CN117283153A

CN117283153A - Optical path concentricity adjusting method, device, equipment and medium

Info

Publication number: CN117283153A
Application number: CN202311160401.9A
Authority: CN
Inventors: 侯君杰; 郭安伟; 林敬刚; 满坤坤; 韩风德; 葛均华; 陈安兵; 李林兵
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2023-09-08
Filing date: 2023-09-08
Publication date: 2023-12-26

Abstract

The application discloses a method, a device, equipment and a medium for adjusting the concentricity of a light path, and belongs to the technical field of laser processing. In the application, a method for accurately adjusting concentricity of an optical path, a cutter and a follow-up mechanism is provided. Compared with the traditional optical path concentricity adjustment method, the first concentricity between the optical path to be measured and the cutter is adjusted through the first emergent light state of the optical path to be measured, so that the optical path to be measured is positioned on the central optical axis of the cutter; and adjusting the second concentricity between the light path to be measured and the follow-up mechanism through the second emergent light state of the light path to be measured so that the light path to be measured is positioned on the central optical axis of the follow-up mechanism. The concentricity of the optical path to be measured, the cutter and the follower is respectively adjusted, so that the concentricity of the optical path is accurately adjusted.

Description

Optical path concentricity adjusting method, device, equipment and medium

Technical Field

The present disclosure relates to the field of laser processing technologies, and in particular, to a method for adjusting concentricity of an optical path, an apparatus for adjusting concentricity of an optical path, and a computer readable storage medium.

Background

At present, in the laser processing process, the optical path precision requirement on laser is higher, for example, in the processing of brittle materials such as glass, if the optical path precision is lower, the processed product is easy to be disqualified. The traditional optical path concentricity adjustment method is to convert invisible light into visible light through a frequency doubling piece to roughly verify the whole optical path state, but the verification of the frequency doubling piece has great influence on the complexity of the laser optical path, the observation visual angle, the ambient brightness, the standard of detection personnel and the like, and cannot accurately complete the optical path concentricity adjustment.

Disclosure of Invention

The main object of the present application is to provide a method for adjusting optical path concentricity, an apparatus for adjusting optical path concentricity, and a computer-readable storage medium, which aim to accurately adjust optical path concentricity.

In order to achieve the above object, the present application provides a method for adjusting concentricity of an optical path, the method for adjusting concentricity of an optical path is applied to a laser processing system, the laser processing system includes a laser, and a follower and a cutter which are sequentially arranged along an outgoing light direction of the laser, the method includes:

controlling a laser to emit test laser to construct a light path to be tested;

Acquiring a first emergent light state of the light path to be measured, and adjusting first concentricity between the light path to be measured and a cutter based on the first emergent light state so that the light path to be measured is positioned on a central optical axis of the cutter;

and acquiring a second emergent light state of the light path to be measured, and adjusting a second concentricity between the light path to be measured and the follow-up mechanism based on the second emergent light state so that the light path to be measured is positioned on a central optical axis of the follow-up mechanism.

Illustratively, after the step of adjusting the second concentricity between the optical path to be measured and the follower based on the second outgoing light state, the method includes:

performing processing of a preset verification processing track by using a light path to be detected after the first concentricity and the second concentricity are regulated, and acquiring verification processing effects of each reference position in the preset verification processing track;

and if the verification processing effects are different, repeatedly adjusting the first concentricity and the second concentricity until the verification processing effects are the same.

Illustratively, the preset verification processing track comprises at least one of a straight line or a curve, and the verification processing effect comprises at least one of a light spot size, a light spot action intensity, a crack state and a crack direction;

And if the verification processing effects are different, repeating the steps of adjusting the first concentricity and the second concentricity until the verification processing effects are the same, wherein the steps comprise:

and if any corresponding one or more of the spot size, the spot action intensity, the crack state and the crack direction of the straight line are different, or if any corresponding one or more of the spot size, the spot action intensity, the crack state and the crack direction of the curve are different, repeatedly adjusting the first concentricity and the second concentricity until any corresponding one or more of the spot size, the spot action intensity, the crack state and the crack direction are the same.

The first outgoing light state includes, for example, spot uniformity of outgoing light corresponding to the optical path to be measured at an out-of-focus position corresponding to the focal position of the optical path to be measured;

the step of adjusting a first concentricity between the optical path to be measured and the cutter based on the first outgoing light state so that the optical path to be measured is located on a central optical axis of the cutter includes:

and adjusting the position of the incident light of the light path to be measured according to the light spot uniformity so as to adjust the first concentricity between the light path to be measured and the cutter and enable the light path to be measured to be positioned on the central optical axis of the cutter.

Exemplary, the step of adjusting the position of the incident light of the optical path to be measured according to the light spot uniformity includes:

if the light spot uniformity does not meet the preset light spot uniformity requirement, the position of the incident light corresponding to the light path to be detected is adjusted through the light spot positions of the emergent light before and after the cutter and/or at the left and right sides of the cutter until the light spot uniformity meets the preset light spot uniformity requirement.

Illustratively, the follower comprises a position-fixing assembly, a rotating motor and a spot-adjusting module, the rotating motor and the spot-adjusting module being mounted on the position-fixing assembly;

the second emergent light state comprises at least one of spot brightness, spot uniformity and offset of a spot around a central point of emergent light corresponding to the light path to be detected at a defocused position corresponding to the focal position of the light path to be detected;

the step of adjusting a second concentricity between the optical path to be measured and the follower based on the second outgoing light state so that the optical path to be measured is located on a central optical axis of the follower includes:

controlling the rotating motor to rotate, and acquiring at least one of the light spot brightness, the light spot uniformity and the offset in the rotating process of the rotating motor;

And adjusting the position of incident light corresponding to the light path to be measured according to at least one of the light spot brightness, the light spot uniformity and the offset to adjust the second concentricity between the light path to be measured and the follow-up mechanism, and enabling the light path to be measured to be positioned on the central optical axis of the follow-up mechanism.

Exemplary, the step of adjusting the position of the incident light corresponding to the optical path to be measured according to at least one of the spot brightness, the spot uniformity and the offset includes:

and if the light spot brightness does not meet at least one of the preset light spot brightness requirement, the light spot uniformity does not meet the preset light spot uniformity requirement and the offset does not meet the preset offset requirement, driving the rotating motor and the light spot adjusting module to move by moving the position fixing assembly, and adjusting the position of incident light corresponding to the light path to be measured.

The application also provides an optical path concentricity adjusting device, which comprises:

the construction module is used for controlling the laser to emit test laser and constructing a light path to be tested;

the first adjusting module is used for acquiring a first emergent light state of the optical path to be measured and adjusting first concentricity between the optical path to be measured and the cutter based on the first emergent light state so that the optical path to be measured is positioned on a central optical axis of the cutter;

The second adjusting module is used for acquiring a second emergent light state of the optical path to be measured and adjusting second concentricity between the optical path to be measured and the follow-up mechanism based on the second emergent light state so that the optical path to be measured is positioned on a central optical axis of the follow-up mechanism.

The application also provides a light path concentricity adjustment device, the light path concentricity adjustment device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, which when executed by the processor, performs the steps of the optical path concentricity adjustment method as described above.

The present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the optical path concentricity adjustment method as described above.

The embodiment of the application provides a light path concentricity adjustment method, a light path concentricity adjustment device, light path concentricity adjustment equipment and a computer readable storage medium, wherein the light path concentricity adjustment method is applied to a laser processing system, and the laser processing system comprises a laser, a follower and a cutter which are sequentially arranged along the emergent light direction of the laser, and controls the laser to emit test laser so as to construct a light path to be tested; acquiring a first emergent light state of the light path to be measured, and adjusting first concentricity between the light path to be measured and a cutter based on the first emergent light state so that the light path to be measured is positioned on a central optical axis of the cutter; and acquiring a second emergent light state of the light path to be measured, and adjusting a second concentricity between the light path to be measured and the follow-up mechanism based on the second emergent light state so that the light path to be measured is positioned on a central optical axis of the follow-up mechanism.

In the application, a method for accurately adjusting concentricity of an optical path, a cutter and a follow-up mechanism is provided. Compared with the traditional optical path concentricity adjustment method, the first concentricity between the optical path to be measured and the cutter is adjusted through the first emergent light state of the optical path to be measured, so that the optical path to be measured is positioned on the central optical axis of the cutter; and adjusting the second concentricity between the light path to be measured and the follow-up mechanism through the second emergent light state of the light path to be measured so that the light path to be measured is positioned on the central optical axis of the follow-up mechanism. The concentricity of the optical path to be measured, the cutter and the follower is respectively adjusted, so that the concentricity of the optical path is accurately adjusted.

Drawings

FIG. 1 is a schematic diagram of an operating device of a hardware operating environment according to an embodiment of the present application;

FIG. 2 is a schematic flow chart of an embodiment of a method for adjusting concentricity of an optical path according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a laser processing system according to an embodiment of a method for adjusting concentricity of an optical path according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a part of a light spot of an embodiment of a method for adjusting concentricity of a light path according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a follower mechanism according to an embodiment of a method for adjusting concentricity of an optical path according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a partially verified processing track of an embodiment of a method for adjusting concentricity of an optical path according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of an optical path concentricity adjusting apparatus according to an embodiment of the present disclosure.

The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings.

Detailed Description

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

Referring to fig. 1, fig. 1 is a schematic diagram of an operating device of a hardware operating environment according to an embodiment of the present application.

As shown in fig. 1, the operation device may include: a processor 1001, such as a central processing unit (Central Processing Unit, CPU), a communication bus 1002, a user interface 1003, a network interface 1004, a memory 1005. Wherein the communication bus 1002 is used to enable connected communication between these components. The user interface 1003 may include a Display, an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may further include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a WIreless interface (e.g., a WIreless-FIdelity (WI-FI) interface). The Memory 1005 may be a high-speed random access Memory (Random Access Memory, RAM) Memory or a stable nonvolatile Memory (NVM), such as a disk Memory. The memory 1005 may also optionally be a storage device separate from the processor 1001 described above.

It will be appreciated by those skilled in the art that the structure shown in fig. 1 is not limiting of the operating device and may include more or fewer components than shown, or certain components may be combined, or a different arrangement of components.

As shown in fig. 1, an operating system, a data storage module, a network communication module, a user interface module, and a computer program may be included in the memory 1005 as one type of storage medium.

In the operating device shown in fig. 1, the network interface 1004 is mainly used for data communication with other devices; the user interface 1003 is mainly used for data interaction with a user; the processor 1001, the memory 1005 in the operation device of the present application may be provided in an operation device that calls a computer program stored in the memory 1005 through the processor 1001 and performs the following operations:

controlling a laser to emit test laser to construct a light path to be tested;

In an embodiment, the processor 1001 may call a computer program stored in the memory 1005, and further perform the following operations:

after the step of adjusting the second concentricity between the optical path to be measured and the follower based on the second outgoing light state, the method includes:

the preset verification processing track comprises at least one of a straight line or a curve, and the verification processing effect comprises at least one of a light spot size, a light spot action intensity, a crack state and a crack direction;

the first emergent light state comprises the spot uniformity of emergent light corresponding to the optical path to be detected at the defocused position corresponding to the focal position of the optical path to be detected;

the step of adjusting the position of the incident light of the optical path to be measured according to the light spot uniformity comprises the following steps:

the follow-up mechanism comprises a position fixing assembly, a rotating motor and a light spot adjusting module, wherein the rotating motor and the light spot adjusting module are arranged on the position fixing assembly;

the step of adjusting the position of the incident light corresponding to the optical path to be measured according to at least one of the light spot brightness, the light spot uniformity and the offset includes:

In an embodiment of the optical path concentricity adjustment method, the optical path concentricity adjustment method is applied to a laser processing system, the laser processing system includes a laser, a follower and a cutter, which are sequentially arranged along an outgoing light direction of the laser, and referring to fig. 2, the method includes:

step S10, controlling a laser to emit test laser to construct a light path to be tested;

the embodiment can be applied to a laser processing system, and the laser processing system comprises a laser, a follow-up mechanism and a cutter which are sequentially arranged along the emergent light direction of the laser. Further, the laser processing system may include a laser 1, a beam expanding unit 2, a first reflecting unit 3, a second reflecting unit 4, a third reflecting unit 5, a follower 6, a cutter 7 and a processing platform 8, and the schematic structure of the laser processing system is shown in fig. 3, and fig. 3 is a schematic structure of the laser processing system.

The laser 1 may be an optical component that emits a laser beam; the beam expander 2 may be a beam expander that expands a laser beam and increases a diameter of the laser beam; the first, second and third reflection units 3, 4 and 5 may be optical elements for reflecting the laser beam; the follower mechanism 6 may be composed of a position fixing assembly, a rotating motor and a spot adjusting module, where the rotating motor and the spot adjusting module are installed on the position fixing assembly, and the position fixing assembly may drive the rotating motor and the spot adjusting module to move, and may be used for performing a series of shaping on the light beam during rotation, such as changing the diameter and shape of the light beam; the cutter 7 may be a laser cutting head for processing a product, for example, the cutter 7 may be a bessel laser cutting head; the optical path to be measured can be a Bessel laser optical path; the processing platform 8 may be a platform for placing a processed product for processing; the above processed product may be an optical glass, such as an optical lens or the like.

It should be understood that the optical path adjusting device adjusts the positions of the follower 6 and the cutter 7 by setting the focal position of the laser 1, so that the test laser emitted by the laser 1 can be focused on the cutter 6, thereby constructing the optical path to be measured; in the above laser processing system, the optical path adjusting device controls the laser 1 to emit the test laser, the test laser is expanded by the beam expanding unit 2, reflected by the first reflecting unit 3, the second reflecting unit 4 and the third reflecting unit 5 respectively, and shaped to the cutter 7 by the beam of the follower mechanism 6, and the laser falls on the processing platform 8 again by the cutter 7 to realize laser processing.

Step S20, a first emergent light state of the light path to be detected is obtained, and a first concentricity between the light path to be detected and a cutter is adjusted based on the first emergent light state, so that the light path to be detected is positioned on a central optical axis of the cutter;

when the optical path to be measured reaches the cutter 7, if the optical path to be measured and the cutter 7 have a problem of being not concentric, the machining precision of the optical path to be measured on the machining platform 8 will be seriously reduced. In this embodiment, a first outgoing light state of the optical path to be measured at the cutter 7 is obtained, and then a first concentricity between the optical path to be measured and the cutter 7 is adjusted according to the first outgoing light state, so that the optical path to be measured is located on a central optical axis of the cutter 7.

The first outgoing light state includes a defocus position corresponding to a focal position of the optical path to be measured, and spot uniformity of outgoing light corresponding to the optical path to be measured, where the focal position of the optical path to be measured is a position of a point where the laser beam emitted by the laser 1 converges after being expanded and focused, and the defocus position is a position, relative to the focal position, where the focal point of the laser does not fall on the processing platform 8.

While the beam has a spot just due to the out-of-focus position. Therefore, the position of the incident light corresponding to the light path to be measured can be adjusted according to the light spot uniformity of the emergent light corresponding to the light path to be measured at the defocused position, so that the first concentricity between the light path to be measured and the cutter is adjusted, and finally the light path to be measured is positioned on the central optical axis of the cutter, and the light spot uniformity meets the preset light spot uniformity requirement.

It should be noted that, the light spot may be displayed by a frequency doubling plate irradiated onto the defocus position by the light path to be measured, the light spot may be an annular light spot pattern, and the frequency doubling plate may be a light modulating plate for detecting, correcting and identifying the infrared beam, and may convert various invisible infrared light into visible light.

In the present embodiment, the frequency doubling chips are placed at the defocusing position above the processing platform 8 and below the cutting head 7, the laser 1 is controlled to emit light, the state of the emitted light, that is, the spot uniformity of the emitted light is observed, and the position of the incident light is adjusted according to the state of the emitted light. The reason for the uneven brightness is that the concentricity is inconsistent, the optical path to be measured is not incident to the center position of the cutting head 7, and the concentricity is deviated. Whether the brightness is uniform or not can be characterized by the width of the circular ring of the circular light spots, and the width of the circular ring of each circular light spot is equal when the brightness is uniform.

Here, the position of the light spot of the outgoing light before and after the cutting head 7 can be adjusted and changed by moving the optical component 4, the position of the light spot of the outgoing light around the cutting head 7 can be adjusted and changed by moving the optical component 4 and the optical component 5, the light beam finally forms an annular light beam with uniform brightness, and after the light spot is determined to meet the preset light spot uniformity requirement, namely, the brightness is uniform, the adjustment of the position of the incident light corresponding to the light path to be detected is completed, so that the adjustment of the first concentricity between the light path to be detected and the cutter is realized.

Step S30, a second emergent light state of the light path to be detected is obtained, and a second concentricity between the light path to be detected and the follow-up mechanism is adjusted based on the second emergent light state, so that the light path to be detected is located on a central optical axis of the follow-up mechanism.

When the light path to be measured reaches the follower 6, if the light path to be measured and the follower 6 are not concentric, the machining precision of the machined product on the machining platform 8 by the light path to be measured is severely reduced. In this embodiment, a second outgoing light state of the optical path to be measured at the follower 6 is obtained, and then a second concentricity between the optical path to be measured and the follower 6 is adjusted according to the second outgoing light state, so that the optical path to be measured is located on the central optical axis of the follower 6.

The second emergent light state comprises at least one of the light spot brightness, the light spot uniformity and the offset of the light spot around the center point of emergent light corresponding to the light path to be detected at the defocused position corresponding to the focal position of the light path to be detected. The offset of the light spot around the center point refers to the distance between the light spot on the light spot and the center point of the light spot, and when the light spot is uniform and the light path to be measured is located on the center optical axis of the follower mechanism, the rotating motor is controlled to rotate at any angle, and the offset is unchanged.

Therefore, the rotating motor is controlled to rotate, at least one of the light spot brightness, the light spot uniformity and the offset is obtained in the rotating process of the rotating motor, and then the position of the incident light corresponding to the light path to be measured is adjusted according to at least one of the light spot brightness, the light spot uniformity and the offset, so that the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and finally the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes a spot brightness of emergent light corresponding to the to-be-measured light path at an out-of-focus position corresponding to the focal position of the to-be-measured light path; under the condition, the rotating motor is controlled to rotate, the light spot brightness in the rotating process of the rotating motor is obtained, the position of incident light corresponding to the light path to be measured is adjusted according to the light spot brightness, the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes a spot uniformity of emergent light corresponding to the to-be-measured light path at an out-of-focus position corresponding to the focal position of the to-be-measured light path; under the condition, the rotating motor is controlled to rotate, the light spot uniformity in the rotating process of the rotating motor is obtained, the position of incident light corresponding to the light path to be measured is adjusted according to the light spot uniformity, the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second outgoing light state includes an offset of a spot of outgoing light corresponding to the optical path to be measured around the center point at an out-of-focus position corresponding to the focal position of the optical path to be measured; under the condition, the rotating motor is controlled to rotate, the offset in the rotating process of the rotating motor is obtained, the position of the incident light corresponding to the optical path to be measured is adjusted according to the offset, so that the second concentricity between the optical path to be measured and the follow-up mechanism is adjusted, and the optical path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes spot brightness and spot uniformity of emergent light corresponding to the optical path to be measured at an out-of-focus position corresponding to the focal position of the optical path to be measured; under the condition, the rotating motor is controlled to rotate, the light spot brightness and the light spot uniformity in the rotating process of the rotating motor are obtained, the position of incident light corresponding to the light path to be measured is adjusted according to the light spot brightness and the light spot uniformity, the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes spot uniformity of emergent light corresponding to the optical path to be measured and offset of the spot around the center point at an out-of-focus position corresponding to the focal position of the optical path to be measured; under the condition, the rotating motor is controlled to rotate, the light spot uniformity and the offset in the rotating process of the rotating motor are obtained, the position of incident light corresponding to the light path to be measured is adjusted according to the light spot uniformity and the offset, the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes a spot brightness of emergent light corresponding to the optical path to be measured and an offset of the spot around the center point at an out-of-focus position corresponding to the focal position of the optical path to be measured; under the condition, the rotating motor is controlled to rotate, the light spot brightness and the offset in the rotating process of the rotating motor are obtained, the position of incident light corresponding to the light path to be measured is adjusted according to the light spot brightness and the offset, the second concentricity between the light path to be measured and the follow-up mechanism is adjusted, and the light path to be measured is positioned on the central optical axis of the follow-up mechanism.

In an embodiment, the second emergent light state includes a spot brightness, a spot uniformity and an offset of the spot around the center point of the emergent light corresponding to the optical path to be measured at the defocus position corresponding to the focal position of the optical path to be measured; in this case, the rotating motor is controlled to rotate, and the light spot brightness, the light spot uniformity and the offset are obtained in the rotating process of the rotating motor; and adjusting the position of incident light corresponding to the light path to be measured according to the light spot brightness, the light spot uniformity and the offset to adjust the second concentricity between the light path to be measured and the follow-up mechanism, and enabling the light path to be measured to be positioned on the central optical axis of the follow-up mechanism.

The light spots when the position of the incident light corresponding to the optical path to be measured is adjusted are shown as a light spot a and a light spot b in fig. 4. In an embodiment, referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a follower, where the second concentricity between the optical path to be measured and the follower is adjusted based on the second outgoing light state so that the optical path to be measured is located on the central optical axis of the follower:

in a first step, the doubling chips are kept in the out-of-focus position of the cutting head 7.

And secondly, controlling the rotating motor B to rotate by 360 degrees.

And a third step of: observing the light spot state of the rotating motor B in the 0-360 DEG rotating process, including the brightness and uniformity of the light spot and the offset around the center of the spot, judging whether the state of each light spot on the light spot of the rotating motor B in the whole rotating process is consistent, and entering the fourth step when the light spot state of any point is different from other light spots; if the states of the light spots are consistent, the rotation center is concentric with the light spot center of the light path to be measured.

Fourth step: concentricity adjustment is performed by moving the positions of the rotation center in the X direction (F2 direction) and the Y direction (F1 direction) by the position fixing unit C on the follower mechanism 6. The position fixing component C can drive the rotating motor B and the light spot adjusting module A (used for beam shaping) to move in position, the back and forth movement of the position fixing component C can drive the rotating center Y direction of the rotating motor B to move, and the left and right movement of the position fixing component C can drive the rotating center X direction of the rotating motor B to move.

Fifth step: after the fourth step of debugging is finished, returning to the second step and the third step, confirming whether the light spot states of all the positions are consistent, finishing the debugging if the light spot states are consistent, and entering the fourth step again if the light spot states are inconsistent.

Taking 0 degree and 180 degree as an example, when the rotating motor rotates to 180 degrees, the light spot presents a certain state, and when the motor rotates to 0 degrees, the shape, the size and the brightness of the light spot only do one 180 degree rotation, and the state of the light spot is kept unchanged. The rotating motor moves to 90 degrees and 270 degrees, the light spot states are equal to 180 degrees, and besides, the light spot states at other positions are consistent with the states of 0 degrees, 90 degrees, 180 degrees and 270 degrees, and the light spot only follows the rotating motor to do a rotating action.

After the concentricity adjustment of the optical path to be measured and the optical path of the cutter is independently completed and the concentricity adjustment of the optical path to be measured and the optical path of the follower is independently completed, there may still be an adjustment deviation, so that the concentricity between the optical path to be measured and the cutter and the follower still does not meet the requirement of processing precision, and the concentricity adjustment needs to be performed on the whole of the three.

In this embodiment, the optical path to be measured after the first concentricity and the second concentricity are adjusted is used to execute the processing of the preset verification processing track and obtain the verification processing effect, and if the verification processing effects are different, the first concentricity and the second concentricity are repeatedly adjusted until the verification processing effects are the same.

and if any corresponding one or more of the spot size, the spot action intensity, the crack state or the crack direction of the straight line are different, or if any corresponding one or more of the spot size, the spot action intensity, the crack state or the crack direction of the curve are different, repeatedly adjusting the first concentricity and the second concentricity until any corresponding one or more of the spot size, the spot action intensity, the crack state and the crack direction are the same.

Referring to fig. 6, the preset verification processing trajectory includes at least one of a straight line or a curved line; verifying the machining effect includes at least one of a spot size, a spot applied intensity (an applied intensity of a spot to a material of a product to be machined), a crack state, and a crack direction. The reference positions in the preset verification processing track may be points shown as Z1, Z2, Z3, Z4 and Z5 in fig. 6, and positions shown as Y1 and Y2, or may be straight line segments and curved line segments shown as Z3Z5 and Y1Y 2.

In one embodiment, in a first step, the doubling chips are also placed in the out-of-focus position of the cutting head.

And secondly, controlling and drawing the 'well' -shaped and circular shape shown in fig. 6.

And thirdly, controlling laser light emission, and executing a processing track by the platform.

Fourthly, placing the processed product under a 600 times microscope to observe the processing effect of the glass, and observing the size of an AR surface light point on the front surface of the glass, the action strength of the light point and the material, the crack state and the crack direction; the thermal influence of the light spot on the back surface of the glass, the size of the light spot, the action strength, the crack state and the crack direction are observed. And testing the light spot sizes, crack lengths, heat affected areas and the like at different positions, judging whether the states of all the positions of the light spots are consistent, if so, finishing fine tuning, and if not, entering a fifth step.

And fifthly, debugging the first concentricity, the second concentricity and the verification processing effect is carried out again until the processing effect under the microscope is consistent, namely the states of all positions of the light spots are consistent.

In one embodiment, the verification processing includes a spot size, and if the spot sizes of the straight lines are different, or if the spot sizes of the curves are different, the first concentricity and the second concentricity are repeatedly adjusted until the spot sizes are the same.

In one embodiment, the verification processing includes a light spot action intensity, and if the light spot action intensities of the straight lines are different, or if the light spot action intensities of the curves are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot action intensities are the same.

In an embodiment, verifying the machining effect includes a crack state, and if the crack states of the straight lines are different, or if the crack states of the curved lines are different, repeating the adjusting of the first concentricity and the second concentricity until the crack states are the same.

In an embodiment, verifying the machining effect includes a crack direction, and if the crack directions of the straight lines are different, or if the crack directions of the curved lines are different, repeating the adjusting of the first concentricity and the second concentricity until the crack directions are the same.

In one embodiment, verifying the machining effect includes spot size, spot intensity; if the light spot size and the light spot action intensity of the straight line are different, or if the light spot size and the light spot action intensity of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size and the light spot action intensity are the same.

In one embodiment, verifying the machining effect includes spot size, crack status; if the light spot size and the crack state of the straight line are different, or if the light spot size and the crack state of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size and the crack state are the same.

In one embodiment, verifying the machining effect includes spot size, crack direction; if the light spot size and the crack direction of the straight line are different, or if the light spot size and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size and the crack direction are the same.

In one embodiment, verifying the machining effect includes spot action intensity, crack status; if the light spot action intensity and the crack state of the straight line are different, or if the light spot action intensity and the crack state of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot action intensity and the crack state are the same.

In one embodiment, verifying the machining effect includes spot action intensity, crack direction; if the light spot action intensity and the crack direction of the straight line are different, or if the light spot action intensity and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot action intensity and the crack direction are the same.

In one embodiment, verifying the machining effect includes crack status, crack direction; if the crack states and the crack directions of the straight lines are different, or if the crack states and the crack directions of the curves are different, the first concentricity and the second concentricity are repeatedly adjusted until the crack states and the crack directions are the same.

In one embodiment, verifying the machining effect includes spot size, spot action intensity, crack status; if the straight line light spot size, the light spot action intensity and the crack state are different, or if the curve light spot size, the light spot action intensity and the crack state are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size, the light spot action intensity and the crack state are the same.

In one embodiment, verifying the machining effect includes spot size, spot action intensity, crack direction; if the light spot size, the light spot action intensity and the crack direction of the straight line are different, or if the light spot size, the light spot action intensity and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size, the light spot action intensity and the crack direction are the same.

In one embodiment, verifying the machining effect includes spot size, crack status, crack direction; if the light spot size, the crack state and the crack direction of the straight line are different, or if the light spot size, the crack state and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size, the crack state and the crack direction are the same.

In one embodiment, verifying the machining effect includes spot action intensity, crack state, crack direction; if the light spot action intensity, the crack state and the crack direction of the straight line are different, or if the light spot action intensity, the crack state and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot action intensity, the crack state and the crack direction are the same.

In one embodiment, verifying the machining effect includes spot size, spot action intensity, crack status, crack direction; if the light spot size, the light spot action intensity, the crack state and the crack direction of the straight line are different, or if the light spot size, the light spot action intensity, the crack state and the crack direction of the curve are different, the first concentricity and the second concentricity are repeatedly adjusted until the light spot size, the light spot action intensity, the crack state and the crack direction are the same.

In the embodiment, the method is applied to a laser processing system comprising a laser, a follow-up mechanism and a cutter, wherein the follow-up mechanism and the cutter are sequentially arranged along the emergent light direction of the laser, and the laser is controlled to emit test laser to construct a light path to be tested; acquiring a first emergent light state of the light path to be measured, and adjusting first concentricity between the light path to be measured and a cutter based on the first emergent light state so that the light path to be measured is positioned on a central optical axis of the cutter; and acquiring a second emergent light state of the light path to be measured, and adjusting a second concentricity between the light path to be measured and the follow-up mechanism based on the second emergent light state so that the light path to be measured is positioned on a central optical axis of the follow-up mechanism.

In this embodiment, a method for accurately adjusting concentricity of an optical path, a cutter and a follower is provided. Compared with the traditional optical path concentricity adjustment method, the first concentricity between the optical path to be measured and the cutter is adjusted through the first emergent light state of the optical path to be measured, so that the optical path to be measured is positioned on the central optical axis of the cutter; and adjusting the second concentricity between the light path to be measured and the follow-up mechanism through the second emergent light state of the light path to be measured so that the light path to be measured is positioned on the central optical axis of the follow-up mechanism. The concentricity of the optical path to be measured, the cutter and the follower is respectively adjusted, so that the concentricity of the optical path is accurately adjusted.

The traditional debugging method is to carry out the debugging of the light beam through the frequency doubling piece, and convert the invisible light into the visible light so as to roughly verify the states of the light path and the incident light spot. The light spot checked by the frequency doubling piece is subjected to the difference of results caused by the observation visual angle, the environment brightness and the standard difference of detection personnel, so that the concentricity adjustment of the incident light spot cannot be accurately completed, and the precise concentricity adjustment among the light path, the cutter and the follower mechanism cannot be further completed.

In the application, on the basis of traditional debugging only by means of a frequency doubling piece, the precise debugging of the light spots is realized through light spot adjustment, special pattern proofing and light spot state analysis, wherein the precise debugging of concentricity is realized through precisely measuring the light spot data of the special pattern, the concentric problem of light beam incidence light spots, a cutting head and the rotating center of a rotating structure is solved, and the precise concentricity debugging of the incidence light spots, the cutting head and the rotating center of the rotating structure is realized.

In addition, referring to fig. 7, an embodiment of the present application further provides an optical path concentricity adjustment device, including:

the construction module M1 is used for controlling the laser to emit test laser and constructing a light path to be tested;

the first adjusting module M2 is configured to obtain a first outgoing light state of the optical path to be measured, and adjust a first concentricity between the optical path to be measured and the cutter based on the first outgoing light state, so that the optical path to be measured is located on a central optical axis of the cutter;

The second adjustment module M3 is configured to obtain a second outgoing light state of the optical path to be measured, and adjust a second concentricity between the optical path to be measured and the follower based on the second outgoing light state, so that the optical path to be measured is located on a central optical axis of the follower.

Illustratively, the apparatus further comprises a verification module for:

after the step of adjusting the second concentricity between the optical path to be measured and the follower based on the second outgoing light state,

Illustratively, the preset verification processing track comprises at least one of a straight line or a curve, and the verification processing effect comprises at least one of a light spot size, a light spot action intensity, a crack state and a crack direction; the verification module is further configured to:

the first adjustment module is further configured to:

and adjusting the position of the incident light corresponding to the optical path to be measured according to the uniformity so as to adjust the first concentricity between the optical path to be measured and the cutter and enable the optical path to be measured to be positioned on the central optical axis of the cutter.

Illustratively, the first adjustment module is further configured to:

Illustratively, the follower comprises a position-fixing assembly, a rotating motor and a spot-adjusting module, the rotating motor and the spot-adjusting module being mounted on the position-fixing assembly; the second emergent light state comprises at least one of spot brightness, spot uniformity and offset of a spot around a central point of emergent light corresponding to the light path to be detected at a defocused position corresponding to the focal position of the light path to be detected; the second adjustment module is further configured to:

Illustratively, the second adjustment module is further configured to:

The optical path concentricity adjusting device provided by the application adopts the optical path concentricity adjusting method in the embodiment, and aims to accurately adjust the optical path concentricity. Compared with the conventional technology, the optical path concentricity adjusting device provided in the embodiment of the present application has the same beneficial effects as the optical path concentricity adjusting method provided in the above embodiment, and other technical features in the optical path concentricity adjusting device are the same as the features disclosed in the method of the above embodiment, and are not described in detail herein.

In addition, the embodiment of the application also provides an optical path concentricity adjustment device, which comprises: a memory, a processor, and a computer program stored on the memory and executable on the processor, which when executed by the processor, performs the steps of the optical path concentricity adjustment method as described above.

In addition, the embodiment of the application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program realizes the steps of the optical path concentricity adjustment method when being executed by a processor.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.

From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the conventional technology in the form of a software product stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) as described above, including several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method described in the embodiments of the present application.

The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the descriptions and drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the claims of the present application.

Claims

1. The method for adjusting the concentricity of the optical path is characterized by being applied to a laser processing system, wherein the laser processing system comprises a laser, a follower mechanism and a cutter, and the follower mechanism and the cutter are sequentially arranged along the emergent light direction of the laser, and the method comprises the following steps:

Controlling a laser to emit test laser to construct a light path to be tested;

2. The method of claim 1, wherein after the step of adjusting the second concentricity between the optical path under test and the follower based on the second outgoing light state, the method further comprises:

3. The optical path concentricity adjustment method according to claim 2, wherein the preset verification processing trajectory comprises at least one of a straight line or a curved line, and the verification processing effect comprises at least one of a spot size, a spot action intensity, a crack state, and a crack direction;

4. The method for adjusting concentricity of optical path according to claim 1, wherein the first outgoing light state comprises spot uniformity of outgoing light corresponding to the optical path to be measured at an out-of-focus position corresponding to the focal position of the optical path to be measured;

5. The method for adjusting concentricity of optical path according to claim 4, wherein the step of adjusting the position of the incident light of the optical path to be measured according to the spot uniformity comprises:

6. The optical path concentricity adjustment method according to claim 1, wherein the follower comprises a position fixing assembly, a rotating motor, and a spot adjustment module, the rotating motor and the spot adjustment module being mounted on the position fixing assembly;

7. The method for adjusting concentricity of optical path according to claim 6, wherein the step of adjusting the position of the incident light corresponding to the optical path to be measured according to at least one of the spot brightness, the spot uniformity, and the offset comprises:

8. An optical path concentricity adjustment device, comprising:

9. An optical path concentricity adjustment device, characterized in that the device comprises: a memory, a processor and a computer program stored on the memory and executable on the processor, the computer program being configured to implement the steps of the optical path concentricity adjustment method as claimed in any one of claims 1 to 7.

10. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, which when executed by a processor, implements the steps of the optical path concentricity adjustment method according to any one of claims 1 to 7.