CN217563974U - Micromodule data center cooling arrangement - Google Patents
Micromodule data center cooling arrangement Download PDFInfo
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- CN217563974U CN217563974U CN202220857149.1U CN202220857149U CN217563974U CN 217563974 U CN217563974 U CN 217563974U CN 202220857149 U CN202220857149 U CN 202220857149U CN 217563974 U CN217563974 U CN 217563974U
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- micromodule data
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Abstract
The utility model discloses a micromodule data center cooling arrangement, including the cabinet body and cooling subassembly, cabinet body left side is rotated and is provided with the cabinet door, and the below of cabinet door is provided with observation window for reduce micromodule data center ambient temperature cooling unit mount is in the internal portion of cabinet, cooling subassembly includes the installing frame, leads to water cavity, working shaft and delivery pipe, the inner wall of installing frame has been seted up and has been led to the water cavity, and leads to the water cavity intake department top and install the working shaft, the left side of working shaft is connected with the delivery pipe, and the end of delivery pipe is equipped with the feed tank. This micromodule data center cooling arrangement adopts the setting of mutually supporting between a plurality of subassemblies, not only can wrap up the refrigerated improvement to micromodule data center heat dissipation homogeneity to micromodule data center when carrying out the parcel to micromodule data center, can also improve cooling efficiency to supplementary cooling simultaneously, but also can be to the installation interval at free control micromodule data center.
Description
Technical Field
The utility model relates to a micromodule data center technical field specifically is a micromodule data center cooling arrangement.
Background
The micro-modular data center is a new generation of data center deployment form based on cloud computing, and in order to cope with the development trend of servers such as cloud computing, virtualization, centralization and high-density, the micro-modular data center adopts a modular design concept to reduce the coupling of infrastructure to a machine room environment to the greatest extent. The integrated subsystems such as power supply and distribution, refrigeration, equipment cabinet, air current containment, comprehensive wiring, moving ring monitoring and the like improve the overall operation efficiency of the data center, realize quick deployment, elastic expansion and green energy conservation, and the modularized data center can generate a large amount of heat during working and needs cooling equipment to cool the modularized data center.
The cooling device on the market has the defect of poor cooling effect, the traditional cooling device adopts air cooling to cool, a plurality of groups of fans can generate a large amount of noise when in operation, and the cooling effect is slow, so that the micromodule data center cooling device is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a micromodule data center cooling arrangement to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a micromodule data center cooling arrangement, includes the cabinet body and cooling subassembly, cabinet body left side rotation is provided with the cabinet door, and the below of cabinet door is provided with observation window for reduce micromodule data center ambient temperature cooling unit mount is in the internal portion of cabinet, the cooling subassembly includes the installing frame, leads to water cavity, working shaft and delivery pipe, the interior wall of installing frame has been seted up and has been led to the water cavity, and leads to the water cavity intake department top and install the working shaft, the left side of working shaft is connected with the delivery pipe, and the end of delivery pipe is equipped with the feed tank, the top and the cabinet body top of feed tank are fixed, the mounting groove has been seted up to the both sides of installing frame, and both sides flange about the inside of mounting groove, flange's front end is provided with mounting flange, and the mounting flange rear end is provided with the mounting panel, the inside of mounting panel is provided with the cooling and weaves the pipe, and weaves the cooling and passes through flange and leads to water cavity through connection.
Further, the inside radiator unit who is used for supplementary cooling that is provided with in mounting panel left side, radiator unit includes intake pipe, fixed plate, motor and flabellum, the inside right side of intake pipe is provided with the fixed plate perpendicularly, and the internally mounted of fixed plate has the motor, install the flabellum on the left end output shaft of motor.
Furthermore, a dust screen is arranged on the left side of the fixing plate, a fixing frame is arranged outside the dust screen, and the periphery of the left side of the fixing frame is fixed with the cabinet body.
Furthermore, bottom plates are arranged on two sides of the bottom of the mounting frame, and sliding grooves are formed in the bottom plates.
Furthermore, an I-shaped sliding block is arranged inside the sliding groove in a sliding mode, and a first mounting frame is installed at the top of the I-shaped sliding block.
Furthermore, fastening screws are arranged on two sides of the front end of the I-shaped sliding block and are parallel to the first mounting frame.
Furthermore, a second mounting frame is arranged at the top of the first mounting frame, and the whole second mounting frame is consistent with the structure of the first mounting frame.
The utility model provides a micromodule data center cooling arrangement possesses following beneficial effect: this micromodule data center cooling arrangement adopts the setting of mutually supporting between a plurality of subassemblies, not only can wrap up the refrigerated improvement to micromodule data center heat dissipation homogeneity when carrying out the micromodule data center, can also improve cooling efficiency to supplementary cooling simultaneously, but also can be to the installation interval at free control micromodule data center.
1. The utility model discloses a setting of cooling subassembly for in the working shaft sucked the coolant liquid of working shaft inside through the delivery pipe, the working shaft was filled its inside coolant liquid injection logical cavity inside, and the pipe is woven in the cooling of the inside through connection of logical cavity to the rethread logical water cavity, realizes that the coolant liquid encircles and cools down the micromodule data center of installing frame internally mounted.
2. The utility model discloses a radiator unit's setting for the fixed plate that the intake pipe inside set up fixes the position of motor, and the rethread motor drives fixed flabellum on the output shaft of left side and rotates, makes in the flabellum inhales the intake pipe with the wind in the dust screen outside, and blows to the cooling through the flabellum and weave the pipe, and rethread cooling is woven the pipe and is cooled down the back to wind, and is blown to the inside fixed micromodule data center of installing frame and cools down, thereby reaches improvement cooling efficiency purpose.
3. The utility model discloses a setting of bottom plate cooperation mounting bracket for the I shape slider that first mounting bracket bottom set up sets up the spout in that the bottom plate is inside to be removed, puts suitable position, and rethread fastening screw will be fixed the position of I shape slider, on being fixed in first mounting bracket and second mounting bracket with micromodule data center, accomplishes fixedly, thereby reaches the installation interval purpose of free control micromodule data center.
Drawings
Fig. 1 is a schematic view of an overall three-dimensional structure of a micro-module data center cooling device according to the present invention;
fig. 2 is a schematic structural view of a cooling assembly of a micro module data center cooling device according to the present invention;
fig. 3 is a schematic structural view of a heat dissipation assembly of a micro module data center cooling device according to the present invention;
fig. 4 is a schematic side view of a cooling braided tube of a micro-module data center cooling device according to the present invention;
fig. 5 is a schematic view of the connection structure between the i-shaped slider and the first mounting bracket of the cooling device of the micro module data center of the present invention.
In the figure: 1. a cabinet body; 2. a cabinet door; 3. an observation window; 4. a cooling assembly; 401. installing a frame; 402. a water cavity is communicated; 403. a water supply pump; 404. a water supply pipe; 5. a water supply tank; 6. mounting grooves; 7. a connecting flange; 8. installing a flange; 9. mounting a plate; 10. cooling the braided tube; 11. a heat dissipating component; 1101. an air inlet pipe; 1102. a fixing plate; 1103. a motor; 1104. a fan blade; 12. a dust screen; 13. a fixing frame; 14. a base plate; 15. a chute; 16. an I-shaped slider; 17. a first mounting bracket; 18. fastening screws; 19. a second mounting bracket.
Detailed Description
As shown in fig. 1-2, a micro module data center cooling device includes a cabinet 1 and a cooling module 4, a cabinet door 2 is rotatably disposed on the left side of the cabinet 1, an observation window 3 is disposed below the cabinet door 2, the cooling module 4 for reducing the temperature around the micro module data center is mounted inside the cabinet 1, the cooling module 4 includes a mounting frame 401, a water cavity 402, a water supply pump 403 and a water supply pipe 404, the inner wall of the mounting frame 401 is provided with the water cavity 402, the water supply pump 403 is mounted on the top of the water inlet of the water cavity 402, the left side of the water supply pump 403 is connected with the water supply pipe 404, the end of the water supply pipe 404 is provided with the water supply tank 5, the top of the water supply tank 5 is fixed to the top of the cabinet 1, mounting grooves 6 are formed on both sides of the mounting frame 401, flanges 7 are connected to the upper and lower sides of the inside of the mounting grooves 6, a mounting flange 8 is disposed at the front end of the mounting flange 7, a mounting plate 9 is disposed at the rear end of the mounting flange 8, a cooling woven pipe 10 is connected to the water supply tank 402 through the water supply pump 7, the water supply pump 403 is communicated to the water cavity 402, and the cooling module 402, and the water supply pump 402 is connected to fill the micro module.
Referring to fig. 3-4, a heat dissipation assembly 11 for assisting cooling is arranged inside the left side of the mounting plate 9, the heat dissipation assembly 11 includes an air inlet pipe 1101, a fixing plate 1102, a motor 1103 and fan blades 1104, a fixing plate 1102 is vertically arranged on the right side inside the air inlet pipe 1101, the motor 1103 is arranged inside the fixing plate 1102, the fan blades 1104 are arranged on a left output shaft of the motor 1103, a dust screen 12 is arranged on the left side of the fixing plate 1102, a fixing frame 13 is arranged outside the dust screen 12, the left periphery of the fixing frame 13 is fixed to the cabinet body 1, the fixing plate 1102 arranged inside the air inlet pipe 1101 fixes the position of the motor 1103, the fan blades 1104 fixed on the left output shaft are driven by the motor 1103 to rotate, so that the fan blades 1104 suck wind outside the dust screen 12 into the air inlet pipe 1101, and blow the wind toward the cooling braided tube 10 through the fan blades 1104, and blow the cooled wind toward a micromodule data center fixed inside the mounting frame 401 to achieve the purpose of improving cooling efficiency.
Referring to fig. 5, bottom plates 14 are disposed on two sides of the bottom of an installation frame 401, sliding grooves 15 are formed in the bottom plates 14, i-shaped sliders 16 are slidably disposed in the sliding grooves 15, a first installation frame 17 is installed on the top of the i-shaped sliders 16, fastening screws 18 are disposed on two sides of the front ends of the i-shaped sliders 16, the fastening screws 18 are parallel to the first installation frame 17, a second installation frame 19 is disposed on the top of the first installation frame 17, the whole second installation frame 19 is consistent with the first installation frame 17 in structure, the i-shaped sliders 16 disposed on the bottom of the first installation frame 17 are provided with the sliding grooves 15 in the bottom plates 14 to move and place at appropriate positions, the positions of the i-shaped sliders 16 are fixed through the fastening screws 18, a micromodule data center is fixed on the first installation frame 17 and the second installation frame 19, and fixation is completed, so that the installation interval of the micromodule data center is freely controlled.
In summary, when the cooling device for the micro module data center is used, firstly, the sliding groove 15 is formed in the bottom plate 14 through the i-shaped sliding block 16 arranged at the bottom of the first mounting frame 17 to move, the position is set to be a proper position, then the position of the i-shaped sliding block 16 is fixed through the fastening screw 18, the micro module data center is fixed on the first mounting frame 17 and the second mounting frame 19, fixing is completed, then cooling liquid in the water supply tank 5 is sucked into the water supply pump 403 through the water supply pipe 404 through the water supply pump 403, the water supply pump 403 injects the cooling liquid in the water supply tank into the water through cavity 402, then the water through cavity 402 fills the cooling weaving pipe 10 communicated with the inside of the water through cavity 402 through the water through cavity 402, cooling liquid is surrounded and cools the micro module data center arranged inside the mounting frame 401, then the position of the motor 1103 is fixed through the fixing plate 1102 arranged inside the 1101, the air inlet pipe 1103 drives the fan 1104 fixed on the left output shaft to rotate, so that air outside the dust screen 12 is sucked into the air inlet pipe 1104 and blown to the cooling weaving pipe 10, and the cooling efficiency of the micro module data center is improved, and the micro module data center is fixed through the air inlet pipe 1104.
Claims (7)
1. The utility model provides a micromodule data center cooling arrangement, includes the cabinet body (1) and cooling subassembly (4), a serial communication port, cabinet body (1) left side is rotated and is provided with cabinet door (2), and the below of cabinet door (2) is provided with observation window (3), is used for reducing micromodule data center ambient temperature cooling subassembly (4) are installed inside cabinet body (1), cooling subassembly (4) are including installing frame (401), logical water cavity (402), working shaft (403) and delivery pipe (404), logical water cavity (402) have been seted up to the inner wall of installing frame (401), and the department top of intaking of logical water cavity (402) installs working shaft (403), the left side of working shaft (403) is connected with delivery pipe (404), and the end of delivery pipe (404) is equipped with supply tank (5), the top and the cabinet body (1) top of supply tank (5) are fixed, mounting groove (6) have been seted up to the both sides of installing frame (401), and both sides flange (7) about the inside of mounting groove (6), the front end of connecting flange (7) is provided with mounting flange (8), and cooling flange (9) are provided with the back mounting panel (9) and weave mounting flange (10) and weave through mounting panel (10) and weave mounting flange (10) and weave mounting tube (10) and weave the interior flange (10) and weave mounting flange (7) and weave mounting panel (402) and weave mounting flange (10) and weave the through the cooling cavity (402) and weave mounting flange (7) and weave .
2. The micromodule data center cooling device according to claim 1, wherein a heat dissipation assembly (11) for assisting cooling is arranged inside the left side of the mounting plate (9), the heat dissipation assembly (11) comprises an air inlet pipe (1101), a fixing plate (1102), a motor (1103) and fan blades (1104), the fixing plate (1102) is vertically arranged on the right side inside the air inlet pipe (1101), the motor (1103) is arranged inside the fixing plate (1102), and the fan blades (1104) are arranged on an output shaft at the left end of the motor (1103).
3. The micromodule data center cooling device according to claim 2, wherein a dust screen (12) is arranged on the left side of the fixing plate (1102), a fixing frame (13) is mounted outside the dust screen (12), and the periphery of the left side of the fixing frame (13) is fixed with the cabinet body (1).
4. The micromodule data center cooling device according to claim 1, wherein bottom plates (14) are arranged on two sides of the bottom of the mounting frame (401), and sliding grooves (15) are formed in the bottom plates (14).
5. The micromodule data center cooling device according to claim 4, wherein an I-shaped slider (16) is slidably arranged inside the sliding groove (15), and a first mounting frame (17) is mounted on the top of the I-shaped slider (16).
6. The micromodule data center cooling device according to claim 5, wherein the I-shaped slider (16) is provided with fastening screws (18) at two sides of the front end, and the fastening screws (18) are parallel to the first mounting frame (17).
7. The micromodule data center cooling device of claim 5, wherein the second mounting rack (19) is arranged on the top of the first mounting rack (17), and the whole second mounting rack (19) is consistent with the structure of the first mounting rack (17).
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CN202220857149.1U CN217563974U (en) | 2022-04-14 | 2022-04-14 | Micromodule data center cooling arrangement |
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CN202220857149.1U CN217563974U (en) | 2022-04-14 | 2022-04-14 | Micromodule data center cooling arrangement |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117279343A (en) * | 2023-11-22 | 2023-12-22 | 湖南省康普通信技术有限责任公司 | Micro-module data center |
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2022
- 2022-04-14 CN CN202220857149.1U patent/CN217563974U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117279343A (en) * | 2023-11-22 | 2023-12-22 | 湖南省康普通信技术有限责任公司 | Micro-module data center |
CN117279343B (en) * | 2023-11-22 | 2024-01-30 | 湖南省康普通信技术有限责任公司 | Micro-module data center |
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