CN117434421A - Test board card, test board card tool and board card test method - Google Patents

Test board card, test board card tool and board card test method Download PDF

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Publication number
CN117434421A
CN117434421A CN202311294994.8A CN202311294994A CN117434421A CN 117434421 A CN117434421 A CN 117434421A CN 202311294994 A CN202311294994 A CN 202311294994A CN 117434421 A CN117434421 A CN 117434421A
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CN
China
Prior art keywords
test
board
main control
tested
digital signal
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CN202311294994.8A
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Chinese (zh)
Inventor
张晓羽
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CASIC Defense Technology Research and Test Center
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CASIC Defense Technology Research and Test Center
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Priority to CN202311294994.8A priority Critical patent/CN117434421A/en
Publication of CN117434421A publication Critical patent/CN117434421A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/25Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2815Functional tests, e.g. boundary scans, using the normal I/O contacts
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention provides a test board card, a test board card tool and a board card test method, which belong to the technical field of chips, wherein the test board card comprises a main control chip, a signal acquisition module, a power supply module and a communication module, the signal acquisition module is connected with the main control chip, and the signal acquisition module is used for acquiring an analog voltage signal output by the board card to be tested and converting the acquired analog voltage signal into a first test digital signal; the communication module is respectively connected with the main control chip and the server, and can transmit the first test digital signal back to the server; and/or the communication module can transmit the test instruction to the main control chip so that the main control chip inputs a second test digital signal to the board to be tested. The test board card provided by the application can be convenient for test operation of the board card to be tested, can test the board card to be tested under various test scenes, and is wide in application range.

Description

Test board card, test board card tool and board card test method
Technical Field
The application relates to the technical field of electronic components, in particular to a test board card, a test board card tool and a board card test method.
Background
The board card is a printed circuit board and is commonly used for electrical equipment. For example, the television board is the main control board of the television. When the board card performs different functions, different signal input interfaces are used for connecting external equipment, so that different channels are used, for example, channels of a television board card comprise an ATV (analog television) channel, an HDMI (high definition multimedia interface) channel and the like. To ensure the quality of use of the board, power testing of each channel is generally required before the board leaves the factory.
In the board test experiment, corresponding application requirements of users are required to be met, however, the existing board test experiment cannot meet test functions under various setting scenes, for example, tests on various aspects such as signal transmission, dynamic power consumption, working stability and temperature environment factors, are greatly limited in adaptability verification of the board, and improvement and mass production of the board are not facilitated.
Disclosure of Invention
Accordingly, the present application is directed to a test board, a test board fixture and a board testing method.
Based on the above objects, the present application provides a test board card, comprising:
a main control chip;
the signal acquisition module is connected with the main control chip and is used for being connected with a board to be tested so as to acquire an analog voltage signal output by the board to be tested and convert the analog voltage signal into a first test digital signal to be transmitted to the main control chip;
the power supply module is suitable for supplying power to the main control chip;
the communication module is respectively connected with the main control chip and the server, and can receive a first test digital signal of the main control chip and transmit the first test digital signal back to the server;
and/or the communication module can receive the test instruction of the server and transmit the test instruction to the main control chip so that the main control chip inputs a second test digital signal to the board to be tested.
Further, the main control chip reads and loads a pre-configuration program through the configuration chip, and configuration information of the pre-configuration program is stored in the external memory.
Further, the main control chip adopts a combined test action group daisy chain structure downloading configuration procedure.
Based on the same inventive concept, the application also provides a test board card tool, including any one of the test board cards, further including:
the board card to be tested comprises a driver, a receiver and a conversion module, wherein the driver is connected with the signal acquisition module of the test board card, the receiver is connected with the main control chip of the test board card, and the driver is electrically connected with the receiver through the conversion module;
the receiver receives a second test digital signal of the main control chip, then transmits the second test digital signal to the conversion module, and the conversion module converts the second test digital signal into an analog voltage signal and then outputs the analog voltage signal to the signal acquisition module through the driver.
Further, the method further comprises the following steps:
the external power supply is connected with the board card to be tested through a peripheral circuit;
and the oscilloscope is electrically connected with the board card to be tested so as to display the analog voltage signal output by the driver.
Based on the same inventive concept, the application also provides a board testing method, which is suitable for testing the board tool for testing, and comprises the following steps:
the method comprises the steps that a communication module receives a test instruction sent by a server and transmits the test instruction to a main control chip, the main control chip sends a second test digital signal to a receiver of a board to be tested after receiving the test instruction, the receiver receives the second test digital signal of the main control chip and then transmits the second test digital signal to a conversion module, and the conversion module converts the second test digital signal into an analog voltage signal and then outputs the analog voltage signal through a driver;
the method comprises the steps that a signal acquisition module acquires an analog voltage signal output by a board card to be tested, converts the analog voltage signal into a first test digital signal and transmits the first test digital signal to a main control chip;
receiving a first test digital signal of the main control chip through the communication module, and transmitting the first test digital signal back to the server;
comparing the first test digital signal with the second test digital signal, and obtaining a test result according to the comparison result.
Further, the receiving, by the communication module, the test instruction sent by the server includes:
initial test environmental conditions are set.
Further, the setting the initial test environmental condition includes:
setting at least two different test temperature environments;
and placing the board card to be tested in each temperature environment for testing.
Further, the setting the initial test environmental condition includes:
setting a test temperature interval, and enabling the temperature alternation of a test temperature environment to be in the test temperature interval;
and placing the board card to be tested in a test temperature environment for testing.
Further, the method further comprises the following steps:
detecting the appearance, the function and the working performance of the board card to be tested before the test starts;
detecting the appearance, the function and the working performance of the board card to be tested after the test is finished;
and comparing the detection results of the board card to be tested before and after the test, and obtaining the test result according to the detection results.
From the above, it can be seen that the test board card provided by the present application, the communication module can receive the first test digital signal of the main control chip and transmit the first test digital signal back to the server; and/or the communication module can receive the test instruction of the server and transmit the test instruction to the main control chip, so that the main control chip inputs a second test digital signal to the board to be tested, and a detection result is obtained by comparing the first test digital signal with the second test digital signal, thereby the test work of the board to be tested can be completed by using the test board, and all functional performance verification of the current board to be tested is satisfied.
Drawings
In order to more clearly illustrate the technical solutions of the present application or related art, the drawings that are required to be used in the description of the embodiments or related art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to those of ordinary skill in the art.
Fig. 1 is a schematic diagram of transmission signal principles of a test board and a board to be tested in an embodiment of the present application;
FIG. 2 is a schematic diagram illustrating connection between a board to be tested and a test board in an embodiment of the present application;
FIG. 3 is a schematic diagram illustrating steps of a board testing method according to an embodiment of the present application;
fig. 4 is a schematic diagram of a hardware structure of an electronic device in an embodiment of the application.
Reference numerals illustrate:
1. a server; 2. a communication module; 3. a main control chip; 4. configuring a chip; 5. a power supply module; 6. a signal acquisition module; 7. a board card to be tested; 71. a receiver; 72. a driver; 73. a conversion module;
1010. a processor; 1020. a memory; 1030. an input/output interface; 1040. a communication interface; 1050. a bus.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Currently, board level verification tests include the following steps:
the method comprises the steps of taking an application circuit actually used by the type of the board as a prototype, and developing the design of a general board based on domestic components;
setting verification items according to categories by taking actual application indexes and quality problems historically occurring in similar products as guidance;
the whole process data representing the main characteristics of the device is taken as a guide, and a special monitoring circuit is designed;
and the data analysis and evaluation are carried out by utilizing an informatization means with the aim of scientifically and objectively evaluating the usability and applicability of the device.
In the step of the above board level verification test, the board level verification test should be performed following the following principle: 1. meeting the general application demand response; namely, a certain board-level functional circuit is used for realizing a specific function, and the board-level functional circuit is used for realizing verification and evaluation of key performance; 2. the user application demand response is satisfied; the application requirements comprise functional requirements, namely the functions realized by using the component in the actual product application of the user unit; parameter requirements, namely parameters concerned by a user unit in the process of designing by using the device, or parameters which have obvious influence on practical application, and functional performance which is easily influenced by board-level parasitic parameters or loads and the like; the environmental requirements, including temperature, humidity, mechanical and chemical conditions, are specified according to the user's proposed environmental parameters or profiles, and as far as possible, when time and technical conditions allow.
However, board level verification tests still have some drawbacks, such as the difficulty in implementing functional performance of test verification on ATE (Automatic Test Equipment, integrated power test machine), relatively little research on the general board adaptability verification method of some feature boards, such as RS-422/485 signal transceivers, and adverse effects on ensuring reliability of subsequent components and quality of control models.
Based on the above problems, the present application provides a test board, and embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the test board card provided by the application comprises a main control chip 3, a signal acquisition module 6, a power supply module 5 and a communication module 2, wherein the signal acquisition module 6 is connected with the main control chip 3, the signal acquisition module 6 is used for being connected with a board card 7 to be tested so as to acquire an analog voltage signal output by the board card 7 to be tested, and the acquired analog voltage signal is converted into a first test digital signal and then transmitted to the main control chip 3; the power supply module 5 is suitable for supplying power to the main control chip 3; the communication module 2 is respectively connected with the main control chip 3 and the server 1, and the communication module 2 can receive a first test digital signal of the main control chip 3 and transmit the first test digital signal back to the server 1; and/or, the communication module 2 can receive the test instruction of the server 1 and transmit the test instruction to the main control chip 3, so that the main control chip 3 inputs a second test digital signal to the board card 7 to be tested.
As can be seen from the above description, the communication module 2 of the test board provided by the present application can receive the first test digital signal of the main control chip 3 and transmit the first test digital signal back to the server 1; and/or, the communication module 2 can receive the test instruction of the server 1 and transmit the test instruction to the main control chip 3, so that the main control chip 3 inputs a second test digital signal to the board card 7 to be tested, and a detection result is obtained by comparing the first test digital signal with the second test digital signal, so that the test work of the board card 7 to be tested can be completed by using the test board card, and all functional performance verification of the current board card 7 to be tested is satisfied; meanwhile, the board card 7 to be tested is tested through the test board card, the test environment of the board card 7 to be tested is not restricted or limited, and the board card 7 to be tested can be suitable for various test environments and test conditions and has strong universality.
In the above description, the main control chip 3 may be an existing mature control chip, for example, spartan-6 series chip of Xilinx corporation, and the main control chip 3 is used for realizing the functions of controlling the board card 7 to be tested, outputting excitation signals, collecting daughter board signals and interacting with an upper computer.
In some embodiments, the master chip 3 reads and loads a pre-configuration program through the configuration chip 4, configuration information of which is stored in an external memory. Specifically, the configuration chip 4 may be an FPGA (Field Programmable Gate Array ) chip, the configuration information of the configuration chip 4 is stored in a PROM (Programmable Read-Only Memory ), and when the configuration chip 4 is powered up for testing, a pre-configuration program is read from the PROM to complete the loading procedure.
In some embodiments, the configuration of the configuration chip 4 is performed by adopting a JTAG (Joint Test Action Group, joint test working group) downloading manner, specifically, the configuration chip 4 downloads the configuration program by adopting a joint test working group daisy chain structure, and pins used in downloading the configuration chip 4 can follow the IEEE1149.1 standard.
In some embodiments, the power supply module 5 supplies power to the test board and the peripheral circuit, where the peripheral circuit is a mature circuit for ensuring the normal operation of the board, and this will not be described in detail in this embodiment.
Based on the same inventive concept, the application also provides a test board tool, which comprises the test board as described in any one of the above, and further comprises a board 7 to be tested, wherein the board 7 to be tested comprises a driver 72, a receiver 71 and a conversion module 73, the driver 72 is connected with the signal acquisition module 6 of the test board, the receiver 71 is connected with the main control chip 3 of the test board, and the driver 72 and the receiver 71 are electrically connected through the conversion module 73.
After receiving the second test digital signal of the main control chip 3, the receiver 71 transmits the second test digital signal to the conversion module 73, and the conversion module 73 converts the second test digital signal into an analog voltage signal and outputs the analog voltage signal to the signal acquisition module 6 through the driver 72.
In the above description, as shown in fig. 1 and fig. 2, fig. 2 is a schematic connection diagram of a board to be tested 7 and a test board, where the board to be tested 7 may use an SM3491 chip of an RS-422/485 signal transceiver produced by a micro-production in Shenzhen country, and the board to be tested 7 should have other peripheral circuits and connectors for ensuring normal operation of the chip besides the chip.
In the above embodiment, the test board card tool should further include an external power supply and an oscilloscope, where the external power supply is used to supply power to the board card 7 to be tested, the test board card and other required devices, and the oscilloscope can grasp the analog voltage signal output by the driver 72 of the board card 7 to be tested, so as to perform subsequent verification or test work.
Based on the same inventive concept, the application also provides a board testing method, as shown in fig. 3, suitable for testing the board testing tool as described above, comprising the following steps:
step 100, the communication module 2 receives the test command sent by the server 1, and sends the test command to the main control chip 3, after receiving the test command, the main control chip 3 sends a second test digital signal to the receiver 71 of the board card 7 to be tested, after receiving the second test digital signal of the main control chip 3, the receiver 71 sends the second test digital signal to the conversion module 73, and the conversion module 73 converts the second test digital signal into an analog voltage signal and outputs the analog voltage signal through the driver 72.
Step 200, the signal acquisition module 6 acquires the analog voltage signal output by the board card 7 to be tested, converts the analog voltage signal into a first test digital signal, and transmits the first test digital signal to the main control chip 3.
Step 300, the communication module 2 receives the first test digital signal of the main control chip 3, and returns the first test digital signal to the server 1.
Step 400, comparing the first test digital signal with the second test digital signal, and obtaining a test result according to the comparison result.
As can be seen from the above description steps, in the board testing method provided by the present application, by comparing the second test digital signal input into the board 7 to be tested with the first test digital signal sent out by the driver 72 of the board 7 to be tested, whether the board 7 to be tested can normally work is determined according to the comparison result, and the whole process is simple and convenient, and the board testing method is not limited to testing on an ATE platform, and has higher universality.
In the above description, the first test digital signal and the second test digital signal may each employ a differential signal. The server 1 may be an existing mature upper computer, or a cloud platform such as the cloud server 1, which is not limited in any way in the embodiments of the present application.
Illustratively, in some embodiments, the test verification experiment items for the basic functions of the board card 7 under test are as follows:
1. verification purpose: verifying whether the signal transmission function meets the requirement or not under the specified power supply voltage of the board card 7 to be tested;
2. verification conditions: vcc=3.3v;
3. the verification method comprises the following steps:
a) The board card 7 to be tested is placed in a prescribed experimental environment.
b) And the board card 7 to be tested is respectively connected with a direct-current power supply, an oscilloscope and a test board card.
c) And (5) switching on a power supply.
d) The board 7 to be tested is controlled by the test board so that a driver 72 (driver) of the board 7 to be tested is interconnected with a receiver 71 (receiver) via a conversion module 73.
e) The server 1 sends a test instruction to the test board, the main control chip 3 of the test board receives the test instruction and then sends a second test digital signal to the receiver 71 of the board 7 to be tested, and the oscilloscope is adjusted to capture an analog voltage signal output by the driver 72 of the board 7 to be tested and obtain a first test digital signal returned by the communication module 2 in the server 1.
f) And comparing the first test digital signal with the second test digital signal, and detecting the correctness of the signal transmission function of the board card 7 to be tested.
In the step a), the experimental environment may be a conventional board placement environment, for example, a room temperature of 27 ℃ and a humidity of 50% are set. In step f), according to the comparison result, when the first test digital signal and the second test digital signal are consistent, the transmission function of the basic signal of the board card 7 to be tested is proved to be normal.
Illustratively, in some embodiments, the test verification experiment item for dynamic power consumption of the board under test 7 is as follows:
1. verification purpose: verifying whether the dynamic power consumption of the board card 7 to be tested meets the requirement under the specified power supply voltage;
2. verification conditions: vcc=3.3v;
3. the verification method comprises the following steps:
a) The board 7 to be tested is placed in a prescribed environment.
b) And the board card 7 to be tested is respectively connected with a direct-current power supply, an oscilloscope and a test board card.
c) And (5) switching on a power supply.
d) The board 7 to be tested is controlled by the test board control to interconnect a driver 72 (driver) and a receiver 71 (receiver) of the board 7 to be tested.
e) The supply current of the device in the operating state is measured.
f) The dynamic power consumption of the device is recorded.
Illustratively, in some embodiments, the test verification experiment for the supply voltage bias of the board 7 under test is as follows:
1. verification purpose: verifying whether the functional performance of the board card 7 to be tested meets the requirement under the condition that the power supply voltage deviates by +/-10%;
2. verification conditions: vcc=3.3v±10%;
3. the verification method comprises the following steps:
a) The board 7 to be tested is placed in a prescribed environment.
b) And the board card 7 to be tested is respectively connected with a direct-current power supply, an oscilloscope and a test board card.
c) The power is turned on, and the board 7 to be tested is controlled by the test board control to interconnect the driver 72 (driver) and the receiver 71 (receiver) of the board 7 to be tested.
d) The server 1 outputs a test instruction to the test board, the main control chip of the test board sends a second test digital signal to the receiver 71 of the board 7 to be tested, and the oscilloscope is adjusted to capture an analog voltage signal output by the driver 72 of the board 7 to be tested, and the first test digital signal returned by the communication module 2 in the server 1 is obtained.
e) And comparing the first test digital signal with the second test digital signal, and detecting the correctness of the signal transmission function of the board card 7 to be tested.
In some embodiments, prior to step 100, a related step of setting the initial environmental conditions of the board card 7 under test is also included. Specifically, the method comprises the following steps:
step 101, setting at least two different test temperature environments;
and 102, placing the board card 7 to be tested in each temperature environment for testing.
The steps can facilitate verification of the electrical environment adaptability and the working stability of the board card 7 to be tested, and the testing range of the board card 7 to be tested is expanded.
Illustratively, in some embodiments, the test verification experiment items for the operational stability of the board card 7 under test are as follows:
1. verification purpose: testing the electrical environmental adaptability of the device;
2. verification conditions: setting different three-temperature test environments, wherein the test environments respectively correspond to-40 ℃,25 ℃ and 65 ℃;
3. the verification method comprises the following steps:
a) The board 7 to be tested is placed in a prescribed test environment.
b) And the board card 7 to be tested is connected with a direct-current power supply, an oscilloscope and a test board card.
c) The power is turned on, a test instruction is output to the test board through the server 1, and a main control signal of the test board sends a second test digital signal to the receiver 71 of the board 7 to be tested.
d) And applying prescribed constraint, grabbing an analog voltage signal output by a driver 72 of the board 7 to be tested by the adjusting oscilloscope, acquiring a first test digital signal returned by the communication module 2 in the server 1, comparing the first test digital signal with a second test digital signal, and judging the working state of the board 7 to be tested according to a comparison result.
e) Placing the board card 7 to be tested in different test environments, and cycling the steps a) to d) until 48h is over.
In the verification test, the application of the prescribed constraint in the step d) refers to respectively inputting different first test digital signals so as to obtain more accurate experimental results through multiple comparison.
In some embodiments, in step 100, the setting the initial environmental condition of the board card 7 to be tested further includes:
setting a test temperature interval, and enabling the temperature alternation of a test temperature environment to be in the test temperature interval;
the board card 7 to be tested is placed in a test temperature environment for testing.
The steps can be convenient for verifying the thermal environment adaptability of the board card 7 to be tested, and the testing range of the board card 7 to be tested is expanded.
Furthermore, in some embodiments, the board testing method further comprises:
step 600, the appearance, function and working performance of the board card 7 to be tested are detected before the test starts.
Step 700, after the test is finished, the appearance, function and working performance of the board card 7 to be tested are detected.
Step 800, comparing the detection results of the board 7 to be tested before and after the test, and obtaining the test result.
Here, the above-mentioned test method steps may be combined with the above-mentioned test method steps to perform a test experiment, so as to obtain a more accurate and comprehensive experimental result.
Illustratively, in some embodiments, test verification experiments for the alternating environmental job stability of the board card 7 under test are as follows:
1. verification purpose: and verifying the adaptability of the board card 7 to be tested under temperature alternation, and simultaneously inspecting the functional change condition of the product of the board card 7 to be tested.
2. Verification conditions: setting the temperature of the test environment to be-40-65 ℃, and keeping the high and low temperature for 30min at a temperature rate of 15 ℃/min; the test was cycled 3 times.
3. The verification method comprises the following steps:
a) The initial detection is carried out, and the appearance, the function and the performance of the board card 7 to be detected are detected and recorded so as to determine that the sample is normal, and the sample is used for comparing with the intermediate detection result and the final detection result.
b) Setting up a test bed, placing a sample in a test box with a test environment, and connecting the board card 7 to be tested with a direct-current power supply, an oscilloscope, a universal meter and a test board card.
c) The temperature of the test chamber was raised to the high test temperature.
d) After the temperature of the test sample is stable for 1h, the power supply and the signal source of the test board card are connected.
e) Outputting a test instruction to the test board through the server 1, sending a second test digital signal to the receiver 71 of the board 7 to be tested by the main control signal of the test board, capturing an analog voltage signal output by the driver 72 of the board 7 to be tested by the adjusting oscilloscope, and obtaining a first test digital signal returned by the communication module 2 in the server 1; comparing the first test digital signal with the second test digital signal; this process was continued for 30min with the power turned off.
f) The temperature of the test chamber is reduced to the low-temperature environment test temperature at a speed of not more than 3 ℃/min, and the test is continued.
g) And after the temperature of the test sample is stable, switching on a power supply.
h) Repeating step e);
i) After the test is completed for 3 cycles, performing functional performance test and recording, and continuously recording a temperature cycle test identification bit;
j) After the test is finished, the board card 7 to be tested is stopped, the temperature of the test environment in the test box is adjusted to the standard atmospheric condition environment, and the condition is maintained until the temperature of the test piece is stable.
k) After the test is finished, the board 7 to be tested is subjected to comprehensive visual inspection and working performance detection, and the result is recorded and compared with the data before the test.
Illustratively, in some embodiments, the test verification experiment for the random vibration environment suitability of the board card 7 under test is as follows:
1. verification purpose: and verifying the adaptability of the board card 7 to be tested in a random vibration environment, and simultaneously examining the functional change condition of the product of the board card 7 to be tested.
2. The verification method comprises the following steps:
a) The initial detection is carried out, and the appearance, the function and the performance of the board card 7 to be detected are detected and recorded so as to determine that the sample is normal, and the sample is used for comparing with the intermediate detection and the final detection result.
b) The board card 7 to be measured is fixed on a test fixture or a table top of a vibrating table.
c) And (3) pre-vibrating, wherein the pre-vibrating condition is 1/4-1/3 of the formal test condition.
d) In the test process, the working state of the device is recorded in the whole process.
e) And after the test is finished, carrying out comprehensive visual inspection and working performance detection on the test piece, recording the result and carrying out comparison analysis on the result and the data before the test.
In the experimental process, when the board card 7 to be tested is fixed on the test fixture, the test fixture should have enough rigidity and have flatter frequency response characteristics in a test frequency band; in addition, the connection of the instrument and the test fixture or the table top of the vibration table should simulate the actual installation state of the instrument and the device on the equipment, for example, the vibration test should be controlled by multi-point average as much as possible, the control point should be selected on the connection surface of the instrument and the table top of the vibration table or the test fixture, and is close to the vicinity of the installation foot of the instrument and the device, and the arrangement can be more close to the actual use scene of the to-be-tested card, which is beneficial to obtaining accurate and effective test result data.
In the step c), the pre-vibration operation can be added with a 1/2-2/3 magnitude of bottoming test process according to the resonance response conditions of each stage of the instrument equipment so as to control vibration adjusting factors.
Illustratively, in some embodiments, the test verification experiment for the mechanical impact environment suitability of the board card 7 under test is as follows:
1. verification purpose: and verifying the adaptability of the board card 7 to be tested in the mechanical impact environment, and simultaneously inspecting the functional change condition of the product of the board card 7 to be tested.
2. The verification method comprises the following steps:
a) The initial detection is carried out, and the appearance, the function and the performance of the board card 7 to be detected are detected and recorded to determine that the sample of the board card 7 to be detected is normal, and the sample is used for comparing with the intermediate detection and the final detection result.
b) The board card 7 to be tested is fixed on the test fixture or the table top of the impact table.
c) In the test process, the working state of the device is recorded in the whole process.
d) And after the test is finished, carrying out comprehensive visual inspection and working performance detection on the test piece, recording the result and carrying out comparison analysis on the result and the data before the test.
In the experimental process, when the board card 7 to be tested is fixed on the test fixture, the test fixture should have enough rigidity and have flatter frequency response characteristics in a test frequency band; in addition, the connection of the instrument and the test fixture or the table top of the impact table should simulate the actual installation state of the instrument and the device on the equipment, for example, the vibration test should be controlled by multi-point average as much as possible, the control point should be selected on the connection surface of the instrument and the table top of the impact table or the test fixture, and is close to the vicinity of the installation foot of the instrument and the device, and the arrangement can be more close to the actual use scene of the to-be-tested card, which is beneficial to obtaining accurate and effective test result data.
It should be noted that the method of the embodiment of the present application may be performed by a single device, for example, a computer or the server 1. The method of the embodiment can also be applied to a distributed scene, and is completed by mutually matching a plurality of devices. In the case of such a distributed scenario, one of the devices may perform only one or more steps of the methods of embodiments of the present application, and the devices may interact with each other to complete the methods.
It should be noted that some embodiments of the present application are described above. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
Based on the same inventive concept, the application also provides an electronic device corresponding to the method of any embodiment, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor realizes the board card testing method of any embodiment when executing the program.
Fig. 4 shows a more specific hardware architecture of an electronic device according to this embodiment, where the device may include: a processor 1010, a memory 1020, an input/output interface 1030, a communication interface 1040, and a bus 1050. Wherein processor 1010, memory 1020, input/output interface 1030, and communication interface 1040 implement communication connections therebetween within the device via a bus 1050.
The processor 1010 may be implemented by a general-purpose CPU (Central Processing Unit ), microprocessor, application specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, etc. for executing relevant programs to implement the technical solutions provided in the embodiments of the present disclosure.
The Memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory ), static storage device, dynamic storage device, or the like. Memory 1020 may store an operating system and other application programs, and when the embodiments of the present specification are implemented in software or firmware, the associated program code is stored in memory 1020 and executed by processor 1010.
The input/output interface 1030 is used to connect with an input/output module for inputting and outputting information. The input/output modules may be configured as components in the device (not shown in fig. 4) or may be external to the device to provide corresponding functionality. Wherein the input devices may include a keyboard, mouse, touch screen, microphone, various types of sensors, etc., and the output devices may include a display, speaker, vibrator, indicator lights, etc.
Communication interface 1040 is used to connect communication modules (not shown in fig. 4) to enable communication interactions of the present device with other devices. The communication module may implement communication through a wired manner (such as USB, network cable, etc.), or may implement communication through a wireless manner (such as mobile network, WIFI, bluetooth, etc.).
Bus 1050 includes a path for transferring information between components of the device (e.g., processor 1010, memory 1020, input/output interface 1030, and communication interface 1040).
It should be noted that although the above-described device only shows processor 1010, memory 1020, input/output interface 1030, communication interface 1040, and bus 1050, in an implementation, the device may include other components necessary to achieve proper operation. Furthermore, it will be understood by those skilled in the art that the above-described apparatus may include only the components necessary to implement the embodiments of the present description, and not all the components shown in the drawings.
The electronic device of the foregoing embodiment is configured to implement the corresponding board card testing method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiment, which is not described herein.
Based on the same inventive concept, corresponding to any of the above-described embodiment methods, the present application further provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to perform the board card test method as described in any of the above-described embodiments.
The computer readable media of the present embodiments, including both permanent and non-permanent, removable and non-removable media, may be used to implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device.
The storage medium of the foregoing embodiment stores computer instructions for causing the computer to execute the board card testing method described in any one of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which are not described herein.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the application (including the claims) is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the present application, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of brevity.
Additionally, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures, in order to simplify the illustration and discussion, and so as not to obscure the embodiments of the present application. Furthermore, the devices may be shown in block diagram form in order to avoid obscuring the embodiments of the present application, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform on which the embodiments of the present application are to be implemented (i.e., such specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the application, it should be apparent to one skilled in the art that embodiments of the application can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.
While the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.
The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Accordingly, any omissions, modifications, equivalents, improvements and/or the like which are within the spirit and principles of the embodiments are intended to be included within the scope of the present application.

Claims (10)

1. A test board card, comprising:
a main control chip;
the signal acquisition module is connected with the main control chip and is used for being connected with a board to be tested so as to acquire an analog voltage signal output by the board to be tested and convert the analog voltage signal into a first test digital signal to be transmitted to the main control chip;
the power supply module is suitable for supplying power to the main control chip;
the communication module is respectively connected with the main control chip and the server, and can receive a first test digital signal of the main control chip and transmit the first test digital signal back to the server;
and/or the communication module can receive the test instruction of the server and transmit the test instruction to the main control chip so that the main control chip inputs a second test digital signal to the board to be tested.
2. The test board of claim 1, wherein the main control chip reads and loads a pre-configuration program through a configuration chip, and configuration information of the pre-configuration program is stored in an external memory.
3. The test board of claim 2, wherein said master chip employs a combined test action group daisy chain structure download configuration procedure.
4. A test board tooling, comprising the test board of any one of claims 1-3, further comprising:
the board card to be tested comprises a driver, a receiver and a conversion module, wherein the driver is connected with the signal acquisition module of the test board card, the receiver is connected with the main control chip of the test board card, and the driver is electrically connected with the receiver through the conversion module;
the receiver receives a second test digital signal of the main control chip, then transmits the second test digital signal to the conversion module, and the conversion module converts the second test digital signal into an analog voltage signal and then outputs the analog voltage signal to the signal acquisition module through the driver.
5. The test board tool of claim 4, further comprising:
the external power supply is connected with the board card to be tested through a peripheral circuit;
and the oscilloscope is electrically connected with the board card to be tested so as to display the analog voltage signal output by the driver.
6. The board testing method is suitable for testing the board tool according to claim 4 or 5, and comprises the following steps:
the method comprises the steps that a communication module receives a test instruction sent by a server and transmits the test instruction to a main control chip, the main control chip sends a second test digital signal to a receiver of a board to be tested after receiving the test instruction, the receiver receives the second test digital signal of the main control chip and then transmits the second test digital signal to a conversion module, and the conversion module converts the second test digital signal into an analog voltage signal and then outputs the analog voltage signal through a driver;
the method comprises the steps that a signal acquisition module acquires an analog voltage signal output by a driver of a board card to be tested, converts the analog voltage signal into a first test digital signal and transmits the first test digital signal to a main control chip;
receiving a first test digital signal of the main control chip through the communication module, and transmitting the first test digital signal back to the server;
comparing the first test digital signal with the second test digital signal, and obtaining a test result according to the comparison result.
7. The board testing method according to claim 6, wherein the receiving, by the communication module, the test instruction sent by the server includes:
initial test environmental conditions are set.
8. The board testing method of claim 7, wherein the setting initial testing environmental conditions comprises:
setting at least two different test temperature environments;
and placing the board card to be tested in each temperature environment to test sequentially.
9. The board testing method of claim 7, wherein the setting initial testing environmental conditions comprises:
determining a test temperature interval, and enabling the temperature law of a test temperature environment to be alternately located in the test temperature interval;
and placing the board card to be tested in a test temperature environment for testing.
10. The board card testing method of claim 6, further comprising:
detecting the appearance, the function and the working performance of the board to be detected before the test starts, and obtaining a first detection result;
detecting the appearance, the function and the working performance of the board to be detected after the test is finished, and obtaining a second detection result;
and comparing the first detection result with the second detection result, and obtaining a test result according to the comparison result.
CN202311294994.8A 2023-10-08 2023-10-08 Test board card, test board card tool and board card test method Pending CN117434421A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311294994.8A CN117434421A (en) 2023-10-08 2023-10-08 Test board card, test board card tool and board card test method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311294994.8A CN117434421A (en) 2023-10-08 2023-10-08 Test board card, test board card tool and board card test method

Publications (1)

Publication Number Publication Date
CN117434421A true CN117434421A (en) 2024-01-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN117434421A (en)

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