CN112976753A

CN112976753A - Preparation method of composite board, composite board and electronic equipment

Info

Publication number: CN112976753A
Application number: CN202110326161.XA
Authority: CN
Inventors: 吕海东; 邹小明
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-03-26
Filing date: 2021-03-26
Publication date: 2021-06-18

Abstract

The application discloses a preparation method of a composite board, the composite board and an electronic device. The preparation method of the composite board comprises the following steps: a sheet material is prepared, the sheet material including a first side and a second side. And carrying out silk-screen printing treatment on the second surface of the plate to form a pattern, and forming a texture layer on the plate with the pattern. The texture layer is subjected to plating treatment to form a plating layer. And attaching the film layer to the electroplated layer to form the composite board. This application can satisfy electronic equipment's outward appearance demand through laminating the rete on the plating layer, and then can reduce or avoid realizing the outward appearance demand through printing ink printing many times among the correlation technique, can effectively reduction in production cost in the preparation of composite sheet, makes this preparation method adapt to large batch volume production demand, and the rete management and control is effectual, can ensure the yield of composite sheet in performance test.

Description

Preparation method of composite board, composite board and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a preparation method of a composite board, the composite board and the electronic equipment.

Background

With the increasing popularity of electronic devices and the improvement of processing technologies, the appearance of electronic devices (smart phones) has been developed as a main competitive point of electronic devices.

At present, in the preparation process of a plate used by electronic equipment, at least four times of bottom covering ink printing and one time of demolding ink printing are needed in the bottom covering treatment process of the plate, and the yield and the capacity of large-scale production are affected by more printing processes.

In addition, in the current printing process, the performance of the ink and the thickness control effect of the ink are poor, and the performance test is often influenced.

Therefore, in order to reduce the cost, improve the efficiency of mass production of the plate, and control the film thickness performance, a method of replacing the cover bottom printing many times is urgently needed.

Content of application

The embodiment of the application aims to provide a preparation method of a composite board, the composite board and an electronic device.

In order to solve the above problems, the present application is implemented as follows:

in a first aspect, embodiments of the present application provide a method for preparing a composite board, including:

preparing a plate, wherein the plate comprises a first surface and a second surface;

performing silk-screen printing on the second surface of the plate to form a pattern;

forming a texture layer on the board with the pattern;

electroplating the texture layer to form an electroplated layer;

and attaching the film layer to the electroplated layer to form the composite board.

In a second aspect, an embodiment of the present application further provides a composite board, including a substrate layer, a texture layer, an electroplating layer and a film layer, wherein the substrate layer includes a first surface and a second surface opposite to each other, the texture layer and the electroplating layer are sequentially stacked on the second surface of the substrate layer, and the film layer is attached to a side surface of the electroplating layer deviating from the texture layer.

In a third aspect, embodiments of the present application further provide an electronic device, including a composite board obtained by the method for preparing a composite board provided in the first aspect. Alternatively, an electronic device comprises a composite panel as provided in the second aspect.

In an embodiment of the present application, a method of manufacturing a composite panel includes: firstly, preparing a plate, wherein the plate comprises a first surface and a second surface, the first surface of the plate is an appearance surface, the second surface of the plate is an inner side surface, and when the composite plate made of the plate is applied to electronic equipment, namely, the second surface of the plate faces to the inside of the electronic equipment, and the first surface of the plate faces to a user for display. And then, carrying out silk-screen printing on the second surface of the plate to form patterns, wherein the patterns comprise marks, signs and the like. It should be noted that, when the plate is processed, a plurality of layered structures, such as a texture layer and a hardened layer, may be formed, and these layered structures may protect the pattern formed by screen printing, so as to prevent the pattern from being worn. The texture layer is formed on the board with the pattern, and further, the texture layer is formed on the board with the pattern, and the structural appearance characteristics of the board can be improved by arranging the texture layer, so that the first side of the board can present various appearance expression modes, for example, the board can have lines, textures or patterns with aesthetic characteristics. Specifically, the texture layer may be formed on the panel through a UV transfer process. It should be noted that the UV transfer printing process is a process for preparing a fine texture structure by using a phenomenon that liquid UV glue is cured under irradiation of ultraviolet light. Specifically, a UV flying disc machine or a pad transfer station or the like may be used to transfer the textured layer onto the second side of the sheet, cured and ready for use. And then, plating the required electroplated layer on the texture layer of the plate with the texture layer by using an electron gun or a magnetic control plating device. The electroplated layer can reflect the light transmitted by the first side of the plate, so that the texture layer can show a good appearance decoration effect. The electroplated layer includes at least one reflective film. It is noted that the reflective layer is a metal film.

Further, laminate the rete on the plating layer, specifically, the rete laminating deviates from on the side on the texture layer on the plating layer, because the rete has the required various colours that satisfy electronic equipment performance and appearance effect, then can satisfy electronic equipment's outward appearance demand through laminating the rete on the plating layer, and then can reduce or avoid realizing the outward appearance demand through printing ink many times printing in the correlation technique, can effectively reduce manufacturing cost in the preparation process of composite sheet, make this preparation method be adapted to large batch volume production demand, the rete management and control is effectual, can ensure the yield of composite sheet in performance test. Specifically, when the electronic device has a dark appearance requirement, such as: blue, black, etc., then the film may be selected to be a black film. When electronic equipment has light colour outward appearance demand, then the grey rete can be selected to the rete, laminates between the plating layer at the diaphragm simultaneously, can increase the one deck printing ink silk screen printing lid end on the side that the plating layer deviates from the texture layer. That is, the way of attaching the film layer can completely replace the ink printing process in the related art under the requirement of dark appearance. And under the light color appearance requirement, the printing ink printing times can be reduced by the film layer laminating mode, and only one printing ink printing is needed to be added before the film layer is laminated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 shows one of the flow charts of a method of making a composite panel according to one embodiment of the present application;

fig. 2 shows a second flow diagram of a method of making a composite panel according to an embodiment of the present application;

fig. 3 shows a third flow diagram of a method of making a composite panel according to an embodiment of the present application;

FIG. 4 illustrates a fourth flowchart of a method of making a composite panel according to an embodiment of the present application;

FIG. 5 shows a fifth flowchart of a method of making a composite panel according to an embodiment of the present application;

FIG. 6 shows a sixth flowchart of a method of making a composite panel according to an embodiment of the present application;

FIG. 7 illustrates a seventh flow diagram of a method of making a composite panel according to an embodiment of the present application;

fig. 8 shows an eighth flowchart of a method of making a composite panel according to an embodiment of the present application;

fig. 9 shows a schematic structural view of a composite plate in an embodiment of the present application.

Wherein, the correspondence between the reference numbers and the names of the components in fig. 9 is:

100 composite board, 101 substrate layer, 102 silk screen printing layer, 103 texture layer, 104 electroplating layer, 105 glue layer, 106 rete.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein.

The composite board provided in the embodiment of the present application is mainly used for electronic devices, including but not limited to electronic devices such as mobile phones, tablet computers, laptop computers, mobile computers, handheld game machines, and the like. Of course, the present invention is not limited to electronic devices, and may be applied to other devices requiring a composite board.

The method for manufacturing a composite board, the composite board 100, and the electronic device according to the embodiments of the present application are further described below with reference to the drawings.

Fig. 1 shows one of the flow charts of the method for manufacturing the composite board according to the embodiment of the present application.

An embodiment of the present application provides a method for manufacturing a composite board, including:

102, preparing a plate, wherein the plate comprises a first surface and a second surface;

104, performing silk-screen printing on the second surface of the plate to form a pattern;

step 106, forming a texture layer on the plate with the pattern;

step 108, electroplating the texture layer to form an electroplated layer;

and step 110, attaching the film layer to the electroplated layer to form the composite board.

Specifically, the plating layer may include an In/Sn layer, TiO₂Layer, NbO₂Layer, Nb₂O₃Layer, Nb₂O₂Layer, Nb₂O₅Layer, SiO₂Layer, ZrO₂Layers, and the like. The color of the plated layer depends on the desired color of the electronic device. The plate with the texture layer and the electroplated layer is protected by coating, so that the surface which does not need to be treated in subsequent work can be prevented from being polluted and scratched, and the like.

Further, laminate the rete on the plating layer, concretely, the rete laminating deviates from on the side on the texture layer on the plating layer, because the rete has the required various colours that satisfy electronic equipment performance and appearance effect, then can satisfy electronic equipment's outward appearance demand through laminating the rete on the plating layer, and then can reduce or avoid realizing the outward appearance demand through printing ink multiple printing in the correlation technique, can effectively reduce manufacturing cost in the preparation process of composite sheet, make this preparation method be adapted to large batch volume production demand, the rete management and control is effectual, can ensure the yield of composite sheet in performance test, optimize the processing procedure management and control, reach and promote the productivity, the effect of stability ability, also can reduce the price of product simultaneously. Particularly, the laminating machine can be adopted to complete the lamination between the diaphragm and the plate with the electroplated layer, so that the yield and the yield are greatly improved, and the price of a finished product is reduced.

Specifically, when the electronic device has a dark appearance requirement, such as: blue, black, etc., then the film may be selected to be a black film. When electronic equipment has light colour outward appearance demand, then the grey rete can be selected to the rete, laminates between the plating layer at the diaphragm simultaneously, can increase the one deck printing ink silk screen printing lid end on the side that the plating layer deviates from the texture layer. That is, the way of attaching the film layer can completely replace the ink printing process in the related art under the requirement of dark appearance. And under the light color appearance requirement, the printing ink printing times can be reduced by the film layer laminating mode, and only one printing ink printing is needed to be added before the film layer is laminated.

Fig. 2 shows a second flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 202, preparing a plate, wherein the plate comprises a first surface and a second surface;

step 204, performing silk-screen printing on the second surface of the plate to form a pattern;

step 206, forming a texture layer on the plate with the pattern;

step 208, electroplating the texture layer to form an electroplated layer;

step 210, coating an adhesive on at least one abutting surface of the film layer and the electroplated layer, wherein the abutting surfaces are close to each other;

step 212, pre-pressing the film layer and the electroplated layer to form the composite board.

In the embodiment of the present application, the specific steps of attaching the diaphragm to the electroplated layer to form the composite board are as follows: the film layer and the electroplated layer are provided with abutting surfaces close to each other, namely the film layer and the electroplated layer are respectively provided with corresponding abutting surfaces, namely the abutting surfaces are two. The film layer and the electroplated layer can be reliably connected through the adhesive, and the possible layering situation caused by weak connection performance between the film layer and the electroplated layer in the subsequent processing technology is prevented. And then, pre-pressing the film layer with the adhesive and the electroplated layer to form the composite board.

Specifically, the adhesive is OCA glue or hot melt glue. Oca (optical Clear adhesive) is used for special adhesives for gluing transparent optical elements such as lenses and the like. The adhesive has the characteristics of no color, transparency, light transmittance of more than 90 percent, good bonding strength, capability of being cured at room temperature or middle temperature, small curing shrinkage and the like. The hot melt adhesive is a plastic adhesive, the physical state of which changes along with the change of temperature within a certain temperature range, and the chemical property of which is unchanged, is nontoxic and tasteless, and belongs to an environment-friendly chemical product. The product is solid, so the product is convenient to package, transport and store, and has no solvent, pollution and toxicity; and the production process is simple, the added value is high, the bonding strength is high, the speed is high, and the like.

Fig. 3 shows a third flow chart of a method for manufacturing a composite board according to an embodiment of the present application.

step 302, preparing a plate, wherein the plate comprises a first surface and a second surface;

304, performing silk-screen printing on the second surface of the plate to form a pattern;

step 306, forming a texture layer on the board with the pattern;

step 308, electroplating the texture layer to form an electroplated layer;

step 310, coating an adhesive on at least one of the adjacent binding surfaces of the film layer and the electroplated layer;

in step 312, the film layer with the adhesive and the plating layer are subjected to a roll process.

In this application embodiment, carry out the concrete mode of pressfitting in advance for the roll-in processing to the panel that has binder, rete, plating layer, texture layer, make the binder between rete and the plating layer can be by even flattening for rete and plating layer can increase the laminating area as far as through the binder, can roll it through the running roller promptly, adjust through pressure, hardness isoparametric to the running roller, thereby can make and reach ideal laminating effect between rete and the plating layer. In addition, pre-pressing can be performed through rolling treatment, namely, the film layer and the plate are integrated, and meanwhile, the subsequent processes are convenient to perform. It is worth mentioning that the roller movement direction depends on the operation mode, so as to facilitate the production and the material taking.

Fig. 4 shows a fourth flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 402, preparing a plate, wherein the plate comprises a first surface and a second surface;

step 404, performing silk-screen printing on the second surface of the plate to form a pattern;

step 406, forming a texture layer on the plate with the pattern;

step 408, electroplating the texture layer to form an electroplated layer;

step 410, coating an adhesive on at least one of the adjacent binding surfaces of the film layer and the electroplated layer;

step 412, performing roll-in treatment on the film layer with the adhesive and the electroplated layer;

step 414, preparing a first mold and a second mold, and placing the rolled plate on the first mold;

and 416, closing the first mold and the second mold, wherein the temperature of the first mold and the temperature of the second mold are controlled to be 130-150 ℃ and the closing pressure is controlled to be 15-25 KG during the mold closing process, so as to press the film layer, the adhesive and the electroplating film.

In this application embodiment, carry out the secondary pressfitting to diaphragm and panel after the pressfitting in advance, the secondary pressfitting process specifically includes: first, a first mold and a second mold are prepared, and the first mold and the second mold may be selected from a steel mold or a silicone mold, wherein the first mold is located below the second mold. And (3) placing the rolled plate on a first mould, closing the first mould and a second mould, namely moving the second mould towards the first mould, and controlling the temperatures of the first mould and the second mould to be between 130 and 150 ℃ in the process of closing the moulds. On the premise that the temperatures of the first mold and the second mold meet the range, the temperature of the first mold and the temperature of the second mold may be equal or different. Further, the temperatures of the first mold and the second mold were 130 ℃, 135 ℃, 140 ℃, 145 ℃ and 150 ℃. Further, the clamping pressure is between 15KG and 25 KG. Specifically, the matched die pressure is 15KG, 18KG, 20KG, 25KG to can make the binder laminate with rete and plating layer better, promptly the binder can with fully bond between rete and the plating layer, and avoid appearing the bubble in bonding process and influence the bonding reliability.

Fig. 5 shows a fifth flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 502, preparing a plate, wherein the plate comprises a first surface and a second surface;

step 504, performing silk-screen printing on the second surface of the plate to form a pattern;

step 506, forming a texture layer on the board with the pattern;

step 508, electroplating the texture layer to form an electroplated layer;

step 510, coating an adhesive on at least one of the close attaching surfaces of the film layer and the electroplated layer;

step 512, performing rolling treatment on the film layer with the adhesive and the electroplated layer;

step 514, preparing a first mold and a second mold, and sequentially placing a silica gel pad and a glass plate on the first mold;

step 516, placing the rolled plate on a glass plate;

step 518, covering the shielding cloth on the plate with the binder;

and 520, closing the first mold and the second mold, wherein the temperature of the first mold and the temperature of the second mold are controlled to be 130-150 ℃ and the closing pressure is controlled to be 15-25 KG during the mold closing process, so as to press the film layer, the glue layer and the electroplating film.

In this application embodiment, in the compound die process, after preparing first mould and second mould, because first mould is used for placing panel, consequently can place silica gel pad and glass board on first mould in proper order, the silica gel pad is placed on first mould promptly, and the glass board is placed on the silica gel pad, and the panel after the roll-in is handled is placed on the glass board, and the glass board can provide the holding surface for panel, avoids directly influencing the roughness of composite sheet because the unevenness of holding surface. In addition, the silica gel pad provides the buffering surplus for glass board and composite sheet, and under the locking pressure, the composite sheet receives locking pressure and can take place to warp, because there may be some deviations in the roughness of each position department of composite sheet, can make each position of composite sheet all can receive effective pressfitting through setting up the silica gel pad, makes the laminating between rete and the plating layer more fully reliable in the composite sheet. Furthermore, the shielding cloth is covered on the board with the binder, so that the damage to the outer surface of the composite board in the mold closing process is avoided.

Fig. 6 shows a sixth flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 602, preparing a plate, wherein the plate comprises a first surface and a second surface;

step 604, performing silk-screen printing on the second surface of the plate to form a pattern;

step 606, forming a texture layer on the board with the pattern;

step 608, electroplating the texture layer to form an electroplated layer;

step 610, coating an adhesive on at least one abutting surface of the film layer and the electroplated layer, wherein the abutting surfaces are close to each other;

step 612, performing rolling treatment on the film layer with the adhesive and the electroplated layer;

step 614, preparing a first mold and a second mold, and sequentially placing a silica gel pad and a glass plate on the first mold;

step 616, placing the rolled plate on a glass plate;

step 618, covering the shielding cloth on the board with the binder;

step 620, closing the first mold and the second mold, wherein the temperature of the first mold and the temperature of the second mold are controlled to be 130-150 ℃ in the mold closing process, and the mold closing pressure is controlled to be 15-25 KG, so as to press the film layer, the glue layer and the electroplating film;

step 622, performing hot bending forming treatment on the plate subjected to die assembly treatment;

and 624, hardening the first surface of the hot-bending formed plate to form a hardened layer.

In the embodiment of the application, after the die assembly treatment, the hot bending forming treatment is carried out on the plate, so that the composite plate with a complex structure can be processed to adapt to different requirements. Specifically, the hot-bending forming process includes heating and baking the plate at a high temperature to soften the plate, thereby allowing press-forming. The hot bending forming process comprises an upper die and a lower die, wherein the temperature of the upper die is controlled to be greater than or equal to 130 ℃, less than or equal to 170 ℃, and preferably, the temperature of the upper die is 150 ℃. The temperature of the upper die is controlled to be more than or equal to 110 ℃ and less than or equal to 150 ℃, and preferably, the temperature of the upper die is 130 ℃. The temperature of the high-pressure baking tray is more than or equal to 330 ℃ and less than or equal to 370 ℃, and preferably, the temperature of the high-pressure baking tray is 350 ℃. It is noted that the second surface dyne value of the plate material is required to be within a range of 32-34 after the high pressure treatment.

Furthermore, the first surface of the plate after hot bending forming is hardened, namely the appearance surface of the plate is hardened, so that a hardened layer can be formed on the appearance surface of the plate, and the friction resistance of the composite plate can be improved by the hardened layer. Specifically, the hardening material constituting the hardened layer may be urethane acrylate with silicone resin and perfluoropolyether acrylate added. Further, a protective film may be provided to the composite board after photocuring by curtain coating a UV hardening liquid for standby.

Further, after the step of hardening the first surface of the plate subjected to hot bending forming to form a hardened layer, CNC machining can be performed on the hardened composite plate to remove leftover bits and pieces, and finally the required composite plate with the assembly matching size is obtained. Specifically, CNC machining generally refers to computer numerical control precision machining, CNC machining lathes, CNC machining milling machines, CNC machining boring and milling machines, and the like.

Fig. 7 shows a seventh flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 702, preparing a plate, wherein the plate comprises a first surface and a second surface;

step 704, performing silk-screen printing on the second surface of the plate to form a pattern;

step 706, performing offset printing treatment on the plate with the pattern;

step 708, forming a texture layer on the board with the pattern;

step 710, performing electroplating treatment on the texture layer to form an electroplated layer;

step 712, the film layer is attached to the electroplated layer to form a composite board.

In the embodiment of the present application, after the pattern is formed on the board and before the texture layer is formed on the board, the board having the pattern may be offset-printed, so that a color layer is formed on the board, so that the composite board has a desired color. Specifically, the color layer includes at least one layer of monochromatic ink, such as red, green, blue, etc., and when the color layer includes a plurality of layers of monochromatic inks of different colors, a color gradation effect can also be achieved.

Fig. 8 shows an eighth flowchart of a method for manufacturing a composite board according to an embodiment of the present application.

step 802, obtaining a plate formed by stacking a PC plate and a PMMA plate, wherein the PC plate comprises a second surface of the plate, and the PMMA plate comprises a first surface of the plate;

step 804, performing silk-screen printing on the second surface of the plate to form a pattern;

step 806, forming a texture layer on the plate with the pattern;

step 808, performing electroplating treatment on the texture layer to form an electroplated layer;

step 810, attaching the film layer to the electroplated layer to form the composite board.

In the embodiment of the application, the plate material can be a composite plate material formed by combining a PC plate and a PMMA plate. Specifically, the PC board and the PMMA board are stacked to form a board, the side surface of the PC board, which is far away from the PMMA board, forms a second surface of the board, and the side surface of the PMMA board, which is far away from the PC board, forms a first surface of the board. Specifically, PC, Polycarbonate, which is a tough thermoplastic resin Polycarbonate, has colorless transparency, heat resistance, impact resistance, and other characteristics, and has good mechanical properties. PMMA, namely Polymethyl Methacrylate, which is named as Polymethyl Methacrylate in the Chinese, commonly called organic glass, is the most excellent and relatively suitable variety of synthetic transparent materials so far, is not easy to generate sharp fragments when being crushed, and has better appearance and easy processing performance.

Embodiments of the second aspect of the present application further provide a composite plate 100, as shown in fig. 9, including a substrate layer 101, a texture layer 103, an electroplating layer 104 and a film layer 106, where the substrate layer 101 includes a first surface and a second surface opposite to each other, the texture layer 103 and the electroplating layer 104 are sequentially stacked on the second surface of the substrate layer 101, and the film layer 106 is attached to a side surface of the electroplating layer 104 away from the texture layer 103.

In this embodiment, composite sheet 100 includes base plate layer 101, texture layer 103, plating layer 104 and rete 106, and base plate layer 101 includes relative first face and second face, and texture layer 103 and plating layer 104 stack gradually locate the second face of base plate layer 101, and the second face of base plate layer 101 is the medial surface, and the first face of base plate layer 101 shows towards the user, is the outward appearance face. The texture layer 103 may improve the structural appearance of the panel, allowing the first side of the panel to exhibit a variety of topographical manifestations, such as lines, textures, or patterns that may be aesthetically characteristic. Specifically, the texture layer 103 may be formed on the plate material by a UV transfer process. It should be noted that the UV transfer printing process is a process for preparing a fine texture structure by using a phenomenon that liquid UV glue is cured under irradiation of ultraviolet light. Specifically, the texture layer 103 may be transferred onto the second side of the sheet using a UV-flash drive or a pad transfer station, and cured and ready for use. Next, the plate material having the texture layer 103 is coated with a desired plating layer 104 by using an electron gun or a magnetron plating apparatus. The electroplated layer 104 can reflect the light transmitted from the first side of the plate, so that the texture layer 103 can show a better appearance decoration effect. Plating layer 104 includes at least one reflective film. It is noted that the reflective layer is a metal film.

Further, the film layer 106 is attached to the side, deviating from the texture layer 103, of the electroplated layer 104, and the film layer 106 has various colors required for meeting the performance and appearance effect of the electronic device, so that the appearance requirement of the electronic device can be met by attaching the film layer 106 to the electroplated layer 104, further, the appearance requirement can be reduced or avoided by printing ink for multiple times in the related technology, the production cost can be effectively reduced in the preparation process of the composite board 100, the preparation method is suitable for the large-batch mass production requirement, the film layer 106 is good in management and control effect, and the yield of the composite board 100 in the performance test can be ensured. Specifically, when the electronic device has a dark appearance requirement, such as: blue, black, etc., then the film 106 may be selected to be a black film 106. When the electronic device has a light-colored appearance requirement, the gray film 106 can be selected as the film 106, and meanwhile, a layer of ink screen printing cover bottom can be added on the side of the electroplated layer 104 away from the texture layer 103 when the film is attached between the electroplated layers 104. That is, the film layer 106 can be attached in a manner that can completely replace the ink printing process in the related art under the requirement of a dark appearance. However, in the light appearance requirement, the number of ink printing times can be reduced by attaching the film layer 106, and only one additional ink printing is required before attaching the film layer 106.

In one specific embodiment, further, as shown in fig. 9, composite plate 100 further includes a glue layer 105, glue layer 105 being disposed between plating layer 104 and film layer 106.

In the embodiment of the present application, composite plate 100 further includes a glue layer 105, and glue layer 105 is disposed between plating layer 104 and film layer 106. During the pre-lamination process, the adhesive existing between the film 106 and the plating layer 104 is squeezed and uniformly applied between the film 106 and the plating layer 104 to form the glue layer 105, and the glue layer 105 can reliably connect the film 106 and the plating layer 104, thereby preventing the delamination which may exist due to the weak connection performance between the film 106 and the plating layer 104 in the subsequent processing process. Specifically, the glue layer 105 includes OCA glue or hot melt glue. Oca (optical Clear adhesive) is used for special adhesives for gluing transparent optical elements such as lenses and the like. The adhesive has the characteristics of no color, transparency, light transmittance of more than 90 percent, good bonding strength, capability of being cured at room temperature or middle temperature, small curing shrinkage and the like. The hot melt adhesive is a plastic adhesive, the physical state of which changes along with the change of temperature within a certain temperature range, and the chemical property of which is unchanged, is nontoxic and tasteless, and belongs to an environment-friendly chemical product. The product is solid, so the product is convenient to package, transport and store, and has no solvent, pollution and toxicity; and the production process is simple, the added value is high, the bonding strength is high, the speed is high, and the like.

In a specific embodiment, further as shown in fig. 9, composite board 100 further includes a silk-screen layer 102, where silk-screen layer 102 is disposed between substrate layer 101 and texture layer 103.

In the embodiment of the present application, a silk-screen layer 102 is disposed between a substrate layer 101 and a texture layer 103, and a pattern is disposed on the silk-screen layer 102.

In one specific embodiment, further, the composite board 100 further includes a hardened layer disposed on the first surface of the substrate layer 101.

In the embodiment of the present application, the first surface of the substrate layer 101 is hardened, that is, the appearance surface of the substrate layer 101 is hardened, so that a hardened layer can be formed on the appearance surface of the substrate layer 101, and the hardened layer can increase the friction resistance of the composite board 100. Specifically, the hardening material constituting the hardened layer may be urethane acrylate with silicone resin and perfluoropolyether acrylate added. Further, a protective film may be provided to the composite board 100 after photo-curing by shower coating a UV hardening liquid for standby.

In a specific embodiment, the film layer 106 is further a PC film layer or a PET film layer.

In the embodiment of the present application, the film 106 may be a PC film, i.e., Polycarbonate, which is a tough thermoplastic resin Polycarbonate, and has colorless, transparent, heat-resistant, impact-resistant, and other characteristics, and has good mechanical properties. The film 106 may also be a PET film, namely Polyethylene terephthalate, which is a chinese name Polyethylene terephthalate, having excellent electrical insulation properties, creep resistance, and fatigue resistance. PMMA, namely Polymethyl Methacrylate, which is named as Polymethyl Methacrylate in the Chinese, commonly called organic glass, is the most excellent and relatively suitable variety of synthetic transparent materials so far, is not easy to generate sharp fragments when being crushed, and has better appearance and easy processing performance.

In a specific embodiment, the composite panel is prepared by a process comprising:

1. panel printing LOGO

The product can adopt screen printing mirror surface silver LOGO. LOGO color depends on the desired color;

and (5) airing and baking for later use.

2. Offset color

And (4) offset printing the LOGO product after silk printing by using a coating offset printing device to obtain the required color, and curing for later use.

3. UV texture transfer

And (4) transferring the UV textures of the product with the offset printing color by using a UV flying disc machine or a flat plate machine transfer printing machine, and curing for later use.

4. Electroplating of

And (5) plating the UV texture product after transfer printing with a required plating layer by using an electron gun and a magnetic control film plating device. The color effect of the plating layer depends on the color required by the product, the coating is reserved after protection, and the original protective film on the plate cannot be replaced.

5. Laminated film

And (5) tearing off the protective film of the plated product, and fixing the product on a film pasting machine table to stabilize the product.

Wherein, regarding the first laminating embodiment mode of 2.5D composite sheet:

1) the attaching size is as follows: the full plate of 8 out 1 and 4 out 1 was applied 380 x 480 mm. Can be adjusted according to the parameters of the adjusting machine table and the roller. The composite board may have a thickness of: 0.65mm-0.8 mm.

2) The product uses the PC or PET black film of OCA glue or hot melt adhesive coating, reaches ideal laminating effect through parameters such as the pressure of adjustment running roller, hardness. The direction of motion of the roller depends on the operation mode, so that the material is convenient to produce and take.

3) Film material for use in the method

The film layer is a PC black film or a PET black film, the thickness of the film layer is 0.05mm-0.3mm, and OCA optical glue or hot melt adhesive is coated on the film layer incoming material.

4) Physical properties required for the film layer

Physical properties: the surface dyne value should reach the test value of 32-36.

Mechanical properties: the tensile strength is required to reach 60MPa according to the ISO527 standard of a test mode, and the bending strength is required to reach 92MPa according to the ISO178 standard of a test method.

Temperature resistance: the Vicat softening point is required to reach more than 148 ℃ according to the ISO306 standard of a test method.

Flame retardant property: the fire-retardant rating of the fire protection reaches VTM0, V0 rating according to the test European Union method.

5) Physical properties required for the binder

The OCA optical adhesive or hot melt adhesive used by the method comprises the following steps: the glue transmittance needs to be more than 90%. The hot melt adhesive is under 4um thickness circumstances, and the transmissivity reaches 90%, and the glue system is: the proportion of polyolefin in the glue is 20 percent in the PE hot melt adhesive system.

Wherein, regarding the second laminating embodiment mode of 3D composite sheet:

1) and (3) fixing the plate with the electroplated layer on a laminating machine table, and then uniformly dispensing the plate in a strip shape. The fit size in this embodiment: the full plate of 8 and 6 out of 1 was applied 380 x 480 mm. Can be adjusted according to the parameters of the adjusting machine table and the roller.

Wherein, the composite board thickness can be: 0.65mm-0.8 mm.

2) After the film layers are precisely aligned and pre-laminated, the glue is uniformly rolled through the rollers, and a complete laminating state is achieved.

3) The film material used in the method is as follows:

the material is as follows: a black film of PC.

Film thickness: 0.05mm-0.3 mm.

Physical properties: the surface dyne value is required to reach the test value of 38-46, and can be adjusted as required by a processing method.

4) Physical properties required for the binder

The hot melt adhesive glue mainly comprises the following components: polyolefin resin having a relative density of 1, a solids content wt% of 24-28, a pH of 9-11, a viscosity mpa-s: 1-200, the melting point is 80 ℃, and the curing condition needs to meet the test requirements of conventional adhesive force and the like; the required pull force test is: 30N-36N, and the thickness of the hot melt adhesive film is 7 mu m-15 mu m.

5) Requirement of laminating machine

The flat plate laminating machine is suitable for coating hot melt adhesive laminating products. The machine is characterized in that: the flat laminating of vacuum, need to heat 140 ℃ with the mechanical equipment platform, the evacuation to 20KG pressure pressurization laminating, material: 0.05mm of PC black film, and the thickness of the hot melt adhesive film is 7-15 um.

Laminating the machine table: vacuum flat laminating machine.

Fitting parameters: and (3) vacuum reaching delayed fitting: 5 seconds, vacuum delay fitting: 10 seconds, keep fit: 60 seconds, vacuum breaking and attaching: 1 second, sticking rising delay time: 5 seconds, temperature: 140 degrees.

6) High pressure forming

And heating and baking the product at high temperature to soften the PC layer and the PMMA layer, and then carrying out compression molding.

Temperature of the die: the temperature of the upper die is 150 +/-20 ℃, and the temperature of the lower die is 130 +/-20 ℃. Temperature of the high-pressure baking tray: 350 +/-20 ℃. Desired PC surface dyne value after high pressure: 32-34.

7) Surface spray coating hardening liquid

And tearing off the surface protective film of the product after the bonding and curing, coating UV hardening liquid by spraying, and coating the protective film for later use after photocuring.

6. CNC shaping

And (4) CNC molding the products (2.5D composite boards and 3D composite boards) after the curtain coating according to the required size.

Embodiments of the third aspect of the present application also provide an electronic device including a composite board obtained by the method for preparing a composite board as provided in the first aspect. Alternatively, an electronic device comprises a composite panel as provided in the second aspect.

The electronic device provided by the embodiment of the present application includes the composite board mentioned in the foregoing embodiment, or the composite board prepared by the preparation method in the foregoing embodiment, so that the electronic device has all the beneficial effects of the composite board or the preparation method, and details are not described herein again.

It is noted that, in the present application, the term "plurality" means two or more unless explicitly defined otherwise. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship. In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A method of making a composite panel, comprising:

preparing a sheet material, wherein the sheet material comprises a first surface and a second surface;

forming a texture layer on the board with the pattern;

electroplating the texture layer to form an electroplated layer;

and attaching a film layer to the electroplated layer to form the composite board.

2. The method for preparing a composite plate according to claim 1, wherein the step of attaching the film to the plating layer to form the composite plate comprises:

coating an adhesive on at least one abutting surface of the film layer and the electroplated layer, wherein the abutting surfaces are close to each other;

pre-pressing the film layer and the electroplated layer to form the composite board; wherein, the binder is OCA glue or hot melt adhesive.

3. The method for preparing a composite board according to claim 2, wherein the step of pre-laminating the film layer and the electroplated layer specifically comprises:

and carrying out rolling treatment on the film layer with the adhesive and the electroplated layer.

4. The method of manufacturing a composite panel according to claim 3, further comprising:

preparing a first die and a second die, and placing the rolled plate on the first die;

and closing the first mold and the second mold, wherein the temperature of the first mold and the second mold is controlled to be between 130 and 150 ℃ and the closing pressure is controlled to be between 15 and 25KG in the mold closing process, so as to press the film layer, the adhesive and the electroplated film.

5. The method for preparing a composite sheet according to claim 4, wherein the step of placing the rolled sheet on the first mold comprises:

placing a silica gel pad and a glass plate on the first mould in sequence;

placing the rolled plate on the glass plate;

covering the shielding cloth on the plate with the binder.

6. The method of manufacturing a composite panel according to claim 4, further comprising:

carrying out hot bending forming treatment on the plate subjected to the die assembly treatment;

and hardening the first surface of the plate subjected to the hot bending forming to form a hardened layer.

7. A method of manufacturing a composite board according to any of claims 1 to 6,

between the step of forming a pattern by silk-screen printing on the second surface of the plate and the step of forming a texture layer on the plate with the pattern, the method further comprises the following steps:

carrying out offset printing treatment on the plate with the pattern; and/or the step of preparing the plate specifically comprises:

obtaining the plate formed by stacking a PC plate and a PMMA plate, wherein the PC plate comprises a second surface of the plate, and the PMMA plate comprises a first surface of the plate.

8. A composite panel, comprising:

a substrate layer comprising opposing first and second faces;

the texture layer and the electroplated layer are sequentially stacked on the second surface of the substrate layer;

and the film layer is attached to one side surface of the electroplated layer, which deviates from the texture layer.

9. A composite board according to claim 8, further comprising:

the glue layer is arranged between the electroplated layer and the film layer; and/or

The silk-screen layer is arranged between the substrate layer and the texture layer; and/or

And the hardening layer is arranged on the first surface of the substrate layer.

10. An electronic device, comprising: a composite board obtained by the method for producing a composite board according to any one of claims 1 to 7; or using a composite board according to claim 8 or 9.