CN109822986A - Method for producing shell and its shell, electronic equipment - Google Patents
Method for producing shell and its shell, electronic equipment Download PDFInfo
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- CN109822986A CN109822986A CN201910115314.9A CN201910115314A CN109822986A CN 109822986 A CN109822986 A CN 109822986A CN 201910115314 A CN201910115314 A CN 201910115314A CN 109822986 A CN109822986 A CN 109822986A
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Abstract
The embodiment of the present disclosure provides a kind of method for producing shell and its shell, electronic equipment, belongs to shell manufacturing technology field.The method for producing shell includes: offer substrate layer；The formation process layer on the substrate layer；Mantle layer is covered on first surface of the process layer far from the substrate layer；Forming processes are carried out to the substrate layer after the covering mantle layer；The mantle layer is removed from the substrate layer after forming processes to form the shell；Wherein, the hardness of the mantle layer is less than the substrate layer.The technical solution of the embodiment of the present disclosure passes through before substrate layer high-pressure molding, increase mantle layer in the technique layer surface of the substrate layer, utilize the soft characteristic of the mantle layer matter, it realizes during substrate layer high-pressure molding, particle point bring stress on its process layer is absorbed, so as to avoid the shell bad order as caused by particle point.
Description
Technical field
This disclosure relates to shell manufacturing technology field, in particular to a kind of method for producing shell and its shell, electronics
Equipment.
Background technique
Composite board high pressure or it is hot-forming before need to carry out preceding processing, including works such as printing, transfer, plated films
Sequence, due to the environment and processing procedure problem itself between each processing procedure, there are impure points in the product after will lead to technique, through excessively high
After pressing or being hot-forming, it can aggravate to highlight impure point, cause product surface particle point bad.
In the related technology, high pressure or hot-forming composite board mainly by raw material control, workshop condition transformation with
And increase particle point polishing operation, the yield of Lai Tisheng product.
For example, can by ink supplied materials reinforce filtering come reduce ink carry particle point, but this will lead to raw material at
This increase.For another example can reduce impure point by improving each processing procedure workshop condition grade, such as each processing procedure workshop condition need to reach
To thousand grades, even up to ten thousand grades, but this will lead to more demanding to workshop condition, and general enterprises are difficult to reach necessary requirement.Also
For example, can be polished ink pellet surface technique by increasing machine after printing, it is bad to reduce particle point during processing procedure, but this
It will increase process, improve cost, reduce efficiency.For another example can also by high pressure or it is hot-forming during, often do one
Flake products clear up Belt-type tools inner cavity and product surface, but do so and equally will increase process, more demanding to employee,
And cost and efficiency will receive influence.
Therefore, it is necessary to a kind of new method for producing shell and its shell, electronic equipment.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The embodiment of the present disclosure is designed to provide a kind of method for producing shell and its shell, electronic equipment, and then at least
Overcome product surface particle point present in the relevant technologies bad to a certain extent or reduces product surface in the related technology
The undesirable higher cost of particle point, the technical problem that higher to environmental requirement or production efficiency is lower.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by the disclosure
Practice and acquistion.
According to one aspect of the disclosure, a kind of method for producing shell is provided, comprising: provide substrate layer；In the substrate
Formation process layer on layer；Mantle layer is covered on first surface of the process layer far from the substrate layer；It is described soft to covering
The substrate layer after film layer carries out forming processes；The mantle layer is removed from the substrate layer after forming processes to be formed
The shell；Wherein, the hardness of the mantle layer is less than the substrate layer.
According to one aspect of the disclosure, a kind of shell is provided, is made of the method as described in above-mentioned any embodiment.
According to one aspect of the disclosure, a kind of electronic equipment is provided, including the shell as described in above-described embodiment.
The technical solution that the embodiment of the present disclosure provides can include the following benefits:
In the technical solution provided by some embodiments of the present disclosure, by before substrate layer forming processes, at this
The technique layer surface of substrate layer increases mantle layer, using the soft characteristic of the mantle layer matter, realizes in substrate layer forming process, inhales
Particle point bring stress on its process layer is received, so as to avoid the shell bad order as caused by particle point.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.In the accompanying drawings:
Fig. 1 diagrammatically illustrates the flow chart of the method for producing shell of one embodiment according to the disclosure；
Fig. 2 diagrammatically illustrates the flow chart of one embodiment of the step S120 in Fig. 1；
Fig. 3-7 diagrammatically illustrates the schematic diagram of the method for producing shell of one embodiment according to the disclosure；
Fig. 8 diagrammatically illustrates the flow chart of the method for producing shell of another embodiment according to the disclosure；
Fig. 9 diagrammatically illustrates the structural schematic diagram of the shell of one embodiment according to the disclosure.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, thesing embodiments are provided so that the disclosure will more
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.
In addition, described feature, structure or characteristic can be incorporated in one or more implementations in any suitable manner
In example.In the following description, many details are provided to provide and fully understand to embodiment of the disclosure.However,
It will be appreciated by persons skilled in the art that can with technical solution of the disclosure without one or more in specific detail,
Or it can be using other methods, constituent element, device, step etc..In other cases, it is not shown in detail or describes known side
Method, device, realization or operation are to avoid fuzzy all aspects of this disclosure.
Block diagram shown in the drawings is only functional entity, not necessarily must be corresponding with physically separate entity.
I.e., it is possible to realize these functional entitys using software form, or realized in one or more hardware modules or integrated circuit
These functional entitys, or these functional entitys are realized in heterogeneous networks and/or processor device and/or microcontroller device.
Flow chart shown in the drawings is merely illustrative, it is not necessary to including all content and operation/step,
It is not required to execute by described sequence.For example, some operation/steps can also decompose, and some operation/steps can close
And or part merge, therefore the sequence actually executed is possible to change according to the actual situation.
Fig. 1 diagrammatically illustrates the flow chart of the method for producing shell of one embodiment according to the disclosure.
As shown in Figure 1, the method for producing shell that the embodiment of the present disclosure provides may comprise steps of.
In step s 110, substrate layer is provided.
In the embodiment of the present disclosure, the substrate layer may include the first surface and second surface being oppositely arranged.
In the exemplary embodiment, the substrate layer may include PC (Polycarbonate, polycarbonate) and PMMA
(polymethacrylate, polymethyl methacrylate) two kinds of materials.Such as both materials can be subjected to extrusion forming
Composite board is formed, and using the composite board as the substrate layer.
Specifically, PC+PMMA composite board is by two kinds of raw material composite materials as made from co-extrusion of PC and PMMA, usually
There are two kinds of specifications of two laminates and three ply board.Wherein, two laminate thickness can be used for making phone cover in 0.05mm-2mm
Plate, decoration, mobile phone protective cover etc..Three ply board thickness can be used for making vehicle-mounted panel etc. in 0.5mm-2.0mm.This
In by taking two laminates as an example, wherein PMMA layers of generally transparent protective film, due to its hardness and wearability with higher,
It can be used for the outer layer of shell such as hand-set lid；PC layers are usually that colored protective film can be made since its property is crisp
For the internal layer of shell, the toughness of material entirety can be improved in this way.
In the step s 120, the formation process layer on the substrate layer.
In the embodiment of the present disclosure, the process layer is formed on the first surface of the substrate layer, wherein the process layer
Also include the first surface and second surface that are oppositely arranged, and the first surface of the process layer far from the substrate layer first
Surface, the first surface of the second surface of the process layer close to the substrate layer.
In the exemplary embodiment, there is particle point on the first surface of the process layer.Wherein, the quantity of particle point can
To be one or more, the disclosure is not construed as limiting this.
In step s 130, mantle layer is covered on first surface of the process layer far from the substrate layer.
Wherein, the hardness of the mantle layer is less than the substrate layer.
In the exemplary embodiment, the mantle layer may include the PVC (Polyvinyl with softening agent
Chloride, polyvinyl chloride) film layer.But it's not limited to that for the disclosure, other have characteristic same or similar with PVC film layer
Material can be employed as the mantle layer.
In the exemplary embodiment, the thickness of the PVC film layer can be 0.075mm perhaps 0.1mm or 0.075mm
To any one numerical value between 0.1mm, the disclosure is not construed as limiting this.
In the embodiment of the present disclosure, the PVC film layer is a kind of poly- record vinyl containing softening agent, have high temperature resistant,
The characteristic that thermal stability is good and matter is soft.In composite board 3D (dimension) forming process, its distinctive heat resistance is utilized
(composite board, which generally requires, is heated to 130 °, then carries out 3D high-pressure molding) can be covered on product well, and special using it
Some toughness and ductility form, the particle point in adsorption production process.
Since composite board needs to carry out before high-pressure molding preceding processing, such as pass through the processes shape such as printing, transfer, plated film
The surface presence of process layer is generally resulted in due to the environment and processing procedure problem itself between each processing procedure at the process layer
Grain point, after high-pressure molding, can aggravate to highlight particle point, to cause product surface particle point bad.The disclosure is implemented
In example, by covering one layer of PVC film in the printing ink surface of the first surface of the process layer of composite board before high-pressure molding
Layer, due to the characteristic that PVC film layer has matter soft, and composite board and process layer are harder, therefore during high-pressure molding, PVC
Film layer can be absorbed by particle point bring stress, so as to avoid the product appearance as caused by particle point bad.
In step S140, forming processes are carried out to the substrate layer after the covering mantle layer.
In the exemplary embodiment, the forming processes can be high-pressure molding or hot-forming.
In the embodiment of the present disclosure, high-pressure molding refers to that (actual temp value can be according to substrate in high temperature by the substrate layer
The material property of layer is chosen) soften under state, then to apply high pressure again make its molding process.
In the embodiment of the present disclosure, high-pressure molding generally requires to be used in molding high pressure board blow forming process, gas
Pressure reaches 60-80kg, but it's not limited to that for the disclosure.It should be noted that the height during composite board high-pressure molding
Value and 3D (three-dimension, three-dimensional) molding of pressure are related, the too small one side of pressure will lead to product cannot completely at
Type, product cambered surface will appear folding line, and transition is unnatural；On the other hand it is distorted after will lead to formed product, deformation is big.And pressure mistake
It will lead to mold gas leakage greatly, it is high to mold seal request, it is also high to the molding force request of high pressure board.
Wherein it is possible to carry out high-pressure molding to the substrate layer using high pressure board.Wherein, according to the difference of high pressure board
Two types can be divided into: lower die is vacuumized to add high pressure with upper mold.
By taking the substrate layer is composite board as an example, specific high-pressure molding process be may comprise steps of:
Composite board is put between upper die and lower die by the first step, and can be fixed in lower die by location hole.
Second step heats the composite board every sky using IR (Infrared Radiation, infrared ray) heating plate
(for example, 400 DEG C or so), the composite board is heated and softened.
Third step, removes IR heating plate, and upper mold pressure is molded with lower die.
4th step, upper mold fill high pressure, alternatively, lower die vacuumizes, it specifically can be according to composite board using which kind of type
Characteristic selects, and the disclosure is not construed as limiting this.
5th step, lower die keep mould Wen Junheng (for example, 130 DEG C -140 DEG C), pressure maintaining.
6th step lifts top board, the product after taking out high-pressure molding.
According to thermoforming way, then it is i.e. plastic to reach 15-25kg for hot bending die forming requirements blow gas pressure, but originally
It is open that it's not limited to that.
In step S150, the mantle layer is removed from the substrate layer after forming processes to form the shell.
In the related technology, high pressure or it is hot-forming during, composite board is under high-pressure, process layer particle
Point is inconsistent with the hardness of process layer, and stress is concentrated, shape after being composite board high pressure or is hot-forming so as to cause particle point
At shell on it is main one of bad, particle point is bad in the related technology thoroughly to solve, can only by improve environment and
Product defect rate is reduced in terms of material.The method for producing shell that the embodiment of the present disclosure provides, since PVC film layer has matter soft
Characteristic, and composite board and process layer are harder, therefore, high pressure or it is hot-forming during, PVC film layer can absorb by
Grain point bring stress, so as to be effectively improved high pressure or it is hot-forming during particle point it is bad, avoid by particle
Bad order caused by point, and 3D composite board production yield is effectively promoted, reduce production cost.
In the exemplary embodiment, after the method can also include: forming processes, in the substrate layer and described
The opposite second surface in one surface forms hardened layer.
In the embodiment of the present disclosure, the hardened layer is also showering layer, has the effect of surface stiffened.After increasing hardened layer
On the one hand shell is convenient for transport and storage after product export, on the other hand can also meet the requirement of portioned product.
Specifically, the hardened layer can be formed on the second surface of the substrate layer by leaching coating process.Wherein, it drenches
It applies technique and stiffened mainly is carried out to product surface, can specifically include following steps: keeping showering liquid uniform under the effect of gravity
It is covered with the second surface of entire substrate layer, then by baking and ultraviolet curing process, so that showering liquid is solidificated in the of substrate layer
Two surfaces.Wherein, showering liquid may include easy volatile solvent and UV (ultraviolet, ultraviolet light) type curing agent, but the disclosure
It's not limited to that.
It should be noted that above-mentioned steps S150 removes the mantle layer and is formed on the second surface of the substrate layer
Sequencing is had no between hardened layer.
A kind of method for producing shell that disclosure embodiment provides, by before substrate layer high-pressure molding, in the base
The technique layer surface of material layer increases mantle layer, using the soft characteristic of the mantle layer matter, realizes during substrate layer high-pressure molding,
Particle point bring stress on the process layer is absorbed, so as to avoid the shell bad order as caused by particle point.
Fig. 2 diagrammatically illustrates the flow chart of one embodiment of the step S120 in Fig. 1.In the embodiment of the present disclosure, institute
Stating process layer may include texture layer, film plating layer and background color layer.
As shown in Fig. 2, above-mentioned steps S120 may further include following steps in the embodiment of the present disclosure.
In step S121, the texture layer is formed on the substrate layer.
In the exemplary embodiment, the texture layer may include the UV glue layer formed by transfer.
Wherein, the texture layer may include the UV glue of Wave crest and wave trough structure.In the plated film by following step S122
Afterwards, difference of the Wave crest and wave trough to density between light reflected intensity and wave crest, it will form the bright dark grain effect of optical path.
In the embodiment of the present disclosure, the molding of the texture layer be may include steps of:
Texture formwork is placed on microscope carrier by the first step, wherein making texture layer upward.
Second step adds one layer of liquid UV glue on the texture formwork.
Third step covers the substrate layer on the texture formwork, wherein UV glue is in the substrate layer and the line
It manages among template.
4th step, the first surface (such as upper surface) by idler wheel in the substrate layer rolls, so that UV glue is uniform.
5th step, LED light is irradiated in the top of the substrate layer, so that UV glue primary solidification.
5th step removes the substrate layer, and the substrate layer is carried out secondary curing with mercury lamp.
In the exemplary embodiment, the hardness of the UV glue layer is greater than the mantle layer.
In the exemplary embodiment, the process layer can also include character layer.Wherein, work is formed on the substrate layer
Skill layer can also include: that the character is formed on the substrate layer before forming the texture layer on the substrate layer
Layer.In the embodiment of the present disclosure, the character layer (or being referred to as logo layers) can be formed by printing ink printing art.
In step S122, the film plating layer is formed on the texture layer.
In the embodiment of the present disclosure, the film plating layer can be formed using Vacuum Deposition mode, the process of Vacuum Deposition includes: true
It is set to evaporate or be splashed on the texture layer by high-temperature heating on metal or oxide in the air, institute required for being formed
State film plating layer.
In the embodiment of the present disclosure, the film plating layer can be inorganic matter and small part metal material, for example, titanium and oxide
(TiO2), the materials such as silicon and oxide (SiO2), indium (In), tin (Sn).
In the embodiment of the present disclosure, film plating layer substance does not have color, but it is with different refractive index and reflectivity.Light
Line forms multiple-beam interference in different film layer multiple reflections and transmission.Control the refractive index and thickness of film thickness, so that it may obtain not
Same interference effect, so as to control light color, light pass-through, light reflection and other effects.
In step S123, the background color layer is formed on the film plating layer.
In the exemplary embodiment, the background color layer may include at least three layers of ink layer formed by printing.For example,
It may include generally 4-6 layers of ink layer.
In the embodiment of the present disclosure, the ink that the last layer ink layer of the background color layer generally uses corrosion resistance strong, or
Other protection gloss oil of person play protection and make accordingly it is also possible to which the last layer ink layer of the background color layer is referred to as protective layer
With.
In the embodiment of the present disclosure, the background color layer generally has multilayer ink layer, and each layer of ink layer can be using oil
Ink print technique, and after the printing of ink each time, and then carry out one of baking process.
Wherein, baking can be there are two types of mode: baking box and tunnel line.Baking box is generally resistance heating, internal hot wind
The mode of circulation is dry.Continuous tunnel furnace is the tunnel type equipment that baking is completed by the conduction of heat, convection current, radiation.Baking box baking
Time is long, generally prints one of ink and needs to toast 30min, and continuous tunnel furnace baking only needs 15min, and continuous tunnel furnace dries plate
It is uniform in effect, thorough, it is more efficient.
Method for producing shell provided by the above embodiment is illustrated below with reference to Fig. 3-7.
As shown in figure 3, providing a substrate layer 1, substrate layer 1 includes the first surface S1 and second surface S2 being oppositely arranged.
As shown in figure 4, forming texture layer 2 on the first surface S1 of substrate layer 1 shown in Fig. 3.
As shown in figure 5, forming film plating layer 3 on texture layer 2 shown in Fig. 4.
As shown in fig. 6, forming background color layer 4 on film plating layer 3 shown in Fig. 5.Wherein, have extremely on the surface of background color layer 4
A few particle point 41.
As shown in fig. 7, forming mantle layer 5 on background color layer 4 shown in Fig. 6.It later, can be by shown in Fig. 7 including soft
The substrate layer 1 of film layer 5 carry out high pressure it is perhaps hot-forming and high pressure or it is hot-forming after mantle layer 5 peeled off, generate
The shell.
Further, embodiment further provides a kind of shells for the disclosure, using the shell as described in above-mentioned any embodiment
Body production method is made.
Fig. 8 diagrammatically illustrates the flow chart of the method for producing shell of another embodiment according to the disclosure.
As shown in figure 8, the method for producing shell that the embodiment of the present disclosure provides may comprise steps of.The embodiment of the present disclosure
In the content that does not illustrate be referred to above-mentioned other embodiments, details are not described herein.
In step S801, logo printing is carried out on the first surface of substrate layer, forms character layer.
In step S802, first time baking process is carried out.
In the embodiment of the present disclosure, logo printing, shape can be carried out on the first surface of the substrate layer using printing machine
At the character layer, then, first time baking is carried out to it with oven.
In step S803, first time cleaning operation is carried out.
In step S804, it is transferred on character layer by UV and forms texture layer.
In step S805, secondary curing is carried out.
In step S806, film plating layer is formed on texture layer by optical coating.
In step S807, the first background color layer is printed on film plating layer.
In the embodiment of the present disclosure, it is illustrated so that the background color layer includes four layers of ink layer as an example, wherein first layer
Ink layer is referred to as the first background color layer, and second layer ink layer is referred to as the second background color layer, and third layer ink layer is referred to as third bottom
Chromatograph, the 4th layer of ink layer are referred to as protective layer.
In step S808, second of baking process is carried out.
In step S809, the second background color layer is printed on the first background color layer.
In step S810, third time baking process is carried out.
In step S811, third background color layer is printed on the second background color layer.
In step S812, the 4th baking process is carried out.
In step S813, protective layer is printed on third background color layer.
In step S814, the 5th baking process is carried out.
In step S815, sanding operation is carried out.
In step S816, second of cleaning operation is carried out.
In step S817, PVC film layer is covered in protective layer.
In step S818, high pressure or hot-forming is carried out.
In step S819, coding.
In step S820, hardened layer is formed on the second surface of substrate layer by showering.
In step S821, PVC film layer is removed.
It should be noted that having no sequencing relationship between above-mentioned steps S821 and step S820.
In the embodiment of the present disclosure, the method can also include: can also be including punching, CNC (Computerized
Numerical Control, computer numerical control) and inspection packet and etc..
Fig. 9 diagrammatically illustrates the shell of one embodiment according to the disclosure.
As shown in figure 9, the shell that the embodiment of the present disclosure provides may include substrate layer 1, substrate layer 1 may include opposite sets
The first surface S1 and second surface S2 set.The shell can also include being set in turn on the first surface S1 of substrate layer 1
Character layer 6, texture layer 2, film plating layer 3 and background color layer 4.Wherein, there is at least one particle point 41 on the surface of background color layer 4.
It include hardened layer 7 on the second surface S2 of substrate layer 1 with continued reference to Fig. 9.
Further, for the disclosure embodiment further provides a kind of electronic equipment, the electronic equipment may include as above
State shell described in any embodiment.
In the exemplary embodiment, the electronic equipment can be mobile phone, and the shell can be used as the lid of the mobile phone
Plate, protective case, decoration etc..But it's not limited to that for the disclosure, and the electronic equipment can also be intelligent helmet, automobile, pen
Remember the arbitrary electronic equipment such as this computer, tablet computer, the shell can be used for vehicle-mounted panel, automobile control piece, inside gadget,
The visual window lens such as all kinds of instrument boards, Touch panels, Lens, display eyeglass, mobile phone key, thin film switch etc..
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (12)
1. a kind of method for producing shell characterized by comprising
Substrate layer is provided；
The formation process layer on the substrate layer；
Mantle layer is covered on first surface of the process layer far from the substrate layer；
Forming processes are carried out to the substrate layer after the covering mantle layer；
The mantle layer is removed from the substrate layer after forming processes to form the shell；
Wherein, the hardness of the mantle layer is less than the substrate layer.
2. method for producing shell according to claim 1, which is characterized in that the mantle layer includes having softening agent
PVC film layer.
3. method for producing shell according to claim 1, which is characterized in that on the first surface of the process layer have
Grain point.
4. method for producing shell according to claim 1, which is characterized in that the substrate layer includes two kinds of materials of PC and PMMA
Expect the composite board of extrusion forming.
5. method for producing shell according to claim 1, which is characterized in that the process layer includes texture layer, film plating layer
With background color layer；Wherein, the formation process layer on the substrate layer, comprising:
The texture layer is formed on the substrate layer；
The film plating layer is formed on the texture layer；
The background color layer is formed on the film plating layer.
6. method for producing shell according to claim 5, which is characterized in that the process layer further includes character layer；Wherein,
The formation process layer on the substrate layer, further includes:
It is formed on the substrate layer before the texture layer, forms the character layer on the substrate layer.
7. method for producing shell according to claim 5, which is characterized in that the background color layer includes being formed by printing
At least three layers of ink layer.
8. method for producing shell according to claim 5, which is characterized in that the texture layer includes being formed by transfer
UV glue layer.
9. method for producing shell according to claim 8, which is characterized in that the hardness of the UV glue layer is greater than described soft
Film layer.
10. method for producing shell according to claim 3, which is characterized in that further include:
After forming processes, hardened layer is formed in the second surface opposite with the first surface of the substrate layer.
11. a kind of shell, which is characterized in that be made of such as the described in any item methods of the claims 1-10.
12. a kind of electronic equipment, which is characterized in that including the shell as described in the claims 11.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910115314.9A CN109822986A (en) | 2019-02-13 | 2019-02-13 | Method for producing shell and its shell, electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910115314.9A CN109822986A (en) | 2019-02-13 | 2019-02-13 | Method for producing shell and its shell, electronic equipment |
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| CN201910115314.9A Pending CN109822986A (en) | 2019-02-13 | 2019-02-13 | Method for producing shell and its shell, electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110254111A (en) * | 2019-06-27 | 2019-09-20 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof, electronic equipment |
| CN110588229A (en) * | 2019-09-06 | 2019-12-20 | 惠州Tcl移动通信有限公司 | Shell film and preparation method thereof |
| CN114125105A (en) * | 2021-11-23 | 2022-03-01 | 东莞正广精密科技有限公司 | Processing method for manufacturing double-layer texture mobile phone rear shell by using liquid crystal |
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Application publication date: 20190531 |
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