprising a structural unit represented by the formula (A1). For example, the alkali-soluble resin including the structural unit represented by formula (A1) may include a first alkali-soluble resin, a second alkali-soluble resin, a third alkali-soluble resin, or a combination thereof. The first alkali-soluble resin may include a structural unit represented by formula (A1), a structural unit represented by formula (A2), and a structural unit represented by formula (A3). The second alkali-soluble resin may include a structural unit represented by formula (A1), a structural unit represented by formula (A2), and a structural unit represented by formula (A4). The third alkali-soluble resin may include a structural unit represented by formula (A1), a structural unit represented by formula (A2), a structural unit represented by formula (A5), and a structural unit represented by formula (A6).
In this embodiment, the weight average molecular weight of each of the alkali-soluble resins (A-1) is more than 13000 and less than or equal to 85000. For example, the alkali-soluble resin (a-1) may include a first alkali-soluble resin, a second alkali-soluble resin, a third alkali-soluble resin, or a combination thereof, wherein the weight average molecular weight of the first alkali-soluble resin, the second alkali-soluble resin, and the third alkali-soluble resin is greater than 13000 and less than or equal to 85000, preferably 55000 to 85000, respectively.
In this example, the acid value of each of the alkali-soluble resins (A-1) was 60mgKOH/g to 135mgKOH/g. For example, the alkali-soluble resin (A-1) may include a first alkali-soluble resin, a second alkali-soluble resin, a third alkali-soluble resin, or a combination thereof, wherein the acid value of the first alkali-soluble resin, the second alkali-soluble resin, and the third alkali-soluble resin is 60mgKOH/g to 135mgKOH/g, preferably 70mgKOH/g to 100mgKOH/g, respectively.
In this embodiment, in the alkali-soluble resin (a-1), the structural unit represented by the formula (A1) may be 35 mol% to 65 mol%, preferably 35 mol% to 55 mol%, based on 100 mol% of the total of all the structural units included in each alkali-soluble resin including the structural unit represented by the formula (A1). For example, the first alkali-soluble resin including the structural unit represented by formula (A1) may include the structural unit represented by formula (A1), the structural unit represented by formula (A2), and the structural unit represented by formula (A3), wherein the structural unit represented by formula (A1) may be 35 mol% to 65 mol% based on the total of the structural unit represented by formula (A1), the structural unit represented by formula (A2), and the structural unit represented by formula (A3). The second alkali-soluble resin including the structural unit represented by formula (A1) may include the structural unit represented by formula (A1), the structural unit represented by formula (A2), and the structural unit represented by formula (A4), wherein the structural unit represented by formula (A1) may be 35 mol% to 65 mol% based on the total of the structural unit represented by formula (A1), the structural unit represented by formula (A2), and the structural unit represented by formula (A4). The third alkali-soluble resin including the structural unit represented by formula (A1) may include the structural unit represented by formula (A1), the structural unit represented by formula (A2), the structural unit represented by formula (A5), and the structural unit represented by formula (A6), wherein the structural unit represented by formula (A1) may be 35 mol% to 65 mol% based on the total of the structural unit represented by formula (A1), the structural unit represented by formula (A2), the structural unit represented by formula (A5), and the structural unit represented by formula (A6).
The alkali-soluble resin (A-1) may be used in an amount of 5 to 95 parts by weight, preferably 20 to 70 parts by weight, based on 100 parts by weight of the resin (A).
The other resin (A-2) does not include the structural unit represented by the formula (A1). The other resin (A-2) is not particularly limited, and an appropriate resin may be selected according to the need. For example, the other resin (a-2) may include a structural unit represented by formula (A2), a structural unit represented by formula (A3), a structural unit represented by formula (A4), a structural unit represented by formula (A7), and a structural unit represented by formula (A8). The other resin (A-2) may include one or more resins. The weight average molecular weight of each of the other resins (A-2) is 3000 to 11000, preferably 8000 to 11000. In this embodiment, the acid value of each of the other resins (A-2) is 60mgKOH/g to 135mgKOH/g, preferably 120mgKOH/g to 132mgKOH/g.
In the resin (A), the other resin (A-2) may be used in an amount larger than that of the alkali-soluble resin (A-1). The other resin (A-2) may be used in an amount of 5 to 95 parts by weight, preferably 30 to 80 parts by weight, based on 100 parts by weight of the resin (A).
When the photosensitive resin composition comprises the alkali-soluble resin (A-1), and the alkali-soluble resin (A-1) comprises the structural unit represented by the formula (A1), the cured product formed by the photosensitive resin composition at the hard baking temperature of 150 ℃ or less can have good ink exudation resistance and ink penetration resistance.
When the photosensitive resin composition comprises the alkali-soluble resin (A-1), the alkali-soluble resin (A-1) comprises the structural unit represented by the formula (A1), and the weight average molecular weight of each resin in the alkali-soluble resin (A-1) is 13000 or more and 85000 or less, the cured product formed by the photosensitive resin composition at the bake temperature of 150 ℃ or less can have good ink bleeding resistance and ink penetration resistance.
Ethylenically unsaturated monomer (B)
The ethylenically unsaturated monomer (B) is not particularly limited, and an appropriate ethylenically unsaturated monomer may be selected according to the need. In this embodiment, the ethylenically unsaturated monomer (B) includes an alkyl (meth) acrylate, a hydroxyl group-containing (meth) acrylate, an ether group-containing (meth) acrylate, an alicyclic (meth) acrylate, or a combination thereof. The alkyl (meth) acrylate may include (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, tributyl (meth) acrylate, lauryl (meth) acrylate, or other suitable alkyl (meth) acrylate. The hydroxyl group-containing (meth) acrylate may include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, or other suitable hydroxyl group-containing (meth) acrylate. The (meth) acrylate containing an ether group may include ethoxyethyl (meth) acrylate, glycidyl (meth) acrylate, or other suitable (meth) acrylate containing an ether group. The alicyclic (meth) acrylate may include cyclohexyl (meth) acrylate, dicyclopentadiene (meth) acrylate, or other suitable alicyclic (meth) acrylate. In this embodiment, the ethylenically unsaturated monomer (B) is preferably a (meth) acrylate containing an ether group.
For example, the ethylenically unsaturated monomer (B) may include compounds having two functional groups (i.e., difunctional compounds) such as 1, 6-hexanediol diacrylate, diallyl terephthalate, ethylene glycol dimethacrylate, 9-bis [4- (2-hydroxy-3-acryloxypropoxy) phenyl ] fluorene, 9-bis [4- (2-acryloxyethoxy) phenyl ] fluorene, bisphenol a diglycidyl ether, and the like; compounds having more than two functional groups (i.e., multifunctional compounds) such as pentaerythritol triacrylate, ethoxylated pentaerythritol tetraacrylate, pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, and the like; thiol compounds having one or more thiol groups such as trimethylolpropane tris (3-mercaptopropionate), 1, 4-butanediol bis (3-mercaptobutyrate), tris [2- (3-mercaptopropoxy) ethyl ] isocyanurate, pentaerythritol tetrakis (3-mercaptobutyrate) and the like. In this embodiment, the ethylenically unsaturated monomer (B) is preferably pentaerythritol pentaacrylate, pentaerythritol tetra (3-mercaptobutyrate) or a combination thereof.
The amount of the ethylenically unsaturated monomer (B) used is 5 to 25 parts by weight, preferably 16 to 21 parts by weight, based on 100 parts by weight of the resin (A).
Photopolymerization initiator (C)
The photopolymerization initiator (C) includes a compound represented by the following formula (C1):
in the formula (C1), R 1 Represents hydrogen or methoxy, preferably hydrogen; r is R 2 Represents hydrogen, fluorine, chlorine, bromine, methyl or methoxy, preferably hydrogen; r is R 3 Represents fluorine, chlorine, bromine, methyl or methoxy, preferably methoxy.
The photopolymerization initiator (C) may also include other photopolymerization initiators. For example, the photopolymerization initiator (C) may further include a hexaarylbisimidazole-based compound, a benzophenone-based compound, a thioxanthone-based compound, a diphenylphosphine oxide-based compound, a triazine-based compound, an acetophenone-based compound, a quinone-based compound, an acylphosphine oxide, an oxime ester-based compound, or other suitable photopolymerization initiator. The photopolymerization initiator (C) may be used alone or in combination of two or more. In the present embodiment, the photopolymerization initiator (C) is preferably a hexaarylbisimidazole-based compound, a benzophenone-based compound, or a combination thereof.
In this embodiment, the photopolymerization initiator (C) may further include a compound represented by the following formula (C2):
in the formula (C2), R 4 And R is R 5 Represents methylamino, ethylamino, cyclohexylamino, hydroxyethylamino, methoxy, methylethylamino or diethylamino, preferably diethylamino.
In the photopolymerization initiator (C), the weight ratio of the amount of the compound represented by the formula (C1) to the amount of the compound represented by the formula (C2) is 5:1 to 2:1, preferably 4:1 to 3:1.
The photopolymerization initiator (C) is used in an amount of 0.1 to 5 parts by weight, preferably 0.9 to 2 parts by weight, based on 100 parts by weight of the resin (A).
When the photosensitive resin composition includes the photopolymerization initiator (C), and the photopolymerization initiator (C) includes the compound represented by the formula (C1), the cured product of the photosensitive resin composition formed at a bake temperature of 150℃or less can be made to have good ink bleeding resistance and ink penetration resistance.
When the photosensitive resin composition includes the photopolymerization initiator (C), the photopolymerization initiator (C) includes the compound represented by the formula (C1) and further includes the compound represented by the formula (C2), the cured product of the photosensitive resin composition formed at the bake temperature of 150 ℃ or less can be made to have good ink bleeding resistance and ink penetration resistance.
Pigment (D)
The pigment (D) is not particularly limited, and an appropriate pigment may be selected according to the need. In this embodiment, the pigment (D) may include a white pigment (D-1). In addition, the pigment (D) may further include a black pigment (D-2).
In this embodiment, the white pigment (D-1) may be at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc, and montmorillonite, preferably titanium oxide (e.g., titanium dioxide).
Pigment (D) may further comprise black pigment (D-2). The black pigment (D-2) is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black, and preferably at least one selected from the group consisting of carbon black and titanium black.
The pigment (D) is used in an amount of 45 to 65 parts by weight, preferably 51 to 64 parts by weight, based on 100 parts by weight of the resin (a). In the pigment (D), the white pigment (D-1) may be used in an amount larger than that of the black pigment (D-2). The white pigment (D-1) is used in an amount of 35 to 90 parts by weight, preferably 51 to 64 parts by weight, based on 100 parts by weight of the resin (A).
Solvent (E)
The solvent (E) is not particularly limited, and an appropriate solvent may be selected according to the need. In this embodiment, the solvent (E) may include a low boiling point solvent (E-1). The boiling point of the low boiling point solvent (E-1) is 100 ℃ or lower. For example, the low boiling point solvent (E-1) may include butanone, ethyl acetate, dioxane, 1, 3-butanediol diacetate, or other suitable low boiling point solvents. In addition, the solvent (E) may further include a solvent having a boiling point exceeding 100℃such as propylene glycol monomethyl ether, methyl isobutyl ketone, propylene glycol monomethyl ether acetate (methoxy propyl acetate, PMA), dipropylene glycol dimethyl ether, 1, 2-propanediol diacetate, 3-cyclohexene-1-methanol, 1, 4-butanediol diacetate, 1, 6-diacetoxyhexane, 3-methoxybutyl acetate, ethylene glycol butyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol butyl ether acetate, triacetin, 1, 3-butanediol, diethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol methyl ether acetate, ethylene glycol diethyl ether acetate or other suitable solvents. For example, the solvent (E) may include a low boiling point solvent (E-1) and an appropriate amount of another solvent, wherein the other solvent may be used to dilute or disperse the pigment (D). The solvent (E) may be used alone or in combination of two or more. In the present embodiment, the solvent (E) is preferably butanone, ethyl acetate or a combination thereof, more preferably butanone.
The solvent (E) is used in an amount of 20 to 65 parts by weight, preferably 24 to 53 parts by weight, based on 100 parts by weight of the resin (A). The low boiling point solvent (E-1) is used in an amount of 25 to 100 parts by weight, preferably 35 to 100 parts by weight, based on 100 parts by weight of the solvent (E).
When the photosensitive resin composition includes the solvent (E), the photosensitive resin composition can be made to have an appropriate viscosity, thereby having good coating uniformity.
Surfactant (F)
The surfactant (F) is not particularly limited, and an appropriate surfactant may be selected according to the need. For example, the surfactant (F) may include cationic surfactants, anionic surfactants, nonionic surfactants, amphoteric surfactants, silicone surfactants, fluorine surfactants, or other suitable surfactants. The surfactant (F) may be used alone or in combination of two or more. In this embodiment, the surfactant (G) is preferably a polysiloxane-based surfactant, a fluorine-based surfactant, or a combination thereof, and more preferably a fluorine-based surfactant.
The surfactant (F) is used in an amount of 1 to 5 parts by weight, preferably 1 to 3 parts by weight, based on 100 parts by weight of the resin (A).
< method for producing photosensitive resin composition >
The method for producing the photosensitive resin composition is not particularly limited. For example, the resin (a), the ethylenically unsaturated monomer (B), the photopolymerization initiator (C), the pigment (D) and the solvent (E) are stirred in a stirrer to be uniformly mixed into a solution, and if necessary, the surfactant (F) may be added to uniformly mix them, thereby obtaining a liquid photosensitive resin composition.
< cured product and method for producing the same >
An exemplary embodiment of the present invention provides a cured product formed using the photosensitive resin composition. In addition, an exemplary embodiment of the present invention provides a method for manufacturing a cured product, including hard baking the photosensitive resin composition, wherein the temperature of the hard baking is 150 ℃ or less.
The cured product can be formed by applying the above photosensitive resin composition on a substrate to form a coating film, and subjecting the coating film to prebake (prebake), exposure, development, and hard bake (postrake). For example, after the photosensitive resin composition is coated on a substrate to form a coating film, vacuum drying is first performed, and then a pre-exposure baking (i.e., pre-baking) step is performed at a temperature of 90 ℃ for 1 minute. Next, exposure was performed using a mask having a predetermined pattern, the film surface was controlled to have a spacing of 100 μm from the mask, and a high-pressure mercury lamp was used at 150mJ/cm 2 Exposing the pre-baked coating film to light. Then, the exposed coating film was developed for 60 seconds. Then, the developed coating film was washed with distilled water and nitrogen gas was blown to dry the coating film. Then, hard baking is performed at a temperature of 150 ℃ or less for 60 minutes to form a cured product on the substrate.
The substrate may be a glass substrate, a plastic substrate material such as a Polyethersulfone (PES) plate, a Polycarbonate (PC) plate, or a Polyimide (PI) film, or other light-permeable substrate, the type of which is not particularly limited.
The coating method is not particularly limited, but a spray coating method, a roll coating method, a spin coating method, or the like can be used, and in general, a spin coating method is widely used. Further, a coating film is formed, and then in some cases, the residual solvent may be partially removed under reduced pressure.
The developer is not particularly limited, and an appropriate developer may be selected according to the need. For example, the developer may be sodium bicarbonate (NaHCO 3 ) The concentration of the aqueous solution may be 0.1 wt%.
< light emitting device >
An exemplary embodiment of the present invention provides a light emitting device including a light conversion layer, wherein the light conversion layer includes the above-described cured product or a cured product produced by the above-described method of producing a cured product.
Fig. 1 is a schematic view of a light emitting device according to an embodiment of the present invention. The light emitting device 10 includes a substrate 120, a light conversion layer 160, and a backlight module 200. In this embodiment, the light emitting device 10 may further include a filter layer 140. The light emitting device 10 may further include a polarizing plate, an alignment film, a liquid crystal (not shown), or other components known to those skilled in the art, and will not be described in detail herein.
In this embodiment, the substrate 120 is a light-transmissive substrate. The substrate 120 may be made of glass, an organic polymer (such as Polyimide (PI), polyethersulfone (PES), or Polycarbonate (PC)), or other suitable materials.
The filter layer 140 is located under the substrate 120. In the present embodiment, the filter layer 140 may include a red filter pattern 142, a green filter pattern 144, and a blue filter pattern 146. In addition, the filter layer 140 may further include a plurality of light shielding patterns 148. Preferably, there may be a light shielding pattern 148 between each of the light filtering patterns such that any one of the red, green and blue light filtering patterns 142, 144 and 146 exists between every two adjacent light shielding patterns 148 of the plurality of light shielding patterns 148. In addition, the red filter pattern 142, the green filter pattern 144, and the blue filter pattern 146 do not contain quantum dots.
The light conversion layer 160 is located under the substrate 120. The light conversion layer 160 is located under the filter layer 140. The filter layer 140 is located between the substrate 120 and the light conversion layer 160. The light conversion layer 160 is a light conversion layer formed using the above-described resin composition. In the present embodiment, the light conversion layer 160 includes a plurality of pattern layers 160P and a plurality of cured objects 168. The plurality of pattern layers 160P include a red pattern layer 162, a green pattern layer 164, and a diffuser pattern layer 166. The hardened substance 168 is arranged between the pattern layers. The plurality of cured objects 168 are interposed between the plurality of pattern layers 160P such that one of the plurality of pattern layers 160P is present between each two adjacent cured objects 168 of the plurality of cured objects 168. For example, the plurality of cured objects 168 are respectively interposed between the red pattern layer 162, the green pattern layer 164 and the diffuser pattern layer 166, that is, any one of the red pattern layer 162, the green pattern layer 164 and the diffuser pattern layer 166 is present between every two adjacent cured objects 168 of the plurality of cured objects 168. Here, the cured product 168 serves as a reflective layer.
The red pattern layer 162 may include red quantum dots. The green pattern layer 164 may include green quantum dots. The scatterer pattern layer 166 may be free of quantum dots. In the present embodiment, the red pattern layer 162 of the light conversion layer 160 may be disposed opposite to the red filter pattern 142 of the filter layer 140, the green pattern layer 164 of the light conversion layer 160 may be disposed opposite to the green filter pattern 144 of the filter layer 140, and the diffuser pattern layer 166 of the light conversion layer 160 may be disposed opposite to the blue filter pattern 146 of the filter layer 140. For example, the red pattern layer 162 is located under the red filter pattern 142, the green pattern layer 164 is located under the green filter pattern 144, and the diffuser pattern layer 166 is located under the blue filter pattern 146. In addition, the light shielding pattern 148 in the filter layer 140 is located on the hardened material 168 in the light conversion layer 160.
The backlight module 200 is disposed at a side of the substrate 120 where the light conversion layer 160 is disposed. The backlight module 200 irradiates light to the light conversion layer 160. For example, the backlight module 200 is adapted to provide a light source, and the light emitted from the light source sequentially passes through the light conversion layer 160, the filter layer 140 and the substrate 120 to provide a converted light source. In the present embodiment, the types of light sources used in the backlight module 200 may include organic light emitting diodes (organic light emitting diode, OLED), micro light emitting diodes (Micro-LEDs), or other suitable light sources. In the present embodiment, the backlight module 200 is a light source emitting blue light. After the blue light emitted by the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162 and the green quantum dots in the green pattern layer 164, converted light can be emitted from the red pattern layer 162 and the green pattern layer 164 respectively, and red light and green light can be emitted through the red filter pattern 142 and the green filter pattern 144 of the filter layer 140 respectively; the blue light emitted from the backlight module 200 directly passes through the scatterer pattern layer 166 without quantum dots to emit blue light, and then passes through the blue filter pattern 146 of the filter layer 140 to emit blue light. For example, when the light emitted by the light source through the light conversion layer 160 and the filter layer 140 includes visible light (e.g., red, green, and blue light), the light emitting device 10 may be applied to a display device or other suitable device. Thus, the display device of the light emitting device 10 including the light conversion layer formed of the above resin composition can exhibit better brightness and color purity than conventional display devices. However, the present invention is not limited thereto, and in one embodiment, the filter layer 140 (the red filter pattern 142) does not filter the near infrared light, so the present invention can be used for emitting the near infrared light.
Fig. 2 is a schematic view of a light emitting device according to another embodiment of the present invention. It should be noted that the embodiment of fig. 2 uses component reference numerals and partial contents of the embodiment of fig. 1, where the same or similar reference numerals are used to denote the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, reference is made to the foregoing embodiments, and the following embodiments are not repeated.
The main differences between the embodiment of fig. 2 and the embodiment of fig. 1 are that: the light emitting device 20 does not have the filter layer 140.
Referring to fig. 2, the light emitting device 20 includes a substrate 120, a light conversion layer 160, and a backlight module 200. In the present embodiment, the light conversion layer 160 is disposed on the substrate 120, and there is no filter layer containing no quantum dots between the light conversion layer 160 and the substrate 120.
In the present embodiment, the light emitted by the light source provided by the backlight module 200 sequentially passes through the light conversion layer 160 and the substrate 120 to provide converted light source. After the blue light emitted by the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162 and the green quantum dots in the green pattern layer 164, converted light can be emitted from the red pattern layer 162 and the green pattern layer 164 respectively; the blue light emitted from the backlight module 200 directly passes through the scattering body pattern layer 166 without quantum dots to emit blue light. For example, when the light emitted from the light source through the light conversion layer 160 includes visible light (e.g., red, green, and blue light), the light emitting device 20 may be applied to a display device or other suitable device. Therefore, compared with the conventional display device and/or the display device comprising the light emitting device 10, the display device comprising the light emitting device 20 not only can show better brightness and color purity, but also can omit the step of manufacturing the filter layer so as to reduce the manufacturing cost of the display device. For example, when the light emitted by the light source through the light conversion layer 160 includes near-infrared light (e.g., having a wavelength of about 780 nm to 800 nm), the light emitting device 20 may be applied to an electromagnetic radiation device or other suitable device.
Hereinafter, the present invention will be described in detail with reference to examples. The following examples are provided to describe the invention and the scope of the invention includes the scope of the claims and their substitutes and modifications, and is not limited to the scope of the examples.
Examples of photosensitive resin compositions and cured articles
Examples 1 to 10 and comparative examples 1 to 10 of the photosensitive resin composition and cured product are described below:
example 1
a. Photosensitive resin composition
The photosensitive resin composition of example 1 was prepared by adding 42.83 parts by weight of resin a-1 (manufactured by Miwon common co., ltd.), 57.17 parts by weight of resin a-5 (manufactured by Miwon common co., ltd.), 17 parts by weight of pentaerythritol pentaacrylate, 1.99 parts by weight of pentaerythritol tetrakis (3-mercaptobutyrate), 0.88 parts by weight of photopolymerization initiator C-1, 0.22 parts by weight of photopolymerization initiator C-2, and 58.94 parts by weight of a titanium dioxide dispersion (manufactured by Sanyang pigment company (Sanyo Color Works, ltd.)) to 41.72 parts by weight of butanone, and stirring uniformly with a stirrer.
b. Cured product
The photosensitive resin composition prepared in example 1 was applied to a substrate by spin coating (spin coater model MS-A150, manufactured by Mikasa Co., ltd., rotation speed: about 165 rpm). Then, vacuum drying (vacuum gauge model GP-2ARY, manufactured by Ubeck technologies Co., ltd.) was performed at a pressure of 65 Pa for 1 minute. Next, a pre-baking was performed at a temperature of 90℃for 60 seconds to form a film. Then, using a photomask having an elongated transmission pattern of 80 μm×240 μm, the distance between the photomask and the film surface was controlled to be about 100 μm, and a high-pressure mercury lamp (model ELS106SA, manufactured by the company of science and technology of Yi-Lixin systems, inc. (ELS System Technology co., ltd.) containing g, h, i rays was used ) At 150mJ/cm 2 Exposing the pre-baked coating film to light to form a semi-finished product. Then, development was performed at a temperature of 23 to 28℃for 60 seconds using an aqueous sodium bicarbonate solution having a concentration of 0.1 wt% as a developing solution. Then, the developed coating film was washed with distilled water and nitrogen gas was blown to dry the coating film. Then, the cured product having a pattern thickness of 8 μm was obtained by hard baking at 120℃for 60 minutes. The cured products thus obtained were evaluated in the following evaluation manners, and the results are shown in table 2.
Examples 2 to 10 and comparative examples 1 to 10
The photosensitive resin compositions of examples 2 to 10 and comparative examples 1 to 10 were prepared in the same procedure as in example 1, and they were different in that: the types of the components of the photosensitive resin composition and the amounts thereof used were changed (as shown in table 2), wherein the components/compounds corresponding to the numbers in table 2 are shown in table 1. The cured products of the obtained photosensitive resin compositions were evaluated in the following evaluation manners, and the results are shown in table 2.
TABLE 1
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TABLE 2
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TABLE 2 ()
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< evaluation mode >
Method for preparing ink composition
Based on the ink composition used in an amount of 100 parts by weight, 34.5 parts by weight of diethylene glycol diethyl ether acetate (ethyl diglycol acetate, EDGAC), 34.5 parts by weight of propylene glycol monomethyl ether acetate (2-acetic-1-methoxpropane, PGMEA), 3.2 parts by weight of a titanium dioxide dispersion, 1.8 parts by weight of brilliant best solid (Irgacure) OXE01 (trade name; manufactured by BASF Taiwan Ltd.), 6.1 parts by weight of polydipentaerythritol hexaacrylate (DPHA), 11.9 parts by weight of resin A-3, and 8.0 parts by weight of red quantum dots were placed in a stirrer and stirred to be uniformly mixed into a solution state. After they are mixed uniformly, a liquid ink composition is obtained.
a. Ink exudation resistance
The prepared ink composition was sprayed into an opening pattern (size 80. Mu.m. Times.240. Mu.m) of a hardened substance having a thickness of 8. Mu.m, by a nanomaterial spray printer (model DMP-2850, manufactured by Fujifilm Dimatix, inc.), so that the thickness of the ink composition was about 6. Mu.m. Then, the surface of the cured product was observed by an optical microscope (model MX61, manufactured by olympus corporation). When the ink composition 310 stays in the opening pattern 300A of the cured product 300 for a longer time and the bubbles 300B observed at the surface 300S of the cured product are smaller (as shown in fig. 3), it is shown that the ink composition is not easily oozed out from the surface of the cured product, i.e., the cured product has good ink oozing resistance.
The evaluation criteria for ink bleeding resistance were as follows:
o: 60 minutes < residence time, and no bubbles were observed on the surface of the cured product;
delta: a residence time of 30 minutes or less and 60 minutes or less, and the surface of the cured product is observed to be slightly micro-bubbles;
and (3) the following steps: residence time < 30 minutes, and many bubbles were observed on the surface of the cured product.
b. Ink permeation resistance
The prepared ink composition was sprayed into an opening pattern (size 80. Mu.m. Times.240. Mu.m) of a hardened substance having a thickness of 8. Mu.m, by a nanomaterial spray printer (model DMP-2850, manufactured by Fuji North Co., ltd.) to make the thickness of the ink composition about 6. Mu.m. Next, the initial film thickness h1 of the ink composition 310 in the opening pattern 300A of the cured product 300 and the film thickness h2 after being left for 30 minutes (as shown in fig. 4A and 4B) were observed by a color three-dimensional laser microscope (model VK-9700, manufactured by taiwan kens corporation), and the film thickness change rate was calculated according to the following formula. When the film thickness change rate is smaller, it is shown that the ink composition is less likely to penetrate into the cured product, i.e., the cured product has good ink penetration resistance.
The evaluation criteria for ink penetration resistance were as follows:
o: the film thickness change rate is less than or equal to 5 percent;
and (3) the following steps: 5% < film thickness change rate.
< evaluation results >
As is clear from table 2, the photosensitive resin compositions including the alkali-soluble resin (a-1) having the structural unit of the specific structure and the photopolymerization initiator (C) including the compound represented by the formula (C1) have excellent ink bleeding resistance and ink penetration resistance at the hard bake temperature of 150 ℃ or less, and are applicable to the light conversion layer and the light emitting device. In contrast, the photosensitive resin composition containing no alkali-soluble resin (A-1) having a structural unit of a specific structure was poor in ink bleeding resistance and ink penetration resistance in cured products (comparative examples 5 and 6) formed at a bake temperature of 150℃or less. When the photopolymerization initiator (C) of the photosensitive resin composition does not include the compound represented by the formula (C1), the cured product (comparative examples 2 to 5 and 8) formed at a bake temperature of 150 ℃ or less is poor in ink bleeding resistance and/or ink penetration resistance.
In addition, when the weight average molecular weight of each resin in the alkali-soluble resin (a-1) of the photosensitive resin composition is more than 13000 and less than or equal to 85000, the cured products (examples 1 to 10) formed at the hard bake temperature of 150 ℃ or less have good ink bleeding resistance and ink penetration resistance. In contrast, when the weight average molecular weight of each resin in the alkali-soluble resin (a-1) of the photosensitive resin composition is 13000 or more than 85000, the cured product (comparative example 7) formed at a bake temperature of 150 ℃ or less is poor in ink bleeding resistance and/or ink penetration resistance.
In addition, when the photopolymerization initiator (C) of the photosensitive resin composition further includes the compound represented by the formula (C2), the cured products (examples 1 to 10) formed at the bake temperature of 150℃or less have good ink bleeding resistance and ink penetration resistance. In contrast, when the photopolymerization initiator (C) of the photosensitive resin composition does not include the compound represented by the formula (C2), the cured product (comparative examples 1, 3 to 5, 8) formed at a bake temperature of 150 ℃ or less is poor in ink bleeding resistance and/or ink penetration resistance.
On the other hand, when the alkali-soluble resin (a-1) of the photosensitive resin composition does not include the structural unit having a specific structure (comparative examples 5, 6, 10), the cured product (comparative example 10) of the photosensitive resin composition formed at a bake temperature of greater than 150 ℃ can have better ink bleeding resistance and ink penetration resistance than the cured product (comparative examples 5, 6) of the photosensitive resin composition formed at a bake temperature of 150 ℃ or less.
In addition, when the photopolymerization initiator (C) of the photosensitive resin composition does not include the compound represented by the formula (C1) (comparative examples 2 to 5, 8 to 10), the cured product (comparative examples 9 to 10) of the photosensitive resin composition formed at a bake temperature of greater than 150 ℃ can have better ink bleeding resistance and/or ink penetration resistance than the cured product (comparative examples 2 to 5, 8) of the photosensitive resin composition formed at a bake temperature of 150 ℃ or less.
In summary, when the photosensitive resin composition of the present invention contains the alkali-soluble resin (a-1) having a specific structural unit and the photopolymerization initiator (C) containing the compound represented by the formula (C1), the cured product of the photosensitive resin composition at the bake temperature of 150 ℃ or less has excellent ink bleeding resistance and ink penetration resistance, and is suitable for use in light conversion layers and light emitting devices, and the performance of the light emitting devices can be improved. The photosensitive resin composition of the present invention is also suitable for forming a cured product having excellent ink bleeding resistance and ink penetration resistance at a hard bake temperature of 150 ℃ or higher, and is suitable for use in a light conversion layer and a light emitting device.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but rather is capable of modification and variation without departing from the spirit and scope of the present invention.
Claims (23)
1. A photosensitive resin composition comprising:
a resin (A) comprising an alkali-soluble resin (A-1), other resin (A-2), or a combination thereof, the alkali-soluble resin (A-1) comprising a structural unit represented by the following formula (A1):
Wherein represents a bonding position;
an ethylenically unsaturated monomer (B);
a photopolymerization initiator (C) comprising a compound represented by the following formula (C1);
pigment (D); and
solvent (E):
in the formula (C1), R 1 Represents hydrogen or a methoxy group, and is preferably a hydroxyl group,
R 2 represents hydrogen, fluorine, chlorine, bromine, methyl or methoxy,
R 3 represents fluorine, chlorine, bromine, methyl or methoxy.
2. The photosensitive resin composition according to claim 1, wherein each resin of the alkali-soluble resin (a-1) has a weight average molecular weight of more than 13000 and less than or equal to 85000.
3. The photosensitive resin composition according to claim 1, wherein each of the alkali-soluble resin (a-1) and the other resin (a-2) has an acid value of 60mgKOH/g to 135mgKOH/g.
4. The photosensitive resin composition according to claim 1, wherein the alkali-soluble resin (a-1) comprises one or more alkali-soluble resins comprising a structural unit represented by formula (A1), and in the alkali-soluble resin (a-1), the structural unit represented by formula (A1) is 35 mol% to 65 mol% based on the total of all structural units included in the alkali-soluble resin each comprising the structural unit represented by formula (A1).
5. The photosensitive resin composition according to claim 1, wherein the ethylenically unsaturated monomer (B) comprises an alkyl (meth) acrylate, a hydroxyl group-containing (meth) acrylate, an ether group-containing (meth) acrylate, an alicyclic (meth) acrylate, or a combination thereof.
6. The photosensitive resin composition according to claim 1, wherein the ethylenically unsaturated monomer (B) comprises (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, third butyl (meth) acrylate, lauryl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, ethoxyethyl (meth) acrylate, glycidyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, or a combination thereof.
7. The photosensitive resin composition according to claim 1, wherein the photopolymerization initiator (C) further comprises a compound represented by the following formula (C2):
in the formula (C2), R 4 And R is R 5 Respectively represents methylamino, ethylamino, cyclohexylamino, hydroxyethylamino, methoxy, methylethylamino or diethylamino.
8. The photosensitive resin composition according to claim 7, wherein in the photopolymerization initiator (C), a weight ratio of the compound represented by the formula (C1) to the compound represented by the formula (C2) is 5:1 to 2:1.
9. The photosensitive resin composition according to claim 1, wherein the pigment (D) comprises a white pigment (D-1), the white pigment (D-1) being at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc, and montmorillonite.
10. The photosensitive resin composition according to claim 9, wherein the pigment (D) comprises a black pigment (D-2), the black pigment (D-2) being at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, titanium black.
11. The photosensitive resin composition according to claim 1, wherein the solvent (E) comprises a low boiling point solvent (E-1), the low boiling point solvent (E-1) having a boiling point of 100 ℃ or less.
12. The photosensitive resin composition according to claim 11, wherein the low boiling point solvent (E-1) is used in an amount of 25 to 100 parts by weight based on 100 parts by weight of the solvent (E).
13. The photosensitive resin composition according to claim 1, further comprising a surfactant (F), wherein the surfactant (F) is used in an amount of 1 to 5 parts by weight based on 100 parts by weight of the resin (a).
14. The photosensitive resin composition according to claim 1, further comprising a surfactant (F), wherein the surfactant (F) comprises a fluorine-based surfactant.
15. The photosensitive resin composition according to claim 1, wherein the amount of the ethylenically unsaturated monomer (B) is 5 to 25 parts by weight, the amount of the photopolymerization initiator (C) is 0.1 to 5 parts by weight, the amount of the pigment (D) is 45 to 65 parts by weight, and the amount of the solvent (E) is 20 to 65 parts by weight, based on 100 parts by weight of the resin (a).
16. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 15.
17. A method for producing a cured product, comprising:
the photosensitive resin composition according to any one of claims 1 to 15 is hard baked at a temperature of 150 ℃ or less.
18. A light conversion layer comprising the cured product according to claim 16 or a cured product produced by the method for producing a cured product according to claim 17.
19. The light-converting layer of claim 18, wherein the cured object is a plurality of cured objects, the light-converting layer further comprising a plurality of pattern layers, wherein the plurality of cured objects are interposed between the plurality of pattern layers such that one of the plurality of pattern layers is present between each two adjacent cured objects of the plurality of cured objects.
20. The light conversion layer of claim 18, further comprising a plurality of pattern layers, wherein the pattern layers are red pattern layers, green pattern layers, or diffuser pattern layers.
21. A light emitting device comprising the light conversion layer of any one of claims 18 to 20.
22. The light emitting device of claim 21, further comprising:
a substrate on which the light conversion layer is located; and
and the backlight module is arranged on one side of the substrate provided with the light conversion layer.
23. The light emitting device of claim 22, further comprising a filter layer between the substrate and the light conversion layer.
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