CN117276101A - External lead wire building and interconnecting method - Google Patents
External lead wire building and interconnecting method Download PDFInfo
- Publication number
- CN117276101A CN117276101A CN202311328668.4A CN202311328668A CN117276101A CN 117276101 A CN117276101 A CN 117276101A CN 202311328668 A CN202311328668 A CN 202311328668A CN 117276101 A CN117276101 A CN 117276101A
- Authority
- CN
- China
- Prior art keywords
- bonding
- wire
- lead
- welding
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 230000004907 flux Effects 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/431—Pre-treatment of the preform connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an external lead wire building and interconnecting method, which is characterized in that: it comprises the following steps: a. forming a first bonding point at one end of a bonding wire welded on the surface of the substrate; b. pulling the bonding wire to rotate and wind the lead column for at least 1 circle, so that the bonding wire is contacted with the outer wall of the lead column; c. and then welding the other end of the bonding wire on the surface of the substrate to form a second bonding point. The invention adopts the conventional bonding process, has the advantages of simple process, high reliability, no soldering flux, green and succinct property and the like.
Description
Technical Field
The invention relates to the technical field of thick film hybrid integrated circuits, in particular to an external lead bonding interconnection method.
Background
The lead interconnection process refers to a process for realizing the electrical interconnection between a metal shell lead column and a circuit substrate, and is a basic assembly process of a microelectronic product. Common methods for realizing wire interconnection are wire bonding interconnection technology, thick copper wire welding interconnection technology and thick wire spot welding interconnection technology, and the wire interconnection technology has related problems.
Compared with the conventional external lead bonding technology, namely the bonding interconnection technology of bonding wires between the surface of the lead post and the surface of the substrate, the bonding between the bonding wires and the lead post is realized by vibration friction in the bonding process, and when the length of the lead post with phi 0.45mm exceeds 1.5mm, the bonding cannot be realized. The patent No. CN20051003089.8, which is a method for improving the bonding reliability of the lead in the integrated circuit, is to increase the bonding reliability of the lead of the aluminum wire metal shell by a method of re-electroplating nickel on the lead column. In addition, although the copper wire lead bonding is low in cost, the copper wire lead bonding needs to be completed in a high-purity N2 and H2 protective atmosphere environment, so that the process difficulty is increased, defects which are not easy to occur in gold wire bonding are overcome, and the problems of substrate cracks, silicon pits, low bonding strength, cold joint and the like are mainly caused, and the defects seriously affect the popularization and application of the copper wire bonding on the surface of the lead of the metal shell.
The thick copper wire lead wire welding interconnection process also has related reliability hidden trouble, because when the traditional silver-plated copper wire welding mode is adopted, the melting point of common solder is lower (about 180 ℃), the welding mode has the problems that the welding reliability is reduced due to the fact that the solder is melted when the working temperature of a circuit is increased, and the reliability problems such as unwelding, open circuit and the like are caused by the fact that the solder is melted when the temperature of a lead wire column of a metal shell is increased in the welding and inserting process of the circuit and other parts. In addition, the traditional welding mode needs to be operated by means of soldering flux, and after the operation, the operation needs to be performed with cleaning treatment by using chemical reagents, so that the process is complicated.
The thick lead spot welding interconnection process realizes the electrical interconnection of the leads and the substrate in a pulse spot welding mode, the reliability is relatively good, but the pulse spot welding mode needs to realize the welding of the leads and the element by means of high current, and the external current can generate electric damage to the interconnected active devices, so that the reliability hidden trouble of the product is caused.
Disclosure of Invention
The invention provides an external lead wire building and interconnecting method for overcoming the defects in the prior art.
The application provides the following technical scheme:
an external lead wire building interconnection method is characterized in that: it comprises the following steps: a. forming a first bonding point at one end of a bonding wire welded on the surface of the substrate; b. pulling the bonding wire to rotate and wind the lead column for at least 1 circle, so that the bonding wire is contacted with the outer wall of the lead column; c. and then welding the other end of the bonding wire on the surface of the substrate to form a second bonding point.
On the basis of the technical scheme, the following further technical scheme is also available:
the diameter of the bonding wire is 0.1mm.
And arranging a spherical pressure welding covering the second bonding point at the second bonding point.
The bonding wire is a gold wire.
The invention has the advantages that:
compared with the conventional external lead bonding technology, namely the bonding interconnection technology of bonding wires between the surface of the lead post and the surface of the substrate, the bonding between the bonding wires and the lead post is realized by vibration friction in the bonding process, and the bonding cannot be realized after the length of the lead post with phi 0.45mm exceeds 1.5 mm.
Copper wire bonding needs to be completed in a high-purity N2 and H2 protective atmosphere environment, so that the process difficulty is increased, and the problems of substrate cracking, silicon pits, low bonding strength, cold joint and the like exist. The invention adopts the conventional bonding process and has the obvious advantages of simple process and high reliability.
Compared with the traditional copper wire outer lead welding interconnection technology, the welding mode has the problems that the welding reliability is reduced due to the fact that the melting point of common welding flux is lower (about 180 ℃), and the reliability problems of off-welding, open circuit and the like due to the fact that the welding flux is melted due to the fact that the temperature of a metal shell lead post is increased in the welding and inserting process of the circuit and other parts. In addition, the traditional welding mode needs to be operated by means of soldering flux, and after the operation, the operation needs to be performed with cleaning treatment by using chemical reagents, so that the process is complicated. The bonding process adopted by the invention does not need soldering flux, and has the advantages of green and conciseness.
In addition, compared with the interconnection technology of lead spot welding, the method of pulse spot welding needs to realize the welding of the lead and the element by means of high current, and the external high current can generate electric damage to the interconnected active devices, so that the reliability hidden trouble of the product is caused. The conventional bonding process adopted by the invention has the advantages of no extra current introduction, no electric damage to active devices in the circuit and no external current damage.
Drawings
FIG. 1 is a schematic illustration of the interconnect method of the present invention after completion;
fig. 2 is a schematic diagram of embodiment 2.
Detailed Description
Examples
As shown in fig. 1, an external lead bonding interconnection method includes: a conventional gold wire ball bonding device is adopted, the bonding device is a 7700E gold wire ball bonding device, and the bonding wire is a filament with a gold wire diameter of 25um.
a. One end of a bonding wire is welded on a bonding area on the surface of the substrate to form a first bonding point 1.
b. The bonding wire 2 is pulled to wind the lead post 3 at least 1 turn, and the bonding wire is tensioned, so that the bonding wire 2 is fully contacted with the outer wall of the lead post 3, and stable electrical connection between the bonding wire 2 and the lead post is realized.
c. And then the other end of the bonding wire 2 is welded on the surface of the substrate to form a second bonding point 4, and a spherical pressure welding 5 covering the second bonding point is arranged at the second bonding point. Thereby forming a safety ball for improving reliability of the second bonding point.
As shown in fig. 2, embodiment 2 differs from embodiment 1 in that the ball bonding 5 is not provided.
Claims (4)
1. An external lead wire building interconnection method is characterized in that: it comprises the following steps: a. forming a first bonding point at one end of a bonding wire welded on the surface of the substrate; b. pulling the bonding wire to rotate and wind the lead column for at least 1 circle, so that the bonding wire is contacted with the outer wall of the lead column; c. and then welding the other end of the bonding wire on the surface of the substrate to form a second bonding point.
2. A method of external lead build-up interconnect as defined in claim 1, wherein: the diameter of the bonding wire is 25um.
3. A method of external lead build-up interconnect as defined in claim 1, wherein: and arranging a spherical pressure welding covering the second bonding point at the second bonding point.
4. A method of external lead build-up interconnect as defined in claim 1, wherein: the bonding wire is a gold wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311328668.4A CN117276101A (en) | 2023-10-14 | 2023-10-14 | External lead wire building and interconnecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311328668.4A CN117276101A (en) | 2023-10-14 | 2023-10-14 | External lead wire building and interconnecting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117276101A true CN117276101A (en) | 2023-12-22 |
Family
ID=89221422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311328668.4A Pending CN117276101A (en) | 2023-10-14 | 2023-10-14 | External lead wire building and interconnecting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117276101A (en) |
-
2023
- 2023-10-14 CN CN202311328668.4A patent/CN117276101A/en active Pending
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