CN117289773A - Computer CPU radiator - Google Patents
Computer CPU radiator Download PDFInfo
- Publication number
- CN117289773A CN117289773A CN202311340503.9A CN202311340503A CN117289773A CN 117289773 A CN117289773 A CN 117289773A CN 202311340503 A CN202311340503 A CN 202311340503A CN 117289773 A CN117289773 A CN 117289773A
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- Prior art keywords
- heat dissipation
- movable
- heat
- module
- static
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 94
- 230000005855 radiation Effects 0.000 claims abstract description 48
- 230000003068 static effect Effects 0.000 claims abstract description 48
- 239000000428 dust Substances 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 36
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000004323 axial length Effects 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of computer heat dissipation, in particular to a computer CPU radiator, which comprises a heat dissipation fan, a heat dissipation frame, a heat dissipation device and an adjusting device; the invention is provided with a heat radiation device in the heat radiation frame, comprising a movable heat radiation module and a static heat radiation module; when the heat on the CPU is not effectively dissipated, the temperature is increased; when the temperature reaches the critical value of the deformation of the memory spring, the memory spring can deform and stretch to press the adjusting device; the movable heat radiation module and the static heat radiation module are staggered to enlarge the heat radiation area, and then the dust attached to the heat radiation fins is cleaned by sliding each other, so that the heat radiation efficiency of the heat radiation device is further improved.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a computer CPU heat radiator.
Background
Nowadays, computers are gradually popularized to household users, and in order to meet the operation requirement of users on the computers, the performance of some hardware such as a CPU is continuously improved, so that the required current is increased, and under the condition of larger current output, the heating problem is more serious. The traditional heat dissipation mode comprises fan heat dissipation and water cooling heat dissipation.
However, after the CPU is used for a period of time, dust is easy to adhere to the upper surfaces of the radiating fins, so that the later radiating efficiency is seriously affected;
meanwhile, dust of the radiator exists in the cracks, the dust is difficult to clean by an individual, and the radiator or the CPU can be aged and damaged along with the time.
Disclosure of Invention
The technical problems to be solved are as follows:
aiming at the defects of the prior art, the invention provides a computer CPU radiator, which comprises a movable radiating module and a static radiating module by arranging a radiating device in a radiating frame; when the heat on the CPU is not effectively dissipated, the temperature is increased; when the temperature reaches the critical value of the deformation of the memory spring, the memory spring can deform and stretch to press the adjusting device; the movable heat radiation module and the static heat radiation module are dislocated firstly and then slide mutually, so that the heat radiation area is increased, and meanwhile, dust on the heat radiation fins can be cleaned; this solves the technical problems mentioned in the background art.
The technical scheme is as follows:
in order to achieve the above purpose, the invention is realized by the following technical scheme:
a computer CPU heat sink comprising: comprises a cooling fan, a cooling frame, a cooling device and an adjusting device; the heat dissipation device is arranged in the heat dissipation frame; the adjusting device is arranged in the heat dissipation device; the cooling fan is fixedly connected to the end part of the cooling frame; the heat dissipation fan dissipates heat for the heat dissipation frame and the heat dissipation device; when the temperature is too high, the adjusting device controls the heat dissipating device to generate dislocation, so that the heat dissipating area is increased and dust can be removed at the same time.
Preferably, the cooling fan comprises a shell, a motor is arranged in the shell, the motor can output from two sides, one end of the motor is in transmission connection with a fan blade, and the other end of the motor, which is close to the cooling device, is in transmission connection with an outer convex shaft; the shell is provided with a power line; the power cord is used for connecting the power.
Preferably, the heat dissipation frame comprises a fixed seat, and the fixed seat is in fit connection with the heating source when in implementation; the periphery of the fixed seat is provided with radiating pipes, a sleeve is fixedly arranged on one side of the fixed seat, which is close to the radiating device, and a memory spring is arranged in the sleeve; one end of the radiating tube far away from the fixed seat is fixedly connected with a fixed net; the fixed net is fixedly connected with the shell; the sleeve is internally provided with a spline close to one half of the fixed seat, and the other half is a unthreaded hole.
Preferably, the heat dissipation device comprises a movable heat dissipation module and a static heat dissipation module; the static heat radiation module is sleeved outside the movable heat radiation module; the static heat dissipation module is fixedly connected with the fixing seat, the movable heat dissipation module is rotationally connected with the static heat dissipation module, and a first spring is arranged between the movable heat dissipation module and the fixing seat.
Preferably, the movable heat radiation module comprises a heat radiation cylinder, and movable heat radiation fins are fixedly connected to the periphery of the heat radiation cylinder at intervals; a yielding groove is formed on one side of the root of the movable radiating fin; and diversion holes are arranged outside the heat dissipation barrel at intervals of the movable heat dissipation fins.
Preferably, the static heat dissipation module comprises a fixed rod, wherein the fixed rod is provided with a plurality of fixing rods which are respectively arranged on the outer side of the heat dissipation cylinder and positioned in the abdication groove; fixing seats are fixedly connected to the fixing rods at intervals; static cooling fins are fixedly arranged on the outer side of the fixing seat; one end of the fixing rod, which is not provided with the fixing seat, is fixedly connected with the fixing seat.
Preferably, the axial lengths of the movable radiating fin and the static radiating fin are the same as the taper; the movable heat radiation module and the static heat radiation module are staggered by one axial length of the movable heat radiation fin when being sleeved; further, the movable radiating fins and the static radiating fins are alternately and adjacently ordered.
Preferably, a friction hole is formed in one end, close to the cooling fan, of the shaft lever of the adjusting device, a sliding groove is formed in the outer surface of the middle of the adjusting device, the sliding groove is in a wave shape, and an inclined sliding groove is formed in a wave crest position, close to one side of the friction hole, of the curved sliding groove; one end of the adjusting device, which is close to the heat dissipation frame, is inserted into the sleeve to be abutted against the memory spring.
Preferably, the spline is also arranged at the end of the adjusting device, which is spliced with the adjusting device; the friction hole is matched with the outer convex shaft.
Preferably, the inside fixedly connected with restraint slide bar of movable heat dissipation module, restraint slide bar's inner and curve spout and slope spout cooperate.
Advantageous effects
In the scheme, the heat dissipation device is arranged in the heat dissipation frame and comprises a movable heat dissipation module and a static heat dissipation module; when the heat on the CPU is not effectively dissipated, the temperature is increased; when the temperature reaches the critical value of the deformation of the memory spring, the memory spring can deform and stretch to press the adjusting device; the movable heat radiation module and the static heat radiation module are staggered to enlarge the heat radiation area, and then the dust attached to the heat radiation fins is cleaned by sliding each other, so that the heat radiation efficiency of the heat radiation device is further improved.
Drawings
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the whole structure of the present invention;
FIG. 3 is a schematic diagram of a heat dissipating fan according to the present invention;
FIG. 4 is a schematic view of a heat sink rack according to the present invention;
FIG. 5 is a schematic diagram of a heat dissipating device according to the present invention;
FIG. 6 is a schematic diagram of a movable heat sink module according to the present invention;
FIG. 7 is a schematic diagram of a static heat dissipating module according to the present invention;
FIG. 8 is a schematic diagram of a static heat dissipating module according to the present invention;
FIG. 9 is a schematic view of the structure of the adjusting device of the present invention;
FIG. 10 is a schematic diagram of the inside of a heat dissipating device according to the present invention;
FIG. 11 is a schematic diagram showing the dislocation of the movable heat sink module and the static heat sink module according to the present invention.
Legend description: 1. a heat radiation fan; 11. a housing; 12. a motor; 121. a fan blade; 122. an outer convex shaft; 13. a power line; 2. a heat dissipation frame; 21. a fixing seat; 22. a heat radiating pipe; 23. a sleeve; 24. a memory spring; 25. a fixed net; 3. a heat sink; 31. a movable heat dissipation module; 311. a heat dissipation cylinder; 312. a movable heat sink; 313. a relief groove; 314. a deflector aperture; 32. a static heat dissipation module; 321. a fixed rod; 322. a fixing seat; 323. static cooling fins; 4. an adjusting device; 41. a friction hole; 42. a curved chute; 43. tilting the chute; 5. the slide bar is restrained.
Detailed Description
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention may be embodied in various forms, and thus the present invention is not limited to the embodiments described below, and in addition, components not connected to the present invention will be omitted from the drawings for the sake of more clarity of description of the present invention;
the technical scheme in the embodiment of the application aims to solve the problems of the background technology, and the overall thought is as follows:
as shown in fig. 1 and 2, a specific structure of a computer CPU radiator includes a heat radiation fan 1, a heat radiation frame 2, a heat radiation device 3, and an adjusting device 4; the heat dissipation device 3 is arranged inside the heat dissipation frame 2; the adjusting device 4 is arranged inside the heat dissipation device 3; the cooling fan 1 is fixedly connected to the end part of the cooling frame 2; the heat radiation fan 1 radiates heat for the heat radiation frame 2 and the heat radiation device 3; when the temperature is too high, the adjusting device 4 controls the heat dissipating device 3 to be misplaced, so that the heat dissipating area is increased and dust can be removed at the same time;
as shown in fig. 3, the heat dissipation fan 1 includes a housing 11, a motor 12 is installed inside the housing 11, the motor 12 can output from two sides, one end is connected with a fan blade 121 in a transmission manner, and the other end close to the heat dissipation device 3 is connected with an outer protruding shaft 122 in a transmission manner; the shell 11 is provided with a power line 13; the power line 13 is used for connecting a power supply;
as shown in fig. 4, the heat dissipation frame 2 includes a fixing base 21, and the fixing base 21 is attached to the heat source when implemented, for example, may be attached to a CPU of a computer; the periphery of the fixed seat 21 is provided with a radiating pipe 22, one side of the fixed seat 21 close to the radiating device 3 is fixedly provided with a sleeve 23, and the inside of the sleeve 23 is provided with a memory spring 24; one end of the radiating tube 22 far away from the fixed seat 21 is fixedly connected with a fixed net 25; the fixed net 25 is fixedly connected with the shell 11;
as shown in fig. 5, the heat dissipation device 3 includes a movable heat dissipation module 31 and a static heat dissipation module 32; the static heat dissipation module 32 is sleeved outside the dynamic heat dissipation module 31; the static heat radiation module 32 is fixedly connected with the fixed seat 21, the movable heat radiation module 31 is rotationally connected with the static heat radiation module 32, and a first spring is arranged between the movable heat radiation module 31 and the fixed seat 21;
as shown in fig. 6, the movable heat dissipation module 31 includes a heat dissipation cylinder 311, and movable heat dissipation fins 312 are fixedly connected around the heat dissipation cylinder 311 at intervals; a yielding groove 313 is formed on one side of the root of the movable radiating fin 312; the outside of the heat dissipation cylinder 311 is provided with a diversion hole 314 at intervals of the movable heat dissipation fins 312 (or one side of the root of the movable heat dissipation fins 312 close to the heat dissipation fan 1);
as shown in fig. 7 and 8, the static heat dissipation module 32 includes a fixing rod 321, and the fixing rod 321 is provided with a plurality of fixing holes respectively arranged outside the heat dissipation cylinder 311 and located inside the relief groove 313; fixed bases 322 are fixedly connected to the fixed rods 321 at intervals; static cooling fins 323 are fixedly arranged on the outer side of the fixed seat 322;
one end of the fixing rod 321, on which the fixing seat 322 is not mounted, is fixedly connected with the fixing seat 21; therefore, an axial length abdication of the movable radiating fin 312 can be reserved between the fixed seat 21 and the fixed seat 322, so that falling dust can fall off conveniently;
the axial lengths of the movable radiating fins 312 and the static radiating fins 323 are the same as the taper; the movable heat dissipation module 31 and the static heat dissipation module 32 are in a sleeved mode, and the axial length of the movable heat dissipation fin 312 (the static heat dissipation fin 323) is misplaced; further, the movable cooling fins 312 and the static cooling fins 323 are alternately arranged adjacently; the space between each annular row of movable fins 312 (or static fins 323) accommodates one movable fin 312 to slide therein; thus, when the movable radiating fins 312 slide, dust adsorbed on the movable radiating fins 312 and the static radiating fins 323 can be removed, and the radiating area is increased;
as shown in fig. 9, a friction hole 41 is formed at one end of the shaft lever of the adjusting device 4 near the cooling fan 1, a sliding groove 42 is formed on the outer surface of the middle part of the adjusting device 4, the sliding groove 42 is in a waveform shape, and an inclined sliding groove 43 is formed at a crest (farthest point) of one side of the curved sliding groove 42 near the friction hole 41; one end of the adjusting device 4, which is close to the heat dissipation frame 2, is inserted into the sleeve 23 to be abutted against the memory spring 24; when the temperature of the CPU rises, the sleeve 23 deforms and stretches to press the adjusting device 4, and the adjusting device 4 slides towards the outer convex shaft 122 to be in friction transmission with the outer convex shaft 122;
as shown in fig. 4, a half of the sleeve 23, which is close to the fixing seat 21, is provided with a spline, and the other half is a light hole; the adjusting device 4 is also provided with a spline at the end which is spliced with the adjusting device; when the shaft lever of the adjusting device 4 is provided with a spline which is matched with the spline on the fixed seat 21, the adjusting device 4 can only slide and can not rotate; the shaft lever of the adjusting device 4 can rotate when being provided with a spline to be matched with the unthreaded hole on the fixed seat 21;
the friction hole 41 is matched with the outer convex shaft 122, and when the friction hole and the outer convex shaft are in contact, friction transmission can be carried out, so that the adjusting device 4 is driven to rotate;
as shown in fig. 10, the inside of the movable heat dissipation module 31 is fixedly connected with a constraint slide bar 5, and the inner end of the constraint slide bar 5 is matched with a curve slide groove 42 and an inclined slide groove 43;
working principle:
firstly, the fixing seat 21 is arranged on the radiating surface of the CPU; when the invention is electrified to start heat dissipation work, the motor 12 controls the fan blades 121 and the outer convex shaft 122 to rotate, and the heat absorbed by the heat dissipation frame 2 and the heat dissipation device 3 is quickly dissipated by increasing the flow speed of air flow; along with the lengthening of the service cycle, a large amount of dust can be adsorbed on the heat dissipating device 3, and if the dust is not cleaned in time, the heat dissipating efficiency is affected; during the period, the heat on the CPU cannot be effectively dissipated, and the temperature can be increased; when the temperature reaches the critical value of deformation of the memory spring 24, the memory spring 24 will deform and stretch to press the adjusting device 4, so that the spline on the friction adjusting device 4 slides along the spline inside the sleeve 23, and the adjusting device 4 slides towards the outer protruding shaft 122 to be in friction transmission with the outer protruding shaft; at the beginning, as the inner end of the constraint slide bar 5 is arranged at the tail end of the inclined slide groove 43, when the adjusting device 4 generates axial displacement under the action of the memory spring 24, the constraint slide bar 5 can rotate for a certain angle under the constraint of the inclined slide groove 43; at this time, the movable heat dissipation module 31 rotates along with the constraint slide bar 5; because the static heat dissipation module 32 is fixedly connected with the fixing seat 21, the movable heat dissipation module 31 rotates and drives the movable heat dissipation fins 312 and the flow guide holes 314 to rotate; thus, the movable cooling fin 312 is dislocated with the static cooling fin 323 on the static cooling module 32 (as shown in fig. 11); the deflector hole 314 is also overlapped with the fixed rod 321 to a greater extent; thus, through the dynamic change of the heat dissipation device 3, the heat dissipation area is further increased, and the heat dissipation is faster;
according to the above manner, if the heat of the CPU is effectively dissipated, the memory spring 24 is retracted, and the original heat dissipation manner is returned;
if the heat of the CPU still cannot be timely eliminated; the memory spring 24 continues to squeeze the adjusting device 4 until the friction hole 41 slides towards the outer convex shaft 122 to generate rotation transmission with the friction to be generated, and at the moment, the spline on the adjusting device 4 just slides out along the spline arranged inside the sleeve 23; at this time, the inner end of the constraint slide bar 5 just slides out of the inclined chute 43 completely, and the friction hole 41 is driven to rotate along with the outer convex shaft 122, so that the inner end of the constraint slide bar 5 can be constrained by the curved chute 42 from the crest to the trough; at the same time, the movable fins 312 are rotated by an interval angle to slide between the stationary fins 323; at the beginning, the movable radiating fin 312 is firstly slid to the radiating frame 2, and the movable radiating fin 312 is attached to the surface of the static radiating fin 323, so that dust attached to the surfaces of the movable radiating fin 312 and the static radiating fin 323 can be scraped while sliding; the falling dust falls from the overlapping part of the fixing rod 321 and the flow guide hole 314, and is sucked to the outside and discharged under the action of the air flow generated by the cooling fan 1;
when the surface dust of the movable radiating fin 312 and the static radiating fin 323 are cleaned, the heat of the CPU is rapidly dissipated; so that the memory spring 24 will retract; the friction hole 41 moves towards the heat dissipation frame 2 under the action of the tension of the memory spring 24; the movable heat radiation module 31 generates axial elastic force to one end of the heat radiation fan 1 under the action of the first spring; since the constraint slide bar 5 can only slide at this time, the inner end of the constraint slide bar 5 can enter the wave crest close to one side of the cooling fan 1 again under the constraint of the curve chute 42 and finally enter the inner inlet of the inclined chute 43, and the spline on the adjusting device 4 is just matched with the inner spline of the sleeve 23; finally, the movable cooling fin 312 rotates under the constraint of the inclined chute 43, and finally, the movable cooling fin 323 is reset to be in a row with the static cooling fin; when the dust needs to be cleaned again automatically, the steps are repeated.
Finally, it should be noted that: it is apparent that the above examples are only illustrative of the present invention and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (10)
1. A computer CPU heat sink comprising: comprises a cooling fan (1), a cooling frame (2), a cooling device (3) and an adjusting device (4); the heat dissipation device (3) is arranged in the heat dissipation frame (2); the adjusting device (4) is arranged inside the heat radiating device (3); the cooling fan (1) is fixedly connected to the end part of the cooling frame (2); the heat dissipation fan (1) dissipates heat for the heat dissipation frame (2) and the heat dissipation device (3); when the temperature is too high, the adjusting device (4) controls the heat radiating device (3) to be misplaced, the heat radiating area is increased, and meanwhile dust can be removed.
2. A computer CPU heat sink as claimed in claim 1 wherein: the cooling fan (1) comprises a shell (11), a motor (12) is arranged in the shell (11), the motor (12) can output on two sides, one end of the motor is connected with a fan blade (121) in a transmission manner, and the other end of the motor, which is close to the cooling device (3), is connected with an outer protruding shaft (122) in a transmission manner; the shell (11) is provided with a power line (13); the power line (13) is used for connecting a power supply.
3. A computer CPU heat sink as claimed in claim 2, wherein: the heat dissipation frame (2) comprises a fixed seat (21), and the fixed seat (21) is connected with a heating source in a fitting way when in use; the periphery of the fixed seat (21) is provided with a radiating pipe (22), one side of the fixed seat (21) close to the radiating device (3) is fixedly provided with a sleeve (23), and the inside of the sleeve (23) is provided with a memory spring (24); one end of the radiating pipe (22) far away from the fixed seat (21) is fixedly connected with a fixed net (25); the fixed net (25) is fixedly connected with the shell (11); the sleeve (23) is internally provided with a spline near one half of the fixed seat (21), and the other half is a unthreaded hole.
4. A computer CPU heat sink as claimed in claim 3 wherein: the heat dissipation device (3) comprises a movable heat dissipation module (31) and a static heat dissipation module (32); the static heat radiation module (32) is sleeved outside the movable heat radiation module (31); the static heat dissipation module (32) is fixedly connected with the fixed seat (21), the movable heat dissipation module (31) is rotationally connected with the static heat dissipation module (32), and a first spring is arranged between the movable heat dissipation module (31) and the fixed seat (21).
5. A computer CPU heat sink as claimed in claim 4 wherein: the movable heat radiation module (31) comprises a heat radiation cylinder (311), and movable heat radiation fins (312) are fixedly connected around the heat radiation cylinder (311) at intervals; a yielding groove (313) is formed on one side of the root of the movable radiating fin (312); outside the heat dissipation cylinder (311), a diversion hole (314) is arranged at intervals of the movable heat dissipation fins (312).
6. A computer CPU heat sink as claimed in claim 4 wherein: the static heat dissipation module (32) comprises a fixed rod (321), and the fixed rod (321) is provided with a plurality of grooves which are respectively arranged on the outer side of the heat dissipation cylinder (311) and are positioned in the abdication groove (313); fixed seats (322) are fixedly connected to the fixed rods (321) at intervals; a static cooling fin (323) is fixedly arranged on the outer side of the fixed seat (322); one end of the fixing rod (321) without the fixing seat (322) is fixedly connected with the fixing seat (21).
7. A computer CPU heat sink as claimed in claim 6 wherein: the axial lengths of the movable radiating fins (312) and the static radiating fins (323) are the same as the taper; the axial length of the movable radiating fin (312) is misplaced when the movable radiating module (31) and the static radiating module (32) are sleeved; further, the movable cooling fins (312) and the static cooling fins (323) are alternately arranged adjacently.
8. A computer CPU heat sink as claimed in claim 2, wherein: a friction hole (41) is formed in one end, close to the cooling fan (1), of the shaft lever of the adjusting device (4), a sliding groove (42) is formed in the outer surface of the middle of the adjusting device (4), the sliding groove (42) is in a wave shape, and an inclined sliding groove (43) is formed in a wave crest (farthest point) of one side, close to the friction hole (41), of the curved sliding groove (42); one end of the adjusting device (4) close to the heat dissipation frame (2) is inserted into the sleeve (23) to be abutted against the memory spring (24).
9. A computer CPU heat sink as claimed in claim 8 wherein: the adjusting device (4) is also provided with a spline at one end which is spliced with the adjusting device; the friction hole (41) is matched with the outer convex shaft (122).
10. A computer CPU heat sink as claimed in claim 9 wherein: the inside of movable heat dissipation module (31) fixedly connected with retrains slide bar (5), retrains the inner and curve spout (42) and slope spout (43) of slide bar (5) and cooperatees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311340503.9A CN117289773B (en) | 2023-10-17 | 2023-10-17 | Computer CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311340503.9A CN117289773B (en) | 2023-10-17 | 2023-10-17 | Computer CPU radiator |
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| CN117289773A true CN117289773A (en) | 2023-12-26 |
| CN117289773B CN117289773B (en) | 2024-03-29 |
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| CN202311340503.9A Active CN117289773B (en) | 2023-10-17 | 2023-10-17 | Computer CPU radiator |
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| 高光亚;马永昱;: "基于记忆合金的CPU散热应用浅谈", 电子元器件与信息技术, no. 09, 20 September 2018 (2018-09-20), pages 103 - 106 * |
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