CN220896923U - Welding disc shielding device - Google Patents

Abstract

The utility model discloses a bonding pad shielding device, which comprises a shielding plate and a buckling piece, wherein the shielding plate is arranged on the shielding plate; the shape of the shielding plate is consistent with the trend of the shielded bonding pads on the PCB; the buckling piece is arranged on the shielding plate, is used for being buckled and connected with buckling holes on the PCB, and covers the shielding plate on the shielded bonding pad. The bonding pad shielding device disclosed by the utility model is convenient to assemble and disassemble, and can accurately assemble and shield the bonding pad of the component; the device can be reused, so that the quality abnormality in the prior art is avoided in the welding process of the PCB device, and meanwhile, a large amount of waste generated by using gummed paper is avoided, and the labor cost is also greatly reduced; moreover, when the bonding pad shielding device is arranged on the PCB, the bonding pad shielding device can play a role in supporting and reinforcing the PCB, and deformation of the PCB during welding is avoided.

Description

Welding disc shielding device

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a bonding pad shielding device used in the process of welding electronic components in batches on a PCB.

Background

Circuit boards are well known as core components of various electric or electronic products for realizing control of various functions and operations of the electric or electronic products. The circuit board is generally composed of a PCB substrate and electronic components (simply referred to as components) arranged on the PCB substrate; in the component soldering process, because there are different types of electronic components, these electronic components often need to be soldered on the PCB substrate in batches.

Taking an air conditioner outdoor unit and a control circuit board used by the same as an example for specific explanation: in the control circuit board of the outdoor unit of the air conditioner, the bottom components on the PCB are welded by wave soldering, but the power module belongs to the top components, and manual soldering or selective wave soldering is needed. In this way, before the wave soldering of the PCB, the bonding pad position of the power module needs to be shielded by using gummed paper, so that the bonding pad is prevented from being blocked by the welding hole. After wave soldering, the gummed paper is required to be torn off, and then pins of the power module are spliced and are manually soldered or selectively wave soldering is adopted.

However, there are a number of drawbacks to the manner in which the power module pad locations are obscured by the adhesive paper: the gummed paper is disposable, so that a great amount of waste is caused; (2) The process of sticking and tearing off the gummed paper is difficult to control in a standardized way, is easy to stick in place and tear off cleanly, and has low efficiency and easy occurrence of quality abnormality. A real case is presented here: after sales, a certain air conditioner manufacturer returns a single outdoor machine electrical box high-heat shutdown fault machine; through analysis, for the operator not clear up the gummed paper that is used for shielding components and parts bonding pad on mainboard (control circuit board), remain a part on the mainboard, this position just in time is used for installing high-power components and parts (power module), and high-power components produce high temperature in work, and high temperature fires gummed paper, leads to off-premises station electrical apparatus box part high temperature, and the unable normal operating of air conditioner.

Disclosure of utility model

The utility model aims to provide a bonding pad shielding device which is used for temporarily shielding bonding pads of components to be welded in a later batch when the components in the current batch are welded on a PCB. The utility model is realized by the following technical scheme:

a bonding pad shielding device comprises a shielding plate and a buckling piece; the shape of the shielding plate is consistent with the trend of the shielded bonding pads on the PCB; the buckling piece is arranged on the shielding plate, is used for being buckled and connected with the buckling hole on the PCB, and covers the shielding plate on the shielded bonding pad.

Preferably, the shielding plate is provided with a first plate surface attached to the PCB and a second plate surface opposite to the first plate surface, and the shielding plate is gradually narrowed from the first plate surface to the second plate surface.

Preferably, the shielding plate is made of any one of a metal material, a ceramic material, and a synthetic stone material.

Preferably, the shield plate is provided with a relief groove corresponding to the trend of the non-shield bonding pad on the PCB, and the relief groove is a blind groove formed by the first plate facing the second plate.

Preferably, the shielding plate is provided with a reinforcing plate on the second plate surface corresponding to the abdication groove.

Preferably, two ends of the reinforcing plate respectively span the abdication groove and are fixedly connected to the shielding plate.

Preferably, the buckling pieces are arranged at two opposite ends or two opposite corners of the shielding plate.

Preferably, the buckling piece is a cylindrical tensioning pin buckled with or separated from the buckling hole formed in the PCB.

Preferably, the cylindrical tensioning pin comprises a base and a plurality of elastic pieces arranged on the circumference of the base at intervals, and the outer side of the tail end of each elastic piece is provided with a bulge; the base is fixedly connected to the shielding plate, when the cylindrical tensioning pin is buckled with the buckling hole, the plurality of elastic sheets penetrate through the buckling hole from the back surface of the PCB and tension the wall of the buckling hole, and the protrusions at the tail ends of the elastic sheets are buckled on the front surface of the PCB.

Preferably, the buckling piece comprises a pin and a lock tongue, wherein the end face of one end of the pin is connected with the shielding plate, and the lock tongue is eccentrically and rotatably arranged on the end face of the other end of the pin; when the buckling piece is buckled with the buckling hole, the pin and the lock tongue penetrate through the buckling hole from the back of the PCB, and the lock tongue is stirred to rotate and buckled on the front of the PCB.

The pad shielding device provided by the technical scheme of the utility model has the beneficial effects that: the disassembly and assembly are convenient, and the bonding pads of the components can be accurately assembled and shielded; the adhesive tape can be reused, quality abnormality caused by the fact that the adhesive tape is not cleaned in the prior art is avoided, labor cost can be greatly reduced, and meanwhile a large amount of waste caused by using the adhesive tape is avoided. Furthermore, the pad shielding device is arranged on the PCB by matching at least two buckling pieces with relatively large intervals with corresponding buckling holes on the PCB; the connecting mode can not only apply acting force to two sides of the PCB, but also support and strengthen the whole PCB, and prevent the PCB from being deformed by heat after wave soldering, so that the stress of the PCB is unqualified and serious quality defects are generated.

Drawings

Fig. 1 is a schematic view of a shielded land left free when components are soldered to the front side of a PCB.

Fig. 2 is a front view of fig. 1.

Fig. 3 is a schematic diagram of a pad shielding device provided in this embodiment, where a part of components are soldered on the front surface of a PCB board and a shielded pad is left on the back surface.

Fig. 4 is a side view of fig. 3.

Fig. 5 is a front view of the pad shielding device provided in this embodiment.

Fig. 6 is a front view of the pad shielding device provided in the present embodiment.

Fig. 7 is an exploded view of the pad shielding device provided in the present embodiment.

Fig. 8 is a perspective view of a fastener used in the pad shielding device according to the present embodiment.

FIG. 9 is a side view of the fastener of FIG. 8.

Fig. 10 is a schematic view of another fastening member used in the pad shielding device according to the present embodiment in an unfastened state.

Fig. 11 is a schematic view of another fastening member in a fastened state used in the pad shielding device according to the present embodiment.

Reference numerals illustrate: 10-PCB board, 20-current batch of components, 101-shielded bonding pad, 30-bonding pad shielding device, 31-shielding board, 321-first buckling piece, 322-second buckling piece, 11-first buckling hole, 12-second buckling hole, 109-non-shielding bonding pad, 310-yielding groove, 33-reinforcing plate, 35-screw, 3211-base, 3212-shrapnel, 3213-bulge, 3215-pin and 3216-lock tongue.

Detailed Description

The technical solutions of the embodiments of the present utility model are explained and illustrated below with reference to the drawings of the embodiments of the present utility model, but the following embodiments are only preferred embodiments of the present utility model, and not all the embodiments; on the premise that the technical schemes do not conflict, the technical means of the embodiments can be reasonably and freely combined. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships are based on the orientations or relative positional relationships shown in the drawings, are intended to facilitate a clear description of the construction of the product or device, and are not intended to limit the actual orientation of the product or device during production, use, sales, etc.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more, unless otherwise clearly defined.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," "disposed," "secured," and the like are to be construed broadly and may be, for example, fixedly coupled, detachably coupled, or integrally coupled; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Referring to fig. 1 and 2, in this embodiment, when the front side of the PCB 10 is to be soldered with the component 20 of the current lot, pads of the component (e.g., power module) to be soldered of the next lot are left, and these pads are referred to as shielded pads 101 in the present application. The components 20 of the current batch may be power consuming components constituting a control circuit, such as capacitors, resistors, inductors, diodes, transistors, etc.; the components to be soldered in the next lot are typically some high power devices, such as IPM modules (INTELLIGENT POWER MODULE, smart power modules), etc.

Referring to fig. 1 and 2, the shielded pad 101 matches the pin distribution of the component (e.g., IPM module) to be soldered in the next lot; that is, the shielded pad 101 has a predetermined extending direction (or referred to as a distribution direction) matching the pin distribution of the IPM module, see the directions of the broken lines in fig. 1 and 2.

As shown in fig. 3 and 4, the pad shielding device 30 provided in this embodiment is configured to be temporarily disposed at a shielded pad 101 corresponding to the back surface of the PCB board 10, so that when the components 20 of the current batch are soldered on the PCB board, the pad shielding device 30 is used to temporarily shield the pads of the components to be soldered of the next batch, that is, the shielded pad 101 is used to shield the solder holes corresponding to the shielded pad 101, so that the solder holes corresponding to the shielded pad 101 are not blocked due to the current soldering operation, which is not beneficial to the pin plugging of the components to be soldered of the next batch.

Referring to fig. 5, 6 and 7, the pad shielding device 30 provided in this embodiment includes a shielding plate 31, a first fastening member 321 and a second fastening member 322. The shielding plate 31 is made of any one of a metal material, a ceramic material, and a synthetic stone material. In addition, the shielding plate 31 is in a thin strip extension shape, and the shape of the shielding plate is consistent with the trend of the shielded bonding pads 101 on the PCB 10, that is, the trend of the shielding plate 31 is basically matched with the trend of the broken line in fig. 1 and 2.

With continued reference to fig. 1 and 2, according to the trend of the shielded bonding pads 101 on the PCB, a first fastening hole 11 and a second fastening hole 12 are formed on the PCB 10. The first fastening hole 11 and the second fastening hole 12 are used for fastening the first fastening piece 321 and the second fastening piece 322, so that the first fastening hole 11 and the second fastening hole 12 are arranged at the adjacent part of the shielded bonding pad 101 or at the position where the shielded bonding pad 101 upwards avoids the welding hole.

Referring to fig. 1 to 7, the first fastening member 321 and the second fastening member 322 are disposed on the shielding plate 31 and aligned with the first fastening hole 11 and the second fastening hole 12, respectively; the first fastening piece 321 and the second fastening piece 322 are respectively used for being fastened and connected with the first fastening hole 11 and the second fastening hole 12 on the PCB board 10, so as to cover the shielding plate 31 on the shielded bonding pad 101. Preferably, the first fastening member 321 and the second fastening member 322 are disposed at two opposite ends or two opposite corners of the shielding plate. Moreover, fastener assemblies may be provided in specific extensions on the shield 31 for specific placement of the first and second fasteners 321, 322.

The pad shielding device 30 provided by the scheme is convenient to assemble and disassemble, can accurately assemble and shield the component pad, can be reused, avoids quality abnormality caused by the fact that the gummed paper is not cleaned in the prior art, can greatly reduce labor cost, and simultaneously avoids a large amount of waste caused by the use of the gummed paper. In addition, through the cooperation of two buckling pieces that relatively interval is great and the buckling holes that corresponds on the PCB board, this kind of connected mode can play the effect of support, pulling, reinforcement to the whole PCB board, both can prevent the inward deformation of PCB board, can prevent the outward deformation of PCB board again, can also prevent the PCB board crooked, prevent that the PCB board from passing wave soldering back board limit heat deformation, lead to the unqualified PCB board stress, produce serious quality defect.

As a preferred embodiment, as shown in fig. 3, 5 and 7, the shielding plate 31 has a first plate surface attached to the PCB 10 and a second plate surface opposite to the first plate surface, and the shielding plate 31 is gradually narrowed from the first plate surface to the second plate surface, so that the space for operability and the flux of solder are increased when the current batch of components 20 are soldered, and the good soldering of the current batch of components 20 on the PCB 10 is ensured.

As a special embodiment, referring to fig. 3, if the trend of the shielded bonding pad on the PCB board crosses the trend of a non-shielded bonding pad 109, when the bonding pad shielding device 30 is manufactured, the shielding plate 31 is provided with a relief groove 310 corresponding to the crossing, referring to fig. 5 to 7; the relief groove 310 forms a gap of a predetermined height above the intersection to provide a tin-plating space for the non-shielded pads 109. For example, the non-shielding bonding pad 109 is a bonding pad of a heat sink, and the bonding pad of the heat sink under the relief groove 310 can be normally tin-plated by the above mechanism.

Specifically, the relief groove 310 is a blind groove formed by the first plate surface of the shielding plate 31 facing the second plate surface. In addition, in order to make the structure at the relief groove 310 sufficiently stable, the shielding plate 31 is provided with a reinforcing plate 33 on the second plate surface corresponding to the relief groove 310; the two ends of the reinforcing plate 33 respectively cross the relief grooves 310 and are fixedly connected to the shielding plate 31 by screws 35.

Referring to fig. 8 and fig. 9, in one implementation manner of the first fastener 321 in this embodiment, the fastener is a cylindrical tensioning pin, and includes a base 3211 and a plurality of elastic sheets 3212 circumferentially spaced apart from the base 3211, and a protrusion 3213 is disposed at an outer side of an end of each elastic sheet 3212. The base 3211 is fixedly connected to the shield plate 31 by screws and nuts. When the cylindrical tensioning pin is matched with the first buckling hole 11, a plurality of elastic pieces 3212 penetrate through the first buckling hole 11 from the back surface of the PCB 10 and tension the hole wall of the first buckling hole 11, and the bulges 3213 at the tail ends of the elastic pieces 3212 are buckled on the front surface of the PCB 10. In addition, the second fastening components 322 have the same structure as the first fastening components 321.

Referring to fig. 10 and 11, in another implementation manner of the first fastener 321 in this embodiment, the fastener includes a pin 3215 and a lock tongue 3216, an end surface of one end of the pin 3215 is fixedly connected to the shielding plate 31, and the lock tongue 3216 is eccentrically and rotatably disposed on the end surface of the other end; as shown in fig. 10, when the fastener is engaged with the first fastening hole 11, the pin 3215 and the tongue 3216 pass through the first fastening hole 11 from the back of the PCB 10; then, the toggle latch 3216 rotates and snaps onto the front surface of the PCB 10, as shown in fig. 11. In addition, the second fastening components 322 have the same structure as the first fastening components 321.

Fig. 10 is a schematic view of another fastening member used in the pad shielding device according to the present embodiment in an unfastened state. Fig. 11 is a schematic view of another fastening member in a fastened state used in the pad shielding device according to the present embodiment.

The embodiment also provides a welding method of the PCB device, which comprises the following steps:

(1) According to the trend of the shielded bonding pads on the PCB, buckling holes are formed in the PCB, and meanwhile the bonding pad shielding device is manufactured;

(2) The buckling piece is buckled with the buckling hole, so that the shielding plate covers the shielded bonding pad;

(3) Wave soldering of components is carried out on the non-shielding bonding pads on the PCB;

(4) And detaching the bonding pad shielding device from the PCB, and welding components and parts on the shielded bonding pad on the PCB.

If the trend of the shielded bonding pad and the trend of the non-shielded bonding pad 109 on the PCB board intersect, when the bonding pad shielding device 30 is manufactured, the shielding plate 31 is provided with a relief groove 310 corresponding to the intersection, the relief groove 310 forms a gap with a preset height above the intersection, and the gap enables the non-shielded bonding pad 109 at the intersection to still be tin-plated, so as to complete the welding of the corresponding device (such as a heat dissipating device).

The above embodiments are merely for fully disclosing the present utility model, but not limiting the present utility model, and should be considered as the scope of the present disclosure based on the substitution of equivalent technical features of the inventive subject matter without creative work.

Claims (10)

1. A welding disc shielding device is characterized by comprising a shielding plate and a buckling piece; the shape of the shielding plate is consistent with the trend of the shielded bonding pads on the PCB; the buckling piece is arranged on the shielding plate, is used for being buckled and connected with the buckling hole on the PCB, and covers the shielding plate on the shielded bonding pad.

2. The pad shielding device according to claim 1, wherein the shielding plate is made of any one of a metal material, a ceramic material, and a synthetic stone material.

3. The land shielding device according to claim 1 or 2, wherein the shielding plate has a first plate surface attached to the PCB board and a second plate surface opposite to the first plate surface, and the shielding plate is tapered from the first plate surface toward the second plate surface.

4. The pad shielding device according to claim 3, wherein a relief groove is formed in the shielding plate corresponding to a trend of the non-shielding pad on the PCB, and the relief groove is a blind groove formed by the first plate facing the second plate.

5. The pad shielding device according to claim 4, wherein the shielding plate is provided with a reinforcing plate on the second plate surface corresponding to the relief groove.

6. The bonding pad shielding device according to claim 5, wherein two ends of the reinforcing plate respectively cross over the relief grooves and are fixedly connected to the shielding plate.

7. The solder pad shield of claim 1 wherein said fasteners are disposed at opposite ends or opposite corners of said shield.

8. The solder pad shielding device of claim 1 or 7, wherein the fastener is a cylindrical tensioning pin that is fastened to or separated from the fastening hole formed in the PCB.

9. The bonding pad shielding device according to claim 8, wherein the cylindrical tensioning pin comprises a base and a plurality of elastic sheets arranged on the circumference of the base at intervals, and the outer side of the tail end of each elastic sheet is provided with a protrusion; the base is fixedly connected to the shielding plate, when the cylindrical tensioning pin is buckled with the buckling hole, the plurality of elastic sheets penetrate through the buckling hole from the back surface of the PCB and tension the wall of the buckling hole, and the protrusions at the tail ends of the elastic sheets are buckled on the front surface of the PCB.

10. The pad shielding device according to claim 1 or 7, wherein the fastener comprises a pin and a tongue, an end face of one end of the pin is connected to the shielding plate, and the tongue is eccentrically rotatably provided on an end face of the other end; when the buckling piece is buckled with the buckling hole, the pin and the lock tongue penetrate through the buckling hole from the back of the PCB, and the lock tongue is stirred to rotate and buckled on the front of the PCB.