CN113703284A - Resin composition, light conversion layer, and light emitting device - Google Patents
Resin composition, light conversion layer, and light emitting device Download PDFInfo
- Publication number
- CN113703284A CN113703284A CN202010434499.2A CN202010434499A CN113703284A CN 113703284 A CN113703284 A CN 113703284A CN 202010434499 A CN202010434499 A CN 202010434499A CN 113703284 A CN113703284 A CN 113703284A
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- China
- Prior art keywords
- resin composition
- light
- weight
- parts
- conversion layer
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 115
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 82
- 239000002096 quantum dot Substances 0.000 claims abstract description 75
- 150000001875 compounds Chemical class 0.000 claims abstract description 35
- -1 phenyl compound Chemical class 0.000 claims abstract description 35
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 21
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 37
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005977 Ethylene Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 129
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 24
- 238000000576 coating method Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 15
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- 230000000996 additive effect Effects 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
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- 238000004519 manufacturing process Methods 0.000 description 6
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 4
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
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- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 4
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- 150000002431 hydrogen Chemical group 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- CFXQEHVMCRXUSD-UHFFFAOYSA-N 1,2,3-Trichloropropane Chemical compound ClCC(Cl)CCl CFXQEHVMCRXUSD-UHFFFAOYSA-N 0.000 description 2
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- AFZZYIJIWUTJFO-UHFFFAOYSA-N 1,3-diethylbenzene Chemical compound CCC1=CC=CC(CC)=C1 AFZZYIJIWUTJFO-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 2
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical compound CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 2
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
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- 239000000463 material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229940078552 o-xylene Drugs 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
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- 235000012239 silicon dioxide Nutrition 0.000 description 2
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical class C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
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- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical compound CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
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- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
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- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a resin composition, a light conversion layer and a light emitting device. The resin composition comprises quantum dots (A), an alkali-soluble resin (B), an ethylene unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl compound (F). The phenyl compound (F) includes at least one of a compound represented by the following formula (F-1) and a compound represented by the following formula (F-2). The phenyl-based compound (F) is used in an amount of 0.05 to 5 parts by weight, based on 100 parts by weight of the total amount of the resin composition used.
In the formulae (F-1) and (F-2), R1、R3、R4Y, Z, m, n and p are as defined in the detailed description.
Description
Technical Field
The present invention relates to a resin composition, and more particularly, to a resin composition suitable for a light conversion layer, a light conversion layer and a light emitting device.
Background
With the development of display device technology, in order to improve the display quality of the display device, in recent years, a light conversion layer containing quantum dots is provided in the display device to improve the brightness and color purity of a display screen. However, the quantum dot-containing resin composition for manufacturing the light conversion layer has a problem of poor storage stability at room temperature, which affects the stability of the manufactured light conversion layer and the performance of a device using the light conversion layer.
Disclosure of Invention
Accordingly, the present invention provides a resin composition, a light conversion layer, and a light emitting device that can form a pattern having good viscosity stability, patterning ability, resolution, and pattern stability.
The resin composition comprises quantum dots (A), alkali-soluble resin (B), an ethylene unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl compound (F). The phenyl compound (F) includes at least one of a compound represented by the following formula (F-1) and a compound represented by the following formula (F-2),
in the formula (F-1), R1Is an alkyl group, m is an integer of 0 to 3,
z is alkylene,
-O-or combinations thereof, R2Is a hydrogen or an alkyl group,
when n is 1, Y is hydrogen or alkyl,
when n is 2, Y is a single bond, alkylene, S,
Or a combination thereof,
when n is 3, Y is a single bond, a trivalent alkyl group, a trivalent phenyl group,
Or a combination thereof,
when n is 4, Y is carbon,
indicates a bonding site;
in the formula (F-2), R3Is alkyl, R4Is hydrogen or phenyl, p is 0 or 1, and the phenyl-based compound (F) is used in an amount of 0.05 to 5 parts by weight based on 100 parts by weight of the total amount of the resin composition used.
In an embodiment of the invention, the quantum dots (a) include at least one selected from a group consisting of green quantum dots and red quantum dots. The light emission wavelength of the green quantum dots is in the range of greater than or equal to 500 nm to less than 600 nm. The light emission wavelength of the red quantum dots is in a range from greater than or equal to 600 nm to less than or equal to 800 nm.
In an embodiment of the invention, the phenyl compound (F) includes at least one selected from the group consisting of:
in an embodiment of the invention, the resin composition further includes a scatterer (G). The scatterer (G) is used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the sum of the amounts of the resin composition used.
In an embodiment of the invention, the resin composition further includes a scatterer (G). The scatterer (G) includes at least one selected from the group consisting of titanium dioxide, silicon dioxide, barium titanate, zirconium oxide, zinc oxide, and aluminum oxide.
In one embodiment of the present invention, the quantum dot (a) is used in an amount of 0.5 to 15 parts by weight, the alkali-soluble resin (B) is used in an amount of 0.5 to 20 parts by weight, the ethylenically unsaturated monomer (C) is used in an amount of 0.5 to 20 parts by weight, and the photoinitiator (D) is used in an amount of 0.01 to 5 parts by weight, based on 100 parts by weight of the total amount of the resin composition.
In one embodiment of the present invention, the solvent (E) is used in an amount of 65 to 85 parts by weight, based on 100 parts by weight of the total amount of the resin composition used.
The light conversion layer of the present invention is formed from the above resin composition.
In an embodiment of the invention, the light conversion layer further includes a red pattern layer, a green pattern layer and a scatterer pattern layer. The red pattern layer includes red quantum dots. The green pattern layer includes green quantum dots. The scatterer pattern layer does not contain quantum dots.
In an embodiment of the invention, the light emission wavelength of the green quantum dot is greater than or equal to 500 nm and less than 600 nm, and the light emission wavelength of the red quantum dot is greater than or equal to 600 nm and less than or equal to 800 nm.
The light emitting device of the invention comprises the light conversion layer.
In an embodiment of the invention, the light emitting device further includes a substrate and a backlight module. The light conversion layer is located on the substrate. The backlight module is arranged on one side of the substrate, on which the light conversion layer is arranged.
In an embodiment of the invention, the light emitting device further includes a filter layer. The filter layer is located between the substrate and the light conversion layer. The filter layer includes a red filter pattern, a green filter pattern, and a blue filter pattern. The red filter pattern, the green filter pattern, and the blue filter pattern do not contain quantum dots.
Based on the above, the resin composition of the present invention uses the phenyl-based compound (F) of a specific structure, and the amount of the phenyl-based compound (F) used is 0.05 to 5 parts by weight based on 100 parts by weight of the total amount of the resin composition used. Therefore, the resin composition has good viscosity stability and patterning capability, and when the resin composition is used for forming the light conversion layer, the light conversion layer has good resolution and pattern stability, so that the resin composition is suitable for a light emitting device.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a light emitting device according to another embodiment of the present invention.
Description of reference numerals:
10. 20: light emitting device
120: substrate
140: filter layer
142: red filter pattern
144: green light filtering pattern
146: blue color filter pattern
148: shading pattern
160: light conversion layer
162: red pattern layer
164: green pattern layer
166: scatterer pattern layer
168: bank layer
200: backlight module
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, without departing from the spirit or scope of the present invention. In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification.
< resin composition >
The invention provides a resin composition, which comprises quantum dots (A), alkali-soluble resin (B), an ethylene unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl compound (F). The resin composition of the present invention may further include a scatterer (G) and an additive (H) such as a leveling agent, if necessary. Hereinafter, the above-mentioned various components will be described in detail.
In the following, acrylic acid and/or methacrylic acid is represented by (meth) acrylic acid, and acrylate and/or methacrylate is represented by (meth) acrylate.
Quantum dots (A)
In this embodiment, the quantum dots (a) may include at least one selected from the group consisting of green quantum dots and red quantum dots. The green quantum dots and the red quantum dots can absorb light (such as blue light) emitted by the backlight module, and emit green light and red light respectively after energy conversion. The light emission wavelength of the green quantum dots can range from greater than or equal to about 500 nanometers to less than about 600 nanometers. The light emission wavelength of the red quantum dots may range from greater than or equal to about 600 nanometers to less than or equal to about 800 nanometers. In this embodiment, the light emission wavelength of the quantum dot can be adjusted according to the requirement. For example, the emission wavelength of the quantum dot may be adjusted depending on the use of the light emitting device using the light conversion layer formed of the resin composition.
For example, quantum dots (A) may include quantum dots composed of group II-VI elements, quantum dots composed of group III-V elements, or other suitable quantum dots. The quantum dots may be single-layer structured quantum dots or multi-layer structured quantum dots. The quantum dot of the multilayer structure may have a core-shell structure.
The quantum dot composed of group II to VI elements is not particularly limited, and a suitable quantum dot composed of group II to VI elements may be selected according to the need. For example, quantum dots composed of group II-VI elements may include CdS, CdSe, CdTe, ZnS, ZnSe, HgS, or other suitable quantum dots. The quantum dots composed of group II to VI elements may be used singly or in combination of two or more.
The quantum dot composed of a group III-V element is not particularly limited, and a suitable quantum dot composed of a group III-V element may be selected according to the need. For example, quantum dots composed of group III-V elements may include InP, InAs, or other suitable quantum dots. The quantum dots composed of group III-V elements may be used alone or in combination of two or more.
The quantum dot (a) is used in an amount of 0.5 to 15 parts by weight, based on 100 parts by weight of the total amount of the resin composition.
Alkali soluble resin (B)
The alkali-soluble resin (B) is not particularly limited, and an appropriate alkali-soluble resin may be selected as required. In this embodiment, the alkali-soluble resin (B) may be a (meth) acrylic resin. For example, the alkali-soluble resin (B) may be composed of (meth) acrylic acid, an alkyl (meth) acrylate, a hydroxyl group-containing (meth) acrylate, an ether group-containing (meth) acrylate, an alicyclic (meth) acrylate, or other suitable monomers. The alkali-soluble resin (B) may be composed of a single monomer or may be composed of a plurality of monomers.
The alkyl (meth) acrylate may include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, t-butyl (meth) acrylate, benzyl (meth) acrylate, lauryl (meth) acrylate, or other suitable alkyl (meth) acrylates.
The hydroxyl-containing (meth) acrylate may include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, or other suitable hydroxyl-containing (meth) acrylates.
The (meth) acrylate containing an ether group may include ethoxyethyl (meth) acrylate, glycidyl (meth) acrylate, or other suitable (meth) acrylates containing an ether group.
The alicyclic (meth) acrylate may include cyclohexyl (meth) acrylate, isophorone (meth) acrylate, dicyclopentadienyl (meth) acrylate, or other suitable alicyclic (meth) acrylates.
For example, the alkali-soluble resin (B) may be one alkali-soluble resin or a combination of a plurality of alkali-soluble resins. For example, the alkali-soluble resin (B) may be the alkali-soluble resin (B-1) described below, the alkali-soluble resin (B-2) described below, or a combination thereof.
The structural unit contained in the alkali-soluble resin (B-1) is a structural unit represented by the formula (B-1), a structural unit represented by the formula (B-2), or a structural unit represented by the formula (B-3). The structural unit contained in the alkali-soluble resin (B-2) is a structural unit represented by the formula (B-2), a structural unit represented by the formula (B-4), a structural unit represented by the formula (B-5), or a structural unit represented by the formula (B-6). In this embodiment, the weight average molecular weight of the alkali-soluble resin (B-1) may be 13500 to 16500, and the weight average molecular weight of the alkali-soluble resin (B-2) may be 11000 to 14000, but is not limited thereto.
In the structural units represented by the formulae (b-1) to (b-6), a represents a bonding site;
in the structural unit represented by the formula (b-5),
represents an alkyl group having 1 to 10 carbon atoms.
The alkali-soluble resin (B) is used in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the total amount of the resin composition used.
When the resin composition includes the alkali-soluble resin (B), the resin composition can be provided with good patterning ability, and thus a light conversion layer formed therefrom can be provided with good resolution.
Ethylenically unsaturated monomer (C)
The ethylenically unsaturated monomer (C) is not particularly limited, and an appropriate ethylenically unsaturated monomer can be selected as required. In this embodiment, the ethylenically unsaturated monomer (C) includes at least one ethylenically unsaturated group. The ethylenically unsaturated monomer (C) may include at least one selected from the group consisting of a monofunctional monomer, a difunctional monomer, and a polyfunctional monomer, wherein the polyfunctional monomer is an ethylenically unsaturated monomer having three or more ethylenically unsaturated groups, preferably a polyfunctional monomer.
For example, the ethylenically unsaturated monomer (C) may include isobornyl methacrylate, 2-phenoxyethyl acrylate, ethoxyethoxyethyl acrylate, tricyclodecane dimethanol diacrylate, 1, 6-hexanediol diacrylate, ethylene glycol dimethacrylate, pentaerythritol triacrylate, ethoxylated pentaerythritol tetraacrylate, pentaerythritol hexaacrylate, or other suitable monomers, preferably pentaerythritol hexaacrylate. The ethylenically unsaturated monomer (C) may be used alone or in combination of two or more.
The ethylenically unsaturated monomer (C) is used in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the total amount of the resin composition used.
When the resin composition includes the ethylenically unsaturated monomer (C), the resin composition can be provided with good patternability, and thus the light conversion layer formed therefrom can have good resolution.
Photoinitiator (D)
The photoinitiator (D) includes at least one selected from the group consisting of triazine compounds, acetophenone compounds, benzophenone compounds, diimidazole compounds, thioxanthone compounds, quinone compounds, acylphosphine oxide (acylphosphine oxide) and acyloxime compound (acyloxime), and preferably includes at least one selected from the group consisting of acyloxime compound and acetophenone compound. However, the present invention is not limited thereto, and the photoinitiator (D) may also include other suitable photoinitiators.
The triazine compound may include chemcure-PAG-1 (trade name; manufactured by Hengqiao industries, Ltd.), chemcure-PAG-2 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable triazine compounds. The triazine compound may be used alone or in combination of two or more.
The acetophenone compounds may include Irgacure 907, 369E (trade name; manufactured by BASF corporation), chemcure-96 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable acetophenone compounds. The acetophenone compounds can be used alone or in combination.
The diphenyl ketone compound may include chemcure-BP, chemcure-64 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable diphenyl ketone compounds. The diphenyl ketone compound may be used alone or in combination of two or more.
The bisimidazoles may include Chemcure-BCIM, Chemcure-TCDM (trade name; manufactured by Hengqiao industries, Inc.), or other suitable bisimidazoles. The bisimidazole compounds may be used alone or in combination of two or more.
Thioxanthone compounds may include Irgacure ITX (trade name; manufactured by BASF corporation) or other suitable thioxanthone compounds. The thioxanthone compounds may be used singly or in combination.
The quinone compound can be selected from suitable quinone compounds. The quinone compound may be used alone or in combination of two or more.
The acylphosphine oxide may include brilliant good solids TPO, brilliant good solids 819 (trade name; manufactured by BASF corporation), or other suitable acylphosphine oxides. The phosphine oxide may be used alone or in combination of two or more.
The acyloxime-based compound may include Brilliant OxE-01, OxE-02, OxE-03, OxE-04 (trade name; manufactured by BASF corporation) or other suitable acyloxime-based compounds. The acyloxime-based compound may be used alone or in combination of two or more.
The photoinitiator (D) is used in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the total amount of the resin composition used.
When the resin composition includes the photoinitiator (D), the resin composition can be provided with good patternability, and thus the light conversion layer formed therefrom can have good resolution.
Solvent (E)
The solvent (E) is not particularly limited, and an appropriate solvent may be selected according to the requirements. For example, the solvent (E) may include 1,2, 3-trichloropropane, 1, 3-butanediol, benzyl alcohol, 1, 3-butanediol diacetate, 1, 4-dioxane, 2-heptanone, 2-methyl-1, 3-propanediol, cyclohexanone, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene, N-dimethylacetamide, N-butylbenzene, N-propyl acetate, N-methylpyrrolidone, o-xylene, p-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, isophorone (isophorone), ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, diisobutyl ketone, cyclohexanol acetate, dipropylene glycol dimethyl ether, dipropylene glycol monomethyl ether acetate, benzyl alcohol, 1, 3-butanediol diacetate, 1, 4-dioxane, N-diethylbenzene, N-dimethylacetamide, N-propyl acetate, N-methylpyrrolidone, o-xylene, p-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, isophorone (isophorone), ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol methyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol acetate, and propylene glycol acetate, Propylene glycol monomethyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol monopropyl ether, methyl isobutyl ketone, methyl cyclohexanol, or other suitable solvent. The solvent (E) may be used alone or in combination of two or more.
The solvent (E) is used in an amount of 65 to 85 parts by weight, based on 100 parts by weight of the total amount of the resin composition used.
When the resin composition includes the solvent (E), the resin composition can be made to have an appropriate viscosity, so that the light conversion layer formed therefrom has good coating uniformity.
Phenyl compounds (F)
The phenyl compound (F) includes at least one of a compound represented by the following formula (F-1) and a compound represented by the following formula (F-2). The phenyl compound (F) may be used alone or in combination of two or more.
In the formula (F-1), R1Is an alkyl group, m is an integer of 0 to 3,
z is alkylene,
-O-or combinations thereof, R2Is a hydrogen or an alkyl group,
when n is 1, Y is hydrogen or alkyl,
when n is 2, Y is a single bond, alkylene, S,
Or a combination thereof,
when n is 3, Y is a single bond, a trivalent alkyl group, a trivalent phenyl group,
Or a combination thereof,
when n is 4, Y is carbon,
denotes a bonding site.
In the formula (F-1), R1Preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or a tert-butyl group; m is preferably 2 or 3; z is preferably an alkylene group having 1 to 18 carbon atoms,
-O-or a combination thereof; r2Hydrogen is preferred.
In the formula (F-1), when n is 1, Y is preferably hydrogen or an alkyl group having 1 to 17 carbon atoms. For example, when n is 1 and Z is methylene (-CH)2-) Y is preferably an alkyl group having 7 to 17 carbon atoms; or when n is 1 and Y is hydrogen, Z is preferably an alkylene group having 8 to 18 carbon atoms.
In the formula (F-1), when n is 2 and Y is an alkylene group, Y is preferably an alkylene group having 4 to 6 carbon atoms, more preferably a hexylene group or a butylene group.
In the formula (F-1), when n is 3 and Y is a trivalent alkyl group, Y is preferably a trivalent alkyl group having 4 to 6 carbon atoms, more preferably a trivalent hexylene group or a trivalent butylene group; when n is 3 and Y is a trivalent phenyl group, Y is preferably a trivalent phenyl group substituted with an alkyl group, more preferably a trivalent phenyl group substituted with a methyl group.
Preferred examples of the compound represented by the formula (F-1) include compounds represented by the following formulae (F-1) to (F-13). The compounds represented by the formulae (f-1) to (f-13) are available from, for example, Pasteur Corp or Addicke (ADEKA) Corp. The compound represented by the formula (F-1) may be used alone or in combination of two or more.
In the formula (F-2), R3Is alkyl, R4Is hydrogen or phenyl, and p is 0 or 1.
In the formula (F-2), R3Preferably an unsubstituted or phenyl-substituted alkyl group, more preferably an unsubstituted or phenyl-substituted alkyl group having 3 to 8 carbon atoms; r4Preferably hydrogen, unsubstituted phenyl, alkyl-substituted phenyl or phenylalkyl-substituted phenyl, more preferably hydrogen, unsubstituted phenyl, butylphenyl or phenylpropyl-substituted phenyl. Preferred examples of the compound represented by the formula (F-2) include compounds represented by the following formulae (F-14) to (F-16). The compounds represented by the formulae (f-14) to (f-16) are available from, for example, double bond chemical industry. The compound represented by the formula (F-2) may be used alone or in combination of two or more.
The phenyl compound (F) is preferably at least one selected from the group consisting of the compounds represented by the above formulae (F-1) to (F-16).
The phenyl-based compound (F) is used in an amount of 0.05 to 5 parts by weight, preferably 0.1 to 4 parts by weight, more preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the total amount of the resin composition.
When the phenyl compound (F) in the resin composition comprises at least one of the compound represented by the formula (F-1) and the compound represented by the formula (F-2), the hydroxyl (-OH) and/or the amino (-NH-) in the compound represented by the formula (F-1) and/or the compound represented by the formula (F-2) can react with the free radicals generated by the photoinitiator in the resin composition to reduce the reaction of the free radicals and other components in the resin composition, thereby obtaining the resin composition with good viscosity stability. Meanwhile, when the amount of the phenyl compound (F) used falls within the above range, the resin composition can have good viscosity stability and patterning ability, and the light conversion layer formed therefrom has good resolution and pattern stability.
Scatterer (G)
The resin composition may further include a scatterer (G). In the present embodiment, the scatterer (G) may include at least one selected from the group consisting of titanium dioxide, silicon dioxide, barium titanate, zirconium oxide, zinc oxide, and aluminum oxide. The scatterers (G) may be used alone or in combination.
The scatterer (G) is used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the sum of the amounts of the resin composition used.
When the resin composition further includes the scatterer (G), the scatterer (G) may reflect light (e.g., blue light) that is not absorbed by the quantum dot (a) to increase the possibility that light is absorbed by the quantum dot, thereby improving the light absorption rate and light conversion efficiency of the light conversion layer formed from the resin composition.
Additive (H)
The resin composition may further include an additive (H). In this embodiment, the additive (H) may include a leveling agent. The leveling agent is not particularly limited, and an appropriate leveling agent may be selected according to the requirements. For example, the leveling agent may include a silicone-based surfactant, a fluorine-based surfactant, or other suitable leveling agents. The leveling agent may be used alone or in combination of two or more. However, the present invention is not limited thereto, and the additive (H) may also include other suitable additives. The additive (H) may be used alone or in combination of two or more.
The silicone-based surfactant may include a silicone-based surfactant. For example, the silicone-based surfactant may include BYK-307, BYK-323, BYK-348 (trade name; manufactured by BYK chemical Co., Ltd.), KP323, KP324, KP340, KP341 (trade name; manufactured by shin-Etsu chemical industries, Ltd.), or other suitable silicone-based surfactants. The silicone surfactant may be used alone or in combination of two or more.
The silicone-based surfactant may include BYK-333 (trade name; manufactured by Bick chemical Co., Ltd.) or other suitable silicone-based surfactants. The silicone surfactant may be used alone or in combination of two or more.
The fluorine-based surfactant may include Meijia (Megaface) F-477, F-554, F-556, F-563, F-575, RS-72-K (trade name; manufactured by Dieie (DIC) Inc.) or other suitable fluorine-based surfactants. The fluorine-based surfactant may be used alone or in combination of two or more.
The additive (H) is used in an amount of 0.01 to 0.5 parts by weight, based on 100 parts by weight of the total amount of the resin composition used.
When the resin composition further includes a leveling agent as the additive (H), a light conversion layer formed from the resin composition can have good coating uniformity.
< method for producing resin composition >
The method for producing the resin composition is not particularly limited. For example, the quantum dot (a), the alkali-soluble resin (B), the ethylenically unsaturated monomer (C), the photoinitiator (D), the solvent (E), and the phenyl compound (F) are stirred in a stirrer to be uniformly mixed into a solution state, and the scatterer (G) and the additive (H) may be added if necessary, and then uniformly mixed to obtain a liquid resin composition.
< method for producing light conversion layer >
An exemplary embodiment of the present invention provides a light conversion layer formed using the above resin composition.
The light conversion layer may be formed by coating the above resin composition on a substrate to form a coating film, and subjecting the coating film to pre-baking (prebake), exposure, development, and post-baking (postbake). For example, after the resin composition is coated on a substrate to form a coating film, a pre-exposure baking (i.e., pre-baking) step is performed at a temperature of 90 ℃ for 120 seconds. Next, a high-pressure mercury lamp was used at 100mJ/cm2The prebaked coating film is exposed to light. Then, the exposed coating film was subjected to a development step for 50 seconds. Next, the developed coating film was washed with distilled water and blown with nitrogen gas to dry the coating film. Then, post baking was performed at 150 ℃ for 20 minutes to form a light conversion layer on the substrate.
The substrate may be a glass substrate, a plastic backing material (e.g., a Polyethersulfone (PES) plate, a Polycarbonate (PC) plate, or a Polyimide (PI) film), or other light-permeable substrate, and the type thereof is not particularly limited.
The coating method is not particularly limited, but a spray coating method, a roll coating method, a spin coating method, or the like can be used, and in general, the spin coating method is widely used. Further, a coating film is formed, and then, in some cases, the residual solvent may be partially removed under reduced pressure.
The developing solution is not particularly limited, and an appropriate developing solution may be selected according to the need. For example, the developer may be an aqueous solution of potassium hydroxide (KOH), which may be at a concentration of 0.038 wt%.
In this embodiment, the light conversion layer further includes a red pattern layer, a green pattern layer, and a scatterer pattern layer. The red pattern layer includes red quantum dots. The green pattern layer includes green quantum dots. The scatterer pattern layer does not contain quantum dots.
< light emitting device >
An exemplary embodiment of the present invention provides a light emitting device including the above-described light conversion layer.
Fig. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention. The light emitting device 10 includes a substrate 120, a light conversion layer 160, and a backlight module 200. In this embodiment, the light emitting device 10 may further include a filter layer 140. The light emitting device 10 may further include a polarizer, an alignment film, a liquid crystal (not shown) or other components known to those skilled in the art, and thus, will not be described in detail herein.
In the present embodiment, the substrate 120 is a light-transmissive substrate. The substrate 120 may be made of glass, organic polymer (e.g., Polyimide (PI), Polyethersulfone (PES), or Polycarbonate (PC)), or other suitable material.
The filter layer 140 is located under the substrate 120. In the embodiment, the filter layer 140 includes, for example, red filter patterns 142, green filter patterns 144, and blue filter patterns 146, wherein light-shielding patterns 148 are preferably disposed between the filter patterns. The red, green, and blue filter patterns 142, 144, and 146 do not include quantum dots.
The light conversion layer 160 is located under the filter layer 140. The filter layer 140 is located between the substrate 120 and the light conversion layer 160. The light conversion layer 160 is formed using the resin composition. In the present embodiment, the light conversion layer 160 includes a red pattern layer 162, a green pattern layer 164, and a diffuser pattern layer 166, wherein a bank layer 168 is preferably disposed between the pattern layers. The red pattern layer 162 includes red quantum dots. The green pattern layer 164 includes green quantum dots. The scatterer pattern layer 166 is free of quantum dots. In the present embodiment, the red pattern layer 162 of the light conversion layer 160 is disposed opposite to the red filter pattern 142 of the filter layer 140, the green pattern layer 164 of the light conversion layer 160 is disposed opposite to the green filter pattern 144 of the filter layer 140, and the scatterer pattern layer 166 of the light conversion layer 160 is disposed opposite to the blue filter pattern 146 of the filter layer 140. For example, the red pattern layer 162 is positioned under the red filter pattern 142, the green pattern layer 164 is positioned under the green filter pattern 144, and the diffuser pattern layer 166 is positioned under the blue filter pattern 146.
The backlight module 200 is disposed at a side of the substrate 120 where the light conversion layer 160 is disposed. The backlight module 200 irradiates light to the light conversion layer 160. For example, the backlight module 200 is suitable for providing a light source, and the light emitted from the light source sequentially passes through the light conversion layer 160, the filter layer 140 and the substrate 120 to provide a converted light source. In the present embodiment, the light source used in the backlight module 200 may include an Organic Light Emitting Diode (OLED), a Micro-LED (Micro-LED), or other suitable light sources. In the present embodiment, the backlight module 200 is a light source emitting blue light. After the blue light emitted from the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162 and the green quantum dots in the green pattern layer 164, the converted light can be respectively emitted from the red pattern layer 162 and the green pattern layer 164, and then the red light and the green light can be emitted through the red filter pattern 142 and the green filter pattern 144 of the filter layer 140, respectively; the blue light emitted from the backlight module 200 directly passes through the scattering medium pattern layer 166 without quantum dots to emit blue light, and then passes through the blue filter pattern 146 of the filter layer 140 to emit blue light. For example, when light emitted from the light source through the light conversion layer 160 and the filter layer 140 includes visible light (e.g., red light, green light, and blue light), the light emitting device 10 may be applied to a display apparatus or other suitable devices. Thereby, the display apparatus including the light emitting device 10 of the light conversion layer formed of the above resin composition may exhibit better brightness and color purity than conventional display apparatuses. For example, when the light emitted from the light source through the light conversion layer 160 and the filter layer 140 includes near infrared light (e.g., having a wavelength of about 780 nm to about 800 nm), the light emitting device 10 may be applied to an electromagnetic radiation device or other suitable devices.
Fig. 2 is a schematic diagram of a light emitting device according to another embodiment of the present invention. It should be noted that the embodiment of fig. 2 follows the reference numerals and parts of the contents of the embodiment of fig. 1, wherein the same or similar reference numerals are used to indicate the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
The main difference between the embodiment of fig. 2 and the embodiment of fig. 1 is that: the light emitting device 20 does not have the filter layer 140.
Referring to fig. 2, the light emitting device 20 includes a substrate 120, a light conversion layer 160, and a backlight module 200. In the embodiment, the light conversion layer 160 is located on the substrate 120, and there is no filter layer containing no quantum dots between the light conversion layer 160 and the substrate 120.
In the present embodiment, light emitted from the light source provided by the backlight module 200 sequentially passes through the light conversion layer 160 and the substrate 120 to provide a converted light source. After the blue light emitted from the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162 and the green quantum dots in the green pattern layer 164, the converted light can be emitted from the red pattern layer 162 and the green pattern layer 164 respectively; the blue light emitted from the backlight module 200 directly passes through the scatterer pattern layer 166 without quantum dots to emit blue light. For example, when light emitted from the light source through the light conversion layer 160 includes visible light (e.g., red light, green light, and blue light), the light emitting device 20 may be applied to a display apparatus or other suitable device. Thereby, the display apparatus including the light emitting device 20 may not only exhibit better brightness and color purity, but also omit a step of manufacturing a filter layer to reduce the manufacturing cost of the display apparatus, compared to the conventional display apparatus and/or the above-described display apparatus including the light emitting device 10. For example, when the light emitted from the light source through the light conversion layer 160 includes near infrared light (e.g., having a wavelength of about 780 nm to 800 nm), the light emitting device 20 may be applied to an electromagnetic radiation device or other suitable device.
Hereinafter, the present invention will be described in detail with reference to examples. The following examples are provided for the purpose of describing the present invention, and the scope of the present invention includes the scope described in the following claims and substitutes and modifications thereof, and is not limited to the scope of the examples.
Examples of the resin composition and the light conversion layer
Examples 1 to 31 and comparative examples 1 to 16 of the resin composition and the light conversion layer are described below:
example 1
a. Resin composition
8 parts by weight of cadmium selenide-based green quantum dots (manufactured by Taiwan Kawakamiki Co., Ltd.), 11 parts by weight of an alkali-soluble resin (B-1) (manufactured by Meiyuan Co., Ltd.), 5.5 parts by weight of pentaerythritol hexaacrylate (DPHA) (manufactured by Nippon KaYAKU Co., Ltd.), 0.7 parts by weight of Brilliant OXE-01, 0.7 parts by weight of Brilliant 907, 0.1 parts by weight of Meijia F-554, 1 part by weight of Irganox 1010 (trade name; manufactured by Bass) and 3 parts by weight of a titanium dioxide dispersion (manufactured by Shanyang pigment Works, LTD) were added to 70 parts by weight of propylene glycol Monomethyl Ether Acetate (MEA), and stirred uniformly by a stirrer to obtain the resin composition of example 1.
b. Light conversion layer
Each of the resin compositions prepared in examples was coated on a substrate by a spin coating method (spin coater model MS-A150, manufactured by Mikasa corporation, rotation speed about 200 rpm). Then, prebaking was performed at a temperature of 90 ℃ for 120 seconds to form a thin film. Then, using a mask having a line width/space of 1 to 100 μm with a straight-line type through pattern, the distance between the mask and the film surface is controlled to be about 50 μm to contain g, h, i+A radiant high-pressure mercury lamp (model UX-1000SM-ANC01, manufactured by Ushio, Inc.) at 100mJ/cm2The prebaked coating film is exposed to light to form a semi-finished product. Subsequently, the resultant was developed at a temperature of 23 ℃ for 50 seconds using an aqueous solution of potassium hydroxide having a concentration of 0.038 wt% as a developer. Then, the developed coating film was washed with distilled water and blown with nitrogen gas to dry the coating film. Then, post-baking was performed at 150 ℃ for 20 minutes to obtain a light conversion layer having a pattern thickness of 6 μm. The obtained light conversion layers were evaluated in the following evaluation methods, and the results are shown in table 2.
Examples 2 to 31 and comparative examples 1 to 16
The resin compositions of examples 2 to 31 and comparative examples 1 to 16 were prepared in the same procedure as in example 1, and they were different in that: the types of components and the amounts thereof used (as shown in table 2) of the resin composition were changed, wherein the components/compounds corresponding to the symbols in table 2 are shown in table 1. The obtained resin composition was evaluated as a light conversion layer in the following evaluation methods, and the results are shown in table 2.
[ Table 1]
[ Table 2]
[ Table 2] (continuation)
[ Table 2] (continuation)
[ Table 2] (continuation)
[ Table 2] (continuation)
< evaluation mode >
a. Stability of viscosity
The viscosities (initial viscosities) of the resin compositions obtained in the examples and comparative examples were measured by a viscometer (model No. TV-22, manufactured by Toki Sangyo Co., Ltd.). After the resin compositions were left standing at room temperature for three weeks, their respective viscosities were measured again. The viscosity change rate was calculated according to the following formula:
the evaluation criteria for viscosity stability are as follows:
very good: the viscosity change rate is less than or equal to 5%;
o: viscosity change rate is less than 5% < 15%;
gamma rays: 15% ≦ viscosity change rate.
b. Patterning capability
The prepared light conversion layer was observed by an electron microscope (model SU8000, manufactured by HITACHI (HITACHI)) at a magnification of 10000 times to see whether a straight pattern having a line width of 10 μm was maintained neat and whether a resin composition remained on the edge of the pattern on the substrate, to evaluate the patterning ability.
The evaluation criteria of patterning ability were as follows:
very good: the line edge of the straight line pattern has high linearity, and no resin composition is remained on the substrate at the edge of the pattern;
o: the line edge of the straight line pattern is not straight, and the pattern edge has a little resin composition remained on the substrate;
gamma rays: the linear pattern has a non-straight line side, and a large amount of the resin composition remains on the substrate at the pattern edge or the pattern is peeled off from the substrate.
c. Stability of pattern
The resin composition was left standing at room temperature for three weeks, and then was again produced into a light conversion layer. And the pattern stability was evaluated in the manner described above for evaluating patterning ability.
Evaluation criteria for pattern stability were as follows:
very good: the line edge of the straight line pattern has high linearity, and no resin composition is remained on the substrate at the edge of the pattern;
o: the line edge of the straight line pattern is not straight, and the pattern edge has a little resin composition remained on the substrate;
gamma rays: the linear pattern has a non-straight line side, and a large amount of the resin composition remains on the substrate at the pattern edge or the pattern is peeled off from the substrate.
< evaluation results >
As can be seen from table 2, the resin compositions (examples 1 to 31) including the phenyl compound (F) having the specific structure and having the usage amount of 0.05 to 5 parts by weight based on 100 parts by weight of the total usage amount of the resin composition had good viscosity stability and patterning ability, and the light conversion layers formed therefrom had good resolution and pattern stability, and were thus suitable for use in light emitting devices. On the other hand, the resin compositions (comparative examples 1 to 16) and the light conversion layers formed therefrom, which do not have the specific structure or the amount of the phenyl compound (F) used is not within the above range, are poor in viscosity stability, patterning ability, or pattern stability.
The resin compositions (examples 1 to 31 and comparative examples 2, 6, 10 and 14) of the phenyl compound (F) having a specific structure have good viscosity stability. However, when the amount of the phenyl compound (F) having a specific structure used in the resin composition is not in the above range, the reaction between other components in the resin composition (for example, the reaction between radicals generated from the photoinitiator and the ethylenically unsaturated monomer) may be affected, resulting in poor patterning ability of the resin composition and poor resolution and pattern stability of the light conversion layer formed therefrom (comparative examples 2, 6, 10, and 14). It is understood that when the phenyl compound (F) having a specific structure is used in an amount within the above range, the resin composition has good viscosity stability and patterning ability, and the light conversion layer formed therefrom has good resolution and pattern stability, and thus is suitable for use in a light emitting device.
In addition, when the phenyl compound is not included in the resin composition, the resin composition does not have a group capable of effectively reacting with the radical, so that the radical can react with other components in the resin composition, resulting in poor viscosity stability of the resin composition at room temperature and poor pattern stability of the light conversion layer formed therefrom (comparative examples 1, 5, 9, and 13).
In addition, when the phenyl compound having the above-mentioned specific structure is not included in the resin composition, the free radicals may react with other components in the resin composition by not having a group capable of effectively reacting with the free radicals in the resin composition, and thus the viscosity stability of the resin composition at room temperature is not good and the pattern stability of the light conversion layer formed therefrom is not good (comparative examples 3, 4, 7, 8, 11, 12, 15 to 16). In addition, when the resin composition includes the phosphorus or sulfur-containing phenyl compound, the compatibility between the phosphorus or sulfur-containing phenyl compound and the resin composition may be poor, which may result in poor patterning capability of the resin composition and poor resolution of the light conversion layer formed therefrom (comparative examples 3, 4, 7, 8, 11, 12, 15 to 16).
In summary, the resin composition of the present invention contains the phenyl compound (F) with a specific structure, and when the phenyl compound (F) is used in an amount of 0.05 to 5 parts by weight based on 100 parts by weight of the total amount of the resin composition, the resin composition has good viscosity stability and patterning capability, and the light conversion layer formed therefrom has good resolution and pattern stability, and is suitable for a light emitting device and can improve the performance of the light emitting device.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A resin composition comprising:
quantum dots (A);
an alkali-soluble resin (B);
an ethylenically unsaturated monomer (C);
a photoinitiator (D);
a solvent (E); and
a phenyl compound (F),
wherein the phenyl compound (F) comprises at least one of a compound represented by the following formula (F-1) and a compound represented by the following formula (F-2),
in the formula (F-1), R1Is an alkyl group, m is an integer of 0 to 3,
z is alkylene,
-O-or combinations thereof, R2Is a hydrogen or an alkyl group,
when n is 1, Y is hydrogen or alkyl,
when n is 2, Y is a single bond, alkylene, S,
Or a combination thereof,
when n is 3, Y is a single bond, a trivalent alkyl group, a trivalent phenyl group,
Or a combination thereof,
when n is 4, Y is carbon,
indicates a bonding site;
in the formula (F-2), R3Is alkyl, R4Is hydrogen or phenyl, p is 0 or 1, and
the phenyl-based compound (F) is used in an amount of 0.05 to 5 parts by weight, based on 100 parts by weight of the sum of the amounts of the resin composition.
2. The resin composition according to claim 1, wherein the quantum dot (a) comprises at least one selected from the group consisting of a green quantum dot having a light emission wavelength in a range of greater than or equal to 500 nm to less than 600 nm and a red quantum dot having a light emission wavelength in a range of greater than or equal to 600 nm to less than or equal to 800 nm.
3. The resin composition according to claim 1, wherein the phenyl-based compound (F) comprises at least one selected from the group consisting of:
4. the resin composition according to claim 1, wherein the resin composition further comprises a scatterer (G), wherein the scatterer (G) is used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the sum of the amounts of the resin composition.
5. The resin composition according to claim 1, wherein the resin composition further comprises a scatterer (G), wherein the scatterer (G) comprises at least one selected from the group consisting of titanium dioxide, silica, barium titanate, zirconium oxide, zinc oxide, and aluminum oxide.
6. The resin composition according to claim 1, wherein the quantum dot (a) is used in an amount of 0.5 to 15 parts by weight, the alkali-soluble resin (B) is used in an amount of 0.5 to 20 parts by weight, the ethylenically unsaturated monomer (C) is used in an amount of 0.5 to 20 parts by weight, and the photoinitiator (D) is used in an amount of 0.01 to 5 parts by weight, based on 100 parts by weight of the sum of the amounts of the resin composition used.
7. The resin composition according to claim 1, wherein the solvent (E) is used in an amount of 65 to 85 parts by weight, based on 100 parts by weight of the sum of the amounts of the resin composition.
8. A light conversion layer formed from the resin composition according to any one of claims 1 to 7.
9. The light conversion layer of claim 8, wherein the light conversion layer further comprises:
a red pattern layer including red quantum dots;
a green pattern layer including green quantum dots; and
a scatterer pattern layer without quantum dots.
10. The light conversion layer of claim 9, wherein the green quantum dots have a pump wavelength in a range from greater than or equal to 500 nanometers to less than 600 nanometers and the red quantum dots have a pump wavelength in a range from greater than or equal to 600 nanometers to less than or equal to 800 nanometers.
11. A light emitting device comprising the light conversion layer as claimed in any one of claims 8 to 10.
12. The light-emitting device of claim 11, wherein the light-emitting device further comprises:
a substrate, the light conversion layer being located on the substrate; and
and the backlight module is arranged on one side of the substrate, on which the light conversion layer is arranged.
13. The light emitting device of claim 12, wherein the light emitting device further comprises a filter layer between the substrate and the light conversion layer, the filter layer comprising red, green, and blue filter patterns, the red, green, and blue filter patterns being free of quantum dots.
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| CN110073291A (en) * | 2016-12-12 | 2019-07-30 | 三星Sdi株式会社 | Photosensitive resin composition, photo-sensitive resin and colored filter using it |
| JP2019144549A (en) * | 2018-02-23 | 2019-08-29 | 東洋インキＳｃホールディングス株式会社 | Photosensitive colored composition and color filter |
| CN110716389A (en) * | 2018-07-11 | 2020-01-21 | 新应材股份有限公司 | Photosensitive composition, color filter and method for manufacturing color filter |
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| CN105511226A (en) * | 2014-10-14 | 2016-04-20 | 东友精细化工有限公司 | Photosensitive resin composition |
| CN107434773A (en) * | 2016-05-10 | 2017-12-05 | 株式会社Lg化学 | Compound, the colorant composition containing the compound and the resin combination containing the compound |
| CN110073291A (en) * | 2016-12-12 | 2019-07-30 | 三星Sdi株式会社 | Photosensitive resin composition, photo-sensitive resin and colored filter using it |
| JP2019144549A (en) * | 2018-02-23 | 2019-08-29 | 東洋インキＳｃホールディングス株式会社 | Photosensitive colored composition and color filter |
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