CN117279232A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN117279232A CN117279232A CN202210670263.8A CN202210670263A CN117279232A CN 117279232 A CN117279232 A CN 117279232A CN 202210670263 A CN202210670263 A CN 202210670263A CN 117279232 A CN117279232 A CN 117279232A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- conductive pattern
- circuit layer
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000010304 firing Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- -1 polypropylene Polymers 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920006380 polyphenylene oxide Polymers 0.000 description 6
- 238000005553 drilling Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application provides a manufacturing method of a circuit board, which provides a circuit substrate, wherein the circuit substrate comprises a substrate layer and a first circuit layer, the substrate layer comprises a first surface, and the first circuit layer is arranged on the first surface; disposing an electronic component on the first surface; setting conductive paste on the first surface, wherein the conductive paste coats the electronic element and is connected with the first circuit layer; firing the conductive paste to form a conductive pattern, wherein the conductive pattern is electrically connected with the first circuit layer and the electronic element to obtain a circuit board. The manufacturing method of the circuit board has the advantages of short flow, simple operation, high design flexibility, high yield and good heat dissipation effect. The application also provides a circuit board.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
In order to realize integration and thinning of the circuit board, it is generally necessary to embed electronic components in the circuit board. Conventional fabrication methods generally include: slotting on the circuit substrate, embedding parts, laminating, laser drilling and electroplating to electrically connect the embedded electronic element with the external circuit, and has the advantages of complex operation, long flow and poor heat dissipation effect. In addition, because certain position deviation exists in the process of placing the electronic component, certain deviation can also occur in the process of carrying out subsequent lamination treatment on the circuit board, when laser drilling is carried out, the electronic component is easily deviated or accidentally injured due to inaccurate laser alignment, and the functional influence is caused, so that the yield of the circuit board is not high.
Disclosure of Invention
In view of the above, the present application provides a circuit board and a manufacturing method thereof.
An embodiment of the present application provides a method for manufacturing a circuit board, including the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a substrate layer and a first circuit layer, the substrate layer comprises a first surface, and the first circuit layer is arranged on the first surface;
disposing an electronic component on the first surface;
setting conductive paste on the first surface, wherein the conductive paste coats the electronic element and is connected with the first circuit layer;
firing the conductive paste to form a conductive pattern, wherein the conductive pattern is electrically connected with the first circuit layer and the electronic element to obtain a circuit board.
In some embodiments, the conductive pattern is made of copper paste or copper alloy glue.
In some embodiments, the step of disposing a conductive paste on the first surface comprises:
and setting conductive paste on the first surface in a printing mode, and then baking to enable the conductive paste to be solidified.
In some embodiments, the electronic component includes a body and at least two electrodes electrically connected to the body, where the at least two electrodes are located at a side of the body away from the first circuit layer;
the first circuit layer comprises at least two connecting pads, and each conductive pattern is electrically connected with one connecting pad and one electrode.
In some embodiments, after the step of firing the conductive paste to form a conductive pattern, further comprising:
and sequentially laminating an insulating layer and a dielectric layer on the first surface, wherein the insulating layer coats the electronic element, the conductive pattern and the first circuit layer to obtain an intermediate.
In some embodiments, further comprising:
a second circuit layer is arranged on the surface, away from the insulating layer, of the dielectric layer;
arranging a first conducting body in the intermediate body, wherein the first conducting body penetrates through the dielectric layer and part of the insulating layer, and the first conducting body is electrically connected with the conductive pattern and the second circuit layer;
and/or
And a second conducting body is arranged in the intermediate body, penetrates through the dielectric layer and the insulating layer, and is electrically connected with the first circuit layer and the second circuit layer.
The application also provides a circuit board, including:
the circuit substrate comprises a substrate layer and a first circuit layer, wherein the substrate layer comprises a first surface, and the first circuit layer is arranged on the first surface;
an electronic component disposed on the first surface;
and the conductive pattern is electrically connected with the first circuit layer and the electronic element.
In some embodiments, the conductive pattern is made of copper paste or copper alloy glue.
In some embodiments, the electronic component includes a body and at least two electrodes electrically connected to the body, where the at least two electrodes are located at a side of the body facing away from the first surface;
the first circuit layer comprises at least two connecting pads, and each conductive pattern is electrically connected with one connecting pad and one electrode.
In some embodiments, an insulating layer, a dielectric layer, a second circuit layer, a first conductive body and/or a second conductive body are sequentially stacked on the first surface, and the insulating layer encapsulates the electronic element and the conductive pattern;
the first conductive body penetrates through the dielectric layer and part of the insulating layer, and is electrically connected with the second circuit layer and the conductive pattern; and/or
The second conducting body penetrates through the dielectric layer and the insulating layer, and is electrically connected to the first circuit layer and the second circuit layer.
According to the manufacturing method of the circuit board, the electronic element is directly arranged on the circuit substrate, the electronic element is electrically connected with the first circuit layer through the conductive pattern, multiple processes such as laser grooving, embedding, lamination and layering, drilling electroplating and the like are omitted, the flow is short, the operation is simple, and the yield is high. And the conductive pattern has great design flexibility and can be designed into various patterns, so that the arrangement of the electronic element is not limited by the size and the position of the connecting pad on the first circuit layer. In addition, by designing the conductive pattern, the heat dissipation efficiency of the electronic element can be effectively improved, so that the electronic element circuit board has a good heat dissipation effect.
Drawings
Fig. 1 is a cross-sectional view of a circuit substrate according to an embodiment of the present application.
Fig. 2 is a cross-sectional view of the first surface shown in fig. 1 after the electronic component is disposed thereon.
Fig. 3 is a cross-sectional view of the first surface shown in fig. 2 after the conductive paste is provided thereon.
Fig. 4 is a cross-sectional view of an intermediate body obtained by firing the conductive paste shown in fig. 3 to form a conductive pattern.
Fig. 5 is a cross-sectional view of the first surface shown in fig. 4 after lamination of the first insulating layer and the first dielectric layer.
Fig. 6 is a cross-sectional view of a circuit board according to an embodiment of the present application.
Description of the main reference signs
Circuit board 100
Circuit board 10
Substrate layer 11
First surface 111
Second surface 112
First circuit layer 12
Connection pad 122
Third circuit layer 13
Electronic component 20
Body 21
Electrode 22
Conductive paste 30
Conductive pattern 31
Intermediate 40
First insulating layer 50
Second insulating layer 52
First dielectric layer 60
Second dielectric layer 62
Second circuit layer 70
Fourth wiring layer 72
First conductive body 80
The following detailed description will further illustrate the application in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In order to further describe the technical means and effects adopted by the present application to achieve the predetermined purpose, the following detailed description is made in connection with the accompanying drawings and preferred embodiments.
An embodiment of the present application provides a method for manufacturing a circuit board, and it should be noted that the present embodiment only uses four layers of circuit boards as an illustration, but the present application is not limited to such a multi-layer circuit board structure, and those skilled in the art can understand that the present application can also be applied to connection boards and other multi-layer circuit board structures or processes.
Referring to fig. 1 to 6, the method for manufacturing the circuit board includes the following steps:
in step S1, referring to fig. 1, a circuit substrate 10 is provided.
In the present embodiment, the circuit substrate 10 includes a base material layer 11, a first circuit layer 12, and a third circuit layer 13. The substrate layer 11 includes a first surface 111 and a second surface 112 disposed opposite to each other, the first circuit layer 12 is disposed on the first surface 111, and the first circuit layer 12 includes at least two connection pads 122.
The material of the substrate layer 11 may be one selected from epoxy resin (epoxy resin), ABF resin, polypropylene (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate, PEN), and the like. In this embodiment, the material of the substrate layer 11 is ABF resin.
In step S2, referring to fig. 2, an electronic component 20 is disposed on the first surface 111.
Specifically, the electronic component 20 is attached to the first surface 111 by a Surface Mount Technology (SMT), and the electronic component 20 is spaced from the first circuit layer 12. The electronic component 20 includes a body 21 and at least two electrodes 22 electrically connected to the body 21. In this embodiment, both of the electrodes 22 are located on a side of the body 21 facing away from the first surface 111. The two connection pads 122 are respectively located adjacent to two opposite sides of the electronic component 20.
In step S3, referring to fig. 3, a conductive paste 30 is disposed on the first surface 111, and the conductive paste 30 encapsulates the electronic component 20 and is connected to the connection pad 122.
Specifically, the conductive paste 30 is disposed on the first surface 111 of the substrate layer 11 by printing, and after printing, baking and curing are performed, so that the electronic component 20 is fixed on the first circuit layer 12.
In this embodiment, the conductive paste 30 may be copper paste or copper alloy paste.
In step S4, referring to fig. 4, the conductive paste 30 is fired to form a conductive pattern 31, and the conductive pattern 31 electrically connects the connection pad 122 and the electrode 22, thereby obtaining an intermediate 40.
Specifically, the conductive paste 30 is fired by laser to form two conductive patterns 31, the two conductive patterns 31 are mirror images, and each conductive pattern 31 is electrically connected to a connection pad 122 and an electrode 22.
In step S5, referring to fig. 5 and fig. 6, lamination and layering are performed on the intermediate body 40, so as to obtain the circuit board 100.
Specifically, step S5 includes:
in step S51, referring to fig. 5, the first insulating layer 50 and the first dielectric layer 60 are sequentially laminated on the first surface 111, and the second insulating layer 52 and the second dielectric layer 62 are sequentially laminated on the second surface 112.
In this embodiment, the first insulating layer 50 encapsulates the electronic component 20, the conductive pattern 31 and the first circuit layer 11. The second insulating layer 52 encapsulates the third circuit layer 13.
The material of the first insulating layer 50 and the second insulating layer 52 may be one selected from epoxy resin (PP), polypropylene (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). The first dielectric layer 60 and the second dielectric layer 62 may be one selected from Polypropylene (PP), polytetrafluoroethylene (PTFE), polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), modified polyimide (modified polyimide, MPI), and other materials, and may specifically be a prepreg (prepreg), FR5, ABF (Ajinomoto build-up film) dielectric film, or the like.
Step S52, referring to fig. 6, a second circuit layer 70 is disposed on the first dielectric layer 60, and a first via 80 is disposed in the intermediate body 40, wherein the first via 80 penetrates the first dielectric layer 60 and a portion of the first insulating layer 50 to electrically connect the second circuit layer 70 and the conductive pattern 31; and disposing a fourth circuit layer 72 on the second dielectric layer 62 to obtain the circuit board 100.
In other embodiments, a second conductive body (not shown) may be formed through the first dielectric layer 60 and the first insulating layer 50 to electrically connect the second circuit layer 70 and the first circuit layer 12. It will be appreciated that the second conductive body may replace the first conductive body 80. The first conductive body 80 is made of conductive paste.
Those skilled in the art can know that the manufacturing method of the circuit board further comprises the steps of lamination, anti-soldering, surface treatment, finished product testing and the like, so as to complete the manufacturing of the whole multi-layer circuit board.
The manufacturing method of the circuit board provided by the application is characterized in that the electronic element 20 is directly arranged on the circuit substrate 10, and the electronic element 20 is directly and electrically connected with the first circuit layer 12 by adopting the conductive pattern 31, so that a plurality of processes such as laser grooving, embedding, lamination and layering, drilling electroplating and the like are omitted, the flow is short, the operation is simple, and the yield is high. Also, the conductive pattern 31 has great design flexibility and can be designed in various patterns, so that the arrangement of the electronic component 20 is not limited by the connection pad 122. In addition, by designing the conductive pattern 31, the heat dissipation efficiency of the electronic component 20 can be effectively improved, so that the circuit board 100 has a good heat dissipation effect.
In addition, in the process of performing the subsequent lamination and build-up on the intermediate body 40, the circuit board 100 can be directly formed by laminating an insulating layer or a dielectric layer without performing a pre-opening or grooving process.
Referring to fig. 6, an embodiment of the present application further provides a circuit board 100 manufactured by the above manufacturing method.
The circuit board 100 includes a circuit substrate 10, an electronic component 20, a conductive pattern 31, a first insulating layer 50, a second insulating layer 52, a first dielectric layer 60, a second dielectric layer 62, a second circuit layer 70, a fourth circuit layer 72, and a first via 80.
The wiring substrate 10 includes a base material layer 11, a first wiring layer 12, and a third wiring layer 13. The substrate layer 11 includes a first surface 111 and a second surface 112 disposed opposite to each other, the first circuit layer 12 is disposed on the first surface 111, and the first circuit layer 12 includes at least two connection pads 122. The electronic component 20 is disposed on the first surface 111, and the electronic component 20 is spaced from the first circuit layer 12. The conductive pattern 31 encapsulates the electronic component 20 and is electrically connected to the connection pad 122.
In this embodiment, the electronic component 20 includes a body 21 and at least two electrodes 22 electrically connected to the body 21, wherein both the electrodes 22 are located at a side of the body 21 facing away from the first surface 111, and the two connection pads 122 are respectively located at two opposite sides of the electronic component 20. The number of the conductive patterns 31 is two, the two conductive patterns 31 are mirror images, and each conductive pattern 31 is electrically connected to a connection pad 122 and an electrode 22.
In this embodiment, the conductive pattern 31 may be a copper paste or a copper alloy paste.
The first insulating layer 50, the first dielectric layer 60 and the second circuit layer 70 are sequentially stacked on the first surface 111, and the first insulating layer 50 covers the electronic component 20 and the conductive pattern 31. The second insulating layer 52, the second dielectric layer 62 and the fourth circuit layer 72 are sequentially stacked on the second surface 112, and the second insulating layer 52 covers the third circuit layer 13. The first conductive body 80 penetrates through the first dielectric layer 60 and a portion of the first insulating layer 50 to electrically connect the second circuit layer 70 and the conductive pattern 31.
The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application.
Claims (10)
1. The manufacturing method of the circuit board is characterized by comprising the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a substrate layer and a first circuit layer, the substrate layer comprises a first surface, and the first circuit layer is arranged on the first surface;
disposing an electronic component on the first surface;
setting conductive paste on the first surface, wherein the conductive paste coats the electronic element and is connected with the first circuit layer;
firing the conductive paste to form a conductive pattern, wherein the conductive pattern is electrically connected with the first circuit layer and the electronic element to obtain a circuit board.
2. The method of claim 1, wherein the conductive pattern is made of copper paste or copper alloy paste.
3. The method of manufacturing a circuit board according to claim 1, wherein the step of disposing a conductive paste on the first surface includes: and setting conductive paste on the first surface in a printing mode, and then baking to enable the conductive paste to be solidified.
4. The method of claim 1, wherein the electronic component includes a body and at least two electrodes electrically connected to the body, the at least two electrodes being located at a side of the body facing away from the first circuit layer;
the first circuit layer comprises at least two connecting pads, and each conductive pattern is electrically connected with one connecting pad and one electrode.
5. The method of manufacturing a circuit board according to claim 1, wherein after the step of firing the conductive paste to form a conductive pattern, further comprising:
and sequentially laminating an insulating layer and a dielectric layer on the first surface, wherein the insulating layer coats the electronic element, the conductive pattern and the first circuit layer to obtain an intermediate.
6. The method for manufacturing a circuit board according to claim 5, further comprising:
a second circuit layer is arranged on the surface, away from the insulating layer, of the dielectric layer;
arranging a first conducting body in the intermediate body, wherein the first conducting body penetrates through the dielectric layer and part of the insulating layer, and the first conducting body is electrically connected with the conductive pattern and the second circuit layer; and/or
And a second conducting body is arranged in the intermediate body, penetrates through the dielectric layer and the insulating layer, and is electrically connected with the first circuit layer and the second circuit layer.
7. A wiring board, comprising:
the circuit substrate comprises a substrate layer and a first circuit layer, wherein the substrate layer comprises a first surface, and the first circuit layer is arranged on the first surface;
an electronic component disposed on the first surface;
and the conductive pattern is electrically connected with the first circuit layer and the electronic element.
8. The circuit board of claim 7, wherein the conductive pattern is made of copper paste or copper alloy glue.
9. The circuit board of claim 7, wherein the electronic component comprises a body and at least two electrodes electrically connected to the body, the at least two electrodes being located on a side of the body facing away from the first surface; the first circuit layer comprises at least two connecting pads, and each conductive pattern is electrically connected with one connecting pad and one electrode.
10. The wiring board of claim 7, further comprising: the electronic component comprises an insulating layer, a dielectric layer, a second circuit layer, a first conducting body and/or a second conducting body, wherein the insulating layer, the dielectric layer and the second circuit layer are sequentially stacked on the first surface, and the insulating layer coats the electronic component and the conductive pattern;
the first conductive body penetrates through the dielectric layer and part of the insulating layer, and is electrically connected with the second circuit layer and the conductive pattern; and/or
The second conducting body penetrates through the dielectric layer and the insulating layer, and is electrically connected to the first circuit layer and the second circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210670263.8A CN117279232A (en) | 2022-06-14 | 2022-06-14 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210670263.8A CN117279232A (en) | 2022-06-14 | 2022-06-14 | Circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117279232A true CN117279232A (en) | 2023-12-22 |
Family
ID=89199584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210670263.8A Pending CN117279232A (en) | 2022-06-14 | 2022-06-14 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117279232A (en) |
-
2022
- 2022-06-14 CN CN202210670263.8A patent/CN117279232A/en active Pending
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