CN117405239A - Modbus protocol-based thermal infrared imager and system imaging method thereof - Google Patents
Modbus protocol-based thermal infrared imager and system imaging method thereof Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/48—Thermography; Techniques using wholly visual means
- G01J5/485—Temperature profile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/025—Interfacing a pyrometer to an external device or network; User interface
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/03—Arrangements for indicating or recording specially adapted for radiation pyrometers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
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- H—ELECTRICITY
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- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
- H04L12/40—Bus networks
- H04L2012/40208—Bus networks characterized by the use of a particular bus standard
- H04L2012/40228—Modbus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention discloses a Modbus protocol-based thermal infrared imager and a system imaging method thereof, comprising the following steps: the device comprises a clock source CLK, a RESET interface RESET, an MCU module, an infrared array temperature measuring probe, an IIC interface, a serial port-to-485 module and a 485 interface; the clock source CLK is used for generating an external clock signal and providing a clock for the MCU module, and the MCU module acquires and stores temperature matrix data detected by the infrared array temperature measuring probe through the IIC interface; when the PC computer is used as a Modbus master station to prepare to read data, the MCU module is informed by writing a register flag bit to store the temperature matrix data stored in the memory array into a Modbus slave station register in batches, the PC computer uses the Modbus master station to command batch reading, and an interpolation method, a table look-up method and a scaling method are adopted to convert the temperature matrix data into 24-bit true-color two-dimensional temperature cloud pictures for display; according to the invention, thermal imaging data are transmitted through a Modbus network, and algorithm correction and picture display are carried out in a PC, so that the application of the thermal infrared imager in the Modbus network is realized.
Description
Technical Field
The invention relates to the technical field of thermal infrared imagers, in particular to a Modbus protocol-based thermal infrared imager and a system imaging method thereof.
Background
The thermal infrared imager is equipment for converting an image of temperature distribution of a target object into a visible image by utilizing an infrared thermal imaging technology through infrared radiation detection of the target object, signal processing, photoelectric conversion and other means, and is widely applied to a plurality of fields such as military, electric power, industrial automation, inspection and quarantine, security monitoring, forest fire prevention, fire rescue, police law enforcement, automatic driving, intelligent home, artificial intelligence and the like.
Because the thermal infrared imager has large image data volume and high real-time requirement, the communication of the thermal infrared imager in the market at present mainly comprises 4G/5G, cameraLink, USB, HDMI, LAN, optical fibers, PAL and the like, and the thermal infrared imager uses CameraLink, USB, HDMI, LAN, SDI and PAL interface communication as disclosed in patent application with publication number CN116839742A, and the image acquisition module is used for acquiring the image data acquired by the thermal infrared imager and converting the image data into optical fiber signals for output as disclosed in patent application with publication number CN 116320328A. Thus, the method cannot be used in a small low-speed industrial network of the Modbus protocol, and limits the application range of the thermal infrared imager. Therefore, how to design a thermal infrared imager which is convenient and practical on an industrial automation production line and can be collected and transmitted through a Modbus network is a technical problem which needs to be solved urgently.
Disclosure of Invention
In view of the above, the invention provides a thermal infrared imager based on the Modbus protocol and a system imaging method thereof, so as to solve the problem that the conventional thermal infrared imager cannot be used in a small industrial network of the Modbus protocol.
The technical scheme of the invention is realized as follows: in one aspect, the invention provides a Modbus protocol-based thermal infrared imager, which comprises a clock source CLK, a RESET interface RESET, an MCU module, an infrared array temperature measuring probe, an IIC interface, a serial-to-485 module and a 485 interface;
the clock source CLK is electrically connected with the MCU module and is used for generating an external clock signal and sending the external clock signal into the MCU module;
the RESET interface RESET is electrically connected with the MCU module and is used for changing the state of a RESET signal to RESET the MCU module when power is on or abnormal;
the infrared array temperature measuring probe is electrically connected with the IIC interface and is used for receiving the temperature of infrared light generated by an external heat source and converting the temperature into temperature matrix data through the infrared array temperature measuring probe;
the IIC interface is electrically connected with the MCU module and is used for the MCU module to read temperature matrix data through the IIC interface in an IIC communication command mode and send the temperature matrix data into the MCU module;
the serial interface is electrically connected with the MCU module and is used for enabling a PC computer to serve as a Modbus master station to send a command from the USB-to-485 module to the MCU module through the serial-to-485 module and the serial interface through the 485 interface, the MCU module serves as a Modbus slave station and sends Modbus slave station response data from the serial interface to the PC computer through the serial-to-485 module through the 485 interface and the USB-to-485 module;
the serial port-to-485 module is electrically connected with the serial interface and is used for converting a serial port TTL signal of the serial interface into a 485 signal;
the 485 interface is electrically connected with the USB-to-485 module and is used for carrying out data communication on the 485 interface and a Modbus master station at the PC computer end through the USB-to-485 module, so that the PC computer can obtain thermal imaging data, and the temperature matrix data is converted into 24-bit true color two-dimensional temperature cloud pictures for display through an interpolation method, a table look-up method and a scaling method.
Preferably, the MCU module comprises a PLL phase-locked loop unit, a CPU system and a Modbus slave control unit; the PLL is electrically connected with the clock source CLK and the CPU system and is used for receiving the clock source CLK signal, raising the frequency of the clock source signal and sending an up-conversion signal to the CPU system;
the CPU system is electrically connected with the Modbus slave control unit and is used for receiving and analyzing a command sent by the PC computer as a master station through the Modbus slave control unit, and simultaneously sending the internal register data of the CPU system to the PC computer through the Modbus slave control unit according to a Modbus protocol.
Preferably, the CPU system comprises an embedded system, a TIMER controller, a UART controller, an IIC controller and a RAM memory;
the TIMER controller, the UART controller, the IIC controller and the RAM memory transmit information with the embedded system through an internal bus;
the TIMER controller is used for generating a time sequence according to the serial port baud rate;
the UART controller exchanges information with the embedded system through an internal bus, receives and analyzes external serial port TTL electric signals, and changes output data into serial port TTL electric signals to be output according to the serial port baud rate;
the IIC controller exchanges information with the embedded system through an internal bus, receives external IIC electric signals, analyzes data, and changes the output data into IIC electric signals to be output;
the RAM memory is used for providing an address space for running a program and an address space of a Modbus register;
the functions of the CPU system and the Modbus slave control unit are realized by C language codes on MCU hardware;
preferably, the MCU module hardware is STM32F407VET6 model and compiled through using KeiluVision 5 software.
On the other hand, the invention provides a system imaging method of the thermal infrared imager based on the Modbus protocol; the method comprises the following steps:
s1, changing a RESET signal state when power is on or abnormal, and resetting an MCU module through a RESET interface RESET;
s2, a CPU system in the MCU module sends a temperature matrix data reading command to the infrared array temperature measuring probe through the IIC interface, and the infrared array temperature measuring probe responds and uploads the temperature matrix data reading command to the CPU system according to the opposite path and temporarily stores the temperature matrix data reading command in an internal register;
s3, when the PC computer is used as a Modbus master station to prepare to read data, the MCU module is informed by writing a register flag bit to store temperature matrix data stored in the memory array into a Modbus slave station register in batches, and the PC computer uses a Modbus master station command to read in batches and stores the temperature matrix data into a two-dimensional array of M rows and N columns;
s4, creating a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by the PC computer, and filling the original two-dimensional array of M rows and N columns into the two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by adopting an interpolation method;
s5, changing the two-dimensional array temperature data of (M-1) x 10 rows (N-1) x 10 columns into a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns of 16-system colors according to a 24-bit true-color 16-system color comparison table;
s6, sequentially storing the 16-system color two-dimensional arrays of (M-1) x 10 rows (N-1) x 10 columns in a one-dimensional array of (M-1) x 10 x (N-1) x 10 elements according to the row sequence, and storing the two-dimensional arrays in a PC according to the requirement of a BMP format to form a temperature cloud picture;
s7, reducing and displaying the BMP-format temperature cloud picture in a computer picture browser, improving the precision, and forming the temperature cloud picture dynamic video if continuously playing a plurality of stored pictures.
Compared with the prior art, the Modbus protocol-based thermal infrared imager and the system imaging method thereof have the following beneficial effects:
the Modbus communication function is integrated in the thermal infrared imager, so that the acquisition of the Modbus network infrared temperature cloud image is realized;
the method breaks through the problem that the register is limited in the process of transmitting a large amount of data by using the Modbus network in a batch reading mode;
the temperature matrix data is changed into a two-dimensional temperature cloud picture by adopting an interpolation method, a table lookup method and a scaling method, so that the display accuracy is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of a Modbus protocol-based thermal infrared imager of the present invention;
FIG. 2 is a block diagram of an MCU system of the present invention;
fig. 3 is a flowchart of the Modbus protocol-based thermal infrared imager and the system imaging method thereof according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will clearly and fully describe the technical aspects of the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
1-2, the thermal infrared imager based on the Modbus protocol comprises a clock source CLK, a RESET interface RESET, an MCU module, an infrared array temperature measuring probe, an IIC interface, a serial port-to-485 module and a 485 interface;
the clock source CLK is electrically connected with the MCU module and is used for generating an external clock signal and sending the external clock signal into the MCU module;
the RESET interface RESET is electrically connected with the MCU module and is used for changing the state of a RESET signal to RESET the MCU module when power is on or abnormal;
the infrared array temperature measuring probe is electrically connected with the IIC interface and is used for receiving the temperature of infrared light generated by an external heat source and converting the temperature into temperature matrix data through the infrared array temperature measuring probe;
the IIC interface is electrically connected with the MCU module and is used for the MCU module to read temperature matrix data through the IIC interface in an IIC communication command mode and send the temperature matrix data into the MCU module;
the serial interface is electrically connected with the MCU module and is used for enabling a PC computer to serve as a Modbus master station to send a command from the USB-to-485 module to the MCU module through the serial-to-485 module and the serial interface through the 485 interface, the MCU module serves as a Modbus slave station and sends Modbus slave station response data from the serial interface to the PC computer through the serial-to-485 module through the 485 interface and the USB-to-485 module;
the serial port-to-485 module is electrically connected with the serial interface and is used for converting a serial port TTL signal of the serial interface into a 485 signal;
the 485 interface is electrically connected with the USB-to-485 module and is used for carrying out data communication on the 485 interface and a Modbus master station at the PC computer end through the USB-to-485 module, so that the PC computer can obtain thermal imaging data, and the temperature matrix data is converted into 24-bit true color two-dimensional temperature cloud pictures for display through an interpolation method, a table look-up method and a scaling method.
The device adopts the MCU module, the serial port-485 module and the infrared array temperature measuring probe to realize an infrared thermal imager based on the Modbus protocol, integrates the function of a Modbus communication slave station, is convenient for a Modbus network to realize infrared temperature cloud image acquisition, converts temperature matrix data into 24-bit true-color two-dimensional temperature cloud images for display through an interpolation method, a table lookup method and a scaling method, and improves the display precision of the two-dimensional temperature cloud images; through design, simulation and verification, a modularized product is formed, rapid transplanting among different platforms can be realized, and the product development process is accelerated.
The MCU module comprises a PLL (phase locked loop) unit, a CPU (central processing unit) system and a Modbus slave control unit; the PLL is electrically connected with the clock source CLK and the CPU system and is used for receiving the clock source CLK signal, raising the frequency of the clock source signal and sending an up-conversion signal to the CPU system;
the CPU system is electrically connected with the Modbus slave control unit and is used for receiving and analyzing a command sent by the PC computer as a master station through the Modbus slave control unit, and simultaneously sending the internal register data of the CPU system to the PC computer through the Modbus slave control unit according to a Modbus protocol;
the clock source CLK provides a passive clock for the PLL unit, selects 25MHz, and sends the clock source CLK to the PLL circuit control end of the PLL unit in the MCU module; the PLL phase-locked loop unit receives the 25MHz clock provided by the clock source CLK and raises the output clock frequency to 168MHz by the frequency division factor within the PLL phase-locked loop unit PLL.
The serial port-to-485 module is realized by hardware composed of a MAX3485 chip and peripheral electronic components thereof, and the infrared array temperature measurement probe is realized by hardware composed of an MLX90640 chip and peripheral electronic components thereof.
The CPU system comprises an embedded system, a TIMER controller, a UART controller, an IIC controller and a RAM memory; the TIMER controller, the UART controller, the IIC controller and the RAM memory transmit information with the embedded system through an internal bus; the TIMER controller is used for generating a time sequence according to the serial port baud rate; the UART controller exchanges information with the embedded system through an internal bus, receives and analyzes external serial port TTL electric signals, and changes output data into serial port TTL electric signals to be output according to the serial port baud rate; the IIC controller exchanges information with the embedded system through an internal bus, receives external IIC electric signals, analyzes data, and changes the output data into IIC electric signals to be output; the RAM memory is used for providing an address space for running a program and an address space of a Modbus register; and the functions of the CPU system and the Modbus slave control unit are realized by C language codes on MCU hardware.
The MCU hardware was compiled using STM32F407VET6 from ST company using Keil uVision 5 software.
According to the Modbus thermal infrared imager, an MCU module, a serial port-to-485 module and an infrared array temperature measuring probe are adopted to realize the thermal infrared imager based on the Modbus protocol, the Modbus communication slave station function is integrated in the device, the Modbus network is convenient to realize infrared temperature cloud image acquisition, temperature matrix data are converted into 24-bit true-color two-dimensional temperature cloud images for display through an interpolation method, a table lookup method and a scaling method, and the display precision of the two-dimensional temperature cloud images is improved; through design, simulation and verification, a modularized product is formed, rapid transplanting among different platforms can be realized, and the product development process is accelerated.
In a second embodiment, a system imaging method of a Modbus protocol-based thermal infrared imager is provided, which adopts the Modbus protocol-based thermal infrared imager as described in embodiment one, and the method includes the following steps:
s1, changing a RESET signal state when power is on or abnormal, and resetting an MCU module through a RESET interface RESET;
s2, a CPU system in the MCU module sends a temperature matrix data reading command to the infrared array temperature measuring probe through the IIC interface, and the infrared array temperature measuring probe responds and uploads the temperature matrix data reading command to the CPU system according to the opposite path and temporarily stores the temperature matrix data reading command in an internal register;
s3, when the PC computer is used as a Modbus master station to prepare to read data, the MCU module is informed by writing a register flag bit to store temperature matrix data stored in the memory array into a Modbus slave station register in batches, and the PC computer uses a Modbus master station command to read in batches and stores the temperature matrix data into a two-dimensional array of M rows and N columns;
s4, creating a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by the PC computer, and filling the original two-dimensional array of M rows and N columns into the two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by adopting an interpolation method;
s5, changing the two-dimensional array temperature data of (M-1) x 10 rows (N-1) x 10 columns into a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns of 16-system colors according to a 24-bit true-color 16-system color comparison table;
s6, sequentially storing the 16-system color two-dimensional arrays of (M-1) x 10 rows (N-1) x 10 columns in a one-dimensional array of (M-1) x 10 x (N-1) x 10 elements according to the row sequence, and storing the two-dimensional arrays in a PC according to the requirement of a BMP format to form a temperature cloud picture;
s7, reducing and displaying the BMP-format temperature cloud picture in a computer picture browser, improving the precision, and forming the temperature cloud picture dynamic video if continuously playing a plurality of stored pictures.
The PC computer uses Modbus master station commands to read in batches, namely the PC computer writes a digital 1 command into a register with the address of 0000H according to the 06 commands of Modbus protocol, a USB interface is used for transmitting the digital 1 command into an MCU module through a USB interface-485 module, a serial interface-485 module and a serial interface, a CPU system in the MCU module receives the commands through a Modbus slave control unit, the first 96 data of temperature matrix data temporarily stored in the internal register are stored into the register with the address of 0001H-0060H, the PC computer reads 96 register data once according to the 03 commands of Modbus protocol, if the temperature matrix data is greater than 96, the PC computer writes digital 2 into the register with the address of 0000H again, the MCU module stores the 97 th to 192 th data into the register with the address of 0001H-0060H, and the PC computer reads 96 register data once according to the 03 commands of Modbus protocol, and so on.
The interpolation method is that a PC computer firstly subtracts the 1 st data and the 2 nd data in the 1 st row of the two-dimensional array of M rows and N columns, then takes absolute value and divides by 9 to obtain increasing and decreasing gradient values between the two data, if the 1 st data is smaller than the 2 nd data, 9 data are inserted after the 1 st data, each data is added with 1 gradient value on the basis of the previous data, if the 1 st data is larger than the 2 nd data, each data is subtracted with 1 gradient value on the basis of the previous data, and then the operations are analogized.
The table look-up method is to replace the temperature data of the two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns with the 16-system data of the blue corresponding to the lowest temperature data and the 16-system data of the red corresponding to the highest temperature data through the 16-system color comparison table of 24 true colors, and replace the middle temperature data with the 16-system data in the color comparison table sequentially from the blue to the red according to the temperature, and finally the two-dimensional array of the 16-system colors of (M-1) x 10 rows (N-1) x 10 columns is obtained.
The BMP format is to add the first 54 bytes of BMP head bytes of 0X42,0X4D before the one-dimensional array.
As shown in fig. 3, after the MCU module is reset, the MCU collects the temperature detected by the infrared array temperature probe, the PC computer reads the temperature data in batches, then the PC computer fills the data by interpolation, then the temperature data is changed into 24-bit true color data by table look-up, then the PC computer adds the header byte in BMP format, changes the color data into temperature cloud picture, finally the picture browser is used to shrink the picture and continuously display the dynamic temperature cloud picture.
The system imaging method of the Modbus protocol-based thermal infrared imager is completed by adopting a standard C language, a modularized design method is adopted, and an MCU module, a serial port-to-485 module and an infrared array temperature measuring probe are used, so that the Modbus network infrared temperature matrix acquisition is realized, the temperature matrix data are converted into 24-bit true-color two-dimensional temperature cloud picture display, and the display precision of the two-dimensional temperature cloud picture is improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (8)
1. An infrared thermal imager based on Modbus protocol mainly comprises a clock source CLK, a RESET interface RESET, an MCU module, a serial interface, a serial port-to-485 module and a 485 interface;
the clock source CLK is electrically connected with the MCU module and is used for generating an external clock signal and sending the external clock signal into the MCU module;
the RESET interface RESET is electrically connected with the MCU module and is used for changing the state of a RESET signal to RESET the MCU module when power is on or abnormal;
the method is characterized in that: the infrared array temperature measuring probe is characterized by also comprising an infrared array temperature measuring probe and an IIC interface;
the infrared array temperature measuring probe is electrically connected with the IIC interface and is used for receiving infrared light generated by an external heat source and converting the infrared light into temperature matrix data through the infrared array temperature measuring probe;
the IIC interface is electrically connected with the MCU module and is used for the MCU module to read temperature matrix data through the IIC interface in an IIC communication command mode and send the temperature matrix data into the MCU module;
the serial interface is electrically connected with the MCU module and is used for enabling a PC computer to serve as a Modbus master station to send a command from the USB-to-485 module to the MCU module through the serial-to-485 module and the serial interface through the 485 interface, the MCU module serves as a Modbus slave station and sends Modbus slave station response data from the serial interface to the PC computer through the serial-to-485 module through the 485 interface and the USB-to-485 module;
the serial port-to-485 module is electrically connected with the serial interface and is used for converting a serial port TTL signal of the serial interface into a 485 signal;
the 485 interface is electrically connected with the USB-to-485 module and is used for carrying out data communication on the 485 interface and a Modbus master station at the PC computer end through the USB-to-485 module, so that the PC computer can obtain thermal imaging data, and the temperature matrix data is converted into 24-bit true color two-dimensional temperature cloud pictures for display through an interpolation method, a table look-up method and a scaling method.
2. The Modbus protocol based thermal infrared imager of claim 1, wherein: the MCU module comprises a PLL (phase locked loop) unit, a CPU (central processing unit) system and a Modbus slave control unit;
the PLL is electrically connected with the clock source CLK and the CPU system and is used for receiving the clock source CLK signal, raising the frequency of the clock source signal and sending an up-conversion signal to the CPU system;
the CPU system is electrically connected with the Modbus slave control unit and is used for receiving and analyzing a command sent by the PC computer as a master station through the Modbus slave control unit, and simultaneously sending the internal register data of the CPU system to the PC computer through the Modbus slave control unit according to a Modbus protocol.
3. The Modbus protocol based thermal infrared imager as set forth in claim 2, wherein:
the CPU system comprises an embedded system, a TIMER controller, a UART controller, an IIC controller and a RAM memory;
the TIMER controller, the UART controller, the IIC controller and the RAM memory transmit information with the embedded system through an internal bus;
the TIMER controller is used for generating a time sequence according to the serial port baud rate;
the UART controller exchanges information with the embedded system through an internal bus, receives and analyzes external serial port TTL electric signals, and changes output data into serial port TTL electric signals to be output according to the serial port baud rate;
the IIC controller exchanges information with the embedded system through an internal bus, receives external IIC electric signals, analyzes data, and changes the output data into IIC electric signals to be output;
the RAM memory is used for providing an address space for running a program and an address space of a Modbus register;
and the functions of the CPU system and the Modbus slave control unit are realized by C language codes on MCU hardware.
4. A method of imaging a Modbus protocol based thermal infrared imager system as defined in any one of claims 1 to 3, wherein: the method comprises the following steps:
s1, changing a RESET signal state when power is on or abnormal, and resetting an MCU module through a RESET interface RESET;
s2, a CPU system in the MCU module sends a temperature matrix data reading command to the infrared array temperature measuring probe through the IIC interface, and the infrared array temperature measuring probe responds and uploads the temperature matrix data reading command to the CPU system according to the opposite path and temporarily stores the temperature matrix data reading command in an internal register;
s3, when the PC computer is used as a Modbus master station to prepare to read data, the MCU module is informed by writing a register flag bit to store temperature matrix data stored in the memory array into a Modbus slave station register in batches, and the PC computer uses a Modbus master station command to read in batches and stores the temperature matrix data into a two-dimensional array of M rows and N columns;
s4, creating a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by the PC computer, and filling the original two-dimensional array of M rows and N columns into the two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns by adopting an interpolation method;
s5, changing the two-dimensional array temperature data of (M-1) x 10 rows (N-1) x 10 columns into a two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns of 16-system colors according to a 24-bit true-color 16-system color comparison table;
s6, sequentially storing the 16-system color two-dimensional arrays of (M-1) x 10 rows (N-1) x 10 columns in a one-dimensional array of (M-1) x 10 x (N-1) x 10 elements according to the row sequence, and storing the two-dimensional arrays in a PC according to the requirement of a BMP format to form a temperature cloud picture;
s7, reducing and displaying the BMP-format temperature cloud picture in a computer picture browser, improving the precision, and forming the temperature cloud picture dynamic video if continuously playing a plurality of stored pictures.
5. The system imaging method of a Modbus protocol-based thermal infrared imager according to claim 4, wherein the step S3 specifically includes:
the PC computer uses Modbus master station commands to read in batches, namely the PC computer writes a digital 1 command into a register with the address of 0000H according to the 06 commands of Modbus protocol, a USB interface at the PC computer end is transmitted to the MCU module through a USB interface-485 module, a serial interface-485 module and a serial interface, after receiving the commands from a control unit of Modbus, a CPU system in the MCU module stores the first 96 data of temperature matrix data temporarily stored in the internal register into the register with the address of 0001H-0060H, the PC computer reads 96 register data once according to the 03 commands of Modbus protocol, if the temperature matrix data is greater than 96, the PC computer writes a digital 2 into the register with the address of 0000H again, the MCU module stores the 97 th to 192 th data into the register with the address of 0001H-0060H, and so on, until the PC computer reads all the temperature matrix data according to the 03 commands of Modbus protocol once.
6. The system imaging method of a Modbus protocol-based thermal infrared imager according to claim 4, wherein the step S4 specifically includes:
the interpolation method is that a PC computer firstly subtracts the 1 st data and the 2 nd data in the 1 st row of the two-dimensional array of M rows and N columns, then takes absolute value and divides by 9 to obtain increasing and decreasing gradient values between the two data, if the 1 st data is smaller than the 2 nd data, 9 data are inserted after the 1 st data, each data is added with 1 gradient value on the basis of the previous data, if the 1 st data is larger than the 2 nd data, each data is subtracted with 1 gradient value on the basis of the previous data, and then the operations are analogized.
7. The system imaging method of a Modbus protocol-based thermal infrared imager according to claim 4, wherein the step S5 specifically comprises:
the table look-up method is to replace the temperature data of the two-dimensional array of (M-1) x 10 rows (N-1) x 10 columns with the 16-system data of the blue corresponding to the lowest temperature data and the 16-system data of the red corresponding to the highest temperature data through the 16-system color comparison table of 24 true colors, and replace the middle temperature data with the 16-system data in the color comparison table sequentially from the blue to the red according to the temperature, and finally the two-dimensional array of the 16-system colors of (M-1) x 10 rows (N-1) x 10 columns is obtained.
8. The system imaging method of a Modbus protocol-based thermal infrared imager according to claim 4, wherein the step S6 specifically includes:
the BMP format is to add the first 54 bytes of BMP head bytes of 0X42,0X4D before the one-dimensional array.
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Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU98311U1 (en) * | 2010-04-27 | 2010-10-10 | Учреждение Российской академии наук Институт физики полупроводников им. А.В. Ржанова Сибирского отделения РАН (ИФП СО РАН) | ELECTRONIC INFRARED IMAGE VISUALIZATION SYSTEM FOR MATRIX THERMAL IMAGERS |
| CN103139025A (en) * | 2011-12-05 | 2013-06-05 | 艾默生网络能源系统北美公司 | Access method and access system of Modbus equipment |
| US20170155851A1 (en) * | 2015-12-01 | 2017-06-01 | Maarten Van Laere | Thermal imaging sensor which connects to base units and makes thermal temperature data available over industrial protocols to monitoring systems |
| CN208335212U (en) * | 2018-05-20 | 2019-01-04 | 杨一凡 | A kind of recognition of face image capture device |
| CN109951366A (en) * | 2019-03-29 | 2019-06-28 | 浙江理工大学 | A kind of Modbus RTU bus control unit and control method |
| CN110989462A (en) * | 2019-12-24 | 2020-04-10 | 武汉亚为电子科技有限公司 | Infrared array temperature control method and device |
| CN111486967A (en) * | 2020-05-12 | 2020-08-04 | 广州杰马信息科技有限公司 | Forehead temperature gun capable of being controlled by mobile phone |
| CN211740411U (en) * | 2020-03-20 | 2020-10-23 | 深圳市桑格尔科技股份有限公司 | Simple and easy portable infrared temperature measuring device |
| CN113162931A (en) * | 2021-04-22 | 2021-07-23 | 中煤科工集团重庆研究院有限公司 | Method for transmitting Modbus RTU protocol in wide area network |
| CN113194046A (en) * | 2021-04-14 | 2021-07-30 | 深圳赛动生物自动化有限公司 | Method, device and equipment for acquiring monitoring data in real time |
| CN113218511A (en) * | 2021-05-12 | 2021-08-06 | 国网江苏省电力有限公司南通供电分公司 | Miniature infrared temperature measurement system of cubical switchboard cable chamber |
| CN114295223A (en) * | 2021-11-24 | 2022-04-08 | 国网浙江省电力有限公司桐庐县供电公司 | Infrared imaging on-line monitoring system and method for power transmission line |
| CN115290696A (en) * | 2022-08-03 | 2022-11-04 | 重庆大学 | Infrared thermal imaging defect detection method and device for transformer substation insulator |
| CN115371819A (en) * | 2022-08-15 | 2022-11-22 | 维达护理用品（中国）有限公司 | Online monitoring method and system for paper surface temperature of household paper |
| CN218098040U (en) * | 2022-10-11 | 2022-12-20 | 山东正瑞电子有限公司 | Infrared thermal imaging online temperature measuring device |
| CN116566762A (en) * | 2023-07-07 | 2023-08-08 | 武汉亚为电子科技有限公司 | Cascading equipment based on Modbus-RTU protocol and application method thereof |
| CN117036164A (en) * | 2023-07-24 | 2023-11-10 | 华中光电技术研究所(中国船舶集团有限公司第七一七研究所) | General spliced display method and system for photoelectric scanning images |
-
2023
- 2023-12-14 CN CN202311715918.XA patent/CN117405239A/en active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU98311U1 (en) * | 2010-04-27 | 2010-10-10 | Учреждение Российской академии наук Институт физики полупроводников им. А.В. Ржанова Сибирского отделения РАН (ИФП СО РАН) | ELECTRONIC INFRARED IMAGE VISUALIZATION SYSTEM FOR MATRIX THERMAL IMAGERS |
| CN103139025A (en) * | 2011-12-05 | 2013-06-05 | 艾默生网络能源系统北美公司 | Access method and access system of Modbus equipment |
| US20170155851A1 (en) * | 2015-12-01 | 2017-06-01 | Maarten Van Laere | Thermal imaging sensor which connects to base units and makes thermal temperature data available over industrial protocols to monitoring systems |
| CN208335212U (en) * | 2018-05-20 | 2019-01-04 | 杨一凡 | A kind of recognition of face image capture device |
| CN109951366A (en) * | 2019-03-29 | 2019-06-28 | 浙江理工大学 | A kind of Modbus RTU bus control unit and control method |
| CN110989462A (en) * | 2019-12-24 | 2020-04-10 | 武汉亚为电子科技有限公司 | Infrared array temperature control method and device |
| CN211740411U (en) * | 2020-03-20 | 2020-10-23 | 深圳市桑格尔科技股份有限公司 | Simple and easy portable infrared temperature measuring device |
| CN111486967A (en) * | 2020-05-12 | 2020-08-04 | 广州杰马信息科技有限公司 | Forehead temperature gun capable of being controlled by mobile phone |
| CN113194046A (en) * | 2021-04-14 | 2021-07-30 | 深圳赛动生物自动化有限公司 | Method, device and equipment for acquiring monitoring data in real time |
| CN113162931A (en) * | 2021-04-22 | 2021-07-23 | 中煤科工集团重庆研究院有限公司 | Method for transmitting Modbus RTU protocol in wide area network |
| CN113218511A (en) * | 2021-05-12 | 2021-08-06 | 国网江苏省电力有限公司南通供电分公司 | Miniature infrared temperature measurement system of cubical switchboard cable chamber |
| CN114295223A (en) * | 2021-11-24 | 2022-04-08 | 国网浙江省电力有限公司桐庐县供电公司 | Infrared imaging on-line monitoring system and method for power transmission line |
| CN115290696A (en) * | 2022-08-03 | 2022-11-04 | 重庆大学 | Infrared thermal imaging defect detection method and device for transformer substation insulator |
| CN115371819A (en) * | 2022-08-15 | 2022-11-22 | 维达护理用品（中国）有限公司 | Online monitoring method and system for paper surface temperature of household paper |
| CN218098040U (en) * | 2022-10-11 | 2022-12-20 | 山东正瑞电子有限公司 | Infrared thermal imaging online temperature measuring device |
| CN116566762A (en) * | 2023-07-07 | 2023-08-08 | 武汉亚为电子科技有限公司 | Cascading equipment based on Modbus-RTU protocol and application method thereof |
| CN117036164A (en) * | 2023-07-24 | 2023-11-10 | 华中光电技术研究所(中国船舶集团有限公司第七一七研究所) | General spliced display method and system for photoelectric scanning images |
Non-Patent Citations (2)
| Title |
|---|
| 胡青龙;: "浅析PLC控制系统在能源化工的应用", 机电工程技术, no. 11 * |
| 茅文铭, 刘思嘉: "在线式双光热像仪云测温电力监测系统", 电力与电子技术, no. 5, 31 March 2023 (2023-03-31) * |
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