CN117412527A

CN117412527A - Texture substrate, manufacturing method thereof and electronic equipment

Info

Publication number: CN117412527A
Application number: CN202311223635.3A
Authority: CN
Inventors: 付科荣; 熊立; 竹岩
Original assignee: Huizhou TCL Mobile Communication Co Ltd
Current assignee: Huizhou TCL Mobile Communication Co Ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2024-01-16

Abstract

The embodiment of the application provides a texture substrate, a manufacturing method thereof and electronic equipment. The manufacturing method of the texture substrate comprises the following steps: providing a metal mold, wherein the surface of the metal mold is provided with a first texture pattern; applying the molten plastic raw material to one side of a metal mold with a first texture pattern, and cooling the plastic raw material to form a plastic substrate to obtain a transfer mold, wherein the transfer mold comprises a plastic substrate, and the surface of the plastic substrate is provided with a second texture pattern; providing a substrate, arranging a glue layer on the substrate, arranging a transfer printing die on one side of the glue layer, which is away from the substrate, pressing the transfer printing die, and then curing the glue layer to obtain a texture layer, wherein the surface of the texture layer is provided with a third texture pattern, so as to obtain the texture substrate. The transfer printing die adopted in the manufacturing method of the texture substrate is light in weight and convenient to use in the transfer printing process, and in addition, the processing cost of the transfer printing die is low, so that the production cost of the texture substrate can be reduced.

Description

Texture substrate, manufacturing method thereof and electronic equipment

Technical Field

The application relates to the field of texture plates, in particular to a texture substrate, a manufacturing method thereof and electronic equipment.

Background

In recent years, in the field of consumer electronics, consumers have increasingly higher requirements on the appearance of products, and textured substrates are increasingly used in various products due to their advantages of gorgeous appearance, rich changes and the like.

The traditional texture substrate processing method is a photoetching or high-precision CNC processing method, the texture processing modes have longer period and very high cost, and the texture substrate processing method has fewer supplier resources with development capability and great development difficulty; for this reason, the UV transfer method has been developed to form the texture pattern on the substrate surface, however, the existing UV transfer method generally adopts a metal mold as a transfer mold, which is heavy and inconvenient to use, and has a high production cost, and when a plurality of UV transfer lines need to be simultaneously operated, a plurality of metal molds need to be manufactured, resulting in a high production cost of the texture substrate.

Disclosure of Invention

The embodiment of the application provides a texture substrate, a manufacturing method thereof and electronic equipment, wherein the transfer printing die adopted in the manufacturing method of the texture substrate is lighter in weight and convenient to use in the transfer printing process, and in addition, the processing cost of the transfer printing die is lower, so that the production cost of the texture substrate can be reduced.

In a first aspect, an embodiment of the present application provides a method for manufacturing a textured substrate, including:

providing a metal mold, wherein the surface of the metal mold is provided with a first texture pattern, and the first texture pattern comprises a plurality of first concave parts and a plurality of first convex parts which are alternately arranged;

applying molten plastic raw material to one side of the metal mold, which is provided with a first texture pattern, and cooling the plastic raw material to form a plastic substrate to obtain a transfer mold, wherein the transfer mold comprises a plastic substrate, the surface of the plastic substrate is provided with a second texture pattern, and the second texture pattern is complementary with the first texture pattern;

providing a substrate, arranging a glue layer on the substrate, arranging the transfer mold on one side of the glue layer, deviating from the substrate, pressing the transfer mold, and then carrying out curing treatment on the glue layer to obtain a texture layer, wherein the surface of the texture layer is provided with a third texture pattern, the third texture pattern is complementary with the second texture pattern, so as to obtain a texture substrate, and the texture substrate comprises a substrate and a texture layer arranged on the substrate.

In some embodiments, after the plastic material is cooled to form a plastic substrate, an anti-fingerprint film layer is formed on a surface of the plastic substrate, where the surface is provided with a second texture pattern, and the transfer mold includes a plastic substrate and an anti-fingerprint film layer located on the plastic substrate.

In some embodiments, the third texture pattern comprises a plurality of third recesses and a plurality of third protrusions arranged alternately; the third concave part and the first concave part have the same shape and size, and the third convex part and the first convex part have the same shape and size; the depth of the first concave part is 10-20 mu m.

In some embodiments, the providing a metal mold includes: providing a metal plate, and forming a first texture pattern on the metal plate by adopting a laser engraving method to obtain the metal mold.

In some embodiments, the side of the metal plate having the second texture pattern is sandblasted prior to obtaining the metal mold.

In some embodiments, the applying the molten plastic feedstock to the side of the metal mold having the second texture pattern comprises:

providing a plastic product mold, wherein the plastic product mold is provided with an inner cavity, and the metal mold is arranged in the inner cavity of the plastic product mold so that the plastic product mold is connected with an injection molding machine;

and adding plastic raw materials into an injection molding machine, and injecting the molten plastic raw materials into the plastic product mold after the plastic raw materials are melted by the injection molding machine.

In some embodiments, the glue layer is cured by ultraviolet irradiation, the ultraviolet energy received by the glue layer in the curing process is 500 joules/square centimeter to 600 joules/square centimeter, and the curing time is 3 seconds to 10 seconds.

In some embodiments, after the texture layer is obtained, an optical film layer is disposed on a side of the texture layer having a third texture pattern, and a color ink layer is disposed on a side of the optical film layer facing away from the texture layer;

the texture substrate comprises a substrate, and a texture layer, an optical film layer and a color ink layer which are sequentially laminated on the substrate.

In a second aspect, an embodiment of the present application provides a textured substrate, which is manufactured by using the manufacturing method of the textured substrate, where the textured substrate includes a substrate and a textured layer disposed on the substrate, a side surface of the textured layer, which faces away from the substrate, has a third texture pattern, and the third texture pattern includes a plurality of third concave portions and a plurality of third convex portions that are alternately disposed.

In a third aspect, an embodiment of the present application provides an electronic device, including a device body and a housing disposed on an outer surface of the device body, where the housing is a texture substrate as described above.

The method for manufacturing the texture substrate provided by the embodiment of the application comprises the steps of firstly providing a metal mold, wherein the surface of the metal mold is provided with a first texture pattern, applying molten plastic raw material to the metal mold, cooling the plastic raw material to form a plastic substrate, and arranging a second texture pattern on the surface of the plastic substrate; it can be seen that, because the transfer printing mold is made of plastic raw materials, the weight of the transfer printing mold is lighter, and the transfer printing mold is convenient to use in the transfer printing process, in addition, a metal mold can be used as a template to prepare the transfer printing mold made of a plurality of plastic materials through an injection molding method, the processing cost of the metal mold is higher, and the processing cost of the transfer printing mold made of the plastic materials is lower, so that the processing cost of the transfer printing mold can be reduced, especially for the condition that a plurality of transfer printing production lines need to be operated simultaneously, the transfer printing mold made of a plurality of plastic materials can be simultaneously prepared to be applied to a plurality of transfer printing production lines, and the production cost of the texture substrate can be greatly improved due to the simultaneous operation of a plurality of transfer printing production lines.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.

Fig. 1 is a flowchart of a method for manufacturing a textured substrate according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a metal mold according to an embodiment of the present application.

FIG. 3 is a schematic diagram of a substrate obtained by applying molten plastic raw material to a metal mold and cooling the molten plastic raw material according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a first structure of a transfer mold according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a second structure of a transfer mold according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a textured substrate according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a second structure of a textured substrate according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

Referring to fig. 1, and referring to fig. 2 to 7, an embodiment of the present application provides a method for manufacturing a textured substrate, including:

in S100, referring to fig. 2, a metal mold 50 is provided, the surface of the metal mold 50 has a first texture pattern 51, and the first texture pattern 51 includes a plurality of first concave portions 511 and a plurality of first convex portions 512 alternately arranged.

Illustratively, the depth h1 of the first recess 511 is 10 μm-20 μm, e.g., 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc. It will be appreciated that since the first concave portions 511 are alternately arranged with the first convex portions 512, that is, the height of the first convex portions 512 is the same as the depth of the first concave portions 511, that is, the height of the first convex portions 512 is 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc.

Illustratively, the depths of at least two first concave portions 511 in the first texture pattern 51 are different, or the depths of any two first concave portions 511 in the first texture pattern 51 are different, or the depths of all first concave portions 511 in the first texture pattern 51 are equal.

Referring to fig. 2, the "providing a metal mold 50" may specifically include: a metal plate is provided, and a first grain pattern 51 is formed on the metal plate by a laser engraving method, to obtain a metal mold 50.

Illustratively, the metal mold 50 may be a steel plate, such as a stainless steel plate.

The "forming the first grain pattern 51 on the metal plate using the laser engraving method" may specifically include: the method comprises the steps of designing an optical texture pattern, inputting the optical texture pattern into a five-axis laser engraving and milling machine, engraving a metal plate (such as a steel plate) by using the five-axis laser engraving and milling machine, and oxidizing a material on the surface of the metal plate by using a high-intensity focused laser beam emitted by a laser at a focus.

It can be appreciated that, due to the higher fineness of the laser engraving method, the fineness of the first texture pattern 51 on the surface of the metal mold 50 can be improved, and further, the fineness of the second texture pattern 61 on the subsequently prepared transfer mold 60 can be improved, and further, the fineness of the third texture pattern 21 on the finally prepared texture substrate 120 can be improved, so that the pattern of the third texture pattern 21 is more exquisite, and thus, the appearance aesthetic degree of the electronic device 100 including the texture substrate 120 can be improved.

Illustratively, the side of the metal plate having the second grain pattern 61 may also be sandblasted prior to the metal mold 50.

It should be noted that, by performing sand blasting treatment on the side of the metal plate having the second texture pattern 61, burrs generated after carving on the surface of the metal plate can be removed, so that the first texture pattern 51 on the transfer mold 60 prepared by the metal mold 50 is more natural and softer, and further, the third texture pattern on the subsequently prepared texture substrate 120 is more beautiful.

In S200, referring to fig. 3 and 4, a molten plastic material is applied to a side of the metal mold 50 having the first texture pattern 51, and the plastic material is cooled to form a plastic substrate 601, so as to obtain a transfer mold 60, wherein the transfer mold 60 includes a plastic substrate 601, the surface of the plastic substrate 601 has a second texture pattern 61, and the second texture pattern 61 is complementary to the first texture pattern 51.

Referring to fig. 3, the "applying the molten plastic material to the side of the metal mold 50 having the second texture pattern 61" may specifically include:

providing a plastic product mold 130, wherein the plastic product mold 130 is provided with an inner cavity, and the metal mold 50 is arranged in the inner cavity of the plastic product mold 130, so that the plastic product mold 130 is connected with an injection molding machine;

the plastic raw material is added to the injection molding machine, and after the plastic raw material is melted by the injection molding machine, the melted plastic raw material is injected into the plastic product mold 130.

Referring to fig. 4, the second texture pattern 61 includes a plurality of second concave portions 611 and a plurality of second convex portions 612 alternately arranged, and it is understood that the second concave portions 611 are complementary to the first convex portions 512, and the second convex portions 612 are complementary to the first concave portions 511.

Referring to fig. 4, the depth h2 of the second recess 611 is 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc. It will be appreciated that since the second concave portions 611 alternate with the second convex portions 612, that is, the height of the second convex portions 612 is the same as the depth of the second concave portions 611, that is, the height of the second convex portions 612 is 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc.

Referring to fig. 5, after the plastic substrate 601 is formed after the plastic material is cooled, an anti-fingerprint film 602 may be further formed on a side surface of the plastic substrate 601 having the second texture patterns 61, and the transfer mold 60 includes the plastic substrate 601 and the anti-fingerprint film 602 disposed on the plastic substrate 601.

It can be appreciated that the anti-fingerprint film 602 has hydrophobic and oleophobic effects, so that the surface of the transfer mold 60 is smoother, when the transfer mold 60 is used for transfer, after the glue layer is cured, the transfer mold 60 and the cured glue layer (texture layer 20) can be easily separated, so that the problem that the glue layer (texture layer 20) is torn due to strong adhesion between the glue layer (texture layer 20) and the transfer mold 60, and the production yield of the texture substrate 120 is reduced is avoided.

Illustratively, the material of the anti-fingerprint film 602 may be an organic material, and the anti-fingerprint film 602 may be prepared by vacuum evaporation plating, magnetron sputtering plating or spraying.

Illustratively, the anti-fingerprint film layer 602 has a thickness of 50nm to 500nm, such as 50nm, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, 450nm, 500nm, etc.

Illustratively, before the anti-fingerprint film 602 is formed, the plastic substrate 601 may be cleaned (e.g., the plastic substrate 601 is placed in an ultrasonic cleaning tank to clean) to remove oil and dust on the surface of the plastic substrate 601, so as to ensure that the surface of the transfer mold 60 is smooth and free of impurities.

S300, please refer to fig. 6, a substrate 10 is provided, a glue layer is disposed on the substrate 10, a transfer mold 60 is disposed on a side of the glue layer away from the substrate 10, the transfer mold 60 is pressed, and then the glue layer is cured to obtain a texture layer 20, the surface of the texture layer 20 has a third texture pattern 21, the third texture pattern 21 is complementary with the second texture pattern 61, a texture substrate 120 is obtained, and the texture substrate 120 comprises the substrate 10 and the texture layer 20 disposed on the substrate 10.

For example, a coating method may be used to provide a glue layer on the base substrate 10.

Illustratively, the base substrate 10 may be a light-transmitting sheet material; illustratively, the light transmittance of the substrate base plate 10 may be greater than 40%, such as 40%, 50%, 60%, 70%, 80%, 90%, 95%, 100%, etc.

In some embodiments, the substrate base 10 may be a glass plate, a plastic plate, a glass fiber plate, or a composite plate; illustratively, the material of the plastic plate may be polyethylene terephthalate (PET).

Illustratively, the transfer mold 60 may be pressed by roller rolling.

Illustratively, the glue layer may be cured by ultraviolet irradiation for a period of 3 seconds to 10 seconds, for example, 3 seconds, 4 seconds, 5 seconds, 6 seconds, 7 seconds, 8 seconds, 9 seconds, 10 seconds, etc. Illustratively, the ultraviolet energy received by the glue layer during curing is in the range of 500 joules per square centimeter to 600 joules per square centimeter, such as 500 joules per square centimeter, 520 joules per square centimeter, 550 joules per square centimeter, 580 joules per square centimeter, 600 joules per square centimeter, and the like.

It can be understood that when the glue layer is cured by ultraviolet irradiation, it means that the material of the glue layer is a UV-curable resin material; for example, when the material of the glue layer may be a thermosetting resin material, the glue layer may be cured by heating.

Illustratively, the texture layer 20 has an average thickness of 50 μm to 500 μm, such as 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc.

Referring to fig. 6, the third texture pattern 21 includes a plurality of third concave portions 211 and a plurality of third convex portions 212 alternately arranged; it will be appreciated that the third recess 211 is complementary to the second protrusion 612 and that the third protrusion 212 is complementary to the second recess 611.

It can be seen that since the third texture pattern 21 and the first texture pattern 51 are complementary to the second texture pattern 61, that is, the third texture pattern 21 and the first texture pattern 51 are identical, that is, the third concave portion 211 is identical in shape and size to the first concave portion 511, and the third convex portion 212 is identical in shape and size to the first convex portion 512.

Referring to fig. 7, after obtaining the texture layer 20, an optical film layer 30 may be further disposed on the side of the texture layer 20 having the third texture pattern 21, and a color ink layer 40 may be disposed on the side of the optical film layer 30 facing away from the texture layer 20; the resulting textured substrate 120 includes a base substrate 10, and a textured layer 20, an optical film layer 30, and a color ink layer 40, which are sequentially stacked on the base substrate 10.

Illustratively, the optical film layer 30 may include a plurality of film layers having different refractive indexes, so that the textured substrate 120 may exhibit different color effects when viewed from different angles by using light refraction effects and reflection effects between the plurality of film layers.

In some embodiments, the optical film layer 30 may be a laminated structure in which a plurality of titanium oxide layers and a plurality of silicon oxide layers are alternately laminated; in other embodiments, the optical film layer 30 may be a laminated structure in which a plurality of indium metal layers and a plurality of tin metal layers are alternately laminated.

Illustratively, the optical film layer 30 may be formed by magnetron sputtering or electron gun plating, etc.

Illustratively, the thickness of the optical film layer 30 may be 20 μm to 300 μm, such as 20 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, etc.

Illustratively, the material of the color ink layer 40 may include a resin material and a pigment, and the color of the color ink layer 40 may be set according to the product requirement, for example, may be a single color or an gradual color change, etc. It can be appreciated that the matching of the color ink layer 40 and the optical film layer 30 can make the texture cover plate exhibit a complex and gorgeous color effect, so as to improve the aesthetic appearance of the texture substrate 120, and further improve the aesthetic appearance of the electronic device 100 including the texture substrate 120. Illustratively, the resin material may be Polyurethane (PU); illustratively, the pigment is present in the color ink layer 40 at a mass ratio of 0.5wt% to 10wt%, such as 0.5wt%, 1wt%, 2wt%, 5wt%, 8wt%, 10wt%, etc.

Illustratively, the thickness of the color ink layer 40 may be 20 μm to 500 μm, for example 20 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc.

In the method for manufacturing the texture substrate provided in the embodiment of the present application, a metal mold 50 is provided, a first texture pattern 51 is provided on the surface of the metal mold 50, a molten plastic material is applied on the metal mold 50, the plastic material is cooled to form a plastic substrate 601, a second texture pattern 61 is provided on the surface of the plastic substrate 601, and the transfer mold 60 manufactured in the embodiment of the present application includes the plastic substrate 601, and since the surface of the plastic substrate 601 has the second texture pattern 61, the transfer mold 60 can be used for performing a transfer operation to manufacture the texture substrate 120; it can be seen that, since the transfer mold 60 is made of plastic materials, the transfer mold 60 is lighter in weight and is convenient to use in the transfer process, in addition, a plurality of transfer molds 60 made of plastic materials can be prepared by taking one metal mold 50 as a template through an injection molding method, the processing cost of the metal mold 50 is known to be higher, and the processing cost of the transfer mold 60 made of plastic materials is lower, so that the processing cost of the transfer mold 60 can be reduced, especially for the case that a plurality of transfer production lines need to be operated simultaneously, a plurality of transfer molds 60 made of plastic materials can be prepared simultaneously to be applied to a plurality of transfer production lines, the production cost of transfer operation can be reduced due to the lower processing cost of the transfer mold 60 made of plastic materials, and the production efficiency of the texture substrate 120 can be greatly improved due to the simultaneous operation of a plurality of transfer production lines, so that the production cost of the texture substrate 120 can be further reduced.

Referring to fig. 6 or fig. 7, the present embodiment further provides a textured substrate 120, which is manufactured by adopting the manufacturing method of the textured substrate in any of the foregoing embodiments, the textured substrate 120 includes a substrate 10 and a textured layer 20 disposed on the substrate 10, a side surface of the textured layer 20 facing away from the substrate 10 has a third texture pattern 21, and the third texture pattern 21 includes a plurality of third concave portions 211 and a plurality of third convex portions 212 that are alternately disposed.

Referring to fig. 6 or 7, the depth h3 of the third recess 211 is 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc. It will be appreciated that since the third concave portions 211 are alternately arranged with the third convex portions 212, that is, the height of the third convex portions 212 is the same as the depth of the third concave portions 211, that is, the height of the third convex portions 212 is 10 μm to 20 μm, for example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, etc.

Referring to fig. 7, the texture substrate 120 may further include an optical film layer 30 and a color ink layer 40, wherein the optical film layer 30 is disposed on a side of the texture layer 20 having the third texture pattern 21, and the color ink layer 40 is disposed on a side of the optical film layer 30 facing away from the texture layer 20.

Illustratively, the optical film layer 30 may include a plurality of film layers having different refractive indices; in some embodiments, the optical film layer 30 may be a laminated structure in which a plurality of titanium oxide layers and a plurality of silicon oxide layers are alternately laminated; in other embodiments, the optical film layer 30 may be a laminated structure in which a plurality of indium metal layers and a plurality of tin metal layers are alternately laminated.

Illustratively, the material of the color ink layer 40 may include a resin material and a pigment. Illustratively, the resin material may be Polyurethane (PU); illustratively, the pigment is present in the color ink layer 40 at a mass ratio of 0.5wt% to 10wt%, such as 0.5wt%, 1wt%, 2wt%, 5wt%, 8wt%, 10wt%, etc.

Illustratively, the thickness of the color ink layer 40 may be 50 μm to 500 μm, for example 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc.

Illustratively, when the texture substrate 120 is used as the housing 110 of the electronic device 100, the texture substrate 120 may be disposed near the device body of the electronic device 100 on the side of the substrate 10 facing away from the texture layer 20, and may also be disposed near the device body of the electronic device 100 on the side of the texture layer 20 facing away from the substrate 10, and it is understood that when the texture substrate 120 is disposed near the device body of the electronic device 100 on the side of the texture layer 20 facing away from the substrate 10, the texture layer 20, the optical film layer 30 and the color ink layer 40 are disposed below the substrate 10, i.e. the user needs to see the texture pattern and the color effect of the texture layer 20, the optical film layer 30 and the color ink layer 40 through the substrate 10, so that the substrate 10 needs to have higher light transmittance.

Illustratively, the light transmittance of the substrate base plate 10 may be greater than 40%, such as 40%, 50%, 60%, 70%, 80%, 90%, 95%, 100%, etc.

Referring to fig. 8, and referring to fig. 6 and fig. 7, an electronic device 100 is further provided in this embodiment, and the electronic device includes a device body and a housing 110 disposed on an outer surface of the device body, where the housing 110 is the texture substrate 120 in any of the above embodiments.

Illustratively, the texture substrate 120 may be disposed near the device body on a side of the substrate 10 facing away from the texture layer 20, or may be disposed near the device body on a side of the texture layer 20 facing away from the substrate 10, and it is understood that the appearance effect of the electronic device 100 is different when the texture substrate 120 is disposed with different sides facing the device body.

Illustratively, the electronic device 100 may be a mobile terminal such as a mobile phone, a tablet computer, etc., and may also be a router, a game device, an augmented Reality (Augmented Reality, AR) device, a Virtual Reality (VR) device, a data storage device, an audio playing device, a video playing device, a wearable device, etc., where the wearable device may be a smart bracelet, smart glasses, a smart watch, a smart decoration, etc.

For example, when the electronic device 100 is a mobile phone, the housing 110 may be a front cover, a middle frame, a rear cover, or a Unibody structure (i.e., a structure in which the rear cover and the middle frame are integrally formed) of the mobile phone.

The texture substrate, the manufacturing method thereof and the electronic device provided by the embodiment of the application are described in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, with the description of the examples given above only to assist in understanding the present application. Meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims

1. A method of manufacturing a textured substrate, comprising:

2. The method according to claim 1, wherein after the plastic material is cooled to form a plastic substrate, an anti-fingerprint film layer is formed on a surface of the plastic substrate having the second texture pattern, and the transfer mold comprises a plastic substrate and an anti-fingerprint film layer on the plastic substrate.

3. The method according to claim 1, wherein the third texture pattern comprises a plurality of third concave portions and a plurality of third convex portions alternately arranged; the third concave part and the first concave part have the same shape and size, and the third convex part and the first convex part have the same shape and size; the depth of the first concave part is 10-20 mu m.

4. The method of manufacturing a textured substrate of claim 1, wherein the providing the metal mold comprises: providing a metal plate, and forming a first texture pattern on the metal plate by adopting a laser engraving method to obtain the metal mold.

5. The method according to claim 4, wherein before the metal mold is obtained, a side of the metal plate having the second texture pattern is sandblasted.

6. The method of claim 1, wherein applying the molten plastic material to the side of the metal mold having the second texture pattern comprises:

7. The method of claim 1, wherein the glue layer is cured by ultraviolet irradiation, the energy of ultraviolet light received by the glue layer during curing is 500 joules/square centimeter to 600 joules/square centimeter, and the curing time is 3 seconds to 10 seconds.

8. The method according to claim 1, wherein after obtaining the texture layer, an optical film layer is disposed on a side of the texture layer having the third texture pattern, and a color ink layer is disposed on a side of the optical film layer facing away from the texture layer;

9. A textured substrate manufactured by the manufacturing method of the textured substrate according to any one of claims 1 to 8, wherein the textured substrate comprises a substrate and a textured layer arranged on the substrate, a side surface of the textured layer, which is away from the substrate, is provided with a third texture pattern, and the third texture pattern comprises a plurality of third concave parts and a plurality of third convex parts which are alternately arranged.

10. An electronic device, comprising a device body and a housing provided on an outer surface of the device body, wherein the housing is the textured substrate according to claim 9.