CN117336948A - Optimized bonding pad structure of display module - Google Patents

Optimized bonding pad structure of display module Download PDF

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Publication number
CN117336948A
CN117336948A CN202311339695.1A CN202311339695A CN117336948A CN 117336948 A CN117336948 A CN 117336948A CN 202311339695 A CN202311339695 A CN 202311339695A CN 117336948 A CN117336948 A CN 117336948A
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CN
China
Prior art keywords
mfpc
pad
fpc
front surface
display module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311339695.1A
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Chinese (zh)
Inventor
温武炎
曾焕章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Truly Opto Electronics Ltd
Original Assignee
Truly Opto Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Truly Opto Electronics Ltd filed Critical Truly Opto Electronics Ltd
Priority to CN202311339695.1A priority Critical patent/CN117336948A/en
Publication of CN117336948A publication Critical patent/CN117336948A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)

Abstract

An optimized pad structure of a display module, comprising: a full-page FPC including a plurality of MFPCs; the MFPC is characterized in that a TP bonding pad is arranged at the top of the front surface of the MFPC, a backlight bonding pad is arranged at the top of the front surface of the MFPC, and a BTB connector is arranged at the bottom of the front surface of the MFPC; the top of the front of the MFPC is provided with a backlight pad windowing, the top of the front of the MFPC is provided with a TP pad windowing, and bottom tin is arranged on the backlight pad windowing, the TP pad windowing and the connector windowing pins. According to the optimized bonding pad structure of the display module, the bottom tin is printed on the bonding pad in advance, so that the process of entering the manual processing of the FPC can be reduced, the FPC needing to be printed is printed with the bottom tin of the bonding pad together when the tin paste is printed by the steel mesh for SMT, the process of feeding the bottom tin in the traditional welding process can be reduced, the work content of workers during welding is reduced, the work efficiency of the workers is improved, and the yield of products of the workers is improved.

Description

Optimized bonding pad structure of display module
Technical Field
The invention relates to the technical field of display module bonding pads, in particular to an optimized bonding pad structure of a display module.
Background
The structure of wearing display module assembly at present is more and more accurate small and exquisite, and the space stacks more and more limit, and various functions are also more and more, and this just has led to our production line loaded down with trivial details complicacy, and the flow is long, and the manual operation that needs personnel is also many, and too much flow can cause to increase too much working position, or has increased staff's work content, not only can reduce staff's work efficiency, also can influence the yields of product to a certain extent.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an optimized bonding pad structure of a display module.
The aim of the invention is realized by the following technical scheme:
an optimized pad structure of a display module, comprising: a full-page FPC including a plurality of MFPCs; the MFPC is characterized in that a TP bonding pad is arranged at the top of the front surface of the MFPC, a backlight bonding pad is arranged at the top of the front surface of the MFPC, and a BTB connector is arranged at the bottom of the front surface of the MFPC; the top of the front surface of the MFPC is provided with a backlight welding disc windowing, the top of the front surface of the MFPC is provided with a TP welding disc windowing, and the bottom of the front surface of the MFPC is provided with a connector windowing pin; the FPC on the full-length FPC is divided into two types, one type is the FPC needing to be subjected to piece-making, the other type is the FPC not needing to be subjected to piece-making, and bottom tin is arranged on the backlight pad windowing pin, the TP pad windowing pin and the connector windowing pin.
In one embodiment, the TP pad is located on the right side of the top of the front of the MFPC, a TPFPC is fixedly connected to the TP pad, and an electronic component is disposed on the right side of the front of the TPFPC.
In one embodiment, the backlight pad is located at the left side of the top of the front of the MFPC, and a backlight FPC is fixedly connected to the backlight pad.
In one embodiment, the connector windowing pins are disposed at the bottom of the front face of the MFPC and correspond to the positions between the BTB connectors of the front face of the MFPC.
In one embodiment, the TP pad window is located on top of the MFPC front surface and corresponds to the TP pad on the MFPC front surface.
In one embodiment, the backlight pad window is located on top of the front surface of the MFPC and corresponds to a position between the front surface of the MFPC and the backlight pad.
In one embodiment, the front surface of the full-length FPC is rectangular, and the MFPC on the full-length FPC is two in group and is fixed on the plate body of the full-length FPC in a manner that the front surface and the back surface of the MFPC are mutually staggered.
In one embodiment, the shape of the front face of the MFPC is in the shape of a "J".
In one embodiment, the FPC that requires a stencil on the full-length FPC is printed onto the MFPC along with other components when the solder paste is printed on the SMT.
In one embodiment, the FPC without a punch on the full-page FPC is printed with solder paste by opening the steel mesh before the FPC provider imposes the full-page and does not punch the split plate.
Compared with the prior art, the invention has at least the following advantages:
according to the optimized bonding pad structure of the display module, the bottom tin is printed on the bonding pad in advance, so that the flow of the FPC after manual processing is reduced, the FPC is divided into the FPC needing to be printed and the FPC not needing to be printed according to different FPCs, wherein the FPC needing to be printed is windowed at the position of the bonding pad designed by the SMT steel mesh, a tin-plated opening is reserved, the tin paste is printed on the bonding pad together with other components when the tin paste is printed by the SMT, and the tin paste is printed on the bonding pad by opening the steel mesh before the split plate of an FPC provider is not punched, so that the flow of the bottom tin is reduced in the traditional welding flow, the working content of workers during welding is reduced, the working efficiency of the workers is improved, and the yield of products of the workers is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a front structure of a full-page FPC with an optimized pad structure of a display module;
FIG. 2 is a schematic diagram of the overall structure of the front surface of a bonding pad with optimized bonding pad structure of a display module according to the present invention;
FIG. 3 is a schematic view of a front portion of a bonding pad of an optimized bonding pad structure of a display module according to the present invention;
fig. 4 is a schematic diagram of the overall structure of the front surface of the bonding pad with the optimized bonding pad structure of the display module.
In the figure: 1. a full-page FPC; 11. a bonding pad; 12. a TP pad; 13. MFPC; 14. a BTB connector; 15. a backlight pad; 16. backlight FPC; 17. windowing pins of the connector; 18. TP bonding pad windowing; 19. windowing a backlight bonding pad; 2. and (5) bottom tin.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1-4, an optimized pad structure of a display module includes: a full-scale FPC1, the full-scale FPC1 including a plurality of MFPCs 13; the MFPC13, the top of the front of the MFPC13 is provided with a TP pad 12, the top of the front of the MFPC13 is provided with a backlight pad 15, and the bottom of the front of the MFPC13 is provided with a BTB connector 14; the top of the front of the MFPC13 is provided with a backlight pad windowing 19, the top of the front of the MFPC13 is provided with a TP pad windowing 18, and the bottom of the front of the MFPC13 is provided with a connector windowing pin 17; the FPCs on the full-length FPC1 are divided into two types, one is the FPC requiring the opening, and in the embodiment, the FPCs requiring no opening are provided with the bottom tin 2 on the backlight pad windowing 19, the TP pad windowing 18 and the connector windowing pins 17. .
It should be noted that, the conventional welding process of the bonding pad 11 after the production is completed is as follows: after the bottom tin 2 is arranged, the alignment is finished, then welding is carried out, and rosin is wiped, so that the final welding is finished; the improved welding process is as follows: and after alignment is finished, welding is performed, and then the rosin is wiped, so that the welding process is finished, and compared with the prior art welding scheme, the welding process of the upper bottom tin 2 is reduced, and the working efficiency of workers can be enhanced during welding.
As shown in fig. 1-4, in an embodiment, the TP pad 12 is located on the right side of the top of the front surface of the MFPC13, the TP fpc11 is fixedly connected to the TP pad 12, and an electronic component is disposed on the right side of the front surface of the TPFPC 11. The TP pad window 18 is located on top of the front surface of the MFPC13 and corresponds to the TP pad 12 on the front surface of the MFPC 13.
It should be noted that, in the production of MFPC13, TP pad 12 is first soldered to MFPC13, TP pad window 18 is then provided on the corresponding front surface, and tin 2 is coated on the top surface, and TPFPC11 is then fixed on the top surface.
As shown in fig. 1-4, in an embodiment, the backlight pad 15 is located on the left side of the top of the front surface of the MFPC13, and the backlight FPC16 is fixedly connected to the backlight pad 15. The backlight pad window 19 is located on top of the front side of the MFPC13 and corresponds to the position between the front backlight pads 15 of the MFPC 13.
After the backlight pad 15 is set, a backlight pad window 19 is provided at a position corresponding to the front surface of the backlight pad 15, and after the bottom tin 2 is applied, the backlight FPC16 and the backlight pad 15 are connected together.
As shown in fig. 1-4, in one embodiment, the connector windowing pins 17 are disposed at the bottom of the front side of the MFPC13 and correspond to the locations between the BTB connectors 14 on the front side of the MFPC 13. It should be noted that, after the connector windowing pins 17 are set on the MFPC13, the BTB connector 14 needs to be fixed at the corresponding positions.
As shown in fig. 1-4, in an embodiment, the front surface of the full-size FPC1 is rectangular, and MFPCs 13 on the full-size FPC1 are two in groups and are fixed on the plate body of the full-size FPC1 in a manner that the front surface and the back surface are mutually staggered. The length and width of the full-page FPC1 are designed according to the need, and the layout is determined according to the shape of the MFPC13 in order to improve the layout utilization.
As shown in fig. 1-4, in one embodiment, the front surface of MFPC13 has a "J" shape. It should be noted that, the size and shape of the MFPC13 are not completely designed according to the drawing, and may be designed according to the actual production requirement, as long as the structure and procedure of the pads on the MFPC13 are designed according to the present technical scheme.
As shown in fig. 1-4, in one embodiment, the FPC to be printed on the full-scale FPC1 is printed on the MFPC13 together with other components when the solder paste is printed on the SMT. And (3) opening a steel mesh to print solder paste on the bonding pad before the FPC is subjected to the imposition of the whole plate by an FPC supplier and the cutting plate is not punched on the whole plate FPC 1. It should be noted that, the technical scheme has different designs according to different FPCs required, but the final purpose is the same to save the steps of manual welding, and the content in fig. 2 of the specification is the FPC required to be manufactured, and the FPC in fig. 2 of the specification is the FPC not required to be manufactured.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. An optimized pad structure of a display module, comprising:
a full-length FPC (1), wherein the full-length FPC (1) comprises a plurality of MFPCs (13);
the device comprises an MFPC (13), wherein a TP bonding pad (12) is arranged at the top of the front surface of the MFPC (13), a backlight bonding pad (15) is arranged at the top of the front surface of the MFPC (13), and a BTB connector (14) is arranged at the bottom of the front surface of the MFPC (13);
a backlight pad windowing window (19) is arranged at the top of the front surface of the MFPC (13), a TP pad windowing window (18) is arranged at the top of the front surface of the MFPC (13), and a connector windowing pin (17) is arranged at the bottom of the front surface of the MFPC (13);
the FPC on the full-length FPC (1) is divided into two types, one type is the FPC needing to be subjected to piece-making, the other type is the FPC not needing to be subjected to piece-making, and bottom tin (2) is arranged on backlight pad windowing (19), TP pad windowing (18) and connector windowing pins (17).
2. The optimized pad structure of a display module according to claim 1, wherein the TP pad (12) is located on the right side of the top of the front face of the MFPC (13), a TPFPC (11) is fixedly connected to the TP pad (12), and an electronic component is disposed on the right side of the front face of the TPFPC (11).
3. The optimized pad structure of a display module according to claim 1, wherein the backlight pad (15) is located at the left side of the top of the front surface of the MFPC (13), and a backlight FPC (16) is fixedly connected to the backlight pad (15).
4. The optimized pad structure of a display module according to claim 1, wherein the connector windowing pins (17) are disposed at the bottom of the front face of the MFPC (13) and correspond to positions between the BTB connectors (14) of the front face of the MFPC (13).
5. The optimized pad structure of a display module according to claim 1, characterized in that the TP pad window (18) is located on top of the front surface of the MFPC (13) and corresponds to the TP pad (12) of the front surface of the MFPC (13).
6. The optimized pad structure of a display module according to claim 1, characterized in that the backlight pad window (19) is located on top of the front face of the MFPC (13) and corresponds to the position between the backlight pads (15) of the front face of the MFPC (13).
7. The optimized bonding pad structure of a display module according to claim 1, wherein the front surface of the full-page FPC (1) is rectangular, and the MFPCs (13) on the full-page FPC (1) are fixed on the plate body of the full-page FPC (1) in a mode that two MFPCs are combined into a group, and the front surface and the back surface of the MFPCs are mutually staggered.
8. The optimized pad structure of a display module according to claim 1, wherein the shape of the front surface of the MFPC (13) is in the shape of a "J".
9. The optimized pad structure of a display module according to claim 1, characterized in that the FPC to be printed on the full-size FPC (1) is printed on MFPC (13) together with other components when the solder paste is printed on SMT.
10. The optimized pad structure of a display module according to claim 1, wherein the FPC without a dummy on the full-length FPC (1) is printed with solder paste by opening a steel screen before the full-length FPC is punched into a split board by an FPC supplier.
CN202311339695.1A 2023-10-17 2023-10-17 Optimized bonding pad structure of display module Pending CN117336948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311339695.1A CN117336948A (en) 2023-10-17 2023-10-17 Optimized bonding pad structure of display module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311339695.1A CN117336948A (en) 2023-10-17 2023-10-17 Optimized bonding pad structure of display module

Publications (1)

Publication Number Publication Date
CN117336948A true CN117336948A (en) 2024-01-02

Family

ID=89275240

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311339695.1A Pending CN117336948A (en) 2023-10-17 2023-10-17 Optimized bonding pad structure of display module

Country Status (1)

Country Link
CN (1) CN117336948A (en)

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