CN117287974A - Ceramic tile firing furnace and temperature control system and method thereof - Google Patents
Ceramic tile firing furnace and temperature control system and method thereof Download PDFInfo
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- CN117287974A CN117287974A CN202311567589.9A CN202311567589A CN117287974A CN 117287974 A CN117287974 A CN 117287974A CN 202311567589 A CN202311567589 A CN 202311567589A CN 117287974 A CN117287974 A CN 117287974A
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- placing box
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- 238000010304 firing Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 title abstract description 30
- 238000002485 combustion reaction Methods 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 claims abstract description 18
- 239000000446 fuel Substances 0.000 claims abstract description 8
- 239000003990 capacitor Substances 0.000 claims description 133
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 88
- 229910052697 platinum Inorganic materials 0.000 claims description 44
- 239000013078 crystal Substances 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 8
- 230000008859 change Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 239000003381 stabilizer Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0041—Chamber type furnaces specially adapted for burning bricks or pottery
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D19/00—Arrangements of controlling devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D19/00—Arrangements of controlling devices
- F27D2019/0003—Monitoring the temperature or a characteristic of the charge and using it as a controlling value
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Furnace Details (AREA)
Abstract
The invention provides a ceramic tile firing furnace, a temperature control system and a temperature control method thereof, and relates to the technical field of ceramic tile firing, wherein the ceramic tile firing furnace comprises: the firing chamber is rotationally connected with a rotating shaft; the motor is connected with the rotating shaft; the first installation part and the second installation part are vertically arranged on the rotating shaft and are symmetrically arranged; the first placing box and the second placing box are respectively arranged on the first installation part and the second installation part; the temperature sensors are arranged in the first placing box and the second placing box; the combustion chamber is communicated with the firing chamber and is positioned right below the firing chamber; the igniter is arranged at the bottom of the combustion chamber and is connected with the fuel pipe; the high-temperature resistant fan is communicated with the upper part of the firing chamber; pipe connected to the air outlet end of the high temperature resistant blower and the combustion chamber; the Laval nozzle is communicated with a type pipe through a solenoid valve. The invention can effectively control the temperature change in the ceramic tile firing process, so that the ceramic tile is heated uniformly, and the surface of the ceramic tile is effectively prevented from being uneven in the firing process.
Description
Technical Field
The invention relates to the technical field of ceramic tile firing, in particular to a ceramic tile firing furnace and a temperature control system and method thereof.
Background
Ceramic tile is prepared from refractory metal oxide and semi-metal oxide through grinding, mixing, pressing, glazing and sintering, the raw materials of the building or decorative material with acid and alkali resistance, such as porcelain or stone, are mostly mixed by clay, quartz sand and the like. The ceramic tile needs to be burned in the firing process, the firing furnace acts on the ceramic tile with the heat that the fuel was burnt, makes the inside moisture of ceramic tile totally evaporate, and current firing furnace adopts the lower part burning generally, then the mode that upper portion was fired burns, causes the ceramic tile to be heated unevenly easily in the in-process of firing to the ceramic tile can not overturn from top to bottom, the uneven phenomenon of ceramic tile upper and lower firing degree can appear in the in-process of firing, thereby influences ceramic tile quality.
During the firing of the ceramic tile, the ceramic tile is heated to a high temperature from normal temperature and then cooled to normal temperature from high temperature. With the change of temperature, a series of physical and chemical changes are generated on the ceramic tile blank, so that the blank expands and contracts in volume to different degrees. The expansion and contraction conditions of the ceramic tile in different firing stages are different, and in the heating stage, the green body is discharged due to the crystallization water, organic matters are oxidized, carbonate is decomposed and the like, and the volume is contracted; in the firing stage, the blank body expands in volume due to high temperature; in the cooling stage, the blank body is subjected to quartz crystal form transformation, and the volume of the blank body is contracted.
In the sintering process, the sintering temperature is improper, the temperature rising rate is unreasonable, when the temperature difference between the upper surface and the lower surface of the green body is improper, the expansion and the shrinkage of the upper surface and the lower surface of the green body are possibly different, the condition of protruding upwards or sinking downwards appears, and even wave deformation can appear in serious cases. These deformations not only greatly reduce the yield and quality of the tile, but also result in waste of resources.
Disclosure of Invention
The invention provides a ceramic tile firing furnace, a temperature control system and a temperature control method thereof, which can effectively control the temperature change in the ceramic tile firing process, so that the ceramic tile is heated uniformly, and the surface of the ceramic tile is prevented from being uneven in the firing process.
To achieve the above object, in a first aspect, the present invention provides a tile firing furnace comprising:
the firing chamber is internally and rotatably connected with a rotating shaft which is horizontally arranged;
the motor is in transmission connection with the rotating shaft;
the first installation part is vertically arranged on the rotating shaft;
the second installation part is vertically arranged on the rotating shaft and is symmetrical with the first installation part;
the first placing box is arranged on the first installation part;
the second placing box is arranged on the second installation part;
the temperature sensors are arranged in the first placing box and the second placing box and are respectively used for detecting the temperatures of the upper layer and the lower layer of the first placing box and the upper layer and the lower layer of the second placing box;
a combustion chamber communicating with the firing chamber and located directly below the firing chamber;
the igniter is arranged at the bottom of the combustion chamber and is connected with a fuel pipe;
the air inlet end of the high-temperature resistant fan is communicated with the upper part of the firing chamber;
pipe with lower opening connected to the air outlet end of the high temperature resistant blower and the combustion chamber via three-way pipe;
a plurality of Laval nozzles are arranged along the inner wall of the firing chamber and are communicated with the type pipe through electromagnetic valves.
In some embodiments, the upper wall and the lower wall of the first placement box are hollow structures, the temperature sensors are arranged at the left, middle and right positions of the upper wall of the first placement box, and the temperature sensors are arranged at the left, middle and right positions of the lower wall of the first placement box; the upper wall and the lower wall of the second placement box are hollow structures, the temperature sensors are arranged at the left, middle and right positions of the upper wall of the second placement box, and the temperature sensors are arranged at the left, middle and right positions of the lower wall of the second placement box.
In some embodiments, the first placement boxes and the second placement boxes are each 4, the 4 first placement boxes are rectangular in distribution along the length direction of the first mounting portion, and the 4 second placement boxes are rectangular in distribution along the length direction of the second mounting portion.
In some embodiments, at least 2 of the laval nozzles face from top to bottom to the 2 first placing boxes or the second placing boxes located above, respectively, at least 2 of the laval nozzles face to left and right spaces between the 2 first placing boxes located above and the 2 first placing boxes located below, respectively, at least 2 of the laval nozzles face to left and right spaces between the 2 first placing boxes located close to the rotating shaft, respectively, at least 2 of the laval nozzles face to left and right spaces between the 2 second placing boxes located above and the 2 second placing boxes located below, respectively, and at least 2 of the laval nozzles face to left and right spaces between the 2 second placing boxes located close to the rotating shaft, respectively.
In some embodiments, the number of the high-temperature resistant fans is 2, one opening at the lower part of the type pipe is respectively communicated with the air outlet end of one high-temperature resistant fan and the combustion chamber through a three-way pipe, and the other opening at the lower part of the type pipe is respectively communicated with the air outlet end of the other high-temperature resistant fan and the combustion chamber through a three-way pipe.
In a second aspect, the present invention provides a temperature control system for a tile firing furnace, comprising:
a tile firing furnace according to any one of the preceding claims;
the control circuit is connected with the temperature sensor and used for controlling the electromagnetic valve and the motor to work according to the detection temperature of the temperature sensor;
the control circuit comprises a processor, a first relay and a second relay, wherein the coil of the first relay and the coil of the second relay are connected with the processor, the processor is connected with the temperature sensor, a normally open contact of the first relay is connected in series with a working circuit of the electromagnetic valve, and a normally open contact of the second relay is connected in series with the working circuit of the motor.
In some embodiments, the temperature sensor is configured with a measurement circuit comprising a master circuit, a first platinum resistance circuit, a second platinum resistance circuit, a first thermocouple circuit, a second thermocouple circuit, and a power supply circuit, the master circuit, the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit, and the second thermocouple circuit each being connected to the power supply circuit, the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit, and the second thermocouple circuit each being connected to the master circuit; wherein, one temperature sensor comprises a first platinum resistor, a second platinum resistor, a first thermocouple and a second thermocouple.
In some embodiments, the master circuit includes a master chip U1A, a master chip U1B, a debug interface P1, a resistor R7, a diode D2, a capacitor C4, a capacitor C5, a capacitor C6, an interface chip U5, a capacitor C21, a resistor R18, a resistor R19, a resistor R30, a capacitor C13, a capacitor C14, a crystal oscillator Y2, a resistor R12, a capacitor C8, a capacitor C7, a resistor R10, a resistor R3, and a crystal oscillator Y1;
the pin 28 of the main control chip U1A is grounded through the resistor R3, the pin 5 of the main control chip U1A is connected with one end of the resistor R10, one end of the crystal oscillator Y1 and the grounded capacitor C8, the pin 6 of the main control chip U1A is connected with the other end of the resistor R10, the other end of the crystal oscillator Y1 and the grounded capacitor C7, the pin 66 of the main control chip U1A is grounded through the resistor R12, the pin 3 of the main control chip U1A is connected with one end of the crystal oscillator Y2 and the grounded capacitor C13, and the pin 4 of the main control chip U1A is connected with the other end of the crystal oscillator Y2 and the grounded capacitor C14;
the pin 13 of the main control chip U1B is connected with the capacitor C5 and the capacitor C6 which are grounded in a one-to-one correspondence manner, the pin 7 of the interface chip U5 is connected with one end of the resistor R30 and one end of the resistor R18, one end of the resistor R7 is connected with the other end of the resistor R30 and one end of the resistor R19, the other end of the resistor R7 is connected with the anode of the diode D2, the pin 7 of the main control chip U1B and the capacitor C4 which are grounded, the pin 2, the pin 3 and the pin 4 of the debugging interface P1 are respectively connected with the pin 49, the pin 46 and the pin 7 of the main control chip U1A in a one-to-one correspondence manner, the pin 7 of the interface chip U5 is connected with one end of the resistor R30 and one end of the resistor R18, the pin 6 of the other end of the resistor R18 and the other end of the resistor R19 are respectively connected with the power supply circuit, the pin 1 and the pin 4 of the interface chip U5 are respectively connected with the pin 43 of the main control chip U1A and the pin 42, and the pin 3 is connected with the pin 3 of the interface chip U2 and the end of the interface chip U3 is connected with the voltage end of the interface chip 3.
In some embodiments, the first platinum resistance circuit includes a digitizer U2, a capacitor C1, a capacitor C2, a capacitor C30, a capacitor C41, a resistor R5, and a platinum resistor P2; the pin 1, the pin 14, the pin 15, the pin 16 and the pin 17 of the digitizer U2 are respectively connected with the pin 14, the pin 23, the pin 21, the pin 24 and the pin 22 of the main control chip U1A in a one-to-one correspondence manner, the pin 2 of the digitizer U2 is connected with the capacitor C1 which is grounded and then externally connected with the voltage terminal VCC3.3, the pin 3 of the digitizer U2 is connected with the capacitor C2 which is grounded and then externally connected with the voltage terminal VCC3.3, one end of the resistor R5 is connected with the pin 4 and the pin 5 of the digitizer U2, the other end of the resistor R5 is connected with the pin 6 and the pin 7 of the digitizer U2, the pin 3 of the platinum resistor P2 is connected with the pin 8 and the pin 9 of the digitizer U2, the pin 2 of the platinum resistor P2 is connected with the pin 10 of the digitizer U2, one end of the capacitor C30 and one end of the capacitor C41, and the other end of the capacitor C30 and the pin 11 of the digitizer U2.
In a third aspect, the invention provides a temperature control method of a tile firing furnace, which is realized through the temperature control system of the tile firing furnace;
the temperature control method comprises the following steps:
detecting an upper temperature and a lower temperature of the first placing box and an upper temperature and a lower temperature of the second placing box by the temperature sensor;
judging whether the upper layer temperature and the lower layer temperature of the first placing box are consistent or not, and judging whether the upper layer temperature and the lower layer temperature of the second placing box are consistent or not;
if the upper layer temperature and the lower layer temperature of the first placing box are inconsistent, the processor controls the electromagnetic valve and/or the motor to work so as to regulate and control the upper layer temperature and the lower layer temperature of the first placing box to be consistent;
if the upper layer temperature and the lower layer temperature of the second placing box are inconsistent, the processor controls the electromagnetic valve and/or the motor to work so as to regulate and control the upper layer temperature and the lower layer temperature of the first placing box to be consistent.
The embodiment of the specification can at least realize the following beneficial effects:
according to the invention, by arranging the ceramic tile firing furnace and the temperature control system thereof, the temperature change in the ceramic tile firing process can be effectively controlled, so that the ceramic tile is uniformly heated, and the surface of the ceramic tile is effectively prevented from being uneven in the firing process.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view showing a structure of a tile firing furnace according to some embodiments of the present invention.
Fig. 2 is a schematic distribution diagram of a laval nozzle and a first placement tank involved in some embodiments of the present invention.
Fig. 3 is a schematic diagram of the distribution of laval nozzles and second placement boxes involved in some embodiments of the present invention.
Fig. 4 is a schematic circuit diagram of a master control chip U1A according to some embodiments of the present invention.
Fig. 5 is a schematic circuit diagram of a master control chip U1B according to some embodiments of the present invention.
Fig. 6 is a circuit schematic diagram of the debug interface P1 according to some embodiments of the present invention.
Fig. 7 is a circuit schematic diagram of an interface chip U5 according to some embodiments of the present invention.
Fig. 8 is a circuit schematic diagram of a digitizer U2 according to some embodiments of the present invention.
Fig. 9 is a circuit schematic diagram of a digitizer U7 according to some embodiments of the present invention.
Fig. 10 is a circuit schematic diagram of a digitizer U8 according to some embodiments of the present invention.
Fig. 11 is a circuit schematic of a digitizer U9 according to some embodiments of the present invention.
Fig. 12 is a circuit diagram of a voltage regulator U6 according to some embodiments of the invention.
Fig. 13 is a schematic circuit diagram of a voltage regulator VR1 according to some embodiments of the present invention.
Reference numerals:
1. a firing chamber; 11. a rotating shaft; 12. a motor;
2. a first mounting portion; 21. a first placement box;
3. a second mounting portion; 31. a second placement box;
4. a temperature sensor;
5. a combustion chamber; 51. an igniter; 52. a fuel pipe;
6. high temperature resistant fan; 7. type tube; 8. a Laval nozzle; 81. a solenoid valve.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships conventionally placed in use of the product of the present invention, or orientations or positional relationships conventionally understood by those skilled in the art, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Furthermore, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, in a first aspect, the present embodiment provides a tile firing furnace, including:
a rotating shaft 11 which is horizontally arranged is rotatably connected in the firing chamber 1;
the motor 12 is in transmission connection with the rotating shaft 11;
a first mounting part 2 vertically arranged on the rotating shaft 11;
the second installation part 3 is vertically arranged on the rotating shaft 11 and is symmetrical with the first installation part 2;
a first placing box 21 provided on the first mounting portion 2 for placing a tile blank to be fired;
a second placing box 31 provided on the second mounting portion 3 for placing a tile blank to be fired;
a plurality of temperature sensors 4 provided in the first placing box 21 and the second placing box 31 for detecting temperatures of upper and lower layers of the first placing box 21 and upper and lower layers of the second placing box 31, respectively;
a combustion chamber 5 which communicates with the firing chamber 1 and is located immediately below the firing chamber 1;
an igniter 51 provided at the bottom of the combustion chamber 5 and connected to a fuel pipe 52;
the air inlet end of the high-temperature resistant fan 6 is communicated with the upper part of the firing chamber 1;
pipe 7, whose lower opening is respectively connected with the air outlet end of the high temperature resistant fan 6 and the combustion chamber 5 through a three-way pipe;
a plurality of laval nozzles 8 are provided along the inner wall of the firing chamber 1 and communicate with the type tube 7 by means of solenoid valves 81.
It should be understood that the motor 12, the igniter 51, the high temperature resistant fan 6, the electromagnetic valve 81 and the laval nozzle 8 are all existing devices, the temperature sensor 4 may adopt an existing scheme or a scheme of the following embodiment, and the types of the high temperature resistant fan 6 and the electromagnetic valve 81 may be set according to the actual working temperature environment, for example: in general, the high temperature resistant blower 6 can normally operate in a temperature range of 200 ℃ to 800 ℃. The high temperature resistant fans 6 in the market are classified into different grades, and the temperatures which can be born by the high temperature resistant fans 6 in different grades are different. The bearing temperature of the first-stage high-temperature resistant fan 6 is 80-300 ℃, the bearing temperature of the second-stage high-temperature resistant fan 6 is 300-450 ℃, the bearing temperature of the third-stage high-temperature resistant fan 6 is 450-600 ℃, and the bearing temperature of the fourth-stage high-temperature resistant fan 6 is 600-1000 ℃. That is, the highest working temperature of the high temperature resistant fan 6 is about 1000 ℃.
In operation, fuel enters through the fuel pipe 52 and is ignited and combusted by the igniter 51 to generate high temperature, so that the temperature in the firing chamber 1 gradually decreases from bottom to top, namely the bottom temperature is the highest, and the top temperature is the lowest; therefore, the upper air in the firing chamber 1 can be pumped to the lower opening of the type pipe 7 through the high-temperature resistant fan 6, the type pipe 7 is structurally characterized in that the high-temperature resistant fan 6 blows the lower air in the type pipe 7 vertically upwards to form high-speed air flow, and under the drive of the high-speed air flow, the high-temperature air in the combustion chamber 5 can enter the type pipe 7 from the three-way pipe to be mixed with the upper air in the firing chamber 1 pumped by the high-temperature resistant fan 6, and then the mixture can be sprayed out through the Laval nozzle 8 for opening the electromagnetic valve 81. This arrangement can accelerate the flow of high temperature air without keeping the upper temperature in the firing chamber 1 at a low level all the time, so that the lower high temperature air in the firing chamber 1 flows upward more quickly, facilitating the firing of the tile.
Subsequently, the upper and lower temperatures of the first placement tank 21 and the upper and lower temperatures of the second placement tank 31 are detected by the temperature sensor 4; it is determined whether the upper temperature and the lower temperature of the first placing box 21 are identical, and whether the upper temperature and the lower temperature of the second placing box 31 are identical. If the upper temperature and the lower temperature of the first placement tank 21 are not uniform, when the lower temperature is high, the laval nozzle 8 near the upper portion of the first placement tank 21 may be opened by the solenoid valve 81, and the high-temperature air is ejected from the laval nozzle 8 to heat the upper portion of the first placement tank 21 so that the upper temperature and the lower temperature of the first placement tank 21 tend to be uniform. Similarly, the rest of the cases are so far as they are not repeated here.
The main function of the motor 12 is to drive the rotation shaft 11 to rotate so that the tile blanks in the first placing box 21 or the second placing box 31 can be circularly fired in the lower higher temperature environment and the upper lower temperature environment in the firing chamber 1, so that the tile blanks can obtain more uniform firing temperature.
In some embodiments, the upper wall and the lower wall of the first placement box 21 are hollow structures, the temperature sensors 4 are arranged at the left, middle and right positions of the upper wall of the first placement box 21, and the temperature sensors 4 are arranged at the left, middle and right positions of the lower wall of the first placement box 21; the upper wall and the lower wall of the second placement box 31 are hollow structures, the left, middle and right positions of the upper wall of the second placement box 31 are provided with temperature sensors 4, and the left, middle and right positions of the lower wall of the second placement box 31 are provided with temperature sensors 4.
In some embodiments, the first placement boxes 21 and the second placement boxes 31 each have 4, the 4 first placement boxes 21 are rectangular in distribution along the length direction of the first mounting portion 2, and the 4 second placement boxes 31 are rectangular in distribution along the length direction of the second mounting portion 3.
In some embodiments, at least 2 laval nozzles 8 face from top to bottom against the 2 first placing boxes 21 or the second placing boxes 31 located above, respectively, at least 2 laval nozzles 8 face the left side space and the right side space between the 2 first placing boxes 21 located above and the 2 first placing boxes 21 located below, respectively, at least 2 laval nozzles 8 face the left side space and the right side space between the 2 first placing boxes 21 located near the rotating shaft 11 and the rotating shaft 11, at least 2 laval nozzles 8 face the left side space and the right side space between the 2 second placing boxes 31 located above and the 2 second placing boxes 31 located below, respectively, and at least 2 laval nozzles 8 face the left side space and the right side space between the 2 second placing boxes 31 located near the rotating shaft 11 and the rotating shaft 11, respectively.
In some embodiments, the number of the high temperature resistant fans 6 is 2, one opening at the lower part of the type pipe 7 is respectively communicated with the air outlet end of one high temperature resistant fan 6 and the combustion chamber 5 through a three-way pipe, and the other opening at the lower part of the type pipe 7 is respectively communicated with the air outlet end of the other high temperature resistant fan 6 and the combustion chamber 5 through a three-way pipe.
In a second aspect, the present embodiment provides a temperature control system of a tile firing furnace, including:
a tile firing furnace according to any one of the above;
a control circuit connected with the temperature sensor 4 for controlling the operation of the electromagnetic valve 81 and the motor 12 according to the detected temperature of the temperature sensor 4;
the control circuit comprises a processor, a first relay and a second relay, wherein the coil of the first relay and the coil of the second relay are connected with the processor, the processor is connected with the temperature sensor 4, the normally open contact of the first relay is connected in series on the working circuit of the electromagnetic valve 81, and the normally open contact of the second relay is connected in series on the working circuit of the motor 12. The normally open contacts of one first relay correspond to the solenoid valves 81 of a set of plural laval nozzles 8 arranged laterally, as shown in fig. 2 and 3, the set of plural laval nozzles 8 arranged laterally being plural laval nozzles 8 facing the upper portion of the same first placing box 21 (or second placing box 31) or plural laval nozzles 8 facing the space below or above the same first placing box 21 (or second placing box 31). It is also possible that a normally open contact of a first relay is controlled in one-to-one correspondence with the solenoid valve 81 of a laval nozzle 8.
In some embodiments, the temperature sensor 4 is configured with a measurement circuit including a main control circuit, a first platinum resistance circuit, a second platinum resistance circuit, a first thermocouple circuit, a second thermocouple circuit, and a power supply circuit, the main control circuit, the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit, and the second thermocouple circuit being all connected to the power supply circuit, the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit, and the second thermocouple circuit being all connected to the main control circuit; wherein a temperature sensor 4 is composed of a first platinum resistor, a second platinum resistor, a first thermocouple and a second thermocouple.
In some embodiments, as shown in fig. 4 to 7, the master circuit includes a master chip U1A, a master chip U1B, a debug interface P1, a resistor R7, a diode D2, a capacitor C4, a capacitor C5, a capacitor C6, an interface chip U5, a capacitor C21, a resistor R18, a resistor R19, a resistor R30, a capacitor C13, a capacitor C14, a crystal oscillator Y2, a resistor R12, a capacitor C8, a capacitor C7, a resistor R10, a resistor R3, and a crystal oscillator Y1;
the pin 28 of the main control chip U1A is grounded through a resistor R3, the pin 5 of the main control chip U1A is connected with one end of a resistor R10, one end of a crystal oscillator Y1 and a grounded capacitor C8, the pin 6 of the main control chip U1A is connected with the other end of the resistor R10, the other end of the crystal oscillator Y1 and a grounded capacitor C7, the pin 66 of the main control chip U1A is grounded through a resistor R12, the pin 3 of the main control chip U1A is connected with one end of the crystal oscillator Y2 and a grounded capacitor C13, and the pin 4 of the main control chip U1A is connected with the other end of the crystal oscillator Y2 and a grounded capacitor C14;
the pin 13 of the main control chip U1B is connected with the grounded capacitor C5 and the grounded capacitor C6 to be externally connected with a voltage end VCC3.3, one end of the resistor R7 is connected with the cathode of the diode D2 to be externally connected with the voltage end VCC3.3, the other end of the resistor R7 is connected with the anode of the diode D2, the pin 7 of the main control chip U1B and the grounded capacitor C4, the pin 2, the pin 3 and the pin 4 of the debugging interface P1 are respectively connected with the pin 49, the pin 46 and the pin 7 of the main control chip U1A in one-to-one correspondence, the pin 7 of the interface chip U5 is connected with one end of the resistor R30 and one end of the resistor R18, the pin 6 of the interface chip U5 is connected with the other end of the resistor R30 and one end of the resistor R19, the other end of the resistor R18 and the other end of the resistor R19 are connected with a power circuit, the pin 1 and the pin 4 of the interface chip U5 are respectively connected with the pin 43 and the pin 42 of the main control chip U1A in one-to-one correspondence, the pins 2 and 3 of the interface chip U5 are respectively connected with the pin 44 of the main control chip U1A, and the interface chip U5 is connected with the voltage end of the pin 3 is connected with the grounded capacitor C3.
In some embodiments, as shown in fig. 8, the first platinum resistance circuit includes a digitizer U2, a capacitor C1, a capacitor C2, a capacitor C30, a capacitor C41, a resistor R5, and a platinum resistor P2; pin 1, pin 14, pin 15, pin 16 and pin 17 of the digitizer U2 are respectively connected with pin 14, pin 23, pin 21, pin 24 and pin 22 of the master control chip U1A in a one-to-one correspondence manner, the pin 2 of the digitizer U2 is connected with a grounded capacitor C1 and then externally connected with a voltage end VCC3.3, the pin 3 of the digitizer U2 is connected with the grounded capacitor C2 and then externally connected with a voltage end VCC3.3, one end of a resistor R5 is connected with pin 4 and pin 5 of the digitizer U2, the other end of the resistor R5 is connected with pin 6 and pin 7 of the digitizer U2, the pin 3 of the platinum resistor P2 is connected with pin 8 and pin 9 of the digitizer U2, the pin 2 of the platinum resistor P2 is connected with pin 10 of the digitizer U2, one end of a capacitor C30 and one end of a capacitor C41, and the other end of the capacitor C30 and the other end of the capacitor C41 of the platinum resistor P2 and the other end of the capacitor C41 and the pin 11 and pin 12 of the digitizer U2.
In some embodiments, as shown in fig. 9, the second platinum resistance circuit includes a digitizer U7, a capacitor C10, a capacitor C11, a capacitor C35, a capacitor C42, a resistor R1, and a platinum resistor P5; pin 1, pin 14, pin 15, pin 16 and pin 17 of digitizer U7 are connected with pin 15, pin 23, pin 21, pin 25 and pin 22 of master control chip U1A respectively in a one-to-one correspondence, external voltage end VCC3.3 after pin 2 of digitizer U7 is connected with grounded capacitor C10, external voltage end VCC3.3 after pin 3 of digitizer U7 is connected with grounded capacitor C11, one end of resistor R1 is connected with pin 4 and pin 5 of digitizer U7, the other end of resistor R1 is connected with pin 6 and pin 7 of digitizer U7, pin 3 of platinum resistor P5 is connected with pin 8 and pin 9 of digitizer U7, pin 2 of platinum resistor P5 is connected with pin 10 of digitizer U7, one end of capacitor C35 and one end of capacitor C42, and pin 1 of platinum resistor P5 is connected with the other end of capacitor C35, the other end of capacitor C42, pin 11 and pin 12 of digitizer U7.
In some embodiments, as shown in fig. 10, the first thermocouple circuit includes thermocouple P7, resistor R2, resistor R4, resistor R6, capacitor C12, capacitor C15, capacitor C43, capacitor C17, capacitor C20, capacitor C27, and digitizer U8; the pin 1 of the thermocouple P7 is connected with one end of a resistor R2, one end of a resistor R4 and one end of a resistor R6, the other end of the resistor R2 is connected with the pin 2 of the digitizer U8, the other end of the resistor R4 is connected with one end of a capacitor C15, one end of a capacitor C43, the pin 3 of the digitizer U8 and a grounded capacitor C12, the other end of the resistor R6 is connected with the other end of the capacitor C15, the other end of the capacitor C43, the pin 4 of the digitizer U8 and the grounded capacitor C17, the pin 5 of the digitizer U8 is grounded through a capacitor C20, the pin 8 of the digitizer U8 is connected with the grounded capacitor C27 and then is externally connected with a voltage end VCC3.3, and the pin 7, the pin 9, the pin 10, the pin 11, the pin 12 and the pin 13 of the digitizer U8 are respectively connected with the pin 16, the pin 26, the pin 21, the pin 22, the pin 23 and the pin 29 of the master control chip U1A in one-to-one correspondence.
In some embodiments, as shown in fig. 11, the second thermocouple circuit includes thermocouple P13, resistor R8, resistor R14, resistor R15, capacitor C28, capacitor C36, capacitor C44, capacitor C37, capacitor C38, capacitor C40, and digitizer U9; the pin 1 of the thermocouple P13 is connected with one end of a resistor R8, one end of a resistor R14 and one end of a resistor R15, the other end of the resistor R8 is connected with the pin 2 of the digitizer U9, the other end of the resistor R14 is connected with one end of a capacitor C36, one end of a capacitor C44, the pin 3 of the digitizer U9 and a grounded capacitor C28, the other end of the resistor R15 is connected with the other end of the capacitor C36, the other end of the capacitor C44, the pin 4 of the digitizer U9 and the grounded capacitor C37, the pin 5 of the digitizer U9 is grounded through the capacitor C38, the pin 8 of the digitizer U9 is connected with the grounded capacitor C40 and then is externally connected with a voltage end VCC3.3, and the pin 7, the pin 9, the pin 10, the pin 11, the pin 12 and the pin 13 of the digitizer U9 are respectively connected with the pin 17, the pin 27, the pin 21, the pin 22, the pin 23 and the pin 30 of the master control chip U1A in one-to-one correspondence.
In some embodiments, as shown in fig. 12 and 13, the power supply circuit includes an interface P8, a fuse F1, a diode D6, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C22, a capacitor C23, an inductance L1, a diode D7, a resistor R23, a resistor R13, a capacitor C19, a capacitor C29, a capacitor C16, a capacitor C39, a voltage regulator U6, and a voltage regulator VR1; the pin 4 of the interface P8 is connected with the other end of the resistor R18, the pin 3 of the interface P8 is connected with the other end of the resistor R19, the pin 2 of the interface P8 is connected with one end of the fuse F1, the other end of the fuse F1 is connected with the positive electrode of the diode D6, the negative electrode of the diode D6 is connected with the grounded capacitor C24, the grounded capacitor C25, the grounded capacitor C26 and the pin 7 of the voltage stabilizer U6, the pin 1 of the voltage stabilizer U6 is connected with one end of the capacitor C22, the other end of the capacitor C22 is connected with one end of the inductor L1, the negative electrode of the diode D7 and the pin 8 of the voltage stabilizer U6, the positive electrode of the diode D7 is grounded, the other end of the inductor L1 is connected with the grounded capacitor C23, one end of the resistor R23, the grounded capacitor C19, the grounded capacitor C29 and the input end of the voltage stabilizer VR1, the pin 4 of the voltage stabilizer U6 is connected with the other end of the resistor R23 and the grounded capacitor R13, and the output end of the voltage stabilizer VR1 is connected with the grounded capacitor C16 and the grounded capacitor C39 as the voltage VCC3.
To sum up, devices, model parameters, connection relationships, and the like, which are not described, may be referred to fig. 4 to 13; the temperature data detected by the platinum resistor P2, the platinum resistor P5, the thermocouple P7 and the thermocouple P13 are transmitted to the main control chip U1A through corresponding digital converters, and then transmitted to the processor through the main control chip U1A, namely, the detected temperature of the temperature sensor 4 is the average value of 4 temperature data, and the upper temperature of the first placement box 21 is the average value of the detected temperatures of 3 temperature sensors 4 with equal intervals (uniform distribution) on the upper layer of the first placement box 21, so that the upper layer temperature of the first placement box 21 is more accurately determined, and the result of comparing the upper layer temperature and the lower layer temperature of the first placement box 21 is more reliable.
In a third aspect, the present embodiment provides a temperature control method for a tile firing furnace, which is implemented by the temperature control system of the tile firing furnace;
the temperature control method of the tile firing furnace comprises the following steps:
detecting the upper and lower temperatures of the first placing box 21 and the upper and lower temperatures of the second placing box 31 by the temperature sensor 4;
judging whether the upper temperature and the lower temperature of the first placing box 21 are identical or not, and judging whether the upper temperature and the lower temperature of the second placing box 31 are identical or not;
if the upper layer temperature and the lower layer temperature of the first placing box 21 are inconsistent, the processor controls the electromagnetic valve 81 and/or the motor 12 to work so as to regulate and control the upper layer temperature and the lower layer temperature of the first placing box 21 to be consistent;
if the upper temperature and the lower temperature of the second placement tank 31 are not consistent, the processor controls the electromagnetic valve 81 and/or the motor 12 to operate so as to regulate the upper temperature and the lower temperature of the first placement tank 21 to be consistent.
If the upper temperature of the first placement tank 21 is lower than the lower temperature, the first placement tank 21 is positioned uppermost in this case, and the solenoid valve 81 of the laval nozzle 8 directly above the first placement tank 21 can be opened; if the first placing box 21 is the one close to the rotating shaft 11, the electromagnetic valve 81 of the laval nozzle 8 facing the upper space of the first placing box 21 can be opened; the rest of the cases are so analogized and are not repeated here.
The upper temperature of the first placement box 21 above is lower than the lower temperature, and meanwhile, the upper temperature of the first placement box 21 below is lower than the lower temperature, at this time, the electromagnetic valve 81 of one or more laval nozzles 8 in a group of corresponding positions can be controlled to be opened, namely, a plurality of laval nozzles 8 corresponding to the position with higher temperature can be closed, a plurality of laval nozzles 8 corresponding to the position with lower temperature are opened, and the temperature can be effectively controlled to be in a more balanced state through the control of the opening and closing quantity of the laval nozzles 8. The rest of the cases are deduced according to conventional logic and will not be repeated here.
In summary, a plurality of specific embodiments of the present invention are disclosed, and under the condition of no paradox, each embodiment may be freely combined to form a new embodiment, that is, embodiments belonging to alternative schemes may be freely replaced, but cannot be mutually combined; embodiments not belonging to the alternatives can be combined with each other, and these new embodiments also belong to the essential content of the invention.
While the above examples describe various embodiments of the present invention, those skilled in the art will appreciate that various changes and modifications can be made to these embodiments without departing from the spirit and scope of the present invention, and that such changes and modifications fall within the scope of the present invention.
Claims (10)
1. A tile firing furnace, comprising:
the firing chamber is internally and rotatably connected with a rotating shaft which is horizontally arranged;
the motor is in transmission connection with the rotating shaft;
the first installation part is vertically arranged on the rotating shaft;
the second installation part is vertically arranged on the rotating shaft and is symmetrical with the first installation part;
the first placing box is arranged on the first installation part;
the second placing box is arranged on the second installation part;
the temperature sensors are arranged in the first placing box and the second placing box and are respectively used for detecting the temperatures of the upper layer and the lower layer of the first placing box and the upper layer and the lower layer of the second placing box;
a combustion chamber communicating with the firing chamber and located directly below the firing chamber;
the igniter is arranged at the bottom of the combustion chamber and is connected with a fuel pipe;
the air inlet end of the high-temperature resistant fan is communicated with the upper part of the firing chamber;
pipe with lower opening connected to the air outlet end of the high temperature resistant blower and the combustion chamber via three-way pipe;
a plurality of Laval nozzles are arranged along the inner wall of the firing chamber and are communicated with the type pipe through electromagnetic valves.
2. The tile firing furnace according to claim 1, wherein:
the upper layer wall and the lower layer wall of the first placing box are hollow structures, the temperature sensors are arranged at the left, middle and right positions of the upper layer wall of the first placing box, and the temperature sensors are arranged at the left, middle and right positions of the lower layer wall of the first placing box;
the upper wall and the lower wall of the second placement box are hollow structures, the temperature sensors are arranged at the left, middle and right positions of the upper wall of the second placement box, and the temperature sensors are arranged at the left, middle and right positions of the lower wall of the second placement box.
3. The tile firing furnace according to claim 2, wherein:
the first case of placing and second place the case all have 4, 4 the first case of placing is rectangular distribution along the length direction of first installation department, 4 the second is placed the case and is rectangular distribution along the length direction of second installation department.
4. A tile firing furnace according to claim 3, wherein:
at least 2 Laval nozzles respectively face to the left side space and the right side space between the 2 first placing boxes and the 2 first placing boxes below from top to bottom, at least 2 Laval nozzles respectively face to the left side space and the right side space between the 2 first placing boxes near the rotating shaft, at least 2 Laval nozzles respectively face to the left side space and the right side space between the 2 second placing boxes above and the 2 second placing boxes below, and at least 2 Laval nozzles respectively face to the left side space and the right side space between the 2 second placing boxes near the rotating shaft.
5. The tile firing furnace of claim 4, wherein:
the high-temperature-resistant fan has 2, one of them opening of the lower part of type pipe is through the three-way pipe respectively with one of them high-temperature-resistant fan's air-out end and combustion chamber intercommunication, another opening of the lower part of type pipe is through the three-way pipe respectively with another high-temperature-resistant fan's air-out end and combustion chamber intercommunication.
6. A temperature control system for a tile firing furnace, comprising:
the tile firing furnace of any one of claims 1 to 5;
the control circuit is connected with the temperature sensor and used for controlling the electromagnetic valve and the motor to work according to the detection temperature of the temperature sensor;
the control circuit comprises a processor, a first relay and a second relay, wherein the coil of the first relay and the coil of the second relay are connected with the processor, the processor is connected with the temperature sensor, a normally open contact of the first relay is connected in series with a working circuit of the electromagnetic valve, and a normally open contact of the second relay is connected in series with the working circuit of the motor.
7. The temperature control system of a tile firing furnace according to claim 6, wherein:
the temperature sensor is provided with a measuring circuit, the measuring circuit comprises a main control circuit, a first platinum resistance circuit, a second platinum resistance circuit, a first thermocouple circuit, a second thermocouple circuit and a power supply circuit, the main control circuit, the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit and the second thermocouple circuit are all connected with the power supply circuit, and the first platinum resistance circuit, the second platinum resistance circuit, the first thermocouple circuit and the second thermocouple circuit are all connected with the main control circuit; wherein, one temperature sensor comprises a first platinum resistor, a second platinum resistor, a first thermocouple and a second thermocouple.
8. The temperature control system of a tile firing furnace according to claim 6, wherein:
the main control circuit comprises a main control chip U1A, a main control chip U1B, a debugging interface P1, a resistor R7, a diode D2, a capacitor C4, a capacitor C5, a capacitor C6, an interface chip U5, a capacitor C21, a resistor R18, a resistor R19, a resistor R30, a capacitor C13, a capacitor C14, a crystal oscillator Y2, a resistor R12, a capacitor C8, a capacitor C7, a resistor R10, a resistor R3 and a crystal oscillator Y1;
the pin 28 of the main control chip U1A is grounded through the resistor R3, the pin 5 of the main control chip U1A is connected with one end of the resistor R10, one end of the crystal oscillator Y1 and the grounded capacitor C8, the pin 6 of the main control chip U1A is connected with the other end of the resistor R10, the other end of the crystal oscillator Y1 and the grounded capacitor C7, the pin 66 of the main control chip U1A is grounded through the resistor R12, the pin 3 of the main control chip U1A is connected with one end of the crystal oscillator Y2 and the grounded capacitor C13, and the pin 4 of the main control chip U1A is connected with the other end of the crystal oscillator Y2 and the grounded capacitor C14;
the pin 13 of the main control chip U1B is connected with the capacitor C5 and the capacitor C6 which are grounded in a one-to-one correspondence manner, the pin 7 of the interface chip U5 is connected with one end of the resistor R30 and one end of the resistor R18, one end of the resistor R7 is connected with the other end of the resistor R30 and one end of the resistor R19, the other end of the resistor R7 is connected with the anode of the diode D2, the pin 7 of the main control chip U1B and the capacitor C4 which are grounded, the pin 2, the pin 3 and the pin 4 of the debugging interface P1 are respectively connected with the pin 49, the pin 46 and the pin 7 of the main control chip U1A in a one-to-one correspondence manner, the pin 7 of the interface chip U5 is connected with one end of the resistor R30 and one end of the resistor R18, the pin 6 of the other end of the resistor R18 and the other end of the resistor R19 are respectively connected with the power supply circuit, the pin 1 and the pin 4 of the interface chip U5 are respectively connected with the pin 43 of the main control chip U1A and the pin 42, and the pin 3 is connected with the pin 3 of the interface chip U2 and the end of the interface chip U3 is connected with the voltage end of the interface chip 3.
9. The temperature control system of a tile firing furnace of claim 8, wherein:
the first platinum resistance circuit comprises a digitizer U2, a capacitor C1, a capacitor C2, a capacitor C30, a capacitor C41, a resistor R5 and a platinum resistor P2; the pin 1, the pin 14, the pin 15, the pin 16 and the pin 17 of the digitizer U2 are respectively connected with the pin 14, the pin 23, the pin 21, the pin 24 and the pin 22 of the main control chip U1A in a one-to-one correspondence manner, the pin 2 of the digitizer U2 is connected with the capacitor C1 which is grounded and then externally connected with the voltage terminal VCC3.3, the pin 3 of the digitizer U2 is connected with the capacitor C2 which is grounded and then externally connected with the voltage terminal VCC3.3, one end of the resistor R5 is connected with the pin 4 and the pin 5 of the digitizer U2, the other end of the resistor R5 is connected with the pin 6 and the pin 7 of the digitizer U2, the pin 3 of the platinum resistor P2 is connected with the pin 8 and the pin 9 of the digitizer U2, the pin 2 of the platinum resistor P2 is connected with the pin 10 of the digitizer U2, one end of the capacitor C30 and one end of the capacitor C41, and the other end of the capacitor C30 and the pin 11 of the digitizer U2.
10. A method of controlling the temperature of a tile firing furnace by a temperature control system of a tile firing furnace according to any one of claims 6 to 9, comprising:
detecting an upper temperature and a lower temperature of the first placing box and an upper temperature and a lower temperature of the second placing box by the temperature sensor;
judging whether the upper layer temperature and the lower layer temperature of the first placing box are consistent or not, and judging whether the upper layer temperature and the lower layer temperature of the second placing box are consistent or not;
if the upper layer temperature and the lower layer temperature of the first placing box are inconsistent, the processor controls the electromagnetic valve and/or the motor to work so as to regulate and control the upper layer temperature and the lower layer temperature of the first placing box to be consistent;
if the upper layer temperature and the lower layer temperature of the second placing box are inconsistent, the processor controls the electromagnetic valve and/or the motor to work so as to regulate and control the upper layer temperature and the lower layer temperature of the first placing box to be consistent.
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| CN202311567589.9A CN117287974B (en) | 2023-11-23 | 2023-11-23 | Ceramic tile firing furnace and temperature control system and method thereof |
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