CN117276163A - Wafer box carrying device for ultra-clean environment - Google Patents

Wafer box carrying device for ultra-clean environment Download PDF

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Publication number
CN117276163A
CN117276163A CN202311562626.7A CN202311562626A CN117276163A CN 117276163 A CN117276163 A CN 117276163A CN 202311562626 A CN202311562626 A CN 202311562626A CN 117276163 A CN117276163 A CN 117276163A
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CN
China
Prior art keywords
clamping
rod
fixed
wafer box
shaft
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Granted
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CN202311562626.7A
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Chinese (zh)
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CN117276163B (en
Inventor
林坚
王彭
吴国明
王栋梁
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Honghu Suzhou Semiconductor Technology Co ltd
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Honghu Suzhou Semiconductor Technology Co ltd
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Priority to CN202311562626.7A priority Critical patent/CN117276163B/en
Publication of CN117276163A publication Critical patent/CN117276163A/en
Application granted granted Critical
Publication of CN117276163B publication Critical patent/CN117276163B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention belongs to the technical field of wafer box conveying, and discloses a wafer box conveying device for an ultra-clean environment, which comprises the following components: the machine base is provided with a robot arm; the clamping jaw assembly is arranged at the extending end of the robot arm and used for clamping and carrying the wafer box; the clamping plates are oppositely arranged on the clamping jaw assemblies and are used for abutting against two side walls of the wafer box when clamping and conveying the wafer box, so as to clamp the wafer box; and the expansion assembly is arranged on the clamping jaw assembly and used for expanding the contact area between the clamping plate and the wafer box. The clamping plate is formed by combining a plurality of sub-plates, and when the clamping plate is folded, the clamping plate is combined into a complete disc to clamp the wafer box with small size; when the clamping plate expands, the plurality of sub-plates can be sequentially separated and expanded outwards, and the expanded plurality of sub-plates are on the same virtual circle, so that the phenomenon that the wafer box with large size is damaged due to concentrated clamping force is avoided.

Description

Wafer box carrying device for ultra-clean environment
Technical Field
The invention belongs to the technical field of wafer box conveying, and particularly relates to a wafer box conveying device for an ultra-clean environment.
Background
The wafer has the characteristics of thin thickness, light weight, large brittleness, high requirement on environmental cleanliness and the like, and in order to reduce the risk of pollution of the wafer, the wafer is generally stored in and transported through the wafer box.
In the conventional wafer box carrying process, two clamping and carrying modes are mainly adopted, wherein one mode is to clamp, hoist and carry a top bracket of the wafer box; the other is to clamp and carry the side wall of the wafer box; the hanging and carrying mode is adopted, so that the falling is easily caused by the fact that the support at the top of the wafer box is not firm enough; when carrying the lateral wall of wafer box to the adoption, the area of atress of manipulator centre gripping is unadjustable, if the wafer box is great, and the centre gripping stress face concentrates on a certain fritter, leads to the wafer box to appear deformation easily, leads to inside wafer damage of placing.
The patent of the application publication No. CN116062455A discloses a grabbing device and a driving mechanism thereof, wherein two first protruding edges on two sides of a wafer box deviating from are respectively inserted into a first clamping groove of a pair of first clamping parts, and the first clamping grooves and the first protruding edges are arranged along the horizontal direction, so that the wafer box can be carried through the pair of first clamping parts, the movement of a wafer is realized, the wafer is prevented from falling off from a clamp and is damaged, and the processing efficiency of the wafer is effectively improved.
Although the above-mentioned patent can realize the effect of carrying the wafer cassette by clamping, there are also the following problems:
when carrying out the centre gripping to the wafer box lateral wall, too rely on the protruding arris structure of wafer box lateral wall, the limitation of use is great, and when the centre gripping to the wafer box lateral wall, the area of atress of manipulator centre gripping is unadjustable, and the stress point is too gathering, influences the stability of centre gripping.
Disclosure of Invention
The invention aims to provide a grabbing device and a driving mechanism thereof, which are used for solving the technical problems in the background technology.
In order to achieve the above purpose, the present invention adopts the following technical scheme: a wafer cassette handling device for an ultra clean environment, comprising: the machine base is provided with a robot arm; the clamping jaw assembly is arranged at the extending end of the robot arm and used for clamping and carrying the wafer box; the clamping plates are oppositely arranged on the clamping jaw assemblies and are used for abutting against two side walls of the wafer box when clamping and conveying the wafer box, so as to clamp the wafer box; the expansion assembly is arranged on the clamping jaw assembly and used for expanding the contact area between the clamping plate and the wafer box; the clamping plates are expanded or folded according to the sizes of the wafer boxes by the expansion assembly, so that the wafer boxes with different sizes can be effectively clamped.
Preferably, the jaw assembly comprises: the control seat is fixedly connected with the extending end of the robot arm; the first clamping arm is arranged on the control seat in a sliding manner and is fixedly connected with the clamping plate; the second clamping arm is arranged on the control seat in a sliding manner, is identical to the first clamping arm in structure and is symmetrically arranged.
Preferably, the clamping plate includes: the fixed shaft is fixedly arranged on the first clamping arm and the second clamping arm; the fixed ring plate is arranged at one end of the fixed shaft and is fixedly connected with the fixed shaft through a connecting rod; the dividing plates are arranged in a plurality and are circumferentially and uniformly distributed on the fixed ring plate, and the dividing plates are combined into a disc; the rotating shaft is rotatably arranged on the fixed ring plate, and one end of the rotating shaft is fixedly connected with one side surface of the dividing plate; the first gear is fixedly sleeved at one end of the rotating shaft far away from the split plate.
Preferably, the first clamping arm includes: the fixed rod is arranged on one side of the control seat and is in sliding connection with the control seat; the fixed plate is arranged at one end of the fixed rod far away from the control seat and is perpendicular to the fixed rod, and the fixed plate is fixedly connected with the fixed shaft and is perpendicular to the fixed shaft; the U-shaped sliding seat is arranged on the control seat in a sliding manner and is fixedly connected with one end of the fixed rod, which is close to the control seat.
Preferably, the expansion assembly includes: the auxiliary clamping structure is used for increasing the clamping area of the wafer box; the driving structure is used for providing power support for the unfolding or folding of the auxiliary clamping structure; and the transmission structure is used for transmitting power generated during the operation of the driving structure to the auxiliary clamping structure.
Preferably, the auxiliary clamping structure comprises: the sliding cavity is arranged in the fixed shaft; the sliding shaft rod is arranged in the sliding cavity in a sliding way, and one end of the sliding shaft rod extends to the outside of the sliding cavity; the guide rod is arranged on the side wall of the sliding shaft rod and used for guiding and limiting the movement of the sliding shaft rod; the auxiliary clamping plate is arranged at one end of the fixed shaft and is fixedly connected with one end of the sliding shaft rod.
Preferably, the transmission structure includes: the driving shaft is rotatably arranged inside the fixed plate; the driven shaft sleeve is rotatably arranged on the fixed shaft and is opposite to the drive shaft; the synchronous belt is arranged between the driving shaft and the driven shaft sleeve; the guide groove is arranged on the inner wall of the driven shaft sleeve and is matched with one end of the guide rod extending to the outside of the sliding cavity; the toothed ring is arranged on one side of the fixed ring plate and fixedly connected with the driven shaft sleeve through a connecting rod, and the toothed ring is meshed with the first gear.
Preferably, the driving structure includes; a second gear disposed on the drive shaft; the rack is arranged in the fixed plate in a sliding way and meshed with the second gear, and one end of the rack extends to the outside of the fixed plate and is in sliding connection with the fixed rod; the bidirectional telescopic rod is arranged between the two racks and used for adjusting the distance between the two racks; the electric push rod is arranged on the side wall of the control seat, and the extension end of the electric push rod is fixedly connected with one side of the bidirectional telescopic rod and is used for driving the rack to move by pushing and pulling the bidirectional telescopic rod.
Preferably, the control seat includes: a housing; the bidirectional screw rod is rotatably arranged in the shell; the screw rod nut is oppositely arranged on the bidirectional screw rod; the through grooves are oppositely formed on the upper surface and the lower surface of the shell; the connecting block is fixedly arranged on the screw rod nut and penetrates through the through groove and is fixedly connected with the U-shaped sliding seat.
Preferably, the control seat further comprises: the driving motor is arranged at the top end inside the shell; the first bevel gear is fixedly arranged at the output end of the driving motor; the second bevel gear is fixedly arranged in the middle of the bidirectional screw rod and is meshed with the first bevel gear.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. the clamping plate is formed by combining a plurality of sub-plates, and when the clamping plate is folded, the clamping plate is combined into a complete disc to clamp the wafer box with small size; when the clamping plate expands, a plurality of sub-plates can be sequentially separated and expanded outwards, and the expanded sub-plates are on the same virtual circle, so that the clamping contact surface of the wafer box is regularly dispersed, the clamping force of the wafer box is uniformly distributed, the phenomenon that the wafer box with large size is damaged due to the concentrated clamping force is avoided, the wafer box can be automatically adjusted according to the size of the wafer box, and the wafer box is convenient to use.
2. According to the invention, the auxiliary clamping structure is arranged, when the plurality of sub-plates are expanded outwards, the driven shaft sleeve rotates and drives the sliding shaft rod to extend outwards from the sliding cavity, so that the auxiliary clamping plate can be pushed outwards, the auxiliary clamping plate and the plurality of expanded sub-plates are uniformly contacted with the side wall of the wafer box, the clamping area of the wafer box can be increased while the clamping stress points of the wafer box are dispersed, the wafer box is effectively clamped, and the clamping is more stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a front view of the present invention;
FIG. 2 shows an overall block diagram of the jaw assembly of the present invention;
FIG. 3 shows a schematic diagram of the control seat structure of the present invention;
FIG. 4 shows a schematic diagram of the drive configuration of the present invention;
FIG. 5 shows a cross-sectional structural view of a fixing plate of the present invention;
FIG. 6 shows an exploded view of the clamping plate of the present invention;
FIG. 7 shows a schematic view of the auxiliary clamping structure of the present invention;
FIG. 8 illustrates a block diagram of the driven bushing of the present invention;
FIG. 9 shows a schematic view of the clamp plate in an expanded configuration;
fig. 10 shows another operational state diagram of the jaw assembly.
Reference numerals: 100. a base; 102. a robotic arm; 200. a jaw assembly; 201. a control base; 201a, a housing; 201b, a bidirectional screw rod; 201c, a screw nut; 201d, connecting blocks; 201e, through slots; 201f, driving a motor; 201g, a first bevel gear; 201h, a second bevel gear; 202. a first clamp arm; 202a, a fixed rod; 202b, a fixing plate; 202c, a U-shaped slide; 203. a second clamp arm; 300. a clamping plate; 301. a fixed shaft; 302. a fixed ring plate; 303. dividing plates; 304. a rotating shaft; 305. a first gear; 400. an expansion component; 401. an auxiliary clamping structure; 401a, a sliding chamber; 401b, a sliding shaft; 401c, a guide bar; 401d, auxiliary splints; 402. a transmission structure; 402a, a drive shaft; 402b, a synchronous belt; 402c, driven bushings; 402c-1, guide slots; 402d, toothed ring; 403. a driving structure; 403a, a second gear; 403b, a rack; 403c, a bidirectional telescopic rod; 403d, electric push rod.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, a wafer box carrying device for ultra-clean environment includes a machine base 100, on which a robot arm 102 is disposed, an extension end of the robot arm 102 is connected with a clamping jaw assembly 200, and the robot arm 102 cooperates with the clamping jaw assembly 200 to clamp and carry a wafer box;
specifically, referring to fig. 1 and 2, the jaw assembly 200 includes a control seat 201 fixedly coupled to the extended end of the robotic arm 102; the control seat 201 is provided with a first clamping arm 202 and a second clamping arm 203 which are opposite to each other, the first clamping arm 202 comprises a fixed rod 202a which is arranged on one side of the control seat 201 and is in sliding connection with the control seat 201, one end of the fixed rod 202a, which is close to the control seat 201, is fixedly connected with a U-shaped sliding seat 202c, and the U-shaped sliding seat 202c is arranged on the control seat 201 in a sliding manner; one end of the fixed rod 202a, which is far away from the control seat 201, is fixedly connected with a fixed plate 202b, the fixed plate 202b is vertically arranged with the fixed rod 202a, the fixed plate 202b is provided with a clamping plate 300 which is used for abutting against two side walls of the wafer box when clamping and conveying the wafer box, the wafer box is clamped, and the surface of the clamping plate 300 is provided with a rubber pad, so that on one hand, the friction force of the clamping plate 300 contacting the wafer box can be increased, and on the other hand, the extrusion force of the clamping plate 300 contacting the wafer box can be buffered, and the stress point of the wafer box is protected; the second clamping arm 203 is identical in structure and symmetrically arranged with the first clamping arm 202.
In this embodiment, when the first clamping arm 202 and the second clamping arm 203 move on the control seat 201 in opposite directions through the U-shaped sliding seat 202c, the distance between the first clamping arm 202 and the second clamping arm 203 is reduced, and the wafer box located between the first clamping arm 202 and the second clamping arm 203 can be clamped by the clamping plate 300, so that clamping and carrying of the wafer box are realized; after the robot arm 102 drives the wafer cassette carried by the clamping jaw assembly 200 to move to the corresponding position, the first clamping arm 202 and the second clamping arm 203 can move back to the control seat 201 through the U-shaped sliding seat 202c to release the clamped wafer cassette.
Further, referring to fig. 3, the control seat 201 includes a housing 201a, a bidirectional screw rod 201b is rotatably mounted in the housing 201a, two screw nuts 201c are provided on the bidirectional screw rod 201b, the two screw nuts 201c are oppositely disposed, and each of the two screw nuts 201c is fixedly connected with a connection block 201d, the connection blocks 201d are used for respectively connecting the two screw nuts 201c with two U-shaped sliding seats 202c, in order to facilitate the connection blocks 201d to extend to the outside of the housing 201a and slide on the housing 201a, through grooves 201e are correspondingly formed on the upper surface and the lower surface of the housing 201a, and the connection blocks 201d are fixedly connected with the U-shaped sliding seats 202c through the through grooves 201 e;
a driving motor 201f for driving the bidirectional screw rod 201b to rotate is further arranged in the control seat 201, the driving motor 201f is arranged at the top end in the shell 201a, an output shaft of the driving motor 201f is fixedly connected with a first bevel gear 201g, a second bevel gear 201h is fixedly arranged in the middle of the bidirectional screw rod 201b, and the second bevel gear 201h is in meshed connection with the first bevel gear 201 g;
in this embodiment, the driving motor 201f works to drive the first bevel gear 201g to rotate, and the first bevel gear 201g rotates while engaging with the second bevel gear 201h to rotate synchronously, so that the bidirectional screw rod 201b rotates, and when the bidirectional screw rod 201b rotates, two screw nuts 201c move in opposite directions or in opposite directions, and when the screw nuts 201c move, the first clamping arm 202 and the second clamping arm 203 can be driven to move in opposite directions or in opposite directions, so as to adjust the distance between the first clamping arm 202 and the second clamping arm 203.
Working principle: when the wafer box needs to be clamped and transported by using the robot arm 102, the clamping jaw assembly 200 is firstly moved to the place where the wafer box is placed by using the robot arm 102, then the first bevel gear 201g is driven to rotate by using the driving motor 201f, the first bevel gear 201g can be meshed with the second bevel gear 201h to synchronously rotate while rotating, so that the bidirectional screw rod 201b can be rotated, two screw nuts 201c on the bidirectional screw rod 201b can oppositely move, the two U-shaped sliding seats 202c respectively drive the first clamping arm 202 and the second clamping arm 203 to approach, the clamping plates 300 on the first clamping arm 202 and the second clamping arm 203 are used for clamping the two sides of the wafer box, and after the clamped wafer box moves to the corresponding position under the operation of the robot arm 102, the driving motor 201f is used for reversely rotating, so that the two screw nuts 201c can be reversely moved, and further the first clamping arm 202 and the second clamping arm 203 are mutually far away, and the clamping plates 300 can be separated from the wafer box, so that the wafer box can be carried.
Example 2
On the basis of embodiment 1, in order to make the distribution of clamping stress points reasonable when carrying wafer cassettes of different sizes, the invention also provides an expanding assembly 400 for gathering or dispersing the contact positions of the clamping plate 300 and the wafer cassettes; the wafer cassettes of different sizes are effectively clamped.
Specifically, referring to fig. 5 and 6, the clamping plate 300 includes a fixed shaft 301, a fixed ring plate 302, a plurality of sub-plates 303, a rotation shaft 304, and a first gear 305; wherein the fixed shaft 301 is fixedly installed on the fixed plate 202 b; a fixed ring plate 302 disposed at one end of the fixed shaft 301 and fixedly connected to the fixed shaft 301 through a connecting rod; a plurality of sub-plates 303 are circumferentially and uniformly distributed on the fixed ring plate 302, and the plurality of sub-plates 303 are sequentially contacted and combined into a disc; the rotating shafts 304 are the same in number as the split plates 303 and are rotatably arranged on the fixed ring plate 302, one end of each rotating shaft 304 penetrates through the fixed ring plate 302 and is fixedly connected with one side surface of the split plate 303, and the other end of each rotating shaft 304 is connected with a first gear 305;
in this embodiment, when a large-sized wafer box needs to be clamped, the external driving structure 403 may be used to drive the first gear 305 to rotate at a certain angle at this time, so that the rotating shaft 304 may rotate synchronously, and the rotating shaft 304 may simultaneously drive the sub-plates 303 to expand to the outside of the fixed ring plate 302 with the rotating shaft 304 as the center, so that the plurality of sub-plates 303 are separated from each other, and the plurality of sub-plates 303 after being expanded are located on the same virtual circle, so that the clamping points are annularly distributed on the wafer box, so that the side wall of the large-sized wafer box is stressed and dispersed, a phenomenon that the clamping stress points are gathered on a certain part of the side wall of the wafer box, resulting in deformation or damage of the wafer box is avoided, and the stability of clamping is ensured.
Further, referring to fig. 5, the expansion assembly 400 includes a transmission structure 402, where the transmission structure 402 includes a driving shaft 402a, a driven shaft sleeve 402c, a synchronous belt 402b and a toothed ring 402d, where the driving shaft 402a is rotatably installed at the top end inside the fixed plate 202b, the driven shaft sleeve 402c is rotatably installed on the fixed shaft 301 and is opposite to the driving shaft 402a, a part of the driven shaft sleeve 402c is located inside the fixed plate 202b, another part of the driven shaft sleeve 402c extends to be located outside the fixed plate 202b, the synchronous belt 402b is sleeved between the driving shaft 402a and the driven shaft sleeve 402c, and when the driving shaft 402a rotates, the driven shaft sleeve 402c can be driven by the synchronous belt 402b to rotate synchronously; the toothed ring 402d is arranged on one side of the fixed ring plate 302 and is fixedly connected with the driven shaft sleeve 402c through a connecting rod, the toothed ring 402d is meshed with the plurality of first gears 305, and the driven shaft sleeve 402c rotates to drive the toothed ring 402d to rotate and mesh with the first gears 305 to rotate; in this embodiment, when the driving shaft 402a rotates, the driven shaft sleeve 402c can be driven to rotate by a certain angle through the synchronous belt 402b, and the driven shaft sleeve 402c can simultaneously drive the toothed ring 402d to rotate, so that the toothed ring 402d can engage with the plurality of first gears 305 to rotate.
Further, referring to fig. 4, the expansion assembly 400 further includes a driving structure 403 for providing power support for the expansion of the split plate 303, wherein the driving structure 403 includes a second gear 403a, a rack 403b, a bi-directional expansion link 403c, and an electric push rod 403d, and the second gear 403a is disposed on the driving shaft 402a and fixedly connected to the driving shaft 402 a; the rack 403b is slidably arranged at the top end of the inner part of the fixed plate 202b and is meshed with the second gear 403a, one end of the rack 403b extends to the outer part of the fixed plate 202b and is fixedly connected with a lantern ring, and the lantern ring is slidably sleeved on the fixed rod 202 a; the bidirectional telescopic rod 403c is arranged between the two racks 403b and is fixedly connected with the two lantern rings respectively, and is used for adjusting the distance between the two racks 403 b; the electric push rod 403d is arranged on the side wall of the control seat 201, and the extension end of the electric push rod is fixedly connected with one side of the bidirectional telescopic rod 403c and is used for driving the rack 403b to move by pushing and pulling the bidirectional telescopic rod 403 c;
in this embodiment, when the partition 303 needs to be expanded, the electric push rod 403d may be used to shrink and pull the bidirectional telescopic rod 403c to translate, so that the rack 403b may move to the outside of the fixed plate 202b and engage the second gear 403a to rotate a certain angle, so that the driving shaft 402a may synchronously rotate a certain angle, and the driven shaft sleeve 402c may be driven to rotate by the synchronous belt 402 b.
Working principle: when clamping a large-size wafer box, the electric push rod 403d can be used for shrinking and pulling the bidirectional telescopic rod 403c to translate, so that the rack 403b moves towards the outside of the fixed plate 202b and is meshed with the second gear 403a to rotate a certain angle, the driving shaft 402a can synchronously rotate a certain angle, the driven shaft sleeve 402c is driven to rotate through the synchronous belt 402b, the driven shaft sleeve 402c synchronously moves while the toothed ring 402d is driven to rotate, the toothed ring 402d is meshed with the plurality of first gears 305, the plurality of rotating shafts 304 synchronously rotate and drive the plurality of sub-plates 303 to extend towards the outside of the fixed ring plate 302 by taking the rotating shafts 304 as the center, as shown in fig. 9, the plurality of sub-plates 303 after the extension are positioned on the same virtual circle, clamping points can be annularly distributed on the wafer box, the side wall of the large-size wafer box is dispersed under stress, the phenomenon that the wafer box is deformed or damaged due to the fact that the clamping stress points are gathered on a certain part of the side wall of the wafer box is avoided, and the stability is ensured;
when a small-sized wafer box needs to be clamped, the electric push rod 403d can be used for extending to push the bidirectional telescopic rod 403c to translate, the rack 403b can be moved towards the inside of the fixed plate 202b, the second gear 403a can be reversely rotated for a certain angle, meanwhile, the driving shaft 402a synchronously rotates and drives the driven shaft sleeve 402c to reversely rotate through the synchronous belt 402b, the driven shaft sleeve 402c drives the toothed ring 402d to reversely rotate, the rotating shaft 304 reversely rotates for a certain angle and drives the plurality of sub-plates 303 to rotate towards the inside of the fixed ring plate 302 by taking the rotating shaft 304 as the center, the plurality of sub-plates 303 are sequentially contacted and closed to form a disc, and the disc formed by combination can be contacted with the side wall of the wafer box during clamping; the clamping plate 300 is adjusted to expand or retract, so that the clamping device is suitable for clamping wafer boxes with different sizes.
Example 3
In order to avoid excessive dispersion of the expanded clamping points on the basis of the embodiment 1 and the embodiment 2, the invention further discloses an expanding assembly 400;
referring to fig. 7 and 8, the expansion assembly 400 includes: an auxiliary clamping structure 401 for increasing the clamping area of the wafer cassette; the auxiliary clamping structure 401 comprises a sliding cavity 401a which is arranged in the fixed shaft 301, a sliding shaft lever 401b is slidably arranged in the sliding cavity 401a, one end of the sliding shaft lever 401b is fixedly connected with a limiting plate, the other end of the sliding shaft lever 401b extends to the outside of the sliding cavity 401a and is fixedly connected with an auxiliary clamping plate 401d, a rubber pad is arranged on the surface of the auxiliary clamping plate 401d, and the auxiliary clamping plate 401d is positioned on one side of the middle part of a disc formed when the sub-plates 303 are closed and is in contact with the disc; two guide rods 401c are arranged on the sliding shaft rod 401b, sliding grooves penetrating through the sliding cavity 401a are symmetrically formed in the fixed shaft 301, one end of each guide rod 401c penetrates through each sliding groove and extends into a guide groove 402c-1 formed in the inner wall of the driven shaft sleeve 402c, the whole guide groove 402c-1 is in an inclined arc shape, and the radian of the guide groove 402c-1 is the same as the deflection angle of the driven shaft sleeve 402 c;
when the driven shaft sleeve 402c rotates for a certain angle to drive the toothed ring 402d to rotate for expansion, the split plate 303 expands outwards, meanwhile, the driven shaft sleeve 402c rotates to enable the sliding shaft rod 401b to move along the guide groove 402c-1 through the guide rod 401c, so that the sliding shaft rod 401b drives the auxiliary clamping plate 401d to synchronously move away from the fixed shaft 301, at the moment, after the split plate 303 expands outwards, the auxiliary clamping plate 401d is positioned in the center part of a virtual circle surrounded by the split plate 303, as shown in fig. 10, the split plate 303 can be utilized for clamping a large-size wafer box, and meanwhile, the auxiliary clamping plate 401d is utilized for synchronously clamping, so that redundant dispersion of clamping force after the split plate 303 expands can be avoided, and the contact area for clamping the wafer box can be increased, so that the clamping stability is ensured;
when the driven shaft sleeve 402c reversely rotates and the dividing plate 303 is folded, the sliding shaft rod 401b moves along the guide groove 402c-1 through the guide rod 401c, so that the auxiliary clamping plate 300 moves towards the direction of the fixed shaft 301, the auxiliary clamping plate 300 is positioned in the middle of a disc formed when the dividing plate 303 is closed and is in contact with the disc, and when the outside of a small-size wafer is clamped by the closed dividing plate 303, the auxiliary clamping plate 300 can support the middle of the disc formed after the dividing plate 303 is closed, so that stable clamping is ensured.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.

Claims (10)

1. A wafer cassette handling apparatus for an ultra clean environment, comprising:
a machine base (100) on which a robot arm (102) is provided;
the clamping jaw assembly (200) is arranged at the extending end of the robot arm (102) and used for clamping and carrying the wafer box;
clamping plates (300) which are oppositely arranged on the clamping jaw assemblies (200) and are used for abutting against two side walls of the wafer box when clamping and conveying the wafer box to clamp the wafer box;
the expanding assembly (400) is arranged on the clamping jaw assembly (200) and is used for expanding the contact area of the clamping plate (300) and the wafer box;
the expansion assembly (400) expands or gathers the clamping plates (300) according to the sizes of the wafer boxes, disperses or gathers the clamping points, and realizes effective clamping of the wafer boxes with different sizes.
2. The wafer cassette handling device for an ultra clean environment according to claim 1, wherein the clamping jaw assembly (200) comprises:
the control seat (201) is fixedly connected with the extending end of the robot arm (102);
the first clamping arm (202) is arranged on the control seat (201) in a sliding manner and is fixedly connected with the clamping plate (300);
the second clamping arm (203) is arranged on the control seat (201) in a sliding manner, is identical to the first clamping arm (202) in structure and is symmetrically arranged.
3. The wafer cassette transport apparatus for an ultra-clean environment according to claim 2, wherein the clamping plate (300) comprises:
a fixed shaft (301) fixedly mounted on the first clamp arm (202) and the second clamp arm (203);
the fixed ring plate (302) is arranged at one end of the fixed shaft (301) and is fixedly connected with the fixed shaft (301) through a connecting rod;
the dividing plates (303) are arranged in a plurality and are circumferentially and uniformly distributed on the fixed ring plate (302), and the dividing plates (303) are combined into a disc;
a rotating shaft (304) rotatably mounted on the fixed ring plate (302), one end of which is fixedly connected with one side surface of the split plate (303);
the first gear (305) is fixedly sleeved at one end of the rotating shaft (304) far away from the split plate (303).
4. The wafer cassette transport apparatus for an ultra-clean environment according to claim 3, wherein the first clamp arm (202) comprises:
the fixed rod (202 a) is arranged on one side of the control seat (201) and is in sliding connection with the control seat (201);
the fixed plate (202 b) is arranged at one end of the fixed rod (202 a) far away from the control seat (201) and is perpendicular to the fixed rod (202 a), and the fixed plate (202 b) is fixedly connected with the fixed shaft (301) and is perpendicular to the fixed shaft (301);
the U-shaped sliding seat (202 c) is arranged on the control seat (201) in a sliding manner and is fixedly connected with one end of the fixed rod (202 a) close to the control seat (201).
5. The wafer cassette transport apparatus for an ultra-clean environment according to claim 4, wherein said expansion assembly (400) comprises:
an auxiliary clamping structure (401) for increasing the clamping area of the wafer cassette;
a driving structure (403) for providing power support for the auxiliary clamping structure (401) to be unfolded or folded;
and the transmission structure (402) is used for transmitting power generated by the operation of the driving structure (403) to the auxiliary clamping structure (401).
6. The wafer cassette transport apparatus for an ultra-clean environment according to claim 5, wherein the auxiliary clamping structure (401) comprises:
a sliding cavity (401 a) which is arranged inside the fixed shaft (301);
a sliding shaft rod (401 b) which is arranged inside the sliding cavity (401 a) in a sliding way, and one end of the sliding shaft rod (401 b) extends to the outside of the sliding cavity (401 a);
the guide rod (401 c) is arranged on the side wall of the sliding shaft rod (401 b) and used for guiding and limiting the movement of the sliding shaft rod (401 b);
the auxiliary clamping plate (401 d) is arranged at one end of the fixed shaft (301) and is fixedly connected with one end of the sliding shaft lever (401 b).
7. The wafer cassette handling device for an ultra clean environment according to claim 6, wherein the transmission structure (402) comprises:
a drive shaft (402 a) rotatably mounted inside the fixed plate (202 b);
a driven shaft sleeve (402 c) rotatably mounted on the fixed shaft (301) and disposed opposite to the drive shaft (402 a);
a timing belt (402 b) provided between the drive shaft (402 a) and the driven bushing (402 c);
a guide groove (402 c-1) which is arranged on the inner wall of the driven shaft sleeve (402 c) and is matched with one end of the guide rod (401 c) extending to the outside of the sliding cavity (401 a);
and a toothed ring (402 d) arranged on one side of the fixed ring plate (302) and fixedly connected with the driven shaft sleeve (402 c) through a connecting rod, wherein the toothed ring (402 d) is meshed with the first gear (305).
8. The wafer cassette transport apparatus for an ultra-clean environment according to claim 7, wherein said drive structure (403) comprises;
a second gear (403 a) provided on the drive shaft (402 a);
a rack (403 b) slidably disposed in the fixed plate (202 b) and engaged with the second gear (403 a), wherein one end of the rack (403 b) extends to the outside of the fixed plate (202 b) and is slidably connected with the fixed rod (202 a);
a bidirectional telescopic rod (403 c) arranged between the two racks (403 b) for adjusting the distance between the two racks (403 b);
the electric push rod (403 d) is arranged on the side wall of the control seat (201), and the extension end of the electric push rod is fixedly connected with one side of the bidirectional telescopic rod (403 c) and is used for driving the rack (403 b) to move by pushing and pulling the bidirectional telescopic rod (403 c).
9. The wafer cassette transport apparatus for an ultra clean environment according to claim 4 or 8, wherein the control base (201) includes:
a housing (201 a);
the bidirectional screw rod (201 b) is rotatably arranged in the shell (201 a);
the screw rod nut (201 c) is oppositely arranged on the bidirectional screw rod (201 b);
the through grooves (201 e) are oppositely formed on the upper surface and the lower surface of the shell (201 a);
the connecting block (201 d) is fixedly arranged on the screw nut (201 c), and the connecting block (201 d) penetrates through the through groove (201 e) and is fixedly connected with the U-shaped sliding seat (202 c).
10. The wafer cassette transport apparatus for an ultra-clean environment according to claim 9, wherein said control base (201) further comprises:
a drive motor (201 f) provided at the top end inside the housing (201 a);
a first bevel gear (201 g) fixedly arranged at the output end of the driving motor (201 f);
the second bevel gear (201 h) is fixedly arranged in the middle of the bidirectional screw rod (201 b) and is meshed with the first bevel gear (201 g).
CN202311562626.7A 2023-11-22 2023-11-22 Wafer box carrying device for ultra-clean environment Active CN117276163B (en)

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CN117276163B CN117276163B (en) 2024-01-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117913010A (en) * 2024-03-19 2024-04-19 捷螺智能设备(苏州)有限公司 Wafer box handling device in AMHS
CN117913010B (en) * 2024-03-19 2024-06-04 捷螺智能设备(苏州)有限公司 Wafer box handling device in AMHS

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219626619U (en) * 2023-04-18 2023-09-01 江苏启微半导体设备有限公司 Wafer transfer device and wafer cleaning equipment
CN219751657U (en) * 2023-05-08 2023-09-26 扬州晶樱光电科技有限公司 Lifting clamp for polycrystalline silicon ingot casting
CN116968491A (en) * 2023-08-23 2023-10-31 捷螺智能设备(苏州)有限公司 AMR multi-slot wafer box carrying trolley

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN219626619U (en) * 2023-04-18 2023-09-01 江苏启微半导体设备有限公司 Wafer transfer device and wafer cleaning equipment
CN219751657U (en) * 2023-05-08 2023-09-26 扬州晶樱光电科技有限公司 Lifting clamp for polycrystalline silicon ingot casting
CN116968491A (en) * 2023-08-23 2023-10-31 捷螺智能设备(苏州)有限公司 AMR multi-slot wafer box carrying trolley

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117913010A (en) * 2024-03-19 2024-04-19 捷螺智能设备(苏州)有限公司 Wafer box handling device in AMHS
CN117913010B (en) * 2024-03-19 2024-06-04 捷螺智能设备(苏州)有限公司 Wafer box handling device in AMHS

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