CN117309752A - Method and device for testing bonding strength of semiconductor product - Google Patents

Method and device for testing bonding strength of semiconductor product Download PDF

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Publication number
CN117309752A
CN117309752A CN202311383707.0A CN202311383707A CN117309752A CN 117309752 A CN117309752 A CN 117309752A CN 202311383707 A CN202311383707 A CN 202311383707A CN 117309752 A CN117309752 A CN 117309752A
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CN
China
Prior art keywords
substrate
testing
assembly
moving device
speed moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311383707.0A
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Chinese (zh)
Inventor
唐声灿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Try Precision Technology Co ltd
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Shenzhen Try Precision Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Try Precision Technology Co ltd filed Critical Shenzhen Try Precision Technology Co ltd
Priority to CN202311383707.0A priority Critical patent/CN117309752A/en
Publication of CN117309752A publication Critical patent/CN117309752A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G01N3/04—Chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/0042—Pneumatic or hydraulic means
    • G01N2203/0044—Pneumatic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/04—Chucks, fixtures, jaws, holders or anvils

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The device comprises a mounting plate, a substrate bearing mechanism, a high-speed moving device and a driving assembly, wherein the substrate bearing mechanism and the high-speed moving device are arranged on the mounting plate, a buffer spring is arranged between the bottom of the substrate bearing mechanism and the mounting plate, and the high-speed moving device drives the substrate bearing mechanism to move downwards and rapidly along the Z-axis direction; a clamp assembly for fixing the substrate with the object to be tested to the substrate bearing mechanism; clamping the tested object by a tension clamp of the testing tool; and the tension clamp and the measured object are kept motionless; the high-speed moving device drives the clamp assembly and the substrate to move downwards in an instant acceleration way, so that the tested object is pulled off the substrate. In the invention, only the tested object of the tested sample and the substrate in the substrate need to move in the test process, and the tested object is fixed, so that the invention is easier to realize repeated and stable test technically; the test reliability is higher.

Description

Method and device for testing bonding strength of semiconductor product
Technical Field
The present invention relates to a method and apparatus for semiconductor electrical bonding testing, and more particularly to a method and apparatus suitable for high speed tensile testing.
Background
Semiconductor electrical bonding circuits typically include a series of solder or gold balls on a substrate having the circuit. These balls are used to connect individual wires to vias, or to vias of another substrate when the substrates are in aligned contact.
Test equipment is required to confirm that the ball has sufficient mechanical adhesion to the substrate to confirm durability of the manufacturing technique. It is known to perform shear testing by driving a tool on the side of a ball and tensile testing by clamping and stretching the ball orthogonally to the substrate.
Individual balls are typically aligned in a row and are very small. Solder balls typically have diameters of 1000-75um, while gold balls have diameters of 100-20um. When these "balls" are attached to a substrate, they have a slightly hemispherical appearance. The very small size of certain solder balls and gold balls means that the breaking force is very small, and special measuring devices and methods are required to measure the breaking force.
A high-speed tensile test apparatus and method as disclosed in chinese patent document CN1950689a is one in which a ball (solder ball or gold ball) is clamped and rapidly moved in a direction substantially orthogonal to an adhesion plane. The substrate is suddenly stopped by an abutment to apply a sudden load at the ball-substrate interface to measure the breaking force of the ball and the substrate.
The method has the problems that a device (such as a cylinder or a device similar to the device with a tension function) generating force and a clamping tool are difficult to realize synchronous movement, so that the accuracy of a test result is low, the effective test moment is difficult to judge, and when the required drawing test speed is reached, the sample is stretched or compressed in advance with high probability; so that repeated and stable tests cannot be realized technically; and the test reliability is low.
Disclosure of Invention
In order to solve the problems, the invention provides a method and a device for testing the bonding strength of a semiconductor product, which can realize repeated and stable testing more technically and have high testing reliability.
The technical scheme of the invention is as follows: there is provided a method of testing the bond strength of a semiconductor product comprising the steps of:
s1, fixing a substrate with a measured object to a fixture assembly;
s2, using a testing tool to be matched with the tested object, enabling the testing tool to be fixedly connected with the tested object, and keeping the testing tool and the tested object motionless;
s3, driving the clamp assembly and the substrate to move downwards in an instant acceleration manner by adopting a high-speed moving device, so that the tested object is pulled off the substrate;
s4, measuring the binding force at the interface of the object to be measured and the substrate.
As an improvement of the present invention, the high-speed moving means drives the clamp assembly and the substrate to move downward at a high speed by rapidly pressing the inclined surface of the wedge block.
As an improvement of the invention, the high-speed moving device drives the clamp assembly and the substrate to move downwards at a high speed by quickly striking the first striking block.
The invention also provides a device for testing the bonding strength of the semiconductor product, which comprises a mounting plate, a substrate bearing mechanism, a high-speed moving device and a driving assembly, wherein the substrate bearing mechanism and the high-speed moving device are arranged on the mounting plate, and the high-speed moving device drives the substrate bearing mechanism to move downwards and rapidly along the Z-axis direction through the driving assembly; when in use, the substrate with the measured object is fixed to the clamp assembly of the substrate bearing mechanism; clamping the tested object by a tension clamp of the testing tool; and the tension clamp and the measured object are kept motionless; the high-speed moving device drives the clamp assembly and the substrate to move downwards in an instant acceleration mode, so that the tested object is pulled off the substrate.
As an improvement to the invention, the substrate bearing mechanism comprises a clamp assembly, wherein a connecting plate is arranged on the lower bottom surface of the clamp assembly, and the connecting plate is arranged on a Z-direction guide rail and moves up and down along the Z-direction guide rail; and a buffer spring is arranged between the bottom of the substrate bearing mechanism and the mounting plate.
As an improvement to the invention, the driving assembly comprises a driving assembly main body, a driving wheel and a wedge block, wherein the driving wheel is horizontally arranged on the driving assembly main body, the wedge block is arranged at the lower part of the connecting plate, and the driving assembly main body is positioned on the linear guide rail of the mounting plate; the wedge and the drive wheel are configured such that when the drive wheel moves horizontally, the drive wheel presses the inclined surface of the wedge, causing the web to move downwardly at a high speed.
As an improvement of the present invention, the high-speed moving device comprises a motor and a synchronous pulley assembly, the motor drives the synchronous pulley assembly to move, and the driving assembly body is connected with a belt of the synchronous pulley assembly.
As an improvement to the invention, the driving assembly comprises a driving assembly main body, an active striking block and a passive striking block, wherein the active striking block is arranged on the driving assembly main body in a sliding way through a Z-axis sliding block, and the passive striking block is arranged at the lower part of the connecting plate; the active and passive striking blocks are configured such that when the active striking block moves vertically downward, the active striking block strikes the passive striking block, causing the connecting plate to move downward at a high speed.
As an improvement of the invention, the high-speed moving device comprises a motor and a synchronous pulley assembly, wherein the motor drives the synchronous pulley assembly to move, and the Z-axis sliding block is connected with a belt of the synchronous pulley assembly.
As an improvement of the present invention, the present invention further includes a hold-down cylinder that is abutted with the substrate carrying mechanism.
In the invention, only the tested object of the tested sample and the substrate in the substrate need to move in the test process, and the tested object is fixed, so that the invention is easier to realize repeated and stable test technically; the test reliability is higher.
In addition, the invention only needs to realize the movement of a single part of the substrate bearing mechanism, so the control system, the algorithm logic and the like of the invention are simpler and more reliable.
Drawings
FIG. 1 is a schematic block diagram of the method of the present invention.
Fig. 2 is a schematic perspective view of a first embodiment of the device of the present invention.
Fig. 3 is a schematic perspective view of another view of fig. 2.
Fig. 4 is a schematic view of the embodiment of fig. 2 in use.
Fig. 5 is a schematic plan view of a second embodiment of the apparatus of the present invention.
Detailed Description
The invention will be described by taking the example of tearing off the conductive balls from the substrate, but the invention can be used for tearing off the conductive balls from the substrate, and can also be used for testing the bonding performance of two different materials, wherein the tested objects include but are not limited to the conductive balls; the means for fixing the object to be tested used in the test tool includes, but is not limited to, tension clamps, and any structure can be used as long as the object to be tested can be fixed.
Referring to fig. 1, fig. 1 discloses a method for testing bonding strength of a semiconductor product, comprising the following steps:
s1, fixing a substrate with conductive balls to a fixture assembly; the clamp assembly comprises a fixed clamping plate and a movable clamping plate, and the movable clamping plate can reciprocate relative to the fixed clamping plate under the control of the adjusting handle so as to fix the substrate on the clamp assembly, thereby realizing the relative fixation of the substrate;
s2, using a testing tool to be matched with the conductive ball, so that a tension clamp of the testing tool clamps the conductive ball; and keep the tension clip and the conductive ball motionless; the test tool and its tension clip are prior art, wherein the tension clip is a component of the test tool and will not be described in detail herein;
s3, driving the clamp assembly and the substrate to move downwards in an instant acceleration manner by adopting a high-speed moving device, so that the conductive balls are torn off from the substrate;
s4, measuring the binding force at the interface of the conductive ball and the substrate; the method for testing the binding force is the prior art and will not be described in detail here.
In the invention, only the conductive ball of the tested sample and the substrate in the substrate need to move in the test process, and the conductive ball is fixed, so that the repeated and stable test is easier to realize technically; the test reliability is higher. Furthermore, the invention only needs to realize the movement of a single part of the substrate bearing mechanism, so the control system, the algorithm logic and the like of the invention are simpler and more reliable.
Preferably, the high-speed moving means drives the clamp assembly and the substrate to move downward at a high speed by rapidly pressing the inclined surface of the wedge block.
Preferably, the high-speed moving means drives the clamp assembly and the substrate to move downward at a high speed by rapidly striking the first striking block.
Referring to fig. 2-4, fig. 2-4 disclose a first embodiment of an apparatus for testing bonding strength of semiconductor products, which includes a mounting board 1, a substrate carrying mechanism 2, a high-speed moving device 3 and a driving assembly 4, wherein the substrate carrying mechanism 2 and the high-speed moving device 3 are disposed on the mounting board 1, and a buffer spring 5 is disposed between the bottom of the substrate carrying mechanism 2 and the mounting board 1, in this embodiment, the buffer spring 5 includes a first buffer spring 51 and a second buffer spring 52, and the first buffer spring 51 and the second buffer spring 52 are disposed at a predetermined distance; the high-speed moving device 3 drives the substrate bearing mechanism 2 to move downwards and rapidly along the Z-axis direction through the driving component 4; in use, the substrate 6 with the conductive balls 61 is secured to the clamp assembly 21 of the substrate carrier 2; causing a tension clamp 71 of the test tool 7 (see fig. 4) to clamp the conductive ball 61; and holds the tension clip 71 and the conductive ball 61 stationary; the high-speed moving device 3 drives the clamp assembly 21 and the substrate 6 to move downward at an instant acceleration, thereby tearing the conductive balls 61 off the substrate 6.
In this embodiment, the clamp assembly 21 includes a fixed clamping plate 211 and a movable clamping plate 212, and the movable clamping plate 212 is reciprocally movable with respect to the fixed clamping plate 211 under the control of an adjustment handle 213, so that the substrate 6 can be fixed to the clamp assembly 21, thereby achieving the relative fixation of the substrate 6.
Preferably, the substrate carrying mechanism 2 comprises a fixture assembly 21, a connecting plate 22 is arranged on the lower bottom surface of the fixture assembly 21, and the connecting plate 22 is arranged on a Z-guide rail 23 and moves up and down along the Z-guide rail 23; the buffer spring 5 is arranged at the lower part of the connecting plate 22; the buffer spring 5 serves to buffer the substrate carrier 2 when the substrate carrier 2 is descending, and appropriately reduce the descending speed of the substrate carrier 2.
Preferably, the driving assembly 4 includes a driving assembly main body 41, a driving wheel 42 and a wedge block 43, the driving wheel 42 is horizontally arranged on the driving assembly main body 41, the wedge block 43 is arranged at the lower part of the connecting plate 22, the driving assembly main body 41 is arranged on a linear guide rail 44 and can reciprocate along the linear guide rail 44, and the linear guide rail 44 is arranged on the mounting plate 1; the wedge 43 and the driving wheel 42 are configured such that when the driving wheel 42 moves horizontally, the driving wheel 42 presses the inclined surface 431 of the wedge 43 to move the connection plate 22 downward at a high speed.
Preferably, the high-speed moving device 3 comprises a motor 31 and a synchronous pulley assembly 32, the motor 31 drives the synchronous pulley assembly 32 to move, and the driving assembly body 41 is connected with a belt 321 of the synchronous pulley assembly 32; in this embodiment, the motor 31 may be a servo motor to facilitate system control.
The synchronous pulley assembly 32 of the present invention may be replaced with a lead screw nut structure as desired; the high-speed moving device 3 in the present invention may be replaced with an air cylinder, and when the high-speed moving device 3 is an air cylinder, the air cylinder may directly act on the driving assembly body 41; the high-speed moving device 3 in the invention can be replaced by a linear motor and can play the same role.
Preferably, the invention further comprises a hold-down cylinder 8, wherein the hold-down cylinder 8 is adjacent to the substrate bearing mechanism 2; the hold-down cylinder 8 is provided such that the hold-down cylinder 8 holds the substrate carrying mechanism 2 when the test is not performed, and the hold-down cylinder 8 releases the substrate carrying mechanism 2 at the instant of starting the test for the test.
In actual use, a series of conductive balls 61 may be present on the substrate 6, at which point the present invention may index the tension clamp 71 or the overall device to place the desired conductive balls 61 under the test tool. As shown in fig. 4, the present invention is to index the whole device by X-axis 9 and Y-axis 91. The X-axis 9 and the Y-axis 91 are prior art and are not described in detail herein.
Referring to fig. 5, fig. 5 is a schematic plan view of a second embodiment of the apparatus according to the present invention.
The embodiment shown in fig. 5 is identical to the embodiment shown in fig. 2 in general structure, except that the driving assembly 4 includes a driving assembly body 41, an active striking block 44, and a passive striking block 45, the active striking block 44 is slidably disposed on the driving assembly body 41 through a Z-axis sliding block 441, and the passive striking block 45 is disposed at a lower portion of the connecting plate 22; the active and passive striking blocks 44, 45 are configured such that when the active striking block 44 moves vertically downward, the active striking block 44 strikes the passive striking block 45, causing the web 22 to move downward at a high speed. Preferably, the high-speed moving device 3 comprises a motor 31 and a synchronous pulley assembly 32, the motor 31 drives the synchronous pulley assembly 32 to move, and the Z-axis sliding block 441 is connected with a belt 321 of the synchronous pulley assembly 32.
Obviously, the synchronous pulley assembly 32 of the present invention may be replaced with a lead screw nut structure; the high-speed moving device 3 in the present invention may be replaced with an air cylinder, and when the high-speed moving device 3 is an air cylinder, the air cylinder may directly act on the driving assembly body 41; the high-speed moving device 3 in the invention can be replaced by a linear motor and can play the same role.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.

Claims (10)

1. A method of testing the bond strength of a semiconductor product, comprising: the method comprises the following steps:
s1, fixing a substrate with a measured object to a fixture assembly;
s2, using a testing tool to be matched with the tested object, enabling the testing tool to be fixedly connected with the tested object, and keeping the testing tool and the tested object motionless;
s3, driving the clamp assembly and the substrate to move downwards in an instant acceleration manner by adopting a high-speed moving device, so that the tested object is pulled off the substrate;
s4, measuring the binding force at the interface of the measured object and the substrate.
2. The method of testing the bond strength of a semiconductor product of claim 1, wherein: the high-speed moving device drives the clamp assembly and the substrate to move downwards at a high speed by rapidly pressing the inclined surface of the wedge block.
3. The method of testing the bond strength of a semiconductor product of claim 1, wherein: the high-speed moving device drives the clamp assembly and the substrate to move downwards at a high speed by rapidly striking the first striking block.
4. An apparatus for testing the bond strength of a semiconductor product, comprising: the device comprises a mounting plate (1), a substrate bearing mechanism (2), a high-speed moving device (3) and a driving assembly (4), wherein the substrate bearing mechanism (2) and the high-speed moving device (3) are arranged on the mounting plate (1), and the high-speed moving device (3) drives the substrate bearing mechanism (2) to move downwards and rapidly along the Z-axis direction through the driving assembly (4); in use, the substrate (6) with the object (61) to be tested is fixed to the clamp assembly (21) of the substrate bearing mechanism (2); clamping the object (61) to be tested by a tension clamp (71) of a test tool (7); and the tension clamp (71) and the measured object (61) are kept motionless; the high-speed moving device (3) drives the clamp assembly (21) and the substrate (6) to move downwards in an instant acceleration mode, so that the tested object (61) is pulled off from the substrate (6).
5. The apparatus for testing the bonding strength of a semiconductor product according to claim 4, wherein: the substrate bearing mechanism (2) comprises a clamp assembly (21), a connecting plate (22) is arranged on the lower bottom surface of the clamp assembly (21), and the connecting plate (22) is arranged on a Z-shaped guide rail (23) and moves up and down along the Z-shaped guide rail (23); a buffer spring (5) is arranged between the bottom of the substrate bearing mechanism (2) and the mounting plate (1).
6. The apparatus for testing the bonding strength of semiconductor products according to claim 4 or 5, wherein: the driving assembly (4) comprises a driving assembly main body (41), a driving wheel (42) and a wedge block (43), wherein the driving wheel (42) is horizontally arranged on the driving assembly main body (41), the wedge block (43) is arranged at the lower part of the connecting plate (22), and the driving assembly main body (41) is positioned on a linear guide rail (44) of the mounting plate (1); the wedge block (43) and the driving wheel (42) are configured such that when the driving wheel (42) moves horizontally, the driving wheel (42) presses the inclined surface (431) of the wedge block (43) to move the connection plate (22) downward at a high speed.
7. The apparatus for testing the bonding strength of semiconductor products according to claim 4 or 5, wherein: the high-speed moving device (3) comprises a motor (31) and a synchronous pulley assembly (32), the motor (31) drives the synchronous pulley assembly (32) to move, and the driving assembly main body (41) is connected with a belt (321) of the synchronous pulley assembly (32).
8. The apparatus for testing the bonding strength of semiconductor products according to claim 4 or 5, wherein: the driving assembly (4) comprises a driving assembly main body (41), an active striking block (44) and a passive striking block (45), wherein the active striking block (44) is slidably arranged on the driving assembly main body (41) through a Z-axis sliding block (441), and the passive striking block (45) is arranged at the lower part of the connecting plate (22); the active and passive striking blocks (44, 45) are configured such that when the active striking block (44) moves vertically downward, the active striking block (44) impacts the passive striking block (45), causing the web (22) to move downward at a high speed.
9. The apparatus for testing the bonding strength of a semiconductor product according to claim 8, wherein: the high-speed moving device (3) comprises a motor (31) and a synchronous pulley assembly (32), the motor (31) drives the synchronous pulley assembly (32) to move, and the Z-axis sliding block (441) is connected with a belt (321) of the synchronous pulley assembly (32).
10. The apparatus for testing the bonding strength of semiconductor products according to claim 4 or 5, wherein: and the device further comprises a pressing-down holding cylinder (8), wherein the pressing-down holding cylinder (8) is adjacent to the substrate bearing mechanism (2).
CN202311383707.0A 2023-10-24 2023-10-24 Method and device for testing bonding strength of semiconductor product Pending CN117309752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311383707.0A CN117309752A (en) 2023-10-24 2023-10-24 Method and device for testing bonding strength of semiconductor product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311383707.0A CN117309752A (en) 2023-10-24 2023-10-24 Method and device for testing bonding strength of semiconductor product

Publications (1)

Publication Number Publication Date
CN117309752A true CN117309752A (en) 2023-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311383707.0A Pending CN117309752A (en) 2023-10-24 2023-10-24 Method and device for testing bonding strength of semiconductor product

Country Status (1)

Country Link
CN (1) CN117309752A (en)

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