CN106017834A - Non-contact modality testing method, device, and system - Google Patents
Non-contact modality testing method, device, and system Download PDFInfo
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- CN106017834A CN106017834A CN201610363441.7A CN201610363441A CN106017834A CN 106017834 A CN106017834 A CN 106017834A CN 201610363441 A CN201610363441 A CN 201610363441A CN 106017834 A CN106017834 A CN 106017834A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
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Abstract
The invention relates to a non-contact modality testing method, device, and system. The method includes that the measuring points of a testpiece are arranged based on the image of the testpiece acquired by a laser head; a plurality of measuring points are selected from the measuring points to measure the vibration response signals of the plurality of measuring points when a piezoelectric wafer vibrates at different positions, wherein the piezoelectric wafer vibrates while receiving the excitation signal output by a signal generator; the fixing position of the piezoelectric wafer is determined based on the vibration response signals of the plurality of measuring points; the excitation signal output by the signal generator and the vibration response signals of the plurality of measuring points are acquired when the piezoelectric wafer is arranged at the fixing position; the frequency response function of the measuring points with respect to the excitation signal is obtained based on the acquired excitation signal and the vibration response signals of the measuring points; and the parameters of the testpiece are obtained based on the frequency response function. The non-contact modality testing method, device, and system improves the excitation energy utilization rate and the signal to noise ratio of the vibration response signals; and meanwhile, the noise of the testing site is low.
Description
Technical field
The present invention relates to mould measurement technical field, particularly relate to a kind of Non-contact modal test method,
Non-contact modal test device and Non-contact modal test system.
Background technology
Model analysis is to study various dynamic load effect lower linear structural system vibratory response characteristics and structure to move
The basis of state optimization design.Modal test is the process being obtained linear structural system modal parameter by test,
It is checking or the main tool of revised theory modal analysis result.
Traditional modal test generally uses power hammer or vibrator to apply excitation, structurally pastes sensor,
By measuring power hammer or the pumping signal of vibrator and the vibratory response of structure, it is thus achieved that structural frequency response function, enter
One step identification modal parameters.Traditional method is applicable to large scale structure, and as big in size, quality is big, rigidity
Big structure.But for small-sized structure, such as circuit board, electronic devices and components, key components and parts etc., tradition
Additional mass and additional stiffness that method can be brought because of the sensor of driving source and stickup affect and occur bigger
Error.
At present small-sized structure modal test is generally used contactless acoustically-driven and vibration measurement with laser systematic survey
Vibratory response obtains modal parameter, this method eliminatess additional mass and additional stiffness impact, especially suitable
In thin plate class formation.But there is excitation energy loss greatly in contactless acoustically-driven, excitation energy utilization rate is low,
Test site noise is big, to non-thin plate class formation vibratory responses such as irregular electronic devices and components, key components and partss
The shortcomings such as signal to noise ratio is low.
Summary of the invention
Based on this, it is necessary to for the problems referred to above, it is provided that a kind of Non-contact modal test method, device and
System, it is possible to economic, obtain the mode of various small-sized structure (including thin plate) efficiently and accurately
Parameter, by using piezoelectric chip contact to encourage, solves the excitation energy utilization rate that sound stimulation exists
Low, vibratory response poor signal to noise, the problem that test site noise is big.
In order to achieve the above object, the technical scheme that the present invention takes is as follows:
A kind of Non-contact modal test method, including step:
According to the image of the testpieces that laser head obtains, arrange each measuring point of testpieces；
From each measuring point, choose several measuring points, measure piezoelectric chip when each diverse location occurs vibration
The vibration response signal of several measuring points, wherein piezoelectric chip is receiving the excitation letter of signal generator output
Number time vibrate；
Vibration response signal according to several measuring points determines the fixed position of piezoelectric chip；
When piezoelectric chip is positioned at described fixed position, obtain the pumping signal of signal generator output and each
The vibration response signal of individual measuring point；
According to obtain pumping signal and the vibration response signal of each measuring point, it is thus achieved that each measuring point relative to
The frequency response function of pumping signal；
The modal parameter of testpieces is obtained according to described frequency response function.
A kind of Non-contact modal test device, including:
Point layout module, is used for the image of the testpieces obtained according to laser head, arranges testpieces each
Measuring point；
Vibration response signal measurement module, for choosing several measuring points from each measuring point, measures piezo crystals
Sheet is the vibration response signal of several measuring points when each diverse location occurs vibration, and wherein piezoelectric chip is connecing
Vibrate when receiving the pumping signal of signal generator output；
Fixed position determines module, for determining piezoelectric chip according to the vibration response signal of several measuring points
Fixed position；
Pumping signal and vibration response signal acquisition module, be used for when piezoelectric chip is positioned at described fixed position,
Obtain pumping signal and the vibration response signal of each measuring point of signal generator output；
Frequency response function obtains module, for the vibratory response letter according to the pumping signal obtained and each measuring point
Number, it is thus achieved that each measuring point is relative to the frequency response function of pumping signal；
Modal parameter obtains module, for obtaining the modal parameter of testpieces according to described frequency response function.
A kind of Non-contact modal test system, including piezoelectric chip and vibration measurement with laser system, described Laser Measuring
Vibrating system includes laser head, signal generator and described Non-contact modal test device；Described piezoelectricity
Wafer is connected with described signal generator outfan, and described Non-contact modal test device swashs with described respectively
Bare headed and described signal generator outfan is connected.
Non-contact modal test methods, devices and systems of the present invention, when being compared to each other with prior art, tool
Standby advantages below:
(1) present invention utilizes piezoelectric chip directly to carry out contact excitation, improve excitation energy utilization rate and
The signal to noise ratio of vibration response signal, test site noise is the least simultaneously；
(2) feature that piezoelectric chip has light weight, excitation amplitude is little that the present invention uses, may be arranged at examination
Testing the enterprising row energization of part accessory structure, additional mass and additional stiffness impact on small-sized structure can be ignored,
Certainty of measurement is high；
(3) present invention is applicable to various small-sized structure (including thin plate)；
(4) present invention directly utilizes the pumping signal calculating frequency response function of signal generator output, it is not necessary to extra
Measure input signal, convenient and simple.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of Non-contact modal test embodiment of the method for the present invention；
Fig. 2 is the schematic diagram of each measuring point arranged on testpieces of the present invention；
Fig. 3 is the structural representation of Non-contact modal test device embodiment of the present invention；
Fig. 4 is the structural representation that fixed position of the present invention determines module embodiments；
Fig. 5 is the structural representation of Non-contact modal test system embodiment of the present invention；
Fig. 6 is the schematic diagram of piezoelectric chip placement location specific embodiment of the present invention；
Fig. 7 is the frequency response function of level Hermetic Package structure of the present invention；
Fig. 8 (a)～Fig. 8 (h) is the vibration shape of level Hermetic Package structure of the present invention.
Detailed description of the invention
By further illustrating the technological means and the effect of acquirement that the present invention taked, below in conjunction with the accompanying drawings and
Preferred embodiment, to technical scheme, carries out clear and complete description.
As it is shown in figure 1, a kind of Non-contact modal test method, including step:
S110, the image of the testpieces obtained according to laser head, arrange each measuring point of testpieces；
S120, from each measuring point, choose several measuring points, measure piezoelectric chip and occur at each diverse location
The vibration response signal of several measuring points during vibration, wherein piezoelectric chip is receiving signal generator output
Vibrate during pumping signal；
S130, vibration response signal according to several measuring points determine the fixed position of piezoelectric chip；
S140, when piezoelectric chip is positioned at described fixed position, obtain signal generator output pumping signal
And the vibration response signal of each measuring point；
S150, according to obtain pumping signal and the vibration response signal of each measuring point, it is thus achieved that each measuring point
Frequency response function relative to pumping signal；
S160, according to described frequency response function obtain testpieces modal parameter.
In step s 110, testpieces is include various small-sized structures (including including thin plate), such as power supply
The level Hermetic Package structure etc. of module.Laser head is laser scanning head, arranges along direction of excitation, is used for measuring examination
Test the vibration response signal of part.There is minisize pick-up head on laser head, the image of testpieces can be shot.
Got the image of testpieces by photographic head after, testpieces image is arranged each measuring point.Such as,
As in figure 2 it is shown, be the schematic diagram of each measuring point (black round dot) arranged in level Hermetic Package structural images,
Wherein level Hermetic Package structure is cuboid metal shell, and point layout is at metal shell surface.
In the step s 120, the present invention uses the piezoelectric chip of small volume.The terminals of piezoelectric chip and letter
The output port of number generator connects, and the device of connection can use test cable.Signal generator directly will
Pumping signal is input to piezoelectric chip, makes piezoelectric chip produce vibration, so that testpieces produces vibration.
Before test, it is thus necessary to determine that pumping signal, sampling parameter and the excitation frequency band band of signal generator output
Wide.Pumping signal includes random white noise or transient state sine sweep signal etc..Sampling parameter and excitation frequency band
Bandwidth can need to arrange according to analyzing frequency.
Signal generator output drive signal makes piezoelectric chip produce vibration, chooses several from each measuring point
Measuring point, adjusts the position of piezoelectric chip, the vibration response signal of synchro measure testpieces.
In step s 130, the fixed position of piezoelectric chip is determined according to the vibration response signal of several measuring points.
In one embodiment, the fixed position of piezoelectric chip is determined according to the vibration response signal of several measuring points
Step may include that
S1301, from the vibration response signal of several measuring points, choose line smoothing and the frequency information that comprises
Many vibration response signals；
S1302, the position of piezoelectric chip corresponding for the vibration response signal of acquisition is defined as fixed position.
The fixed position of piezoelectric chip includes that piezoelectric chip is positioned on testpieces or the accessory structure of testpieces
On, wherein the accessory structure of testpieces includes the junction etc. of testpieces and fixture.In general, to rigidity
Big testpieces, piezoelectric chip can be affixed directly on testpieces, for ultra thin plate class testpieces, piezoelectricity
Wafer can be pasted onto on testpieces accessory structure.
Owing to piezoelectric chip needs to be fixed on testpieces or on the accessory structure of testpieces, so piezo crystals
The physical dimension being sized generally below testpieces of sheet.When fixing piezoelectric chip, piezoelectric chip can be led to
Crossing cohesive material to be pasted onto on the accessory structure of testpieces or testpieces, cohesive material can be glue etc..
In step S140, piezoelectric chip is fixed on the fixed position determined, measures now signal and occur
The vibration response signal of each measuring point during device output drive signal.
In step S150, the pumping signal exported by signal generator, as reference signal, uses existing skill
In art, existing method calculates each measuring point frequency response function relative to reference signal.
In step S160, use existing modal identification method identification frequency response function, it is thus achieved that the frequency of testpieces
The modal parameter such as rate and the vibration shape.
Based on same inventive concept, the present invention also provides for a kind of Non-contact modal test device, below in conjunction with
The detailed description of the invention of apparatus of the present invention is described in detail by accompanying drawing.
As it is shown on figure 3, a kind of Non-contact modal test device, including:
Point layout module 110, the image of the testpieces for obtaining according to laser head, arrange each of testpieces
Individual measuring point；
Vibration response signal measurement module 120, for choosing several measuring points from each measuring point, measures piezoelectricity
Wafer is the vibration response signal of several measuring points when each diverse location occurs vibration, and wherein piezoelectric chip exists
Vibrate when receiving the pumping signal of signal generator output；
Fixed position determines module 130, for determining piezoelectric chip according to the vibration response signal of several measuring points
Fixed position；
Pumping signal and vibration response signal acquisition module 140, for being positioned at described fixed position at piezoelectric chip
Time, obtain pumping signal and the vibration response signal of each measuring point of signal generator output；
Frequency response function obtains module 150, for according to the pumping signal obtained and the vibratory response of each measuring point
Signal, it is thus achieved that each measuring point is relative to the frequency response function of pumping signal；
Modal parameter obtains module 160, for obtaining the modal parameter of testpieces according to described frequency response function.
In one embodiment, as shown in Figure 4, described fixed position determines that module 130 may include that
Vibration response signal chooses unit 1301, for choosing song from the vibration response signal of several measuring points
The vibration response signal that linear light frequency information that is sliding and that comprise is most；
Fixed position determines unit 1302, the position of piezoelectric chip corresponding to vibration response signal for obtaining
Put and be defined as fixed position.
The fixed position of piezoelectric chip includes that piezoelectric chip is positioned on testpieces or the accessory structure of testpieces
On, wherein the accessory structure of testpieces includes the junction etc. of testpieces and fixture.In general, to rigidity
Big testpieces, piezoelectric chip can be affixed directly on testpieces, for ultra thin plate class testpieces, piezoelectricity
Wafer can be pasted onto on testpieces accessory structure.
Owing to piezoelectric chip needs to be fixed on testpieces or on the accessory structure of testpieces, so piezo crystals
The physical dimension being sized generally below testpieces of sheet.When fixing piezoelectric chip, piezoelectric chip can be led to
Crossing cohesive material to be pasted onto on the accessory structure of testpieces or testpieces, such as cohesive material can be glue
Deng.
Other technical characteristic of apparatus of the present invention is identical with the inventive method, does not repeats them here.
The present invention also provides for a kind of Non-contact modal test system, enters present system below in conjunction with the accompanying drawings
Row is simple to be introduced.
As it is shown in figure 5, a kind of Non-contact modal test system, including piezoelectric chip and vibration measurement with laser system,
Described vibration measurement with laser system includes laser head, signal generator and described Non-contact modal test device；
Described piezoelectric chip is connected with described signal generator outfan, and described Non-contact modal test device is respectively
It is connected with described laser head and described signal generator outfan.
Non-contact modal test device has signals collecting storage, frequency response function calculates, the merit of modal idenlification
Can, concrete technical characteristic is identical with the technical characteristic of the invention described above Non-contact modal test device, at this
It will not go into details.Signal generator can be by test cable and piezoelectric chip, Non-contact modal test device
Connecting, laser head can be connected by test cable with Non-contact modal test device.
The implementation process of the present invention is described below as a example by the level Hermetic Package structure modal test of certain power module.
The piezoelectric excitation mould measurement system of level Hermetic Package structure, including piezoelectric chip 1, Polytec
PSV-500-3D-M vibration measurement with laser system 1 is overlapped.This vibration measurement with laser system includes laser head 1, bilateral number of channels
According to gathering and analyzing module (i.e. Non-contact modal test device), single channel signal generator.Data acquisition
It is mounted with PSV data collection and analysis software and modal idenlification software with analyzing in module.Select diameter dimension
35mm (millimeter), the thickness piezoelectric chip less than 1mm.Piezoelectric chip passes through test cable and vibration measurement with laser
The signal generator passage of system connects, the signal generator passage of vibration measurement with laser system simultaneously with bilateral number of channels
Being connected according to one of them passage gathered with analyze module, another passage is by test cable with laser head even
Connect.Laser head is placed on the dead ahead of level Hermetic Package structure.
The piezoelectric excitation mode testing method of level Hermetic Package structure, comprises the following steps:
(1) PSV data collection and analysis software is started, the examination shot by the minisize pick-up head on laser head
Testing the image of part, arrange measuring point, totally 90 measuring points at image-region, (Fig. 6 comprises two as shown in Figure 6
Level Hermetic Package structure, each level Hermetic Package structure has 45 measuring points).
(2) determine analysis frequency 0～2000Hz, signal generator be set and be output as transient state sine sweep signal,
Swept frequency range is 0～2000Hz.
(3) signal generator output signal makes piezoelectric chip vibrate, signal trigger PSV data acquisition with
Analyze the vibration response signal of software synchronization experiment with measuring part.Select several measuring points, adjust piezoelectric chip position
Put, obtain the vibration response signal curve of several measuring points, find out curve light in the vibration response signal recorded
Slide, comprise the vibration response signal that frequency information is many, using excitation point corresponding for this vibration response signal as pressure
The energized position that electricity is wafer optimized.
Owing to level Hermetic Package structure is the thinnest, experimental test finds that 0.7g sensor can cause fundamental frequency to reduce
12%, piezoelectric chip can not be affixed directly in level Hermetic Package structure, and piezoelectric chip is relative to level Hermetic Package
Body structure surface is bigger than normal, finally determines the connection that piezoelectric chip is arranged in level Hermetic Package structure and fixture
Place, as shown in Figure 6.
(4) piezoelectric chip is pasted onto the junction of level Hermetic Package structure and fixture, and measuring transmitter is defeated
The vibration response signal of all measuring points when going out transient state sine sweep signal.
(5) PSV data collection and analysis software is using the channel signal of signal generator as reference signal, counts
Calculating all measuring points frequency response function relative to reference signal, the frequency response parameter obtained is as shown in Figure 7.
(6) frequency response function data are imported modal idenlification software, use PolyMAX modal identification method meter
Calculate modal parameter, there are 8 rank natural frequency and the vibration shapes, as shown in Fig. 8 (a)～Fig. 8 (h).
When the present invention and prior art are compared to each other, possess advantages below:
(1) present invention utilizes piezoelectric chip directly to carry out contact excitation, improve excitation energy utilization rate and
The signal to noise ratio of vibration response signal, test site noise is the least simultaneously；
(2) feature that piezoelectric chip has light weight, excitation amplitude is little that the present invention uses, may be arranged at examination
Testing the enterprising row energization of part accessory structure, additional mass and additional stiffness impact on small-sized structure can be ignored,
Certainty of measurement is high；
(3) present invention is applicable to various small-sized structure (including thin plate)；
(4) present invention directly utilizes the pumping signal calculating frequency response function of signal generator output, it is not necessary to extra
Measure input signal, convenient and simple.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (10)
1. a Non-contact modal test method, it is characterised in that include step:
According to the image of the testpieces that laser head obtains, arrange each measuring point of testpieces；
From each measuring point, choose several measuring points, measure piezoelectric chip when each diverse location occurs vibration
The vibration response signal of several measuring points, wherein piezoelectric chip is receiving the excitation letter of signal generator output
Number time vibrate；
Vibration response signal according to several measuring points determines the fixed position of piezoelectric chip；
When piezoelectric chip is positioned at described fixed position, obtain the pumping signal of signal generator output and each
The vibration response signal of individual measuring point；
According to obtain pumping signal and the vibration response signal of each measuring point, it is thus achieved that each measuring point relative to
The frequency response function of pumping signal；
The modal parameter of testpieces is obtained according to described frequency response function.
Non-contact modal test method the most according to claim 1, it is characterised in that according to some
The vibration response signal of individual measuring point determines that the step of the fixed position of piezoelectric chip includes:
Line smoothing and most the shaking of frequency information comprised is chosen from the vibration response signal of several measuring points
Dynamic response signal；
The position of piezoelectric chip corresponding for the vibration response signal of acquisition is defined as fixed position.
Non-contact modal test method the most according to claim 1 and 2, it is characterised in that piezoelectricity
The fixed position of wafer includes that piezoelectric chip is positioned on testpieces or on the accessory structure of testpieces.
Non-contact modal test method the most according to claim 3, it is characterised in that testpieces
Accessory structure includes the junction of testpieces and fixture.
Non-contact modal test method the most according to claim 1 and 2, it is characterised in that piezoelectricity
The physical dimension being smaller in size than testpieces of wafer.
6. a Non-contact modal test device, it is characterised in that including:
Point layout module, is used for the image of the testpieces obtained according to laser head, arranges testpieces each
Measuring point；
Vibration response signal measurement module, for choosing several measuring points from each measuring point, measures piezo crystals
Sheet is the vibration response signal of several measuring points when each diverse location occurs vibration, and wherein piezoelectric chip is connecing
Vibrate when receiving the pumping signal of signal generator output；
Fixed position determines module, for determining piezoelectric chip according to the vibration response signal of several measuring points
Fixed position；
Pumping signal and vibration response signal acquisition module, be used for when piezoelectric chip is positioned at described fixed position,
Obtain pumping signal and the vibration response signal of each measuring point of signal generator output；
Frequency response function obtains module, for the vibratory response letter according to the pumping signal obtained and each measuring point
Number, it is thus achieved that each measuring point is relative to the frequency response function of pumping signal；
Modal parameter obtains module, for obtaining the modal parameter of testpieces according to described frequency response function.
Non-contact modal test device the most according to claim 6, it is characterised in that described fixing
Position determination module includes:
Vibration response signal chooses unit, for choosing curve light from the vibration response signal of several measuring points
The vibration response signal that frequency information that is sliding and that comprise is most；
Fixed position determines unit, and the position of piezoelectric chip corresponding to vibration response signal for obtaining is true
It is set to fixed position.
8. according to the Non-contact modal test device described in claim 6 or 7, it is characterised in that piezoelectricity
The fixed position of wafer includes that piezoelectric chip is positioned on testpieces or on the accessory structure of testpieces；Testpieces
Accessory structure include the junction of testpieces and fixture.
9. according to the Non-contact modal test device described in claim 6 or 7, it is characterised in that piezoelectricity
The physical dimension being smaller in size than testpieces of wafer.
10. a Non-contact modal test system, it is characterised in that include piezoelectric chip and vibration measurement with laser
System, described vibration measurement with laser system includes laser head, signal generator and as claim 6 to 9 is any
One described Non-contact modal test device；Described piezoelectric chip and described signal generator outfan phase
Even, described Non-contact modal test device respectively with described laser head and described signal generator outfan phase
Even.
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