CN117276125B - Swing arm mechanism of semiconductor wafer cleaning machine - Google Patents
Swing arm mechanism of semiconductor wafer cleaning machine Download PDFInfo
- Publication number
- CN117276125B CN117276125B CN202311213207.2A CN202311213207A CN117276125B CN 117276125 B CN117276125 B CN 117276125B CN 202311213207 A CN202311213207 A CN 202311213207A CN 117276125 B CN117276125 B CN 117276125B
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- cantilever
- fixing seat
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- 238000004140 cleaning Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 title claims abstract description 16
- 238000009434 installation Methods 0.000 claims abstract description 14
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 8
- 239000000872 buffer Substances 0.000 claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000002146 bilateral effect Effects 0.000 claims 2
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention relates to a swing arm mechanism of a semiconductor wafer cleaning machine, which comprises a motor base, wherein a robot joint is fixedly connected to the motor base, a harmonic reducer is arranged in the robot joint, a main shaft is fixed on a rotating mandrel of the robot joint, a cantilever fixing seat is fixed at the top end of the main shaft, and a pipe fitting is fixed on the cantilever fixing seat; a cylinder is arranged below the motor seat and connected with a piston end of the cylinder, the cylinder drives the pipe fitting to ascend or descend through the motor seat, the cylinder is fixed on a cylinder seat plate, and the cylinder seat plate is fixed on the bottom plate; the other side of the bottom plate is provided with bilaterally symmetrical guide shafts, the guide shafts penetrate through the bottom plate, each guide shaft is provided with a flanged linear bearing, the flanged linear bearings are fixed on the bottom plate, one end of each guide shaft is fixed on the motor base, and the other end of each guide shaft is provided with a top extension base; the invention has the advantages of simple installation, reduced number of parts, reduced overall structure size and weight, and solves the problems of complex installation and large structure size of the traditional structure.
Description
[ technical field ]
The invention relates to the technical field of semiconductor wet processing, in particular to a swing arm mechanism of a semiconductor wafer cleaning machine.
[ background Art ]
Wafer refers to a silicon wafer used in the fabrication of semiconductor circuits. In the semiconductor manufacturing process, the wafer is stuck with impurities such as metals, particles, organic matters and the like, and the impurities are required to be removed by a cleaning machine. Wafer cleaning is a very important part in the semiconductor manufacturing process, and under the condition of not damaging the surface and electrical properties of the wafer, a chemical solution, gas, water and other mediums are used, and proper temperature and speed are set to achieve the cleaning purpose.
In the cleaning process, the swing arm structure can move up and down to ensure the proper distance between the medium outlet surface and the wafer surface, and the medium acts on the whole surface of the wafer through reciprocating swing.
At present, an air cylinder or an electric cylinder is used for driving the up-down movement of the swing arm structure, and the stability of the movement is ensured by virtue of a guide rail, but the guide rail is required to be arranged on a fixed plate, so that the installation size is larger, and the structure is more complex; the swing motion of the swing arm structure uses a torque motor as a drive, the swing arm is directly fixed on a motor rotor, but the torque motor is sensitive to the change of load inertia, if the load changes, the related gain parameters of the motor need to be readjusted, otherwise, larger vibration and noise are easily caused, and the operation is unstable.
In summary, it would be of great significance if improvements could be made to the swing arm structure of the existing wafer cleaning machine to solve the above-mentioned problems.
[ summary of the invention ]
The invention aims to solve the defects and provide the swing arm mechanism of the semiconductor wafer cleaning machine, which has the advantages of simpler installation, reduced number of parts, reduced overall structure size and weight, solves the problems of complex installation and large structure size of the traditional structure, and the problem that the traditional structure is used for replacing a torque motor.
The swing arm mechanism of the semiconductor wafer cleaning machine comprises a motor base 4, wherein a robot joint 18 is fixedly connected to the motor base 4, a harmonic reducer is arranged in the robot joint 18, a protective cover 13 is arranged below the robot joint 18, a main shaft 5 is fixed on a rotating mandrel of the robot joint 18, a cantilever fixing seat 6 is fixed at the top end of the main shaft 5, a pipe fitting 9 is fixed on the cantilever fixing seat 6, and the robot joint 18 drives the pipe fitting 9 to do circular arc motion after rotating, so that a motion track of the outlet center of the pipe fitting 9 passes through the center of a wafer; an air cylinder 19 is arranged below the motor seat 4 and is connected with a piston end of the air cylinder 19, the air cylinder 19 drives the pipe fitting 9 to ascend or descend through the motor seat 4, the air cylinder 19 is fixed on the air cylinder seat plate 2, and the air cylinder seat plate 2 is fixed on the bottom plate 1; the motor base is characterized in that the other side of the bottom plate 1 is provided with left and right symmetrical guide shafts 16, the guide shafts 16 penetrate through the bottom plate 1, each guide shaft 16 is provided with a flanged linear bearing 17, each flanged linear bearing 17 is fixed on the bottom plate 1, one end of each guide shaft 16 is fixed on the motor base 4, the other end of each guide shaft 16 is provided with a jacking seat 11 so as to ensure that the movement of each guide shaft 16 is not deflected, and the motor base 4 and the jacking seat 11 are provided with a hydraulic buffer 21 and ensure that the movement stopping process of the air cylinder 19 is stable through the hydraulic buffer 21.
Further, the cantilever fixing seat 6 is provided with an installation groove matched with the shape of the fixing part of the pipe fitting 9, and one end of the pipe fitting 9 is fixed on the cantilever fixing seat 6 through the cantilever pipe clamp front 7 and the cantilever pipe clamp rear 8 after being placed in the installation groove, so that the installation and the fixation between the pipe fitting 9 and the cantilever fixing seat 6 are simpler, and the structure is more compact; the cantilever fixing seat 6 is connected with a cantilever upper cover 10 in a matched manner, and the cantilever upper cover 10 covers a fixing part of the pipe fitting 9 fixed on the cantilever fixing seat 6, so that the sealing performance above is better.
Further, a pipe clamp fixing seat A14 and a pipe clamp fixing seat B15 are arranged below the cantilever fixing seat 6, and the pipe clamp fixing seat A14 and the pipe clamp fixing seat B15 are arranged at the lower end of the main shaft 5.
Further, the cylinder seat board 2 is fixed on one side of the bottom board 1 and forms a T-shaped structure with the bottom board 1, and a supporting block 3 is arranged between the cylinder seat board 2 and the bottom board 1 and improves the structural strength of the cylinder seat board through the supporting block 3.
Further, the piston end of the air cylinder 19 comprises a guide rod and a piston rod, the piston rod of the air cylinder 19 drives the guide rod to move after moving, and one ends of the guide rod and the piston rod are both arranged on the motor base 4, so that the stability of structural movement can be ensured.
Further, a first threaded hole is formed in the motor base 4, a hydraulic buffer 21 is installed through the first threaded hole, the hydraulic buffer 21 on the motor base 4 is located right above the cylinder seat board 2, a groove is formed in the middle of the top of the cylinder seat board 2 in a digging mode, and when the cylinder 19 descends to the position, an anti-collision head of the hydraulic buffer 21 abuts against the cylinder seat board 2.
Further, a second threaded hole which is bilaterally symmetrical is formed in the jacking seat 11, hydraulic buffers 21 are respectively installed through the threaded holes, the two hydraulic buffers 21 on the jacking seat 11 are respectively located right below the flanged linear bearing 17, and when the air cylinder 19 is lifted to the position, the hydraulic buffers 21 are used for resisting the lower bottom surface of the flanged linear bearing 17 by an anti-collision head.
Further, the pipe fitting 9 is composed of a round bar 22 with supporting function located above and two pipes 23 located below the round bar 22, the round bar 22 and the two pipes 23 are welded and fixed in a cylinder 24, the cylinder 24 is fixed on the cantilever fixing seat 6 through the front 7 of the cantilever pipe clamp, and the round bar is fixed on the cantilever fixing seat 6 through the rear 8 of the cantilever pipe clamp.
Further, the three pipe fittings 9 are respectively used for etching acid-water, cleaning two fluids and drying N2; the outlet pipes of the two pipes 23 for the acid-water etching adopt two straight pipes below to vertically downwards; two pipes 23 for drying N2 are divided at the downward bending part, and the lower Fang Lingyi pipes are inclined downward at 45 degrees; two tubes 23 for two fluids, one of which is below, are broken at a downward bend, and the lower Fang Lingyi tubes are vertically downward.
Compared with the prior art, the invention has the following advantages:
(1) According to the invention, the guide rail is replaced by the two guide shafts matched with the linear bearings, and the guide shafts are fixed on the motor base through the threaded holes on the end surfaces, so that the motor base is simple to install, the number of parts is reduced, the size of the whole structure is reduced, and the weight is reduced;
(2) The whole swing arm structure is fixed through the bottom plate, the fixing mode is simpler, parts are fewer, the structural size is smaller, the weight is lighter, and the problems that the guide rail mounting plate and the two side plates are required to be fixed, the mounting is complex and the structural size is large in the traditional guide rail structure are solved;
(3) According to the hydraulic buffer, when the hydraulic buffer is installed, the threaded holes are directly formed in the motor base and the top extension base, other parts are not added, and the problem that a supporting block is needed to be used for installing the hydraulic buffer in a traditional guide rail structure is solved;
(4) In the design of the pipe fitting, the universality is considered, the design quantity is simplified, and the cost is saved;
(5) The invention provides three pipe fittings which can be respectively used for acid-water etching, two-fluid cleaning and N2 blow-drying, and in order to ensure the universality, the installation and fixing parts of the pipe fittings are designed to be the same, and only the length and the style of the outlet pipe are designed to be different;
(6) According to the invention, the robot joint is used for replacing the torque motor, the harmonic speed reducer is fused in the robot joint, and the load inertia is reduced by many times after passing through the speed reducer, so that the influence of load change on the robot joint is small, the performance is more stable and reliable, and the robot joint has smaller volume and mass, so that the swing arm structure is lighter and exquisite.
[ description of the drawings ]
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic view of the overall external structure of the present invention;
FIG. 4 is a schematic view of the pipe fitting of the present invention;
FIG. 5 is a schematic diagram of a second embodiment of the pipe fitting of the present invention;
FIG. 6 is a schematic diagram III of the construction of the pipe fitting of the present invention;
in the figure: 1. the hydraulic support comprises a bottom plate 2, a cylinder seat plate 3, a support block 4, a motor base 5, a main shaft 6, a cantilever fixing seat 7, a cantilever pipe clamp front 8, a cantilever pipe clamp rear 9, a pipe fitting 10, a cantilever upper cover 11, a top extension seat 12, a motor wire fixing plate 13, a protective cover 14, a pipe clamp fixing seat A15, a pipe clamp fixing seat B16, a guide shaft 17, a flanged linear bearing 18, a robot joint 19, a cylinder 20, a full-thread screw 21, a hydraulic buffer 22, a round rod 23, two pipes 24 and a cylinder.
Detailed description of the preferred embodiments
As shown in fig. 1 to 3, the invention provides a swing arm mechanism of a semiconductor wafer cleaning machine, which comprises a motor base 4, wherein a robot joint 18 is fixedly connected to the motor base 4, a harmonic reducer is arranged in the robot joint 18, a protective cover 13 is arranged below the robot joint 18, the protective cover 13 can protect a wiring terminal below the robot joint 18 from being corroded, a main shaft 5 is fixed on a rotating mandrel of the robot joint 18, a cantilever fixing seat 6 is fixed at the top end of the main shaft 5, a pipe fitting 9 is fixed on the cantilever fixing seat 6, the robot joint 18 drives the pipe fitting 9 to do circular arc motion after rotating, and then a motion track of the center of an outlet of the pipe fitting 9 passes through the center of a wafer; an air cylinder 19 is arranged below the motor seat 4 and is connected with a piston end of the air cylinder 19, the air cylinder 19 drives the pipe fitting 9 to ascend or descend through the motor seat 4, the air cylinder 19 is fixed on the air cylinder seat plate 2, and the air cylinder seat plate 2 is fixed on the bottom plate 1; the cylinder seat board 2 is fixed on one side of the bottom board 1, and forms a T-shaped structure with the bottom board 1, a supporting block 3 is arranged between the cylinder seat board 2 and the bottom board 1, and the structural strength of the supporting block is improved through the supporting block 3; the piston end of the air cylinder 19 comprises a guide rod and a piston rod, the piston rod of the air cylinder 19 drives the guide rod to move after moving, and one ends of the guide rod and the piston rod are both arranged on the motor base 4, so that the stability of the structural movement can be ensured; the other side of the bottom plate 1 is provided with bilaterally symmetrical guide shafts 16, the guide shafts 16 penetrate through the bottom plate 1, each guide shaft 16 is provided with a flanged linear bearing 17, the flanged linear bearings 17 are fixed on the bottom plate 1, one end of each guide shaft 16 is fixed on the motor base 4, the other end of each guide shaft 16 is provided with a jacking seat 11 so as to ensure that the movement of the guide shaft 16 is not deflected, the motor base 4 and the jacking seat 11 are both provided with a hydraulic buffer 21, and the stable movement stopping process of the air cylinder 19 is ensured through the hydraulic buffer 21.
The cantilever fixing seat 6 is provided with an installation groove matched with the appearance of the fixing part of the pipe fitting 9, one end of the pipe fitting 9 is fixed on the cantilever fixing seat 6 through the front 7 of the cantilever pipe clamp and the rear 8 of the cantilever pipe clamp after being placed in the installation groove, so that the installation and the fixation between the pipe fitting 9 and the cantilever fixing seat 6 are simpler, and the structure is more compact; the cantilever fixing seat 6 is connected with a cantilever upper cover 10 in a matched manner, and the cantilever upper cover 10 covers the fixing part of the pipe fitting 9 fixed on the cantilever fixing seat 6, so that the upper sealing performance is better; a pipe clamp fixing seat A14 and a pipe clamp fixing seat B15 are arranged below the cantilever fixing seat 6, and the pipe clamp fixing seat A14 and the pipe clamp fixing seat B15 are arranged at the lower end of the main shaft 5.
The motor seat 4 is provided with a first threaded hole, a hydraulic buffer 21 is arranged through the first threaded hole, the hydraulic buffer 21 on the motor seat 4 is positioned right above the cylinder seat board 2, a groove is dug in the middle of the top of the cylinder seat board 2, and when the cylinder 19 descends to the position, the anti-collision head of the hydraulic buffer 21 props against the cylinder seat board 2; the jacking seat 11 is provided with a second symmetrically-arranged threaded hole, the hydraulic buffers 21 are respectively arranged through the threaded holes, the two hydraulic buffers 21 on the jacking seat 11 are respectively positioned right below the flanged linear bearing 17, and when the cylinder 19 is lifted to the position, the anti-collision head of the hydraulic buffer 21 props against the lower bottom surface of the flanged linear bearing 17.
The pipe fitting 9 is composed of a round bar 22 positioned on the upper surface and having a supporting function and two pipes 23 positioned below the round bar 22, wherein the round bar 22 and the two pipes 23 are welded and fixed in a cylinder 24, the cylinder 24 is fixed on the cantilever fixing seat 6 through the cantilever pipe clamp front 7, and the round bar is fixed on the cantilever fixing seat 6 through the cantilever pipe clamp rear 8; the pipe fitting 9 is provided with three types which are respectively used for etching acid-water, cleaning two fluids and drying N2; the outlet pipes of the two pipes 23 for the acid-water etching adopt two straight pipes below to vertically downwards; two pipes 23 for drying N2 are divided at the downward bending part, and the lower Fang Lingyi pipes are inclined downward at 45 degrees; two tubes 23 for two fluids, one of which is below, are broken at a downward bend, and the lower Fang Lingyi tubes are vertically downward.
The invention is further described below with reference to the accompanying drawings and specific examples:
the swing arm structure of the wafer cleaning machine mainly comprises two movements: the robot joint 18 rotates to drive the pipe fitting 9 to do circular arc movement, so that the movement track of the center of the pipe outlet passes through the center of the wafer; the lifting and retracting movement of the air cylinder guide rod drives the pipe fitting 9 to lift or descend, the descending position is a working position, and the lifting ensures that the pipe fitting 9 enters or exits from the working range and does not interfere with other parts.
The whole swing arm structure is fixed through the bottom plate 1, the traditional guide rail structure needs to fix the guide rail mounting plate and the two side plates, the mounting is complex, the structural size is large, and the whole swing arm structure is fixed through the bottom plate 1, so that the fixing mode is simpler, parts are fewer, the structural size is smaller, and the weight is lighter.
According to the invention, a robot joint 18 is fixed on a motor base 4, a main shaft 5 is fixed on a rotary mandrel of the robot joint 18, and a cantilever fixing base 6 is fixed on the main shaft 5; the robot joint 18 is used for replacing a torque motor, a harmonic reducer is arranged in the robot joint, and load inertia is reduced by many times after passing through the reducer, so that the influence of load change on the robot joint is small, the operation is simple, the performance is more stable and reliable, and the robot joint has smaller volume and mass, so that the swing arm structure is lighter and more exquisite.
The cylinder seat board 2 is fixed on one side of the bottom board 1, the structural strength of the cylinder seat board is improved by two supporting blocks 3, a cylinder body of the cylinder is fixed on the cylinder seat board 2, one end of a guide rod and one end of a piston rod are arranged on a motor base, the cylinder body is fixed, the movement of the piston rod drives the guide rod to move, in order to ensure the stability of the structural movement, two guide shafts 16 are added on the other side and matched with a linear bearing 17 with flanges, one end of each guide shaft 16 is fixed on the motor base 4, the other end of each guide shaft is provided with a jacking seat 11 to ensure that the movement of each guide shaft is not deflected, and the linear bearing 17 with flanges is fixed on the bottom board 1; the guide shaft 16 is simpler to install, has a reduced number of parts, has a reduced overall structural size, and is lightweight compared to a rail system.
In order to ensure the stable movement stopping process of the cylinder 19, the hydraulic buffer 21 is additionally arranged. The cylinder 19 descends, the hydraulic buffer 21 is arranged on the motor seat 4, one block is removed from the middle of the cylinder seat plate 2, and the anti-collision head of the hydraulic buffer 21 props against the cylinder seat plate 2; the cylinder 19 is lifted up, the hydraulic buffer 21 is installed on the top extension seat 11, and the anti-collision head is propped against the lower bottom surface of the flanged linear bearing 17. The traditional structure using the guide rail is used for installing the hydraulic buffer, and the swing arm structure of the invention is used for directly installing the hydraulic buffer on the motor base 4 and the top extension base 11 by using the support block, so that other parts are not added, and the structure is simpler.
According to the invention, a pipe fitting 9 is fixed on a cantilever fixing seat 6 through a cantilever pipe clamp front 7 and a cantilever pipe clamp rear 8, a cantilever upper cover 10 is matched with the cantilever fixing seat 6 to cover the fixed part of the pipe fitting 9, and a pipe clamp fixing seat A14 and a pipe clamp fixing seat B15 below are arranged at the lower end of a main shaft 5. In addition, in the design of the pipe fitting 9, the universality is considered, the design quantity is simplified, and the cost is saved.
The swing arm structure can be used for etching acid and water, cleaning two fluids and drying N2, and the three functions of the swing arm structure are identical except that the pipe length of the pipe fitting 9 part and the style of an outlet pipe are different; in order to ensure versatility, the mounting and fixing portions of the pipe are designed in the same pattern, and only the outlet pipe length and pattern are designed differently. The round rod above the three pipe fittings plays a supporting role, the round rod and the lower two pipes are welded and fixed in a cylinder, the cylinder is fixed on the cantilever fixing seat 6 through the cantilever pipe clamp front 7, and the round rod is fixed on the cantilever fixing seat 6 through the cantilever pipe clamp rear 8. As shown in fig. 4, the outlet pipe of the acid-water is vertically downward two straight pipes below; as shown in fig. 5, N2 is that the lower pipe is broken at the downward bending position, and the lower Fang Lingyi pipe is inclined downward at 45 degrees; as shown in fig. 6, the lower pipe is broken at the downward bending position, and the lower Fang Lingyi pipes are vertically downward.
The details not described in detail in this specification belong to the prior art known to those skilled in the art, all standard parts used by the standard parts can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of all parts adopt conventional means such as mature bolts, rivets and welding in the prior art, the machinery, the parts and the equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection modes in the prior art, which are not described in detail.
The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principles of the invention are intended to be equivalent substitutes and are included in the scope of the invention.
Claims (9)
1. A swing arm mechanism of a semiconductor wafer cleaning machine is characterized in that: the novel intelligent robot comprises a motor base (4), wherein a robot joint (18) is fixedly connected to the motor base (4), a harmonic reducer is arranged inside the robot joint (18), a protective cover (13) is arranged below the robot joint (18), a main shaft (5) is fixed on a rotating mandrel of the robot joint (18), a cantilever fixing seat (6) is fixed at the top end of the main shaft (5), a pipe fitting (9) is fixed on the cantilever fixing seat (6), and the robot joint (18) drives the pipe fitting (9) to do circular arc motion after rotating, so that a motion track of the outlet center of the pipe fitting (9) passes through the center of a wafer; an air cylinder (19) is arranged below the motor base (4) and is connected with a piston end of the air cylinder (19), the air cylinder (19) drives the pipe fitting (9) to ascend or descend through the motor base (4), the air cylinder (19) is fixed on the air cylinder seat board (2), and the air cylinder seat board (2) is fixed on the bottom board (1); the utility model discloses a motor cabinet, including motor cabinet (19), bottom plate (1), motor cabinet (4), motor cabinet (11), guide axle (16), flange linear bearing (17) are equipped with bilateral symmetry's guiding axle (16) on bottom plate (1) opposite side, guiding axle (16) pass bottom plate (1), and the collocation has on every guiding axle (16), flanged linear bearing (17) are fixed in on bottom plate (1), guiding axle (16) one end is fixed in on motor cabinet (4), top is installed to the guiding axle (16) other end to guarantee that the motion of guiding axle (16) is not inclined, hydraulic buffer (21) are all installed with top to motor cabinet (4) and top are stretched seat (11), and guarantee cylinder (19) motion stop process steady through hydraulic buffer (21).
2. The swing arm mechanism of a semiconductor wafer cleaning machine as recited in claim 1, wherein: the cantilever fixing seat (6) is provided with an installation groove matched with the shape of the fixing part of the pipe fitting (9), and one end of the pipe fitting (9) is fixed on the cantilever fixing seat (6) through the cantilever pipe clamp front (7) and the cantilever pipe clamp rear (8) after being arranged in the installation groove; the cantilever fixing seat (6) is connected with a cantilever upper cover (10) in a matched mode, and the cantilever upper cover (10) covers a fixing part of the pipe fitting (9) fixed on the cantilever fixing seat (6).
3. The swing arm mechanism of a semiconductor wafer cleaning machine as recited in claim 1, wherein: the pipe clamp fixing seat A (14) and the pipe clamp fixing seat B (15) are arranged below the cantilever fixing seat (6), and the pipe clamp fixing seat A (14) and the pipe clamp fixing seat B (15) are arranged at the lower end of the main shaft (5).
4. The swing arm mechanism of a semiconductor wafer cleaning machine as recited in claim 1, wherein: the cylinder seat board (2) is fixed on one side of the bottom board (1) and forms a T-shaped structure with the bottom board (1), and a supporting block (3) is arranged between the cylinder seat board (2) and the bottom board (1) and improves the structural strength of the cylinder seat board through the supporting block (3).
5. The swing arm mechanism of a semiconductor wafer cleaning machine as recited in claim 1, wherein: the piston end of the air cylinder (19) comprises a guide rod and a piston rod, the piston rod of the air cylinder (19) moves to drive the guide rod to move, and one ends of the guide rod and the piston rod are both arranged on the motor base (4).
6. The swing arm mechanism of a semiconductor wafer cleaning machine according to any one of claims 1 to 5, wherein: the motor seat (4) is provided with a first threaded hole, a hydraulic buffer (21) is arranged through the first threaded hole, the hydraulic buffer (21) on the motor seat (4) is located right above the cylinder seat board (2), a groove is dug in the middle of the top of the cylinder seat board (2), and when the cylinder (19) descends to the position, an anti-collision head of the hydraulic buffer (21) props against the cylinder seat board (2).
7. The swing arm mechanism of the semiconductor wafer cleaning machine according to claim 6, wherein: the hydraulic buffer device is characterized in that a second bilateral symmetry threaded hole is formed in the jacking seat (11), hydraulic buffers (21) are respectively arranged on the jacking seat through the threaded holes, the two hydraulic buffers (21) on the jacking seat (11) are respectively located under the flanged linear bearing (17), and when the air cylinder (19) ascends to the position, an anti-collision head of the hydraulic buffer (21) abuts against the lower bottom surface of the flanged linear bearing (17).
8. The swing arm mechanism of a semiconductor wafer cleaning machine according to any one of claims 1 to 5, wherein: the pipe fitting (9) comprises a round bar (22) which is arranged on the pipe fitting and has a supporting function and two pipes (23) which are arranged below the round bar (22), the round bar (22) and the two pipes (23) are welded and fixed in a cylinder (24), the cylinder (24) is fixed on the cantilever fixing seat (6) through the cantilever pipe clamp front (7), and the round bar is fixed on the cantilever fixing seat (6) through the cantilever pipe clamp rear (8).
9. The swing arm mechanism of the semiconductor wafer cleaning machine according to claim 8, wherein: the pipe fitting (9) is provided with three types, which are respectively used for etching acid-water, cleaning two fluids and drying N2; the outlet pipes of the two pipes (23) for acid-water etching adopt two straight pipes below to vertically downwards; two pipes (23) for drying N2 are provided, wherein one pipe below is broken at a downward bending position, and the lower Fang Lingyi pipes are inclined downwards at 45 degrees; two pipes (23) for two fluids, one pipe below which is broken at a downward bend, and a lower Fang Lingyi pipe vertically downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311213207.2A CN117276125B (en) | 2023-09-20 | 2023-09-20 | Swing arm mechanism of semiconductor wafer cleaning machine |
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| CN202311213207.2A CN117276125B (en) | 2023-09-20 | 2023-09-20 | Swing arm mechanism of semiconductor wafer cleaning machine |
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| CN117276125B true CN117276125B (en) | 2024-02-09 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4935981A (en) * | 1988-01-06 | 1990-06-26 | Dainippon Screen Mfg. Co., Ltd. | Cleaning apparatus having a contact buffer apparatus |
| JP2000005707A (en) * | 1998-06-23 | 2000-01-11 | Shibaura Mechatronics Corp | Brush washer and brush washing method |
| JP2001058161A (en) * | 1999-08-24 | 2001-03-06 | Shibaura Mechatronics Corp | Brush washing apparatus and brush washing method |
| JP2002124504A (en) * | 2000-10-17 | 2002-04-26 | Dainippon Screen Mfg Co Ltd | Substrate cleaner and substrate cleaning method |
| TW200532782A (en) * | 2004-03-30 | 2005-10-01 | Nanya Technology Corp | Chip cleaning device containing cleaning head capable of spraying cleaning solution |
| CN217881419U (en) * | 2022-07-20 | 2022-11-22 | 郑州轨道交通信息技术研究院 | Swing mechanical arm for cleaning barrel of wafer cutting equipment |
-
2023
- 2023-09-20 CN CN202311213207.2A patent/CN117276125B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4935981A (en) * | 1988-01-06 | 1990-06-26 | Dainippon Screen Mfg. Co., Ltd. | Cleaning apparatus having a contact buffer apparatus |
| JP2000005707A (en) * | 1998-06-23 | 2000-01-11 | Shibaura Mechatronics Corp | Brush washer and brush washing method |
| JP2001058161A (en) * | 1999-08-24 | 2001-03-06 | Shibaura Mechatronics Corp | Brush washing apparatus and brush washing method |
| JP2002124504A (en) * | 2000-10-17 | 2002-04-26 | Dainippon Screen Mfg Co Ltd | Substrate cleaner and substrate cleaning method |
| TW200532782A (en) * | 2004-03-30 | 2005-10-01 | Nanya Technology Corp | Chip cleaning device containing cleaning head capable of spraying cleaning solution |
| CN217881419U (en) * | 2022-07-20 | 2022-11-22 | 郑州轨道交通信息技术研究院 | Swing mechanical arm for cleaning barrel of wafer cutting equipment |
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| Publication number | Publication date |
|---|---|
| CN117276125A (en) | 2023-12-22 |
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