CN117279343B - Micro-module data center - Google Patents
Micro-module data center Download PDFInfo
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- CN117279343B CN117279343B CN202311559534.3A CN202311559534A CN117279343B CN 117279343 B CN117279343 B CN 117279343B CN 202311559534 A CN202311559534 A CN 202311559534A CN 117279343 B CN117279343 B CN 117279343B
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- 238000001816 cooling Methods 0.000 claims abstract description 30
- 230000008602 contraction Effects 0.000 claims abstract description 16
- 230000008859 change Effects 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims abstract description 9
- 238000000429 assembly Methods 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 6
- 238000004378 air conditioning Methods 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims 3
- 230000010485 coping Effects 0.000 abstract 1
- 239000003570 air Substances 0.000 description 53
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to the technical field of data center infrastructures, and discloses a micro-module data center, which comprises a plurality of frames and contraction assemblies; the frames are connected through a contraction assembly, and the contraction assembly stretches to control the frames to change the space shape; the cooling device is used for cooling and radiating the servers installed in the frame; this micromodule data center can carry out the change of space shape to a plurality of frames through the shrink subassembly operation that sets up, will be similar rectangular structure shape shrink into similar circular structure, and then realize the change to the whole frame of micromodule data center, the use of coping with different spaces, so operating personnel can carry out the change of space shape according to actual ground space shape to improve the commonality of equipment, need not to order, improve the timeliness that equipment used.
Description
Technical Field
The invention relates to the technical field of data center infrastructures, in particular to a micro-module data center.
Background
The modular data center/machine room model is a form of data center that can meet both rapid deployment and efficient cooling efficiency. The construction of various scale data centers can be realized rapidly through the modular assembly mode and the on-site module assembly. The cooling device avoids the backflow phenomenon and improves the cooling efficiency by a form that the cold channel and the hot channel are respectively or completely sealed.
When the existing micro-module data center is used for parallel connection of a server cabinet and connection of an indoor unit of an air conditioner and the server cabinet, a certain occupied area is too large, and more servers cannot be deployed in a limited space, so that when the positions of different installation areas are dealt with, the traditional micro-module data center needs to be opened up by a proper space to provide placement, the construction time is long in the mode, and meanwhile, corresponding dimensions may need to be ordered, so that timeliness is reduced, and the universality and applicability of the micro-module data center are finally reduced.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a micro-module data center, which solves the problems that the micro-module data center in the prior art has larger occupied area and can not be used by deploying more servers in a limited space in the actual installation and placement process, and finally has relatively low universality and applicability.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: a micro-module data center comprising a plurality of frames and a retraction assembly; the frames are connected through a contraction assembly, and the contraction assembly stretches to control the frames to change the space shape; the cooling device is used for cooling and radiating the servers installed in the frame; the cooling device comprises a heat dissipation assembly and a suction assembly; the heat dissipation component absorbs and cools the heat generated in the single frame at the upper position; the suction assembly absorbs and dissipates heat from the back sides of the plurality of frames.
Preferably, the frame comprises two frames, wherein the frames are provided with mounting grooves for placing servers, the frames are provided with locking covers, and the frames are trapezoid in structural shape.
Preferably, the shrinkage subassembly is including the shrinkage hydro-cylinder, the bottom of shrinkage hydro-cylinder is connected with the connecting seat, the connecting seat passes through the connecting piece and is connected with two frames, the output rotation of shrinkage hydro-cylinder is connected with connecting rod one, one end of connecting rod one is connected with connecting rod two, the other end of connecting rod one and the other end of connecting rod two are connected with two frames respectively.
Preferably, the frames are provided with eight, the shrinkage assemblies are provided with seven, and the seven shrinkage assemblies are respectively positioned between every two of the frames.
Preferably, a roller is installed at the bottom of the frame, and two rollers are installed on the roller.
Preferably, the heat dissipation assembly comprises a mounting frame, the mounting frame is mounted above the frame, a heat dissipation fan is mounted in the mounting frame, a plurality of flow holes are formed in the mounting frame, an air outlet pipe is arranged above the flow holes in a covering mode, and the heat dissipation assembly is located right above the server.
Preferably, the suction assembly comprises a first gear, a second gear is meshed with the surface of the first gear, the first gear is fixedly connected with a connecting rod through a shaft rod, a penetrating shaft is connected to the center of the second gear, the penetrating shaft is rotatably connected to a frame through a frame body, a support rod is connected to the frame body, and a fan is installed at the bottom of the support rod.
Preferably, the suction assembly comprises a first gear, a second gear is meshed with the surface of the first gear, the first gear is fixedly connected with a connecting rod through a shaft rod, a penetrating shaft is connected to the center of the second gear, the penetrating shaft is rotatably connected to a frame through a frame body, a support rod is connected to the frame body, and a fan is installed at the bottom of the support rod.
Preferably, the refrigerator comprises a water inlet pipe, a water pump is connected to one end of the water hose, the water pump is arranged in the frame, a containing cavity is formed in the frame, a refrigerator is mounted in the containing cavity, cooling water is arranged in the containing cavity, and the water hose is mounted on the roller through a binding belt.
(III) beneficial effects
Compared with the prior art, the invention provides a micro-module data center, which has the following beneficial effects:
1. this micromodule data center can carry out the change of space shape to a plurality of frames through the shrink subassembly operation that sets up, will shrink like rectangular structural shape into like circular structure, and then realizes the change to the whole frame of micromodule data center, handles the use in different spaces, if shrink into circular structure, its area can show the reduction, saves space. If the structure is unfolded to form a cuboid, the height of the structure can be reduced, but the actual occupied area can be increased, so that an operator can change the space shape according to the actual ground space shape, the universality of the equipment is improved, the ordering is not needed, and the using timeliness of the equipment is improved.
2. This micromodule data center can realize effectively absorbing the heat that the server of inside micromodule data center produced through the cooling device who sets up to utilize the air conditioning input subassembly can produce the cold air and encircle on a plurality of support bodies, perhaps be in the bottom of support body, the air conditioning can be used on a plurality of servers, realizes air conditioning contact cooling heat dissipation.
3. This micromodule data center can be when a plurality of support body conversion round structures through the suction subassembly that sets up, and the heat that data center produced will directly gather in central point put, and the suction subassembly that this moment can be with the heat effective follow-up drawing of from the middle part to the cooling effect of whole micromodule center has further been improved.
Drawings
FIG. 1 is a schematic diagram of the overall front structure of a micro-module data center according to the present invention;
FIG. 2 is a schematic diagram of the overall back structure of a micro-module data center according to the present invention;
FIG. 3 is a schematic diagram of the overall bottom view of a micro-module data center according to the present invention;
FIG. 4 is a schematic diagram of a converted morphology and structure of a shrink assembly and frame of a micro-modular data center according to the present invention;
FIG. 5 is a schematic view of a frame and retraction assembly of a micro-module data center according to the present invention;
FIG. 6 is a schematic diagram of a heat dissipating assembly of a micro-module data center according to the present invention;
FIG. 7 is a schematic diagram of a suction assembly of a micro-module data center according to the present invention;
FIG. 8 is a schematic diagram of an air duct connection structure of a micro-module data center according to the present invention;
fig. 9 is a schematic diagram of a cold air input assembly of a micro-module data center according to the present invention.
In the figure: 1. a frame; 101. a frame; 102. a locking cover; 103. a mounting groove; 2. a retraction assembly; 201. a shrinkage cylinder; 202. a connecting seat; 203. a connecting piece; 204. a first connecting rod; 205. a second connecting rod; 3. a heat dissipation assembly; 301. a heat radiation fan; 302. a flow hole; 303. an air outlet pipe; 304. a mounting frame; 4. a suction assembly; 401. a first gear; 402. a second gear; 403. a through shaft; 404. a support rod; 405. a blower; 5. a cold air input assembly; 501. a water flow hose; 502. a refrigerator; 503. a receiving chamber; 6. a roller; 7. a roller; 8. an air duct; 9. an air outlet; 10. and (5) a connector.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, a micro-module data center includes a plurality of frames 1, referring to fig. 5, the frames 1 include two frames 101, an installation groove 103 for placing servers is formed in each frame 101, an operator can tile the servers at the position of the installation groove 103, a lock cover 102 is installed on each frame 101, the frame 101 is trapezoidal in structure, transparent glass is arranged on the lock cover 102, the operator can directly see the working state of the servers through the transparent glass, meanwhile, the lock cover 102 is clamped on the frames 1, the fixing effect on the internal servers can be achieved, the trapezoidal structure mainly provides two sides for shrinking inclined surface spaces, interference during space form conversion cannot occur, and after the frames 101 between two sides shrink, the frames 101 are directly located at the inclined surface positions of the frames 101, as shown in fig. 4.
In this embodiment, referring to fig. 1 to 4, a plurality of frames 1 are connected by a contraction assembly 2, and the contraction assembly 2 stretches and contracts to control the plurality of frames 1 to change the spatial shape;
referring to fig. 5, the retraction assembly 2 includes a retraction cylinder 201, a connection base 202 is connected to the bottom of the retraction cylinder 201, the connection base 202 is connected to two frames 101 through a connection member 203, an output end of the retraction cylinder 201 is rotatably connected to a first connecting rod 204, one end of the first connecting rod 204 is connected to a second connecting rod 205, the other end of the first connecting rod 204 and the other end of the second connecting rod 205 are respectively connected to the two frames 101, the synchronous extension of the plurality of retraction cylinders 201 is controlled, the retraction cylinder 201 drives the first connecting rod 204 and the second connecting rod 205 to rotate in a V shape, the frames 101 between the two frames also rotate through the connection member 203, referring to fig. 4, until the frames 1 extend to a limit position, the frames 1 form a circular-like structure, and the area of the micro module data center can be maximally reduced by the polygonal circular structure. In the present embodiment, eight frames 1 are provided, but not limited to only eight, the actual number is set according to the size of different outer diameters, or limited according to the number of servers placed, seven shrinkage assemblies 2 are provided, and seven shrinkage assemblies 2 are respectively located between two of the plurality of frames 1. Because the extension and contraction of each two frames 1 are mainly controlled by the contraction oil cylinders 201 to realize curling and tiling, the arrangement of a plurality of contraction assemblies 2 can also improve the stability after the whole curling, and the instability in the space form transformation process caused by weight factors can be avoided.
Further, referring to fig. 3, a roller 6 is mounted at the bottom of the frame 1, and two rollers 7 are mounted on the roller 6. The roller 7 can push the whole frame 1 in a flat-laying mode, so that the whole frame can be conveniently transported and moved, otherwise, the whole structure is overlong or oversized, and the transfer of operators is inconvenient.
Further, the cooling device is used for cooling and radiating the server installed in the frame 1; the cooling device comprises a heat dissipation component 3 and a suction component 4;
referring to fig. 6, the heat dissipation assembly 3 absorbs and cools the heat generated in the single frame 1 at an upper position; the heat dissipation assembly 3 comprises a mounting frame 304, the mounting frame 304 is mounted above the frame 1, a heat dissipation fan 301 is mounted in the mounting frame 304, a plurality of flow holes 302 are formed in the mounting frame 304, an air outlet pipe 303 is arranged above the flow holes 302 in a covering mode, and the heat dissipation assembly 3 is located right above the server. The heat dissipation fan 301 is located right above the servers, so that heat generated by the servers moves upwards, the heat dissipation fan 301 sucks the heat, the sucked heat enters the inside of the air outlet pipe 303 through the plurality of flow holes 302 and is then discharged outwards, and the heat dissipation assembly 3 is arranged above each server, so that the single servers can be cooled and dissipated.
Further, referring to fig. 7, the suction assembly 4 absorbs and dissipates heat of the back surfaces of the plurality of frames 1. The suction assembly 4 is arranged to perform air flow suction type cooling on the tail of the server. The suction assembly 4 comprises a first gear 401, a second gear 402 is meshed with the surface of the first gear 401, the first gear 401 is fixedly connected with the first connecting rod 204 through a shaft rod, a penetrating shaft 403 is connected to the center of the second gear 402, the penetrating shaft 403 is rotatably connected to the frame 101 through a frame body, a support rod 404 is connected to the frame body, a fan 405 is installed at the bottom of the support rod 404, the first connecting rod 204 in one of the contraction assemblies 2 is driven to rotate along with the extension of the contraction cylinder 201, the first gear 401 is driven to rotate through the connection of the shaft rod, the penetrating shaft 403 is driven to rotate through the mutual meshing of bevel gears, the penetrating shaft 403 is driven to rotate the frame body, the fan 405 is driven to rotate 180 degrees through the connection of the support rod 404, the fan 405 is located at the center of a circular frame, and hot air flow located at the center is started by the fan 405 at the moment, heat is pumped and the heat is reserved, so that the heat dissipation effect of an internal data center is guaranteed.
In addition, referring to fig. 8, threaded holes are formed on two sides of the fan 405, air pipes 8 are disposed on two sides of the fan 405, a connector 10 is disposed at one end of the air pipe 8, threads are disposed on the connector 10, a plurality of air outlets 9 are formed on the air pipe 8, the air outlets 9 are respectively located at the rear of the mounting groove 103, the air pipe 8 is mounted on the frame 101, when the air pipe 8 is in a flat-laid state, an operator needs to rotate the connector 10 into the threaded holes of the fan 405, the whole air pipe 8 is also in a hose-like structure, at this time, the fan 405 is started, suction air flows are generated, the air outlets 9 formed on the two air pipes 8 provide channels for the air flows to enter, and when the fan 405 is started, the generated suction air flows are sucked through the positions of the air outlets 9 to suck hot air flows, so that the tail of the server is sucked, and the whole data center is cooled effectively.
It is noted that referring to fig. 9, the cold air input assembly 5 includes a water flow hose 501, one end of the water flow hose 501 is connected with a water pump, the water pump is disposed in the frame 101, a containing cavity 503 is provided in the frame 101, a refrigerator 502 is installed in the containing cavity 503, the semiconductor refrigerator has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight, and the like, and is reliable in operation, easy to operate, easy to adjust the cold amount, mainly using the cold end position to cool the cooling water in the containing cavity 503, while the hot end position is at the side of the frame 101, heat will be dissipated from the side, then discharged through absorption of the heat dissipation assembly 3, the cooling water is disposed in the containing cavity 503, the rivers hose 501 passes through the bandage and installs on roller bearing 6, the inside in one of them frame 1 is equipped with holding chamber 503, inside cooling water flow will pass through rivers hose 501, later the bottom tiling of S type structure, and inside rivers will cool off through inside refrigerator 502, the rivers after the cooling will pass through the inside that the water pump lets in rivers hose 501, later flow through outside, cool off ambient air, receive radiator fan 301' S absorption air flow influence this moment, the cold air flow of bottom will upwards absorb this moment, get into the inside of circulation hole 302, and at this in-process, the cold air flow will contact with the server, carry out the air current formula contact cooling to the surface of server, improve its cooling radiating effect.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
The working principle is that the whole micro-module data center is in a rectangular structure, if the space is enough, users can directly lay the micro-module data center in a use scene, if the space length is limited, synchronous extension of a plurality of shrinkage cylinders 201 can be controlled, the shrinkage cylinders 201 can drive a first connecting rod 204 and a second connecting rod 205 to rotate in a V shape, frames 101 between the two adjacent micro-module data center can also rotate through connecting pieces 203, please refer to fig. 4 until the micro-module data center extends to a limit position, a plurality of frames 1 form a similar circular structure, and the polygonal circular structure can maximally reduce the occupied area of the micro-module data center, and the stored equipment and the tiled structure are the same and only improve the overall height. And in terms of stability, the whole structure basically tends to be stable, because the whole circular structure is controlled by the contraction force of the contraction oil cylinder 201, and looseness is not generated as long as the contraction oil cylinder 201 does not release pressure. Under the tiling state, holistic heat dissipation cooling relies on radiator unit 3, radiator fan 301 is located the server directly over, so the heat that the server produced can shift up, and be sucked by radiator fan 301, get into the inside of outlet duct 303 through a plurality of circulation holes 302 after sucking, then outwards discharge, the top of every server all is provided with radiator unit, so can cool down the heat dissipation to the monomer server, and cold air input unit 5 mainly is used for producing cold air flow and acts on data center 'S server surface, carry out the air current contact cooling, improve the cooling effect, at first the inside in one of them frame 1 is equipped with holding chamber 503, inside cooling water flow will pass through water flow hose 501, then the bottom tiling of S type structure will be passed through to inside rivers will cool down through inside refrigerator 502, the rivers after the cooling will pass through the inside of water pump and flow hose 501, afterwards the outside will cool down, receive radiator fan 301' S absorption air flow influence, the cold air flow of bottom will upwards absorb this moment, and get into the inside of circulation hole 302, and in this, and here the air current will cool down the server contact cooling effect with the surface, it will cool down the surface contact cooling effect. The suction assembly 4 is used for performing air flow suction type cooling on the tail of the server, when the air flow suction type cooling device is in a flat-laid state, an operator needs to rotate the connector 10 into the threaded hole of the fan 405, the whole air pipe 8 is similar to a hose structure, the fan 405 is started at the moment, suction air flows are generated, the air outlets 9 formed in the two air pipes 8 are channels for providing air flow, and when the fan 405 is started, the generated suction air flows are sucked through the positions of the air outlets 9, so that tail hot air flows of the server are sucked, and the whole data center is cooled efficiently. If the frame 1 forms a circular structure, all the heat dissipation components 3 will be concentrated in the middle part of the circular structure, and the hot air flows will be concentrated in the middle part and not easy to be emitted, so that an operator is required to rotate and unscrew the connectors 10 from two sides of the fan 405 at this time, and release is realized, and at this time, along with the extension of the shrink cylinder 201, the first connecting rod 204 in one of the shrink components will be driven to rotate, the first gear 401 will be driven to rotate through the connection of the shaft rods, the through shaft 403 will be driven to rotate through the mutual engagement of the bevel gears, the through shaft 403 will drive the rotation of the frame body, and then the fan 405 is driven to rotate 180 degrees through the connection of the support rods 404, so that the fan 405 is positioned in the center position of the circular frame, and the hot air flow at this time is started by the fan 405, so that heat is extracted, and therefore the heat dissipation effect of the internal data center is ensured. The water flow hose 501 in the cold air input assembly 5 is also arranged around the outer surface of the circular frame 1 in a circular shape, and can synchronously realize the input of cold air, so that the cooling effect of the whole device still exists no matter in a flat state or in a circular structure state. The duct 8 can be bent and attached to the side of the frame 1 even in the circular configuration.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (8)
1. A micro-modular data center, comprising
A plurality of frames (1) and a retraction assembly (2);
a plurality of frames (1) are connected through a contraction assembly (2),
the retraction assembly (2) is retracted to control the plurality of frames (1) to change the spatial shape;
the cooling device is used for cooling and radiating the server installed in the frame (1);
the cooling device comprises a heat dissipation assembly (3) and a suction assembly (4);
the heat dissipation assembly (3) absorbs and cools the heat generated in the single frame (1) at the upper position;
the suction assembly (4) absorbs and dissipates heat on the back surfaces of the frames (1);
the frame (1) comprises two side frames (101);
the shrinkage subassembly (2) is including shrink hydro-cylinder (201), the bottom of shrink hydro-cylinder (201) is connected with connecting seat (202), connecting seat (202) are connected with two frames (101) through connecting piece (203), the output rotation of shrink hydro-cylinder (201) is connected with connecting rod one (204), the one end of connecting rod one (204) is connected with connecting rod two (205), the other end of connecting rod one (204) and the other end of connecting rod two (205) are connected with two frames (101) respectively, control the synchronous extension of a plurality of shrink hydro-cylinders (201), shrink hydro-cylinder (201) will drive connecting rod one (204) and connecting rod two (205) and be the V font and rotate, and frame (101) between two can also rotate through connecting piece (203).
2. A micro-modular data center as claimed in claim 1, wherein: the frame (101) is provided with a mounting groove (103) for placing a server, the frame (101) is provided with a locking cover (102), and the structural shape of the frame (101) is trapezoidal.
3. A micromodule data center according to claim 2, wherein: eight frames (1) are arranged, seven shrinkage assemblies (2) are arranged, and the seven shrinkage assemblies (2) are respectively arranged between every two of the frames (1).
4. A micro-modular data center as claimed in claim 1, wherein: the bottom of the frame (1) is provided with a rolling shaft (6), and the rolling shaft (6) is provided with two rolling wheels (7).
5. A micro-modular data center as claimed in claim 1, wherein: the heat dissipation assembly (3) comprises a mounting frame (304), the mounting frame (304) is mounted above the frame (1), a heat dissipation fan (301) is mounted inside the mounting frame (304), a plurality of circulation holes (302) are formed in the mounting frame (304), an air outlet pipe (303) is arranged above the circulation holes (302) in a covering mode, and the heat dissipation assembly (3) is located right above the server.
6. A micro-modular data center as claimed in claim 1, wherein: the suction assembly (4) comprises a first gear (401), a second gear (402) is meshed with the surface of the first gear (401), the first gear (401) is fixedly connected with a first connecting rod (204) through a shaft rod, a penetrating shaft (403) is connected to the center of the second gear (402), the penetrating shaft (403) is rotationally connected to the frame (101) through a frame body, a supporting rod (404) is connected to the frame body, and a fan (405) is installed at the bottom of the supporting rod (404).
7. A micromodule data center according to claim 6, wherein: screw holes are formed in two sides of the fan (405), air pipes (8) are arranged on two sides of the fan (405), connectors (10) are arranged at one ends of the air pipes (8), threads are arranged on the connectors (10), a plurality of air outlets (9) are formed in the air pipes (8), the air outlets (9) are respectively located behind the mounting grooves (103), and the air pipes (8) are mounted on the frame (101).
8. A micromodule data center according to claim 4, wherein: still including air conditioning input subassembly (5), air conditioning input subassembly (5) is including rivers hose (501), the one end of rivers hose (501) is connected with the water pump, the water pump sets up the inside at frame (101), holding chamber (503) have been seted up to the inside of frame (101), the internally mounted of holding chamber (503) has refrigerator (502), the inside of holding chamber (503) is provided with cooling water, rivers hose (501) are installed on roller bearing (6) through the bandage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311559534.3A CN117279343B (en) | 2023-11-22 | 2023-11-22 | Micro-module data center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311559534.3A CN117279343B (en) | 2023-11-22 | 2023-11-22 | Micro-module data center |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117279343A CN117279343A (en) | 2023-12-22 |
| CN117279343B true CN117279343B (en) | 2024-01-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311559534.3A Active CN117279343B (en) | 2023-11-22 | 2023-11-22 | Micro-module data center |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1724712A1 (en) * | 2005-05-11 | 2006-11-22 | Stmicroelectronics Sa | Micromodule, specifically for a smart card |
| WO2014059909A2 (en) * | 2012-10-15 | 2014-04-24 | 腾讯科技（深圳）有限公司 | Data center module and data center consisting of micro-modules |
| WO2016082625A1 (en) * | 2014-11-28 | 2016-06-02 | 中兴通讯股份有限公司 | Modularized data centre |
| CN114071904A (en) * | 2020-08-04 | 2022-02-18 | 维谛公司 | Data center flexible micro-module closed system |
| CN217563974U (en) * | 2022-04-14 | 2022-10-11 | 盛道（中国）电气有限公司 | Micromodule data center cooling arrangement |
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2023
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1724712A1 (en) * | 2005-05-11 | 2006-11-22 | Stmicroelectronics Sa | Micromodule, specifically for a smart card |
| WO2014059909A2 (en) * | 2012-10-15 | 2014-04-24 | 腾讯科技（深圳）有限公司 | Data center module and data center consisting of micro-modules |
| WO2016082625A1 (en) * | 2014-11-28 | 2016-06-02 | 中兴通讯股份有限公司 | Modularized data centre |
| CN114071904A (en) * | 2020-08-04 | 2022-02-18 | 维谛公司 | Data center flexible micro-module closed system |
| CN217563974U (en) * | 2022-04-14 | 2022-10-11 | 盛道（中国）电气有限公司 | Micromodule data center cooling arrangement |
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| CN117279343A (en) | 2023-12-22 |
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