CN117417637A - Resin composition and application thereof - Google Patents

Resin composition and application thereof Download PDF

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Publication number
CN117417637A
CN117417637A CN202311560494.4A CN202311560494A CN117417637A CN 117417637 A CN117417637 A CN 117417637A CN 202311560494 A CN202311560494 A CN 202311560494A CN 117417637 A CN117417637 A CN 117417637A
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China
Prior art keywords
parts
resin
polyphenyl ether
prepolymer
ether
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CN202311560494.4A
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Chinese (zh)
Inventor
杨宋
崔春梅
储正振
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Changshu Shengyi Technology Co ltd
Suzhou Shengyi Technology Co Ltd
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Changshu Shengyi Technology Co ltd
Suzhou Shengyi Technology Co Ltd
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Priority to CN202311560494.4A priority Critical patent/CN117417637A/en
Publication of CN117417637A publication Critical patent/CN117417637A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention provides a resin composition and application thereof, comprising the following components in parts by weight: (a) maleimide resin and prepolymer thereof: 100 parts; (B) polyphenylene ether resin: 10-200 parts of a lubricant; (C) a crosslinking agent: 5-80 parts; the polyphenyl ether resin contains terminal hydroxyl modified polyphenyl ether resin; the crosslinking agent contains a compound shown in a structural formula (1). The invention improves the compatibility and the processing problem between the maleimide resin and the polyphenyl ether by adding the allyl phenyl glycidyl ether containing two reactive groups; meanwhile, allyl in allyl phenyl glycidyl ether reacts with maleimide to form ether bond, epoxy reacts with hydroxyl in polyphenyl ether to form multidimensional reticular crosslinked cured product, so that the whole crosslinked network structure is more compact, and finally high heat resistance, low water absorption, high peel strength and low dielectric property are obtained.

Description

Resin composition and application thereof
Technical Field
The invention relates to the technical field of electronic materials, in particular to a resin composition and application thereof.
Background
With the development and scale of 5G, PCB substrate materials are required to have a low dielectric constant and dielectric loss tangent to reduce delay, distortion and loss of signals and interference between signals at high speed transmission. Accordingly, it is desirable to provide a thermosetting resin composition which can exhibit a sufficiently low dielectric constant and low dielectric loss tangent (i.e., the lower and the better the dielectric constant and the dielectric loss tangent) during signal transmission at higher speeds and higher frequencies, and which places higher demands on the performance of the package substrate material: it has low planar thermal expansion coefficient and low dielectric loss tangent.
The main chain of the polyphenyl ether resin contains a large amount of phenyl ether groups, has good physical and mechanical properties, and lower dielectric constant and dielectric loss tangent, and is one of the key materials in the ideal high-frequency high-speed substrate. However, the polyphenylene ether resin has a high melting point, poor flowability and poor processability, and thus the prepreg comprising the polyphenylene ether resin has a high melt viscosity, and it is difficult to meet the process requirements of multilayer printed wiring boards. In the prior art, the melting temperature can be effectively reduced and the fluidity can be improved by reducing the molecular weight of the polyphenyl ether resin, but the low molecular weight can lead to the reduction of the heat resistance of the polyphenyl ether resin, and is not beneficial to the processing and the application of a printed circuit board. Therefore, in order to meet the requirements of actual production and processing, polyphenylene ether needs to be modified by blending or chemical grafting, and common modification methods are directed to terminal modification such as methacrylate modification or styrene modification.
The bismaleimide resin condensate has excellent performances of high temperature resistance, damp heat resistance, high modulus, low CTE, high strength and the like, and is particularly suitable for being used as matrix resin of IC packaging carrier boards and carrier-like boards. However, the disadvantages of high brittleness, poor processability and the like are also present, which limits the large-scale application thereof.
The prior art CN102850766a discloses a halogen-free resin composition, which comprises an epoxy modified polyphenylene ether resin, an allyl modified bismaleimide resin, an epoxy resin, a phosphorus-containing flame retardant, a curing accelerator, a curing agent and an inorganic filler; the resin composition has good compatibility, wettability and processability, but the copper-clad plate containing the resin composition has high dielectric loss tangent, high water absorption and insufficient heat resistance, and is difficult to meet the performance requirements of a high-frequency printed circuit board. In the prior art CN111386313, a resin composition is disclosed which comprises a maleimide compound containing a biphenyl structure and a polyphenylene ether resin containing a carbon-carbon unsaturated double bond, wherein the peel strength, heat resistance, water absorption and dielectric properties are further improved by the maleimide resin containing a biphenyl structure; but it has a technical disadvantage of poor workability.
Therefore, development of a resin composition and application thereof, which can improve compatibility and processability between maleimide resin and polyphenylene ether, and which can obtain high heat resistance, low water absorption, high peel strength and low dielectric properties, is clearly of positive practical significance.
Disclosure of Invention
The invention aims to provide a resin composition and application thereof, which are characterized in that the compatibility and processability problems between maleimide resin and polyphenyl ether are improved by adding allyl phenyl glycidyl ether containing two reactive groups, meanwhile, allyl groups in the allyl phenyl glycidyl ether react with maleimide groups to form ether bonds, epoxy groups react with hydroxyl groups in the polyphenyl ether to form a multidimensional reticular crosslinked cured product, so that the whole crosslinked network structure is more compact, and finally, high heat resistance, low water absorption, high peel strength and low dielectric property are obtained.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a resin composition comprising, in parts by weight:
(A) Maleimide resin and prepolymer thereof: 100 parts;
(B) Polyphenylene ether resin: 10-200 parts of a lubricant;
(C) Crosslinking agent: 5-80 parts;
the polyphenyl ether resin contains terminal hydroxyl modified polyphenyl ether resin;
the crosslinking agent contains a compound shown in a structural formula (1):
preferably, the polyphenyl ether resin contains carbon-carbon double bond modified polyphenyl ether resin.
Preferably, the polyphenylene ether resin is a mixture of a polyphenylene ether represented by the structural formula (2) and a modified polyphenylene ether represented by the structural formula (3) or the structural formula (4);
wherein R1, R2, R3, R4, R5, R6, R7, R8, R10 are hydrogen or C1-C5 alkyl, Y is a direct connection, -O-, methylene, ethylene,One of them.
Preferably, in the structural formula (2) and the structural formula (3), R1, R2, R5 and R6 are methyl, and R3, R4, R7 and R8 are hydrogen; in the structural formula (4), R1, R2, R5, R6 and R8 are methyl, and R3, R4 and R7 are hydrogen.
Preferably, in formula (3) terminal R10 is methyl.
Preferably, the polyphenylene ether resin represented by the formula (2) contains 10 to 80 parts by weight based on 100 parts by weight of the polyphenylene ether resin.
Preferably, the polyphenyl ether resin shown in the structural formula (2) can be SA90 or SA9000 manufactured by Sabyk, and OPE-2St manufactured by Mitsubishi.
Preferably, the cross-linking agent comprises one of o-allylphenyl glycidyl ether, m-allylphenyl glycidyl ether or p-allylphenyl glycidyl ether;
the o-allylphenyl glycidyl ether is shown as a structural formula (5):
preferably, the cross-linking agent is o-allylphenyl glycidyl ether shown in the structural formula (5).
Preferably, the o-allylphenyl glycidyl ether represented by the structural formula (5) is available from four-day synthetic company.
Preferably, the crosslinking agent further contains any one or a combination of at least two of divinylbenzene, bis-vinylbenzyl ether, 1, 2-bis (vinylphenyl) ethane, triallyl isocyanurate (TAIC) or prepolymer thereof, dicyclopentadiene Dimethacrylate (DCP), triallyl cyanurate, 1,2, 4-trivinylcyclohexane, tricyclodecane dimethanol dimethacrylate, trimethylol propane trimethacrylate or polyolefin resin containing butadiene structure, and the content thereof is 1 to 80 percent based on 100 percent by weight of the crosslinking agent.
Preferably, the prepolymer of the maleimide resin is at least one of an allyl compound-modified prepolymer, an aromatic amine compound-modified prepolymer, an aliphatic amine compound-modified prepolymer, an amino silicone resin-modified prepolymer, a cyanate ester-modified prepolymer, or a benzoxazine-modified prepolymer.
Preferably, the bismaleimide compound in the maleimide resin or modified bismaleimide prepolymer is selected from at least one of the following structures:
r2 is hydrogen, methyl or ethyl, R1 is methylene, ethylene or +.>n is an integer of 1 to 10;
n is an integer of 1 to 10;
n is an integer of 1 to 10;
n is an integer of 1 to 10;
r is hydrogen, methyl or ethyl, and n is an integer of 1 to 10.
Preferably, the maleimide resin is selected from any one or more of the following brands of materials: BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000H, BMI-4000H, BMI-5000, BMI-5100, BMI-7000, and BMI-7000H manufactured by Dahe chemical Co., ltd; BMI, BMI-70, BMI-80 manufactured by KI chemical Co., ltd; MIR-3000, MIR-5000 manufactured by Japanese chemical pharmaceutical Co., ltd; x9-450, X9-470 manufactured by DIC corporation of Japan; d936, D937, D939, D950, manufactured by Sichuan Dong Corp.
Preferably, the inorganic filler is also included, and the content of the inorganic filler is 30-200 parts.
Preferably, the inorganic filler is at least one selected from fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.
Preferably, the inorganic filler is silica, more preferably spherical silica.
Preferably, the inorganic filler is surface treated with a silane coupling agent selected from one or more of KBM-573, KBM-6883, KBONING chemical, KBM-1003, KBM-1403.
Preferably, at least one of epoxy resin, cyanate resin, benzoxazine resin or phenolic resin is also included.
The epoxy resin is selected from one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, tetraphenyl ethane epoxy resin, triphenylmethane epoxy resin, biphenyl epoxy resin, naphthalene ring type epoxy resin, dicyclopentadiene type epoxy resin, isocyanate type epoxy resin, aralkyl novolac epoxy resin, bisphenol A novolac type epoxy resin, polyphenyl ether modified epoxy resin, alicyclic epoxy resin, glycidylamine type epoxy resin, glycidylester type epoxy resin, phosphorus-containing epoxy resin, nitrogen-containing epoxy resin and multifunctional epoxy resin, and the content of the epoxy resin is 1-70 parts by weight.
Further preferably, the epoxy resin is naphthalene type epoxy resin or biphenyl type epoxy resin.
The cyanate is a compound containing at least one cyanate group, which may be a monomer, a polymer, a prepolymer, or a combination thereof.
Preferably, the cyanate ester compound is a prepolymer, or a combination of a prepolymer and a monomer, or a combination of a prepolymer and a polymer.
As an alternative, the cyanate ester compound is at least one selected from bisphenol a type cyanate, bisphenol F type cyanate, bisphenol E type cyanate, bisphenol M type cyanate, DCPD type cyanate, naphthalene type cyanate, and diphenyl cyanate, and the content thereof is 1-50 parts by weight.
The benzoxazine resin is selected from bisphenol A type benzoxazine resin, biphenyl type benzoxazine resin, naphthalene type benzoxazine resin, bisphenol F type benzoxazine resin, dicyclopentadiene type benzoxazine resin or double bond-containing benzoxazine resin, and the content of the benzoxazine resin is 1-60 parts by weight.
The phenolic resin is selected from bisphenol A type phenolic resin, biphenyl type phenolic resin, naphthalene type phenolic resin, triazinyl-containing phenolic resin, bisphenol F type phenolic resin or dicyclopentadiene type phenolic resin, and the content of the phenolic resin is 1-20 parts by weight.
Further preferably, the resin composition comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of epoxy resin and 1-70 parts of epoxy resin.
Further preferably, the resin composition comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of cyanate ester and 1-50 parts of cyanate ester.
Further preferably, the resin composition comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of epoxy resin, 1-50 parts of phenolic resin and 1-20 parts of phenolic resin.
Further preferably, the resin composition comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of epoxy resin, 1-70 parts of benzoxazine resin and 1-40 parts of benzoxazine resin.
Preferably, the resin composition further contains 0.01 to 5 parts of a catalyst. The catalyst is at least one of imidazole catalyst, pyridine catalyst and organic metal salt catalyst.
Preferably, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, modified imidazole and zinc octoate.
The application also claims the use of a resin composition as described above in cured sheets, laminates, insulating sheets, insulating films, circuit substrates and electrical devices.
Specifically, the prepreg comprises a reinforcing material, and the above-described resin composition attached to the surface of the reinforcing material.
Preferably, the reinforcing material is at least one selected from the group consisting of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics. Preferably, the reinforcing material is a glass fiber cloth, and a split cloth or a flat cloth is preferably used in the glass fiber cloth, more preferably, the glass fiber cloth is an E glass fiber cloth, an S glass fiber cloth, a T glass fiber cloth or a Q glass fiber cloth.
In addition, when the reinforcing material is a glass fiber cloth, the glass fiber cloth generally needs to be chemically treated to improve the bonding between the resin composition and the interface of the glass fiber cloth. The main method of the chemical treatment is a coupling agent treatment, and the coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent or the like, so as to provide good water resistance and heat resistance.
Preferably, the preparation method of the prepreg comprises the following steps:
dissolving the resin composition with a solvent to prepare a resin composition glue solution;
and (3) dipping the reinforcing material in the resin composition glue solution, and taking out, heating and drying the dipped reinforcing material to obtain the prepreg.
In one embodiment, the impregnated reinforcing material is baked for 1min to 15min at the temperature of 100 ℃ to 180 ℃ and dried to obtain the prepreg.
Specifically, the solvent may be one or a combination of any several of acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
The amount of the solvent to be used in the present invention is not particularly limited. The amount of the solvent to be added is selected by one skilled in the art according to his own experience, as long as the resulting resin composition dope can be brought to a viscosity suitable for use.
Preferably, the laminated board comprises at least one prepreg and a metal foil formed on at least one surface of the prepreg.
In an embodiment in which the laminate comprises at least two prepregs as described above, the at least two prepregs are stacked and bonded together by heating and pressurizing, and then a metal foil is bonded on one or both sides of the bonded prepregs by heating and pressurizing to form the laminate.
Specifically, the laminate was prepared as follows: and coating metal foil on one side or two sides of one prepreg, or coating metal foil on one side or two sides of at least 2 prepregs after superposing, and performing hot press forming to obtain the laminated board.
The pressing conditions of the laminated board are as follows: pressing for 2-4 hours under the pressure of 0.2-2 MPa and the temperature of 150-250 ℃.
In particular, the number of prepregs may be determined according to the thickness of the laminate as desired, and one or more prepregs may be used.
Preferably, the metal foil may be copper foil or aluminum foil, and the material of the metal foil is not limited; the thickness of the metal foil is also not particularly limited, and may be, for example, 5 μm, 8 μm, 12 μm, 18 μm, 35 μm or 70 μm.
Preferably, the printed wiring board comprises at least one prepreg as described above, or the printed wiring board comprises at least one laminate as described above.
Preferably, the preparation method of the printed circuit board is a conventional technical means in the field, and will not be described herein.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
(1) The invention improves the compatibility and the processing problem between the maleimide resin and the polyphenyl ether by adding the allyl phenyl glycidyl ether containing two reactive groups;
(2) According to the invention, allyl in allyl phenyl glycidyl ether reacts with maleimide to form ether bond, epoxy reacts with hydroxyl in polyphenyl ether to form multidimensional reticular crosslinked cured product, so that the whole crosslinked network structure is more compact, and finally high heat resistance, low water absorption, high peel strength and low dielectric property are obtained.
Detailed Description
The following description of the embodiments of the present invention will clearly and fully describe the technical solutions of the embodiments of the present invention in conjunction with the specific contents of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
Synthesis example 1: preparation of allyl Compound modified maleimide resin (prepolymer A)
50g of an allylbisphenol A compound, 100g of a maleimide resin (BMI-2300, manufactured by Dagher chemical reaction), 1.8g of p-aminophenol and an appropriate amount of a butanone solvent were added to a beaker, and reacted at 110℃for 90 minutes to obtain an allylbisphenol A modified maleimide resin.
Synthesis example 2: preparation of aromatic diamine Compound modified maleimide resin (prepolymer B)
50g of a4, 4' -diaminodiphenylmethane compound, 100g of a maleimide resin (manufactured by KI formation, KI-80), 2.4g of p-aminophenol and an appropriate amount of a butanone solvent were added to a beaker, and reacted at 125℃for 110 minutes to obtain an aromatic diamine compound-modified maleimide resin.
Example 1
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of prepolymer A, 30 parts of polyphenyl ether A, 50 parts of polyphenyl ether B, 50 parts of o-allylphenyl glycidyl ether, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Example 2
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of prepolymer B, 40 parts of polyphenyl ether A, 30 parts of polyphenyl ether C, 50 parts of o-allylphenyl glycidyl ether, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Example 3
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of maleimide resin, 20 parts of polyphenyl ether A, 30 parts of polyphenyl ether B, 10 parts of TAIC, 50 parts of o-allylphenyl glycidyl ether, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Example 4
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of prepolymer A, 30 parts of polyphenyl ether A, 50 parts of polyphenyl ether B, 50 parts of o-allylphenyl glycidyl ether, 30 parts of epoxy resin, 5 parts of phenolic resin, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Example 5
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of prepolymer B, 40 parts of polyphenyl ether A, 30 parts of polyphenyl ether C, 50 parts of o-allylphenyl glycidyl ether, 20 parts of cyanate resin, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Example 6
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of maleimide resin, 50 parts of polyphenyl ether A, 10 parts of TAIC, 50 parts of o-allylphenyl glycidyl ether, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Comparative example 1
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of prepolymer A, 30 parts of polyphenyl ether A, 50 parts of polyphenyl ether B, 50 parts of TAIC, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
Comparative example 2
The present embodiment is a resin composition comprising, in parts by weight: 100 parts of maleimide resin, 20 parts of polyphenyl ether A, 30 parts of polyphenyl ether B, 60 parts of TAIC, 150 parts of silicon dioxide and 0.5 part of 2-methylimidazole.
The components and addition amounts of examples 1 to 6 and comparative examples 1 to 2 are shown in Table 1 below.
TABLE 1
The raw material manufacturers and models of the respective components used in examples 1 to 6 and comparative examples 1 to 2 are shown in Table 2 below.
TABLE 2
Performance tests were conducted on the above examples 1 to 6 and comparative examples 1 to 2, respectively, and the test results are shown in Table 3 below.
TABLE 3 Table 3
Example 1 Example 2 EXAMPLE 3 EXAMPLE 4 EXAMPLE 5 EXAMPLE 6 Comparative 1 Comparative example 2
Glass transition temperature (DMA/. Degree.C) 246 248 253 240 259 256 240 242
PCT water absorption rate 0.19 0.20 0.23 0.22 0.21 0.25 0.22 0.29
Coefficient of thermal expansion (ppm/. Degree.C.) in the face 12 12 10 13 10 10 12 13
Dielectric constant (10 GHz) 3.2 3.15 3.35 3.45 3.20 3.39 3.36 3.46
Dielectric loss (10 GHz) 0.003 0.003 0.004 0.004 0.003 0.004 0.004 0.006
Peel strength (N/mm) 0.78 0.75 0.82 0.91 0.80 0.87 0.61 0.63
Compatibility of O O Δ O O O Δ Ⅹ
The performance test methods for all of the above examples 1 to 6 and comparative examples 1 to 2 were as follows:
1) Glass transition temperature (Tg): a dynamic mechanical property tester (TA DMA Q800, USA) is adopted, the heating rate is 10 ℃/min, and the atmosphere is nitrogen;
2) Dk and Df: the measurement was carried out at 10GHz according to IPC-TM-6502.5.5.9 by the plate method;
3) Surface Coefficient of Thermal Expansion (CTE) determination: TMA (thermo mechanical analysis) is adopted, the heating rate is 10 ℃/min, and the test temperature is 30-100 ℃;
rheology of the aminophenols of example 3 and comparative example 2:
4) PCT water absorption: taking 3 samples with the thickness of 10cm multiplied by 10cm and the thickness of 0.80mm and with metal foils removed from two sides, drying at 120 ℃ for 2 hours, then treating for 7 hours at 121 ℃ under 2 atmospheres by using an autoclave stewing test (Pressure Cooker test) machine, drying water surface free water, putting into a dryer for cooling, weighing, and calculating the water absorption rate of the plate according to the front and rear weights;
5) Peel Strength (PS): testing the peel strength of the metal cap layer with laminate a according to the "post thermal stress" experimental conditions in the IPC-TM-650 method;
6) Compatibility: after stirring the glue for 10min, the transparency was observed, for example, as clear and transparent as O, slightly cloudy as delta, and frosted as x.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A resin composition is characterized by comprising the following components in parts by weight:
(A) Maleimide resin and prepolymer thereof: 100 parts;
(B) Polyphenylene ether resin: 10-200 parts of a lubricant;
(C) Crosslinking agent: 5-80 parts;
the polyphenyl ether resin contains terminal hydroxyl modified polyphenyl ether resin;
the crosslinking agent contains a compound shown in a structural formula (1):
2. a resin composition according to claim 1, characterized in that: the polyphenyl ether resin contains carbon-carbon double bond modified polyphenyl ether resin.
3. A resin composition according to claim 1, characterized in that: the polyphenyl ether resin is a mixture of polyphenyl ether shown in a structural formula (2) and modified polyphenyl ether shown in a structural formula (3) or a structural formula (4);
wherein R1, R2, R3, R4, R5, R6, R7, R8, R10 are hydrogen or C1-C5 alkyl, Y is a direct connection, -O-, methylene, ethylene,-S-or->One of them.
4. A resin composition according to claim 3, characterized in that: in the structural formula (2) and the structural formula (3), R1, R2, R5 and R6 are methyl, and R3, R4, R7 and R8 are hydrogen; in the structural formula (4), R1, R2, R5, R6 and R8 are methyl, and R3, R4 and R7 are hydrogen.
5. A resin composition according to claim 3, characterized in that: the polyphenylene ether resin represented by the structural formula (2) contains 10 to 80 parts by weight based on 100 parts by weight of the polyphenylene ether resin.
6. A resin composition according to claim 1, wherein the crosslinking agent comprises one of o-allylphenyl glycidyl ether, m-allylphenyl glycidyl ether or p-allylphenyl glycidyl ether;
the o-allylphenyl glycidyl ether is shown as a structural formula (5):
7. the resin composition according to claim 1, wherein the prepolymer of the maleimide resin is at least one of an allyl compound-modified prepolymer, an aromatic amine compound-modified prepolymer, an aliphatic amine compound-modified prepolymer, an amino silicone resin-modified prepolymer, a cyanate ester-modified prepolymer, or a benzoxazine-modified prepolymer.
8. A resin composition according to claim 1, further comprising an inorganic filler in an amount of 30 to 200 parts.
9. A resin composition according to claim 1, comprising: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts by weight of epoxy resin and 1-70 parts by weight of a resin;
or comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of cyanate ester and 1-50 parts of ethylene oxide;
or comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of epoxy resin, 1-50 parts of phenolic resin and 1-20 parts of phenolic resin;
or comprises: 100 parts of maleimide resin and prepolymer thereof, 10-100 parts of double bond-containing polyphenyl ether resin, 10-100 parts of hydroxyl-containing polyphenyl ether resin and a crosslinking agent: 5-80 parts of epoxy resin, 1-70 parts of benzoxazine resin and 1-40 parts of benzoxazine resin.
10. Use of a resin composition characterized in that: use of the resin composition according to any one of claims 1 to 9 in cured sheets, laminates, insulating sheets, insulating films, circuit substrates and electrical devices.
CN202311560494.4A 2023-11-22 2023-11-22 Resin composition and application thereof Pending CN117417637A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN117417637A true CN117417637A (en) 2024-01-19

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