CN117373961A - Wafer film pasting method and device - Google Patents

Wafer film pasting method and device Download PDF

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Publication number
CN117373961A
CN117373961A CN202311540153.0A CN202311540153A CN117373961A CN 117373961 A CN117373961 A CN 117373961A CN 202311540153 A CN202311540153 A CN 202311540153A CN 117373961 A CN117373961 A CN 117373961A
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CN
China
Prior art keywords
wafer
roller
film
vacuum
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311540153.0A
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Chinese (zh)
Inventor
王孝军
范亚飞
袁泉
叶家焱
牛作艳
陈志平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yunzhe Semiconductor Technology Zhejiang Co ltd
Original Assignee
Yunzhe Semiconductor Technology Zhejiang Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yunzhe Semiconductor Technology Zhejiang Co ltd filed Critical Yunzhe Semiconductor Technology Zhejiang Co ltd
Priority to CN202311540153.0A priority Critical patent/CN117373961A/en
Publication of CN117373961A publication Critical patent/CN117373961A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer film pasting method and device, which comprises a vacuum mechanism, wherein a rolling mechanism is arranged in the vacuum mechanism, a wafer and a film-pasted sheet ring are sequentially placed in the vacuum mechanism, and after vacuumizing, a roller is used for assisting film pasting with the wafer. According to the invention, the rolling mechanism is arranged in the vacuum cavity, the rolling mechanism is used for assisting vacuum film pasting, whether a wafer is warped or not, the wafer can be preliminarily pasted with the film, the film pasting efficiency is accelerated, and the advantages of vacuum film pasting and rolling film pasting are integrated.

Description

Wafer film pasting method and device
Technical Field
The invention relates to the technical field of wafers, in particular to a wafer film pasting method and device.
Background
The dicing process is to separate each die from the wafer, and a protective film (dicing film or dicing protective film) is applied to the non-circuit board (back) of the wafer before dicing, and then the wafer is sent to a dicing machine for dicing. After cutting, a grain will be orderly arranged and stuck on the adhesive tape, and the grain can be prevented from collision due to the crease of the adhesive tape due to the support of the frame.
At present, the conventional film pasting mode comprises vacuum film pasting and rolling film pasting, wherein the rolling film pasting is to place the surface (front surface) of a wafer circuit board downwards, cover a film on the upper surface (namely the back surface) of the wafer, and then roll the film pasting by using a roller. The vacuum film is formed by placing the cutting film and the wafer in a vacuum cavity, and bonding the film and the wafer in a vacuumizing mode.
Patent CN218849428U discloses a vacuum device for wafer film, comprising a vacuum cavity and a sealing cover, wherein an annular table top is arranged above the vacuum cavity, and a wafer ring mounting groove is arranged on the annular table top; a liftable wafer adsorption table top is arranged in the middle of the annular table top; the sealing cover is provided with a first lifting component for driving the sealing cover to move, the sealing cover can be tightly fixed with the vacuum cavity, one side of the sealing cover, which faces the sealing cover, is an upper cavity, and the other side of the annular table is a lower cavity; the upper cavity and the lower cavity are respectively connected with a vacuum device, and the pressure of the upper cavity is smaller than that of the lower cavity. When the wafer is used, the center of the wafer is contacted with the cutting film, and the contact surface of the wafer and the cutting film slowly diffuses outwards along with the rising of the wafer until the wafer is completely attached to the cutting film; and then, instantly releasing the atmospheric pressure, and discharging bubbles between the wafer and the cutting film by using the atmospheric pressure to finish the film pasting operation. However, the film sticking efficiency of the vacuum film is lower, and when the wafer warps, the film and the wafer cannot be bonded well, so that the film sticking effect is poor, and the subsequent processing procedures of the wafer are affected.
Disclosure of Invention
In order to solve the above problems, the present invention provides a wafer film pasting method and apparatus, which can accelerate film pasting efficiency and ensure film pasting quality.
For this purpose, the technical scheme of the invention is as follows: a wafer film pasting method sequentially puts a wafer and a film-pasted wafer ring into a vacuum cavity, and after vacuumizing, a roller is used for assisting the film to be pasted with the wafer.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: in the initial stage, a height difference exists between the wafer and the film-attached wafer ring; after vacuumizing, the wafer is moved to the upper surface to be level with the upper surface of the wafer ring, and the wafer ring is positioned in the rolling range of the roller.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: the roller is of a long cylindrical structure, and the rolling range covers the wafer and the wafer ring.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: the roller rolls one turn along the wafer edge, and the rolling range only comprises the invalid area of the wafer edge and the sheet ring.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: in the initial stage, placing a wafer on an ascending wafer adsorption table top, then descending the wafer adsorption table top, and placing a film-attached wafer ring in a wafer ring placement groove, wherein the wafer is lower than the film-attached wafer ring; the vacuum pumping is started, and after the vacuum value reaches a set value, the wafer adsorption table surface rises to make the upper surface of the wafer and the upper surface of the wafer ring be leveled, and the roller starts rolling; after rolling is completed, the vacuum is released and the film and wafer are pressed together using atmospheric pressure.
The other technical scheme of the invention is as follows: the wafer film sticking device comprises a vacuum mechanism, wherein a rolling mechanism is arranged in the vacuum mechanism.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: the vacuum mechanism comprises a vacuum cavity and a sealing cover, the vacuum cavity and the sealing cover are in sealing fit, the rolling mechanism is positioned on the inner side of the sealing cover and comprises rollers and a driving assembly for driving the rollers to move.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: the roller is of a long cylindrical structure, two ends of the roller are rotatably mounted on the roller support, the driving assembly drives the roller support to translate, and the roller rolls on the wafer ring and the wafer.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: the roller is rotatably arranged on the roller support, the driving assembly drives the roller support to rotate, and the roller rolls one circle along the edge of the wafer.
The above-mentioned scheme is based on and is a preferable scheme of the above-mentioned scheme: an annular table top is arranged above the vacuum cavity, and a slice ring placement groove is formed in the annular table top; the middle of the annular table top is provided with a liftable wafer adsorption table top.
Compared with the prior art, the invention has the beneficial effects that:
1. the rolling mechanism is arranged in the vacuum cavity, the rolling mechanism is used for assisting vacuum film pasting, whether a wafer is warped or not, the wafer can be preliminarily pasted with the film, the film pasting efficiency is accelerated, and the advantages of vacuum film pasting and rolling film pasting are integrated.
2. When the hard roller is used for rolling, the upper surface of the wafer is flush with the upper surface of the wafer ring, and the roller rolls over the upper surface of the wafer ring when the roller rolls films, so that the wafer is not extruded hard, the wafer damage is avoided, and the wafer defective rate is reduced.
3. The roller can be arranged to move around the edge of the wafer for one circle, so that the rolling range of the roller only comprises an invalid area and a wafer ring of the edge of the wafer, and the roller can not contact with an effective area inside the wafer, thereby realizing non-contact wafer film pasting and accelerating non-contact wafer film pasting efficiency.
4. The vacuum degree of the vacuum cavity does not need to reach the extreme vacuum, the film can be pasted under the condition that the vacuum degree reaches 100pa, compared with the vacuum value of 20pa required by the existing vacuum film pasting, the vacuum pumping process of 100pa to 20pa is omitted, the vacuum pumping time is greatly shortened, and the working efficiency is greatly improved.
Drawings
The following is a further detailed description of embodiments of the invention with reference to the drawings
FIG. 1 is a schematic structural diagram of a film laminating apparatus according to embodiment 1;
FIG. 2 is a schematic view of a first rolling mechanism in embodiment 1;
fig. 3 is a schematic structural diagram of a second rolling mechanism in embodiment 2.
Marked in the figure as: the wafer vacuum chamber comprises a vacuum chamber body 1, a mounting table top 11, a wafer ring mounting groove 12, a wafer adsorption table top 13, a sealing cover 2, a sliding rail 21, a first lifting assembly 3, a lifting cylinder 31, a first rolling mechanism 4, a first roller 41, a first roller bracket 42, a first driving motor 43, a driving belt pulley 44, a driven belt pulley 45, a belt 46, a second rolling mechanism 5, a second roller 51, a second driving motor 52, a movable frame 53 and a second roller bracket 54.
Detailed Description
In the description of the present invention, it should be noted that, for the azimuth words such as the terms "center", "transverse (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and should not be construed as limiting the specific protection scope of the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first", "a second" feature may explicitly or implicitly include one or more of such feature, and in the description of the present invention, the meaning of "a number", "a number" is two or more, unless otherwise specifically defined.
Example 1
As shown in fig. 1, the wafer film sticking device in this embodiment includes a vacuum mechanism, the vacuum mechanism includes a vacuum cavity 1 and a sealing cover 2, the sealing cover 2 is tightly attached to an opening at the top end of the vacuum cavity 1, and the vacuum cavity 1 is communicated with the inside of the sealing cover 2; the sealing cover 2 is installed on the first lifting assembly 3, the first lifting assembly comprises a lifting air cylinder 31, and the lifting air cylinder 31 drives the sealing cover 2 to lift, so that the sealing cover 2 can be lowered to be in sealing connection with the vacuum cavity 1 or lifted to be separated from the vacuum cavity 1.
A first rolling mechanism 4 is arranged on one side, facing the vacuum cavity, of the sealing cover 2, and the first rolling mechanism 4 comprises a first roller 41 and a first driving component for driving the first roller to move; the first roller 41 is a hard roller, is in a long cylindrical structure, has a length larger than the inner diameter of the sheet ring, and is rotatably mounted on the first roller bracket 42 at two ends of the first roller 41; a sliding rail 21 is arranged in the sealing cover 2, and the first roller bracket 42 can translate on the sliding rail 21 through a sliding block of the first roller bracket; the first driving assembly comprises a first driving motor 43, a driving belt pulley 44, a driven belt pulley 45 and a belt 46, wherein the driving belt pulley 44 is arranged on an output shaft of the first driving motor 43, the driven belt pulley 45 is arranged on the other side of the sealing cover 2, and the belt 46 is sleeved on the driving belt pulley 44 and the driven belt pulley 45; the first roller support 42 is provided with a belt clamping part which can be fixed with the belt 46, and the first driving motor 43 can drive the belt 46 to move through the driving belt pulley 44, so that the first roller support 42 is driven to move along the sliding rail 21, and the first roller 41 rolls on the wafer and the wafer ring.
A hollow installation table top 11 is arranged in the vacuum cavity 1, a sheet ring installation groove 12 is formed in the installation table top, a plurality of first vent holes are formed in the sheet ring installation groove, the first vent holes can be connected with vacuum equipment, can adsorb a sheet ring and a cutting film in a negative pressure state, the sheet ring and the cutting film are adhered together in advance, and the sheet ring is annular and is positioned at the outer side edge of the cutting film; the sheet ring is fixed through negative pressure adsorption, and whether the sheet ring and the cutting film are in place or not can be judged through the change of pressure.
The middle of the installation table 11 is provided with a liftable wafer adsorption table 13, and the wafer adsorption table 13 is in a negative pressure state. The wafer is placed on the wafer adsorption table surface, is fixed through negative pressure adsorption, and can judge whether the wafer is in place or not through the change of pressure. The second lifting component is arranged below the wafer adsorption table top 13, so that the wafer adsorption table top can stably lift. The second lifting assembly can be a conventional linear movement module or other mechanism capable of driving the wafer adsorption table to lift.
When the film is stuck:
1) In the initial state, the sealing cover 2 and the vacuum cavity 1 are in a separated state, the wafer adsorption table 13 in the vacuum cavity 1 is positioned at a high position, and the first roller 41 is positioned at an endpoint position on one side of the sealing cover;
2) Placing the wafer on the wafer adsorption table 13, wherein the wafer adsorption table 13 is in a negative pressure state and can adsorb the wafer, and then the wafer adsorption table 13 descends until the wafer adsorption table 13 is lower than the wafer ring mounting groove 12;
3) The dicing film and the wafer ring are fixed together in advance, the wafer ring is placed in the wafer ring placement groove 12 for fixation, and a certain distance exists between the wafer and the dicing film;
4) The sealing cover 2 moves downwards to be sealed and fixed with the vacuum cavity 1, vacuumizing is started, and the wafer adsorption table 13 rises when the vacuum value reaches a required value, so that the upper surface of the wafer is leveled with the upper surface of the wafer ring;
5) The first driving motor 43 drives the driving belt wheel 44 to rotate, so that the belt 46 drives the first roller bracket 42 to translate along the sliding rail 21, and the first roller 41 rolls over the upper surfaces of the wafer and the wafer ring, so that the cutting film is primarily attached to the wafer;
6) The vacuum cavity 1 and the sealing cover 2 release atmospheric pressure at the same time, and bubbles between the wafer and the cutting film are discharged by using the atmospheric pressure, so that the cutting film at the edge of the wafer is more fit;
7) The sealing cover 2 moves upwards and is separated from the vacuum cavity 1, the wafer ring placing groove 12 and the wafer adsorbing table 13 stop negative pressure, and the manipulator can take off the wafer with the cutting film attached from the wafer adsorbing table 13, so that the film attaching work of the wafer is completed.
Example 2
This embodiment is similar in structure to embodiment 1, except that: the sealing cover 2 is provided with a second rolling mechanism 5 towards one side of the vacuum cavity 1, the second rolling mechanism 5 comprises a second roller 51 and a second driving assembly for driving the second roller to move, the second driving assembly comprises a second driving motor 52, and the axis of an output shaft of the second driving motor penetrates through the circle center of the wafer. The second roller 51 is a hard roller, and is rotatably mounted on the movable frame 53, the movable frame 53 is rotatably mounted at one end of the second roller support 54, the other end of the second roller support 54 is mounted on the output shaft of the second driving motor 52, and the radius of the second roller support can enable the second roller to just fall on an ineffective area at the edge of the wafer.
The second driving motor 52 drives the second roller bracket 54 to rotate, so that the second roller 51 is driven to roll one circle along the edge of the wafer, the rolling range only comprises an ineffective area and a wafer ring at the edge of the wafer, the effective area in the middle of the wafer cannot be contacted, the wafer cannot be damaged, and the non-contact film pasting requirement of the wafer is met.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.

Claims (10)

1. The wafer film pasting method is characterized by comprising the following steps of: and sequentially placing the wafer and the film-adhered wafer ring into a vacuum cavity, and after vacuumizing, utilizing a roller to assist the film to be adhered to the wafer.
2. A method of wafer lamination as defined in claim 1, wherein: in the initial stage, a height difference exists between the wafer and the film-attached wafer ring; after vacuumizing, the wafer is moved to the upper surface to be level with the upper surface of the wafer ring, and the wafer ring is positioned in the rolling range of the roller.
3. A method of wafer lamination as defined in claim 1, wherein: the roller is of a long cylindrical structure, and the rolling range covers the wafer and the wafer ring.
4. A method of wafer lamination as defined in claim 1, wherein: the roller rolls one turn along the wafer edge, and the rolling range only comprises the invalid area of the wafer edge and the sheet ring.
5. A method of wafer lamination as defined in claim 1, wherein: in the initial stage, placing a wafer on an ascending wafer adsorption table top, then descending the wafer adsorption table top, and placing a film-attached wafer ring in a wafer ring placement groove, wherein the wafer is lower than the film-attached wafer ring; the vacuum pumping is started, and after the vacuum value reaches a set value, the wafer adsorption table surface rises to make the upper surface of the wafer and the upper surface of the wafer ring be leveled, and the roller starts rolling; after rolling is completed, the vacuum is released and the film and wafer are pressed together using atmospheric pressure.
6. The utility model provides a wafer pad pasting device, includes vacuum mechanism, its characterized in that: the interior of the vacuum mechanism is provided with a rolling mechanism.
7. The wafer film laminating apparatus as set forth in claim 6, wherein: the vacuum mechanism comprises a vacuum cavity and a sealing cover, the vacuum cavity and the sealing cover are in sealing fit, the rolling mechanism is positioned on the inner side of the sealing cover and comprises rollers and a driving assembly for driving the rollers to move.
8. The wafer film laminating apparatus as set forth in claim 6, wherein: the roller is of a long cylindrical structure, two ends of the roller are rotatably mounted on the roller support, the driving assembly drives the roller support to translate, and the roller rolls on the wafer ring and the wafer.
9. The wafer film laminating apparatus as set forth in claim 6, wherein: the roller is rotatably arranged on the roller support, the driving assembly drives the roller support to rotate, and the roller rolls one circle along the edge of the wafer.
10. The wafer film laminating apparatus as set forth in claim 6, wherein: an annular table top is arranged above the vacuum cavity, and a slice ring placement groove is formed in the annular table top; the middle of the annular table top is provided with a liftable wafer adsorption table top.
CN202311540153.0A 2023-11-18 2023-11-18 Wafer film pasting method and device Pending CN117373961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311540153.0A CN117373961A (en) 2023-11-18 2023-11-18 Wafer film pasting method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311540153.0A CN117373961A (en) 2023-11-18 2023-11-18 Wafer film pasting method and device

Publications (1)

Publication Number Publication Date
CN117373961A true CN117373961A (en) 2024-01-09

Family

ID=89402428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311540153.0A Pending CN117373961A (en) 2023-11-18 2023-11-18 Wafer film pasting method and device

Country Status (1)

Country Link
CN (1) CN117373961A (en)

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