CN117279984A - Substrate film and sheet for workpiece processing - Google Patents
Substrate film and sheet for workpiece processing Download PDFInfo
- Publication number
- CN117279984A CN117279984A CN202280032218.8A CN202280032218A CN117279984A CN 117279984 A CN117279984 A CN 117279984A CN 202280032218 A CN202280032218 A CN 202280032218A CN 117279984 A CN117279984 A CN 117279984A
- Authority
- CN
- China
- Prior art keywords
- polyester resin
- substrate film
- less
- sheet
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 238000012545 processing Methods 0.000 title claims description 90
- 229920001225 polyester resin Polymers 0.000 claims abstract description 79
- 239000004645 polyester resin Substances 0.000 claims abstract description 79
- 239000002216 antistatic agent Substances 0.000 claims abstract description 52
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- -1 alkali metal salts Chemical class 0.000 claims abstract description 47
- 150000002500 ions Chemical class 0.000 claims abstract description 36
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 150000002891 organic anions Chemical class 0.000 claims abstract description 15
- 150000002892 organic cations Chemical class 0.000 claims abstract description 15
- 150000003839 salts Chemical class 0.000 claims abstract description 15
- 230000004927 fusion Effects 0.000 claims abstract description 14
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 11
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000000113 differential scanning calorimetry Methods 0.000 claims abstract description 5
- 239000002585 base Substances 0.000 claims description 75
- 239000012790 adhesive layer Substances 0.000 claims description 47
- 239000010410 layer Substances 0.000 claims description 36
- 239000000178 monomer Substances 0.000 claims description 36
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- 239000000539 dimer Substances 0.000 claims description 15
- 150000002009 diols Chemical class 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 12
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 8
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 8
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 7
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- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- IWDFHWZHHOSSGR-UHFFFAOYSA-N 1-ethylimidazole Chemical compound CCN1C=CN=C1 IWDFHWZHHOSSGR-UHFFFAOYSA-N 0.000 claims description 4
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- 238000006471 dimerization reaction Methods 0.000 claims description 4
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- 238000004255 ion exchange chromatography Methods 0.000 claims description 4
- 229910001415 sodium ion Inorganic materials 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims description 3
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- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 3
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
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- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
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- 238000004132 cross linking Methods 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 2
- LNGAGQAGYITKCW-UHFFFAOYSA-N dimethyl cyclohexane-1,4-dicarboxylate Chemical compound COC(=O)C1CCC(C(=O)OC)CC1 LNGAGQAGYITKCW-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
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- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
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- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
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- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
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- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 230000000447 dimerizing effect Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 229940119177 germanium dioxide Drugs 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229940082328 manganese acetate tetrahydrate Drugs 0.000 description 1
- CESXSDZNZGSWSP-UHFFFAOYSA-L manganese(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Mn+2].CC([O-])=O.CC([O-])=O CESXSDZNZGSWSP-UHFFFAOYSA-L 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Abstract
A substrate film comprising a first resin layer containing a polyester resin having an alicyclic structure and having a heat of fusion of 2J/g or more as measured by differential scanning calorimetry at a heating rate of 20 ℃/min, and a polymeric antistatic agent containing a polymeric compound and an organic salt composed of an organic cation and an organic anion and substantially free of alkali metal salts and alkaline earth metal salts, wherein the substrate film has a surface resistivity of 1X 10 on at least one side 6 Omega/≡or more and 1×10 15 Ω/≡or less. The substrate film sufficiently suppresses the generation of cutting scraps, while having excellent dust adhesion preventing performance, and suppresses the generation of impurity ions.
Description
Technical Field
The present invention relates to a base film suitable for use as a base film for a workpiece processing sheet used for processing a workpiece such as a semiconductor wafer, and also relates to the workpiece processing sheet.
Background
Semiconductor wafers such as silicon and gallium arsenide, and various packages are manufactured in a large diameter state, cut (diced) into chips, peeled (picked up), and transferred to a mounting process as a subsequent process. At this time, a workpiece such as a semiconductor wafer is subjected to back grinding, dicing, cleaning, drying, expanding, picking up, mounting, and other processes in a state of being attached to an adhesive sheet (hereinafter, sometimes referred to as a "workpiece processing sheet") provided with a base film and an adhesive layer.
As one of the above-described cutting methods, there is a method of cutting a workpiece using a rotating circular blade (cutting blade). In this method, in order to ensure cutting of the workpiece, a part of the workpiece processing sheet to which the workpiece is attached is generally cut together with the workpiece.
When the workpiece is cut together with the workpiece processing sheet in this manner, the workpiece processing sheet may generate cutting chips formed of materials constituting the adhesive layer and the base film. In particular, such chips are generally generated near a wire slot (kerf) through which a circular blade in a chip or a workpiece processing chip obtained by cutting passes.
If the chip is sealed in a state where a large amount of chips are attached to the chip, the chips attached to the chip are decomposed by heat of the sealing, and the thermally decomposed product breaks the package or causes malfunction of the obtained device. Since it is difficult to remove the cutting chips by cleaning, the productivity of the cutting process is significantly lowered by the generation of the cutting chips. Therefore, when cutting is performed using a rotating circular blade, it is required to prevent the generation of cutting chips.
As a base film of a sheet for processing a workpiece, a base film having a polyester resin as one of materials is known (patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2006-152072
Disclosure of Invention
Technical problem to be solved by the invention
The inventors of the present application have found that the generation of the above-described chips can be effectively suppressed by using a base film made of one of predetermined polyester resins as a base film of a sheet for workpiece processing. On the other hand, the inventors of the present application found that such a base film made of a polyester resin is prone to adhesion of dust due to static electricity. In particular, it has been found that even when an antistatic agent is blended into a film for the purpose of preventing the adhesion of dust, sufficient dust adhesion preventing performance tends to be hardly obtained.
In addition, the substrate film blended with the antistatic agent has a problem in that impurity ions are eluted, and devices for processing wafers, chips, sheets for workpiece processing, and the like are adversely affected.
The present invention has been made in view of such a practical situation, and an object thereof is to: provided is a substrate film which has excellent dust adhesion preventing performance while sufficiently suppressing the generation of cutting scraps and which suppresses the generation of impurity ions; and a workpiece processing sheet capable of satisfactorily performing such a function.
Technical means for solving the technical problems
In order to achieve the above object, the present invention provides a substrate film comprising a first resin layer containing a polyester resin and a polymeric antistatic agent, wherein the polyester resin has an alicyclic structure and has a heat of fusion of 2J/g or more as measured by differential scanning calorimetry at a temperature rise rate of 20 ℃/min, the polymeric antistatic agent contains a polymeric compound and an organic salt composed of an organic cation and an organic anion, and is substantially free of alkali metal salts and alkaline earth metal salts, and the substrate film has a surface resistivity of 1×10 on at least one side 6 Omega/≡or more and 1×10 15 Ω/≡is below (invention 1).
The base film of the invention (invention 1) is formed of a material containing a polyester resin having an alicyclic structure and exhibiting the heat of fusion, and therefore, even when a workpiece processing sheet having the base film is used in cutting using a rotating circular blade, the generation of cutting chips can be favorably suppressed. In addition, since the surface resistivity of at least one surface of the base film is in the above range, static electricity can be suppressed when the workpiece processing sheet having the base film is used, and dust adhesion can be favorably suppressed. Further, since the first resin layer contains the above-described polymer antistatic agent as an antistatic agent, it is possible to suppress the generation of impurity ions while achieving excellent dust adhesion preventing performance.
In the above invention (invention 1), the polymer compound is preferably a polyether/polyolefin block polymer (invention 2).
In the above inventions (inventions 1 and 2), the organic cation is preferably an imidazolium cation, and the organic anion is preferably a sulfonate anion (invention 3).
In the above invention (invention 3), the organic cation is preferably 1-ethyl-1H-imidazole, and the organic anion is preferably dodecylbenzenesulfonic acid (invention 4).
In the above inventions (inventions 1 to 4), the content of the antistatic agent in the first resin layer is preferably 1 mass% or more and 50 mass% or less (invention 5).
In the above inventions (inventions 1 to 5), li in the base material film measured by ion chromatography is preferable + Ion, na + Ions and K + The total amount of ions is 0ppm to 20ppm (invention 6).
In the above inventions (inventions 1 to 6), the polyester resin preferably contains a dicarboxylic acid having the alicyclic structure as a monomer unit constituting the polyester resin (invention 7).
In the above inventions (inventions 1 to 7), the polyester resin preferably contains a diol having the alicyclic structure as a monomer unit constituting the polyester resin (invention 8).
In the above inventions (inventions 1 to 8), the number of carbon atoms constituting the ring in the alicyclic structure is preferably 6 or more and 14 or less (invention 9).
In the above inventions (inventions 1 to 9), the polyester resin preferably contains, as a monomer unit constituting the polyester resin, a dimer acid obtained by dimerizing an unsaturated fatty acid having 10 to 30 carbon atoms (invention 10).
In the above invention (invention 10), the ratio of the dimer acid as a monomer unit constituting the polyester resin to the total dicarboxylic acid as a monomer unit constituting the polyester resin is preferably 2 mol% or more and 25 mol% or less (invention 11).
In the above inventions (inventions 1 to 11), the thickness of the base film is preferably 20 μm or more and 600 μm or less (invention 12).
The present invention provides a sheet for workpiece processing, comprising the substrate films (inventions 1 to 12) and an adhesive layer (invention 13) laminated on one side of the substrate film.
In the above invention (invention 13), the workpiece processing sheet is preferably a dicing sheet (invention 14).
Effects of the invention
According to the base material film of the present invention, a workpiece processing sheet can be produced which sufficiently suppresses the generation of chips, has excellent dust adhesion preventing performance, and suppresses the generation of impurity ions. Further, the workpiece processing sheet of the present invention can sufficiently suppress the generation of chips, has excellent dust adhesion preventing performance, and suppresses the generation of impurity ions.
Detailed Description
Hereinafter, embodiments of the present invention will be described.
[ substrate film ]
The substrate film of the present embodiment includes a first resin layer containing a polyester resin and a polymeric antistatic agent. The polyester resin has an alicyclic structure, and has a heat of fusion of 2J/g or more as measured by differential scanning calorimetry at a heating rate of 20 ℃/min.
Since the base film of the present embodiment includes the first resin layer containing the polyester resin, when the workpiece processing sheet formed using the base film is used for cutting a workpiece using a rotating circular blade, the generation of cutting scraps can be favorably suppressed.
The polymer antistatic agent contains a polymer compound and an organic salt composed of an organic cation and an organic anion. On the other hand, the polymeric antistatic agent contains substantially no alkali metal salts or alkaline earth metal salts.
The substrate film of the present embodiment can achieve the surface resistivity described later by using the above-described polymer antistatic agent as an antistatic agent, and thus can favorably suppress adhesion of dust to the workpiece processing sheet. In particular, since the polymer type antistatic agent does not substantially contain alkali metal salts or alkaline earth metal salts, impurity ions generated from the substrate film of the present embodiment are suppressed, and contamination of wafers, chips, devices, and the like due to impurity ions is suppressed.
In the present specification, "substantially free of alkali metal salts and alkaline earth metal salts" means that the total content of alkali metal salts and alkaline earth metal salts in the polymeric antistatic agent is 0.0005 mass% or less, particularly 0 mass% (i.e., not containing them).
The substrate film of the present embodiment has a surface resistivity of 1×10 on at least one side 6 Omega/≡or more and 1×10 15 Ω/≡or less. Since the substrate film of the present embodiment has such a surface resistivity, the workpiece processing sheet formed using the substrate film is less likely to generate static electricity during storage and use, and adhesion of dust caused by static electricity to the workpiece processing sheet can be favorably suppressed.
The surface resistivity is preferably 5.0X10 from the viewpoint of effectively obtaining such a dust adhesion preventing performance 14 Omega/≡or less, particularly preferably 2.0X10 14 Ω/≡or less. The lower limit of the surface resistivity is not particularly limited, and may be, for example, 1×10 8 Ω/≡or more, particularly 1×10 7 Ω/≡or more. The details of the method for measuring the surface resistivity are described in the test examples section below.
The reason why the effect of suppressing the chips can be obtained as described above is presumed to be as follows. However, the following reasons are not excluded from the possibility of obtaining the above-described effects in addition to other reasons, and the possibility of obtaining the above-described effects for reasons other than the following reasons is not excluded.
First, it is presumed that when a cutting force is applied to a base material made of the polyester resin, the polyester resin is easily cut at the position of the ester bond. Further, the polyester resin of the present embodiment has the alicyclic structure as described above and exhibits the above heat of fusion, and therefore moderately has a structure (layered structure) in which a part of its polymer chain is regularly folded. Therefore, it is presumed that the polyester resin is easily cut at the position of the layered structure when a cutting force is applied. Thus, the polyester resin of the present embodiment is more likely to be cut at a specific position when a cutting force is applied than the resin used in the conventional base film.
Here, as a mechanism of generating cutting scraps from a base material of a dicing sheet, it is considered that the base material is softened by frictional heat generated at the time of dicing, and then, it is brought into contact with a rotating circular blade to apply a force to stretch a cut portion of the base material, whereby the cut portion of the base material is stretched and simultaneously shaved. In particular, the chips produced in this way mostly have a filiform morphology.
On the other hand, it is presumed that the substrate of the present embodiment is effectively cut in the vicinity of the ester bond and the layered structure before being stretched as described above, and as a result, the generation of cutting chips is suppressed.
The heat of fusion of the polyester resin measured by differential scanning calorimetry at a temperature rise rate of 20 ℃/min is preferably 5J/g or more, particularly preferably 10J/g or more, and further preferably 15J/g or more, from the viewpoint of more easily achieving the effect of suppressing the chips. On the other hand, the upper limit of the heat of fusion is not particularly limited, and may be, for example, 150J/g or less, or 100J/g or less, particularly 70J/g or less, further 50J/g or less, and particularly 30J/g or less. The details of the method for measuring the heat of fusion are described in the examples section below.
1. Materials of base film and the like
(1) Polyester resin
The specific composition of the polyester resin is not particularly limited as long as the conditions that the polyester resin has an alicyclic structure and exhibits the heat of fusion are satisfied.
The number of carbon atoms constituting the ring in the alicyclic structure of the polyester resin is preferably 6 or more, from the viewpoint of easily and satisfactorily obtaining the effect of suppressing the chips. The number of carbon atoms is preferably 14 or less, and particularly preferably 10 or less. Particularly preferably, the number of carbon atoms is 6. The alicyclic structure may be a single ring structure, a double ring structure composed of two rings, or three or more rings.
In addition, from the viewpoint of easily satisfying the two conditions, the polyester resin preferably contains a dicarboxylic acid having an alicyclic structure as a monomer unit constituting the polyester resin. From the same point of view, the polyester resin preferably contains a diol having an alicyclic structure as a monomer unit constituting the polyester resin. Although the polyester resin may contain only any one of the dicarboxylic acid and the diol, it is preferable that the polyester resin contains both of the dicarboxylic acid and the diol, since the above condition is more easily satisfied.
The structure of the dicarboxylic acid is not particularly limited as long as it has an alicyclic structure and two carboxyl groups at the same time. For example, the dicarboxylic acid may be a structure in which two carboxyl groups are bonded to an alicyclic structure, or may be a structure in which an alkyl group or the like is further interposed between such an alicyclic structure and the carboxyl groups. Preferable examples of such dicarboxylic acids include 1, 2-cyclohexanedicarboxylic acid, 1, 3-cyclohexanedicarboxylic acid, 1, 4-decalin-dicarboxylic acid, 1, 5-decalin-dicarboxylic acid, 2, 6-decalin-dicarboxylic acid, and 2, 7-decalin-dicarboxylic acid, and among them, 1, 4-cyclohexanedicarboxylic acid is preferably used. These dicarboxylic acids may be derivatives of alkyl esters and the like. Examples of such alkyl ester derivatives include alkyl esters having 1 to 10 carbon atoms. More specific examples thereof include dimethyl ester and diethyl ester, and dimethyl ester is particularly preferable.
When the polyester resin of the present embodiment contains a dicarboxylic acid having an alicyclic structure as a monomer unit constituting the same, the ratio of the dicarboxylic acid monomer to the total monomer units constituting the polyester resin is preferably 20 mol% or more, more preferably 25 mol% or more, particularly preferably 30 mol% or more, and further preferably 35 mol% or more. The proportion is preferably 60 mol% or less, more preferably 55 mol% or less, particularly preferably 50 mol% or less, and further preferably 45 mol% or less. When the ratio is within these ranges, the polyester resin tends to exhibit the heat of fusion, and as a result, the workpiece processing sheet obtained using the base film of the present embodiment tends to achieve a more excellent effect of suppressing the chips.
Further, when the polyester resin of the present embodiment contains a dicarboxylic acid having an alicyclic structure as a monomer unit constituting the same, the ratio of the dicarboxylic acid having an alicyclic structure to the entire dicarboxylic acid having a ring structure constituting the polyester resin is preferably 60% or more, more preferably 70% or more, particularly preferably 80% or more, and further preferably 90% or more. When the above ratio is 60% or more, the workpiece processing sheet obtained by using the base film of the present embodiment easily achieves a more excellent effect of suppressing chipping. The upper limit of the ratio is not particularly limited, and may be, for example, 100% or less. The dicarboxylic acid having a ring structure includes dicarboxylic acids having an aromatic ring structure, and the like, in addition to dicarboxylic acids having an alicyclic structure.
The structure of the diol is not particularly limited as long as it has an alicyclic structure and two hydroxyl groups at the same time. For example, the diol may have a structure in which two hydroxyl groups are bonded to an alicyclic structure, or may have a structure in which an alkyl group is further interposed between such an alicyclic structure and a hydroxyl group. Preferable examples of such diols include 1, 2-cyclohexanediol (particularly 1, 2-cyclohexanedimethanol), 1, 3-cyclohexanediol (particularly 1, 3-cyclohexanedimethanol), 1, 4-cyclohexanediol (particularly 1, 4-cyclohexanedimethanol), and 2, 2-bis- (4-hydroxycyclohexyl) -propane, and among them, 1, 4-cyclohexanedimethanol is preferably used.
When the polyester resin of the present embodiment contains a diol having an alicyclic structure as a monomer unit constituting the diol, the proportion of the diol monomer to the total monomer units constituting the polyester resin is preferably 35 mol% or more, particularly preferably 40 mol% or more, and further preferably 45 mol% or more. The proportion is preferably 65 mol% or less, particularly preferably 60 mol% or less, and further preferably 55 mol% or less. When the ratio is within these ranges, the polyester resin tends to exhibit the heat of fusion, and as a result, the workpiece processing sheet obtained using the base film of the present embodiment tends to achieve a more excellent effect of suppressing the chips.
From the viewpoint that the base material easily has a desired flexibility, the polyester resin of the present embodiment preferably further contains a dimer acid obtained by dimerization of an unsaturated fatty acid as a monomer unit constituting the polyester resin. The number of carbon atoms of the unsaturated fatty acid is preferably 10 or more, particularly preferably 15 or more. The number of carbon atoms is preferably 30 or less, and particularly preferably 25 or less. Examples of such dimer acids include dicarboxylic acids having 36 carbon atoms obtained by dimerization of unsaturated fatty acids having 18 carbon atoms such as oleic acid and linoleic acid; and dicarboxylic acids having 44 carbon atoms obtained by dimerization of an unsaturated fatty acid having 22 carbon atoms such as erucic acid. In addition, when the dimer acid is obtained, a small amount of the trimer acid obtained by trimerizing the unsaturated fatty acid may be produced. The polyester resin of the present embodiment may contain such a trimer acid together with the above dimer acid.
When the polyester resin of the present embodiment contains the above dimer acid as a monomer unit constituting the dimer acid, the proportion of the dimer acid to all dicarboxylic acid units constituting the polyester resin is preferably 2 mol% or more, particularly preferably 5 mol% or more, and further preferably 10 mol% or more. The proportion is preferably 25 mol% or less, particularly preferably 23 mol% or less, and further preferably 20 mol% or less. When the ratio is within these ranges, the polyester resin easily has desired flexibility, and as a result, the work processing sheet obtained using the base film of the present embodiment can also achieve excellent expandability and pickup.
The polyester resin of the present embodiment may contain monomers other than the dicarboxylic acid, the diol, and the dimer acid as monomer units constituting the same. Examples of such monomers include aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacic acid; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid, 2, 6-naphthalene dicarboxylic acid, 1, 4-naphthalene dicarboxylic acid, and 4,4' -biphenyl dicarboxylic acid. Further, a diol component other than the diol having an alicyclic structure may be contained. For example, ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, octylene glycol, decylene glycol; ethylene oxide adducts such as bisphenol a and bisphenol S; trimethylolpropane, and the like.
However, from the viewpoint of easily realizing an excellent effect of suppressing cutting chips, it is preferable that the polyester resin of the present embodiment contains more monomer having an alicyclic structure (dicarboxylic acid having an alicyclic structure, diol having an alicyclic structure described above) than monomer having an aromatic ring structure. In particular, the molar ratio of the monomer unit having an aromatic ring structure to the monomer unit having an alicyclic structure in the monomer unit constituting the polyester resin of the present embodiment is preferably less than 1, more preferably 0.5 or less, more preferably 0.2 or less, more preferably 0.1 or less, more preferably 0.05 or less, more preferably 0.03 or less, more preferably 0.01 or less, particularly preferably 0.005 or less, further preferably 0.001 or less, and most preferably 0.
The method for producing the polyester resin of the present embodiment is not particularly limited, and the polyester resin can be obtained by polymerizing the above monomer components using a known catalyst.
The proportion of the polyester resin to the total components constituting the base material of the present embodiment is preferably 50% or more, particularly preferably 60% or more, and further preferably 70% or more. When the above ratio is 50% or more, the workpiece processing sheet obtained by using the base film of the present embodiment easily achieves a more excellent effect of suppressing chipping. The upper limit of the ratio is not particularly limited, and may be, for example, 100% or less.
(2) Polymer type antistatic agent
As described above, the polymeric antistatic agent of the present embodiment contains the polymeric compound and the organic salt composed of the organic cation and the organic anion, and is substantially free of the alkali metal salt and the alkaline earth metal salt. The polymer-based antistatic agent of the present embodiment is not particularly limited, and various polymer-based antistatic agents can be used as long as they satisfy these conditions.
The polymer compound is a compound having at least two or more repeating units. The weight average molecular weight of the polymer compound is preferably 300 or more, and particularly preferably 1000 or more. The weight average molecular weight is preferably 100000 or less, particularly preferably 75000 or less, and further preferably 50000 or less. The weight average molecular weight in the present specification is a value in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC).
The polymer compound is preferably a polymer containing at least one of a polyether segment and a polyolefin segment, from the viewpoint of easily exhibiting excellent antistatic properties. Although these segments may be randomly arranged in the polymer compound, it is preferable to arrange them in a block form in view of the ease of developing excellent antistatic properties.
Examples of the polyether segment include polyalkylene glycols such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polyhexamethylene glycol; polyoxyalkylene, polyalkylene ether glycol, and the like.
Further, as examples of the above polyolefin segment, there are homopolymers of an alpha-olefin having 2 to 10 carbon atoms or copolymers of at least one alpha-olefin with at least one other copolymerizable monomer. Examples of the α -olefin include ethylene, propylene, 1-butene, 2-methylpropene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, and 1-octene.
Among the polymeric antistatic agents of the present embodiment, polyether/polyolefin block polymers are particularly preferably used as the above-mentioned polymeric compounds. By using the polymer compound, the generation of impurity ions can be easily and well suppressed while exhibiting excellent antistatic properties.
The organic cations and organic anions constituting the organic salt of the present embodiment are not particularly limited as long as they are each formed by ionizing an organic compound. Examples of the organic cation include organic cations derived from at least one of imidazolium cations, pyridinium cations, pyrrolidinium cations, ammonium cations, sulfonium cations, phosphonium cations, and the like. Further, examples of the organic anions include linear alkylbenzenesulfonic acid and sulfonate anions (RSO) 3- ) Carboxylate anions (RCOO) - ) Alkoxide or phenoxide anions (RO) - ) Organic imide anions (R) 2 N - ) Methide (R) 3 C - ) Anionic, organoborates (R) 4 B - ) An organic anion of at least one of anions and the like.
As the organic salt of the present embodiment, particularly preferably an organic salt composed of an organic cation derived from an imidazolium cation and an organic anion derived from a sulfonate anion, more preferably an organic salt composed of an organic cation derived from 1-ethyl-1H-imidazole and an organic anion derived from dodecylbenzenesulfonic acid, from the viewpoint of exhibiting excellent antistatic properties and simultaneously easily suppressing the generation of impurity ions.
The alkali metal salt refers to a salt having an alkali metal such as lithium, sodium, potassium, or the like as a cationic component. The alkaline earth metal salt is a salt containing an alkaline earth metal such as magnesium or calcium as a cationic component. The polymeric antistatic agent of the present embodiment does not substantially contain these alkali metal salts and alkaline earth metal salts, but the content thereof is as described above.
The 5% weight reduction temperature of the polymeric antistatic agent of the present embodiment in the atmosphere is preferably 200℃or higher, and particularly preferably 250℃or higher. By setting the weight reduction temperature to at least 200 ℃, the polymer antistatic agent is less likely to decompose and is likely to exhibit sufficient dust adhesion preventing performance even when heated during kneading and film formation of the material of the base film. The upper limit of the 5% weight reduction temperature is not particularly limited, and may be 1000 ℃ or lower, particularly 900 ℃ or lower, and further 700 ℃ or lower, for example.
The 5% weight loss temperature of the polymeric antistatic agent of the present embodiment in a nitrogen atmosphere is preferably 250℃or higher, particularly preferably 270℃or higher, and further preferably 300℃or higher. By setting the weight reduction temperature to not less than 250 ℃, the polymer antistatic agent is less likely to decompose and is likely to exhibit sufficient dust adhesion preventing performance even when heated during kneading and film formation of the material of the base film. The upper limit of the 5% weight reduction temperature is not particularly limited, and may be 1000 ℃ or lower, particularly 900 ℃ or lower, and further 700 ℃ or lower, for example.
The details of the method for measuring the 5% weight reduction temperature in the atmosphere and in the nitrogen atmosphere are described in the examples described below.
In the base film of the present embodiment, the content of the polymeric antistatic agent in the first resin layer is preferably 1% by mass or more, more preferably 3% by mass or more, particularly preferably 5% by mass or more, and further preferably 10% by mass or more. When the content of the polymer-type antistatic agent is 1 mass% or more, the workpiece processing sheet formed by using the base film of the present embodiment can easily achieve good dust adhesion preventing performance. The content of the antistatic agent in the first resin layer is preferably 50 mass% or less, particularly preferably 45 mass% or less, and further preferably 40 mass% or less. When the content of the polymer-based antistatic agent is 50 mass% or less, the workpiece processing sheet formed using the base film of the present embodiment can easily exhibit favorable mechanical properties, can easily exhibit a sufficient effect of suppressing chipping, and can easily and effectively suppress the generation of impurity ions.
(3) Other ingredients
The first resin layer of the present embodiment may contain other components than the polyester resin and the polymeric antistatic agent. In particular, the material may contain a component of a base film used for a general workpiece processing sheet.
Examples of such components include various additives such as flame retardants, plasticizers, lubricants, antioxidants, colorants, infrared absorbers, ultraviolet absorbers, and ion capturing agents. The content of these additives is not particularly limited, but is preferably set within a range where the base film functions as desired.
(4) Construction of substrate film
The layer structure of the base film of the present embodiment may be a single layer or a plurality of layers as long as the first resin layer is formed of a material containing the polyester resin and the polymeric antistatic agent. From the viewpoint of reducing the manufacturing cost, the base film of the present embodiment is preferably a single layer (polyester resin layer alone).
On the other hand, in the case of a plurality of layers, a plurality of first resin layers may be laminated, or the first resin layers and layers other than the first resin layers may be laminated. In this case, the effect of suppressing the chips by the polyester resin layer and the desired effect by the other layers can be achieved at the same time.
In addition, the surface of the laminated adhesive layer of the base film may be subjected to surface treatments such as primer treatment, corona treatment, and plasma treatment to improve adhesion to the adhesive layer.
2. Thickness of base film, etc
The thickness of the base film of the present embodiment is preferably 20 μm or more, particularly preferably 40 μm or more, and further preferably 60 μm or more. The thickness of the base film is preferably 600 μm or less, particularly preferably 300 μm or less, and further preferably 200 μm or less. By setting the thickness of the base film to 20 μm or more, the workpiece processing sheet is easily provided with appropriate strength, and the workpiece fixed to the workpiece processing sheet can be easily supported. As a result, occurrence of chipping (chipping) during dicing can be effectively suppressed. In addition, by making the thickness of the base film 600 μm or less, the base film has more excellent workability.
In the substrate film of the present embodiment, li in the substrate film measured by ion chromatography + Ion, na + Ions and K + The total amount of ions is preferably 20ppm or less, particularly preferably 15ppm or lessMore preferably 10ppm or less. In the base film of the present embodiment, the total amount of the ions can be suppressed to a low level of 20ppm or less by including the polymeric antistatic agent in the first resin layer. Further, by setting the total amount of ions contained in the wafer processing sheet to be within this range, contamination of wafers, chips, devices, and the like due to impurity ions can be easily and effectively suppressed when the wafer processing sheet is used. The lower limit of the total amount is not particularly limited, and may be, for example, 0ppm or more, or 0.1ppm or more. The details of the method for measuring the ions are described in the test examples described below.
3. Method for producing base material film
The method for producing the base film of the present embodiment is not particularly limited as long as a material containing the polyester resin and the polymeric antistatic agent is used, and for example, a melt extrusion method such as a T-die method or a circular die method can be used; a calendaring method; dry, wet, and other solution methods. Among them, the melt extrusion method or the calendaring method is preferable from the viewpoint of efficiently producing a substrate.
When a base film made of a single layer is produced by a melt extrusion method, the material of the base (the material containing the polyester resin) is kneaded, and the obtained kneaded product is directly formed into a film by using a known extruder, or the obtained kneaded product is first formed into pellets and then formed into a film by using a known extruder.
In addition, when a base film made of a plurality of layers is produced by a melt extrusion method, the components constituting each layer are kneaded separately, and the obtained kneaded product is directly extruded from the known extruder to simultaneously form a film, or the obtained kneaded product is first formed into pellets and then extruded from the known extruder to simultaneously form a film.
When the base film is a multilayer film, a coating liquid containing a material containing the polyester resin and the polymer type antistatic agent may be applied to one surface of a specific layer formed in advance in a film shape, and dried or cured to form the first resin layer. Thus, a base film having a specific layer and a first resin layer can be obtained.
[ sheet for workpiece processing ]
The workpiece processing sheet of the present embodiment includes the base film and an adhesive layer laminated on one side of the base film.
1. Construction of sheet for workpiece processing
The following describes the structure of the member constituting the workpiece processing sheet of the present embodiment except the base film.
(1) Adhesive layer
The adhesive constituting the adhesive layer is not particularly limited as long as it can exert a sufficient adhesive force to an adherend (in particular, an adhesive force to a workpiece sufficient for processing a workpiece). Examples of the adhesive constituting the adhesive layer include acrylic adhesives, rubber adhesives, silicone adhesives, urethane adhesives, polyester adhesives, and polyvinyl ether adhesives. Among them, acrylic adhesives are preferred in view of the ease of exhibiting the required adhesive force.
The adhesive constituting the adhesive layer of the present embodiment may be an adhesive having no active energy ray curability, but is preferably an adhesive having active energy ray curability (hereinafter sometimes referred to as "active energy ray curable adhesive"). By forming the adhesive layer from an active energy ray-curable adhesive, the adhesive layer can be cured by irradiation with active energy rays, and the adhesion of the workpiece processing sheet to the adherend can be easily reduced. In particular, the workpiece after processing can be easily separated from the workpiece processing sheet by irradiation with active energy rays.
The active energy ray-curable adhesive constituting the adhesive layer may contain a polymer having active energy ray-curability as a main component, or may contain a mixture of an inactive energy ray-curable polymer (a polymer having no active energy ray-curability) and a monomer and/or oligomer having at least one or more active energy ray-curable groups as a main component.
The polymer having active energy ray curability is preferably a (meth) acrylate polymer (hereinafter, sometimes referred to as "active energy ray curable polymer") having an active energy ray curable functional group (active energy ray curable group) introduced into a side chain. The active energy ray-curable polymer is preferably a polymer obtained by reacting an acrylic copolymer having a functional group-containing monomer unit with an unsaturated group-containing compound having a functional group bonded to the functional group. In the present specification, (meth) acrylic acid refers to both acrylic acid and methacrylic acid. Other similar terms are also the same. Further, "polymer" also includes the concept of "copolymer".
The weight average molecular weight of the active energy ray-curable polymer is preferably 1 ten thousand or more, particularly preferably 15 ten thousand or more, and further preferably 20 ten thousand or more. The weight average molecular weight is preferably 250 ten thousand or less, particularly preferably 200 ten thousand or more, and further preferably 150 ten thousand or less. The weight average molecular weight (Mw) in the present specification is a value in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC).
On the other hand, when the active energy ray-curable adhesive contains a mixture of an inactive energy ray-curable polymer component and a monomer and/or oligomer having at least one active energy ray-curable group as a main component, the above-mentioned acrylic copolymer before reaction with the unsaturated group-containing compound can be used as the inactive energy ray-curable polymer component. Further, as the active energy ray-curable monomer and/or oligomer, for example, an ester of a polyol and (meth) acrylic acid or the like can be used.
The weight average molecular weight of the acrylic polymer as the inactive energy ray-curable polymer component is preferably 1 ten thousand or more, particularly preferably 15 ten thousand or more, and further preferably 20 ten thousand or more. The weight average molecular weight is preferably 250 ten thousand or less, particularly preferably 200 ten thousand or more, and further preferably 150 ten thousand or less.
When ultraviolet rays are used as active energy rays for curing the active energy ray-curable adhesive, a photopolymerization initiator is preferably added to the adhesive. The adhesive may be added with an inactive energy ray-curable polymer component, an oligomer component, a crosslinking agent, or the like.
The thickness of the adhesive layer in this embodiment is preferably 1 μm or more, particularly preferably 2 μm or more, and further preferably 3 μm or more. The thickness of the adhesive layer is preferably 50 μm or less, particularly preferably 40 μm or less, and further preferably 30 μm or less. The sheet for workpiece processing of the present embodiment can easily exhibit the required tackiness by making the thickness of the adhesive layer 1 μm or more. In addition, when the thickness of the adhesive layer is 50 μm or less, the adherend is easily separated from the cured adhesive layer.
(2) Stripping sheet
The work processing sheet of the present embodiment may be formed by laminating a release sheet on a surface of the adhesive layer opposite to the base film (hereinafter, sometimes referred to as "adhesive surface") for the purpose of protecting the surface until the surface is attached to an adherend.
The release sheet may be any one of the above-described release sheets, and a release sheet obtained by peeling a plastic film using a peeling agent or the like may be exemplified. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefin films such as polypropylene and polyethylene. As the release agent, silicones, fluorides, long-chain alkyl groups, and the like can be used, and among them, silicones which are inexpensive and can obtain stable performance are preferable.
The thickness of the release sheet is not particularly limited, and may be, for example, 20 μm or more and 250 μm or less.
(3) Others
The work processing sheet of the present embodiment may be configured such that an adhesive layer is laminated on a surface of the adhesive layer opposite to the base film. In this case, the workpiece processing sheet according to the present embodiment can be used as a dicing die. By attaching a work to a surface of the adhesive layer of the sheet opposite to the adhesive layer and cutting the work together with the adhesive layer, a chip having the singulated adhesive layer laminated can be obtained. The singulated adhesive layer can easily fix the chip to an object on which the chip is mounted. As a material constituting the adhesive layer, a material containing a thermoplastic resin and a thermosetting adhesive component having a low molecular weight, a material containing a thermosetting adhesive component in a B-stage (semi-cured state), or the like is preferably used.
In the work processing sheet of the present embodiment, a protective film forming layer may be laminated on the adhesive surface of the adhesive layer. In this case, the workpiece processing sheet according to the present embodiment can be used as a protective film forming and cutting sheet. By attaching a work to a surface of the sheet on the opposite side of the protective film forming layer from the adhesive layer and cutting the protective film forming layer together with the work, a chip in which the individualized protective film forming layers are laminated can be obtained. As the work, a work having a circuit formed on one surface is preferably used, and in this case, a protective film formation layer is generally laminated on a surface opposite to the surface on which the circuit is formed. By curing the singulated protective film forming layer at a specific timing, a protective film having sufficient durability can be formed on the chip. The protective film forming layer is preferably formed of an uncured curable adhesive.
2. Method for manufacturing sheet for processing workpiece
The method of manufacturing the workpiece processing sheet according to the present embodiment is not particularly limited. For example, it is preferable to form an adhesive layer on a release sheet, and then laminate one surface of a base film on the surface of the adhesive layer opposite to the release sheet, thereby obtaining a sheet for processing a workpiece.
The formation of the adhesive layer can be performed by a known method. For example, an adhesive composition for forming an adhesive layer is prepared, and a coating liquid further containing a solvent or a dispersion medium as required. The coating liquid is then applied to a releasable surface (hereinafter, sometimes referred to as "release surface") of the release sheet. Next, the obtained coating film is dried, whereby an adhesive layer can be formed.
The application of the coating liquid can be performed by a known method, and for example, bar coating, blade coating, roll coating, blade coating, die coating, gravure coating, and the like can be performed. The properties of the coating liquid are not particularly limited as long as the coating liquid can be applied, and the component for forming the adhesive layer may be contained as a solute or as a dispersion medium. The release sheet may be peeled off as a process material, or may protect the adhesive layer until it is attached to the adherend.
When the adhesive composition for forming the adhesive layer contains the crosslinking agent, it is preferable to form a crosslinked structure in the adhesive layer at a desired existing density by crosslinking the polymer component in the coating film with the crosslinking agent by changing the drying conditions (temperature, time, etc.) or by additionally providing a heat treatment. Further, in order to sufficiently carry out the crosslinking reaction, the adhesive layer may be bonded to the base film, and then cured by standing in an environment at 23 ℃ and a relative humidity of 50% for several days, for example.
3. Method for using sheet for working
The workpiece processing sheet according to the present embodiment can be used for processing a workpiece such as a semiconductor wafer. In this case, the work can be processed on the work processing sheet after the adhesive surface of the work processing sheet of the present embodiment is attached to the work. According to this processing, the workpiece processing sheet of the present embodiment can be used as a workpiece processing sheet such as a back grinding sheet, a dicing sheet, an expanding sheet, or a pickup sheet. Examples of the work include semiconductor members such as semiconductor wafers and semiconductor packages, and glass members such as glass plates.
The workpiece processing sheet of the present embodiment is configured by using the base film of the present embodiment, and therefore can achieve a good effect of suppressing the chips and an excellent performance of preventing dust adhesion. Therefore, the workpiece processing sheet according to the present embodiment is particularly suitable for use as a dicing sheet.
In addition, when the work piece processing sheet of the present embodiment is provided with the adhesive layer, the work piece processing sheet can be used as a dicing die-set sheet. Further, when the workpiece processing sheet of the present embodiment is provided with the protective film forming layer, the workpiece processing sheet can be used as a protective film forming and cutting sheet.
In the case where the adhesive layer in the sheet for processing a workpiece of the present embodiment is composed of the above active energy ray-curable adhesive, it is preferable to irradiate the following active energy rays at the time of use. That is, when the work is finished on the work processing sheet and the work after the processing is separated from the work processing sheet, the adhesive layer is preferably irradiated with active energy rays before the separation is performed. This allows the adhesive layer to cure, and the adhesion of the workpiece processing sheet to the processed workpiece is reduced well, thereby facilitating separation of the processed workpiece.
The embodiments described above are described for the convenience of understanding the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes and equivalents which fall within the technical scope of the present invention.
Examples
The present invention will be described in more detail with reference to examples, but the scope of the present invention is not limited to these examples.
Example 1
(1) Production of base film
Into a reactor equipped with a stirrer, a distillation tube and a pressure reducing device, 12.90kg of dimethyl 1, 4-cyclohexanedicarboxylate (trans isomer ratio 98%), 11.47kg of 1, 4-cyclohexanedimethanol, 0.3kg of ethylene glycol and 0.11kg of an ethylene glycol solution containing 10% manganese acetate tetrahydrate were charged, and after heating to 200℃under a nitrogen gas stream, the temperature was raised to 230℃over 1 hour. After maintaining this state for 2 hours and performing transesterification, 10.30kg of dimer acid derived from erucic acid (having 44 carbon atoms, manufactured by Croda company under the product name "PRIPOL 1004") and 0.11kg of an ethylene glycol solution containing 10% trimethyl phosphate were added to the system, followed by esterification at 230℃for 1 hour. Then, 300ppm of germanium dioxide as a polycondensation catalyst was added and stirred, and then the pressure was reduced to 133Pa or less for 1 hour, during which time the internal temperature was increased from 230℃to 270℃and the mixture was stirred under a high vacuum of 133Pa or less until the mixture became a specific viscosity, and a polycondensation reaction was carried out. The resulting polymer was extruded in water into strands and cut into pellets (pellet).
The pellets of the polyester resin thus obtained were dried at 85℃for 4 hours or more. Then, 90 parts by mass of the dried pellets were kneaded with 10 parts by mass of a polymeric antistatic agent (manufactured by SANYO CHEMICAL INDUSTRIES, LTD., product name "PLECTRON UC") as an antistatic agent, which was obtained by adding an organic salt composed of an organic cation derived from 1-ethyl-1H-imidazole and an organic anion derived from dodecylbenzenesulfonic acid to a polyether/polyolefin block polymer as a polymeric compound, using a biaxial kneader. The pellets thus obtained were placed in a hopper of a single-screw extruder provided with a T-die. Then, the pellets were extruded from a T-die in a melt-kneaded state at a barrel temperature of 220℃and a die temperature of 220℃and cooled by a cooling roll, whereby a sheet-like base film having a thickness of 80 μm was obtained.
The polyester resin contains about 50 mol% of 1, 4-cyclohexanedimethanol, about 40.5 mol% of dimethyl 1, 4-cyclohexanedicarboxylate, and 9.5 mol% of dimer acid derived from erucic acid as monomers constituting the resin. The proportion of the dimer acid to the total dicarboxylic acid units constituting the polyester resin was 19.1 mol%. Further, the heat of fusion of the polyester resin was measured by a method described later, and was found to be 20J/g.
The temperature of the polymer-type antistatic agent at which the weight of the antistatic agent was reduced by 5% was measured by the method described later, and was found to be 260℃in an atmosphere and 333℃in a nitrogen atmosphere.
(2) Preparation of adhesive composition
95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid were polymerized by a solution polymerization method to obtain a (meth) acrylate polymer. The weight average molecular weight (Mw) of the acrylic polymer was measured by the method described later, and found to be 50 ten thousand.
100 parts by mass (in terms of solid content, the same applies hereinafter) of the (meth) acrylate polymer obtained in the above manner, 120 parts by mass of the urethane acrylate oligomer (Mw: 8,000), 5 parts by mass of the isocyanate-based crosslinking agent (manufactured by TOSOH CORPORATION, product name
"Coronate L") and 4 parts by mass of a photopolymerization initiator (manufactured by IGM Resins B.V. Co., ltd., product name "Omnirad 184") were mixed to obtain an energy ray-curable adhesive composition.
(3) Formation of adhesive layer
The adhesive composition obtained in the step (2) was applied to a release-treated surface of a release sheet (manufactured by LINTEC Corporation under the product name "SP-PET 381031") obtained by subjecting the obtained coating film to drying at 100 ℃ for 1 minute, and the release sheet was a release-treated surface of a polyethylene terephthalate film having a thickness of 38 μm with a silicone-based release agent. Thus, a laminate having an adhesive layer with a thickness of 10 μm formed on the release surface of the release sheet was obtained.
(4) Production of sheet for workpiece processing
One surface of the base film obtained in the step (1) is bonded to the adhesive layer-side surface of the laminate obtained in the step (3), whereby a sheet for workpiece processing is obtained.
(5) Various measurement methods
The heat of fusion of the above polyester resin was measured in accordance with JIS K7121:2012 using a differential scanning calorimeter (DSC, manufactured by TA Instruments Co., ltd., product name "DSC Q2000"). Specifically, first, the temperature was raised from room temperature to 250℃at a heating rate of 20℃per minute, the temperature was kept at 250℃for 10 minutes, the temperature was lowered to-60℃at a cooling rate of 20℃per minute, and the temperature was kept at-60℃for 10 minutes. Then, the mixture was heated again to 250℃at a heating rate of 20℃per minute to obtain a DSC curve, and the melting point was measured.
Manufactured by using a differential heat-thermogravimetry simultaneous measurement device (Shimadzu Corporation, product name
"DTG-60"), the weight reduction temperature of the above-mentioned polymer type antistatic agent of 5% was measured in accordance with JIS K7120:1987. Specifically, the thermogravimetric measurement was performed by heating the mixture from 40 to 550℃at a gas inflow rate of 100 ml/min and a heating rate of 20℃per minute using atmospheric air or nitrogen gas as the inflow gas. From the obtained thermogravimetric curve, a temperature at which the mass was reduced by 5% with respect to the mass at a temperature of 100 ℃ (5% weight reduction temperature) was obtained.
The weight average molecular weight (Mw) is a weight average molecular weight in terms of standard polystyrene measured using Gel Permeation Chromatography (GPC) under the following conditions (GPC measurement).
< measurement Condition >
Measurement device: TOSOH CORPORATION, HLC-8320
GPC column (passing in the following order): TOSOH CORPORATION manufacture
TSK gel superH-H
TSK gel superHM-H
TSK gel superH2000
Measuring solvent: tetrahydrofuran (THF)
Measurement temperature: 40 DEG C
Examples 2 to 3
A piece for processing a workpiece was obtained in the same manner as in example 1, except that the blending amounts of the polyester resin and the antistatic agent were changed as shown in table 1.
Comparative example 1
A piece for processing a workpiece was obtained in the same manner AS in example 1, except that a polyether ester amide antistatic agent (manufactured by SANYO CHEMICAL INDUSTRIES, LTD., product name "PLECTRON AS") was used AS the antistatic agent, and the blending amounts of the polyester resin and the antistatic agent were changed AS shown in Table 1.
The polyether ester amide antistatic agent was measured at a 5% weight reduction temperature by a method described later, and as a result, the temperature was 340℃in an atmosphere and 358℃in a nitrogen atmosphere. The polyether ester amide antistatic agent is obtained by adding a metal salt to polyether ester amide.
Comparative example 2
A piece for processing a workpiece was obtained in the same manner as in example 1, except that a polyether ester amide block polymer type antistatic agent (manufactured by SANYO CHEMICAL INDUSTRIES, LTD., product name "PELESTAT N1200") was used as the antistatic agent, and the blending amounts of the polyester resin and the antistatic agent were changed as shown in table 1.
The polyether ester amide block polymer antistatic agent is formed of a polyether ester amide block polymer to which an organic salt or a metal salt is not added.
[ test example 1] (measurement of surface resistivity)
The surface resistivity of one surface of the base film produced in examples and comparative examples was measured. Specifically, the substrate film was cut into 100mm using a digital ultra high resistance/micro ammeter 5450 (manufactured by ADC CORPORATION) under conditions of an applied voltage of 100V and an applied time of 60 seconds
Surface resistivity (Ω/≡) of the sample having a size of 100 mm. The results are shown in Table 1.
Test example 2 (measurement of the amount of chip)
The release sheet was peeled from the workpiece processing sheet produced in examples and comparative examples, and the exposed surface of the exposed adhesive layer was attached to one surface of a silicon wafer having a thickness of 40 μm, and then a dicing ring frame was attached to the peripheral edge portion (a position not overlapping the silicon wafer) of the exposed surface of the workpiece processing sheet. Next, the silicon wafer was diced using a dicing machine (manufactured by DISCO Corporation, product name "DFD 6362"), under the following conditions.
Workpiece (adherend): silicon wafer
Workpiece size: diameter of 6 inches and thickness of 40 μm
Cutting blade: DISCO Corporation, product name "27HECC", diamond blade
Blade rotation speed: 50,000rpm
Cutting speed: 100 mm/sec
Depth of cut: cut to a depth of 20 μm from the substrate surface
Cut size: 8mm x 8mm
After dicing, chips obtained by singulating a silicon wafer were attached to a workpiece processing sheet, and the wafer was manufactured by using a digital microscope (KEYENCE CORPORATION, product name
"VHX-5000", multiplying power: 500 times) of the cutting chips generated in the kerf (cutting wire slot generated by the passage of the cutting blade) is counted. At this time, the number of chips present in the 3 slots located near the center in the longitudinal direction and the 3 slots located near the center in the transverse direction among the plurality of slots in the longitudinal direction and the transverse direction, respectively, was counted. The results of the counting are shown in table 1.
Test example 3 (evaluation of dust adhesion preventing Property)
Samples were obtained by cutting the pieces for processing workpieces manufactured in examples and comparative examples to A4 size. The sample was placed on a horizontal table with its substrate side surface upward, and then allowed to stand in an environment at a temperature of 23℃and a relative humidity of 50% for 1 hour. Then, the amount of dust adhering to the surface of the sample on the substrate side was visually checked. As a result, the sample of the example had significantly smaller amounts of dust than the sample of the comparative example. Therefore, the performance of the examples for preventing dust adhesion was judged as "good", and the comparative examples were judged as "bad". The results are also shown in Table 1.
[ test example 4] (measurement and evaluation of impurity ions)
The work pieces produced in examples and comparative examples were cut into strips (about 0.5 to 1cm×3 cm), and the peeled pieces were peeled off and removed to obtain measurement samples. 1g of the sample for measurement was immersed in deionized water in a container, and the container was sealed and boiled under pressure (2 atm) at 121℃for 24 hours. Li contained in the obtained extract water was measured by ion chromatography using an ion chromatograph (manufactured by Yokogawa Electric Corporation under the product name "High Performance Ion Chromatoanalyzer (high performance ion chromatograph) IC 500P") + Ion, na + Ions and K + The respective concentrations of the ions. In addition, the detection limit of the ion chromatograph was 0.01ppm. The results are shown in Table 1. When the detection limit is smaller than the detection limit, the value is referred to as "ND" in table 1. Table 1 also shows the total amount of the concentrations of the three ions.
Further, the total amount of the concentrations of the above three ions was referred to the following criteria, and impurity ions contained in the workpiece processing sheet were evaluated. The results are shown in Table 1.
Good: the total amount of the concentrations of the three ions is 20ppm or less.
Poor: the total of the concentrations of the three ions is more than 20ppm.
As is clear from table 1, the workpiece processing sheet manufactured in the examples effectively suppresses the generation of cutting chips at the time of cutting, and also favorably suppresses the adhesion of dust. Further, the concentration of impurity ions contained in the workpiece processing sheet manufactured in the examples is extremely low, and it is presumed that contamination of wafers, chips, devices, and the like with impurity ions can be well suppressed when the workpiece processing sheet is used.
Industrial applicability
The base film of the present invention can be suitably used as a base film constituting a workpiece processing sheet for processing a workpiece such as a semiconductor wafer.
Claims (14)
1. A substrate film comprising a first resin layer containing a polyester resin and a polymeric antistatic agent, characterized in that,
the polyester resin has an alicyclic structure and has a heat of fusion of 2J/g or more as measured by differential scanning calorimetry at a heating rate of 20 ℃/min,
the polymer antistatic agent contains a polymer compound and an organic salt composed of an organic cation and an organic anion, and is substantially free of alkali metal salts and alkaline earth metal salts,
at least one surface of the substrate film has a surface resistivity of 1×10 6 Omega/≡or more and 1×10 15 Ω/≡or less.
2. The substrate film according to claim 1, wherein the high molecular compound is a polyether/polyolefin block polymer.
3. The substrate film of claim 1, wherein,
the organic cation is derived from an imidazolium cation,
the organic anion is derived from a sulfonate anion.
4. The substrate film according to claim 3, wherein,
the organic cation is from 1-ethyl-1H-imidazole,
the organic anion is derived from dodecylbenzenesulfonic acid.
5. The base film according to claim 1, wherein the content of the antistatic agent in the first resin layer is 1 mass% or more and 50 mass% or less.
6. The substrate film according to claim 1, wherein Li in the substrate film is measured by ion chromatography + Ion, na + Ions and K + The total amount of ions is 0ppm to 20 ppm.
7. The base film according to claim 1, wherein the polyester resin contains a dicarboxylic acid having the alicyclic structure as a monomer unit constituting the polyester resin.
8. The base film according to claim 1, wherein the polyester resin contains a diol having the alicyclic structure as a monomer unit constituting the polyester resin.
9. The substrate film according to claim 1, wherein the number of carbon atoms constituting the ring in the alicyclic structure is 6 or more and 14 or less.
10. The substrate film of claim 1, wherein,
the polyester resin comprises a dimer acid obtained by dimerization of an unsaturated fatty acid as a monomer unit constituting the polyester resin,
the unsaturated fatty acid has 10 to 30 carbon atoms.
11. The base film according to claim 10, wherein a ratio of the dimer acid as a monomer unit constituting the polyester resin to all dicarboxylic acids as monomer units constituting the polyester resin is 2 mol% or more and 25 mol% or less.
12. The substrate film according to claim 1, wherein the thickness of the substrate film is 20 μm or more and 600 μm or less.
13. A workpiece processing sheet is characterized by comprising:
the substrate film of any one of claims 1-12; and (3) with
And an adhesive layer laminated on one side of the base film.
14. The workpiece processing sheet according to claim 13, wherein the workpiece processing sheet is a cut sheet.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-157432 | 2021-09-28 | ||
| JP2021157432 | 2021-09-28 | ||
| PCT/JP2022/035816 WO2023054299A1 (en) | 2021-09-28 | 2022-09-27 | Base material film and workpiece processing sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117279984A true CN117279984A (en) | 2023-12-22 |
Family
ID=85782683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280032218.8A Pending CN117279984A (en) | 2021-09-28 | 2022-09-27 | Substrate film and sheet for workpiece processing |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN117279984A (en) |
| TW (1) | TW202323052A (en) |
| WO (1) | WO2023054299A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005313450A (en) * | 2004-04-28 | 2005-11-10 | Mitsubishi Polyester Film Copp | Reflection preventing film |
| JP2006282798A (en) * | 2005-03-31 | 2006-10-19 | Ge Plastics Japan Ltd | Antistatic thermoplastic resin composition |
| KR101832297B1 (en) * | 2011-12-26 | 2018-02-26 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | Substrate for stealth dicing film, film for stealth dicing, and method for manufacturing electronic component |
| JP6522307B6 (en) * | 2014-10-01 | 2019-07-17 | 大和製罐株式会社 | Polyester resin composition |
| JP7222679B2 (en) * | 2018-11-30 | 2023-02-15 | ダイヤプラスフィルム株式会社 | Base film for semiconductor manufacturing process and adhesive film for dicing using the base film |
| WO2021200615A1 (en) * | 2020-03-30 | 2021-10-07 | リンテック株式会社 | Adhesive sheet |
| WO2021200616A1 (en) * | 2020-03-30 | 2021-10-07 | リンテック株式会社 | Adhesive sheet |
| CN116802224A (en) * | 2021-03-23 | 2023-09-22 | 琳得科株式会社 | Substrate film and sheet for workpiece processing |
-
2022
- 2022-09-27 TW TW111136498A patent/TW202323052A/en unknown
- 2022-09-27 WO PCT/JP2022/035816 patent/WO2023054299A1/en active Application Filing
- 2022-09-27 CN CN202280032218.8A patent/CN117279984A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023054299A1 (en) | 2023-04-06 |
| TW202323052A (en) | 2023-06-16 |
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