CN209897392U

CN209897392U - Wave-soldering device

Info

Publication number: CN209897392U
Application number: CN201920662670.8U
Authority: CN
Inventors: 唐玉银; 潘海涛
Original assignee: Jiangsu Youmao Electronic Technology Co Ltd
Current assignee: Kurz Electronic Technology Nantong Co ltd
Priority date: 2019-05-09
Filing date: 2019-05-09
Publication date: 2020-01-03
Anticipated expiration: 2029-05-09

Abstract

The utility model provides a wave-soldering placing tool, which comprises a bottom plate, wherein a PCB is placed on the bottom plate, an air pressure switch is placed on the PCB, and a pressing plate is arranged on the air pressure switch; on the bottom plate, be located PCB board both sides punishment do not is provided with the frame and detains, the frame is detained and is set up the both ends of clamp plate can compress tightly downwards the clamp plate through setting up the clamp plate that conveniently compresses tightly and dismantle, remain throughout to compress tightly both each other when PCB board and air pressure switch welding, effectively avoided air pressure switch to float high the phenomenon, improved the off-the-shelf qualification rate of welding, easy operation and loading and unloading are convenient.

Description

Wave-soldering device

Technical Field

The utility model relates to a frock clamp field especially relates to a wave-soldering puts utensil.

Background

In wave soldering, a plurality of parts are combined and coated with solder so as to be fed into equipment for soldering. The phenomenon that the air pressure switch floats due to the fact that soldering tin floats up the air pressure switch occurs in the welding process of the PCB and the air pressure switch, and therefore poor contact between the air pressure switch and the PCB is caused, and the welded finished product is scrapped.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: air pressure switch floats high when PCB board and air pressure switch weld among the prior art, easily leads to the welding finished product to scrap, the utility model provides a wave-soldering puts utensil and solves above-mentioned problem.

The utility model provides a technical scheme that its technical problem adopted is: a wave soldering device comprises a bottom plate, wherein a PCB is placed on the bottom plate, an air pressure switch is placed on the PCB, and a pressing plate is arranged on the air pressure switch; and rack buckles are respectively arranged at the two sides of the PCB on the bottom plate and are arranged at the two ends of the pressing plate and can press the pressing plate downwards.

Further: the bottom plate is provided with a plurality of auxiliary pressing plates which are arranged along the side edges of the pressing plates and press the pressing plates downwards.

Further: the auxiliary pressing plate is fixed on the bottom plate through a fastening screw, and a groove which avoids interference with the PCB is formed in the auxiliary pressing plate.

Further: the number of the PCB boards is two or more, and a plurality of the PCB boards are arranged along the length direction of the pressing board.

Further: the bottom plate, the pressing plate and the auxiliary pressing plate are made of bakelite plates.

The beneficial effects of the utility model are that, the utility model discloses the superficial high pass of air pressure switch sets up the clamp plate that conveniently compresses tightly and dismantle, remains throughout when PCB board and air pressure switch welding to compress tightly both each other, has effectively avoided air pressure switch to float and has heightened the phenomenon, has improved the off-the-shelf qualification rate of welding, and easy operation and loading and unloading are convenient.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic structural view of a wave soldering device of the present invention;

FIG. 2 is a top view of the wave soldering apparatus of FIG. 1;

fig. 3 is a partial structural view of the installation of the auxiliary pressure plate.

In the figure, the device comprises a base plate 1, a base plate 2, a PCB 3, an air pressure switch 4, a pressing plate 5, a frame buckle 6, an auxiliary pressing plate 7, a groove 8 and a fastening screw.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used only for convenience in describing and simplifying the present invention, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present invention includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.

As shown in fig. 1 and 2, the utility model provides a wave soldering device, which comprises a bottom plate 1, a PCB 2 is placed on the bottom plate 1, an air pressure switch 3 is placed on the PCB 2, and a pressing plate 4 is arranged on the air pressure switch 3; on the bottom plate 1, frame buckles 5 are respectively arranged at two sides of the PCB 2, and the frame buckles 5 are arranged at two ends of the pressing plate 4 and can press the pressing plate 4 downwards.

Before welding air pressure switch 3 and PCB board 2, scribble the tin cream in PCB board 2 or air pressure switch 3 department, putting air pressure switch 3 relevant position department on PCB board 2, place clamp plate 4 in air pressure switch 3 top, 5 compresses tightly clamp plate 4 downwards are detained to the rethread fastening frame, make air pressure switch 3 closely laminate with PCB board 2, put into the equipment again and weld, can effectively prevent the tin cream to float air pressure switch 3 when welding, avoid causing the welding badly.

When the welding is finished, the placing tool is taken out of the equipment, the frame buckle 5 is opened, the pressing plate 4 pressed on the air pressure switch 3 is loosened, and the PCB 2 and the air pressure switch 3 can be detached.

Referring to fig. 3, a plurality of auxiliary pressing plates 6 are disposed on the bottom plate 1, and the plurality of auxiliary pressing plates 6 are arranged along the side edges of the pressing plates 4 and press the pressing plates 4 downward. The both sides of clamp plate 4 are detained 5 through the frame and are compressed tightly downwards, can lead to the middle flexible deformation of clamp plate 4 to rise upwards like this, and supplementary clamp plate 6 arranges and can compress tightly clamp plate 4 downwards along the side of clamp plate 4, avoids clamp plate 4 to rise upwards for the middle part of clamp plate 4 also can closely laminate in air pressure switch 3's top.

The auxiliary pressing plate 6 is fixed on the bottom plate 1 through a fastening screw 8, and a groove 7 which avoids interference with the PCB 2 is arranged on the auxiliary pressing plate 6. Can easily realize compressing tightly fixedly of supplementary clamp plate 6 through fastening screw 8, recess 7 can avoid producing with PCB board 2 and interfere, can make supplementary clamp plate 6 laminate with clamp plate 4 more conveniently.

The number of the PCB boards 2 is two or more, and a plurality of the PCB boards 2 are arranged along the length direction of the pressing board 4. A plurality of PCB boards 2 are arranged in proper order, and corresponding position department sets up air pressure switch 3 on PCB board 2, can once compress tightly a plurality of PCB boards 2 through clamp plate 4, improves the work efficiency of putting the utensil.

The bottom plate 1, the pressing plate 4 and the auxiliary pressing plate 6 are made of bakelite plates, the bakelite plates have good insulating effect, the influence on the PCB 2 and the air pressure switch 3 which are in contact can be avoided, and the qualified rate of finished products after welding is improved.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic representation of the term does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. The utility model provides a wave-soldering puts utensil, includes bottom plate (1), PCB board (2) have been placed on bottom plate (1), air pressure switch (3), its characterized in that have been placed on PCB board (2): a pressure plate (4) is arranged on the air pressure switch (3); frame buckles (5) are respectively arranged on the bottom plate (1) and located on two sides of the PCB (2), and the frame buckles (5) are arranged at two ends of the pressing plate (4) and can press the pressing plate (4) downwards.

2. A wave soldering apparatus as claimed in claim 1, wherein: the bottom plate (1) is provided with a plurality of auxiliary pressing plates (6), and the auxiliary pressing plates (6) are arranged along the side edges of the pressing plates (4) and press the pressing plates (4) downwards.

3. A wave soldering apparatus as claimed in claim 2, wherein: the auxiliary pressing plate (6) is fixed on the bottom plate (1) through a fastening screw (8), and a groove (7) which avoids interference with the PCB (2) is formed in the auxiliary pressing plate (6).

4. A wave soldering apparatus as claimed in claim 3, wherein: the number of the PCB boards (2) is two or more, and a plurality of the PCB boards (2) are arranged along the length direction of the pressing plate (4).

5. A wave soldering apparatus as claimed in claim 4, wherein: the bottom plate (1), the pressing plate (4) and the auxiliary pressing plate (6) are made of bakelite plates.