CN117275897A - An inductor gap control method and inductor device - Google Patents

An inductor gap control method and inductor device Download PDF

Info

Publication number
CN117275897A
CN117275897A CN202311404435.8A CN202311404435A CN117275897A CN 117275897 A CN117275897 A CN 117275897A CN 202311404435 A CN202311404435 A CN 202311404435A CN 117275897 A CN117275897 A CN 117275897A
Authority
CN
China
Prior art keywords
inductor
inductance
isolation layer
glue
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311404435.8A
Other languages
Chinese (zh)
Inventor
邹文辉
周南帆
苏雨波
黄敬新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huai'an Shunluo Wensheng Electronics Co ltd
Original Assignee
Huai'an Shunluo Wensheng Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huai'an Shunluo Wensheng Electronics Co ltd filed Critical Huai'an Shunluo Wensheng Electronics Co ltd
Priority to CN202311404435.8A priority Critical patent/CN117275897A/en
Publication of CN117275897A publication Critical patent/CN117275897A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/26Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/263Fastening parts of the core together
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/303Clamping coils, windings or parts thereof together

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The application discloses an inductance gap control method and an inductance device, wherein the inductance gap control method is characterized in that a first inductance is fixed so that an isolation layer is arranged on a subsequent first inductance; through set up the isolation layer on the junction surface of first inductance to place the junction surface fixed connection isolation layer of second inductance messenger second inductance, with the interval preset interval between messenger's first inductance and the second inductance, have stable interval and stable connection between messenger's first inductance and the second inductance, avoided between the adjacent inductance because the electromagnetic interference that unstable or seamless connection caused of distance has improved inductance connection stability and fastness, the simple process step is few, the cost is lower, the clearance between the stable control inductance.

Description

一种电感间隙控制方法及电感装置An inductor gap control method and inductor device

技术领域Technical field

本申请涉及电子器件技术领域,具体涉及一种电感间隙控制方法及电感装置。The present application relates to the technical field of electronic devices, and specifically relates to an inductor gap control method and an inductor device.

背景技术Background technique

随着汽车电子行业的飞速发展,汽车电子开始向区域化、模块化发展方向发展,同一模块或区域,需要实现的功能也随之快速增加。为达到更多的功能,同一尺寸上,需要的电子元器件数量也在飞速增加,这对电子元器件的小型化、模块化要求更加迫切。With the rapid development of the automotive electronics industry, automotive electronics has begun to develop in the direction of regionalization and modularization. The functions that need to be implemented in the same module or area have also increased rapidly. In order to achieve more functions, the number of electronic components required in the same size is also increasing rapidly, which makes the requirements for miniaturization and modularization of electronic components more urgent.

功率电感作为常用的电子元器件之一,由于电感本身的电磁效应,当两个或多个电感间的距离不稳定时,非常容易在多个电感间易产生干扰,导致应用出现问题。Power inductors are one of the commonly used electronic components. Due to the electromagnetic effect of the inductor itself, when the distance between two or more inductors is unstable, it is very easy for interference to occur between multiple inductors, leading to application problems.

现有的器件在设置多个电感时,相邻或多个电感之间距离不稳定时,易产生干扰,容易导致电感组出现性能下降或故障等问题;现有技术中也有将两个电感无缝连接以避免上述问题,但是该电感组应用于音频装置时,在大电流的条件下,两个电感的绕组之间存在电磁干扰的问题。When existing devices are equipped with multiple inductors, interference is likely to occur when the distance between adjacent or multiple inductors is unstable, which may easily lead to performance degradation or failure of the inductor group. In the existing technology, there are also two inductors without one. Seam connection is used to avoid the above problems. However, when the inductor group is used in audio devices, under high current conditions, there is an electromagnetic interference problem between the windings of the two inductors.

因此,如何避免相邻或多个电感产生电磁干扰或出现问题是目前亟待解决的问题。Therefore, how to avoid electromagnetic interference or problems caused by adjacent or multiple inductors is an issue that needs to be solved urgently.

发明内容Contents of the invention

鉴于此,本申请提供一种电感间隙控制方法及电感装置,以解决现有的多个电感之间产生的电磁干扰和电感组出现故障或性能下降的问题。In view of this, this application provides an inductor gap control method and an inductor device to solve the existing problems of electromagnetic interference generated between multiple inductors and inductor group failure or performance degradation.

本申请提供一种电感间隙控制方法,包括步骤:This application provides an inductance gap control method, including the steps:

固定第一电感;Fixed first inductor;

在第一电感的连接面上设置隔离层;An isolation layer is provided on the connection surface of the first inductor;

放置第二电感使所述第二电感的连接面固定连接所述隔离层,以使所述第一电感和所述第二电感之间间隔预设间距。The second inductor is placed so that the connection surface of the second inductor is fixedly connected to the isolation layer, so that the first inductor and the second inductor are separated by a preset distance.

可选地,在第一电感的连接面上设置隔离层的步骤包括:Optionally, the step of providing an isolation layer on the connection surface of the first inductor includes:

对所述第一电感的连接面进行粘接隔板操作或点胶操作以生成所述隔离层。A spacer bonding operation or glue dispensing operation is performed on the connection surface of the first inductor to generate the isolation layer.

可选地,对所述第一电感的连接面进行粘接隔板操作或点胶操作以生成所述隔离层的步骤包括:Optionally, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:

在所述第一电感的连接面或隔板朝向所述第一电感的侧面设置第一粘接层,其中,所述隔板的厚度与所述预设间距一致;A first adhesive layer is provided on the connection surface of the first inductor or the side of the separator facing the first inductor, wherein the thickness of the separator is consistent with the preset spacing;

使所述第一粘接层连接所述第一电感和所述隔板。The first adhesive layer is connected to the first inductor and the separator.

可选地,放置第二电感使所述第二电感的连接面固定连接所述隔离层的步骤包括:Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

在所述隔板朝向所述第二电感的侧面或所述第二电感的连接面设置第二粘接层;A second adhesive layer is provided on the side of the separator facing the second inductor or the connection surface of the second inductor;

使所述第二粘接层连接所述隔板和所述第二电感。The second adhesive layer is connected to the separator and the second inductor.

可选地,对所述第一电感的连接面进行粘接隔板操作或点胶操作以生成所述隔离层的步骤包括:Optionally, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:

配置含颗粒胶水;Contains granular glue;

在所述第一电感的连接面上进行点胶操作,使所述颗粒胶水均匀铺设于所述第一电感的连接面上以生成胶水颗粒层;Perform a glue dispensing operation on the connection surface of the first inductor, so that the granular glue is evenly laid on the connection surface of the first inductor to generate a glue particle layer;

对所述胶水颗粒层进行干燥固定操作以生成所述隔离层。The glue particle layer is dried and fixed to form the isolation layer.

可选地,放置第二电感使所述第二电感的连接面固定连接所述隔离层的步骤包括:Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

使所述第二电感的连接面正对所述第一电感的连接面并与所述隔离层侧面紧贴;Make the connection surface of the second inductor face the connection surface of the first inductor and be in close contact with the side of the isolation layer;

进行烘烤操作以使所述隔离层软化并粘接所述第二电感。A baking operation is performed to soften the isolation layer and bond the second inductor.

可选地,配置含颗粒胶水的步骤包括:Optionally, the steps for configuring particle-containing glue include:

按质量组分将1-2份的胶水、0.3-0.6份的稀释剂2-3份的固体颗粒放置于搅拌罐内进行搅拌均匀操作以获取所述含颗粒胶水。According to the mass components, 1-2 parts of glue, 0.3-0.6 parts of diluent and 2-3 parts of solid particles are placed in a mixing tank and stirred evenly to obtain the particle-containing glue.

可选地,所述固体颗粒的外径与所述预设间距一致。Optionally, the outer diameter of the solid particles is consistent with the preset distance.

可选地,放置第二电感使得所述第二电感的连接面连接固定连接所述隔离层的步骤包括:Optionally, the step of placing the second inductor so that the connection surface of the second inductor is firmly connected to the isolation layer includes:

对所述第二电感进行对齐操作,使所述第二电感的侧面与所述第一电感对应的侧面平齐且所述第一电感的连接面与所述第二电感的连接面平行,并使所述第一电感和第二电感关于所述隔离层的中心对称。Align the second inductor so that the side surfaces of the second inductor are flush with the side surfaces corresponding to the first inductor and the connection surface of the first inductor is parallel to the connection surface of the second inductor, and The first inductor and the second inductor are made symmetrical about the center of the isolation layer.

本申请还提供一种电感装置,包括第一电感、第二电感和隔离层,所述第一电感的连接面和所述第二电感之间通过所述隔离层连接,所述第一电感和所述第二电感之间距离为预设间距。This application also provides an inductor device, including a first inductor, a second inductor and an isolation layer. The connection surface of the first inductor and the second inductor are connected through the isolation layer. The first inductor and the second inductor are connected through the isolation layer. The distance between the second inductors is a preset distance.

可选地,所述隔离层包括隔板、第一粘接层和第二粘接层,所述隔板通过所述第一粘接层与所述第一电感的连接面连接,所述隔板通过第二粘接层与所述第二电感的连接面连接,所述隔板的厚度与所述预设间距的大小一致。Optionally, the isolation layer includes a spacer, a first adhesive layer and a second adhesive layer. The spacer is connected to the connection surface of the first inductor through the first adhesive layer. The board is connected to the connection surface of the second inductor through a second adhesive layer, and the thickness of the separator is consistent with the size of the preset spacing.

可选地,所述隔离层包括胶水颗粒层,所述胶水颗粒层包括胶水层和固体颗粒,所述固体颗粒嵌设于所述胶水层内部,所述固体颗粒的外径与所述预设间距的大小一致。Optionally, the isolation layer includes a glue particle layer. The glue particle layer includes a glue layer and solid particles. The solid particles are embedded inside the glue layer. The outer diameter of the solid particles is consistent with the preset diameter. The spacing is the same size.

本申请提供的电感间隙控制方法及电感装置的有益效果在于:The beneficial effects of the inductance gap control method and inductance device provided by this application are:

本申请的电感间隙控制方法通过固定第一电感以便于后续再第一电感上设置隔离层;通过在第一电感的连接面上设置隔离层,并放置第二电感使第二电感的连接面固定连接隔离层,以使第一电感和第二电感之间间隔预设间距,使得第一电感和第二电感之间具有稳定的间距且稳定连接,避免了相邻电感之间因为距离不稳或无缝连接造成的电磁干扰,提高了电感连接稳定性和牢固性,工序简单步骤少,成本较低,稳定控制了电感之间的间隙。The inductor gap control method of this application fixes the first inductor to facilitate the subsequent setting of an isolation layer on the first inductor; by setting an isolation layer on the connection surface of the first inductor and placing the second inductor, the connection surface of the second inductor is fixed Connect the isolation layer so that the first inductor and the second inductor are separated by a preset distance, so that there is a stable distance between the first inductor and the second inductor and a stable connection, avoiding the instability or instability of the distance between adjacent inductors. The electromagnetic interference caused by the seamless connection improves the stability and firmness of the inductor connection. The process is simple and requires fewer steps, the cost is lower, and the gap between the inductors is stably controlled.

附图说明Description of the drawings

为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

图1是本申请实施例的电感间隙控制方法的流程图;Figure 1 is a flow chart of the inductance gap control method according to the embodiment of the present application;

图2是本申请实施例第一种实施方式中设置隔离层的流程图;Figure 2 is a flow chart of setting an isolation layer in the first implementation mode of the embodiment of the present application;

图3是本申请实施例第一种实施方式中放置第二电感的流程图;Figure 3 is a flow chart for placing a second inductor in the first implementation of the embodiment of the present application;

图4是本申请实施例第二种实施方式中设置隔离层的流程图;Figure 4 is a flow chart for setting an isolation layer in the second implementation mode of the embodiment of the present application;

图5是本申请实施例第二种实施方式中放置第二电感的流程图;Figure 5 is a flow chart for placing the second inductor in the second implementation of the embodiment of the present application;

图6是本申请实施例的电感装置的结构示意图;Figure 6 is a schematic structural diagram of an inductor device according to an embodiment of the present application;

图7是本申请实施例第一种实施方式中隔离层结构示意图;Figure 7 is a schematic diagram of the structure of the isolation layer in the first implementation mode of the embodiment of the present application;

图8是本申请实施例第二种实施方式中隔离层结构示意图。FIG. 8 is a schematic diagram of the isolation layer structure in the second implementation mode of the embodiment of the present application.

具体实施方式Detailed ways

下面结合附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本申请一部分实施例,而非全部实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。在不冲突的情况下,下述各个实施例及其技术特征可以相互组合。The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application. The following embodiments and their technical features may be combined with each other without conflict.

通过下面对实施例的描述,将更加有助于公众理解本发明,但不能也不应当将申请人所给出的具体的实施例视为对本发明技术方案的限制,任何对部件或技术特征的定义。The following description of the embodiments will further help the public understand the present invention, but the specific embodiments given by the applicant cannot and should not be regarded as limiting the technical solution of the present invention. Any modification of components or technical features Definition.

本申请提供一种电感间隙控制方法,参照图1,电感间隙控制方法包括步骤:This application provides an inductance gap control method. Referring to Figure 1, the inductance gap control method includes the steps:

S1:固定第一电感;S1: fixed first inductor;

S2:在第一电感的连接面上设置隔离层;S2: Set an isolation layer on the connection surface of the first inductor;

S3:放置第二电感使第二电感的连接面固定连接隔离层,以使第一电感和第二电感之间间隔预设间距。S3: Place the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer, so that the first inductor and the second inductor are separated by a preset distance.

一些实施例中,预设间距可以设置为0.1-0.5mm。In some embodiments, the preset spacing can be set to 0.1-0.5mm.

作为本申请一种可选的实施方式,步骤S2中,在第一电感的连接面上设置隔离层的步骤包括:As an optional implementation mode of the present application, in step S2, the step of setting an isolation layer on the connection surface of the first inductor includes:

对第一电感的连接面进行粘接隔板操作或点胶操作以生成隔离层。A spacer bonding operation or glue dispensing operation is performed on the connection surface of the first inductor to form an isolation layer.

在本申请实施例的第一种实施方式中,参照图2,对第一电感的连接面进行粘接隔板操作或点胶操作以生成隔离层的步骤包括:In a first implementation manner of an embodiment of the present application, referring to Figure 2, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate an isolation layer includes:

S21:在第一电感的连接面或隔板朝向第一电感的侧面设置第一粘接层;S21: Set a first adhesive layer on the connection surface of the first inductor or the side of the separator facing the first inductor;

S22:使第一粘接层连接第一电感和隔板。S22: Connect the first adhesive layer to the first inductor and the separator.

一些实施例中,隔板的材质采用陶瓷或胶片等非磁性材料,隔板的两个与第一电感和第二电感连接的侧面为平行的平面。In some embodiments, the separator is made of non-magnetic materials such as ceramics or films, and the two sides of the separator connected to the first inductor and the second inductor are parallel planes.

一些具体实施例中,隔板的厚度与预设间隔一致,即隔板的厚度可以为0.1-0.5mm,根据不同尺寸的电感产品灵活选择所需要的厚度的隔板。In some specific embodiments, the thickness of the separator is consistent with the preset interval, that is, the thickness of the separator can be 0.1-0.5 mm, and the required thickness of the separator can be flexibly selected according to inductor products of different sizes.

一些实施例中,在考虑到第一粘接层和第二粘接层的公差,即考虑到粘接胶水或胶带的公差后,隔板的厚度与预设间距的公差可以为±0.02-0.05mm。In some embodiments, after taking into account the tolerance of the first adhesive layer and the second adhesive layer, that is, taking into account the tolerance of the adhesive glue or tape, the tolerance of the thickness of the separator and the preset spacing may be ±0.02-0.05 mm.

一些具体实施例中,第一电感和第二电感的连接面尺寸均为6×6mm,此时可以选择厚度为0.2mm厚度的隔板作为第一电感和第二电感之间的隔离层。In some specific embodiments, the connection surface size of the first inductor and the second inductor is 6×6 mm. In this case, a separator with a thickness of 0.2 mm can be selected as the isolation layer between the first inductor and the second inductor.

进一步地,参照图3,步骤S3中,在步骤S22之后,放置第二电感使第二电感的连接面固定连接隔离层的步骤包括:Further, referring to Figure 3, in step S3, after step S22, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

S31:在隔板朝向第二电感的侧面或第二电感的连接面设置第二粘接层;S31: Set a second adhesive layer on the side of the separator facing the second inductor or the connection surface of the second inductor;

S32:使第二粘接层连接隔板和第二电感。S32: Connect the second adhesive layer to the separator and the second inductor.

一些实施例中,第一粘接层和第二粘接层包括但不局限于胶水形成的粘合层和双面胶带中的一种。In some embodiments, the first adhesive layer and the second adhesive layer include, but are not limited to, one of an adhesive layer formed of glue and double-sided tape.

一些具体实施例中,上述步骤S1至S3可以简化为:In some specific embodiments, the above steps S1 to S3 can be simplified as:

固定第一电感后,在第一电感的连接面或隔板的一个侧面均匀喷涂胶水,通过胶水粘接第一电感和隔板;After fixing the first inductor, spray glue evenly on the connecting surface of the first inductor or one side of the separator, and bond the first inductor and the separator through the glue;

待胶水干燥隔板固定于第一电感上后,在隔板的另一个侧面或第二电感的连接面上喷涂胶水,通过胶水粘接第二电感和隔板,通过烘烤步骤烘干胶水,以使得隔离层稳定连接第一电感和第二电感。After the glue is dry and the separator is fixed on the first inductor, spray glue on the other side of the separator or the connecting surface of the second inductor, bond the second inductor and the separator through the glue, and dry the glue through the baking step. So that the isolation layer stably connects the first inductor and the second inductor.

在本申请实施例的第二种实施方式中,参照图4,对第一电感的连接面进行粘接隔板操作或点胶操作以生成隔离层的步骤包括:In the second implementation of the embodiment of the present application, referring to Figure 4, the step of performing a spacer operation or a glue dispensing operation on the connection surface of the first inductor to generate an isolation layer includes:

S23:配置含颗粒胶水;S23: Configure glue containing granules;

S24:在第一电感的连接面上进行点胶操作,使颗粒胶水均匀铺设于第一电感的连接面上以生成胶水颗粒层;S24: Perform a glue dispensing operation on the connection surface of the first inductor, so that the granular glue is evenly laid on the connection surface of the first inductor to generate a glue particle layer;

S25:对胶水颗粒层进行干燥固定操作以生成隔离层。S25: Dry and fix the glue particle layer to generate an isolation layer.

一些实施例中,干燥固定操作可以为烘干操作。In some embodiments, the drying and fixing operation may be a drying operation.

进一步地,参照图5,步骤S3中,在步骤S25之后,放置第二电感使第二电感的连接面固定连接隔离层的步骤包括:Further, referring to Figure 5, in step S3, after step S25, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

S31:使第二电感的连接面正对第一电感的连接面并与隔离层侧面紧贴;S31: Make the connection surface of the second inductor face the connection surface of the first inductor and closely contact the side of the isolation layer;

S32:进行烘烤操作以使隔离层软化并粘接第二电感。S32: Perform a baking operation to soften the isolation layer and bond the second inductor.

作为本申请一种可选的实施方式,步骤S23中,配置含颗粒胶水的步骤包括:As an optional implementation mode of the present application, in step S23, the step of configuring particle-containing glue includes:

按质量组分将1-2份的胶水、0.3-0.6份的稀释剂2-3份的固体颗粒放置于搅拌罐内进行搅拌均匀操作以获取含颗粒胶水。通过稀释剂保持含颗粒胶水的粘度,与胶水配合能稳定粘接第一电感和第二电感;通过固体颗粒来保证第一电感和第二电感之间的预设间距。According to the mass components, place 1-2 parts of glue, 0.3-0.6 parts of diluent and 2-3 parts of solid particles in a mixing tank and stir evenly to obtain particle-containing glue. The diluent is used to maintain the viscosity of the particle-containing glue, and the first inductor and the second inductor can be stably bonded together with the glue; the solid particles are used to ensure the preset distance between the first inductor and the second inductor.

一些实施例中,胶水的组成包括但不局限于环氧树脂、二氧化硅;固体颗粒包括但不局限于非磁性颗粒,如二氧化硅。固体颗粒的形状可以为球形,第一电感和第二电感之间的预设间距由固体颗粒的外径控制。In some embodiments, the composition of the glue includes but is not limited to epoxy resin and silica; the solid particles include but is not limited to non-magnetic particles such as silica. The shape of the solid particles may be spherical, and the preset distance between the first inductor and the second inductor is controlled by the outer diameter of the solid particles.

一些实施例中,固体颗粒可为外径一致的球形颗粒组成,也可以为内径不一致的若干颗粒组成,其最大体积的颗粒的外径与预设间距一致,即为0.1-0.5mm。In some embodiments, the solid particles may be composed of spherical particles with consistent outer diameters, or may be composed of several particles with inconsistent inner diameters. The outer diameter of the largest particle is consistent with the preset spacing, that is, 0.1-0.5 mm.

在理想情况下,上述的颗粒均为颗粒均匀的球形颗粒,以保证胶水粘度的均一性;在实际应用中,由于工艺的原因,部分小型颗粒可以不为颗料,但对生成的隔离层厚度和第一电感和第二电感之间的间距不会造成影响。Under ideal circumstances, the above-mentioned particles are all uniform spherical particles to ensure the uniformity of the glue viscosity; in practical applications, due to process reasons, some small particles may not be particles, but the thickness of the resulting isolation layer and the spacing between the first inductor and the second inductor has no effect.

作为本申请一种可选的实施方式,固体颗粒的外径与预设间距一致。As an optional implementation mode of the present application, the outer diameter of the solid particles is consistent with the preset spacing.

优选的是,通过上述粘接隔板操作或点胶操作两种操作中的任意一种来生成隔离层,提高了适用性和可选性,实际应用中,可根据用户的需求如场地、时间、经济和设备灵活选择合适的操作以生成隔离层,因此本申请的电感控制方法应用范围广,适用于较多场合。Preferably, the isolation layer is generated by either of the above-mentioned bonding partition operations or dispensing operations, which improves applicability and selectability. In actual applications, the isolation layer can be generated according to the user's needs such as location and time. , economy and equipment flexibility to select appropriate operations to generate an isolation layer. Therefore, the inductance control method of this application has a wide range of applications and is suitable for many occasions.

作为本申请一种可选的实施方式,放置第二电感使得第二电感的连接面连接固定连接隔离层的步骤包括:As an optional implementation manner of the present application, the step of placing the second inductor so that the connection surface of the second inductor is connected to the fixed connection isolation layer includes:

对第二电感进行对齐操作,使第二电感的侧面与第一电感对应的侧面平齐且第一电感的连接面与第二电感的连接面平行,并使第一电感和第二电感关于隔离层的中心对称。Align the second inductor so that the side surfaces of the second inductor are flush with the corresponding side surfaces of the first inductor and the connection surface of the first inductor is parallel to the connection surface of the second inductor, and the first inductor and the second inductor are isolated from each other. The layer is symmetrical about its center.

一些实施例中,通过对第一电感和第二电感的固定和对齐操作,使得第一电感和第二电感相同的侧面处于同一平面,且两个相对的连接面相互平行,通过隔离层控制两个电感之间的间距的均一性,简化了工艺流程,提高了效率,降低了成本,保证了电感组的稳定工作。In some embodiments, by fixing and aligning the first inductor and the second inductor, the same sides of the first inductor and the second inductor are on the same plane, and the two opposite connection surfaces are parallel to each other, and the isolation layer controls the two sides. The uniformity of the spacing between the inductors simplifies the process flow, improves efficiency, reduces costs, and ensures the stable operation of the inductor group.

本申请还提供一种电感装置,参照图6,电感装置包括第一电感1、第二电感2和隔离层3,第一电感1的连接面和第二电感2之间通过隔离层3连接,第一电感1和第二电感2之间距离为预设间距。This application also provides an inductor device. Referring to Figure 6, the inductor device includes a first inductor 1, a second inductor 2 and an isolation layer 3. The connection surface of the first inductor 1 and the second inductor 2 are connected through the isolation layer 3. The distance between the first inductor 1 and the second inductor 2 is a preset distance.

一些实施例中,可通过上述本申请的电感间隔控制方法来实现第一电感的连接面和第二电感之间通过隔离层连接,第一电感和第二电感之间距离为预设间距。In some embodiments, the connection surface of the first inductor and the second inductor can be connected through an isolation layer through the inductor spacing control method of the present application, and the distance between the first inductor and the second inductor is a preset distance.

在本申请实施例的第一种实施方式中,参照图7,隔离层3包括隔板31、第一粘接层32和第二粘接层33;In the first implementation of the embodiment of the present application, referring to Figure 7, the isolation layer 3 includes a separator 31, a first adhesive layer 32 and a second adhesive layer 33;

隔板31通过第一粘接层32与第一电感1粘接,并通过第二粘接层33与第二电感2粘接。The spacer 31 is bonded to the first inductor 1 through the first adhesive layer 32 and bonded to the second inductor 2 through the second adhesive layer 33 .

一些实施例中,第一粘接层32和第二粘接层33可以为胶水粘合层或双面胶带中的一种。In some embodiments, the first adhesive layer 32 and the second adhesive layer 33 may be one of a glue adhesive layer or a double-sided tape.

一些实施例中,隔板31的材质采用陶瓷或胶片等非磁性材料,隔板31与第一电感和第二电感连接的两个侧面为平行的平面。In some embodiments, the separator 31 is made of non-magnetic materials such as ceramics or films, and the two sides of the separator 31 connected to the first inductor and the second inductor are parallel planes.

一些具体实施例中,隔板31的厚度可以为0.1-0.5mm,根据不同尺寸的电感产品灵活选择所需要的厚度的隔板。In some specific embodiments, the thickness of the separator 31 may be 0.1-0.5 mm, and the required thickness of the separator can be flexibly selected according to inductor products of different sizes.

一些实施例中,在考虑到第一粘接层32和第二粘接层33的公差,即考虑到粘接胶水或胶带的公差后,隔板31的厚度与预设间距的公差可以为±0.02-0.05mm。In some embodiments, after taking into account the tolerance of the first adhesive layer 32 and the second adhesive layer 33, that is, taking into account the tolerance of the adhesive glue or tape, the tolerance between the thickness of the partition 31 and the preset spacing may be ± 0.02-0.05mm.

在本申请实施例的第二种实施方式中,参照图8,隔离层3包括若干胶水颗粒层,胶水颗粒层包括胶水层34、固体颗粒35和粘合剂(图中未示出),固体颗粒35的最大外径与预设间距一致。In the second implementation of the embodiment of the present application, referring to Figure 8, the isolation layer 3 includes several glue particle layers. The glue particle layer includes a glue layer 34, solid particles 35 and an adhesive (not shown in the figure). The solid The maximum outer diameter of the particles 35 is consistent with the preset distance.

一些实施例中,胶水层34的组成包括但不局限于环氧树脂、二氧化硅,胶水层34由液化的胶水凝固之后形成的层状结构,胶水层34的一个侧面与第一电感1直接粘接,胶水层35的另一个侧面与第二电感2直接粘接。,固体颗粒嵌于胶水层34内。固体颗粒35包括但不局限于非磁性颗粒,如二氧化硅。固体颗粒34的形状可以为球形,第一电感1和第二电感2之间的预设间距由固体颗粒34的外径控制。In some embodiments, the composition of the glue layer 34 includes but is not limited to epoxy resin and silica. The glue layer 34 is a layered structure formed by solidifying liquefied glue. One side of the glue layer 34 is directly in contact with the first inductor 1 For bonding, the other side of the glue layer 35 is directly bonded to the second inductor 2 . , the solid particles are embedded in the glue layer 34. Solid particles 35 include, but are not limited to, non-magnetic particles such as silica. The shape of the solid particles 34 may be spherical, and the preset distance between the first inductor 1 and the second inductor 2 is controlled by the outer diameter of the solid particles 34 .

一些实施例中,固体颗粒34可为外径一致的球形颗粒组成,也可以为内径不一致的若干颗粒组成,其最大体积的颗粒的外径与预设间距一致,即最大体积的颗粒的外径为0.1-0.5mm。In some embodiments, the solid particles 34 may be composed of spherical particles with consistent outer diameters, or may be composed of several particles with inconsistent inner diameters. The outer diameter of the largest particle is consistent with the preset spacing, that is, the outer diameter of the largest particle. is 0.1-0.5mm.

一些实施例中,第二电感2的侧面与第一电感对应的侧面平齐且第一电感1的连接面与第二电感2的连接面平行,第一电感1和第二电感2关于隔离层的中心对称。In some embodiments, the side surfaces of the second inductor 2 are flush with the corresponding side surfaces of the first inductor and the connection surface of the first inductor 1 is parallel to the connection surface of the second inductor 2. The first inductor 1 and the second inductor 2 are about the isolation layer. center symmetry.

一些实施例中,第一电感1和第二电感2相同的侧面处于同一平面,且两个相对的连接面相互平行,通过隔离层3控制两个电感之间的间距的均一性,简化了工艺流程,提高了效率,降低了成本,保证了电感组的稳定工作。In some embodiments, the same side surfaces of the first inductor 1 and the second inductor 2 are on the same plane, and the two opposite connection surfaces are parallel to each other. The isolation layer 3 is used to control the uniformity of the spacing between the two inductors, simplifying the process. The process improves efficiency, reduces costs, and ensures the stable operation of the inductor group.

本申请提供的电感间隙控制方法及电感装置的优点在于:The advantages of the inductance gap control method and inductance device provided by this application are:

本申请的电感间隙控制方法通过固定第一电感以便于后续再第一电感上设置隔离层;通过在第一电感的连接面上设置隔离层,并放置第二电感使第二电感的连接面固定连接隔离层,以使第一电感和第二电感之间间隔预设间距,使得第一电感和第二电感之间具有稳定的间距且稳定连接,避免了相邻电感之间因为距离不稳或无缝连接造成的电磁干扰,提高了电感连接稳定性和牢固性,工序简单步骤少,成本较低,稳定控制了电感之间的间隙。The inductor gap control method of this application fixes the first inductor to facilitate the subsequent setting of an isolation layer on the first inductor; by setting an isolation layer on the connection surface of the first inductor and placing the second inductor, the connection surface of the second inductor is fixed Connect the isolation layer so that the first inductor and the second inductor are separated by a preset distance, so that there is a stable distance between the first inductor and the second inductor and a stable connection, avoiding the instability or instability of the distance between adjacent inductors. The electromagnetic interference caused by the seamless connection improves the stability and firmness of the inductor connection. The process is simple and requires fewer steps, the cost is lower, and the gap between the inductors is stably controlled.

以上所述仅为本申请的实施例,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,例如各实施例之间技术特征的相互结合,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。The above are only embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the description and drawings of the present application, such as the mutual exchange of technical features between the various embodiments. Combination, or direct or indirect application in other related technical fields, are all equally included in the scope of patent protection of this application.

Claims (12)

1. An inductance gap control method, comprising the steps of:
fixing a first inductor;
an isolation layer is arranged on the connection surface of the first inductor;
and placing a second inductor so that the connecting surface of the second inductor is fixedly connected with the isolation layer, so that a preset interval is reserved between the first inductor and the second inductor.
2. The inductance gap control method according to claim 1, wherein the step of providing an isolation layer on the connection face of the first inductance includes:
and performing a baffle bonding operation or a dispensing operation on the connecting surface of the first inductor to generate the isolation layer.
3. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:
a first bonding layer is arranged on the connecting surface of the first inductor or the side surface of the partition plate facing the first inductor, wherein the thickness of the partition plate is consistent with the preset interval;
the first adhesive layer is made to connect the first inductor and the separator.
4. The inductance gap control method of claim 3, wherein the step of positioning the second inductance such that the connection surface of the second inductance is fixedly connected to the isolation layer includes:
a second bonding layer is arranged on the side surface of the partition plate facing the second inductor or the connecting surface of the second inductor;
and connecting the second adhesive layer with the separator and the second inductor.
5. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:
preparing glue containing particles;
dispensing operation is carried out on the connecting surface of the first inductor, so that the granular glue is uniformly paved on the connecting surface of the first inductor to generate a glue granular layer;
and drying and fixing the glue particle layer to generate the isolation layer.
6. The inductance gap control method of claim 5, wherein the step of positioning a second inductance such that a connection surface of the second inductance is fixedly connected to the isolation layer includes:
the connecting surface of the second inductor is opposite to the connecting surface of the first inductor and is clung to the side surface of the isolation layer;
a baking operation is performed to soften the isolation layer and bond the second inductor.
7. The method of inductive gap control of claim 5, wherein the step of disposing a particle-containing glue comprises:
and placing 1-2 parts of glue and 0.3-0.6 part of solid particles of 2-3 parts of diluent into a stirring tank according to mass components, and stirring uniformly to obtain the glue containing particles.
8. The inductance gap control method of claim 7, wherein an outer diameter of the solid particles is consistent with the preset spacing.
9. The inductance gap control method according to claim 1, wherein the step of positioning the second inductance such that the connection face of the second inductance is fixedly connected to the isolation layer includes:
and carrying out alignment operation on the second inductor, so that the side surface of the second inductor is flush with the corresponding side surface of the first inductor, the connecting surface of the first inductor is parallel to the connecting surface of the second inductor, and the first inductor and the second inductor are symmetrical about the center of the isolation layer.
10. The inductance device is characterized by comprising a first inductance, a second inductance and an isolation layer, wherein the connection surface of the first inductance is connected with the second inductance through the isolation layer, and the distance between the first inductance and the second inductance is a preset distance.
11. The inductive device of claim 10, wherein said barrier layer comprises a spacer, a first adhesive layer and a second adhesive layer, said spacer being coupled to said first inductor coupling surface by said first adhesive layer, said spacer being coupled to said second inductor coupling surface by said second adhesive layer, said spacer having a thickness consistent with said predetermined spacing.
12. The inductive device of claim 10, wherein said isolation layer comprises a glue particle layer comprising a glue layer and solid particles embedded within said glue layer, said solid particles having an outer diameter consistent with said predetermined spacing.
CN202311404435.8A 2023-10-26 2023-10-26 An inductor gap control method and inductor device Pending CN117275897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311404435.8A CN117275897A (en) 2023-10-26 2023-10-26 An inductor gap control method and inductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311404435.8A CN117275897A (en) 2023-10-26 2023-10-26 An inductor gap control method and inductor device

Publications (1)

Publication Number Publication Date
CN117275897A true CN117275897A (en) 2023-12-22

Family

ID=89206249

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311404435.8A Pending CN117275897A (en) 2023-10-26 2023-10-26 An inductor gap control method and inductor device

Country Status (1)

Country Link
CN (1) CN117275897A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859357B1 (en) * 2016-07-14 2018-01-02 International Business Machines Corporation Magnetic inductor stacks with multilayer isolation layers
CN211699886U (en) * 2020-01-08 2020-10-16 深圳市科达嘉电子有限公司 Non-coupling inductance bar
CN211699884U (en) * 2019-12-06 2020-10-16 深圳市科达嘉电子有限公司 Heap heavy current inductance
CN113823491A (en) * 2021-09-28 2021-12-21 深圳顺络电子股份有限公司 Dual coil inductors and electronics
CN115547669A (en) * 2022-11-07 2022-12-30 横店集团东磁股份有限公司 Coupling inductor manufacturing method and coupling inductor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859357B1 (en) * 2016-07-14 2018-01-02 International Business Machines Corporation Magnetic inductor stacks with multilayer isolation layers
CN211699884U (en) * 2019-12-06 2020-10-16 深圳市科达嘉电子有限公司 Heap heavy current inductance
CN211699886U (en) * 2020-01-08 2020-10-16 深圳市科达嘉电子有限公司 Non-coupling inductance bar
CN113823491A (en) * 2021-09-28 2021-12-21 深圳顺络电子股份有限公司 Dual coil inductors and electronics
CN115547669A (en) * 2022-11-07 2022-12-30 横店集团东磁股份有限公司 Coupling inductor manufacturing method and coupling inductor

Similar Documents

Publication Publication Date Title
CN110797172B (en) Component carrier comprising an embedded inductor with inlay
US20200243417A1 (en) Component Carrier Comprising at Least One Heat Pipe and Method for Producing Said Component Carrier
US8564092B2 (en) Power convertor device and construction methods
CN1770332B (en) Simplified surface-mount devices and methods
TWI629864B (en) Power converter and method for manufacturing the same
KR100828037B1 (en) Magnetic element and method for the same
KR20140010977A (en) Magnetic element for wireless power transmission and method for manufacturing same
US5992005A (en) Method of manufacturing a power magnetic device
TW200425174A (en) Gapped core structure for magnetic components
CN208444728U (en) Flat-plate transformer
CN113015328A (en) Component carrier with embedded magnetic inlay and integrated coil structure
CN107154301A (en) Magnetic components and their suitable power modules
CN117275897A (en) An inductor gap control method and inductor device
CN105513781B (en) Coil type unit and its manufacturing method for wireless power transmission
CN110707197A (en) LED substrate and LED display panel manufacturing method
CN114390800A (en) Manufacturing method of magnetic-line-embedded circuit board and electronic element
EP0896346A1 (en) Methods of manufacturing a magnetic device and tool for manufacturing the same
JP2003257744A (en) Magnetic element, manufacturing method thereof, and power-supply module using the same
TW200811889A (en) Transformer structure and manufacturing method thereof
CN114628135A (en) A method of manufacturing an electronic component
CN113223823A (en) Magnetic component, component carrier and method for producing a magnetic component
CN207458723U (en) Inductor
JP2007173628A (en) Reactor core and manufacturing method thereof
CN110176447A (en) Surface-assembled component and its packaging method
CN219759613U (en) Chip welding structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20231222

RJ01 Rejection of invention patent application after publication