CN117433644B - Temperature measuring equipment for integrated circuit production - Google Patents
Temperature measuring equipment for integrated circuit production Download PDFInfo
- Publication number
- CN117433644B CN117433644B CN202311754574.3A CN202311754574A CN117433644B CN 117433644 B CN117433644 B CN 117433644B CN 202311754574 A CN202311754574 A CN 202311754574A CN 117433644 B CN117433644 B CN 117433644B
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- fixedly connected
- top end
- base
- pump
- adjusting component
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 15
- 238000003384 imaging method Methods 0.000 claims abstract description 12
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 12
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Abstract
The invention provides temperature measurement equipment for integrated circuit production, which relates to the technical field of temperature anomaly detection during integrated circuit detection, wherein an imaging component is a thermal camera, a pump is fixedly connected to the front end face of a base, a linear array is arranged on the top end face of the pump, and four connecting pipes A are arranged on the top end face of the pump.
Description
Technical Field
The invention relates to the technical field of temperature anomaly detection during integrated circuit detection, in particular to temperature measurement equipment for integrated circuit production.
Background
The integrated circuit is a miniature electronic device or component, the size is generally smaller, a proper sample is generally selected from integrated circuits produced in the same batch in the production process, and various performances of the integrated circuit are detected later, and when the integrated circuit is used for performance detection, due to lack of effective automatic contact connection, the integrated circuit needs to be manually held by a universal meter and other instruments to be contacted with contacts corresponding to two ends of a circuit board respectively for detecting whether the temperature of the integrated circuit is abnormal or not, and the process is complicated during detection, so that the production of the integrated circuit is influenced.
In view of the above, the present invention provides a temperature measuring device for integrated circuit production, which is improved to achieve the purpose of having more practical value.
Disclosure of Invention
The invention provides temperature measuring equipment for integrated circuit production, which solves the problems that when the existing measuring equipment is used for detecting, the existing measuring equipment needs to manually hold a universal meter and other instruments to respectively contact with contacts corresponding to two ends of a circuit board and then detect whether the temperature of an integrated circuit is abnormal, so that the working procedure is complicated when the integrated circuit is detected, and the production of the integrated circuit is influenced.
The invention provides temperature measurement equipment for integrated circuit production, which particularly comprises a base, wherein an imaging assembly is arranged on the top end face of the base, the imaging assembly is a thermal camera, a pump machine is fixedly connected to the front end face of the base, and four connection pipes A are arranged on the top end face of the pump machine in a linear array.
Further, the magnetic disk is matched with the base, a connecting pipe B is fixedly connected to the outer peripheral surface of the magnetic disk, the connecting pipe B is connected with the connecting pipe A through a hose, and air is pumped through the pump.
Further, the pump is pumped by using a connecting pipe A arranged on the top end face of the pump, and a magnetic disk is arranged on the top end face of the base.
Further, a guide post is fixedly connected to the top end face of the magnetic disk, suction holes are formed in the top ends of the guide posts, the suction holes are used for sucking air, the guide posts are arranged in four places, and a circuit board is mounted above the guide posts.
Furthermore, the outside of circuit board is annular array and installs the connecting piece, and the inside left and right sides of base has all seted up longitudinal groove, and the internally mounted in this longitudinal groove has adjusting part A.
Further, a guide frame is fixedly connected to the top end face of the movable frame, a longitudinal groove is formed in the guide frame, and an adjusting component B is mounted in the longitudinal groove.
Further, a movable frame is mounted at the output end of the adjusting component A, the upper side and the lower side of the movable frame are fixedly connected with sliding blocks, and the movable frame is slidably connected in the base through the sliding blocks fixedly connected with the outer sides of the movable frame.
Further, install the mobile station on adjusting part B's the bottom output, both sides all are opposite direction fixedly connected with slider around the mobile station, the mobile station is in the guide frame through its outside fixedly connected's slider sliding connection, and the outside fixedly connected with controller of mobile station, one side fixedly connected with temperature measurement subassembly of installing the controller in the mobile station, and install adjusting part C still in the homonymy of installing temperature measurement subassembly, install the connecting plate on adjusting part C's the output, fixedly connected with loop configuration's contact component on the top end face of connecting plate, the wire is installed to contact component's bottom, and be electrically connected with the controller outside the mobile station of setting in adjusting part B bottom through the wire.
Compared with the prior art, the invention has the following beneficial effects:
1. when using, realize through being provided with connecting plate and contact assembly that the automation circuit intercommunication to the connecting piece of setting in the circuit board outside for it can be showing when using improvement to the measurement of circuit board efficiency, and when connecting, can also detect whether the connecting piece appears in the setting of current integrated circuit outside through contact assembly according to actual need, if when detecting current resistance value too high, can carry out the quick distinguishing mark to the position that the connecting piece that the circuit board outside was installed appears in the realization through utilizing contact assembly slightly to carry out the lifting, make it can reach the purpose of being convenient for follow-up use more when using.
2. Through being provided with imaging module and temperature measurement subassembly for the circuit board can detect the whole temperature of current circuit board through starting imaging module after the intercommunication power, and detect the temperature of circuit connection's position through temperature measurement subassembly, and then reach accurate purpose that detects, this design not only can detect the whole situation of current circuit board through imaging module, and also can carry out accurate detection operation to the part that needs to detect through utilizing the setting of single temperature measurement subassembly, can be very big improvement to the efficiency that detects the circuit board through split type detection operation.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings of the embodiments will be briefly described below.
In the drawings:
FIG. 1 shows a schematic view of a front side view in partial structural cut-away of a measuring device according to an embodiment of the present invention;
FIG. 2 shows a schematic view of a schematic top-down view in partial structural section of a measuring device according to an embodiment of the present invention;
FIG. 3 shows a schematic diagram of a front side view of a measuring device according to an embodiment of the invention;
FIG. 4 shows a schematic left-hand view of a measuring device according to an embodiment of the invention;
FIG. 5 shows a schematic diagram of the assembly structure of a movable frame and a sliding block of the measuring device according to the embodiment of the invention;
FIG. 6 shows a schematic view of the mounting structure of the base and imaging assembly of the measuring device according to an embodiment of the present invention;
FIG. 7 shows an enlarged schematic view of the structure of FIG. 2 at A of a measuring device according to an embodiment of the invention;
fig. 8 shows an enlarged schematic view of the structure of fig. 3 at B of the measuring device according to an embodiment of the present invention.
List of reference numerals
1. A base; 2. an imaging assembly; 3. a pump machine; 4. taking over the A; 5. a magnetic disk; 6. taking over the B; 7. a guide post; 8. a circuit board; 9. a connecting piece; 10. an adjusting assembly A; 11. a moving rack; 12. a slide block; 13. a guide frame; 14. an adjusting component B; 15. a mobile station; 16. a slider; 17. a controller; 18. a temperature measuring assembly; 19. an adjusting component C; 20. a connecting plate; 21. a contact assembly; 22. and (5) conducting wires.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples.
Embodiment one: as shown in fig. 1 to 8:
the invention provides a temperature measuring device for integrated circuit production, comprising: the imaging component 2 is arranged on the top end face of the base 1, the imaging component 2 is a thermal camera, the pump 3 is fixedly connected on the front end face of the base 1, the top end face of the pump 3 is provided with four connecting pipes A4 in a linear array, the bottom end output end of the adjusting component B14 is provided with the moving table 15, the front side and the rear side of the moving table 15 are respectively provided with a sliding piece 16 in opposite fixed connection, the moving table 15 is in sliding connection in the guide frame 13 through the sliding pieces 16 fixedly connected with the outer sides of the moving table 15, the outer sides of the moving table 15 are fixedly connected with the controller 17, one side of the moving table 15, which is not provided with the controller 17, is fixedly connected with the temperature measuring component 18, the same side, which is provided with the temperature measuring component 18, is also provided with the adjusting component C19, the output end of the adjusting component C19 is provided with the connecting plate 20, the top end face of the connecting plate 20 is fixedly connected with the contact component 21 of the annular structure, the bottom end of the contact assembly 21 is provided with a lead 22 and is electrically connected with the controller 17 arranged outside the movable table 15 at the bottom end of the adjusting assembly B14 through the lead 22, when the performance of an integrated circuit is required to be detected in the integrated circuit production process, the positions and the gaps of the magnetic disks 5 adsorbed and connected on the top end surface of the base 1 can be manually adjusted according to the different sizes and specifications of the circuit boards 8 of the current production batch, the connecting pipe B6 arranged outside the magnetic disks 5 and the connecting pipe A4 arranged on the top end surface of the pump 3 are synchronously connected through hoses, at the moment, the circuit boards 8 are synchronously placed above the guide posts 7 fixedly connected on the top end surface of the magnetic disks 5, and the pump 3 arranged on the front end surface of the base 1 is synchronously started, and the pump 3 is used for pumping and limiting from the inside of the guide post 7.
Wherein, fixedly connected with guide pillar 7 on the terminal surface of magnetic disk 5, this suction hole is used for extracting air, and guide pillar 7 is equipped with everywhere altogether, circuit board 8 is installed to the top of guide pillar 7 everywhere, circuit board 8's outside is annular array and installs connecting piece 9, and vertical groove has all been seted up to the inside left and right sides of base 1, this internally mounted in vertical groove has adjusting part A10, after the initial temperature is measured and is accomplished, if need detect the data such as the resistance value of connecting piece 9 installed in the circuit board 8 outside, can carry out the altitude mixture control to mobile station 15 through the adjusting part B14 of start-up installation in guide frame 13, and synchronous start-up is installed adjusting part C19 in the mobile station 15 outside and is promoted connecting plate 20 and contact assembly 21 towards one side of connecting piece 9, and make the contact assembly 21 cup joint on the terminal surface of connecting plate 20 outside and contact with connecting piece 9 this moment, can accomplish the intercommunication operation to the circuit, and synchronous utilization sets up the corresponding data detection of control panel 17 in the mobile station 15 outside and detect the current temperature measurement of the temperature in the corresponding outside at the time, can reach the current temperature measurement of the current situation of the power supply module in the mobile station 8, and further the temperature measurement procedure can reach the practical condition is reached.
When in use, the utility model is characterized in that: in the integrated circuit production process, when the performance of the integrated circuit is required to be detected, the positions and gaps of the magnetic disks 5 which are adsorbed and connected on the top end face of the base 1 can be manually adjusted according to different sizes and specifications of the circuit boards 8 of the current production batch, the connecting pipes B6 arranged on the outer side of the magnetic disks 5 and the connecting pipes A4 arranged on the top end face of the pump 3 can be synchronously connected through hoses, at the moment, the circuit boards 8 are synchronously placed above the guide posts 7 fixedly connected on the top end face of the magnetic disks 5, the pump 3 which is synchronously arranged on the front end face of the base 1 can be started, and the air extraction and limiting can be carried out from the inside of the guide posts 7 through the pump 3.
Embodiment two: based on the temperature measurement device for integrated circuit production provided by the first embodiment, the quick adsorption limit of the circuit board 8 can be realized, but the problem of detecting the initial temperature of the circuit board 8 still cannot be solved when the temperature measurement device is used, and in order to solve the problem, the device is further provided with the following technical scheme.
The output end of the adjusting component A10 is provided with a movable frame 11, the upper side and the lower side of the movable frame 11 are fixedly connected with sliding blocks 12, the movable frame 11 is slidably connected in the base 1 through the sliding blocks 12 fixedly connected with the outer sides of the movable frame 11, the top end surface of the movable frame 11 is fixedly connected with a guide frame 13, the inside of the guide frame 13 is provided with a longitudinal groove, and the inside of the longitudinal groove is provided with an adjusting component B14.
When in use, the utility model is characterized in that: when the pump 3 pumps air through the suction holes formed in the guide posts 7, automatic limiting operation can be realized on the detected circuit board 8, at the moment, the adjusting component A10 installed in the base 1 is started to push the movable frame 11 synchronously according to the difference of the positions of the connecting pieces 9 which are required to be detected currently and are positioned on the outer side of the circuit board 8, when the movable frame 11 moves, the two sliding blocks 12 fixedly connected to the outer side of the movable frame 11 can be synchronously utilized to rapidly move and spread along the longitudinal grooves formed in the base 1, and when the movable frame 11 moves, the guide frames 13 fixedly connected to the top end face of the movable frame 11 can be synchronously driven to synchronously longitudinally displace, and the temperature measuring component 18 installed in the movable table 15 is synchronously started to measure the initial temperature of the current circuit board 8 in advance.
Embodiment III: based on the temperature measurement device for integrated circuit production provided in the second embodiment, it can realize the detection of the initial temperature of the circuit board 8, but it still cannot solve the problem of detecting whether the temperature is abnormal during use.
The pump 3 is pumped by using the adapter tube A4 disposed on the top end surface of the pump 3, the top end surface of the base 1 is provided with the magnetic disk 5, the magnetic disk 5 is matched with the base 1, the outer peripheral surface of the magnetic disk 5 is fixedly connected with the adapter tube B6, the adapter tube B6 and the adapter tube A4 are connected through a hose, and the pump 3 is pumped, when the pump 3 pumps through the suction hole formed in the guide post 7, the automatic limit operation of the detected circuit board 8 can be realized, at this time, the synchronous temperature measuring assembly can be started by starting the adjusting assembly a10 installed in the base 1 according to the different positions of the connecting piece 9 currently required to be detected, and when the moving frame 11 moves, the two sliding blocks 12 fixedly connected to the outer side of the moving frame 11 are rapidly moved and unfolded along the longitudinal groove formed in the base 1, and when the moving frame 11 moves, the guide frame 13 fixedly connected to the top end surface of the moving frame can be synchronously driven, and the current temperature measuring assembly 18 can be synchronously started by synchronously moving the guide frame 13 fixedly connected to the top end surface of the moving frame, and the current temperature measuring assembly can be started in advance, and the temperature measuring assembly can be started by the circuit board 8.
When in use, the utility model is characterized in that: after the initial temperature is measured, if when the data such as the resistance value of the connecting piece 9 installed on the outer side of the circuit board 8 is required to be detected, the height of the mobile station 15 can be adjusted by starting the adjusting component B14 installed in the guide frame 13, and synchronously starting the adjusting component C19 installed on the outer side of the mobile station 15 to push the connecting plate 20 and the contact component 21 towards one side of the connecting piece 9, so that the contact component 21 fixedly connected to the top end surface of the connecting plate 20 is sleeved on the outer side of the connecting piece 9 and contacts with the connecting piece 9, at the moment, the communication operation of the circuit can be completed, and corresponding data detection operation can be synchronously performed by using the controller 17 arranged on the outer side of the mobile station 15, and in the detection process, the temperature measuring component 18 installed on the outer side of the mobile station 15 is synchronously started again to detect whether the current circuit board 8 has abnormal temperature under the condition of communicating with a power supply, thereby achieving the aim of being more practical.
Claims (1)
1. The temperature measurement equipment for integrated circuit production comprises a base (1), and is characterized in that an imaging assembly (2) is arranged on the top end face of the base (1), the imaging assembly (2) is a thermal camera, a pump machine (3) is fixedly connected to the front end face of the base (1), and four connecting pipes A (4) are arranged on the top end face of the pump machine (3) in a linear array; the pump (3) is used for pumping air by utilizing a connecting pipe A (4) arranged on the top end surface of the pump, and a magnetic disk (5) is arranged on the top end surface of the base (1); the magnetic disk (5) is matched with the base (1), a connecting pipe B (6) is fixedly connected to the peripheral surface of the magnetic disk (5), and the connecting pipe B (6) and the connecting pipe A (4) are connected through a hose and are pumped through the pump (3); a guide post (7) is fixedly connected to the top end surface of the magnetic disk (5), suction holes are formed in the top ends of the guide posts (7) and used for sucking air, the guide posts (7) are arranged in four places, and a circuit board (8) is arranged above the guide posts (7) in four places; the outer side of the circuit board (8) is provided with connecting pieces (9) in an annular array, the left side and the right side of the inside of the base (1) are provided with longitudinal grooves, and an adjusting component A (10) is arranged in each longitudinal groove; the output end of the adjusting component A (10) is provided with a movable frame (11), the upper side and the lower side of the movable frame (11) are fixedly connected with sliding blocks (12), and the movable frame (11) is in sliding connection in the base (1) through the sliding blocks (12) fixedly connected with the outer side of the movable frame; a guide frame (13) is fixedly connected to the top end surface of the movable frame (11), a longitudinal groove is formed in the guide frame (13), and an adjusting component B (14) is arranged in the longitudinal groove; the utility model discloses a temperature-measuring device is characterized in that a movable table (15) is installed on the bottom output end of an adjusting component B (14), the front side and the rear side of the movable table (15) are all opposite fixedly connected with a sliding part (16), the movable table (15) is fixedly connected with a sliding part (16) through the outer side of the movable table (15) and is connected in a guide frame (13) in a sliding mode, a controller (17) is fixedly connected with the outer side of the movable table (15), a temperature measuring component (18) is fixedly connected with one side of the movable table (15) which is not provided with the controller (17), an adjusting component C (19) is also installed on the same side of the movable table (15), a connecting plate (20) is installed on the output end of the adjusting component C (19), a contact component (21) of an annular structure is fixedly connected with the top end face of the connecting plate (20), and a conducting wire (22) is installed at the bottom end of the contact component (21) and is electrically connected with the controller (17) arranged on the outer side of the movable table (15) at the bottom of the adjusting component B (14) through the conducting wire (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311754574.3A CN117433644B (en) | 2023-12-20 | 2023-12-20 | Temperature measuring equipment for integrated circuit production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311754574.3A CN117433644B (en) | 2023-12-20 | 2023-12-20 | Temperature measuring equipment for integrated circuit production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117433644A CN117433644A (en) | 2024-01-23 |
| CN117433644B true CN117433644B (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311754574.3A Active CN117433644B (en) | 2023-12-20 | 2023-12-20 | Temperature measuring equipment for integrated circuit production |
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| CN (1) | CN117433644B (en) |
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| DE10119047B4 (en) * | 2000-04-21 | 2010-12-09 | Tokyo Electron Ltd. | Thermal processing device and thermal processing method |
| GB0103886D0 (en) * | 2001-02-16 | 2001-04-04 | Baumbach Per L | Temperature measuring device |
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|---|---|---|---|---|
| US6504155B1 (en) * | 1999-05-07 | 2003-01-07 | Mitsubishi Denki Kabushiki Kaisha | Infrared camera and infrared camera system having temperature selecting switch |
| WO2003031370A2 (en) * | 2001-10-08 | 2003-04-17 | Millennium Venture Holdings Ltd. | Method and facility for manufacture of ceramic products with optically-readable code |
| JP2010217012A (en) * | 2009-03-17 | 2010-09-30 | Nec Corp | Infrared detector and device manufacturing apparatus |
| JP2014237886A (en) * | 2013-06-10 | 2014-12-18 | 大同特殊鋼株式会社 | Heat processing facility and heat processing method |
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| CN117433644A (en) | 2024-01-23 |
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