CN117417795A - Microwave component chip cleaning agent based on double solvents and preparation method thereof - Google Patents
Microwave component chip cleaning agent based on double solvents and preparation method thereof Download PDFInfo
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- CN117417795A CN117417795A CN202311259856.6A CN202311259856A CN117417795A CN 117417795 A CN117417795 A CN 117417795A CN 202311259856 A CN202311259856 A CN 202311259856A CN 117417795 A CN117417795 A CN 117417795A
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- solvent
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- microwave component
- component chip
- cleaning agent
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- 239000002904 solvent Substances 0.000 title claims abstract description 91
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 12
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 12
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000009835 boiling Methods 0.000 claims abstract description 8
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims abstract description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 7
- 239000011593 sulfur Substances 0.000 claims abstract description 7
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 238000005086 pumping Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 4
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 4
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 claims description 4
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 claims description 2
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 claims description 2
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 claims description 2
- DBTGFWMBFZBBEF-UHFFFAOYSA-N 2,4-dimethylpentane-2,4-diol Chemical compound CC(C)(O)CC(C)(C)O DBTGFWMBFZBBEF-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- 241000208140 Acer Species 0.000 claims description 2
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 claims description 2
- PFRUBEOIWWEFOL-UHFFFAOYSA-N [N].[S] Chemical compound [N].[S] PFRUBEOIWWEFOL-UHFFFAOYSA-N 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 68
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052731 fluorine Inorganic materials 0.000 abstract description 25
- 239000011737 fluorine Substances 0.000 abstract description 25
- 230000003749 cleanliness Effects 0.000 abstract description 7
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004377 microelectronic Methods 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract description 3
- 150000002367 halogens Chemical class 0.000 abstract description 3
- 150000001555 benzenes Chemical class 0.000 abstract description 2
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003759 ester based solvent Substances 0.000 abstract 1
- 239000004210 ether based solvent Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 9
- 238000011056 performance test Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- NOPJRYAFUXTDLX-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-methoxypropane Chemical compound COC(F)(F)C(F)(F)C(F)(F)F NOPJRYAFUXTDLX-UHFFFAOYSA-N 0.000 description 1
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical class CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000013020 steam cleaning Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/241—Hydrocarbons linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/242—Hydrocarbons branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3263—Amides or imides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a microwave component chip cleaning agent based on a double solvent and a preparation method thereof, belonging to the technical field of microelectronic cleaning, wherein the cleaning agent comprises the following components in percentage by mass: 10-50% of alcohol ether solvent, 1-10% of ester solvent, 1-10% of nitrogen-containing and sulfur-containing solvent, 0-1% of antioxidant T501 and the balance of hydrocarbon solvent. The invention enhances the capability of removing dirt such as weld, oil stain, dust and the like through the compounding synergy of alcohol ether solvents, ester solvents, nitrogen-containing and sulfur-containing solvents and hydrocarbon solvents; the catalyst does not contain heavy metals, benzene series, halogen and other components, is safe and environment-friendly, can be distilled and recovered, has a simple preparation method, and is suitable for large-scale industrial production; meanwhile, the fluorine-based solvent has specific density and boiling point, can be matched with the fluorine-based solvent to carry out double-solvent gas-phase cleaning on the microwave component chip, solves the problems that the fluorine-based solvent is safe and environment-friendly, but has weak cleaning power and is difficult to meet the requirement of cleaning cleanliness, and can also solve the problems that other cleaning modes are easy to damage the bare chip and influence the reliability of the product.
Description
Technical Field
The invention belongs to the technical field of microelectronic cleaning, and particularly relates to a microwave component chip cleaning agent based on a double solvent and a preparation method thereof.
Background
In recent years, along with the real demands of the military and civil fields on microelectronic products, microelectronic assembly technology is continuously developed towards multiple chips, high density, miniaturization, three-dimensional stacking, high integration and the like, and a microwave assembly chip is taken as a crucial component in the whole technology, so that the cleanliness of the microwave assembly chip plays a crucial role in the performance and reliability of the products. In the process of soldering a microwave component chip to a product bonding pad by using soldering flux (commonly used RMA soldering flux), the chip is inevitably polluted by soldering flux residues, if the chip is not cleaned, chemical components such as halogen, acid and the like contained in the soldering flux residues corrode the surface of the chip in a humid environment, hidden danger is generated or the chip is caused to fail, and line bridging short circuit is easily caused.
The common cleaning modes of the soldering flux residues comprise a plurality of modes such as manual soaking and brushing, ultrasonic cleaning, spray cleaning, gas phase cleaning and the like, but the damage to the bare chip must be avoided in the cleaning process due to the characteristics of the microwave component chip, any hidden trouble cannot be caused, meanwhile, the problems of cleaning cleanliness, stability and the like are considered, and the gas phase cleaning is one of the modes currently suitable. However, with the increasingly stringent environmental protection requirements around the world, increasing importance is placed on health safety, and current cleaning agents for gas phase cleaning have been eliminated or are at the edge of being replaced from the early fluorochloroalkanes (such as CFC 113) to the current chlorinated hydrocarbons, bromopropanes, and the like. Therefore, the gas phase cleaning agent for the microwave component chip can select a fluorine solvent which has extremely low physiological toxicity to human bodies and is friendly to the environment, but the cleaning capability of the fluorine solvent is weak, and residues for cleaning soldering flux by using the fluorine solvent are difficult to meet the cleaning cleanliness requirement, so that the cleaning agent is required to be matched with the fluorine solvent to carry out double-solvent gas phase cleaning to solve various limit problems in the cleaning process of the microwave component chip, and further, the performance and the reliability of products are ensured.
Disclosure of Invention
The invention provides a microwave component chip cleaning agent based on a double solvent and a preparation method thereof, and solves the problems that the cleaning capability is weak and the cleaning flux residue is difficult to meet the cleaning cleanliness requirement when a fluorine solvent is used for cleaning a microwave component chip in the prior art, although the physiological toxicity of a human body is extremely low and the cleaning agent is environment-friendly.
Aiming at the technical problems, the first aspect of the invention provides a microwave component chip cleaning agent based on double solvents, which comprises the following components in percentage by mass:
further, the alcohol ether solvent comprises one or two or more of propylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol methyl ether, dipropylene glycol butyl ether, 2, 4-dimethyl-2, 4-pentanediol or 3-methyl-3 methoxy-1 butanol.
Further, the ester solvent comprises one or two or more of dibasic ester (DBE), ethylene glycol diacetate or 3-methoxy-3-methyl-1-butyl acetate and a mixture of more than two.
Further, the nitrogen-containing and sulfur-containing solvents include one or a mixture of two of N, N-diethylformamide or dimethyl maple.
Further, the hydrocarbon solvent includes C 11 Normal alkane, C 9 -C 12 Normal paraffins or C 10 -C 13 One or two or more isoparaffins and a mixture of more than two isoparaffins.
Further, the hydrocarbon solvent has a boiling range of 180 ℃ to 220 ℃.
In a second aspect, a preparation method of a microwave component chip cleaning agent based on a double solvent is provided, and the preparation method comprises the following steps:
s1, pumping hydrocarbon solvent into a conical storage tank at the bottom and standing for more than 24 hours, and pumping the hydrocarbon solvent into a reaction kettle according to a ratio after removing impurities and moisture at the bottom;
s2, sequentially adding an alcohol ether solvent, an ester solvent, a nitrogen-containing and sulfur-containing solvent and an antioxidant T501 into a reaction kettle;
and S3, uniformly stirring the materials in the reaction kettle for 30 minutes, and passing through a dryer and a filter to obtain the finished product of the microwave component chip cleaning agent based on the double solvent.
The invention has the advantages and beneficial effects that:
1. the invention has strong capability of removing dirt such as weld, oil stain, dust and the like, has specific density and boiling point, and has strict mechanism of double-solvent gas phase cleaning action by matching with fluorine-based solvent. The cleaning agent disclosed by the invention can be used for forming a cleaning solution with a fluorine solvent in a certain proportion, the cleaning solution and the fluorine solvent are incompletely miscible, the density of the cleaning solution and the fluorine solvent is lower than that of the fluorine solvent, the cleaning solution is positioned on the cleaning upper layer, the cleaning solution plays a role in mainly dissolving the scaling powder residue on a workpiece, the boiling point of the cleaning solution can meet the lower temperature when the cleaning solution and the fluorine solvent are azeotropy, the temperature when the mixed solution is boiled is ensured not to cause any adverse effect on the workpiece, the boiling state of the mixed solution can be utilized to play a role in scouring the scaling powder residue on the workpiece, and the stripping and the dissolving of the scaling powder residue are further accelerated.
2. The invention does not contain the ODS substances such as trifluoro trichloroethane (F-113), 1 trichloroethane, trichloroethylene, carbon tetrachloride and the like, does not contain the components such as heavy metal, benzene series, halogen and the like, has low odor, is safe and environment-friendly, meets the RoHS regulations, and meets the requirements of the limit of the content of volatile organic compounds of the national standard GB38508 cleaning agent.
3. The invention is safe in use, has a closed flash point of more than 60 ℃, is a high flash point and low-flammability solvent product, can reduce the risk of fire in the storage or use process, has stable chemical properties, excellent material compatibility, no corrosion to circuit boards, metal materials and the like, can be distilled and recovered, reduces the use cost, and has good economy.
4. The preparation method is simple, the sources of the used raw materials are wide, the acquisition is easy, and the preparation method is very suitable for large-scale industrial production.
Drawings
FIG. 1 is a graph of a sample after cleaning using example 1 in a cleaning performance test according to the present invention;
FIG. 2 is a graph of a sample after cleaning using comparative example 1 in a cleaning performance test according to the present invention;
FIG. 3 is a graph of a sample after cleaning using comparative example 2 in a cleaning performance test according to the present invention;
FIG. 4 is a graph of the sample after cleaning using comparative example 3 in the cleaning performance test of the present invention;
FIG. 5 is a graph showing the comparison of the effects of the sample in application example 1 of the present invention before and after cleaning;
fig. 6 is a partial comparison under a microscope of the sample before and after cleaning according to application example 1 of the present invention.
Detailed Description
Specific embodiments of the invention will be described in detail and clearly in the following examples, which are given by way of illustration only and not by way of all examples, and all other examples which may be obtained without inventive faculty by a person skilled in the art are deemed to fall within the scope of protection of the invention.
Example 1
A microwave component chip cleaning agent based on double solvents comprises the following components in parts by weight (taking 1000g of product as an example):
the components are used for preparing the microwave component chip cleaning agent based on the double solvents, and the steps are as follows:
s1, C is 10 -C 13 Pumping isoparaffin into a storage tank with a conical bottom for standing for more than 24 hours, and pumping into a reaction kettle after ensuring removal of impurities and moisture at the bottom;
s2, sequentially adding propylene glycol butyl ether, 3-methyl-3 methoxy-1 butanol, ethylene glycol diacetate, N-diethyl formamide and an antioxidant T501 into a reaction kettle;
and S3, uniformly stirring the materials in the reaction kettle for 30 minutes, and passing through a dryer and a filter to obtain the finished product of the microwave component chip cleaning agent based on the double solvent.
The performance index of the microwave component chip cleaning agent based on the double solvents prepared in the embodiment is as follows:
appearance: colorless transparent liquid
Smell: slight solvent smell
Density (20 ℃): 0.822g/ml
Initial boiling point: 165 DEG C
Flash point (closed): more than or equal to 61 DEG C
Example 2
Unlike example 1, the composition and weight thereof are as follows: (taking 1000g of product as an example)
The embodiment is based on the performance index of the microwave component chip cleaning agent for the double solvent:
appearance: colorless transparent liquid
Smell: slight solvent smell
Density (20 ℃): 0.810g/ml
Initial boiling point: 166 DEG C
Flash point (closed): more than or equal to 61 DEG C
The alcohol ether solvent, the ester solvent, the nitrogen-containing and sulfur-containing solvents and the hydrocarbon solvent have the advantages of improving the dissolving capacity of the cleaning agent, removing the residues of soldering flux, fingerprints, dust and other dirt, along with good safety, excellent material compatibility and no corrosion to circuit boards and metal materials.
The fluorine solvent double-solvent gas phase cleaning is to clean dirt on a workpiece by using a solvent with strong cleaning power and a fluorine solvent, so that the purpose of meeting the special cleaning process requirement of the workpiece and simultaneously meeting the cleaning cleanliness requirement is achieved. The cleaning agent is mixed with the fluorine solvent according to a certain proportion to be used as cleaning liquid for cleaning, the cleaning agent and the fluorine solvent are not completely mixed, the cleaning agent is positioned on the upper layer of the cleaning liquid to play a role of mainly dissolving scaling powder residues on a workpiece, meanwhile, the azeotropic temperature with the fluorine solvent can meet the cleaning requirement of a microwave component chip, the chip is continuously flushed through the azeotropic effect on the premise of not damaging the chip, dirt stripping and dissolution can be more effectively accelerated, fluorine solvent steam can be generated during azeotropy, and steam is provided for steam cleaning of a steam zone.
Cleaning performance test:
cleaning performance test was performed by selecting the cleaning agent prepared in example 1.
Comparative example 1 without addition of alcohol ether solvent, unlike example 1, propylene glycol butyl ether and 3-methyl-3 methoxy-1 butanol, C 10 -C 13 Isoparaffin makes up the balance.
Comparative example 2 in which no ester solvent was added, unlike example 1 in which no ethylene glycol diacetate, C 10 -C 13 Isoparaffin makes up the balance.
Comparative example 3 in which no nitrogen-and sulfur-containing solvents were added, N-diethylformamide, C was not added unlike example 1 11 The n-alkane makes up the balance.
The cleaning performance test process flow comprises the following steps: double-solvent soaking and cleaning (temperature 85 ℃ for 8 min), fluorine solvent soaking and rinsing (normal temperature), and hot air drying.
The ratio of the double solvents consisting of the sample 1 and the comparative examples 1, 2 and 3 and the AE 3000 fluorine solvent is 7 to 3, and the test is carried out according to the cleaning performance test process flow, wherein the cleaning performance of the sample 1 is shown in the attached drawing 1, the surface of the sample is clean, no residue exists, the surface of the sample is more obvious in the attached drawing 2 after the cleaning of the comparative example 1, the surface of the sample is slightly imprinted, the cleaning effects of the comparative examples 1, 2 and 3 are worse than those of the sample 1 as shown in the attached drawing 3 and the attached drawing 4, the requirements of thorough cleaning of the flux residue and no imprinted residue cannot be met, which indicates that the components of the sample 1 are not necessary, and the excellent cleaning performance of the cleaning agent is ensured by the common compounding of the components.
Application example 1
The product of the example 1 is matched with AE 3000 fluorine solvent (HFE-347 pc-f) to form a double solvent ratio of 7 to 3, a microwave component chip is cleaned by using GUYSON double solvent gas phase cleaning equipment in UK, the appearance of the cleaned chip is free from color change and corrosion, the surface is free from any imprinting residue, the surface is clean and smooth, the solder of a sample piece is observed under a microscope of 25 times, no soldering flux residue exists on the solder and around the solder, the solder of a welding area is complete in shape and clear in outline, and meanwhile, the chip is cleaned by an ion pollutant test, so that the requirement of the three-level electronic product assembly with the cleanliness of not more than 1.56ug (NaCl)/cm 2 specified in GJB5807 is met.
Application example 2
The microwave component chip was cleaned by using the product of example 2 and 71IPA (mixture of fluorine solvent and isopropyl alcohol) to form a bi-solvent ratio of 6 to 4, and the appearance of the cleaned chip was similar to the results shown in fig. 5 and 6 both visually and microscopically, so that the cleaning requirements were not repeated, and the cleaning requirements of the three-stage electronic product assembly specified in GJB5807 were satisfied with a cleaning degree of not more than 1.56ug (NaCl)/cm 2.
In summary, the invention provides the microwave component chip cleaning agent based on the double solvents, the preparation method and the use method thereof, the cleaning agent is prepared by compounding raw materials friendly to human bodies and environment, specific components and proportions can be matched with different fluorine solvents to carry out double-solvent gas-phase cleaning on the microwave component chip, the cleaning agent meets the strict requirements of cleaning, the product is ensured to be lossless, the use is safe and environment-friendly, the cost is low, and the efficient cleaning of the chip is realized. Meanwhile, in practical application, the cleaning agent combines the performance characteristics of the cleaning agent, and can be applied to a double-solvent gas phase cleaning process, and the scaling powder residue and other various polar and nonpolar dirt on a workpiece can be cleaned by manual brushing, ultrasonic wave, spraying and other cleaning modes.
The invention has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the invention.
Claims (7)
1. A microwave component chip cleaning agent based on double solvents is characterized in that: the cleaning agent comprises the following components in percentage by mass:
alcohol ether solvent 10-50%;
1-10% of an ester solvent;
1-10% of nitrogen-containing and sulfur-containing solvents;
0-1% of antioxidant T501;
the balance being hydrocarbon solvent.
2. The microwave component chip cleaner based on the double solvent according to claim 1, wherein the alcohol ether solvent comprises one or two or more of propylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol methyl ether, dipropylene glycol butyl ether, 2, 4-dimethyl-2, 4-pentanediol or 3-methyl-3 methoxy-1 butanol.
3. The microwave component chip cleaner based on the double solvent according to claim 1, wherein the ester solvent comprises one or two or more of dibasic ester (DBE), ethylene glycol diacetate and 3-methoxy-3-methyl-1-butyl acetate.
4. The dual solvent based microwave component chip cleaner of claim 1, wherein the nitrogen-and sulfur-containing solvent comprises one or a mixture of two of N, N-diethylformamide and dimethyl maple.
5. The microwave component chip cleaning agent for a double-solvent based component according to claim 1, wherein the hydrocarbon solvent comprises C 11 Normal alkane, C 9 -C 12 Normal paraffins or C 10 -C 13 One or two or more isoparaffins and a mixture of more than two isoparaffins.
6. The microwave component chip cleaning agent for double-solvent based according to claim 1, wherein the boiling range of the hydrocarbon solvent is 180 ℃ to 220 ℃.
7. The method for preparing the microwave component chip cleaning agent based on the double solvents according to claims 1-6, wherein the preparation method comprises the following steps:
s1, pumping hydrocarbon solvent into a conical storage tank at the bottom and standing for more than 24 hours, and pumping the hydrocarbon solvent into a reaction kettle according to a ratio after removing impurities and moisture at the bottom;
s2, sequentially adding an alcohol ether solvent, an ester solvent, a nitrogen-containing and sulfur-containing solvent and an antioxidant T501 into a reaction kettle;
and S3, uniformly stirring the materials in the reaction kettle for 30 minutes, and passing through a dryer and a filter to obtain the finished product of the microwave component chip cleaning agent based on the double solvent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311259856.6A CN117417795A (en) | 2023-09-27 | 2023-09-27 | Microwave component chip cleaning agent based on double solvents and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311259856.6A CN117417795A (en) | 2023-09-27 | 2023-09-27 | Microwave component chip cleaning agent based on double solvents and preparation method thereof |
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