CN117355585A - Release film - Google Patents
Release film Download PDFInfo
- Publication number
- CN117355585A CN117355585A CN202280036261.1A CN202280036261A CN117355585A CN 117355585 A CN117355585 A CN 117355585A CN 202280036261 A CN202280036261 A CN 202280036261A CN 117355585 A CN117355585 A CN 117355585A
- Authority
- CN
- China
- Prior art keywords
- release
- release layer
- mass
- film
- acrylic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 59
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 59
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 31
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 31
- 239000000126 substance Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 129
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- -1 acryl group Chemical group 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 108010000020 Platelet Factor 3 Proteins 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 22
- 239000002390 adhesive tape Substances 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229910052799 carbon Inorganic materials 0.000 description 11
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 11
- 229920000877 Melamine resin Polymers 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229920006267 polyester film Polymers 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000003377 acid catalyst Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000013522 chelant Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 230000001747 exhibiting effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- REIUXOLGHVXAEO-UHFFFAOYSA-N pentadecan-1-ol Chemical compound CCCCCCCCCCCCCCCO REIUXOLGHVXAEO-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 2
- 229920003274 CYMEL® 303 LF Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical class NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007611 bar coating method Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- NOPFSRXAKWQILS-UHFFFAOYSA-N docosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCO NOPFSRXAKWQILS-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- 239000011254 layer-forming composition Substances 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RAADJDWNEAXLBL-UHFFFAOYSA-N 1,2-di(nonyl)naphthalene Chemical compound C1=CC=CC2=C(CCCCCCCCC)C(CCCCCCCCC)=CC=C21 RAADJDWNEAXLBL-UHFFFAOYSA-N 0.000 description 1
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 1
- QBDAFARLDLCWAT-UHFFFAOYSA-N 2,3-dihydropyran-6-one Chemical compound O=C1OCCC=C1 QBDAFARLDLCWAT-UHFFFAOYSA-N 0.000 description 1
- CVLHGLWXLDOELD-UHFFFAOYSA-N 4-(Propan-2-yl)benzenesulfonic acid Chemical compound CC(C)C1=CC=C(S(O)(=O)=O)C=C1 CVLHGLWXLDOELD-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- 229920003275 CYMEL® 325 Polymers 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- USDJGQLNFPZEON-UHFFFAOYSA-N [[4,6-bis(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(NCO)=NC(NCO)=N1 USDJGQLNFPZEON-UHFFFAOYSA-N 0.000 description 1
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 1
- SYDYRFPJJJPJFE-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(N(CO)CO)=NC(N(CO)CO)=N1 SYDYRFPJJJPJFE-UHFFFAOYSA-N 0.000 description 1
- SUPOBRXPULIDDX-UHFFFAOYSA-N [[4-amino-6-(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound NC1=NC(NCO)=NC(NCO)=N1 SUPOBRXPULIDDX-UHFFFAOYSA-N 0.000 description 1
- WEAJVJTWVRAPED-UHFFFAOYSA-N [[4-amino-6-[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound NC1=NC(N(CO)CO)=NC(N(CO)CO)=N1 WEAJVJTWVRAPED-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- BTFJIXJJCSYFAL-UHFFFAOYSA-N arachidyl alcohol Natural products CCCCCCCCCCCCCCCCCCCCO BTFJIXJJCSYFAL-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- LPTWEDZIPSKWDG-UHFFFAOYSA-N benzenesulfonic acid;dodecane Chemical class OS(=O)(=O)C1=CC=CC=C1.CCCCCCCCCCCC LPTWEDZIPSKWDG-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BFAKENXZKHGIGE-UHFFFAOYSA-N bis(2,3,5,6-tetrafluoro-4-iodophenyl)diazene Chemical compound FC1=C(C(=C(C(=C1F)I)F)F)N=NC1=C(C(=C(C(=C1F)F)I)F)F BFAKENXZKHGIGE-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229960000735 docosanol Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CJMZLCRLBNZJQR-UHFFFAOYSA-N ethyl 2-amino-4-(4-fluorophenyl)thiophene-3-carboxylate Chemical compound CCOC(=O)C1=C(N)SC=C1C1=CC=C(F)C=C1 CJMZLCRLBNZJQR-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical compound CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/005—Presence of (meth)acrylic polymer in the release coating
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Abstract
[ problem ]]The invention provides a release film which has light release force before and after heating and can have light release force even under the condition of high-speed peeling, and does not substantially contain organic silicon. [ solution ]]A release film comprising a base film and a release layer, wherein the release layer comprises at least an acrylic resin (A), a crosslinking agent (B) and a release agent (C), the acrylic resin (A) comprises at least an A-1 component represented by a specific chemical formula (formula 1) and an A-2 component represented by a specific chemical formula (formula 2), the release layer contains substantially no silicone component, the release layer is laminated on the base film, and the ratio a/B of the mass (a) of the acrylic resin (A) to the mass (B) of the crosslinking agent (B) contained in the release layer satisfies the formula (I) (I) 0.1.ltoreq.a/b.ltoreq.8.0. In the formula (1) in the specification, R 1 Represents (cnh2n+1) (n=an integer of 8 to 20 inclusive), R 4 Represents H or CH 3 . In the formula (2) in the specification, R 2 Represents (CmH 2 mOH) (m=an integer of 1 to 10 inclusive) or H, R 4 Represents H or CH 3 。
Description
Technical Field
The present invention relates to release films.
Background
A release film comprising a base material such as a polyethylene film and a release layer laminated thereon is used in various applications such as a battery component, an adhesive layer protection (OCA (Optical Clear Adhesive) protection, adhesive tape protection, etc.), a percutaneous absorption type separator for application in medical fields, a process paper used in a process for producing electronic parts such as ceramic capacitors, and protection of image display components. One specific example is given: the pressure-sensitive adhesive sheet is composed of a base material and a pressure-sensitive adhesive layer, and is used as a film for a process for producing electronic components and the like. The pressure-sensitive adhesive sheet is adhered to a release film before being used as a process film. In order to improve releasability, a release agent layer is provided on the surface (contact surface with the pressure-sensitive adhesive layer) of the release film. Examples of the constituent material of the release agent layer include silicone release agents, fluorine release agents, and long-chain alkyl release agents.
The silicone release agent has excellent releasability. However, there are problems that the silicone component is easily transferred to the mold body to be removed, and that the electronic equipment is erroneously operated due to contamination by the silicone, and the like, and it is difficult to use the silicone component in an electronic component. The fluorine-based release agent has excellent releasability and heat resistance. However, the cost is high and the wettability is poor. The wettability of the long-chain alkyl-based release agent is better than that of the silicone-based release agent and the fluorine-based release agent. However, it does not necessarily have sufficient releasability.
Patent document 1 (japanese patent application laid-open No. 2010-144046) discloses a release agent comprising, as a main agent, a poly (meth) acrylate containing (a) a mono-or polyalkylene glycol (meth) acrylate unit having an alkyl or aryl terminal, and (B) an alkyl (meth) acrylate unit having an alkyl group with a carbon number of 1 to 30, as a release agent capable of preventing shrinkage when an adhesive resin is applied to the release agent and further maintaining the peeling performance of a self-adhesive resin film satisfactorily.
Patent document 2 (japanese patent application laid-open No. 2007-002092) discloses a release agent which comprises, as a release agent having a release property lighter than that of a release agent made of a silicone resin and having no mobility, an active ingredient obtained by crosslinking at least a prepolymer obtained by copolymerizing an alkyl (meth) acrylate and a hydroxyalkyl (meth) acrylate with an isocyanate group-containing compound.
Patent document 3 (japanese patent application laid-open No. 2014-151481) discloses a laminated polyester film, which is characterized in that a coating layer formed of a coating liquid containing a release agent and an active methylene blocked isocyanate compound is provided on at least one surface of a polyester film as a release polyester film having little deterioration in releasability due to heat at the time of processing.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2010-144046
Patent document 2: japanese patent application laid-open No. 2007002092
Patent document 3: japanese patent application laid-open No. 2014-151481
Disclosure of Invention
Problems to be solved by the invention
However, in the technique of patent document 1, a release agent having a large release force and a lighter release force is required.
In addition, the technique of patent document 2 has a problem that wettability of the release agent is insufficient. The technique of patent document 3 has a problem that the peeling force after heating is heavy, and the increase in peeling force due to heating is not sufficiently suppressed.
In addition, in the production process of electronic parts and the like, heat and pressure may be applied to the release film, and in this case, the long-chain alkyl-based release agent tends to increase in release force after heating. In the production process of the desired product, it is required to perform the peeling at a high speed in order to further improve the productivity. However, peeling at high speed, particularly when peeling at high speed after heating, tends to increase peeling force. Further, even if the release layer can be peeled off, cohesive failure occurs in the release layer, and there is a possibility that the release layer component is transferred to the object to be released.
In this way, the long-chain alkyl-based release agent has a problem that the performance as a release agent cannot be sufficiently exhibited, and improvement thereof is demanded.
The present invention is an invention for solving the above-described problems, and for example, the present invention provides a release film which has a light peeling force before and after heating, and which can have a light peeling force even in the case of high-speed peeling, and which does not substantially contain silicone.
Means for solving the problems
The present inventors have made intensive studies to solve the above problems, and as a result, have found that the above object can be achieved by a release film having the following constitution, and have completed the present invention.
That is, the present invention includes the following configurations.
[1] A release film comprising a base film and a release layer in this order,
the release layer comprises at least an acrylic resin (A), a crosslinking agent (B) and a release agent (C),
the acrylic resin (A) contains at least an A-1 component represented by the following chemical formula (1) and an A-2 component represented by the following chemical formula (2),
the release layer contains substantially no silicone component,
the ratio a/B of the mass (a) of the acrylic resin (a) to the mass (B) of the crosslinking agent (B) contained in the release layer satisfies the formula (I).
(I)0.1≤a/b≤8.0。
In the formula (1), R 1 Represents (cnh2n+1) (n=an integer of 8 to 20 inclusive), R 4 Represents H or CH 3 。
In the formula (2), R 2 Represents (CmH 2 mOH) or H (m=an integer of 1 to 10 inclusive), R 4 Represents H or CH 3 。
[2] In one embodiment, the release layer in the release layer of the present invention further comprises a release agent (C), and the ratio C/b of the mass (C) of the release agent to the mass (b) of the crosslinking agent contained in the release layer satisfies the formula (II).
(II)0.1≤c/b≤12.0。
[3] In one embodiment, the total mass of the A-1 component and the A-2 component of the acrylic resin (A) in the release layer is more than 50 parts by mass, based on 100 parts by mass of the total.
[4] In one embodiment, the release agent (C) does not contain an acryl group, and further contains at least a long-chain alkyl group containing no silicone and a reactive functional group.
[5] In one embodiment, the release film of the present invention has a normal peel force (PF 1) of 500mN/50mm or less at a peel speed of 0.3 m/min.
[6] In one embodiment, the release film of the present invention has a release rate of 0.3 m/min, and a release force (PF 2) after 20 hours heating at 70℃is 2 times or less the normal release force (PF 1).
[7] In one embodiment, the release film of the present invention has a release rate of 30 m/min at 70℃and a release force (PF 3) after 20 hours heating of 30 times or less the normal release force (PF 1).
[8] In another aspect of the present invention, there is provided a laminated film comprising an adhesive layer laminated on at least one surface of the release film of the present invention.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, there is provided a release film which has light releasability before and after heating and which can maintain light releasability even in the case of high-speed release.
Detailed Description
As a result of intensive studies, the present inventors have found that the present invention relates to a release film according to claim 1, which comprises a base film and a release layer,
the release layer comprises at least an acrylic resin (A), a crosslinking agent (B) and a release agent (C),
the acrylic resin (A) contains at least an A-1 component represented by the following chemical formula (1) and an A-2 component represented by the following chemical formula (2),
the release layer contains substantially no organic silicon component, and is laminated on the base film,
the ratio a/B of the mass (a) of the acrylic resin (a) to the mass (B) of the crosslinking agent (B) contained in the release layer satisfies the formula (I).
(I)0.1≤a/b≤8.0
In the formula (1), R 1 Represents (cnh2n+1) (n=an integer of 8 to 20 inclusive), R 4 Represents H or CH 3 。
In the formula (2), R 2 Represents (CmH 2 mOH) (m=an integer of 1 to 10 inclusive) or H, R 4 Represents H or CH 3 。
(substrate film)
The release film of the present invention comprises a substrate and a release layer disposed on the surface of the substrate. When the mold body to be released is disposed on the release layer of the release film, the mold body to be released can be molded into the same shape as the base material. In addition, since the release layer and the release target are easily peeled off, the shape of the release target can be deformed and maintained as desired. The release layer may be provided on one surface or both surfaces of the substrate.
As the base material, a known base material can be used. For example, as the base material, a resin film formed of polyester such as polyethylene terephthalate and polyethylene naphthalate, polyolefin such as polypropylene, polyimide, or the like can be used. In particular, from the viewpoint of cost and productivity, a polyester film is preferable, and a polyethylene terephthalate film is more preferable.
The thickness of the base material is preferably 10 μm or more and 188 μm or less, more preferably 25 μm or more and 100 μm or less. By setting the thickness of the base material to 10 μm or more, deformation can be suppressed by heat at the time of production, processing, and molding of the base material. On the other hand, when the thickness of the base material is 188 μm or less, the amount of the base material to be discarded after use can be suppressed while satisfying the physical properties required for the base material, and the burden on the environment can be reduced.
An easy-to-adhere coating for improving adhesion may be disposed between the substrate and the release layer. Further, a coating layer for providing slidability, heat resistance, antistatic properties, and the like may be provided on the surface of the base material opposite to the surface on which the release layer is provided.
The average width (Sa) of the contour unit of the surface of the laminated release layer of the base film used in the present invention is preferably in the range of 1 to 50nm, more preferably 2 to 30nm. The maximum protrusion height (P) of the surface of the laminated release layer of the base film used in the present invention is 2 μm or less, more preferably 1.5 μm or less. When Sa is 50nm or less and P is 2 μm or less, it is possible to suppress the uneven thickness of the release layer and to constantly maintain the smoothness of the release layer surface, and further, it is possible to reduce the uneven thickness of the release film, and it is possible to suppress the possibility of occurrence of cracking starting from a portion having a small thickness when the release film is peeled off the release object.
The average width (Sa) of the outline unit of the base film used in the present invention, which is opposite to the surface of the laminated release layer, is preferably in the range of 10 to 100nm, more preferably 2 to 30nm. The maximum protrusion height (P) of the base film used in the present invention, which is opposite to the surface of the laminated release layer, is preferably 2 μm or less, more preferably 1.5 μm or less. If Sa is 10nm or more, the sliding properties between the release surface and the reverse release surface are improved, and the winding property is excellent. If P is 2 μm or less, the possibility of peeling off a part of the release layer during winding is reduced, and the surface of the release layer is not damaged. Further, the possibility of occurrence of cracking starting from the portion from which the release layer is peeled off when the object to be released is peeled off from the release film can be suppressed.
The haze of the base film used in the present invention is preferably 10% or less, more preferably 5% or less, and further preferably 3% or less. When the haze is 10% or less, the appearance inspection is easy at the time of processing such as a release film and an adhesive layer on the release film.
The base film of the present invention may be polyester film scraps or recycled materials for plastic bottles. In the present invention, since such film scraps and recycled materials for plastic bottles can be used, environmental load can be greatly reduced. In addition, in the mode of containing film scraps and recycled raw materials of the plastic bottle, the slidability of the film can be improved, and the degassing easiness can be maintained. The release layer of the present invention can be used for recycling, treating and reusing polyester films used for various applications.
When such a reclaimed material (material) is contained, fine particles having a size in the range of 1 to 50nm may be contained in the contour unit of the surface of the laminated release layer of the base film, or fine particles having a size of 2 μm or less may be contained in the surface of the laminated release layer of the base film.
For example, the size of the fine particles of the substrate of the present invention may be in the range of (0.001 μm or more and 10 μm). If the particles have a size in this range, the average width (Sa) and the maximum protrusion height (P) of the contour elements on the surface of the laminated release layer of the base film can be satisfied.
In one embodiment, the substrate has a surface layer substantially free of inorganic particles, and the release layer may be laminated on the surface layer.
(Release layer)
The release layer in the present invention is a release layer that contains at least an acrylic resin (a), a crosslinking agent (B), and a release agent (C), and that contains substantially no silicone component. For example, the release layer can be formed by curing a release layer forming composition containing the acrylic resin (a), the crosslinking agent (B), and the release agent (C).
(acrylic resin)
The release layer of the present invention contains an acrylic resin (a).
The acrylic resin (a) contained in the release layer of the present invention preferably has a long-chain alkyl group. Although not theoretically, by repeating the results of the experiment, it is considered that: the acrylic resin (a) has a long-chain alkyl group, so that a release agent described later can be efficiently blended on the surface of the release layer. In particular, the acrylic resin (a) of the present invention may exhibit good wettability, for example, to an adhesive composition forming an adhesive. Further, the acrylic resin (a) of the present invention can provide a release film which has light releasability from a release object such as an adhesive formed on a release layer before and after heating and maintains light releasability even in the case of high-speed release.
In this way, the acrylic resin (a) can contribute to releasability in addition to the function as a binder in the release layer. For example, the molecular weight of the acrylic resin (a) is preferably more than 500.
The acrylic resin of the present invention may further contain a methacrylic resin, for example, a polymer of methyl methacrylate (methyl methacrylate=mma), or a copolymer with an acrylic ester (acrylic ester).
In the present invention, the term "before heating" means a condition of a temperature of 22℃and a humidity of 60%, and the term "after heating" means a condition of a temperature of 70℃after heating for 20 hours. In the present invention, the heated material may be cooled to a temperature equal to or lower than the ambient temperature (for example, 40 ℃ or lower) as well as immediately after the heating.
The release layer of the present invention contains the acrylic resin (a) and does not substantially contain an organosilicon component. Therefore, transfer of the silicone component to the object to be released can be suppressed, and thus, for example, contamination of the object to be released with silicone can be prevented, and for example, an operation failure of the electronic device due to the object to be released can be avoided. In the present specification, "substantially not including the silicone component" means that the silicone component is not intentionally added to the component forming the release layer. For example, in the step of producing a release layer, there is a possibility that an extremely small amount of an unexpected silicone composition is contained. In view of such a practical situation, the amount of the silicone component contained in the release layer is preferably less than 0.1 part by mass with respect to 100 parts by mass of the release layer.
The acrylic resin (a) may be, for example, an acrylic polymer obtained by copolymerizing a long-chain alkyl acrylate, a graft polymer obtained by grafting a long-chain alkyl group, a blocked polymer obtained by adding a long-chain alkyl group to the end, or the like.
The acrylic resin (A) is preferably a polymer comprising at least an A-1 component represented by the following formula (1) and an A-2 component represented by the following formula (2).
In the formula (1), R 1 Represents (cnh2n+1) (n=an integer of 8 to 20 inclusive), R 4 Represents H or CH 3 。
In the formula (2), R 2 Represents (CmH 2 mOH) (m=an integer of 1 to 10 inclusive) or H, R 4 Represents H or CH 3 。
When the total of the mass of the a-1 component and the a-2 component of the acrylic resin (a) in the release layer is 100 parts by mass, the mass of a-1 is preferably more than 50 parts by mass. The mass of A-1 exceeds 50 parts by mass, and thus the releasability of the release layer tends to be low, which is preferable. The mass of A-1 is preferably more than 70 parts by mass, more preferably more than 80 parts by mass, and most preferably more than 90 parts by mass.
For example, the mass of A-1 is 99 parts by mass or less, 96 parts by mass or less, or 92 parts by mass or less. In one embodiment, the mass of A-1 may be 85 parts by mass or less.
The amount of the component A-1 falls within the above range, whereby the physical properties of the release layer can be maintained even before and after heating.
Therefore, the release layer of the present invention has an effect of, for example, more effectively exhibiting a light releasability even before and after heating and maintaining a light releasability even when peeled at a high speed.
In the present invention, the amount of the component A-1 is within the above range, and thus, even when the release film of the present invention is stored after being heated, for example, within a range of several days to several months, the release film can be stored without significantly deteriorating the physical properties of the acrylic resin (A) before heating.
In formula (1) representing component A-1, R 1 Is an alkyl group having 8 to 20 carbon atoms. When the carbon number n is 8 or more, the X component can exhibit good releasability, and the release layer is inhibited from exhibiting adhesiveness due to the alkyl group having a small carbon number. On the other hand, when the carbon number n is 20 or less, the flexibility of the a-1 component can be maintained, and the wettability of the film surface of the release layer can be sufficiently ensured. The carbon number n is preferably 10 to 18, more preferably 12 to 16. In addition, R 1 The compound may be either a linear or branched compound. R is R 1 In the case of a linear shape, the releasability of the release layer tends to be low, and is therefore preferable.
In formula (1) representing component A-1, R 4 Is H or CH 3 Are suitable. As a raw material for the component A-1, a monomer represented by the following formula (7) can be used.
In the formula (7), R 1 Represents (cnh2n+1) (n=an integer of 8 to 20 inclusive), R 4 Represents H or CH 3 。
As a raw material for the component A-1, specifically, lauryl (meth) acrylate, stearyl (meth) acrylate and the like can be used.
R in formula (2) representing component A-2 2 Wherein the carbon number m is 1 to 10. When the carbon number m is 10 or less, the crosslinking density of the release layer of the present invention can be prevented from becoming sparse, the cohesive force of the release layer itself can be suppressed from decreasing, and further the peeling force can be suppressed from becoming heavy. The carbon number m is preferably 2 to 8, more preferably 2 to 4.
In the representation of the A-2 componentIn the formula (2), R 4 Is H or CH 3 Both are preferred. As a raw material for the component A-2, a monomer represented by the following formula (8) can be used.
In formula (8), R 2 Represents (CmH 2 mOH) (m=an integer of 1 to 10 inclusive) or H, R 4 Represents H or CH 3 。
As the raw material of the component A-2, specifically, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate and the like can be used.
(crosslinking agent)
As the crosslinking agent (B) for forming the release layer of the present invention, polyisocyanate, melamine, epoxy resin, aluminum chelate, titanium chelate, ultraviolet curable resin, or a mixture of 2 or more thereof can be used. Among them, the use of melamine is preferable because the cured film is rigid and has excellent chemical resistance and weather resistance. The crosslinking in the aluminum chelate or the titanium chelate may be undesirable depending on the application.
In the present invention, the ratio a/b of the mass (a) of the acrylic resin to the mass (b) of the crosslinking agent contained in the release layer satisfies the formula (I)
(I)0.1≤a/b≤8.0。
In one embodiment, the ratio a/b of the mass (a) of the acrylic resin to the mass (b) of the crosslinking agent is 0.2 to 5.0, for example, 0.2 to 4.0, and may be 0.2 to 2.5. When the ratio a/b of the mass (a) of the acrylic resin to the mass (b) of the crosslinking agent falls within the above range, the acrylic resin (a) and the acrylic resin (a) further added as needed are crosslinked by the crosslinking agent, and the elastic modulus of the release layer is improved, so that the release force can be further reduced. In addition, since the release component of the acrylic resin (a) blended on the surface of the release layer is fixed by the crosslinking agent even after heating, the rise in the release force after heating is suppressed. If the ratio a/b of the mass (a) of the acrylic resin to the mass (b) of the crosslinking agent is 0.1 or less, the release component of the acrylic resin (a) existing on the surface of the release layer becomes small, and thus, for example, in the case of using an adhesive in the release film, the release force may become heavy.
If the ratio a/b of the mass (a) of the acrylic resin to the mass (b) of the crosslinking agent is 8.0 or more, the crosslinking agent becomes small, and therefore the acrylic resin (a) may not be sufficiently crosslinked, and the release layer strength may be insufficient, and the peeling force may be increased. In addition, the problem tends to be more remarkable at the time of high-speed peeling.
The melamine-based compound used in the release layer of the present invention may be any general compound, and is preferably obtained by condensing melamine with formaldehyde, and has 1 or more triazine ring and hydroxymethyl and/or alkoxymethyl groups in 1 molecule. Specifically, a methylolmelamine derivative obtained by condensing melamine with formaldehyde, and a compound etherified by a dehydration condensation reaction of methanol, ethanol, isopropanol, butanol, or the like, which is a lower alcohol, are preferable. Examples of methylolated melamine derivatives include monomethylol melamine, dimethylol melamine, trimethylol melamine, tetramethylol melamine, pentamethylol melamine, and hexamethylol melamine. 1 kind may be used, or 2 or more kinds may be used.
The melamine used in the present invention may be commercially available melamine. Examples of the "Nicak" include CYMEL300, CYMEL301, CYMEL303LF, CYMEL350, CYMEL370N, CYMEL771, CYMEL325, CYMEL327, CYMEL703, CYMEL712, CYMEL701, CYMEL266, CYMEL267, CYMEL285, CYMEL232, CYMEL235, CYMEL236, CYMEL238, CYMEL272, CYMEL212, CYMEL253, CYMEL254, CYMEL202, CYMEL207 (manufactured by Allnex Japan Inc.), nicakMW-30-M, nicalackMW-30, nicalackMW-30-HM, nicalackMW-390, nicalackMW-100-L M, nicalackMA-1-750-LM, nicalackMW-22, nicalackMS-21, nicakMS-11, nicakMW-24A-1, nicakMS-001, caMA-1-002, nicaMA-1-730, nicaMA-35, nicaMA-75, nicaMA-35-75, nicalack-1-35, nicalack-35, nicalack-1-35, nicalack-35-Nicalac-35, nicalack-1-Nicak-35, nicalack-35-Nicalack-1-Nicavalk-Nicak-35. Among them, polyether-type methylated melamine resins are preferable from the viewpoints of curability at low temperature in a short time and adhesion to polyester films. As commercial products, CYMEL303LF, nicalackMW-30 and the like can be mentioned.
In the release layer of the present invention, an acid catalyst is preferably added to promote the crosslinking reaction of the melamine compound, and the release layer-forming composition is preferably coated with the acid catalyst and cured. The acid catalyst to be used is not particularly limited, and a conventional acid catalyst can be used, but a sulfonic acid catalyst is preferably used.
As the sulfonic acid-based catalyst, for example, p-toluenesulfonic acid, xylenesulfonic acid, cumene sulfonic acid, dodecylbenzene sulfonic acid, dinonylnaphthalene sulfonic acid, trifluoromethane sulfonic acid and the like can be preferably used, and p-toluenesulfonic acid can be particularly preferably used from the viewpoint of reactivity.
The sulfonic acid-based catalyst has a higher acidity and excellent reactivity than other acid catalysts such as carboxylic acid-based catalysts, and therefore can be processed at a lower temperature in the mold release layer. Therefore, it is preferable to suppress the deterioration of the flatness and the winding appearance of the film due to heat during processing.
The sulfonic acid-based catalyst used in the present invention may be a commercially available catalyst. Examples of the commercial products include DRIER (registered trademark) 900 (p-toluenesulfonic acid, manufactured by hitachi chemical Co., ltd.), NACURE (registered trademark) DNNDSA series (dinonylnaphthalene disulfonic acid, manufactured by nana chemical Co., ltd.), DNNSA series (dinonylnaphthalene (mono) sulfonic acid, manufactured by nana chemical Co., ltd.), DDBSA series (dodecylbenzenesulfonic acid, manufactured by nana chemical Co., ltd.), and p-TSA series (p-toluenesulfonic acid, manufactured by nana chemical Co., ltd.).
(Release agent)
In one embodiment, the release layer further comprises a release agent (C). The release agent (C) preferably contains reactive functional groups. Although it is not possible to analyze the results of the experiment, it is thought that the release agent (C) added is crosslinked with the acrylic resin (a) existing in the vicinity of the surface of the release layer, and is densely present as compared with the case where only the long-chain alkyl component is the acrylic resin (a) in the vicinity of the surface of the release layer, whereby the peeling force can be reduced. In addition, it is considered that the release agent (C) is crosslinked even after heating and can stay on the surface of the release layer, and therefore, the rise in the release force can be suppressed even after heating.
The release agent used in the present invention is preferably a compound containing no acryl group, a long-chain alkyl group containing no silicone, and a reactive functional group, and is preferably a low-molecular-weight polyolefin wax, a long-chain alkyl-based additive, a higher alcohol, or the like. They may be linear or branched in structure. Among them, 2 or more materials may be mixed and used.
The mold release agent used in the present invention is preferably low in molecular weight, and the molecular weight is preferably 100 to 500. By making the molecular weight of the release agent within the above range, the release agent can be easily oriented on the surface of the release layer, and the peeling force can be reduced. On the other hand, when the molecular weight is 100 or more, the releasability of the release agent can be exhibited, and the risk of exhibiting adhesion can be suppressed. In addition, when the molecular weight is 500 or less, the decrease in solubility of the release agent can be suppressed, the decrease in planarity of the release film surface can be suppressed, and the risk of deterioration in the appearance of the obtained release film can be reduced.
(Low molecular weight polyolefin wax)
As the low molecular weight polyolefin wax, for example, a low molecular weight polyolefin wax such as polyethylene wax or polypropylene wax can be used.
(Long-chain alkyl-based additive)
As the long-chain alkyl-based additive, an additive other than the acrylic resin (a) may be added. For example, low molecular weight additives having an alkyl chain such as PEELOIL1010 and PEELOIL1010S (both of which are manufactured by Niku oil industry Co., ltd.) may be appropriately used. The release additive is added at a proper time in an amount capable of exhibiting a predetermined release property.
(higher alcohols)
As the higher alcohol, there may be mentioned octanol, nonanol, decanol, undecanol, dodecanol, tridecanol, tetradecanol, pentadecanol, hexadecanol, heptadecanol, octadecanol, eicosanol, docosanol and the like.
The carbon number of the higher alcohol is preferably 8 or more and 24 or less. The release layer exhibits good releasability by having a carbon number of 8 or more. If the carbon number is 24 or less, the solubility in a solvent is good, and therefore, the possibility of damaging the appearance of the coating film is low, which is preferable.
In one embodiment, the ratio c/b of the mass (c) of the release agent to the mass (b) of the crosslinking agent contained in the release layer satisfies the formula (II).
(II)0.1≤c/b≤12.0。
For example, the ratio c/b of the mass (c) of the release agent to the mass (b) of the crosslinking agent is preferably 7.0 or less, for example, 5.0 or less, as the amount of the release agent to be added in the present invention. The ratio c/b may be 0.15 or more.
By adjusting the ratio (c/b) of the release agent/crosslinking agent to the present range, the release agent component segregates to the surface of the release layer, and the normal release force can be reduced. Further, since the release agent component blended on the surface of the release layer after heating is also fixed by the crosslinking agent, the rise in the release force after heating and the high-speed release force after heating is suppressed.
On the other hand, if the ratio of the release agent/crosslinking agent is 12.0 or more, the crosslinking agent is small, and therefore, there is a concern that the release component may not stay on the surface layer of the release layer when heating is performed, and the release force may become heavy after heating.
Although not being limited by a specific theory, the release agent (C) can be used in combination with the acrylic resin (a) of the present invention, and can be maintained to such an extent that the release agent (C) is not peeled off from the surface of the release layer, and can have sufficient film strength and releasability.
In one embodiment, the ratio a/c of the mass (a) of the acrylic resin to the mass (c) of the release agent contained in the release layer satisfies the formula (III).
(III)0.1≤a/c≤7.0
For example, as the amount of the release agent to be added in the present invention, the ratio a/c of the mass (a) of the acrylic resin to the mass (c) of the release agent is preferably 5.0 or less, more preferably 3.0 or less, and most preferably 2.0 or less. The ratio a/c is preferably 0.3 or more, more preferably 0.5 or more, and most preferably 0.7 or more.
By adjusting the acrylic resin/release agent (a/c) to the present range, the release agent component segregates to the surface of the release layer, and the normal release force can be reduced. Further, since the release agent component blended on the surface of the release layer after heating is also fixed by the crosslinking agent, the rise in the release force after heating and the high-speed release force after heating is suppressed.
If the ratio of the acrylic resin to the release agent (a/c) is 0.1 or less, the release agent is excessively contained, and therefore the release agent is excessively segregated on the surface of the release layer, and a film having sufficient hardness is not obtained, which is not preferable.
Although not being limited by a specific theory, the release agent (C) can be used in combination with the acrylic resin (a) of the present invention, and can be maintained to such an extent that the release agent (C) is not peeled off from the surface of the release layer, and can have sufficient film strength and releasability.
Additives such as an adhesion improving agent and an antistatic agent may be added to the release layer of the present invention as long as the effects of the present invention are not impaired. In order to improve the adhesion to the substrate, it is preferable to perform pretreatment such as anchor coating, corona treatment, plasma treatment, and atmospheric pressure plasma treatment on the surface of the polyester film before providing the release coating layer.
The thickness of the release layer is preferably 0.01 μm or more and 10 μm or less, more preferably 0.05 μm or more and 1 μm or less. If the thickness of the release layer is less than 0.01 μm, it is difficult to uniformly mold the release layer, and the release force may become unstable. On the other hand, when the thickness of the release layer exceeds 10. Mu.m, the use ratio of the reclaimed material becomes low, which is not preferable.
The average width (Sa) of the outline unit of the release layer is preferably in the range of 1 to 50nm, more preferably 2 to 30nm. The maximum protrusion height (P) of the surface of the laminated release layer of the base film used in the present invention is preferably 2 μm or less, more preferably 1.5 μm or less. If Sa is 50nm or less and P is 2 μm or less, uneven thickness of the release layer can be suppressed and smoothness of the surface of the release layer can be constantly maintained, and the possibility of occurrence of cracking starting from a portion having a small thickness when the release film is peeled from the release body can be suppressed.
The average width (Sa) and the maximum protrusion height (P) of the profile unit change rate before and after heating is preferably 20% or less, more preferably 10% or less, and still more preferably 5% or less. If the average width (Sa) of the contour elements and the rate of change of the maximum protrusion height (P) before and after heating are within 20%, the adhesion area between the release layer and the release object after heating increases, and the possibility of heavy peeling is preferably low when the release object is peeled from the release layer due to the anchoring effect.
In the present invention, the method for forming the release coating layer is not particularly limited, and the following method may be used: the coating liquid in which the release resin is dissolved or dispersed is spread on one surface of the polyester film of the substrate by coating or the like, and the solvent or the like is removed by drying, and then, the coating liquid is dried by heating, thermally cured, or ultraviolet cured. In this case, the drying temperature at the time of solvent drying and heat curing is preferably 180℃or lower, more preferably 160℃or lower, and most preferably 140℃or lower. The heating time is preferably 30 seconds or less, more preferably 20 seconds or less, and still more preferably 10 seconds or less. In the case of 180 ℃ or lower, the flatness of the film is maintained, and the possibility of causing uneven thickness of the release layer is preferably small. At 140 ℃ or less, the film can be processed without impairing the flatness of the film, and the possibility of causing uneven thickness of the release layer is further reduced, which is particularly preferred.
In the present invention, the coating liquid used in coating the release coating layer is not particularly limited, and a solvent having a boiling point of 70 ℃ or higher is preferably added. By adding a solvent having a boiling point of 70 ℃ or higher, bumping during drying can be prevented, leveling of the coating film can be achieved, and planarity of the surface of the coating film after drying can be improved. The amount of the additive is preferably about 50 to 99% by mass based on the entire coating liquid.
As the coating method of the coating liquid, any known coating method can be applied, and for example, conventionally known methods such as roll coating methods such as gravure coating method and reverse coating method, bar coating method such as bar coating method, die coating method, spray coating method, and air knife coating method can be used.
The release film obtained in the present invention preferably has a normal peel force, a peel force after heating, and a peel force at high-speed peeling after heating in the following ranges.
The normal peel force (PF 1) of the release film obtained in the present invention at a peeling speed of 0.3 m/min may be 1000mN/50mm or less, for example 600mN/50mm or less, and may be 500mN/50mm or less. While not being limited by a particular theory, in the present invention, the release layer is characterized by substantially not containing a silicone component, and in particular, when the total of the mass of the a-1 component and the mass of the a-2 component of the acrylic resin (a) in the release layer is set to 100 parts by mass, the mass of a-1 exceeds 50 parts by mass, whereby such light releasability can be derived.
In one embodiment, the normal peel force (PF 1) of the release film obtained in the present invention at a peeling speed of 0.3 m/min is 50mN/50mm or more, for example 80mN/50mm or more.
If the amount is within the above range, the normal peel force is small, and this is preferable. In particular, if the normal peeling force is 50mN/50mm or more and 1000mN/50mm or less, the possibility of peeling the object to be peeled in the conveying step is low, which is preferable. When the peeling force before heating is 1000mN/50mm or less, particularly 500mN/50mm or less, the possibility of deformation of the body to be released is low, which is preferable.
The normal peel force is a normal peel force at a peel speed of 0.3 m/min, and the peel force at the time of peeling off a release film, for example, an adhesive (for example, an acrylic adhesive tape (product of Ridong electric Co., ltd., no. 31B)) disposed on the release layer according to the present invention can be evaluated.
In one embodiment, the peel force (PF 2) after heating (70 ℃ C., 20 hours) at a peel speed of 0.3 m/min is 2 times or less the normal peel force (PF 1). If the peeling force after heating (PF 2) is 2 times or less the normal peeling force, the peeling force after heating is preferably low. The peel force after heating (PF 2) is more preferably 1.9 times or less, most preferably 1.8 times or less the normal peel force (PF 1). If the peeling force after heating is 2 times or less the normal peeling force, the body to be released is preferably not deformed when the body to be released is peeled after heating.
While not being limited by a particular theory, in the present invention, the release layer is characterized by substantially not containing a silicone component, and particularly when the total of the mass of the a-1 component and the mass of the a-2 component of the acrylic resin (a) in the release layer is set to 100 parts by mass, the mass of a-1 exceeds 50 parts by mass, so that light releasability before and after heating can be maintained.
In one embodiment, the peel force (PF 3) after heating (70 ℃ C., 20 hours) at a peel speed of 30 m/min is 30 times or less the normal peel force (PF 1). By having such a relationship, the high-speed peeling force after heating is preferably low. The peel force (PF 3) is more preferably 25 times or less, most preferably 20 times or less, the normal peel force (PF 1). If the peeling force (PF 3) is 30 times or less the normal peeling force (PF 1), the possibility of deformation of the body to be released is low when the body to be released is peeled at a high speed after heating.
In the present invention, a laminated film can be obtained by providing an adhesive layer on at least one side of a release film. The laminated film is obtained, for example, by coating an adhesive composition on at least one surface of the release film of the present invention, drying the coated film as necessary, and forming an adhesive layer on at least one surface of a substrate. For example, the release layer may have an adhesive layer on the surface opposite to the base material.
The present invention is not limited to the pressure-sensitive adhesive sheet, and is used in various applications such as a battery constituent member, pressure-sensitive adhesive layer protection (OCA (Optical Clear Adhesive) protection, pressure-sensitive adhesive tape protection, etc.), a percutaneous absorption type adhesive separator in the medical field, and the protection of electronic components such as ceramic capacitors. The same effect is expected for the effect.
Examples
Hereinafter, the present invention will be described in more detail by using examples, but the present invention is not limited to these examples. The characteristic values used in the present invention were evaluated using the following methods.
< evaluation >
(peel force in Normal (PF 1))
An adhesive tape (31B manufactured by Nito electric Co., ltd.) was attached to the surface of the release film, and the film was pressed by a pressing roller having a wire pressure of 5kgf/mm, and then left to stand at a temperature of 22℃and a humidity of 60% for 20 hours. The release film to which the adhesive tape was attached was cut into short strips having a width of 25mm and a length of 150 mm. One end of the adhesive tape was fixed, one end of the release film was gripped, the release film side was stretched at a speed of 300 mm/min, and the T-shaped peel strength was measured. Ext> Aext> tensileext> testerext> (ext> AUTOGRAPAGext> -ext> Aext> -ext> 1ext>,ext> manufacturedext> byext> Shimadzuext> corporationext>)ext> wasext> usedext> forext> theext> measurementext>.ext> The results are shown in Table 1.
(peeling force after heating (PF 2))
An adhesive tape (trade name "31B" manufactured by Nito electric Co., ltd.) was adhered to the surface of the release film, and the adhesive tape was pressed by a pressing roller having a wire pressure of 5kgf/mm, and then the release film was cut into a short strip having a width of 25mm and a length of 150mm, and heated in an oven at 70℃for 20 hours. Thereafter, one end of the adhesive tape was fixed, one end of the release film was gripped, and the release film side was pulled at a speed of 300 mm/min to peel, and the T-peel strength was measured. Ext> theext> Text> -ext> shapedext> peelext> strengthext> wasext> measuredext> usingext> aext> tensileext> testerext> (ext> AUTOGRAPHAGext> -ext> Aext> -ext> 1ext>,ext> manufacturedext> byext> Shimadzuext> corporationext>)ext>.ext> The results are shown in Table 1.
(high-speed peeling force after heating (PF 3))
An adhesive tape (trade name "31B" manufactured by Nito electric Co., ltd.) was adhered to the surface of the release film, and the adhesive tape was pressed by a pressing roller having a wire pressure of 5kgf/mm, and then the release film was cut into a short strip having a width of 25mm and a length of 150mm, and heated in an oven at 70℃for 20 hours. Thereafter, the release film side was fixed to the metal plate with a double-sided tape, one end of the adhesive tape was gripped, the adhesive tape side was pulled at a speed of 30 m/min, and the release film side was peeled off, and 180 ° peel strength was measured. The 180℃peel strength was measured using a tensile TESTER (TESTER SANGYO CO., LTD. High speed Peel TESTER TE-701). The results are shown in Table 1.
(Silicone migration)
An adhesive tape (trade name "31B" manufactured by Nito electric Co., ltd.) was adhered to the surface of the release film, and the adhesive tape was pressed by a pressing roller having a wire pressure of 5kgf/mm, and then the release film was cut into a short strip having a width of 25mm and a length of 150mm, and heated in an oven at 70℃for 20 hours. Thereafter, one end of the adhesive tape was fixed, one end of the release film was gripped, the release film side was pulled at a speed of 300 mm/min and peeled, and the Si strength (I) of the peeled adhesive tape was measured 1 ). In addition, the Si strength (I) 0 ) As a blank measurement, calculate I 1 -I 0 。I 1 -I 0 >In the case of 0, as the migration of visible silicone, it is noted as migration: x, I 1 -I 0 In the case of=0, migration of the silicone is not seen, and is noted as migration: o (circle). The results are shown in Table 1.
Example 1
(acrylic resin (A) 1 ) And preparation of a releasing layer coating liquid
Stearyl acrylate (CH) 2 ＝C(H)COOC 15 H 25 ) Hydroxy ethyl acrylate (CH) 2 ＝C(H)COOC 2 H 4 OH) at 99:1, toluene was added so that the solid content became 40 mass%, azobisisobutyronitrile (AIBN) was added under a nitrogen gas stream at 0.5 mol% and copolymerized to obtain an acrylic resin (A) 1 )。
The acrylic resin (A1), the melamine resin (NIPPON CARBIDE INDUSTRUES co., inc., manufactured by NicalackMW-30) as the crosslinking agent (B), the higher alcohol (pentadecanol manufactured by tokyo chemical industry co., ltd.) as the release agent (C), and p-toluenesulfonic acid (Hitachi Kasei Polymer co., ltd., DRIER # 900) as the curing catalyst were added in the amounts shown in table 1, and a solvent (toluene/mek=50/50: mass ratio) was further added to give a release layer coating liquid having a solid content concentration of 6.0 mass%.
(formation of release layer)
The obtained release layer coating liquid was applied to a corona-treated surface of a polyethylene terephthalate film (manufactured by Toyo Kabushiki Kaisha, E5100, thickness: 38 μm, surface roughness (Sa): 0.0365nm (corona-treated surface), surface maximum section height (St): 3.72, haze: 3.7%) using a gravure coater, and then dried at 130℃for 30 seconds to form a release layer having a thickness of 0.2. Mu.m. The obtained release film was evaluated for normal peel force, peel force after heating, and high-speed peel force after heating. Various compositions, and evaluation results.
Examples 2 to 5 and comparative examples 1 to 3
A release layer was formed in the same manner as in example 1 except that the composition was changed to table 1. The obtained release film was evaluated for normal peel force, peel force after heating, high-speed peel force after heating, and silicone migration.
Comparative example 4
(acrylic resin (A) 4 ) And preparation of a releasing layer coating liquid
After methyl acrylate (CH 2 ＝C(H)COOCH 3 ) Toluene was added so that the solid content became 40 mass%, azobisisobutyronitrile (AIBN) was added in an amount of 0.5 mol% under a nitrogen stream, and the resulting mixture was copolymerized to obtain an acrylic resin (A) 4 )。
A release layer was formed in the same manner as in example 1 except that the acrylic resin was changed to A4. The obtained release film was evaluated for normal peel force, peel force after heating, high-speed peel force after heating, and silicone migration.
Comparative example 5
A release layer was formed in the same manner as in example 3, except that a heat-curable silicone-based release agent was used as the release agent together with a platinum catalyst. The obtained release film was evaluated for normal peel force, peel force after heating, and high-speed peel force after heating.
TABLE 1
< evaluation results >
According to the present invention, it is possible to provide a release layer film which has light releasability both before and after heating and can maintain light releasability even in the case of high-speed release. On the other hand, in comparative example 1, when the total of the mass of the a-1 component and the mass of the a-2 component of the acrylic resin (a) is 100 parts by mass, the mass of the a-1 component does not exceed 50 parts by mass, and therefore, PF1 is greatly increased, and in PF2, the peeling force is greatly increased, and therefore, the release layer cannot be peeled from the adhesive tape. In comparative example 2, the amount of the crosslinking agent was excessively small, and therefore, sufficient film strength could not be obtained, PF1 and PF2 were greatly increased, and PF3 was excessively large, and the release layer could not be peeled from the adhesive tape. Since the release agent was not contained in comparative example 3, PF2 was greatly increased, and the release layer was not peeled off from the adhesive tape. In comparative example 4, since the release layer was composed of an acrylic resin containing no component a-1 and no component a-2, the release layer could not be peeled from the adhesive tape at room temperature. In comparative example 5, since a silicone-based release agent was used, it was confirmed that migration of silicone occurred.
The present embodiments and examples are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown by the claims rather than the above embodiments, and is intended to include meanings equivalent to the claims, and all modifications within the scope.
Industrial applicability
The release film of the present invention can be applied to applications such as electronic component manufacturing processes where it is difficult to use a silicone release film.
Claims (8)
1. A release film comprising a base film and a release layer in this order,
the release layer comprises at least an acrylic resin (A), a crosslinking agent (B) and a release agent (C),
the acrylic resin (A) comprises at least an A-1 component represented by the following chemical formula (1) and an A-2 component represented by the following chemical formula (2),
the release layer is substantially free of silicone components,
the ratio a/B of the mass (a) of the acrylic resin (A) to the mass (B) of the crosslinking agent (B) contained in the release layer satisfies the formula (I),
(I)0.1≤a/b≤8.0
in the formula (1), R 1 Represents (cnh2n+1), where n=an integer of 8 to 20 inclusive, R 4 Represents H or CH 3 ，
In the formula (2), R 2 Represents (CmH 2 mOH) or H, where m=an integer of 1 to 10 inclusive, R 4 Represents H or CH 3 。
2. The release film according to claim 1, wherein a ratio c/B of a mass (c) of the release agent to a mass (B) of the crosslinking agent (B) contained in the release layer satisfies formula (II),
(II)0.1≤c/b≤12.0。
3. the release film according to claim 1 or 2, wherein the mass of a-1 exceeds 50 parts by mass, based on 100 parts by mass of the total of the mass of a-1 component and a-2 component of the acrylic resin (a) in the release layer.
4. The release film according to any one of claims 1 to 3, wherein the release agent (C) contains no acryl group and further contains at least a long-chain alkyl group containing no silicone and a reactive functional group.
5. The release film according to any one of claims 1 to 4, wherein a normal peel force (PF 1) at a peel speed of 0.3 m/min is 500mN/50mm or less.
6. The release film according to any one of claims 1 to 5, wherein a peeling force (PF 2) after 20 hours of heating at 70 ℃ at a peeling speed of 0.3 m/min is 2 times or less of the normal peeling force (PF 1).
7. The release film according to any one of claims 1 to 6, wherein a peeling force (PF 3) after 20 hours of heating at 70 ℃ at a peeling speed of 30 m/min is 30 times or less of the normal peeling force (PF 1).
8. A laminated film having an adhesive layer laminated on at least one face of the release film according to any one of claims 1 to 7.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-087022 | 2021-05-24 | ||
| JP2021087022 | 2021-05-24 | ||
| PCT/JP2022/020199 WO2022249899A1 (en) | 2021-05-24 | 2022-05-13 | Mold release film |
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| CN117355585A true CN117355585A (en) | 2024-01-05 |
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| CN202280036261.1A Pending CN117355585A (en) | 2021-05-24 | 2022-05-13 | Release film |
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| JP (1) | JPWO2022249899A1 (en) |
| KR (1) | KR20230159711A (en) |
| CN (1) | CN117355585A (en) |
| TW (1) | TW202302365A (en) |
| WO (1) | WO2022249899A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007002092A (en) | 2005-06-23 | 2007-01-11 | Kyoeisha Chem Co Ltd | Mold release agent comprising cross-linked copolymerized prepolymer |
| JP5422195B2 (en) | 2008-12-18 | 2014-02-19 | リンテック株式会社 | Release agent and release sheet |
| JP5730922B2 (en) | 2013-02-06 | 2015-06-10 | 三菱樹脂株式会社 | Laminated polyester film |
| JP6402061B2 (en) * | 2015-03-30 | 2018-10-10 | リンテック株式会社 | Release sheet and adhesive sheet |
| JP6930110B2 (en) * | 2017-01-16 | 2021-09-01 | 荒川化学工業株式会社 | Thermosetting release coating agent, release film and its manufacturing method |
| TW202033350A (en) * | 2018-12-20 | 2020-09-16 | 日商東洋紡股份有限公司 | Release film |
| JP7038184B2 (en) * | 2019-12-20 | 2022-03-17 | 日本化工塗料株式会社 | Thermosetting mold release coating agent and laminate, and method for manufacturing the laminate |
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2022
- 2022-05-13 JP JP2023523410A patent/JPWO2022249899A1/ja active Pending
- 2022-05-13 WO PCT/JP2022/020199 patent/WO2022249899A1/en active Application Filing
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- 2022-05-13 KR KR1020237036808A patent/KR20230159711A/en unknown
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| WO2022249899A1 (en) | 2022-12-01 |
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