CN117316814A - Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment - Google Patents

Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment Download PDF

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Publication number
CN117316814A
CN117316814A CN202311084643.4A CN202311084643A CN117316814A CN 117316814 A CN117316814 A CN 117316814A CN 202311084643 A CN202311084643 A CN 202311084643A CN 117316814 A CN117316814 A CN 117316814A
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CN
China
Prior art keywords
wafer
mechanical arm
current signal
current
micro
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Pending
Application number
CN202311084643.4A
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Chinese (zh)
Inventor
覃富城
王磊
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Beijing Ziniu Yidong Technology Co ltd
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Beijing Ziniu Yidong Technology Co ltd
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Priority to CN202311084643.4A priority Critical patent/CN117316814A/en
Publication of CN117316814A publication Critical patent/CN117316814A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Robotics (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The application relates to a method and a system for detecting wafer scratch by a mechanical arm and semiconductor processing equipment in the technical field of semiconductors, wherein the mechanical arm comprises a base, a wafer clamping part, a plurality of joints and a plurality of rotating shafts, and each rotating shaft is correspondingly provided with a driving motor; the method for detecting the wafer scratch by the mechanical arm comprises the following steps: the wafer clamping part is used for clamping a wafer; each driving motor drives the corresponding rotating shaft to rotate and drives the wafer clamping part to move from the inside of the wafer box to the outside of the wafer box or from the outside of the wafer box to the inside of the wafer box; measuring in real time a current signal of at least one of the circuits of the drive motor; and judging the degree of scratch caused by the mechanical arm to the wafer positioned below the wafer clamping part in the wafer box according to the magnitude of the current signal. The detection method can prevent and reduce the mechanical scratch of the wafer.

Description

Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment
Technical Field
The present disclosure relates to the field of semiconductor technologies, and in particular, to a method and a system for detecting wafer scratches by a mechanical arm, and a semiconductor processing device.
Background
Wafers are the most important raw material in semiconductor production, and have been developed to 12 inches, and in the wafer processing process, the wafers need to be taken out of the wafer box and conveyed to the reaction chamber several times, and the wafers are conveyed back to the wafer box after the reaction is finished. The mechanical arm in the transmission module of the semiconductor processing equipment is adopted to grasp the wafers and transfer the wafers, and the mechanical arm is very easy to scratch the surface of the wafer below due to the fact that the distance between the wafers in the wafer box is very narrow and the mechanical arm can slightly shift in tens of thousands of times of use, so that the yield of the wafers is affected.
Disclosure of Invention
In view of the problems in the background art, the application provides a method and a system for detecting wafer scratch by a mechanical arm and semiconductor processing equipment, which can prevent and reduce the mechanical scratch of the wafer.
According to a first aspect of the present invention, there is provided a method for detecting a wafer scratch by using a mechanical arm, where the mechanical arm includes a base, a wafer clamping portion, a plurality of joints and a plurality of rotating shafts, the plurality of joints are sequentially arranged from the base to the wafer clamping portion, the plurality of rotating shafts are respectively connected between a joint close to the base and between every two adjacent joints, and each rotating shaft is correspondingly provided with a driving motor; the method for detecting the wafer scratch by the mechanical arm comprises the following steps: the wafer clamping part is used for clamping a wafer; each driving motor drives the corresponding rotating shaft to rotate and drives the wafer clamping part to move from the inside of the wafer box to the outside of the wafer box or from the outside of the wafer box to the inside of the wafer box; measuring in real time a current signal of at least one of the circuits of the drive motor; and judging the degree of scratch caused by the mechanical arm to the wafer positioned below the wafer clamping part in the wafer box according to the magnitude of the current signal.
In some embodiments of the invention, the current signal is measured by a microcurrent measurement device.
In some embodiments of the invention, the microcurrent measurement device is a current amplifier.
In some embodiments of the invention, an oscilloscope is connected in the circuit of the microcurrent measurement device.
In some embodiments of the invention, an alarm value is set for the current signal, and when the current signal measured in real time is greater than or equal to the alarm value, an alarm is sent out and/or the operation of the mechanical arm is stopped.
In some embodiments of the invention, the alert value is less than or equal to a current signal of a drive motor when the robot arm is capable of scratching the wafer.
According to a second aspect of the present invention, there is provided a system for detecting wafer scratches by a robot arm, including a micro-current measurement device and an oscilloscope, wherein the micro-current measurement device is connected to a circuit of a driving motor of the robot arm; the oscilloscope is connected with the micro-current measuring device.
In some embodiments of the present invention, the system for detecting wafer scratch by a mechanical arm further includes a controller, where the controller is connected to the micro-current measurement device and/or the oscilloscope and is connected to the mechanical arm, and when a current signal measured by the micro-current measurement device and/or the oscilloscope is greater than or equal to a preset alarm value, the controller controls the mechanical arm to stop working.
In some embodiments of the present invention, the system for detecting wafer scratch by a mechanical arm further includes an alarm, where the alarm is connected to the controller, and the controller controls the alarm to send out an early warning when the current signal measured by the micro-current measurement device and/or the oscilloscope is greater than or equal to a preset alarm value.
According to a third aspect of the present invention, a semiconductor processing apparatus is provided, including the system for detecting wafer scratches by the robot arm described above.
Compared with the prior art, the invention achieves the following technical effects:
according to the method, the current signal change of the driving motor caused by friction force between the mechanical arm and the wafer is utilized, the real-time measurement is carried out on micro-current of the driving motor of the mechanical arm, the current signal measured in real time is compared with the current signal of the mechanical arm in normal operation, whether the wafer and the mechanical arm are scratched or not is judged, and whether the wafer is scratched or not under the condition of scratching, so that the mechanical arm is suspended in time, then maintenance is carried out, the influence on the subsequent wafer is reduced, and the mechanical scratch of the wafer is prevented and reduced.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic diagram of a structure embodying a robot arm;
FIG. 2 is a schematic diagram of a structure embodying a detection system;
fig. 3 is a schematic diagram showing conversion of a current signal into a waveform pattern, A1 is a waveform of a normal current signal of a driving motor when a mechanical arm works normally, A2 is a waveform of a current signal generating contact friction, and A3 is a set alarm line.
The reference numerals in the drawings are as follows: 10. a mechanical arm; 101. a base; 102. a wafer clamping portion; 103. a joint; 104. a rotating shaft; 105. a drive motor; 20. a detection system; 201. a microcurrent measuring device; 202. an oscilloscope; 203. a controller; 204. an alarm.
Detailed Description
It should be understood that the described embodiments are merely some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which would be apparent to one of ordinary skill in the art without making any inventive effort, are intended to be within the scope of the present application.
When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context. Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
The embodiment of the application discloses a method for detecting wafer scratch by a mechanical arm.
As shown in fig. 1 and 2, the robot 10 includes a base 101, a wafer clamping portion 102, N joints 103, and N rotating shafts 104, where the N joints 103 are sequentially arranged from the base 101 to the wafer clamping portion 102, the N rotating shafts 104 are respectively connected between the joint 103 close to the base 101 and between every two adjacent joints 103, so that the joints 103 and the base 101 and between the joints 103 and 103 can rotate, each rotating shaft 104 is correspondingly provided with a driving motor 105, a micro-current measuring device 201 is connected to a circuit of m driving motors 105, and the wafer clamping portion 102 is fixed at an end of the joint 103 far from the base 101.
Wherein N is a positive integer and M is a positive integer selected from 1 to N.
It should be noted that the number of the joints 103 and the rotation shafts 104 in the present embodiment is not limited to 4 in fig. 1, and in other embodiments of the present invention, the robot arm 10 may select more joints 103 and rotation shafts 104 as required.
The micro-current measuring device 201 may be installed on the circuit of the driving motor 105 of each rotating shaft 104, that is, M is equal to N; it is also possible to select one or more of the driving motors 105 to be installed in the circuit, that is, M is smaller than N; further, when the plurality of driving motors 105 form a parallel circuit, a micro-current measuring device 201 may be selectively connected to the parallel circuit of the plurality of driving motors 105; the driving motor 105 corresponding to the micro-current measuring device 201 may be in an operating state when the wafer clamping portion 102 moves from inside to outside of the wafer cassette or from outside to inside of the wafer cassette, which is not limited herein.
The method for detecting the wafer scratch by the mechanical arm comprises the following steps:
the wafer clamping section 102 clamps the wafer;
each driving motor 105 drives the corresponding rotating shaft 104 to rotate, and drives the wafer clamping part 102 to move from the inside of the wafer box to the outside of the wafer box or from the outside of the wafer box to the inside of the wafer box;
measuring current signals of the corresponding circuits of the driving motors 105 in real time by the micro-current measuring devices 201;
whether the wafer clamping part 102 or the joint 103 scratches the wafer positioned below the wafer clamping part 102 in the wafer box is judged according to the magnitude of each current signal.
It will be appreciated that when a wafer is scratched from the wafer holder 102 or the joints 103, the friction between the robot 10 and the wafer will change, and accordingly the current of the drive motor 105 connected to the robot 10 will change.
Therefore, when each micro-current measuring device 201 measures that the current signal of the corresponding circuit of the driving motor 105 exceeds the corresponding normal current signal, it can be determined that the wafer clamping portion 102 or the joint 103 is scratched from the wafer located below the wafer clamping portion 102 in the wafer cassette.
It should be noted that, the normal current signal is a current signal when the wafer clamping portion 102 or the joint 103 does not have any contact friction with a wafer in the wafer box, and the normal current signal may be measured by the micro current measurement device 201 when the robot arm 10 leaves the factory or after calibration, and when the similar wafer is transferred to normally work.
Considering the conditions of different wafer hardness of different materials, different materials of different mechanical arms 10 and the like, the actual friction force required by the scratch formed by different types of wafers is different; therefore, the upper limit of the current signal of each micro current measuring device 201 can be set according to the actual friction force to be achieved by the wafer forming scratch.
Specifically, when the current signal of the micro current measurement device 201 is equal to the normal current signal, it is determined that the wafer clamping portion 102 or the joint 103 has no contact friction with the wafer in the wafer cassette; when the current signal of the micro-current measuring device 201 is larger than the normal current signal and smaller than the upper limit of the set current signal, judging that the wafer clamping part 102 or the joint 103 has certain contact with the wafer in the wafer box but no scratch is formed; when the current signal of the micro current measurement device 201 is greater than or equal to the upper limit of the set current signal, it is determined that the wafer clamping portion 102 or the joint 103 has contact friction with the wafer in the wafer cassette and can form scratches.
In some embodiments of the present invention, the micro-current measurement device 201 may employ a current amplifier; since the current captured by the drive motor 105 is small, the current amplifier can quickly respond to instantaneous current changes and continuously output a corresponding amplified current signal.
Further, as shown in fig. 2, an oscilloscope 202 is further connected to the circuit of the current amplifier; the current signal amplified by the current amplifier is transmitted to the oscilloscope 202, the oscilloscope 202 converts the current signal into a visual waveform pattern, and a worker can analyze the circuit according to the waveform pattern.
Further, as shown in fig. 3, an alarm line is set in the oscillograph 202 in a scratch forming condition (friction force), when the current signal exceeds the alarm value corresponding to the alarm line, it can be more intuitively determined that the wafer and the mechanical arm 10 are scratched and the wafer can be scratched, and at this time, the mechanical arm 10 stops working to reduce the influence on the subsequent wafers. It should be noted that the alarm value may also be set directly to the current signal of the current amplifier to scratch formation conditions.
It should be noted that, for setting the alarm line of the oscillograph 202 waveform graph, the actual friction force to be achieved when the wafer is scratched can be determined, so that detection closer to the critical point of scratching is realized, and the maintenance frequency of the manipulator is reduced; in addition, the alarm line can be set according to actual production requirements, for example, the alarm line can adopt a current signal when a certain contact state of scratch cannot be formed, the mechanical arm 10 stops before the alarm line in time, and the wafer in contact at present can be ensured not to be damaged at all, so that the protection effect on the wafer is improved.
The embodiment of the application also provides a system for detecting the scratch of the wafer by the mechanical arm, as shown in fig. 2, the detection system 20 comprises a micro-current measuring device 201, an oscilloscope 202 and a controller 203; the micro-current measuring device 201 is connected to the circuit of the driving motor 105 of the mechanical arm 10, and the current measuring device measures the current signal of the circuit of the driving motor 105 in real time; the oscilloscope 202 is connected with the micro-current measuring device 201, a current signal measured by the micro-current measuring device 201 is transmitted to the oscilloscope 202, and the oscilloscope 202 converts the current signal into a visual waveform pattern; the controller 203 is connected with the oscilloscope 202 and the mechanical arm 10, and when the oscilloscope 202 displays that the current signal reaches the alarm line, the controller 203 controls the mechanical arm 10 to stop working.
Further, as shown in fig. 2, the detection system 20 further includes an alarm 204, where the alarm 204 is connected to the controller 203, and the controller 203 controls the alarm 204 to send out an early warning when the oscilloscope 202 displays that the current signal reaches the alarm line. Specifically, the alarm 204 may be an audible alarm or an audible-visual alarm, etc.
The embodiment of the application also provides a semiconductor processing device, which comprises the mechanical arm 10 and the detection system 20 for wafer scratch by the mechanical arm.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims (10)

1. The method for detecting the wafer scratch by the mechanical arm is characterized by comprising a base, a wafer clamping part, a plurality of joints and a plurality of rotating shafts, wherein the joints are sequentially arranged from the base to the wafer clamping part, the rotating shafts are respectively connected between the joint close to the base and between every two adjacent joints, and each rotating shaft is correspondingly provided with a driving motor;
the method for detecting the wafer scratch by the mechanical arm comprises the following steps:
the wafer clamping part is used for clamping a wafer;
each driving motor drives the corresponding rotating shaft to rotate and drives the wafer clamping part to move from the inside of the wafer box to the outside of the wafer box or from the outside of the wafer box to the inside of the wafer box;
measuring in real time a current signal of at least one of the circuits of the drive motor;
and judging the degree of scratch caused by the mechanical arm to the wafer positioned below the wafer clamping part in the wafer box according to the magnitude of the current signal.
2. The method of claim 1, wherein the current signal is measured by a microcurrent measurement device.
3. The method for detecting wafer scratches according to claim 2, wherein the micro-current measuring device is a current amplifier.
4. The method for detecting wafer scratches according to claim 2, wherein an oscilloscope is connected to a circuit of the micro-current measuring device.
5. The method for detecting wafer scratches according to any one of claims 1 to 4, wherein an alarm value is set for the current signal, and an alarm is given and/or the robot is stopped when the current signal measured in real time is greater than or equal to the alarm value.
6. The method of claim 5, wherein the alarm value is less than or equal to a current signal of a drive motor when the robot is capable of scratching the wafer.
7. The detection system for the wafer scratch by the mechanical arm is characterized by comprising a micro-current measurement device and an oscilloscope, wherein the micro-current measurement device is connected to a circuit of a driving motor of the mechanical arm; the oscilloscope is connected with the micro-current measuring device.
8. The system of claim 7, further comprising a controller, wherein the controller is connected to the micro-current measurement device and/or the oscilloscope and to the robot, and the controller is configured to control the robot to stop working when the current signal measured by the micro-current measurement device and/or the oscilloscope is greater than or equal to a preset alarm value.
9. The system for detecting wafer scratches according to claim 8, further comprising an alarm connected to the controller, wherein the controller controls the alarm to send out an early warning when the current signal measured by the micro current measuring device and/or the oscilloscope is greater than or equal to a preset alarm value.
10. A semiconductor processing apparatus comprising a system for detecting wafer scratches by the robot of any of claims 7 to 9.
CN202311084643.4A 2023-08-25 2023-08-25 Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment Pending CN117316814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311084643.4A CN117316814A (en) 2023-08-25 2023-08-25 Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311084643.4A CN117316814A (en) 2023-08-25 2023-08-25 Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment

Publications (1)

Publication Number Publication Date
CN117316814A true CN117316814A (en) 2023-12-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311084643.4A Pending CN117316814A (en) 2023-08-25 2023-08-25 Method and system for detecting wafer scratch by mechanical arm and semiconductor processing equipment

Country Status (1)

Country Link
CN (1) CN117316814A (en)

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