CN113759661A - Photosensitive resin composition, partition wall, light conversion layer, and light emitting device - Google Patents
Photosensitive resin composition, partition wall, light conversion layer, and light emitting device Download PDFInfo
- Publication number
- CN113759661A CN113759661A CN202010493418.6A CN202010493418A CN113759661A CN 113759661 A CN113759661 A CN 113759661A CN 202010493418 A CN202010493418 A CN 202010493418A CN 113759661 A CN113759661 A CN 113759661A
- Authority
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- China
- Prior art keywords
- alkali
- resin composition
- formula
- photosensitive resin
- soluble resin
- Prior art date
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- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 98
- 238000005192 partition Methods 0.000 title claims abstract description 59
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 98
- 229920005989 resin Polymers 0.000 claims abstract description 98
- 239000000178 monomer Substances 0.000 claims abstract description 39
- 239000003999 initiator Substances 0.000 claims abstract description 37
- 239000000049 pigment Substances 0.000 claims abstract description 36
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 37
- -1 oxime ester compound Chemical class 0.000 claims description 31
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 25
- 229910052731 fluorine Inorganic materials 0.000 claims description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- 125000001153 fluoro group Chemical group F* 0.000 claims description 10
- 239000012463 white pigment Substances 0.000 claims description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 229910052570 clay Inorganic materials 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 3
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 3
- 239000001095 magnesium carbonate Substances 0.000 claims description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 93
- 239000002096 quantum dot Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 13
- 239000004094 surface-active agent Substances 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 10
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- 150000008062 acetophenones Chemical class 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 4
- VHJHZYSXJKREEE-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropyl prop-2-enoate Chemical compound FC(F)C(F)(F)COC(=O)C=C VHJHZYSXJKREEE-UHFFFAOYSA-N 0.000 description 3
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical class C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 2
- 150000004053 quinones Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- UUGXDEDGRPYWHG-UHFFFAOYSA-N (dimethylamino)methyl 2-methylprop-2-enoate Chemical compound CN(C)COC(=O)C(C)=C UUGXDEDGRPYWHG-UHFFFAOYSA-N 0.000 description 1
- VMEZXMFPKOMWHR-UHFFFAOYSA-N (dimethylamino)methyl prop-2-enoate Chemical compound CN(C)COC(=O)C=C VMEZXMFPKOMWHR-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- BJQFWAQRPATHTR-UHFFFAOYSA-N 1,2-dichloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1Cl BJQFWAQRPATHTR-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- QOVCUELHTLHMEN-UHFFFAOYSA-N 1-butyl-4-ethenylbenzene Chemical compound CCCCC1=CC=C(C=C)C=C1 QOVCUELHTLHMEN-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- DMADTXMQLFQQII-UHFFFAOYSA-N 1-decyl-4-ethenylbenzene Chemical compound CCCCCCCCCCC1=CC=C(C=C)C=C1 DMADTXMQLFQQII-UHFFFAOYSA-N 0.000 description 1
- WJNKJKGZKFOLOJ-UHFFFAOYSA-N 1-dodecyl-4-ethenylbenzene Chemical compound CCCCCCCCCCCCC1=CC=C(C=C)C=C1 WJNKJKGZKFOLOJ-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- LCNAQVGAHQVWIN-UHFFFAOYSA-N 1-ethenyl-4-hexylbenzene Chemical compound CCCCCCC1=CC=C(C=C)C=C1 LCNAQVGAHQVWIN-UHFFFAOYSA-N 0.000 description 1
- LUWBJDCKJAZYKZ-UHFFFAOYSA-N 1-ethenyl-4-nonylbenzene Chemical compound CCCCCCCCCC1=CC=C(C=C)C=C1 LUWBJDCKJAZYKZ-UHFFFAOYSA-N 0.000 description 1
- HLRQDIVVLOCZPH-UHFFFAOYSA-N 1-ethenyl-4-octylbenzene Chemical compound CCCCCCCCC1=CC=C(C=C)C=C1 HLRQDIVVLOCZPH-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- RSVZYSKAPMBSMY-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)C(F)F RSVZYSKAPMBSMY-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical class C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- QSOFJLDXOMMNNK-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.OCC(C)(CO)CO QSOFJLDXOMMNNK-UHFFFAOYSA-N 0.000 description 1
- VLSRKCIBHNJFHA-UHFFFAOYSA-N 2-(trifluoromethyl)prop-2-enoic acid Chemical compound OC(=O)C(=C)C(F)(F)F VLSRKCIBHNJFHA-UHFFFAOYSA-N 0.000 description 1
- XFQDAAPROSJLSX-UHFFFAOYSA-N 2-[4-(9h-fluoren-1-yl)phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1=CC=CC2=C1CC1=CC=CC=C21 XFQDAAPROSJLSX-UHFFFAOYSA-N 0.000 description 1
- YCPMSWJCWKUXRH-UHFFFAOYSA-N 2-[4-[9-[4-(2-prop-2-enoyloxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1C1(C=2C=CC(OCCOC(=O)C=C)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YCPMSWJCWKUXRH-UHFFFAOYSA-N 0.000 description 1
- WBEKRAXYEBAHQF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.CCC(CO)(CO)CO WBEKRAXYEBAHQF-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- YVTVFZKHLXIJEY-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.C1OC1COCC1CO1 Chemical compound OC(=O)C=C.OC(=O)C=C.C1OC1COCC1CO1 YVTVFZKHLXIJEY-UHFFFAOYSA-N 0.000 description 1
- STSCVKRWJPWALQ-UHFFFAOYSA-N TRIFLUOROACETIC ACID ETHYL ESTER Chemical compound CCOC(=O)C(F)(F)F STSCVKRWJPWALQ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 1
- TYKSSIDOMQWRPE-UHFFFAOYSA-N [3-[4-(9H-fluoren-1-yl)phenoxy]-2-hydroxypropyl] prop-2-enoate Chemical compound C(C=C)(=O)OCC(COC1=CC=C(C=C1)C1=CC=CC=2C3=CC=CC=C3CC12)O TYKSSIDOMQWRPE-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000038 blue colorant Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- FCSHDIVRCWTZOX-DVTGEIKXSA-N clobetasol Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@H](C)[C@@](C(=O)CCl)(O)[C@@]1(C)C[C@@H]2O FCSHDIVRCWTZOX-DVTGEIKXSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HHBOIIOOTUCYQD-UHFFFAOYSA-N ethoxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(C)CCCOCC1CO1 HHBOIIOOTUCYQD-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- DWXAVNJYFLGAEF-UHFFFAOYSA-N furan-2-ylmethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CO1 DWXAVNJYFLGAEF-UHFFFAOYSA-N 0.000 description 1
- 239000000040 green colorant Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical compound C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000001062 red colorant Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention provides a photosensitive resin composition, a partition wall, a light conversion layer and a light emitting device, which have good pattern characteristics and can form a pattern without undercut. The photosensitive resin composition comprises an alkali-soluble resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D) and a pigment (E). The alkali-soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by the formula (III-1)
Description
Technical Field
The present invention relates to a photosensitive resin composition, a partition (Spacer), a light conversion layer and a light emitting device, and more particularly, to a photosensitive resin composition, a partition, a light conversion layer and a light emitting device for use in a developing process.
Background
At present, a color filter is mainly formed by a pigment dispersion method, and the manufacturing process is to use a black matrix as a partition wall, coat a photosensitive resin composition containing red, green and blue colorants, and obtain a target pattern through the processes of coating, vacuum drying, soft baking, exposure, development and hard baking. However, when the pigment dispersion method is used, since the colorant is a pigment or a dye, the light source transmission efficiency is reduced, and higher brightness, high contrast, and more diversified color representation and high color gamut cannot be achieved.
In recent years, quantum dots based on quantum confinement effect have been attracting attention, and can be used to generate light in the visible and infrared regions by spontaneous emission from a light source, by controlling the size and composition thereof to obtain a target emission property. The quantum dots themselves are non-scattering particles, and thus, when light passes through a color filter containing the quantum dots, it may obtain more preferable color expression than a colorant generally formed of a pigment or a dye. In the manufacturing process of optical elements such as quantum dot displays and organic Electroluminescence (EL) elements, pattern printing is sometimes performed by an ink jet method to form a light emitting layer, an organic layer, and the like, and when pattern printing is performed by the ink jet method, the partition wall surface must have ink repellency in order to prevent ink mixing between adjacent dots. However, the conventional black matrix is mainly used as the partition wall, and the light utilization rate of the photo-luminescent optical device such as a quantum dot display is reduced, resulting in poor brightness.
By using a resin composition having a high reflectance as a partition wall, the reflectance can be increased, and the light utilization efficiency can be improved, thereby obtaining more preferable light extraction efficiency. However, in order to form a partition wall having a high-definition pattern and to adjust the photosensitive resin composition to form a partition wall having ink repellency on the surface, there are cases where the development residue in the opening portion is excessive and the pattern in the opening portion has undercut.
Disclosure of Invention
The inventors of the present invention found that: if a pattern without undercut is obtained, a photo initiator with high reactivity is required to increase the reactivity of the bottom of the photoresist, but this may cause photoresist residue at the edge of the pattern, which may result in poor pattern (excessive development residue). On the other hand, in order to obtain good pattern characteristics, it is necessary to use a photoinitiator having low reactivity, and the unexposed portion can be more easily dissolved and removed by an alkaline developer, but this may cause undercut of the pattern.
Accordingly, the present invention provides a photosensitive resin composition having both good pattern characteristics (no or little development residue) and capability of forming a pattern without undercut, and a partition wall and a light emitting device formed using the photosensitive resin composition.
The invention provides a photosensitive resin composition for a developing process, which comprises an alkali-soluble resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D) and a pigment (E). The alkali-soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by the formula (III-1).
In the formula (I-1), R1And R2Each represents a hydrogen atom or a methyl group, X1Represents an ethylene group, a propylene group, a butylene group, a1, 2-phenylene group, a1, 2-cyclohexylene group, a1, 2-cyclohexen-1-ylene group, a 4, 5-cyclohexen-1-ylene group or a norbornenylene group, and represents a bonding site.
In the formula (I-2), R3And R4Each represents a hydrogen atom or a methyl group, and represents a bonding position.
In the formula (III-1), X2、X3And X4Each represents a single bond or a carbonyl group, X2、X3And X4At least one of which is carbonyl, R5、R6And R7Each represents an alkyl group, and m, n and q each represent an integer of 0 to 5.
According to an embodiment of the present invention, in the alkali-soluble resin (A-1), the structural unit represented by the formula (I-1) is 30 to 60 mol% based on 100 mol% of the total of the structural unit represented by the formula (I-1) and the structural unit represented by the formula (I-2).
According to an embodiment of the present invention, the weight average molecular weight of the alkali-soluble resin (A-1) is 3,000 to 20,000.
According to an embodiment of the present invention, the acid value of the alkali-soluble resin (A-1) is 30mgKOH/g to 100 mgKOH/g.
According to an embodiment of the present invention, the alkali-soluble resin (a) further includes an alkali-soluble resin (a-2), wherein the alkali-soluble resin (a-2) includes a structural unit represented by formula (I-3).
In the formula (I-3), R8Represents a hydrogen atom or a methyl group, z represents an integer of 1 to 10, and represents a bonding position.
According to the embodiment of the invention, the weight ratio of the alkali-soluble resin (A-1) to the alkali-soluble resin (A-2) is 1: 1 to 1: 3.
According to an embodiment of the present invention, the alkali-soluble resin (a) further includes an alkali-soluble resin (a-3), and the alkali-soluble resin (a-3) includes a structural unit represented by formula (I-4).
In the formula (I-4), R9Represents a hydrogen atom or a methyl group, and represents a bonding position.
According to an embodiment of the present invention, the above-mentioned ethylenically unsaturated monomer (B) includes a fluorine-containing ethylenically unsaturated monomer (B-1) represented by the formula (II-1).
In the formula (II-1), R10Represents a hydrogen atom or a methyl group, R11And R12Each represents a hydrogen atom or a fluorine atom, R11And R12At least one of which is a fluorine atom, R13Represents a hydrogen atom, a fluorine atom or an alkyl group, w represents an integer of 1 to 10, and y represents an integer of 1 to 10.
According to an embodiment of the present invention, the photopolymerization initiator (C) further includes an oxime ester compound.
According to an embodiment of the present invention, in the photopolymerization initiator (C), the weight ratio of the acylphosphine oxide compound to the oxime ester compound is 10: 1 to 4: 1.
According to an embodiment of the present invention, the oxime ester compound is a compound represented by formula (III-2).
In the formula (III-2), R14Represents alkyl or cycloalkyl, R15Represents an alkyl group or a phenyl group.
According to an embodiment of the present invention, the pigment (E) includes a white pigment (E-1), wherein the white pigment (E-1) is at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc, and montmorillonite.
According to an embodiment of the present invention, the pigment (E) further includes a black pigment (E-2), wherein the black pigment (E-2) is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black.
According to an embodiment of the present invention, the photosensitive resin composition comprises 15 to 35 parts by weight of the ethylenically unsaturated monomer (B), 1 to 10 parts by weight of the photopolymerization initiator (C), 20 to 60 parts by weight of the solvent (D), and 55 to 95 parts by weight of the pigment (E), based on 100 parts by weight of the alkali-soluble resin (a).
The invention provides a partition wall formed by the photosensitive resin composition.
The invention provides a light emitting device comprising the partition wall.
The present invention provides a light conversion layer comprising: the white partition walls are respectively inserted between the plurality of pattern layers, so that one of the plurality of pattern layers is arranged between every two adjacent white partition walls in the plurality of white partition walls.
According to an embodiment of the present invention, the pattern layer is a red pattern layer, a green pattern layer or a scatterer pattern layer.
The present invention provides a light emitting device comprising: the backlight module comprises a substrate, a backlight module arranged opposite to the substrate and a light conversion layer positioned between the substrate and the backlight module, wherein the light conversion layer is the light conversion layer.
According to an embodiment of the present invention, the light emitting device further includes a filter layer located between the substrate and the light conversion layer.
Based on the above, the photosensitive resin composition of the present invention comprises a specific alkali-soluble resin and a specific photopolymerization initiator, and provides a photosensitive resin composition with good pattern characteristics (no development residue or less development residue) and capable of forming a pattern without undercut, thereby improving the phenomena of excessive development residue and undercut of taper angle.
Drawings
Fig. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a light emitting device according to another embodiment of the present invention.
Fig. 3(a) and 3(b) are schematic diagrams of the structure of the pattern.
Description of the reference numerals
10. 20: light emitting device
1. 120: substrate
140: filter layer
142: light filtering pattern
142R: red filter pattern
142G: green light filtering pattern
142B: blue color filter pattern
144: black partition wall
160: light conversion layer
162: patterned layer
162R: red pattern layer
162G: green pattern layer
162S: scatterer pattern layer
164: white partition wall
200: backlight module
2: partition wall
2 a: side surface
2 b: bottom surface
θ: taper angle
Detailed Description
< photosensitive resin composition >
This example provides a photosensitive resin composition comprising an alkali-soluble resin (A), an ethylenically unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D) and a pigment (E). In addition, the photosensitive resin composition may further include other additives (F), if necessary. The respective components used in the photosensitive resin composition of the present invention will be described in detail below.
In the following, acrylic acid and/or methacrylic acid is represented by (meth) acrylic acid, and acrylate and/or methacrylate is represented by (meth) acrylate.
Alkali soluble resin (A)
The alkali-soluble resin (a) in the photosensitive resin composition can make the photosensitive resin composition exhibit alkali solubility to a developer in a subsequent developing step.
The alkali-soluble resin (A) includes an alkali-soluble resin (A-1). In addition, the alkali-soluble resin (A) may further include an alkali-soluble resin (A-2). The alkali-soluble resin (A) may further include an alkali-soluble resin (A-3).
Alkali soluble resin (A-1)
The alkali-soluble resin (A-1) comprises a structural unit represented by the following formula (I-1) and a structural unit represented by the following formula (I-2).
In the formula (I-1),
R1and R2Each represents a hydrogen atom or a methyl group, R1Preferably represents methyl, R2Preferably represents a hydrogen atom;
X1represents an ethylene group, a propylene group, a butylene group, a1, 2-phenylene group, a1, 2-cyclohexylene group, a1, 2-cyclohexen-1-ylene group (a group represented by the following formula (I-1-a)), a 4, 5-cyclohexen-1-ylene group (a group represented by the following formula (I-1-b)), or a norbornenyl group (a group represented by the following formula (I-1-c)), preferably a1, 2-cyclohexen-1-ylene group or a 4, 5-cyclohexen-1-ylene group, more preferably a 4, 5-cyclohexen-1-ylene group;
denotes a bonding site.
The structural unit represented by the formula (I-1) is preferably a structural unit represented by the following formula (I-1-1).
In one embodiment, in the alkali-soluble resin (A-1), the structural unit represented by the formula (I-1) may be 30 to 60 mol%, preferably 35 to 50 mol%, based on 100 mol% of the total of the structural unit represented by the formula (I-1) and the structural unit represented by the formula (I-2).
In the formula (I-2),
R3and R4Each represents a hydrogen atom or a methyl group, R3Preferably represents methyl, R4Preferably represents a hydrogen atom;
denotes a bonding site.
The structural unit represented by the formula (I-2) is preferably a structural unit represented by the following formula (I-2-1).
In one embodiment, the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1-1) and a structural unit represented by formula (I-2-1).
In one embodiment, in the alkali-soluble resin (A-1), the structural unit represented by the formula (I-2) may be 40 to 70 mol%, preferably 50 to 65 mol%, based on 100 mol% of the total of the structural unit represented by the formula (I-1) and the structural unit represented by the formula (I-2).
In addition, the alkali-soluble resin (a-1) may further include at least one selected from the group consisting of an acrylic structural unit, a styrenic structural unit, and a maleimide structural unit, without affecting the efficacy of the present invention.
In the present invention, the acrylic structural unit may be derived from an acrylic monomer. The acrylic monomer may include acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, octyl acrylate, cyclohexyl acrylate, stearyl acrylate, benzyl acrylate, furfuryl acrylate, hydroxyethyl acrylate, hydroxybutyl acrylate, dimethylaminomethyl acrylate, dimethylaminoethyl acrylate and the like, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, octyl methacrylate, cyclohexyl methacrylate, stearyl methacrylate, benzyl methacrylate, furfuryl methacrylate, hydroxyethyl methacrylate, hydroxybutyl methacrylate, dimethylaminomethyl methacrylate, dimethylaminoethyl methacrylate and the like, acrylamide, methacrylamide, acrylic acid, methacrylic acid, acrylic acid, propyl acrylate, butyl acrylate, acrylic acid, amides such as N-substituted acrylamide and N-substituted methacrylamide, acrylonitrile, methacrylonitrile, or combinations thereof.
In the present invention, the styrenic building blocks may be derived from styrenic monomers. The styrenic building blocks may include styrene, p-methylstyrene, m-methylstyrene, o-methylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, 3, 4-dichlorostyrene, p-ethylstyrene, 2, 4-dimethylstyrene, p-n-butylstyrene, p-tert-butylstyrene, p-n-hexylstyrene, p-n-octylstyrene, p-n-nonylstyrene, p-n-decylstyrene, p-n-dodecylstyrene, or combinations thereof.
In the present invention, the maleimide-based structural unit may be derived from a maleimide-based monomer. The maleimide-based monomer may include maleimide, N-methyl maleimide, N-ethyl maleimide, N-propyl maleimide, N-isopropyl maleimide, N-cyclohexyl maleimide, N-phenyl maleimide, or a combination thereof.
In one embodiment, the weight average molecular weight of the alkali-soluble resin (A-1) may be 3,000 to 20,000, preferably 4,000 to 12,000.
In one embodiment, the acid value of the alkali-soluble resin (A-1) may be 30mgKOH/g to 100mgKOH/g, preferably 35mgKOH/g to 80 mgKOH/g.
When the alkali-soluble resin (A) includes the alkali-soluble resin (A-1), the photosensitive resin composition can be provided with good pattern characteristics, and the photosensitive resin composition can form a pattern without undercut. Meanwhile, when the amount of the alkali-soluble resin (a) used falls within the above range, a resin composition having good pattern characteristics and capable of forming a pattern without undercut can be obtained. In addition, when the alkali-soluble resin (a) does not include the alkali-soluble resin (a-1), the pattern characteristics of the photosensitive resin composition are not good, and undercut patterns are formed in the photosensitive resin composition.
Alkali soluble resin (A-2)
The alkali-soluble resin (A) may further include an alkali-soluble resin (A-2). Wherein the alkali-soluble resin (A-2) comprises a structural unit represented by the formula (I-3).
In the formula (I-3),
R8represents a hydrogen atom or a methyl group, preferably a methyl group;
z represents an integer of 1 to 10;
denotes a bonding site.
In addition, the alkali-soluble resin (a-2) may further include at least one selected from the group consisting of an acrylic structural unit, a styrenic structural unit, and a maleimide structural unit, without affecting the efficacy of the present invention. The acrylic structural unit, the styrene structural unit, and the maleimide structural unit that may be included in the alkali-soluble resin (a-2) are the same as those that may be included in the alkali-soluble resin (a-1), and will not be described herein again.
In one embodiment, the alkali-soluble resin (a-2) may further include a structural unit derived from methacrylic acid, a structural unit derived from styrene, and a structural unit derived from N-phenylmaleimide.
In one embodiment, the alkali-soluble resin (A-2) comprises a structural unit represented by formula (I-3-1), a structural unit represented by formula (1-1), a structural unit represented by formula (2-1), and a structural unit represented by formula (3-1).
In the formula (I-3-1),
R8represents a methyl group；
z represents an integer of 1 to 10;
denotes a bonding site.
In one embodiment, the weight ratio of the alkali-soluble resin (A-1) to the alkali-soluble resin (A-2) is 1: 1 to 1: 3.
When the photosensitive resin composition further contains the alkali-soluble resin (A-2), the partition wall formed by the photosensitive resin composition has substantially good pattern characteristics (no development residue or little development residue) and can form a pattern without undercut. Further, when the weight ratio of the alkali-soluble resin (A-1) to the alkali-soluble resin (A-2) is in the above range, a resin composition having good pattern characteristics (high linearity at line sides) can be obtained.
Alkali soluble resin (A-3)
In one embodiment, the alkali-soluble resin (A) further comprises an alkali-soluble resin (A-3), and the alkali-soluble resin (A-3) comprises a structural unit represented by formula (I-4).
In the formula (I-4), R9Represents a hydrogen atom or a methyl group, R9Preferably represents a methyl group;
denotes a bonding site.
In addition, the alkali-soluble resin (a-3) may further include at least one selected from the group consisting of an acrylic structural unit, a styrenic structural unit, and a maleimide structural unit, without affecting the efficacy of the present invention. The acrylic structural unit, the styrene structural unit, and the maleimide structural unit that may be included in the alkali-soluble resin (a-3) are the same as those that may be included in the alkali-soluble resin (a-1), and will not be described herein again.
In one embodiment, the alkali-soluble resin (a-3) may further include a structural unit derived from methacrylic acid and a structural unit derived from benzyl methacrylate.
In one embodiment, the alkali-soluble resin (A-3) includes a structural unit represented by formula (I-4-1), a structural unit represented by formula (2-1), and a structural unit represented by formula (2-2).
Ethylenically unsaturated monomer (B)
The ethylenically unsaturated monomer (B) in the photosensitive resin composition can be polymerized in the subsequent exposure step and baking step to form a cured product of the photosensitive resin composition.
The ethylenically unsaturated monomer (B) includes a fluorine-containing ethylenically unsaturated monomer (B-1). The ethylenically unsaturated monomer (B) may include other ethylenically unsaturated monomers (B-2).
Fluorine-containing ethylenically unsaturated monomer (B-1)
The fluorine-containing ethylenically unsaturated monomer (B-1) is a compound represented by the formula (II-1).
In the formula (II-1),
R10represents a hydrogen atom or a methyl group, preferably a hydrogen atom;
R11and R12Each represents a hydrogen atom or a fluorine atom, R11And R12At least one of which is a fluorine atom, R11And R12Preferably both represent fluorine atoms;
R13represents a hydrogen atom, a fluorine atom or an alkyl group, preferably representsA hydrogen atom;
w represents an integer of 1 to 10, preferably an integer of 1;
y represents an integer of 1 to 10, preferably an integer of 2.
The fluorine-containing ethylenically unsaturated monomer (B-1) includes 2, 2, 3, 3-tetrafluoropropyl acrylate, 2, 2, 3, 3-tetrafluoropropyl methacrylate, ethyl 2, 2, 2-trifluoroacetate, ethyl 2, 2, 2-trifluoromethylacrylate, amyl 2, 2, 3, 3, 4, 4,5, 5-octafluoropropenoate, octafluoropentyl 2, 2, 3, 3, 4, 4,5, 5-methacrylate, 3, 3, 4, 4,5, 5, 6, 6, 7, 7, 8, 8, 8-fluorooctyl trifluoromethylacrylate, 3, 4, 4,5, 5, 6, 6, 7, 7, 8, 8, 8, 8-fluorooctyl trifluoromethylacrylate, or a combination of the foregoing, preferably comprising 2, 2, 3, 3-tetrafluoropropyl acrylate.
When the photosensitive resin composition includes the fluorine-containing ethylenically unsaturated monomer (B-1), a cured product formed from the photosensitive resin composition not only has good pattern characteristics and can form a pattern without undercut, but also has good ink repellency.
Other ethylenically unsaturated monomer (B-2)
The ethylenically unsaturated group-containing compound may further include other ethylenically unsaturated monomer (B-2).
Other ethylenically unsaturated monomers (B-2) include difunctional monomers, polyfunctional monomers, compounds having one or more thiol groups, silane compounds, or combinations thereof.
Difunctional monomers include 1, 6-hexanediol diacrylate, diallyl terephthalate, diallyl phthalate, ethylene glycol dimethacrylate, 9-Bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene (9, 9-Bis [4- (2-acryloyloxyoxyethoxy) phenyl ] fluorene), 9-Bis [4- (2-hydroxy-3-acryloyloxypropyloxy) phenyl ] fluorene, (9H-fluorene-9, 9-diyl) Bis (4, 1-phenylene)) Bis (oxy)) Bis (ethane-2, 1-diyl) diacrylate, fluorene-9 bisphenol diglycidyl ether diacrylate, or combinations thereof. The difunctional monomer preferably includes diallyl terephthalate, diallyl phthalate, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene, or a combination of the foregoing.
The multifunctional monomer comprises pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, or combinations of the foregoing. The multifunctional monomer preferably comprises dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, or combinations of the foregoing.
The compound having one or more thiol groups comprises trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercaptobutyrate), 1, 4-butanediol bis (3-mercaptobutyrate), tris [2- (3-mercaptobutyrate) ethyl ] isocyanurate, pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate), or combinations thereof. The compound having one or more thiol groups preferably comprises pentaerythritol tetrakis (3-mercaptobutanoate).
The silane compound includes 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyldimethylethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, or a combination thereof. The silane compound preferably comprises 3-glycidyloxypropyltrimethoxysilane.
The ethylenically unsaturated monomer (B) may be 15 to 35 parts by weight, preferably 20 to 30 parts by weight, based on 100 parts by weight of the alkali-soluble resin (a).
Photopolymerization initiator (C)
The photopolymerization initiator (C) in the photosensitive resin composition can generate free radicals in the subsequent exposure step and cause polymerization reaction to form a cured product from the photosensitive resin composition.
The photopolymerization initiator (C) includes an acylphosphine oxide compound (C-1). The photopolymerization initiator (C) may further include an oxime ester compound (C-2). In addition, the photopolymerization initiator (C) may also include other photopolymerization initiators (C-3).
Acylphosphine oxide compound (C-1)
The acylphosphine oxide compound (C-1) is an acylphosphine oxide compound represented by the formula (III-1).
In the formula (III-1),
X2、X3and X4Each represents a single bond or a carbonyl group, X2、X3And X4At least one of which is a carbonyl group;
R5、R6and R7Each represents an alkyl group;
m, n and q each represent an integer of 0 to 5.
Specific examples of the acylphosphine oxide compound (C-1) include bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide (trade name: Irgacure 819 (manufactured by BASF corporation, a compound represented by the following formula (III-1-a)), 2, 4, 6-trimethylbenzoyl diphenylphosphine oxide (trade name: TPO, manufactured by BASF corporation, a compound represented by the following formula (III-1-b)), or a combination of the above compounds. Specific examples of the acylphosphine oxide compound (C-1) preferably include bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide (trade name: Irgacure 819, manufactured by BASF corporation).
When the photopolymerization initiator (C) includes the acylphosphine oxide compound (C-1), the photosensitive resin composition can be provided with good pattern characteristics, and the photosensitive resin composition can form a pattern without undercut. In addition, if the photopolymerization initiator (C) does not include the acylphosphine oxide compound (C-1), the pattern characteristics of the photosensitive resin composition are not good, and an undercut pattern is formed in the photosensitive resin composition.
Oxime ester compounds (C-2)
The photopolymerization initiator (C) further includes an oxime ester compound.
The oxime ester compound is a compound represented by the formula (III-2).
In the formula (III-2),
R14represents alkyl or cycloalkyl, preferably represents hexyl or cyclopentyl;
R15represents an alkyl group or a phenyl group, preferably a methyl group or a phenyl group.
Specific examples of the oxime ester compounds include a compound represented by the formula (III-2-1) (1, 2-octanedione, 1- [4- (phenylthio) phenyl-, 2- (O-benzoyloxime) ]), (trade name: Brilliant OXE-01, manufactured by BASF corporation), a compound represented by the formula (III-2-2) (trade name: PBG-3057, manufactured by POWDERE Co., Ltd.), or a combination thereof.
When the photopolymerization initiator (C) comprises an acylphosphine oxide compound (C-1) and an oxime ester compound (C-2), the weight ratio of the acylphosphine oxide compound to the oxime ester compound is 10: 1 to 4: 1.
When the photopolymerization initiator (C) further includes the oxime ester compound (C-2), the reactivity of the photosensitive 15-type resin composition can be enhanced, and pattern peeling is less likely to occur in the developing process, so that more preferable pattern characteristics can be obtained. Meanwhile, when the weight ratio of the acylphosphine oxide compound (C-1) to the oxime ester compound (C-2) falls within the above range, the surface layer and the under layer of the photosensitive resin composition can be cured in a uniform manner, and more preferable pattern characteristics and taper angles can be obtained.
Other photopolymerization initiator (C-3)
The photopolymerization initiator (C) may also include other photopolymerization initiators (C-3) without affecting the efficacy of the present invention. The other photopolymerization initiator (C-3) is not particularly limited, and examples thereof include triazine compounds, acetophenone compounds, diphenylketone compounds, diimidazole compounds, thioxanthone compounds, quinone compounds, and combinations thereof.
The triazine compound may include chemcure-PAG-1 (trade name; manufactured by Hengqiao industries, Ltd.), chemcure-PAG-2 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable triazine compounds. The triazine compound may be used alone or in combination of two or more.
The acetophenone compounds may include Irgacure 907, 369E (trade name; manufactured by BASF corporation), chemcure-96 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable acetophenone compounds. The acetophenone compounds can be used alone or in combination.
The diphenyl ketone compound may include chemcure-BP, chemcure-64 (trade name; manufactured by Hengqiao industries, Ltd.), or other suitable diphenyl ketone compounds. The diphenyl ketone compound may be used alone or in combination of two or more.
The bisimidazoles may include Chemcure-BCIM, Chemcure-TCDM (trade name; manufactured by Hengqiao industries, Inc.), or other suitable bisimidazoles. The bisimidazole compounds may be used alone or in combination of two or more.
Thioxanthone compounds may include Irgacure ITX (trade name; manufactured by BASF corporation) or other suitable thioxanthone compounds. The thioxanthone compounds may be used singly or in combination.
The quinone compound can be selected from suitable quinone compounds. The quinone compound may be used alone or in combination of two or more.
The photopolymerization initiator (C) may be 1 to 10 parts by weight, preferably 2 to 5 parts by weight, based on 100 parts by weight of the alkali-soluble resin (a).
Solvent (D)
The solvent (D) in the photosensitive resin composition can be mixed with the alkali-soluble resin (A), the ethylenically unsaturated monomer (B), the photopolymerization initiator (C) and the pigment (E), and the photosensitive resin composition can have a suitable viscosity so that the photosensitive resin composition can be applied to a substrate.
The solvent (D) is not particularly limited as long as it can dissolve the alkali-soluble resin (a), the ethylenically unsaturated monomer (B), the photopolymerization initiator (C), and the pigment (E), and an appropriate solvent can be selected as required.
The solvent (D) preferably includes Propylene Glycol Monomethyl Ether Acetate (PGMEA), ethyl 3-ethoxypropionate (EEP), ethyl lactate, butyl lactate, benzyl alcohol, 3-methoxybutyl acetate (MBA), 3-methoxy-3-methylbutanol, γ -butyrolactone, propylene glycol monobutyl ether, or a combination thereof. More preferably, the solvent (F) comprises propylene glycol monomethyl ether acetate.
The solvent (D) may be used alone or in combination of two or more.
The solvent (D) may be 20 to 60 parts by weight, preferably 30 to 50 parts by weight, based on 100 parts by weight of the alkali-soluble resin (a).
Pigment (E)
The pigment (E) includes a white pigment (E-1). In addition, the pigment (E) may further include a black pigment (E-2). The choice of pigment is not particularly limited and need only ensure a high reflectivity in order to be able to be achieved in one or more embodiments of the invention. However, in another or more embodiments of the present invention, the high reflectance may not be limited, and thus can be applied to elements such as black barrier ribs or other color barrier ribs accordingly.
White pigment (E-1)
The white pigment (E-1) is at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc and montmorillonite.
When the pigment (E) includes the white pigment (E-1), the photosensitive resin composition can be used to prepare a white matrix, and can be applied to a color filter of a quantum dot light-emitting device. Therefore, the white matrix can reflect light to improve the light utilization rate of the quantum dot light emitting device and improve the brightness of the quantum dot light emitting device.
Black pigment (E-2)
The pigment (E) may further include a black pigment (E-2). The black pigment (E-2) is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide and titanium black.
When the pigment (E) further includes a black pigment (E-2), the photosensitive resin composition can be used to prepare a gray matrix, and can be applied to a color filter of a quantum dot light emitting device. The gray matrix can increase Optical Density (OD) compared to the white matrix, avoiding light interaction (Cross Talk) between the pattern layers.
The pigment (E) may be 55 to 95 parts by weight, preferably 60 to 80 parts by weight, based on 100 parts by weight of the alkali-soluble resin (a).
Additive (F)
On the premise of not influencing the efficacy of the invention, the photosensitive resin composition of the invention can be further optionally added with an additive (F). The additive (F) is not particularly limited, and specifically, the additive (F) may include a leveling agent. The leveling agent includes a silicone-based surfactant, a fluorine-based surfactant, or a combination thereof.
The silicone-based surfactant may include a silicone-based surfactant. For example, the silicone-based surfactant may include BYK-307, BYK-323, BYK-348 (trade name; manufactured by BYK chemical Co., Ltd.), KP323, KP324, KP340, KP341 (trade name; manufactured by shin-Etsu chemical industries, Ltd.), or other suitable silicone-based surfactants. The silicone surfactant may be used alone or in combination of two or more.
The silicone-based surfactant may include BYK-333 (trade name; manufactured by Bick chemical Co., Ltd.) or other suitable silicone-based surfactants. The silicone surfactant may be used alone or in combination of two or more.
The fluorine-based surfactant may include Meijia (Megaface) F-477, F-554, F-556, F-563, F-575, RS-72-K (trade name; manufactured by Dieie (DIC) Inc.) or other suitable fluorine-based surfactants. The fluorine-based surfactant may be used alone or in combination of two or more.
When the resin composition further includes a leveling agent as the additive (F), the photosensitive resin composition can have good coating uniformity.
The additive (F) may be not more than 5 parts by weight, preferably 1 to 5 parts by weight, based on 100 parts by weight of the alkali-soluble resin (a).
< method for producing photosensitive resin composition >
The method for producing the photosensitive resin composition is not particularly limited, and examples thereof include: the alkali-soluble resin (A), the ethylenically unsaturated monomer (B), the photopolymerization initiator (C) and the solvent (D) are stirred in a stirrer to be uniformly mixed into a solution state, and if necessary, the additive (F) is added and uniformly mixed to obtain a liquid photosensitive resin composition.
< method for producing partition wall >
An exemplary embodiment of the present invention provides a partition wall formed using the photosensitive resin composition.
The barrier ribs can be formed by coating the photosensitive resin composition on a substrate to form a coating film, and subjecting the coating film to pre-baking (prebake), exposure, development, and post-baking (postbake). For example, after a photosensitive resin composition is coated on a substrate to form a coating film, a pre-exposure baking (i.e., pre-baking) step is performed at a temperature of 100 ℃ for 60 seconds. Then, exposure was performed using a mask having a predetermined pattern with a film surface and mask spacing of 50 μm, and a high-pressure mercury lamp was used at 100mJ/cm2The prebaked coating film is exposed to light. Then, the exposed coating film was subjected to a development step for 50 seconds. Next, the developed coating film was washed with distilled water and blown with nitrogen gas to dry the coating film. Then, post baking was performed at 220 ℃ for 45 minutes to form partition walls on the substrate.
The substrate may be a glass substrate, a plastic base material such as a Polyethersulfone (PES) plate, a Polycarbonate (PC) plate, or a Polyimide (PI) film, or other light-permeable substrate, and the type thereof is not particularly limited.
The coating method is not particularly limited, but a spray coating method, a roll coating method, a spin coating method, or the like can be used, and in general, the spin coating method is widely used. Further, a coating film is formed, and then, in some cases, the residual solvent may be partially removed under reduced pressure.
The developing solution is not particularly limited, and an appropriate developing solution may be selected according to the need. For example, the developer may be an aqueous solution of potassium hydroxide (KOH), which may be at a concentration of 0.038 wt%.
< light emitting device >
An exemplary embodiment of the present invention provides a light emitting device including the partition wall described above. Here, when the photosensitive resin composition includes a white pigment, the photosensitive resin composition may be used to form white partition walls; and when the photosensitive resin composition includes both the black pigment and the white pigment, the photosensitive resin composition may be used to form the gray partition wall.
Fig. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention. The light emitting device 10 includes a substrate 120, a backlight module 200, and a light conversion layer 160, wherein the backlight module 200 is disposed opposite to the substrate 120, and the light conversion layer 160 is disposed between the substrate 120 and the backlight module 200. In this embodiment, the light emitting device 10 may further include a filter layer 140, wherein the filter layer 140 is located between the substrate 120 and the light conversion layer 160. The light emitting device 10 may further include a gas barrier layer, a transparent optical adhesive layer, a polarizer, an alignment film, a liquid crystal (not shown) or other elements known to those skilled in the art, and thus, will not be described in detail herein.
In the present embodiment, the substrate 120 is a light-transmissive substrate. The substrate 120 may be made of glass, organic polymer (e.g., Polyimide (PI), Polyethersulfone (PES), or Polycarbonate (PC)), or other suitable material.
In the present embodiment, the filter layer 140 includes a plurality of filter patterns 142 and a plurality of black barrier ribs 144. The black partition walls 144 are respectively inserted between the filter patterns 142, so that one filter pattern 142 of the filter patterns 142 exists between every two adjacent black partition walls 144 of the black partition walls 144. The plurality of filter patterns 142 include red filter patterns 142R, green filter patterns 142G, and blue filter patterns 142B. In other words, the filter patterns 142 may be red filter patterns 142R, green filter patterns 142G, or blue filter patterns 142B. In addition, the red, green and blue filter patterns 142R, 142G and 142B do not include quantum dots.
In the present embodiment, the light conversion layer 160 includes a plurality of pattern layers 162 and a plurality of white barrier ribs 164. The white partition walls 164 are respectively inserted between the plurality of pattern layers 162, so that one pattern layer 162 of the plurality of pattern layers 162 exists between every two adjacent white partition walls 164 of the plurality of white partition walls 164. The plurality of pattern layers 162 include a red pattern layer 162R, a green pattern layer 162G, and a diffuser pattern layer 162S. In other words, the pattern layer 162 may be a red pattern layer 162R, a green pattern layer 162G, or a scatterer pattern layer 162S. In addition, the red pattern layer 162R includes red quantum dots. The green pattern layer 162G includes green quantum dots. The scatterer pattern layer 162S does not contain quantum dots. Here, the white partition 164 serves as a reflective layer, and the white partition 164 may be replaced with a gray partition.
In the present embodiment, the red pattern layer 162R is located under the red filter pattern 142R; the green pattern layer 162G is under the green filter pattern 142G; and the scatterer pattern layer 162S is positioned under the blue filter pattern 142B. More specifically, the edge of the red pattern layer 162R of the light conversion layer 160 is substantially aligned with the edge of the red filter pattern 142R of the filter layer 140; the edge of the green pattern layer 162G of the light conversion layer 160 is substantially aligned with the edge of the green filter pattern 142G of the filter layer 140; and the edge of the scatterer pattern layer 162S of the light conversion layer 160 is substantially aligned with the edge of the blue filter pattern 142B of the filter layer 140.
Further, the black partition wall 144 in the filter layer 140 is positioned on the white partition wall 164 in the light conversion layer 160. Further, the edge of the white barrier rib 164 in the light conversion layer 160 is substantially aligned with the edge of the black barrier rib 144 in the filter layer 140.
The backlight module 200 irradiates light to the light conversion layer 160. For example, the backlight module 200 is suitable for providing a light source, and the light emitted from the light source sequentially passes through the light conversion layer 160, the filter layer 140 and the substrate 120 to provide a converted light source. In the present embodiment, the light source used in the backlight module 200 may include an Organic Light Emitting Diode (OLED), a Micro-LED (Micro-LED), or other suitable light sources. In the present embodiment, the backlight module 200 is a light source emitting blue light. The blue light emitted from the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162R and the green quantum dots in the green pattern layer 162G, and then the converted light is respectively emitted from the red pattern layer 162R and the green pattern layer 162G, and then the red light and the green light are respectively emitted through the red filter pattern 142R and the green filter pattern 142G of the filter layer 140; the blue light emitted from the backlight module 200 directly passes through the scatterer pattern layer 162S without quantum dots to emit blue light, and then passes through the blue filter pattern 142B of the filter layer 140 to emit blue light. For example, when light emitted from the light source through the light conversion layer 160 and the filter layer 140 includes visible light (e.g., red light, green light, and blue light), the light emitting device 10 may be applied to a display panel or other suitable device. Thereby, the display panel of the light emitting device 10 including the light conversion layer formed of the above resin composition can exhibit preferable brightness and color purity compared to the conventional light emitting device. However, the invention is not limited thereto, and in an embodiment, the filter layer 140 (the red filter pattern 142R) does not filter the nir light, so that the invention can also be applied to the application of emitting nir light.
Fig. 2 is a schematic diagram of a light emitting device according to another embodiment of the present invention. It should be noted that the embodiment of fig. 2 follows the element numbers and partial contents of the embodiment of fig. 1, wherein the same or similar element numbers are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
The main difference between the embodiment of fig. 2 and the embodiment of fig. 1 is that: the light emitting device 20 does not have the filter layer 140.
Referring to fig. 2, the light emitting device 20 includes a substrate 120, a light conversion layer 160, and a backlight module 200, wherein the backlight module 200 is disposed opposite to the substrate 120, and the light conversion layer 160 is disposed between the substrate 120 and the backlight module 200. In the present embodiment, the filter layer 140 without quantum dots is not disposed between the light conversion layer 160 and the substrate 120.
In the present embodiment, light emitted from the light source provided by the backlight module 200 sequentially passes through the light conversion layer 160 and the substrate 120 to provide a converted light source. After the blue light emitted from the backlight module 200 is absorbed by the red quantum dots in the red pattern layer 162R and the green quantum dots in the green pattern layer 162G, the converted light can be respectively emitted from the red pattern layer 162R and the green pattern layer 162G; the blue light emitted from the backlight module 200 directly passes through the scatterer pattern layer 162S without quantum dots to emit blue light. For example, when the light emitted from the light source through the light conversion layer 160 includes visible light (e.g., red light, green light, and blue light), the light emitting device 20 may be applied to an electromagnetic radiation device or other suitable device. Thus, the electromagnetic radiation device including the light emitting device 20 can exhibit preferable brightness and color purity, and a step of manufacturing a filter layer can be omitted to reduce the manufacturing cost of the light emitting device, compared to the conventional light emitting device and/or the above-described electromagnetic radiation device including the light emitting device 10. For example, when the light emitted from the light source through the light conversion layer 160 includes near infrared light (e.g., having a wavelength of about 780 nm to 800 nm), the light emitting device 20 may be applied to an electromagnetic radiation device or other suitable device.
Resin composition and Experimental example of light conversion layer
The following are descriptions of the photosensitive resin composition and the partition wall of experimental examples 1 to 9 and comparative examples 1 to 3:
experimental example 1
a. Photosensitive resin composition
32 parts by weight of an alkali-soluble resin (A-1) (manufactured by Showa Denko K.K.), 34 parts by weight of an alkali-soluble resin (A-2), 34 parts by weight of an alkali-soluble resin (A-3), 9.3 parts by weight of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, 2.4 parts by weight of pentaerythritol tetrakis (3-mercaptobutanoate), 4.5 parts by weight of 9, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene, 6.9 parts by weight of a mixture of diallyl terephthalate and diallyl phthalate, 2.4 parts by weight of 3-glycidyloxypropyltrimethoxysilane, 1.7 parts by weight of 2, 2, 3, 3-tetrafluoropropyl acrylate, 2.4 parts by weight of brilliant good solid (Irgacure)819, 60.8 parts by weight of a titanium oxide dispersion (Sanyo Color Works, LTD) was added to 47 parts by weight of Propylene Glycol Monomethyl Ether Acetate (PGMEA), and stirred uniformly by a stirrer, to obtain the photosensitive resin composition of experimental example 1.
b. Partition wall
The photosensitive resin composition obtained in experimental example 1 was coated on a substrate by a spin coating method (spin coater model MS-A150, manufactured by Mikasa corporation, rotation speed about 200 rpm). Then, pre-baking is performed at a temperature of 100 ℃ for 60 seconds to form a thin film. Then, using a mask having a line width/space of 1 to 100 μm with a straight-line type through pattern, the distance between the mask and the film surface is controlled to be about 50 μm to contain g, h, i+A radiant high-pressure mercury lamp (model UX-1000SM-ANC01, manufactured by Ushio, Inc.) at 100mJ/cm2The prebaked coating film is exposed to light to form a semi-finished product. Subsequently, the resultant was developed at a temperature of 23 ℃ for 50 seconds using an aqueous solution of potassium hydroxide having a concentration of 0.038 wt% as a developer. Then, the developed coating film was washed with distilled water and blown with nitrogen gas to dry the coating film. Subsequently, post baking was performed at 220 ℃ for 45 minutes, and partition walls having a pattern thickness of 8 μm were obtained. The obtained partition wall was evaluated in the evaluation methods described below, and the results are shown in table 2.
Examples 2 to 9 and comparative examples 1 to 3
The photosensitive resin compositions of experimental examples 2 to 9 and comparative examples 1 to 3 were prepared in the same procedure as in experimental example 1, and they were different in that: the types of components and the amounts of the components used (shown in tables 2 and 3) of the photosensitive resin compositions were varied, and the components/compounds corresponding to the symbols in tables 2 and 3 are shown in table 1. The obtained photosensitive resin composition was formed into a partition wall and evaluated in the following evaluation methods, and the results are shown in tables 2 and 3. The blank space in tables 2 and 3 in which no numerical value is described indicates "no addition (this component)".
[ Table 1]
< evaluation mode >
a. Features of the pattern
The manufactured barrier ribs were examined by an optical microscope (model MX61, manufactured by Olympus corporation) for whether pattern features of openings (having a width of 50 μm) between two adjacent barrier ribs were maintained and whether a photosensitive resin composition remained on the edges of the pattern on the substrate, to evaluate the pattern features.
The evaluation criteria for pattern features were as follows:
very good: the line edge of the straight line pattern has high linearity, and no photosensitive resin composition remains on the edge of the pattern;
o: the line edge of the straight line pattern is not straight, and the pattern edge has a little photosensitive resin composition remained on the substrate;
x: the line side of the linear pattern is not straight, and a large amount of the photosensitive resin composition remains on the substrate at the pattern edge or the pattern is peeled off from the substrate.
b. Undercut pattern
The prepared partition wall was observed for the taper angle of the partition wall on the substrate by an electron microscope (model SU8000, manufactured by HITACHI) at a magnification of 10000 times to evaluate whether there was an undercut pattern.
Specifically, fig. 3(a) and 3(b) are schematic structural diagrams of patterns. As shown in fig. 3(a) and 3(b), the partition walls 2 are positioned on the substrate 1. The partition wall 2 has two side surfaces 2a and a bottom surface 2b, wherein the bottom surface 2b is connected to the substrate 1, and the two side surfaces 2a are respectively adjacent to the bottom surface 2 b. An angle between either one of the two side surfaces 2a and the bottom surface 2b is defined as a taper angle θ.
The evaluation criteria for undercut patterns are as follows:
o: as shown in FIG. 3(a), the taper angle θ is less than or equal to 90 °, without undercut pattern;
x: as shown in fig. 3(b), the taper angle θ > 90 °, with an undercut pattern.
c. Ink spreading (hydrophobicity)
Propylene glycol monomethyl ether acetate (PGMEA, as a solvent) was dropped on the surface of the partition wall using a micro syringe, and a contact angle ψ between a tangent of the solvent at a liquid-solid-gas interface and the surface of the partition wall when the solvent was on the partition wall was measured using a contact angle measuring apparatus (model DM500, manufactured by kyowan interface science co.).
The evaluation criteria of ink repellency (hydrophobicity) were as follows:
very good: a contact angle psi is not less than 45 degrees;
o: the contact angle psi is more than or equal to 40 degrees and less than 45 degrees;
x: the contact angle psi is less than 40 deg.
< evaluation results >
As is clear from tables 2 and 3, the partition walls formed from the photosensitive resin compositions (examples 1 to 9) comprising both the alkali-soluble resin (A-1) and the acylphosphine oxide compound as the photopolymerization initiator (C) exhibited substantially good pattern characteristics (no or little development residue) and formed undercut-free patterns. On the other hand, since the partition walls formed from the photosensitive resin compositions (comparative examples 2 and 3) not including both the alkali-soluble resin (a-1) and the acylphosphine oxide compound as the photopolymerization initiator (C) had undercut patterns, it was not possible to achieve both of the characteristics of good pattern characteristics (no or little development residue) and capability of forming undercut-free patterns.
In addition, when the photosensitive resin composition further contains an alkali-soluble resin (A-2) (examples 1 to 9), the partition walls formed from the photosensitive resin composition (examples 1 to 9) have substantially good pattern characteristics (no or little development residue) and can be formed into a pattern without undercut. On the other hand, when the photosensitive resin composition does not contain the alkali-soluble resin (a-2) (comparative example 1), the pattern characteristics of the partition walls formed are not good.
Furthermore, when the photosensitive resin composition includes a fluorine-containing ethylenically unsaturated monomer (examples 1 to 7), the cured product formed from the photosensitive resin composition has a better ink repellency.
In summary, the photosensitive resin composition of the present invention comprises an alkali-soluble resin having a specific structural unit and an acylphosphine oxide compound as a photopolymerization initiator, and provides a photosensitive resin composition with good pattern characteristics (no or little development residue) and capable of forming a pattern without undercut, thereby improving the phenomena of excessive development residue and undercut of taper angle.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (20)
1. A photosensitive resin composition for use in a developing process, comprising:
an alkali-soluble resin A;
an ethylenically unsaturated monomer B;
a photopolymerization initiator C;
a solvent D; and
the pigment E is a pigment which is a pigment,
the alkali-soluble resin A comprises the alkali-soluble resin A-1, the alkali-soluble resin A-1 comprises a structural unit represented by a formula (I-1) and a structural unit represented by a formula (I-2),
in the formula (I-1), R1And R2Each represents a hydrogen atom or a methyl group, X1Represents an ethylene group, a propylene group, a butylene group, a1, 2-phenylene group, a1, 2-cyclohexylene group, a1, 2-cyclohexen-1-ylene group, a 4, 5-cyclohexen-1-ylene group or a norbornenylene group, and represents a bonding site;
in the formula (I-2), R3And R4Each represents a hydrogen atom or a methyl group, each represents a bonding site,
the photopolymerization initiator C includes an acylphosphine oxide compound represented by the formula (III-1),
in the formula (III-1), X2、X3And X4Each represents a single bond or a carbonyl group, X2、X3And X4At least one of which is carbonyl, R5、R6And R7Each represents an alkyl group, and m, n and q each represent an integer of 0 to 5.
2. The photosensitive resin composition according to claim 1, wherein the structural unit represented by the formula (I-1) is 30 to 60 mol% based on 100 mol% of the total of the structural unit represented by the formula (I-1) and the structural unit represented by the formula (I-2) in the alkali-soluble resin A-1.
3. The photosensitive resin composition according to claim 1, wherein the weight average molecular weight of the alkali-soluble resin A-1 is 3,000 to 20,000.
4. The photosensitive resin composition according to claim 1, wherein the acid value of the alkali-soluble resin a-1 is from 30mgKOH/g to 100 mgKOH/g.
5. The photosensitive resin composition according to claim 1, wherein the alkali-soluble resin A further comprises the alkali-soluble resin A-2, the alkali-soluble resin A-2 comprises a structural unit represented by formula (I-3),
in the formula (I-3), R8Represents a hydrogen atom or a methyl group, z represents an integer of 1 to 10, and represents a bonding position.
6. The photosensitive resin composition according to claim 5, wherein the weight ratio of the alkali-soluble resin A-1 to the alkali-soluble resin A-2 is 1: 1-1: 3.
7. the photosensitive resin composition according to claim 1, wherein the alkali-soluble resin A further comprises the alkali-soluble resin A-3, the alkali-soluble resin A-3 comprises a structural unit represented by formula (I-4),
in the formula (I-4), R9Represents a hydrogen atom or a methyl group, and represents a bonding position.
8. The photosensitive resin composition according to claim 1, wherein the ethylenically unsaturated monomer B comprises a fluorine-containing ethylenically unsaturated monomer B-1 represented by the formula (II-1),
in the formula (II-1), R10Represents a hydrogen atom or a methyl group, R11And R12Each represents a hydrogen atom or a fluorine atom, R11And R12At least one of which is a fluorine atom, R13Represents a hydrogen atom, a fluorine atom or an alkyl group, w represents an integer of 1 to 10, and y represents an integer of 1 to 10.
9. The photosensitive resin composition according to claim 1, wherein the photopolymerization initiator C further comprises an oxime ester compound.
10. The photosensitive resin composition according to claim 9, wherein a weight ratio of the acylphosphine oxide compound to the oxime ester compound in the photopolymerization initiator C is 10: 1-4: 1.
11. the photosensitive resin composition according to claim 9, wherein the oxime ester compound is a compound represented by the formula (III-2),
in the formula (III-2), R14Represents alkyl or cycloalkyl, R15Represents an alkyl group or a phenyl group.
12. The photosensitive resin composition according to claim 1, wherein the pigment E comprises a white pigment E-1, and the white pigment E-1 is at least one selected from the group consisting of titanium oxide, silicon oxide, barium titanate, zirconium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium sulfate, magnesium carbonate, barium carbonate, calcium carbonate, strontium titanate, aluminum powder, kaolin, clay, talc, and montmorillonite.
13. The photosensitive resin composition according to claim 12, wherein the pigment E further comprises a black pigment E-2, and the black pigment E-2 is at least one selected from the group consisting of carbon black, chromium oxide, iron oxide, and titanium black.
14. The photosensitive resin composition according to claim 1, wherein the ethylenically unsaturated monomer B is 15 to 35 parts by weight, the photopolymerization initiator C is 1 to 10 parts by weight, the solvent D is 20 to 60 parts by weight, and the pigment E is 55 to 95 parts by weight, based on 100 parts by weight of the alkali-soluble resin A.
15. A partition wall formed of the photosensitive resin composition according to any one of claims 1 to 14.
16. A light emitting device comprising the partition wall according to claim 15.
17. A light conversion layer comprising:
a plurality of pattern layers; and
a plurality of white partition walls formed of the photosensitive resin composition according to any one of claims 1 to 14;
the white partition walls are respectively inserted between the pattern layers, so that one of the pattern layers exists between every two adjacent white partition walls.
18. The light conversion layer of claim 17, wherein the pattern layer is a red pattern layer, a green pattern layer, or a diffuser pattern layer.
19. A light emitting device comprising:
a substrate;
the backlight module is arranged opposite to the substrate; and
a light conversion layer between the substrate and the backlight module,
wherein the light conversion layer is as claimed in claim 17 or claim 18.
20. The light emitting device of claim 19, further comprising a filter layer between the substrate and the light conversion layer.
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| CN202010493418.6A CN113759661B (en) | 2020-06-03 | Photosensitive resin composition, partition wall, light conversion layer, and light emitting device |
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| CN202010493418.6A CN113759661B (en) | 2020-06-03 | Photosensitive resin composition, partition wall, light conversion layer, and light emitting device |
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