CN117420337A - Probe correction method and device - Google Patents

Abstract

The invention discloses a probe correction method and a device, which are used for correcting a probe sucked by a plane and vertically overturned, wherein the method comprises the following steps: respectively acquiring a side morphology image and a front morphology image of the probe; obtaining position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe; comparing the position data with preset position data; and when the comparison result has deviation, sending deviation data to the execution unit for deviation correction. The invention corrects the probe posture at least once from the side and the front, and ensures that the probe is in a height standard posture and a position posture when being implanted in the jig.

Description

Probe correction method and device

Technical Field

The invention relates to the field of manufacturing of probe cards for wafer testing, in particular to a probe correction method and device.

Background

In the semiconductor integrated circuit industry, probe cards are commonly used for performing auxiliary tests when performing wafer level electrical tests on a tester. The existing probe card is characterized in that one end of a probe is fixed on a PCB, then the probe is connected with a testing machine through the PCB, and the other end of the probe is contacted with a probe point on each testing unit on a wafer, so that a complete testing system is formed.

In the scene of adopting the plane to absorb the probe, vertically implanting the tool, the probe after the plane absorbs needs 90 degrees upset and then vertically implants, and the gesture of probe implantation exists the deviation for the position error is bigger in the implantation tool, leads to the product finally unable normal use or deformation damage.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides a probe correction method and a probe correction device, which are used for solving the problem of large implantation error caused by probe posture error.

According to an aspect of the present invention, there is provided a probe calibration method for calibrating a probe sucked in a plane and vertically flipped, comprising:

respectively acquiring a side morphology image and a front morphology image of the probe;

obtaining position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe;

comparing the position data with preset position data;

and when the comparison result has deviation, sending deviation data to the execution unit for deviation correction.

According to the technical scheme, the gestures of the probe are corrected from the side face and the front face respectively, and the accuracy of the probe implantation jig is improved.

As a further technical solution, the method further includes: and acquiring the side form and the front form of the probe after the deviation correction, and re-calculating and comparing the position data according to the acquired data until the comparison result has no deviation.

As a further technical solution, comparing the position data with preset position data, further includes:

comparing whether the position data of the upper end point and the lower end point of the side form image of the probe are overlapped with the position data of the upper end point and the lower end point of the calibration image of the side camera or not;

and/or comparing whether the position data of the upper end point and the lower end point of the front morphological image of the probe are overlapped with the position data of the upper end point and the lower end point of the calibration image of the front camera.

As a further technical scheme, when the angle deviation of the probe relative to the vertical overturning surface and/or the angle deviation of the probe relative to the parallel overturning surface exist, deviation data are sent to the execution unit to carry out deviation correction.

As a further technical solution, when there is an angular deviation of the probe with respect to both the vertical flip face and the parallel flip face, the order of performing the deviation correction is: the angle deviation of the probe relative to the parallel overturning surface is corrected firstly, then the angle deviation of the probe relative to the vertical overturning surface is corrected, and finally the height position deviation of the probe in the Z direction is corrected.

As a further technical solution, when there is an angular deviation of the probe with respect to the vertical flip surface or an angular deviation of the probe with respect to the parallel flip surface, the order of performing the deviation correction is: the angle deviation of the probe relative to the parallel overturning surface or the angle deviation of the probe relative to the vertical overturning surface is corrected, and then the height position deviation of the probe in the Z direction is corrected.

According to an aspect of the present invention, there is provided a probe alignment device for aligning a probe sucked by a plane and vertically flipped, the device comprising: a first visual detection mechanism for detecting a side morphology of the probe; the second visual detection mechanism is used for detecting the front form of the probe; the rotation correcting mechanism is used for correcting the angle deviation of the probe relative to the parallel overturning surface; the turnover mechanism is used for correcting the angle deviation of the probe relative to the vertical turnover surface; a vacuum suction mechanism for sucking the probe; the suction nozzle lifting mechanism is used for driving the suction nozzle to lift and correcting the Z-direction height position deviation of the probe; and the control mechanism is used for obtaining the position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe, comparing the position data with preset position data, and sending deviation data to a corresponding execution unit for deviation correction when deviation exists in the comparison result.

As a further technical scheme, the vacuum suction mechanism is arranged at the output end of the rotating shaft of the rotation correcting mechanism, and the rotation correcting mechanism is arranged at the output end of the rotating shaft of the turnover mechanism.

As a further technical scheme, the vacuum suction mechanism, the rotation correcting mechanism and the turnover mechanism are all connected with the suction nozzle lifting mechanism.

As a further technical scheme, the suction nozzle lifting mechanism is further provided with an appearance detection and coordinate position acquisition mechanism which is used for detecting the appearance of the probe and acquiring the position coordinates of the probe on the placing disc.

Compared with the prior art, the invention has the beneficial effects that:

(1) According to the invention, after the probe is sucked in the plane and turned by 90 degrees, the corrected probe meets the requirement of the vertical implantation jig by the mutual coordination of the correction of the front deviation angle of the probe, the correction of the side deviation angle of the probe and the correction of the Z-direction height position of the probe, and the problem of integral deviation of the position of the probe sucked into the implantation jig caused by the manufacturing and assembling errors (including accumulated errors) of mechanical parts is solved.

(2) According to the invention, after the angle deviation data of the probe is obtained, the probe is ensured to be in a height standard posture and a position state when being implanted into the jig through at least one deviation correction, so that the overall yield of product implantation is improved.

(3) According to the invention, the angle deviation of the probe relative to the vertical overturning surface and/or the parallel overturning surface is determined through the comparison of the actual morphological image of the probe and the calibration image, the comparison process can be realized through the existing image recognition technology, a complex image processing algorithm is not required to be developed, and the deviation angle can be determined through the comparison of the position data of the upper end point and the lower end point of the probe image.

Drawings

FIG. 1 is a flowchart of a probe calibration method according to an embodiment of the invention.

FIG. 2 is a schematic diagram of the offset angle correction according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a device for sucking, turning over and calibrating a probe according to an embodiment of the invention.

Fig. 4 is a schematic view of a placing tray detecting mechanism and an appearance detecting and coordinate position obtaining mechanism according to an embodiment of the present invention.

Fig. 5 is a schematic diagram of a turnover mechanism and a rotation correction mechanism according to an embodiment of the invention.

Fig. 6 is a schematic diagram of a second visual inspection mechanism according to an embodiment of the invention.

Fig. 7 is a schematic diagram of probe aspiration flip according to an embodiment of the present invention.

Fig. 8 is a nine-point test schematic according to an embodiment of the invention.

In the figure: 10. a tray-placing detection mechanism; 20. a vacuum suction mechanism; 30. appearance detection and coordinate position acquisition means;

40. a rotation correction mechanism; 50. a turnover mechanism; 60. a suction nozzle lifting mechanism; 70. a first visual detection mechanism; 80. a second visual inspection mechanism; 101. a displacement sensor; 102. a displacement sensor fixing plate; 201. a suction nozzle; 202. a suction nozzle air pipe joint; 301. a coaxial light source; 302. a high resolution lens; 303. the appearance detection and position acquisition camera fixing seat;

304. appearance detection and position acquisition cameras; 401. a second rotation shaft; 402. a second rotation shaft support bearing; 403. a second rotating shaft mechanical stop lever; 404. a second rotating shaft radial lock nut; 405. the second rotating shaft fixing seat; 406. a second rotation shaft limit sensor mounting block; 407. a second rotation shaft coupling; 408. a stepping motor; 501. a first rotation shaft; 502. a servo motor; 503. a speed reducer; 504. a speed reducer mounting plate; 505. a second rotation shaft coupling; 506. a second rotating shaft radial lock nut; 507. the second rotating shaft fixing seat; 508. limiting buffer glue; 509. a second rotational shaft mechanical limit stop; 510. a second rotation shaft limit sensor (origin limit); 511. a second rotation shaft support bearing;

512. a second rotation shaft limit sensor (limit); 601. a suction nozzle lifting shaft; 602. a connecting plate; 801. a front form detection camera; 802. an XY adjustment stage; 803. a camera fixing seat; 804. a high resolution lens; 805. a coaxial light source;

806. a reflecting mirror; 807. the reflector fixing seat.

Detailed Description

The following description of the embodiments of the present invention will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In practical application, the overturned probe may have an angle deviation on the vertical overturning surface, i.e. the overturned probe is not in a 90-degree vertical state, but has a deviation angle with the vertical overturning surface; or, the turned probe has an angle deviation on the parallel turning surface, i.e. the turned probe is not in a parallel state with the parallel turning surface, but has an angle deviation with the parallel turning surface. Based on the foregoing, if the overturned probe is directly placed into the jig, the placement error is larger, so that the product cannot be normally taken finally. Thus, after the probe is turned 90 °, a probe correction step is performed.

The correction of the probe is realized by a rotation correction mechanism, a turnover mechanism and two visual detection mechanisms.

As shown in fig. 1, specifically, after turning the suction probe over 90 °, the following steps are performed:

step 1, respectively acquiring a side morphology image and a front morphology image of the probe.

Here, the side form image of the probe is detected by the first visual detection means, and the front form image of the probe is detected by the second visual detection means.

The first visual detection mechanism comprises a first camera for shooting a side form image of the probe. The first camera is provided with a high-resolution lens and a coaxial light source for improving image shooting accuracy.

The second visual detection mechanism comprises a second camera for shooting a front morphology image of the probe. The second camera is provided with a high-resolution lens and a coaxial light source for improving image shooting accuracy.

Specifically, as shown in fig. 6, the second visual detection mechanism is disposed on the front surface of the vacuum suction mechanism, and a second camera, a high-resolution lens, a coaxial light source and a reflecting mirror are sequentially disposed along the optical path, and the reflecting mirror faces the direction of the probe. The second camera is provided with a camera fixing seat, and an XY adjusting table is arranged at the bottom of the camera fixing seat and used for adjusting the position of the camera in the process of calibrating. The reflector is fixed on the front face of the probe through a reflector fixing seat and is used for assisting in capturing the front face morphological image of the probe.

Before detection, calibrating the first camera and the second camera respectively to obtain respective camera calibration images for comparison with the actually photographed probe images.

And 2, obtaining position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe.

The vertical flip surface herein refers to a plane perpendicular to the flip direction of the probe. In an ideal case, the overturned probe is parallel to the vertical overturning surface or coincides with the vertical overturning surface, and no angle deviation exists between the overturned probe and the vertical overturning surface.

The parallel flip surface herein refers to a plane parallel to the probe flip direction. In an ideal case, the overturned probe is parallel to the parallel overturning surface or coincides with the parallel overturning surface, and no angle deviation exists between the two surfaces.

Specifically, according to the probe image shot by the first camera, the position data of the probe relative to the vertical overturning surface are obtained through recognition. And identifying and obtaining the position data of the probe relative to the parallel overturning surface according to the probe image shot by the second camera. The identification process belongs to the field of image identification, and can be realized by adopting the existing image identification algorithm.

And step 3, comparing the position data with preset position data, and sending deviation data to an execution unit for deviation correction when deviation exists in the comparison result.

Further, comparing the position data of the probe side image with the position data of the calibration image of the first camera, judging whether the shot probe side image is overlapped with the horizontal direction of the image calibrated by the camera, and if so, considering that the probe has no angle deviation relative to the vertical overturning surface.

If the two actuating units do not overlap, the deviation angle of the probe relative to the vertical overturning surface is acquired and is sent to the control mechanism, and the control mechanism controls the corresponding actuating units to carry out deviation correction according to the deviation angle.

Further, comparing the position data of the front form image of the probe with the position data of the calibration image of the second camera, judging whether the shot probe image is overlapped with the image calibrated by the camera, and if so, considering that the probe has no angle deviation relative to the parallel overturning surface.

If the two actuating units do not overlap, the deviation angle of the probe relative to the parallel overturning surface is acquired and is sent to the control mechanism, and the control mechanism controls the corresponding actuating units to carry out deviation correction according to the deviation angle.

As an embodiment, as shown in fig. 2, if there is an angular deviation of the probe with respect to both the vertical flip surface and the parallel flip surface, the deviation correction is performed in the following order: front rotation correction of the probe, side rotation correction of the probe and Z-direction height position correction of the probe.

If the probe has an angular deviation from a perpendicular flip face or from a parallel flip face, the deviation correction is performed in the following order: front rotation correction of the probe or side rotation correction of the probe→Z-direction height position correction of the probe.

If the probe has an angular deviation with respect to the vertical flip surface or with respect to the parallel flip surface, the height of the probe in the Z direction also has a deviation, and therefore, at the end of correcting the angular deviation, correction of the Z-direction height position is required to be performed to ensure correction accuracy.

Further, correction of the offset angle of the probe with respect to the vertical flip surface is achieved by the flip mechanism. The method comprises the following steps: the control mechanism sends an instruction to a servo motor of the turnover mechanism according to the acquired deviation angle, so that the servo motor drives the first rotating shaft to rotate by a corresponding angle, and the angle deviation is corrected.

The output end of the first rotating shaft of the turnover mechanism is connected with the rotation correction mechanism. When the turnover mechanism rotates, the rotation correction mechanism is driven to rotate, and the rotation correction mechanism drives the vacuum suction mechanism to rotate, so that the probe is finally rotated.

As shown in fig. 5, the turnover mechanism includes a servo motor, the servo motor drives a first rotation shaft to rotate, and an output end of the first rotation shaft is connected with a suction nozzle. When the automatic suction nozzle works, the servo motor drives the first rotating shaft to rotate by a preset angle, and the first rotating shaft drives the suction nozzle to rotate by the preset angle.

Preferably, the first rotation axis is a 90 ° rotation axis. After the probe is sucked, the first rotation shaft is driven to rotate by 90 degrees, so that the probe sucked in a plane is turned into a vertical direction.

As an embodiment, the first rotation shaft may be rotated by an arbitrary angle, and the rotation angle of the first rotation shaft may be controlled by controlling the servo motor. When the overturned probe is detected to not meet the requirement of verticality, the angle of the overturned probe can be adjusted by rotating the first rotating shaft, so that the verticality of the probe meets the requirement.

Optionally, the turnover mechanism is provided with a first rotation shaft fixing seat for installing the first rotation shaft. The first rotation shaft is provided with a first rotation shaft support bearing.

The servo motor is connected with a planetary reducer. The planetary reducer is provided with a reducer mounting plate. The speed reducer is connected with a rotating shaft coupler.

Optionally, the turnover mechanism is provided with two first limit sensors, one for origin limit and one for limit.

Optionally, the turnover mechanism is further provided with a mechanical limit stop for limiting the first rotation shaft.

And the turnover mechanism is also provided with limiting buffer glue for limiting buffer.

The turnover mechanism is also provided with a radial lock nut used for radially locking the first rotating shaft.

Preferably, the connecting plate of the suction nozzle lifting mechanism is also provided with an avoidance hole for providing an avoidance space for the rotation correcting mechanism during overturning and correcting.

Further, correction of the deviation angle of the probe with respect to the parallel flip surface is achieved by a rotation correction mechanism.

As shown in fig. 5, the rotation correction mechanism includes: a stepping motor for driving the second rotation shaft to rotate; a second rotation shaft for rotating under the driving of the stepping motor to complete the rotation correction of the probe; the second rotating shaft fixing seat is used for fixing the second rotating shaft; and the second limit sensor is used for realizing limit induction of the second rotating shaft.

Specifically, a second rotating shaft coupler is further arranged between the second rotating shaft and the stepping motor. And the second rotating shaft fixing seat is also provided with a limit sensor mounting block for mounting a limit sensor. Two second limit sensors are arranged, one is used for limiting an origin, and the other is used for limiting a limit.

And one side of the second rotating shaft fixing seat, which is far away from the stepping motor, is also provided with a second rotating shaft radial lock nut, a second rotating shaft support bearing and a second rotating shaft mechanical limiting rod. The second rotating shaft mechanical limiting rod is used for avoiding excessive rotation of the second rotating shaft.

And one side of the rotation correction mechanism, which is close to the probe to be sucked, is connected with a vacuum sucking mechanism. The vacuum suction mechanism comprises a suction nozzle, and the suction nozzle is connected with a vacuum pump through a suction nozzle air pipe joint. When the probe needs to be sucked, the control mechanism starts the vacuum pump to control the suction nozzle to suck the probe.

Specifically, correction of the offset angle of the probe with respect to the parallel flip surface includes: the control mechanism sends an instruction to the stepping motor of the rotation correction mechanism according to the acquired deviation angle, so that the stepping motor drives the second rotating shaft to rotate by a corresponding angle, and the angle deviation is corrected.

Further, after the angular deviation of the probe with respect to the vertical flip surface and/or the parallel flip surface is performed, correction of the Z-directional height position is performed using the suction nozzle lift mechanism.

Further, after the probe correction step, further comprising:

and 4, acquiring the side form and the front form of the probe after the deviation correction, and re-calculating and comparing the position data according to the acquired data until the comparison result has no deviation.

Specifically, after all deviation data are executed, the probe side form visual detection mechanism and the probe front form visual detection mechanism take a picture for the second time, obtain the position data of the probe relative to the vertical overturning surface and the parallel overturning surface, compare with the position data of theoretical design, if the deviation data exceed the setting data, send the deviation data to the execution unit, take a picture after the execution is finished, confirm whether the deviation is in the setting range, if so, perform the probe implantation procedure.

Through the probe correction process, the probe is ensured to be in a high standard posture and position state when being implanted into the jig, and the bonding and welding yield of the probe is improved.

The device for realizing the probe correction method comprises the following steps: a first visual detection mechanism for detecting a side morphology of the probe; the second visual detection mechanism is used for detecting the front form of the probe; the rotation correcting mechanism is used for correcting the angle deviation of the probe relative to the parallel overturning surface; the turnover mechanism is used for correcting the angle deviation of the probe relative to the vertical turnover surface; a vacuum suction mechanism for sucking the probe; the suction nozzle lifting mechanism is used for driving the suction nozzle to lift and correcting the Z-direction height position deviation of the probe; and the control mechanism is used for obtaining the position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe, comparing the position data with preset position data, and sending deviation data to a corresponding execution unit for deviation correction when deviation exists in the comparison result.

The vacuum suction mechanism is arranged at the output end of the rotating shaft of the rotating correction mechanism, and the rotating correction mechanism is arranged at the output end of the rotating shaft of the turnover mechanism, so that the rotation of the probe can be realized when the rotating correction mechanism rotates.

The vacuum suction mechanism, the rotation correcting mechanism and the turnover mechanism are connected with the suction nozzle lifting mechanism so as to move along with the movement of the suction nozzle lifting mechanism.

And the suction nozzle lifting mechanism is also provided with an appearance detection and coordinate position acquisition mechanism which is used for detecting the appearance of the probe and acquiring the position coordinates of the probe on the placing disc.

The invention also provides a probe sucking method matched with the probe correcting method, and the probe sucking method realizes high-yield sucking of the probe through mutual matching of mechanisms of the sucking device, and the sucking process does not damage the probe or damage the suction nozzle, so that the probe can be sucked successfully within a distance meeting the requirement, and the service life of the suction nozzle can be prolonged.

In whole, the suction device comprises a test module before suction, a positioning module during suction, a lifting module during suction and a suction module, and a control module, wherein the modules are mutually matched to jointly complete the suction of the probe.

As shown in fig. 3 and 4, the suction device includes: the placing disc detection mechanism is used for detecting displacement data of probes at each preset test point of the placing disc from top to bottom by using the displacement sensor; an appearance detection and coordinate position acquisition mechanism for detecting the appearance of the probe and acquiring the position coordinates of the probe; the placing disc detection mechanism and the appearance detection and coordinate position acquisition mechanism are connected with the control mechanism and are used for fitting and forming a reference curved surface according to displacement data of probes at each test point to obtain relative heights of the probes on the placing disc on the reference curved surface, when the probes are sucked, the relative heights are utilized to compensate theoretical heights sucked by the probes, and the compensated heights are sent to the suction nozzle lifting mechanism so as to drive the vacuum suction mechanism to move to corresponding positions.

Specifically, a connecting plate is arranged on the suction nozzle lifting mechanism and used for installing a placing plate detection mechanism, an appearance detection and coordinate position acquisition mechanism and a vacuum suction mechanism.

The placing plate detection mechanism comprises a displacement sensor, wherein the displacement sensor is fixed on the connecting plate through a fixing plate and moves along with the movement of the suction nozzle lifting mechanism.

The appearance detection and coordinate position acquisition mechanism is fixed on the connecting plate through the fixing seat and also moves along with the movement of the suction nozzle lifting mechanism.

The fixed seat is provided with a camera, a high-resolution lens and a coaxial light source. The camera is used for shooting pictures of the probe so as to perform appearance detection; and is also used for acquiring the image of the probe and processing to obtain the position coordinates of the probe. It should be noted that, the processing procedure of obtaining the probe position coordinates through the image may be performed at the camera end or may be performed at the control end, which is not limited in the present invention. The high-resolution lens is used for matching with a camera to realize high-precision image shooting. The coaxial light source is used for providing uniform illumination and improving the image shooting precision.

The vacuum suction mechanism is used for sucking the probe in a plane. The connecting plate of the suction nozzle lifting mechanism is provided with a mounting groove for mounting the vacuum suction mechanism so that the vacuum suction mechanism moves along with the movement of the suction nozzle lifting mechanism.

The control mechanism is respectively connected with the suction nozzle lifting mechanism, the displacement sensor, the camera and the vacuum suction mechanism and is used for receiving displacement data sent by the displacement sensor and processing the displacement data to form a reference curved surface, receiving a probe image sent by the camera and carrying out appearance detection, and receiving a probe image or probe position coordinates sent by the camera when sucking a probe so as to accurately move the suction nozzle lifting mechanism to the position of the probe to be sucked, compensating the suction theoretical height of the probe by using the reference curved surface when sucking, sending a compensated height value to the suction nozzle lifting mechanism, and controlling the vacuum suction mechanism to finish the suction of the probe after controlling the height data after the movement compensation of the suction theoretical height value. The process can move the suction nozzle lifting mechanism according to the actual height of each probe on the placing tray, so that the suction nozzle lifting mechanism can move to the position where the suction nozzle meets the suction condition of the probe every time, the probe can not be adsorbed unsuccessfully due to the overhigh suction nozzle position, the probe or the suction nozzle can not be damaged due to the overlow suction nozzle position, and the suction yield of the probe is greatly improved.

The working process of probe suction by utilizing the suction device comprises the following steps:

and step 1, placing the placing disc on a workbench, shooting an image of the placing disc, and determining the position coordinates of nine test points to be tested according to the shot image.

And 2, controlling the suction nozzle lifting mechanism to move, driving the displacement sensor to move, respectively detecting nine test points by the displacement sensor, acquiring displacement data of the nine test points, and sending the displacement data to the control mechanism.

And step 3, the control mechanism performs fitting according to the displacement data of each test point to obtain a reference curved surface, and the reference curved surface can represent the height change of all probes on the current placing plate. In other words, according to the reference curved surface, the relative height of each probe on the placing tray relative to the same reference surface can be obtained, and when the probe is to be sucked, the theoretical height is compensated according to the relative height of the probe to be sucked, so as to obtain the actual distance of the suction nozzle lifting mechanism to move.

And 4, acquiring the position coordinates of the probe to be sucked, acquiring the relative height of the point on the reference curved surface corresponding to the position coordinates, compensating the theoretical height sucked by the probe by using the relative height, and controlling the suction nozzle lifting mechanism to move to the corresponding position according to the compensated actual height (namely the moving distance of the suction nozzle lifting mechanism).

And 5, controlling a vacuum suction mechanism to finish probe suction.

Further, step 1 further includes: the positions of nine test points are preset and stored in the control mechanism. After the image of the current placing disc is obtained, according to the positions of the preset test points, the positions of the corresponding test points in the image of the placing disc are obtained by matching, and the position coordinates of the nine test points are determined.

As an implementation manner, nine test points can be preset on the placing disc, as shown in fig. 8, the nine test points are arranged in three stages, one-stage test point is only one and is located at the center of the placing disc, four-stage test points are uniformly distributed on a circular ring with a first radius and the center of the placing disc, and four-stage test points are uniformly distributed on a circular ring with a second radius and the center of the placing disc. The nine-point test method is suitable for a six-inch placing disc, and can give consideration to test precision and test complexity.

Further, the first radius is different from the second radius.

Further, the center of the placing disc is used as a round point, and the two-stage test points and the three-stage test points are spaced at the same angle along the circumferential direction.

It should be noted that, after the position coordinates of the nine test points are obtained, the process of controlling the nozzle lifting mechanism to move to the corresponding coordinates may be implemented by using the prior art, which is not described herein.

The suction device tests the height of each probe on the placing disc by using the displacement sensor, obtains displacement data as the relative height of the probe, fits a reference curved surface by using the relative height of each test probe, and compensates the relative height of the corresponding point of the reference curved surface on the theoretical height of the probe suction when the suction nozzle is used for taking materials, thereby effectively solving the problems of unsuccessful suction or damage to products and the suction nozzle due to the too low suction of the suction nozzle caused by the change of the height when the probe is sucked, and improving the probe taking and placing yield and the service life of the suction nozzle.

The suction device detects the relative height of probes at each test point on the placing tray through the placing tray detection mechanism and forms a reference curved surface, the appearance detection and coordinate position acquisition mechanism is utilized to carry out appearance detection and acquire the position coordinates of the probes to be sucked, the control mechanism compensates the theoretical height (namely the lifting distance of the suction nozzle lifting mechanism) of the probes sucked through the relative height of the fitting reference curved surface, and when the suction nozzle lifting mechanism moves the compensated distance, the vacuum suction mechanism is controlled to suck the probes, at the moment, the suction nozzle can successfully suck the probes, the probes or the suction nozzles cannot be damaged due to the fact that the probes are touched, namely, the problem that products and the suction nozzles are damaged due to unsuccessful suction or too low suction nozzles caused by the change of the heights when the probes are sucked is avoided through the mutual matching of the mechanisms.

As an embodiment, after the probe suction is completed, further comprising:

the aspirated probe is turned 90 ° so that it is perpendicular to the horizontal plane, as shown in fig. 7. After the probe is sucked in the plane, the probe can be vertically implanted into the jig by turning the probe by 90 degrees, so that the requirement of vertical implantation of the probe is met.

Specifically, when the probe is sucked, the suction nozzle is vertically downward, the probe is in a horizontal state, and after the probe is turned over by 90 degrees, the suction nozzle is in a horizontal state, and the probe is in a vertical state. The 90 degree turn is achieved here with a turn mechanism.

In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; these modifications or substitutions do not depart from the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present invention.

Claims (10)

1. A probe alignment method for aligning a plane-aspirated and vertically flipped probe, the method comprising:

respectively acquiring a side morphology image and a front morphology image of the probe;

obtaining position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe;

comparing the position data with preset position data;

and when the comparison result has deviation, sending deviation data to the execution unit for deviation correction.

2. The method of claim 1, further comprising: and acquiring the side form and the front form of the probe after the deviation correction, and re-calculating and comparing the position data according to the acquired data until the comparison result has no deviation.

3. The method of claim 1, wherein comparing the position data with preset position data, further comprises:

comparing whether the position data of the upper end point and the lower end point of the side form image of the probe are overlapped with the position data of the upper end point and the lower end point of the calibration image of the side camera or not;

and/or comparing whether the position data of the upper end point and the lower end point of the front morphological image of the probe are overlapped with the position data of the upper end point and the lower end point of the calibration image of the front camera.

4. A method according to claim 3, characterized in that the deviation data are sent to the execution unit for deviation correction when there is an angular deviation of the probe with respect to the vertical flip surface and/or an angular deviation of the probe with respect to the parallel flip surface.

5. The method of calibrating a probe according to claim 4, wherein when the probe has an angular deviation with respect to both a vertically flipped surface and a parallel flipped surface, the order of performing the deviation calibration is: the angle deviation of the probe relative to the parallel overturning surface is corrected firstly, then the angle deviation of the probe relative to the vertical overturning surface is corrected, and finally the height position deviation of the probe in the Z direction is corrected.

6. The method of calibrating a probe according to claim 4, wherein when there is an angular deviation of the probe with respect to a vertical flip surface or an angular deviation of the probe with respect to a parallel flip surface, the order of performing the deviation calibration is as follows: the angle deviation of the probe relative to the parallel overturning surface or the angle deviation of the probe relative to the vertical overturning surface is corrected, and then the height position deviation of the probe in the Z direction is corrected.

7. A probe alignment device for aligning a plane-aspirated and vertically flipped probe, the device comprising: a first visual detection mechanism for detecting a side morphology of the probe; the second visual detection mechanism is used for detecting the front form of the probe; the rotation correcting mechanism is used for correcting the angle deviation of the probe relative to the parallel overturning surface; the turnover mechanism is used for correcting the angle deviation of the probe relative to the vertical turnover surface; a vacuum suction mechanism for sucking the probe; the suction nozzle lifting mechanism is used for driving the suction nozzle to lift and correcting the Z-direction height position deviation of the probe; and the control mechanism is used for obtaining the position data of the probe relative to the vertical overturning surface and the parallel overturning surface according to the side morphology image and the front morphology image of the probe, comparing the position data with preset position data, and sending deviation data to a corresponding execution unit for deviation correction when deviation exists in the comparison result.

8. The probe alignment device of claim 7 wherein the vacuum suction mechanism is disposed at a rotatable shaft output of the rotation alignment mechanism and the rotation alignment mechanism is disposed at a rotatable shaft output of the flipping mechanism.

9. The probe alignment device of claim 7 wherein the vacuum suction mechanism, the rotation alignment mechanism and the flipping mechanism are all coupled to the nozzle lift mechanism.

10. The probe calibration device according to claim 7, wherein the nozzle lifting mechanism is further provided with an appearance detecting and coordinate position acquiring mechanism for detecting an appearance of the probe and acquiring position coordinates of the probe on the placing tray.