CN117400478B - Electronic component manufacturing equipment - Google Patents
Electronic component manufacturing equipment Download PDFInfo
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- CN117400478B CN117400478B CN202311712584.0A CN202311712584A CN117400478B CN 117400478 B CN117400478 B CN 117400478B CN 202311712584 A CN202311712584 A CN 202311712584A CN 117400478 B CN117400478 B CN 117400478B
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- shell
- sliding
- rotating
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- fixed
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 230000008878 coupling Effects 0.000 claims abstract description 7
- 238000010168 coupling process Methods 0.000 claims abstract description 7
- 238000005859 coupling reaction Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 11
- 239000000110 cooling liquid Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
- B29C45/332—Mountings or guides therefor; Drives therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C45/5605—Rotatable mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses electronic component manufacturing equipment, and relates to the technical field of electronic product production. Including the support, the support rigid coupling has first fixed shell and support frame, the support frame passes through electric putter installation and first fixed shell complex second fixed shell, first fixed shell peg graft there is first mould, first mould is equipped with the first shell of rotating of equidistance distribution, the second mould is all installed to the opposite side of first fixed shell and second fixed shell, be equipped with the second shell of rotating of equidistance distribution in the second mould, the lateral wall of first fixed shell and second fixed shell all slides and is provided with evenly distributed's first carriage, evenly distributed's first carriage is equipped with trigger mechanism jointly. According to the invention, the first sliding frame is used for clamping and pulling the cable on the electronic component, so that the electronic component is centrally positioned in the mold cavity of the upper and lower adjacent second molds, the uniformity of the thickness of the resin protective layer on the outer side of the circuit board in the electronic component is ensured, and the quality of a finished product is improved.
Description
Technical Field
The present invention relates to the field of electronic product manufacturing technologies, and in particular, to an electronic component manufacturing apparatus.
Background
The electronic component is a variety of electronic parts used in electronic equipment, and the basic production process is semiconductor manufacturing, circuit board manufacturing, assembling, packaging and other operations, wherein the packaging process is to mold resin materials to the outer side of the circuit board, so that the resin forms a protective shell.
However, the following defects still exist in the existing injection molding process: in the process of injecting the resin into the mould, the resin gradually extrudes the circuit board and the cable in the mould along with the accumulation, so that the circuit board and the cable are laterally deviated in the mould, the thickness of an outer protective shell of the electronic component is uneven, the electronic component is easily damaged in the process of being knocked by the outside, and the normal use of the electronic component is further influenced.
Disclosure of Invention
In order to solve the problem that a circuit board and a cable are easy to deviate in a die, the invention provides electronic component manufacturing equipment.
The technical scheme of the invention is as follows: the utility model provides an electronic components manufacture equipment, including the support, the lateral wall rigid coupling of support has the control cabinet, the upper surface rigid coupling of support has first fixed shell and support frame, the support frame has the second fixed shell through electric putter rigid coupling, the upper portion of first fixed shell is equipped with the first spacing hole of symmetry, its characterized in that: the novel plastic composite material storage device comprises a first fixing shell, and is characterized by further comprising a first die, the first die is inserted into a first limiting hole of the first fixing shell, the first die is provided with first rotating shells distributed at equal intervals, second dies are respectively installed on opposite sides of the first fixing shell and the second fixing shell, second rotating shells distributed at equal intervals are arranged in the second dies, the second rotating shells adjacent to each other in the vertical direction are matched to form a die cavity, a material storage shell is fixedly connected to the side wall of the supporting frame, a material supply unit is communicated to the side wall of the material storage shell, a material guide pipe which is communicated with the material supply unit and is provided with a one-way valve is embedded in the second fixing shell, the material guide pipe is communicated with a die cavity formed by the second rotating shells, a first guide pipe which is provided with an anti-overflow valve is embedded in the second rotating shells, a first sliding frame which is uniformly distributed is arranged on the side wall of the first fixing shell and a second sliding frame which is communicated with the first guide pipe, and a first sliding frame which is uniformly distributed is provided with a common trigger mechanism.
Preferably, the second rotating shell on the first fixing shell is provided with a hollow sealing strip, the middle part of the sealing strip on the second rotating shell is filled with gas, the second rotating shell on the second fixing shell is provided with a groove for improving tightness between adjacent second rotating shells, the first fixing shell is provided with symmetrical fixing rods, and the second fixing shell is provided with a second limiting hole matched with the fixing rods on the first fixing shell.
Preferably, the first fixing shell and the second fixing shell are embedded with liquid guide pipes, and the liquid guide pipes are connected with a cooling liquid circulation unit through pipelines and used for rapidly cooling the resin.
Preferably, the second rotating shell is inclined relative to the horizontal plane, and one end of the second rotating shell, which is close to the first die, is higher than the other end of the second rotating shell, and is used for filling a die cavity formed adjacent to the second rotating shell with materials.
Preferably, the triggering mechanism comprises uniformly distributed sliding rings, the uniformly distributed sliding rings are respectively arranged on the corresponding first sliding frames in a sliding mode, the first sliding frames are provided with elastic blocks for blocking the mold cavities formed by the adjacent second rotating shells, the elastic blocks of the first sliding frames are matched with cables for clamping adjacent electronic components in the vertical direction, first springs are fixedly connected between the first fixed shells and the second fixed shells and the adjacent sliding rings respectively, first tension springs are fixedly connected between the first sliding frames and the adjacent sliding rings, connecting rods are fixedly connected between the sliding rings and located on the same horizontal plane, the first fixed shells and the second fixed shells are respectively provided with symmetrical second sliding frames in a sliding mode, the second sliding frames are provided with sliding grooves matched with the adjacent connecting rods in a sliding mode, and the second sliding frames are matched with the adjacent sliding frames in the vertical direction.
Preferably, the locking mechanism is further arranged on the second fixing shell, the first fixing shell and the second fixing shell are respectively provided with third limiting holes which are uniformly distributed, the third limiting holes of the first fixing shell and the third limiting holes of the second fixing shell are respectively spliced with the adjacent second die, the locking mechanism comprises a rotating frame, the rotating frame is rotatably arranged on the second fixing shell, one end of the rotating frame, which is positioned outside the second fixing shell, is slidably provided with a first sliding rod, a second tension spring is arranged between the first sliding rod and the rotating frame, the second fixing shell faces to one side of the first sliding rod, two blind holes of the second fixing shell are matched with the first sliding rod, symmetrical limiting frames are slidably arranged in the second fixing shell, sliding grooves are formed in the limiting frames, symmetrical convex columns are arranged on the limiting frames, and adjacent convex columns are matched with the second fixing shell, and the adjacent convex columns are matched with the second fixing shell.
Preferably, the device further comprises a swinging mechanism used for filling the mold cavity formed by the second rotating shell with resin, the swinging mechanism is arranged on the first fixed shell, the first rotating shell is in running fit with the first mold, the second rotating shell is in running fit with the adjacent second mold, the second mold on the upper side is provided with evenly distributed sliding grooves, the first guide pipe is located on the upper side in the corresponding sliding groove of the second mold, the swinging mechanism comprises a driving motor, the driving motor is fixedly connected to the side wall of the first fixed shell through a connecting block, a reciprocating screw is arranged on the side wall of the first fixed shell through a supporting block in a rotating mode, the reciprocating screw is fixedly connected with an output shaft of the driving motor, a third sliding frame is arranged on the first fixed shell in a sliding mode, the third sliding frame is in threaded fit with the reciprocating screw, the first mold is provided with a second sliding rod matched with the third sliding frame in a sliding mode, the first rotating shell is fixedly connected with a gear, the second sliding rod is provided with a tooth meshed with the gear, the second sliding frame is provided with the second sliding rod, and the second sliding frame is matched with the second sliding frame in a position limiting assembly.
Preferably, the limiting assembly comprises a fixed block fixedly connected to the first fixed shell, the first die is slidably provided with a sliding block in limiting fit with the second sliding rod, the sliding block is matched with the fixed block, and a symmetrical second spring is fixedly connected between the sliding block and the first die.
Preferably, the first rotating shell is provided with symmetrical lugs at one side outside the first die, and the second rotating shell is provided with grooves matched with the lugs on the adjacent first rotating shell.
Preferably, the electronic component is separated from the second rotating shell by a demolding mechanism, the demolding mechanism is arranged on the first fixed shell and comprises symmetrical fourth sliding frames, the symmetrical fourth sliding frames are respectively and slidably arranged on the first fixed shell and the second fixed shell, and symmetrical third springs are fixedly connected between the first fixed shell and the second fixed shell and the fourth sliding frames.
Compared with the prior art, the invention has the following advantages: according to the invention, the cable of the electronic component is limited, clamped and pulled through the upper and lower adjacent first sliding frames, the electronic component is ensured to be centered in the die cavity of the upper and lower adjacent second die, so that the uniformity of the thickness of the resin protective layer on the outer side of the circuit board in the electronic component is ensured, the quality of a finished product is improved, the second die is replaced through the rotation of the rotating frame in the locking mechanism, the device is convenient for processing and producing products with different specifications, the practicability and applicability of the device are improved, the first rotating shell and the adjacent two second rotating shells rotate together through the work of the driving motor in the swinging mechanism, the resin is ensured to be uniformly filled in the die cavity of the adjacent second rotating shells, the quality of the finished product is further improved, the separation of the resin shell and the second rotating shell is accelerated through the two fourth sliding frames in the demolding mechanism, the electronic component is convenient to take down by an operator, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the parts of the first and second molds of the present invention;
FIG. 3 is an exploded view of the components of the first stationary housing and the second mold of the present invention;
FIG. 4 is a cross-sectional view of the trigger mechanism of the present invention;
FIG. 5 is a cross-sectional view of a second mold and a second rotating shell of the present invention;
FIG. 6 is a schematic perspective view of the trigger mechanism of the present invention;
FIG. 7 is a cross-sectional view of the locking mechanism of the present invention;
FIG. 8 is a schematic perspective view of a swing mechanism according to the present invention;
FIG. 9 is a schematic perspective view of a spacing assembly of the present invention;
fig. 10 is a schematic perspective view of the demolding mechanism of the present invention.
The following reference numerals are included in the drawings of the specification: 1. the support, 101, console, 102, first fixed housing, 1021, support frame, 103, electric putter, 104, second fixed housing, 105, first mold, 106, first rotating housing, 107, second mold, 108, second rotating housing, 109, storage housing, 110, feeding unit, 111, feed pipe, 112, first guide pipe, 113, second guide pipe, 114, catheter, 2, trigger mechanism, 201, first carriage, 202, slip ring, 203, first spring, 204, first tension spring, 205, connecting rod, 206, second carriage, 3, locking mechanism, 301, rotating frame, 302, first carriage, 303, second tension spring, 304, limit frame, 4, swing mechanism, 401, driving motor, 402, reciprocating screw, 403, third carriage, 404, second carriage, 405, gear, 406, magnet, 5, limit assembly, 501, fixed block, 502, carriage, 503, second spring, 7, demoulding mechanism, 701, fourth carriage, 702, third spring.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention, and that references to embodiments herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Example 1: 1-5, the electronic component manufacturing equipment comprises a support 1, wherein the front side wall of the support 1 is fixedly connected with a console 101 through a connecting frame, the upper surface of the support 1 is fixedly connected with a first fixing shell 102 and a support frame 1021, the support frame 1021 is positioned on the upper side of the first fixing shell 102, the upper side surface of the first fixing shell 102 is provided with symmetrical fixing rods, the lower side surface of the support frame 1021 is fixedly connected with a symmetrical electric push rod 103, the symmetrical electric push rod 103 is electrically connected with the console 101, the telescopic ends of the symmetrical electric push rods 103 are fixedly connected with a second fixing shell 104 together, the lower part of the second fixing shell 104 is provided with symmetrical second limiting holes, the second limiting holes of the second fixing shell 104 are matched with the fixing rods on the first fixing shell 102, so that the second fixing shell 104 is tightly bonded to the first fixing shell 102 in a thread joint manner, the tightness between the second fixing shell and the first fixing shell is improved, the upper part of the first fixing shell 102 is provided with symmetrical first limiting holes, the first limiting hole of the first fixed shell 102 is inserted with a first die 105, the front part of the first die 105 is provided with first rotating shells 106 which are distributed at equal intervals, the first rotating shells 106 are used for installing plugs of electronic components, the first die 105 is disassembled to facilitate operators to install the electronic components into the device, the working efficiency is improved, the opposite sides of the first fixed shell 102 and the second fixed shell 104 are respectively provided with a second die 107, the second die 107 is positioned at the front side of the first die 105, the second die 107 is internally provided with second rotating shells 108 which are distributed at equal intervals, the second rotating shells 108 positioned on the first fixed shell 102 are provided with hollow sealing strips, the middle parts of the sealing strips on the second rotating shells 108 are filled with gas, the second rotating shells 108 positioned on the second fixed shells 104 are provided with grooves, after resin is injected between the adjacent second rotating shells 108, the second rotating shells are subjected to the heat of the resin, the sealing strip is expanded by gas, the tightness between the adjacent second rotating shells 108 is further improved, the upper and lower adjacent second rotating shells 108 are matched to form a mold cavity, the lower side face of a supporting frame 1021 is fixedly connected with a storage shell 109, the lower side face of the storage shell 109 is communicated with a feeding unit 110 electrically connected with a console 101, a guide pipe 111 communicated with the feeding unit 110 is embedded in a second fixed shell 104, a connecting pipeline between the feeding unit 110 and the guide pipe 111 is a hose, heating units are arranged on the side walls of the storage shell 109 and the guide pipe 111, the heating units are electrically connected with the console 101, the guide pipe 111 is communicated with a mold cavity formed by the adjacent second rotating shells 108, the rear part of the upper second rotating shell 108 is embedded with a first guide pipe 112, the second fixed shell 104 is embedded with a second guide pipe 113, the second guide pipe 113 is communicated with the first guide pipe 112, uniformly distributed one-way valves are installed in the first guide pipe 112, a uniformly distributed first sliding frame 201 is slidably arranged on the side walls of the first fixed shell 102 and the second fixed shell 104, a second sliding frame 201 is uniformly distributed on the side walls of the first fixed shell 102 and the second fixed shell 104, a first sliding frame 201 is uniformly distributed on the side walls of the first sliding frame 201 is used for triggering the first sliding frame 2 and the second rotating frame 108 to be used for triggering the first rotating frame 2 to move the adjacent second rotating shells, and the second rotating frame 2 is used for triggering the second rotating frame 2 to form a horizontal surface, and the mold cavity is used for triggering the second rotating frame 2, the second rotating frame is used for triggering the second rotating frame 2, the rotating frame is used for the adjacent rotating frame 2, the rotating frame is used for the rotating frame.
Referring to fig. 4, the middle part of the first fixing case 102 and the middle part of the second fixing case 104 are embedded with the liquid guide pipes 114, the two liquid guide pipes 114 are respectively positioned at the outer sides of the two second molds 107, the liquid guide pipes 114 are connected with a cooling liquid circulation unit through a pipeline, and the cooling liquid circulation unit is electrically connected with the console 101 for rapidly cooling the resin, thereby improving the processing efficiency.
Referring to fig. 4 and 6, the triggering mechanism 2 includes a sliding ring 202 with uniform distribution, the first sliding frame 201 is n-shaped, the first fixed shell 102 and the second fixed shell 104 are respectively provided with a groove with uniform distribution, the grooves of the first fixed shell 102 and the second fixed shell 104 are communicated with a model cavity formed by the adjacent second rotating shell 108, the first sliding frame 201 is provided with an elastic block, the elastic blocks of the first sliding frame 201 with uniform distribution are respectively positioned in the grooves of the first fixed shell 102 and the grooves of the second fixed shell 104, the elastic block of the first sliding frame 201 is used for sealing the model cavity formed by the adjacent second rotating shell 108, damping exists between the uniformly distributed first sliding frame 201 and the first fixed shell 102 and the second fixed shell 104, the uniformly distributed sliding rings 202 are respectively arranged on the adjacent first sliding frame 201 in a sliding way, a first spring 203 is fixedly connected between the first fixed shell 102 and the second fixed shell 104 and the adjacent sliding ring 202, the first springs 203 are sleeved on the adjacent first sliding frames 201, the first tension springs 204 are fixedly connected between the first sliding frames 201 and the adjacent sliding rings 202, the first tension springs 204 are sleeved on the adjacent first sliding frames 201, connecting rods 205 are fixedly connected between the sliding rings 202 positioned on the same horizontal plane, the connecting rods 205 positioned on the upper side are positioned in the second fixed shell 104, the connecting rods 205 positioned on the lower side are positioned in the first fixed shell 102, symmetrical second sliding frames 206 are arranged in the first fixed shell 102 and the second fixed shell 104 in a sliding way, the second sliding frames 206 are provided with sliding grooves, the sliding grooves of the upper and lower adjacent second sliding frames 206 are gradually separated from each other by front and rear sliding grooves, the sliding grooves of the second sliding frames 206 are in sliding fit with the adjacent connecting rods 205, the upper and lower symmetrical second sliding frames 206 respectively move in the second fixed shell 104 and the first fixed shell 102, and the sliding grooves on the second sliding frames 206 are extruded to move forward, the upper and lower adjacent second sliding frames 206 are in contact fit, when the lower surface of the second fixing shell 104 is attached to the upper surface of the first fixing shell 102, the elastic blocks of the upper and lower adjacent first sliding frames 201 clamp cables of electronic components and pull the cables, the electronic components and the cables are ensured to be positioned in the middle of the adjacent second rotating shell 108, and therefore the outer side of the subsequent electronic components is ensured to be wrapped with resin with uniform thickness, and the product quality and the service life are improved.
When the electronic components are wrapped by resin, an operator sequentially inserts a plurality of electronic components into the first rotating shell 106 on the first die 105, then the operator inserts the first rotating shell 106 into the first limiting hole of the first fixed shell 102, then the operator controls the electric push rod 103 to work through the console 101, so that the second fixed shell 104 drives connected parts to move downwards, wherein the second limiting hole of the second fixed shell 104 is firstly inserted into the fixing rod of the first fixed shell 102, the second fixed shell 104 is ensured to be opposite to the first fixed shell 102, after the lower surface of the second fixed shell 104 is tightly attached to the upper surface of the first fixed shell 102, the console 101 closes the electric push rod 103, at the moment, two upper and lower adjacent second rotating shells 108 are tightly matched, sealing strips of the second rotating shells 108 are matched with corresponding sliding grooves, and the sealing performance between the upper and lower adjacent second rotating shells 108 is improved.
In the process of downward movement of the second fixed shell 104, two upper and lower adjacent second sliding frames 206 are contacted, then the second fixed shell 104 continues to move downward, so that the elastic blocks of the upper and lower adjacent two first sliding frames 201 clamp cables on electronic components, meanwhile, the lower second sliding frame 206 moves downward relative to the first fixed shell 102, the upper second sliding frame 206 moves upward relative to the second fixed shell 104, the upper sliding groove of the upper second sliding frame 206 presses the corresponding connecting rod 205, the connecting rod 205 drives the adjacent sliding rings 202 to move forward and compress the adjacent first springs 203, the sliding rings 202 are driven by the damping action between the first sliding frames 201 and the first fixed shell 102 and the second fixed shell 104 in the forward movement process, the sliding rings 202 drive the first sliding frames 201 to move forward slowly through the adjacent first tension springs 204, the first sliding frames 201 move forward, namely the elastic blocks of the first sliding frames 201 pull the cables of the electronic components, in the process of pouring resin in the follow-up process, the cables are always located at the middle parts of the adjacent second tension springs 108, the quality of the cables is prevented from being continuously stressed, and the quality of the cables is prevented from being continuously stressed by the second tension springs 108.
After the second fixed case 104 is moved, an operator starts the feeding unit 110 through the console 101, the feeding unit 110 injects the liquid resin in the storage case 109 into the guide tube 111, then the resin enters into the mold cavity formed by the upper and lower adjacent second rotating cases 108 through the check valve in the guide tube 111, since the rear part of the second rotating case 108 is higher than the front part thereof, when the resin flows to the rear part of the mold cavity, the resin presses the spill-proof valve of the first conduit 112, at this time, the mold cavity is filled with the resin, and at the same time, the pressure in the mold cavity gradually increases, and when the pressure in the mold cavity reaches a specified value (at this time, the resin fills the mold cavity formed by the upper and lower adjacent second rotating cases 108, and the resin cannot be continuously injected into the mold cavity), the feeding unit 110 detects the corresponding pressure value to enable the console 101 to close the feeding unit 110, the injection molding operation is completed, then the operator controls the cooling liquid circulation unit through the console 101 to enable the cooling liquid to flow through the guide tube 114, and the cooling liquid cools the resin between the upper and lower adjacent second rotating cases 108, thereby accelerating the cooling of the resin, and improving the working efficiency.
After cooling for a period of time, the control console 101 closes the cooling liquid circulation unit, and simultaneously controls the electric push rod 103 to shrink, so that the electric push rod 103 performs the reverse operation, the second fixing shell 104 drives the connected parts to be far away from the first fixing shell 102, a subsequent operator takes out the connected parts through the handle of the first die 105, then the operator pulls out finished electronic components in sequence, the manufacture of the electronic components is completed, the disassembly of the first die 105 facilitates the accurate placement of the electronic components by the operator, the working efficiency is further improved, and meanwhile, the operation is more portable.
Example 2: on the basis of embodiment 1, referring to fig. 4 and 7, the mold further comprises a locking mechanism 3, the locking mechanism 3 is arranged on the second fixing shell 104, the locking mechanism 3 is used for fixing the mold, the first fixing shell 102 and the second fixing shell 104 are respectively provided with third limiting holes which are uniformly distributed, the third limiting holes of the first fixing shell 102 and the third limiting holes of the second fixing shell 104 are respectively inserted into the adjacent second mold 107, the locking mechanism 3 comprises a rotating frame 301, the rotating frame 301 is rotatably arranged on the upper part of the second fixing shell 104, a first sliding rod 302 is slidably arranged on the upper part of the rotating frame 301, a second tension spring 303 is arranged between the first sliding rod 302 and the rotating frame 301, the second tension spring 303 is positioned on the upper part of the rotating frame 301 and sleeved on the first sliding rod 302, the upper portion of second fixed shell 104 is equipped with two blind holes with first slide bar 302 complex, under the pulling force effect of second extension spring 303, first slide bar 302 inserts in the blind hole of second fixed shell 104, accomplish the fixed to rotating turret 301, horizontal slip is provided with two spacing shelves 304 of bilateral symmetry in the second fixed shell 104, spacing shelf 304 is the I-shaped, the inside of two spacing shelves 304 all is equipped with the spout, rotating turret 301 is equipped with two and adjacent spacing shelf 304 on spout complex projection, upside second mould 107 is equipped with the opening, the opening of upside second mould 107 is spacing with adjacent spacing shelf 304 complex, make spacing shelf 304 remove the spacing to upside second mould 107 through rotatory rotating turret 301, change different types of moulds, improve the suitability of this device.
When injection molding is performed on different electronic components, different dies are required, an operator pulls the first sliding rod 302 upwards before processing the electronic components, so that the first sliding rod 302 moves away from the fit with the blind hole on the second fixed shell 104, the first sliding rod 302 moves while compressing the second tension spring 303, then the operator rotates the rotating frame 301, the rotating frame 301 rotates the upper protruding column of the rotating frame to press the sliding grooves of the two limiting frames 304, the two limiting frames 304 are pressed together, the limiting frames 304 move to release the fit with the notch on the upper side second die 107, then the operator removes the upper side second die 107, and takes out the second die 107 on the first fixed shell 102 together with the first die 105, the subsequent operator replaces the designated first die 105 and second die 107, and the reverse operation is repeated to reinstall the electronic components on the first fixed shell 102 and the second fixed shell 104.
After the replacement of the die is completed, an operator controls the electric push rod 103 to work through the control console 101, and the operation is repeated to perform the plastic packaging operation of the electronic components, wherein the replacement of the die improves the practicability and applicability of the device, and the device is convenient to perform the plastic packaging operation on the electronic components with different specifications.
Example 3: on the basis of embodiment 2, referring to fig. 3, 8 and 9, the swing mechanism 4 is further included, the swing mechanism 4 is disposed on the first fixed shell 102, the swing mechanism 4 is used for filling the mold cavity formed by the adjacent second rotating shell 108 with resin, the first rotating shell 106 is in running fit with the first mold 105, the rear portion of the upper second mold 107 is provided with evenly distributed sliding grooves, the first guide tube 112 is located in the corresponding sliding groove of the upper second mold 107, the swing mechanism 4 includes a driving motor 401 electrically connected with the console 101, the driving motor 401 is fixedly connected with the rear side surface of the first fixed shell 102 through a connecting block, the rear side surface of the first fixed shell 102 is rotatably provided with a reciprocating screw 402 fixedly connected with an output shaft on the driving motor 401 through a supporting block, the rear portion of the first fixed shell 102 is slidably provided with a third sliding frame 403 in threaded fit with the reciprocating screw 402, the lower part of the first mold 105 is slidably provided with a second sliding rod 404, the second sliding rod 404 is matched with the third sliding frame 403, the rear part of the first rotating shell 106 is fixedly connected with a gear 405, the second sliding rod 404 is provided with teeth, the teeth of the second sliding rod 404 are meshed with the gear 405, the second mold 107 and the second rotating shell 108 are embedded with magnets 406, the adjacent magnets 406 are matched, the magnets 406 are used for keeping the second rotating shell 108 fixed on the adjacent second mold 107, the first mold 105 is provided with a limiting component 5, the limiting component 5 is used for limiting the second sliding rod 404, one side of the first rotating shell 106, which is positioned outside the first mold 105, is provided with symmetrical convex blocks, the second rotating shell 108 is provided with grooves matched with the convex blocks on the adjacent first rotating shell 106, during the resin injection molding process, the control console 101 starts the driving motor 401 to work, the first rotating shell 106 drives the adjacent two second rotating shells 108 to reciprocate, the second rotating shell 108 rotates and flicks the resin therein to uniformly fill the mold cavity formed by the adjacent second rotating shell 108 with the resin, and to prevent the attachment of air bubbles to the electronic components.
Referring to fig. 9, the limiting assembly 5 includes a fixed block 501, the fixed block 501 is fixedly connected to the upper surface of the first fixed shell 102, a sliding block 502 is slidably disposed at the lower portion of the first mold 105, the sliding block 502 is used for limiting and extruding the second sliding rod 404, the sliding block 502 is matched with the fixed block 501, the first mold 105 is inserted into the first fixed shell 102, the fixed block 501 extrudes the sliding block 502 to separate from the extrusion limiting of the second sliding rod 404, a symmetrical second spring 503 is fixedly connected between the sliding block 502 and the first mold 105, and the second spring 503 is located in the first mold 105.
When the electronic component is wrapped by the resin, an operator firstly selects the corresponding first mold 105 and two second molds 107, under the action of the elasticity of the second springs 503 in an initial state, the sliding blocks 502 squeeze the second sliding rods 404, limit fixing is carried out on the second sliding rods 404, two adjacent magnets 406 are adsorbed, the second rotating shell 108 is kept fixed on the second mold 107, in the process that the first mold 105 is inserted into the first limit hole of the first fixed shell 102, the fixed blocks 501 firstly contact with the limit sliding blocks 502, then the first mold 105 is continuously pressed downwards, the sliding blocks 502 move upwards relative to the first mold 105 and compress the second springs 503, the sliding blocks 502 release the extrusion limit on the second sliding rods 404, after the first mold 105 is installed, the third sliding frames 403 are opposite to the second sliding rods 404, the third sliding frames 403 are attached to the second sliding rods 404, simultaneously, the protruding blocks of the first rotating shell 106 are positioned in the grooves of the adjacent second rotating shells 108, and then the operator starts the electric push rods 103 through the control console 101 to carry out the operation, so that the electronic component is positioned between the two adjacent second rotating shells 108.
After the upper and lower adjacent two second rotating shells 108 are attached, an operator starts a driving motor 401 and a feeding unit 110 through a control console 101, the feeding unit 110 works to repeat the operations to fill resin into the mold cavities of the upper and lower adjacent two second rotating shells 108, the driving motor 401 works to drive a reciprocating screw 402 to rotate, the reciprocating screw 402 rotates to enable a third sliding frame 403 to move left and right in a reciprocating mode, the third sliding frame 403 moves to press a second sliding rod 404 to move left and right in a reciprocating mode, the second sliding rod 404 enables a gear 405 to rotate in a reciprocating mode through upper teeth of the second sliding rod, the gear 405 drives a first rotating shell 106 to rotate in a reciprocating mode, the first rotating shell 106 extrudes grooves of the adjacent second rotating shells 108 through bumps in the rotating process, the upper and lower adjacent two second rotating shells 108 rotate in a second mold 107, the two second rotating shells 108 rotate to swing the resin filled into the mold cavities of the upper and lower adjacent two second rotating shells 108, meanwhile the resin is enabled to uniformly fill the mold cavities of the upper and lower adjacent two second rotating shells 108, the resin is enabled to uniformly adhere to a circuit board of an electronic component, and the quality of the circuit board is prevented from being uneven, and the quality of the circuit board is prevented from being attached to the circuit board.
After the mold cavities of the upper and lower adjacent two second rotating shells 108 are filled with resin, the console 101 closes the feeding unit 110 and starts the cooling liquid circulation unit, the resin in the mold cavities is cooled, and meanwhile, the driving motor 401 continues to work, and the second rotating shells 108 continue to rotate in the process, so that the resin in the mold cavities formed by the upper and lower adjacent two second rotating shells 108 is uniformly subjected to heat exchange with the liquid in the liquid guide tube 114, and the resin between the two second rotating shells 108 is uniformly cooled and molded, so that the processing efficiency is improved.
After the driving motor 401 is operated for a period of time, when the third carriage 403 is restored to the initial state again, the console 101 closes the cooling liquid circulation unit and the driving motor 401, and then the above-mentioned reverse operation is performed, and the finished electronic component is removed.
Example 4: on the basis of embodiment 3, referring to fig. 6 and 10, the electronic component separating device further comprises a demoulding mechanism 7, the demoulding mechanism 7 is arranged on the first fixed shell 102, the demoulding mechanism 7 is used for accelerating the separation of the electronic component from the second rotating shell 108, the demoulding mechanism 7 comprises two fourth sliding frames 701 which are symmetrical up and down, each of the plough harrow teeth of the two fourth sliding frames 701 is respectively positioned in a groove of the first fixed shell 102 and a groove of the second fixed shell 104, the two fourth sliding frames 701 are respectively arranged in the first fixed shell 102 and the second fixed shell 104 in a sliding manner, two third springs 702 which are symmetrical left and right are fixedly connected between the first fixed shell 102 and the second fixed shell 104 and the fourth sliding frames 701 respectively, the third springs 702 are sleeved on the fourth sliding frames 701 which are adjacent, after the second fixed shell 104 and the first fixed shell 102 are attached, harrow teeth of the two fourth sliding frames 701 are respectively flush with side walls of the grooves of the first fixed shell 102 and side walls of the second fixed shell 104, and the fourth sliding frames 702 are separated from the second fixed shell 108 when the second fixed shell 102 is separated from the fourth sliding frames.
When the second fixing shell 104 moves downwards to be attached to the first fixing shell 102, the second fixing shell 104 contacts with the fourth sliding frames 701 in the first fixing shell 102, meanwhile, the two fourth sliding frames 701 retract into the second fixing shell 104 and the first fixing shell 102 respectively and compress the corresponding third springs 702, at this time, the two fourth sliding frames 701 are parallel to the side walls of the second fixing shell 104 and the first fixing shell 102 respectively, the injection molding operation is repeated subsequently, after the electronic component processing is completed, an operator controls the electric push rod 103 to work through the console 101, the second fixing shell 104 moves upwards to be away from the first fixing shell 102, then the two fourth sliding frames 701 are enabled to protrude out from the side walls of the second fixing shell 104 and the first fixing shell 102 respectively under the elastic force of the third springs 702, the protruding fourth sliding frames 701 squeeze the outer shell of the formed electronic component, the electronic component is accelerated to be separated from the adjacent second rotating shell 108, the finished electronic component is convenient to be taken down by the operator, and the working efficiency is further improved.
Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an electronic components manufacture equipment, including support (1), the lateral wall rigid coupling of support (1) has control cabinet (101), the upper surface rigid coupling of support (1) has first fixed shell (102) and support frame (1021), support frame (1021) have second fixed shell (104) through electric putter (103) rigid coupling, the upper portion of first fixed shell (102) is equipped with the first spacing hole of symmetry, its characterized in that: the utility model also comprises a first mould (105), the first mould (105) is inserted in the first limiting hole of the first fixed shell (102), the first mould (105) is provided with a first rotating shell (106) which is distributed equidistantly, a second mould (107) is arranged on opposite sides of the first fixed shell (102) and the second fixed shell (104), a second rotating shell (108) which is distributed equidistantly is arranged in the second mould (107), adjacent second rotating shells (108) in the vertical direction are matched to form a mould cavity, the side wall of the supporting frame (1021) is fixedly connected with a storage shell (109), the side wall of the storage shell (109) is communicated with a feeding unit (110), the second fixed shell (104) is embedded with a material guiding pipe (111) which is communicated with the feeding unit (110) and is provided with a check valve, the material guiding pipe (111) is communicated with a mould cavity formed by the adjacent second rotating shell (108), the second rotating shell (108) on the upper side is embedded with a first guide pipe (112) which is provided with a guide pipe (112), the second fixed shell (112) is uniformly distributed with the first guide pipe (112), the first sliding frames (201) which are uniformly distributed are provided with a triggering mechanism (2) together;
the triggering mechanism (2) comprises uniformly distributed sliding rings (202), the uniformly distributed sliding rings (202) are respectively and slidably arranged on corresponding first sliding frames (201), the first sliding frames (201) are provided with elastic blocks for blocking a die cavity formed by adjacent second rotating shells (108), the elastic blocks of the first sliding frames (201) are matched with cables for clamping adjacent electronic components in the vertical direction, first springs (203) are fixedly connected between the first fixed shells (102) and the second fixed shells (104) and the adjacent sliding rings (202), first tension springs (204) are fixedly connected between the first sliding frames (201) and the adjacent sliding rings (202), connecting rods (205) are fixedly connected between the sliding rings (202) which are positioned on the same horizontal plane, symmetrical second sliding frames (206) are slidably arranged in the first fixed shells (102) and the second fixed shells (104), and the second sliding frames (206) are provided with second sliding grooves matched with the adjacent sliding frames (206) in the vertical direction;
the device also comprises a swinging mechanism (4) used for filling a mold cavity formed by the adjacent second rotating shell (108) with resin, wherein the swinging mechanism (4) is arranged on the side wall of the first fixed shell (102), the first rotating shell (106) is in rotating fit with the first mold (105), the second rotating shell (108) is in rotating fit with the adjacent second mold (107), the second mold (107) on the upper side is provided with evenly distributed sliding grooves, the first guide tube (112) is positioned in the corresponding sliding groove of the second mold (107) on the upper side, the swinging mechanism (4) comprises a driving motor (401), the driving motor (401) is fixedly connected with the side wall of the first fixed shell (102) through a connecting block, the side wall of the first fixed shell (102) is rotatably provided with a reciprocating screw (402) through a supporting block, the reciprocating screw (402) is fixedly connected with the output shaft of the driving motor (401), the first fixed shell (102) is slidably provided with a third sliding frame (403), the third sliding frame (403) is positioned in the corresponding sliding groove of the second mold (107), the third sliding frame (403) is fixedly connected with the second sliding frame (405) through a connecting block, the reciprocating screw (102) is fixedly connected with the second sliding frame (405) through a connecting rod (405), the second die (107) and the second rotating shell (108) are embedded with magnets (406), adjacent magnets (406) are matched, and the first die (105) is provided with a limiting assembly (5) for limiting the second sliding rod (404);
the limiting assembly (5) comprises a fixed block (501), the fixed block (501) is fixedly connected to the first fixed shell (102), the first die (105) is slidably provided with a sliding block (502) in limiting fit with the second sliding rod (404), the sliding block (502) is matched with the fixed block (501), and a symmetrical second spring (503) is fixedly connected between the sliding block (502) and the first die (105).
2. An electronic component manufacturing apparatus as claimed in claim 1, characterized in that: the second rotating shell (108) located on the first fixing shell (102) is provided with a hollow sealing strip, the middle part of the sealing strip on the second rotating shell (108) is filled with gas, the second rotating shell (108) located on the second fixing shell (104) is provided with a groove for improving tightness between adjacent second rotating shells (108), the first fixing shell (102) is provided with symmetrical fixing rods, and the second fixing shell (104) is provided with a second limiting hole matched with the fixing rods on the first fixing shell (102).
3. An electronic component manufacturing apparatus as claimed in claim 2, characterized in that: the first fixing shell (102) and the second fixing shell (104) are embedded with liquid guide pipes (114), and the liquid guide pipes (114) are connected with a cooling liquid circulation unit through pipelines and used for rapidly cooling resin.
4. An electronic component manufacturing apparatus as claimed in claim 2, characterized in that: the second rotating shell (108) is inclined relative to the horizontal plane, and one end of the second rotating shell (108) close to the first die (105) is higher than the other end of the second rotating shell, and is used for filling a die cavity formed adjacent to the second rotating shell (108) with materials.
5. An electronic component manufacturing apparatus as claimed in claim 1, characterized in that: the locking mechanism (3) is used for fixing the die, the locking mechanism (3) is arranged on the second fixing shell (104), a first sliding rod (302) is arranged at one end of the rotating frame (301) outside the second fixing shell (104) in a sliding mode, a second tension spring (303) is arranged between the first sliding rod (302) and the rotating frame (301), two blind holes are respectively formed in one side of the second fixing shell (102) facing the first sliding rod (302), the second fixing shell (104) is inserted into the adjacent second die (107), the locking mechanism (3) comprises a rotating frame (301), the rotating frame (301) is rotatably arranged on the second fixing shell (104), a first sliding rod (302) is arranged at one end of the rotating frame (301) outside the second fixing shell (104) in a sliding mode, a second tension spring (303) is arranged between the first sliding rod (302), two blind holes are formed in one side of the second fixing shell (104) facing the first sliding rod (302), the second sliding rod (302) is matched with the first sliding rod (302), a sliding groove (304) is symmetrically arranged on the rotating frame (301), and the rotating frame (301) is symmetrically matched with the rotating frame (304), the second die (107) positioned on the second fixing shell (104) is provided with a notch matched with the adjacent limiting frame (304).
6. An electronic component manufacturing apparatus as claimed in claim 1, characterized in that: the first rotating shell (106) is provided with symmetrical convex blocks at one side outside the first die (105), and the second rotating shell (108) is provided with grooves matched with the convex blocks on the adjacent first rotating shell (106).
7. An electronic component manufacturing apparatus as claimed in claim 1, characterized in that: the electronic component is characterized by further comprising a demoulding mechanism (7) for accelerating the separation of the electronic component and the second rotating shell (108), wherein the demoulding mechanism (7) is arranged on the first fixed shell (102), the demoulding mechanism (7) comprises a symmetrical fourth sliding frame (701), the symmetrical fourth sliding frame (701) is respectively and slidably arranged on the first fixed shell (102) and the second fixed shell (104), and a symmetrical third spring (702) is fixedly connected between the first fixed shell (102) and the second fixed shell (104) and the adjacent fourth sliding frame (701).
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN217226424U (en) * | 2022-01-14 | 2022-08-19 | 河北佳泽线缆有限公司 | Insulation injection molding device for wire and cable production |
| CN219213885U (en) * | 2022-12-05 | 2023-06-20 | 南京艾通电气有限公司 | Injection molding device for insulator production |
| CN116352293A (en) * | 2023-06-02 | 2023-06-30 | 沧州领创激光科技有限公司 | Novel laser cutting machine |
| CN117183214A (en) * | 2023-09-11 | 2023-12-08 | 湖北精为电子有限公司 | Insulating injection molding device for electronic cable |
| CN117219372A (en) * | 2023-10-17 | 2023-12-12 | 河北辰硕线缆有限公司 | Cooling device with even cooling function for cable production |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4548199B2 (en) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | Method for manufacturing electronic circuit device |
| CN208782214U (en) * | 2018-07-09 | 2019-04-23 | 东莞富强电子有限公司 | Fixed fixture |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN217226424U (en) * | 2022-01-14 | 2022-08-19 | 河北佳泽线缆有限公司 | Insulation injection molding device for wire and cable production |
| CN219213885U (en) * | 2022-12-05 | 2023-06-20 | 南京艾通电气有限公司 | Injection molding device for insulator production |
| CN116352293A (en) * | 2023-06-02 | 2023-06-30 | 沧州领创激光科技有限公司 | Novel laser cutting machine |
| CN117183214A (en) * | 2023-09-11 | 2023-12-08 | 湖北精为电子有限公司 | Insulating injection molding device for electronic cable |
| CN117219372A (en) * | 2023-10-17 | 2023-12-12 | 河北辰硕线缆有限公司 | Cooling device with even cooling function for cable production |
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