CN117276445A - Package structure and method for manufacturing the same - Google Patents

Abstract

The invention relates to a packaging structure and a manufacturing method thereof. The manufacturing method of the packaging structure comprises the following steps: forming a rewiring layer on the top surface of the glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer to enable the glass substrate to have a cutting edge, wherein the cutting edge of the glass substrate is provided with a crack; and heating the protective layer to enable a part of the protective layer to flow towards the bottom surface of the glass substrate so as to cover the cutting edge of the glass substrate and fill in cracks in the cutting edge of the glass substrate. The protective layer can further prevent cracks from being continuously enlarged in the glass substrate, and can strengthen the structural stability of the glass substrate so as to reduce the possibility of breakage of the glass substrate, further reduce the overall manufacturing cost and improve the yield of display products.

Description

Package structure and method for manufacturing the same

Technical Field

The disclosure relates to a package structure and a method for manufacturing the package structure.

Background

In general, mini-LED and micro-LED displays use glass substrates, and the manufacturing process of such displays generally includes a process of cutting the glass substrates. However, when the cutting process is performed without a protection mechanism for the glass substrate, the cutting edge of the glass substrate is inevitably cracked due to the stress of the glass substrate or the influence of cutting parameters, and the structural stability of the glass substrate is reduced. Therefore, when the glass substrate collides, for example, during transportation or mounting of the LED (e.g., mini LED or micro-LED), the crack generated by cutting is further extended in the glass substrate, increasing the chance of breakage of the glass substrate, increasing the overall manufacturing cost and decreasing the yield of the display product.

Disclosure of Invention

One aspect of the present disclosure is a package structure.

According to one embodiment of the present disclosure, a package structure includes a glass substrate, a redistribution layer, and a passivation layer. The glass substrate has a top surface and a cutting edge adjacent the top surface. The glass substrate has a slit in a cut edge thereof. The rewiring layer is located on the top surface of the glass substrate. The protective layer is positioned on the top surface of the glass substrate. A portion of the protective layer covers the cut edge of the glass substrate and fills in the slit in the cut edge of the glass substrate.

In an embodiment of the disclosure, the redistribution layer and the passivation layer are spaced apart from each other.

In one embodiment of the present disclosure, the distance is between 0.5 mm and 1 mm.

In an embodiment of the disclosure, the package structure further includes an electronic device. The electronic component is located on the rewiring layer.

In an embodiment of the disclosure, the protection layer extends onto the redistribution layer to cover the electronic device.

In an embodiment of the disclosure, the material of the protection layer includes an organic polymer.

In an embodiment of the disclosure, the protective layer is transparent.

In an embodiment of the disclosure, the protective layer is non-transparent.

One aspect of the present disclosure is a method for manufacturing a package structure.

According to one embodiment of the present disclosure, a method for manufacturing a package structure includes: forming a rewiring layer on the top surface of the glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer to enable the glass substrate to have a cutting edge, wherein the cutting edge of the glass substrate is provided with a crack; and heating the protective layer to enable a part of the protective layer to flow towards the bottom surface of the glass substrate so as to cover the cutting edge of the glass substrate and fill in cracks in the cutting edge of the glass substrate.

In an embodiment of the disclosure, the dicing of the glass substrate and the protective layer is performed by using a wheel knife or a laser.

In an embodiment of the disclosure, the passivation layer is formed on the top surface of the glass substrate, and the redistribution layer and the passivation layer are spaced apart from each other by a certain distance.

In an embodiment of the disclosure, after heating the protective layer, the method further includes disposing an electronic device on the redistribution layer.

In an embodiment of the disclosure, before forming the protective layer on the top surface of the glass substrate, the method further includes disposing an electronic component on the redistribution layer.

In an embodiment of the disclosure, a protective layer is formed on the top surface of the glass substrate to cover the electronic device.

In one embodiment of the present disclosure, the forming the protective layer on the top surface of the glass substrate is performed by dipping.

In an embodiment of the disclosure, the method for heating the protective layer uses a heat source disposed on a portion of the protective layer adjacent to the cutting edge.

In an embodiment of the disclosure, the method further includes removing the heat source to cure the protective layer after the protective layer covers the cutting edge and fills the crack.

When the glass substrate of the package structure is cut, a crack is inevitably generated at the cut edge of the glass substrate due to the influence of the glass stress. However, in the above embodiments of the present disclosure, the protective layer may cover the cut edge of the glass substrate and may fill in the crack in the cut edge of the glass substrate. Therefore, the protective layer can further prevent cracks from being continuously enlarged in the glass substrate, and can strengthen the structural stability of the glass substrate, so as to reduce the possibility of breakage of the glass substrate, further reduce the overall manufacturing cost and improve the yield of display products.

Drawings

An embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1 is a cross-sectional view of a package structure according to an embodiment of the disclosure.

Fig. 2 is a cross-sectional view of a package structure according to another embodiment of the disclosure.

Fig. 3 is a flowchart illustrating a method of manufacturing a package structure according to an embodiment of the disclosure.

Fig. 4A is a top view of a glass substrate before a dicing process according to an embodiment of the disclosure.

FIG. 4B is a cross-sectional view of the glass substrate of FIG. 4A along line 4B-4B.

Fig. 5A is a top view of the glass substrate of fig. 4A after a dicing process.

FIG. 5B is a cross-sectional view of the glass substrate of FIG. 5A along line 5B-5B.

Fig. 6 is a cross-sectional view of a method for manufacturing a package structure according to an embodiment of the disclosure at an intermediate stage.

Fig. 7A is a top view of a glass substrate before a dicing process according to an embodiment of the disclosure.

FIG. 7B is a cross-sectional view of the glass substrate of FIG. 7A along line 7B-7B.

Fig. 8 and 9 are cross-sectional views of a method for manufacturing a package structure according to another embodiment of the disclosure at different stages.

[ Main element symbols description ]

100,100a packaging structure 110 glass substrate

111 area 112 top surface

114 cutting edge 116 bottom surface

118 crack 120 re-routing layer

122 contact pads 130,130a protective layer

132,132a dicing edge 140 electronic components

height h1 to height h2

d1 distance D direction

S1 step S2 step

S3, step S4, step

4B-4B line segment 5B-5B line segment

7B-7B line segment

Detailed Description

The following disclosure of embodiments provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course, the examples are merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms, such as "below … …," "below … …," "lower," "above … …," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or manufacturing method in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Fig. 1 is a cross-sectional view of a package structure 100 according to an embodiment of the disclosure. The package structure 100 includes a glass substrate 110, a redistribution layer 120, and a protection layer 130. The glass substrate 110 of the package structure 100 has a top surface 112, a cutting edge 114 adjacent to the top surface 112, and a bottom surface 116 opposite the top surface 112. For example, the material of the glass substrate 110 may include silicon, but is not limited thereto.

The cut edge 114 of the glass substrate 110 has at least one slit 118 therein. The redistribution layer 120 of the package structure 100 is located on the top surface 112 of the glass substrate 110. The redistribution layer 120 may have pads 122. The protective layer 130 of the package structure 100 is located on the top surface 112 of the glass substrate 110. It is noted that a portion of the protective layer 130 covers the cut edge 114 of the glass substrate 110 and fills the slit 118 in the cut edge 114 of the glass substrate 110.

In the present embodiment, the protection layer 130 may be located on the scribe line of the glass substrate 110, and the redistribution layer 120 and the protection layer 130 may be spaced apart from each other by a distance d1. The distance d1 is between 0.5 mm and 1 mm. In addition, the package structure 100 further includes an electronic component 140. For example, the electronic component 140 may include a chip, such as a mini LED chip or a micro-LED chip, but is not limited thereto.

The electronic device 140 may be disposed on the redistribution layer 120 and electrically connected to the pads 122 of the redistribution layer 120. In this embodiment, the material of the protection layer 130 may include an organic Polymer (Polymer), and may be a thermoplastic resin. Furthermore, the protective layer 130 may be non-transparent. For example, the color of the protection layer 130 may be black, so that the protection layer 130 can absorb light, reduce the reflection of the glass substrate 110 to the external light, and improve the image quality. In fig. 1, the protective layer 130 covers the cut edge 114 on one side of the glass substrate 110. However, in practical applications, the cutting edges 114 around the glass substrate 110 may be covered by the protection layer 130, so as to improve the protection effect of the protection layer 130 on the whole glass substrate 110. In addition, the passivation layer 130 may have different heights h1 according to different process methods. For example, after the protective layer 130 is coated on the scribe lines of the glass substrate 110 using a dropper and scribe and melt (as will be described in detail below), the height h1 of the protective layer 130 on the top surface 112 of the glass substrate 110 may be lower than the distance from the top of the electronic component 140 to the top surface 112 of the glass substrate 110. That is, the protective layer 130 does not cover the electronic component 140 and the redistribution layer 120.

Specifically, when the glass substrate 110 of the package structure 100 is cut, the cut edge 114 of the glass substrate 110 is inevitably cracked 118 due to the influence of glass stress. However, the protective layer 130 may cover the cut edge 114 of the glass substrate 110 and may fill the slit 118 in the cut edge 114 of the glass substrate 110. In this way, the protection layer 130 can further prevent the crack 118 from expanding continuously in the cut edge 114 of the glass substrate 110, and can enhance the structural stability of the glass substrate 110. In addition, the protective layer 130 filled in the crack 118 can reduce the chance of cracking the glass substrate 110, thereby reducing the overall manufacturing cost and improving the yield of the display product.

It should be understood that the connection and the effects of the elements described above will not be repeated, and the description is omitted. In the following description, other forms of package structure will be described.

Fig. 2 is a cross-sectional view of a package structure 100a according to another embodiment of the disclosure. The package structure 100a includes a glass substrate 110, a redistribution layer 120, a protection layer 130a, and an electronic component 140. The embodiment shown in fig. 2 differs from the embodiment shown in fig. 1 in that the protective layer 130a may extend onto the redistribution layer 120 to cover the electronic component 140. That is, after the process steps of the redistribution layer 120 are performed, the electronic component 140 may be disposed on the pad 122 of the redistribution layer 120, and then the process steps of forming the protection layer 130a (which will be described in detail below) are performed. For example, the electronic device 140 may include a chip, but is not limited thereto.

In addition, the material of the protection layer 130a may include an organic polymer, and the protection layer 130a may be transparent. When the electronic component 140 is an LED, since the protective layer 130a is transparent, even if the protective layer 130a extends onto the redistribution layer 120 and covers the electronic component 140, the electronic component 140 is not visually blocked, so that the user's viewing experience can be maintained and the protective effect of the electronic component 140 can be provided. In addition, the protection layer 130a of the package structure 100a can further prevent the crack 118 from expanding continuously in the cut edge 114 of the glass substrate 110, and can enhance the structural stability of the glass substrate 110. The crack 118 in the cut edge 114 of the glass substrate 110 is filled with the protection layer 130a, which reduces the chance of cracking the glass substrate 110, thereby reducing the manufacturing cost and improving the yield of the package structure 100 a. In fig. 2, the protective layer 130a covers the cut edge 114 on one side of the glass substrate 110. However, in practical applications, the cutting edges 114 around the glass substrate 110 may be covered by the protection layer 130a, so as to improve the protection effect of the protection layer 130a on the whole glass substrate 110. In addition, the passivation layer 130a may have different heights h2 according to different process methods. For example, after the protective layer 130a is entirely coated on the glass substrate 110 and cut and melted (as will be described in detail below), the height h2 of the protective layer 130a on the top surface 112 of the glass substrate 110 may be higher than the distance from the top of the electronic device 140 to the top surface 112 of the glass substrate 110, and the protective layer 130a may cover the electronic device 140 and the redistribution layer 120.

In the following description, a method for manufacturing the package structure 100 (see fig. 1) and the package structure 100a (see fig. 2) will be described. The connection relationships and materials of the elements already described will not be repeated, and will be described in detail.

Fig. 3 is a flowchart illustrating a method of manufacturing a package structure according to an embodiment of the disclosure. The manufacturing method of the packaging structure comprises the following steps. First, in step S1, a rewiring layer is formed on the top surface of a glass substrate. Next, in step S2, a protective layer is formed on the top surface of the glass substrate. Next, in step S3, the glass substrate and the protective layer are cut to form a glass substrate having a cut edge, wherein the cut edge of the glass substrate has a crack therein. Then, in step S4, the protective layer is heated so that a part of the protective layer flows toward the bottom surface of the glass substrate to cover the cut edge of the glass substrate and fill in the crack in the cut edge of the glass substrate. In the following description, the above-described respective steps will be described in detail.

Fig. 4A is a top view of a glass substrate 110 before a dicing process is performed according to an embodiment of the disclosure. Fig. 4B illustrates a cross-sectional view of the glass substrate 110 of fig. 4A along line 4B-4B. Referring to fig. 4A and 4B, the glass substrate 110 has a redistribution layer 120 and a passivation layer 130 thereon. The redistribution layer 120 and the protective layer 130 have a distance d1 on the glass substrate 110. The periphery of the glass substrate 110 has a region 111 before the glass substrate 110 is subjected to the dicing process. For example, the region 111 may be a scribe line of a portion of the glass substrate 110. The fabrication method includes forming a redistribution layer 120 on the top surface 112 of the glass substrate 110. After forming the re-wiring layer 120, a protective layer 130 may be formed on the top surface 112 of the glass substrate 110. In some embodiments, forming the protective layer 130 on the top surface 112 of the glass substrate 110 is using a dip-tube coating, printing, or spraying. For example, the protective layer 130 may be formed on the scribe line of the glass substrate 110, and the re-wiring layer 120 and the protective layer 130 are separated from each other.

Fig. 5A is a top view of the glass substrate 110 of fig. 4A after a dicing process. FIG. 5B illustrates a cross-sectional view of the glass substrate 110 of FIG. 5A along line 5B-5B. Referring to fig. 5A and 5B, after forming the protective layer 130 on the top surface 112 of the glass substrate 110, the glass substrate 110 and the protective layer 130 may be cut, such that the glass substrate 110 has a cutting edge 114, and the protective layer 130 has a cutting edge 132. In some embodiments, cutting the glass substrate 110, the region 111 (see fig. 4A), and the protective layer 130 is cutting using a wheel knife or laser. During cutting of the glass substrate 110 using a wheel blade or laser, the cut edge 114 of the glass substrate 110 may develop fine cracks 118 due to the influence of glass stress or cutting parameters of the glass substrate 110. In the structure shown in fig. 5A, the periphery of the glass substrate 110 may be covered by the protection layer 130, so as to improve the protection effect of the protection layer 130 on the whole glass substrate 110 and reduce the chance of cracking the glass substrate 110.

Fig. 6 is a cross-sectional view of a method for manufacturing a package structure according to an embodiment of the disclosure at an intermediate stage. Referring to fig. 6 and fig. 1, after the glass substrate 110 and the protective layer 130 are cut, a heat source 200 may be disposed to heat the cutting edge 132 of the protective layer 130. Heat source 200 may be located on cutting edge 132 of protective layer 130. After the protective layer 130 is heated by the heat source 200 along the direction D, the protective layer 130 may be transformed from a solid state to a molten state, so that a portion of the protective layer 130 may flow toward the bottom surface 116 of the glass substrate 110 to cover the cutting edge 114 of the glass substrate 110. Thus, when the cut edge 114 of the glass substrate 110 has the slit 118, the protective layer 130 may fill the slit 118 in the cut edge 114 of the glass substrate 110. In this way, the protection layer 130 can further prevent the crack 118 from expanding continuously in the cut edge 114 of the glass substrate 110, and can enhance the structural stability of the glass substrate 110. In addition, the filling of the crack 118 in the cut edge 114 of the glass substrate 110 with the protective layer 130 reduces the chance of breakage of the glass substrate 110, and improves the yield of the display product.

Next, after a portion of the protective layer 130 covers the cut edge 114 of the glass substrate 110, the manufacturing method further includes removing the heat source 200 above the glass substrate 110 to cure the protective layer 130. In some embodiments, the glass substrate 110 may be placed on a stage (not shown) before the dicing process is performed on the glass substrate 110, and the sample (e.g., the package structure 100) may be moved onto a tray or a load tray (not shown) after the dicing process is performed on the glass substrate 110 and the protective layer 130 is heated. The cooled protective layer 130 may be transformed from a molten state back to a solid state, such that the protective layer 130 stops flowing toward the bottom surface 116 of the glass substrate 110. Next, after heating the cutting edge 132 of the protection layer 130 and removing the heat source 200, the manufacturing method further includes disposing the electronic component 140 on the redistribution layer 120 to form the structure shown in fig. 1. In addition, the electronic device 140 may be electrically connected to the pad 122 of the redistribution layer 120. In some embodiments, the protective layer 130 may be non-transparent. For example, the color of the protection layer 130 may be black, so that the protection layer 130 can absorb light, reduce the reflection of the glass substrate 110 to the external light, and improve the image quality.

In some embodiments, when the glass substrate 110 and the protective layer 130 are cut using a laser, the temperature of the laser source may be regarded as the heat source 200 by parameter setting. Therefore, when the glass substrate 110 and the protective layer 130 have the cutting edges 114, 132, the protective layer 130 can be heated at the same time to transform the protective layer 130 from a solid state to a molten state so as to cover the cutting edge 114 of the glass substrate 110. In this way, the crack 118 in the cut edge 114 of the glass substrate 110 may be filled with the protection layer 130 to reduce the chance of cracking the glass substrate 110.

Fig. 7A is a top view of a glass substrate 110 before a dicing process is performed according to an embodiment of the disclosure. FIG. 7B illustrates a cross-sectional view of the glass substrate 110 of FIG. 7A along line 7B-7B. Referring to fig. 7A and 7B, the protective layer 130a is coated on the glass substrate 110 and covers the redistribution layer 120 and the electronic component 140, so as to improve the protection effect of the protective layer 130a on the whole glass substrate 110. First, a re-wiring layer 120 may be formed on the top surface 112 of the glass substrate 110. Next, before forming the protective layer 130 on the top surface 112 of the glass substrate 110, the electronic element 140 may be disposed on the rewiring layer 120. The electronic device 140 may be electrically connected to the pad 122 of the redistribution layer 120. Next, after the electronic element 140 is disposed on the redistribution layer 120, a protection layer 130a may be formed on the top surface 112 of the glass substrate 110 to cover the electronic element 140. That is, the process step of disposing the electronic element 140 may precede the process step of forming the protective layer 130 a.

Fig. 8 and 9 are cross-sectional views of a method for manufacturing a package structure according to another embodiment of the disclosure at different stages. Referring to fig. 8, after forming the protective layer 130a on the top surface 112 of the glass substrate 110, the glass substrate 110 and the protective layer 130a may be cut, so that the glass substrate 110 has a cutting edge 114, and the protective layer 130a has a cutting edge 132a. For example, during cutting of the glass substrate 110 using a wheel knife or laser, the cut edge 114 of the glass substrate 110 may generate fine cracks 118 due to the influence of glass stress or cutting parameters of the glass substrate 110.

Referring to fig. 9 and fig. 2, after the glass substrate 110 and the protective layer 130a are cut, a heat source 200 may be disposed to heat the cutting edge 132a of the protective layer 130 a. After the protective layer 130a is heated by the heat source 200 along the direction D, the protective layer 130a may be transformed from a solid state to a molten state, so that a portion of the protective layer 130a may flow toward the bottom surface 116 of the glass substrate 110 to cover the cutting edge 114 of the glass substrate 110. Therefore, when the cut edge 114 of the glass substrate 110 has the slit 118, the protective layer 130a may fill in the slit 118 in the cut edge 114 of the glass substrate 110. In this way, the protection layer 130a can further prevent the crack 118 from expanding continuously in the cutting edge 114 of the glass substrate 110, so as to reduce the chance of cracking the glass substrate 110 and yield of the package structure 100 a.

Next, after a portion of the protective layer 130a covers the cut edge 114 of the glass substrate 110, the heat source 200 over the glass substrate 110 may be removed. The cooled protective layer 130a may be transformed from a molten state back to a solid state to stop flowing toward the bottom surface 116 of the glass substrate 110 to form the structure shown in fig. 2. In some embodiments, the glass substrate 110 may be placed on a stage (not shown) before the dicing process is performed on the glass substrate 110, and the sample (e.g., the package structure 100 a) may be moved onto a tray or a carrier (not shown) after the dicing process is performed on the glass substrate 110 and the protective layer 130a is heated. In some embodiments, the protective layer 130a is transparent, even if the protective layer 130a extends onto the redistribution layer 120 to cover the electronic component 140 and does not visually block the electronic component 140, so as to maintain the user's viewing experience and provide the protective effect of the electronic component 140.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims (17)

1. A package structure, comprising:

a glass substrate having a top surface and a cut edge adjacent to the top surface, wherein the cut edge of the glass substrate has a slit therein;

a rewiring layer located on the top surface of the glass substrate; and

and a protective layer on the top surface of the glass substrate, wherein a part of the protective layer covers the cutting edge of the glass substrate and fills the crack in the cutting edge of the glass substrate.

2. The package structure of claim 1, wherein the redistribution layer and the protection layer are spaced apart from each other by a distance.

3. The package of claim 2, wherein the distance is between 0.5 mm and 1 mm.

4. The package structure of claim 1, further comprising:

and the electronic element is positioned on the rewiring layer.

5. The package structure of claim 4, wherein the protective layer extends onto the redistribution layer to cover the electronic component.

6. The package structure of claim 1, wherein the material of the protective layer comprises an organic polymer.

7. The package structure of claim 1, wherein the protective layer is transparent.

8. The package structure of claim 1, wherein the protective layer is non-transparent.

9. A method of manufacturing a package structure, comprising:

forming a rewiring layer on the top surface of the glass substrate;

forming a protective layer on the top surface of the glass substrate;

cutting the glass substrate and the protective layer to enable the glass substrate to have a cutting edge, wherein the cutting edge of the glass substrate is provided with a crack; and

heating the protective layer to enable a part of the protective layer to flow towards the bottom surface of the glass substrate so as to cover the cutting edge of the glass substrate and fill in the crack in the cutting edge of the glass substrate.

10. The method of claim 9, wherein cutting the glass substrate and the protective layer is performed using a wheel knife or a laser.

11. The method of claim 9, wherein the protective layer is formed on the top surface of the glass substrate and the redistribution layer and the protective layer are spaced apart from each other.

12. The method of claim 11, further comprising, after heating the protective layer:

an electronic component is disposed on the redistribution layer.

13. The method of claim 9, further comprising, prior to forming the protective layer on the top surface of the glass substrate:

an electronic component is disposed on the redistribution layer.

14. The method of claim 13, wherein the protective layer is formed on the top surface of the glass substrate to cover the electronic component.

15. The method of claim 9, wherein forming the protective layer on the top surface of the glass substrate is coated using a dropper.

16. The method of claim 9, wherein heating the protective layer is performed using a heat source disposed on a portion of the protective layer adjacent the cutting edge.

17. The method as recited in claim 16, further comprising:

after the protective layer covers the cutting edge and fills the crack, the heat source is removed to cure the protective layer.