CN117276221A - SIP packaging structure and preparation method thereof - Google Patents
SIP packaging structure and preparation method thereof Download PDFInfo
- Publication number
- CN117276221A CN117276221A CN202311297996.2A CN202311297996A CN117276221A CN 117276221 A CN117276221 A CN 117276221A CN 202311297996 A CN202311297996 A CN 202311297996A CN 117276221 A CN117276221 A CN 117276221A
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- substrate
- sip
- packaging
- liquid cooling
- ceramic
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000000919 ceramic Substances 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 239000000110 cooling liquid Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000962 AlSiC Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a SIP packaging structure and a preparation method thereof. The SIP packaging structure comprises a substrate, components arranged on the substrate and a double-sided heat dissipation structure, wherein the double-sided heat dissipation structure comprises a packaging cover plate arranged on one side of the substrate and a ceramic liquid cooling plate arranged on the other side of the substrate. The substrate and the packaging cover plate enclose a cavity for accommodating the component, the packaging cover plate is arranged above the component, at least one transversely penetrating micro-channel is arranged on the ceramic liquid cooling sheet, the micro-channel is used for cooling liquid circulation, a flexible structure is arranged on the inner surface of the micro-channel, and the flexible structure forms an angle with the flow direction of the cooling liquid. The invention provides a high-efficiency SIP packaging structure, which can effectively reduce the temperature, improve the heat dissipation efficiency and ensure the stable operation of the SIP packaging structure under the high-power-consumption working condition.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a SIP packaging structure and a preparation method thereof.
Background
With the development of semiconductor technology, especially in the 5G communication era, not only is the demand for electronic devices increasingly miniaturized and thinned, but also the demand for heterogeneous integration of different elements is increasingly greater, so that the System In Package (SIP) of semiconductor heterogeneous integration is becoming a trend of packaging.
With the continued development and advancement of integrated circuits, the power consumption of chips and components is also increasing. In the existing SIP package structure, a conventional heat dissipation structure such as a heat sink and a heat dissipation module is generally adopted. However, these conventional heat dissipation structures cannot effectively reduce the temperature and maintain a stable operation state due to limited package space and limited heat dissipation paths. The existing heat dissipation structure has the following problems: the traditional heat radiation structure can not absorb and conduct heat effectively, so that the temperature is too high, the heat radiation efficiency is low, meanwhile, due to insufficient heat radiation, the equipment is easy to overheat, so that the operation is unstable, and even the chip and the components are damaged. Due to the problems of limited packaging space, low heat accumulation and heat dissipation efficiency and the like, the existing heat dissipation structure cannot meet the heat dissipation requirement of high-power-consumption equipment.
For this reason, improvements are needed in the art.
Disclosure of Invention
In the prior art, due to the problems of limited packaging space, low heat accumulation and heat dissipation efficiency and the like, the existing heat dissipation structure cannot meet the heat dissipation requirement of high-power-consumption equipment, so the invention provides an SIP packaging structure and a preparation method thereof for solving the problems.
In a first aspect, the invention provides an SIP packaging structure, which includes a substrate, a component disposed on the substrate, and a double-sided heat dissipation structure, where the double-sided heat dissipation structure includes a packaging cover plate disposed on one side of the substrate and a ceramic liquid cooling plate disposed on the other side of the substrate, the substrate and the packaging cover plate enclose a cavity for accommodating the component, at least one micro channel penetrating transversely is disposed on the ceramic liquid cooling plate, the micro channel is used for cooling liquid to circulate, and a flexible structure is disposed on an inner surface of the micro channel, and the flexible structure forms an angle with a flow direction of the cooling liquid.
In one implementation, the SIP package structure further includes a metal layer disposed between the substrate and the component, where the metal layer is disposed on a side of the metal layer, which is close to the ceramic liquid cooling plate, and a plurality of array metal columns, and the metal columns penetrate through the substrate and are inserted into the micro-channels of the ceramic liquid cooling plate.
In one implementation, the metal layer is a copper layer and the metal pillars are copper pillars.
In one implementation, the package cover is a metal sheet with a heat dissipation structure.
In one implementation, the microchannels are linear, threaded, tree-like or bifurcated, mesh or lattice.
In one implementation, the flexible structure includes any one of fine textures, fine protrusions, rotating blades, wavy structures, elastic structures, and capillary structures.
In one implementation, the components include a main control chip module and a radio frequency chip module.
In one implementation, the substrate is a ceramic substrate.
In a second aspect, the present invention further provides a method for preparing a SIP package structure, which is used for preparing the SIP package structure, and specifically includes the following steps:
s1, providing a substrate, mounting the components on the substrate through welding or conductive adhesive, and forming point electrical connection between the components through metal wires and/or solder balls;
s2, providing a packaging cover plate, and packaging and fixing the packaging cover plate and the substrate;
s3, providing a ceramic liquid cooling sheet, and fixing the ceramic liquid cooling sheet on the other side of the substrate;
s4, carrying out surface polishing, cleaning and surface treatment to obtain the SIP packaging structure.
The beneficial effects are that: according to the SIP packaging structure and the preparation method thereof, the SIP packaging structure has the superimposed heat dissipation capacity by adopting the double-sided heat dissipation structure; meanwhile, the flexible structure is arranged on the inner surface of the micro-channel of the ceramic liquid cooling plate, so that orderly vortex is generated on the flow of cooling liquid, the heat exchange coefficient between the cooling liquid and the wall surface is enhanced, the heat exchange coefficient between the cooling liquid and the wall surface of the ceramic liquid cooling plate is improved, the heat transfer capacity of the micro-channel is improved, an efficient SIP packaging structure is provided, the temperature can be effectively reduced, the heat dissipation efficiency is improved, and the stable operation of the SIP packaging structure under the high-power-consumption working condition is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a SIP package structure provided by the present invention;
fig. 2 is a schematic diagram of the structure of the ceramic liquid cooling sheet shown in fig. 1.
Wherein, 100, SIP packaging structure; 10. a substrate; 20. a component; 21. a cavity; 30. packaging the cover plate; 40. a ceramic liquid cooling plate; 41. a microchannel; 411. a flexible structure; 50. a metal layer; 51. a metal column; 60. a water inlet; 70. and a water outlet.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, units, modules, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, units, modules, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a SIP package structure provided by the present invention, and fig. 2 is a schematic structural diagram of a ceramic liquid cooling plate shown in fig. 1. The invention provides an SIP packaging structure 100, which comprises a substrate 10, a component 20 arranged on the substrate 10 and a double-sided heat dissipation structure, wherein the double-sided heat dissipation structure comprises a packaging cover plate 30 arranged on one side of the substrate and a ceramic liquid cooling sheet 40 arranged on the other side of the substrate 10, the substrate 10 and the packaging cover plate 30 enclose a cavity 21 for accommodating the component 20, at least one micro channel 41 which transversely penetrates through the ceramic liquid cooling sheet 40 is arranged, the micro channel 41 is used for cooling liquid circulation, a flexible structure 411 is arranged on the inner surface of the micro channel 41, and the flexible structure 411 forms an angle with the flow direction of the cooling liquid.
The SIP packaging structure 100 provided by the present invention adopts a double-sided heat dissipation structure, so that the heat source inside the SIP packaging structure 100 has heat dissipation channels in upper and lower directions, which can effectively conduct out the heat on the heat source of the component 20, reduce thermal resistance, and improve heat dissipation conditions.
Further, the SIP package structure 100 further includes a metal layer 50 disposed between the substrate 10 and the component 20, where a plurality of array metal pillars 51 are disposed on a side of the metal layer 50 near the ceramic liquid cooling plate 40, and the metal pillars 51 penetrate through the substrate 10 and are inserted into the micro-channels 41 of the ceramic liquid cooling plate 40. Preferably, the metal layer 50 is a copper layer, and the metal pillars 51 are copper pillars. By inserting the metal posts 51 into the micro-channels 41 of the ceramic liquid cooling plate 40 through the substrate 10, heat generated during operation of the component 20 can be quickly conducted into the ceramic liquid cooling plate 40, and meanwhile, part of heat is transferred into the ceramic liquid cooling plate 40 through the substrate 10, and the heat is taken away through the cooling liquid.
Specifically, the substrate 10 is a ceramic substrate. The material of the substrate 10 is LTCC low-temperature ceramic, a plurality of layers of metal wiring are arranged in the substrate 10, and a metal conduction band pattern for component assembly is arranged on the upper surface of the substrate 10. The component 20 is disposed on the upper surface of the base 10. The component 20 includes a main control chip module and a radio frequency chip module.
Specifically, the package cover 30 is a metal sheet with a heat dissipation structure. Specifically, the optional material of the packaging cover plate 30 is AlSiC, which has high thermal conductivity (170-200W/mK) ten times that of the common packaging material, so that the heat generated by the chip can be timely dissipated, and the reliability and stability of the whole component are improved. In terms of the heat dissipation path, the heat generated by the components in the package is mainly divided into an upward part and a downward part, the heat of the upward part is transferred to the environment space through the upper surface of the package, and the heat of the downward part is transferred to the environment space through the PCB or the ceramic substrate. In the present invention, the heat of the upward portion can be transferred to the ambient space through the package cover 30. In some embodiments, the package cover 30 may also be a ceramic cover, consistent with the substrate 10, to facilitate raw material access.
Specifically, the micro-channels 41 are linear, threaded, tree-like or bifurcated, mesh-like or lattice-like. The linear type consists of parallel linear channels, and has simple structure and easy manufacture; the spiral micro-channel is in a spiral or curved shape, so that the turbulence of fluid can be improved, and the cooling effect is improved; the tree or bifurcation type starts with one larger channel and then diverges into multiple smaller channels, allowing for even distribution of the fluid and providing a larger surface area for heat exchange; the mesh-like or lattice-like microchannels form a mesh or lattice-like structure providing multiple paths for the flow of cooling fluid. The micro-channel 41 can be selected according to the actual requirement in preparation, and can also be selected from a plurality of composite micro-channels combined. In this embodiment, the micro-channel 41 is selected to be a linear structure.
Specifically, the flexible structure 411 includes any one of fine textures, fine protrusions, rotating blades, wave-shaped structures, elastic structures, and capillary structures. The flexible structure 411 is used in the present invention to optimize the flow of the cooling liquid, increase the contact area of the liquid with the surface of the micro channel 41, or cause the rotation and turbulence of the fluid, thereby improving the heat dissipation efficiency. Wherein fine textures and fine protrusions may be formed on the inner surface of the micro-channels to increase turbulence of the cooling liquid, thereby increasing the heat dissipation effect. The rotating blades may cause the cooling fluid to rotate within the micro-channels 41, thereby increasing the contact of the fluid with the channel surfaces. The wavy structure is wavy on the inner surface of the micro-channel 41, so that turbulence is generated when the cooling liquid flows through. The elastic structure may comprise a material that may change shape under certain conditions (e.g., temperature or flow rate). The capillary structure may increase the surface area and result in a dispersed flow of the cooling liquid. Preferably, the flexible structure 411 provided in this embodiment is an elastic structure selected so as to be combined with the micro channel 41 having a linear structure, and has a simple structure and is convenient to manufacture.
The invention also provides a preparation method of the SIP packaging structure, which is used for preparing the SIP packaging structure and specifically comprises the following steps:
s1, providing a substrate, mounting the components on the substrate through welding or conductive adhesive, and forming point electrical connection between the components through metal wires and/or solder balls;
s2, providing a packaging cover plate, and packaging and fixing the packaging cover plate and the substrate;
s3, providing a ceramic liquid cooling sheet, and fixing the ceramic liquid cooling sheet on the other side of the substrate;
s4, carrying out surface polishing, cleaning and surface treatment to obtain the SIP packaging structure.
Specifically, all components to be integrated and their layout and interconnections in the package need to be determined before S1, and in S1, a suitable substrate material, including a circuit board or a ceramic substrate, is selected and prepared. Functional and performance testing is also required before S4 to ensure that all components are working as intended. After S4, a final quality control check is also required to ensure that the product meets all specifications and standards.
When the SIP packaging structure 100 provided by the invention operates, an external power supply is connected, the SIP packaging structure 100 starts to operate, a plurality of chips and a plurality of devices generate huge heat, a packaging cover plate 30 on a ceramic cavity is a metal sheet of a heat dissipation structure and absorbs the heat transferred to the upper part, copper columns are arranged below the chip positions, pass through the substrate 10 and are inserted into micro-channels 41 of the ceramic liquid cooling sheet 40, so that the generated heat can be quickly transferred to the ceramic liquid cooling sheet 40, and the heat generated by the rest devices is transferred to the ceramic liquid cooling sheet by virtue of the good heat dissipation capacity of the ceramic plate, and is taken away by cooling liquid flowing in the ceramic sheet. Under the superposition of the effects of double-sided heat dissipation, a good operating environment can be built for the components 20. Meanwhile, a flexible structure 411 is added on the surface of the micro-channel 41, and forms a certain angle with the flow direction, so that the fluid is disturbed to generate orderly vortex, the heat exchange coefficient with the wall surface is enhanced, and the heat transfer capacity of the channel is improved. Under the support of the flexible structure 411, the heat dissipation effect of the SIP package structure 100 can be improved by 30% -40% under the condition that the channel size, the number and the fluid flow rate structure are consistent.
In general, the SIP packaging structure and the method for manufacturing the same provided by the present invention enable the SIP packaging structure 100 to have a stacked heat dissipation capability by adopting a dual-sided heat dissipation structure; meanwhile, the flexible structure 411 is arranged on the inner surface of the micro-channel 41 of the ceramic liquid cooling plate 40, so that orderly vortex is generated for the flow of the cooling liquid, the heat exchange coefficient with the wall surface is enhanced, the heat exchange coefficient with the wall surface of the ceramic liquid cooling plate is improved, the heat transfer capacity of the micro-channel 41 is improved, an efficient SIP packaging structure 100 is provided, the temperature can be effectively reduced, the heat dissipation efficiency is improved, and the stable operation of the SIP packaging structure 100 under the high-power-consumption working condition is ensured.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (9)
1. The utility model provides a SIP packaging structure, its characterized in that includes the base plate, sets up components and parts and two-sided heat radiation structure on the base plate, two-sided heat radiation structure is including setting up encapsulation apron and the setting on base plate one side are in the ceramic liquid cooling piece of base plate opposite side, the base plate with encapsulation apron encloses into the cavity of acceping components and parts, encapsulation apron sets up the top of components and parts, set up at least one microchannel that transversely runs through on the ceramic liquid cooling piece, the microchannel supplies the cooling liquid circulation, the internal surface of microchannel sets up flexible structure, flexible structure with the flow direction of cooling liquid forms the angle.
2. The SIP package structure of claim 1, further comprising a metal layer disposed between the substrate and the component, wherein the metal layer is disposed on a side of the ceramic liquid cooling sheet adjacent to a plurality of array metal posts, and wherein the metal posts pass through the substrate and are inserted into the micro-channels of the ceramic liquid cooling sheet.
3. The SIP package structure of claim 2, wherein the metal layer is a copper layer and the metal pillars are copper pillars.
4. The SIP package structure of claim 1, wherein the package cover is a metal sheet having a heat dissipation structure.
5. The SIP package structure of claim 1, wherein the micro-channels are linear, threaded, tree-like or bifurcated, mesh-like or lattice-like.
6. The SIP package structure of claim 1, wherein the flexible structure comprises any one of a fine texture, fine protrusions, rotating blades, wavy structures, elastic structures, and capillary structures.
7. The SIP package structure of claim 1, wherein the components include a main control chip module and a radio frequency chip module.
8. The SIP package structure of claim 1, wherein the substrate is a ceramic substrate.
9. A method for preparing a SIP package structure, which is used for preparing the SIP package structure according to any one of claims 1-8, specifically comprising the following steps:
s1, providing a substrate, mounting the components on the substrate through welding or conductive adhesive, and forming point electrical connection between the components through metal wires and/or solder balls;
s2, providing a packaging cover plate, and packaging and fixing the packaging cover plate and the substrate;
s3, providing a ceramic liquid cooling sheet, and fixing the ceramic liquid cooling sheet on the other side of the substrate;
s4, carrying out surface polishing, cleaning and surface treatment to obtain the SIP packaging structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311297996.2A CN117276221A (en) | 2023-10-09 | 2023-10-09 | SIP packaging structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311297996.2A CN117276221A (en) | 2023-10-09 | 2023-10-09 | SIP packaging structure and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117276221A true CN117276221A (en) | 2023-12-22 |
Family
ID=89202296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311297996.2A Pending CN117276221A (en) | 2023-10-09 | 2023-10-09 | SIP packaging structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117276221A (en) |
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2023
- 2023-10-09 CN CN202311297996.2A patent/CN117276221A/en active Pending
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