CN117275897A - An inductor gap control method and inductor device - Google Patents

Abstract

The application discloses an inductance gap control method and an inductance device, wherein the inductance gap control method is characterized in that a first inductance is fixed so that an isolation layer is arranged on a subsequent first inductance; through set up the isolation layer on the junction surface of first inductance to place the junction surface fixed connection isolation layer of second inductance messenger second inductance, with the interval preset interval between messenger's first inductance and the second inductance, have stable interval and stable connection between messenger's first inductance and the second inductance, avoided between the adjacent inductance because the electromagnetic interference that unstable or seamless connection caused of distance has improved inductance connection stability and fastness, the simple process step is few, the cost is lower, the clearance between the stable control inductance.

Description

An inductor gap control method and inductor device

Technical field

The present application relates to the technical field of electronic devices, and specifically relates to an inductor gap control method and an inductor device.

Background technique

With the rapid development of the automotive electronics industry, automotive electronics has begun to develop in the direction of regionalization and modularization. The functions that need to be implemented in the same module or area have also increased rapidly. In order to achieve more functions, the number of electronic components required in the same size is also increasing rapidly, which makes the requirements for miniaturization and modularization of electronic components more urgent.

Power inductors are one of the commonly used electronic components. Due to the electromagnetic effect of the inductor itself, when the distance between two or more inductors is unstable, it is very easy for interference to occur between multiple inductors, leading to application problems.

When existing devices are equipped with multiple inductors, interference is likely to occur when the distance between adjacent or multiple inductors is unstable, which may easily lead to performance degradation or failure of the inductor group. In the existing technology, there are also two inductors without one. Seam connection is used to avoid the above problems. However, when the inductor group is used in audio devices, under high current conditions, there is an electromagnetic interference problem between the windings of the two inductors.

Therefore, how to avoid electromagnetic interference or problems caused by adjacent or multiple inductors is an issue that needs to be solved urgently.

Contents of the invention

In view of this, this application provides an inductor gap control method and an inductor device to solve the existing problems of electromagnetic interference generated between multiple inductors and inductor group failure or performance degradation.

This application provides an inductance gap control method, including the steps:

Fixed first inductor;

An isolation layer is provided on the connection surface of the first inductor;

The second inductor is placed so that the connection surface of the second inductor is fixedly connected to the isolation layer, so that the first inductor and the second inductor are separated by a preset distance.

Optionally, the step of providing an isolation layer on the connection surface of the first inductor includes:

A spacer bonding operation or glue dispensing operation is performed on the connection surface of the first inductor to generate the isolation layer.

Optionally, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:

A first adhesive layer is provided on the connection surface of the first inductor or the side of the separator facing the first inductor, wherein the thickness of the separator is consistent with the preset spacing;

The first adhesive layer is connected to the first inductor and the separator.

Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

A second adhesive layer is provided on the side of the separator facing the second inductor or the connection surface of the second inductor;

The second adhesive layer is connected to the separator and the second inductor.

Optionally, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:

Contains granular glue;

Perform a glue dispensing operation on the connection surface of the first inductor, so that the granular glue is evenly laid on the connection surface of the first inductor to generate a glue particle layer;

The glue particle layer is dried and fixed to form the isolation layer.

Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

Make the connection surface of the second inductor face the connection surface of the first inductor and be in close contact with the side of the isolation layer;

A baking operation is performed to soften the isolation layer and bond the second inductor.

Optionally, the steps for configuring particle-containing glue include:

According to the mass components, 1-2 parts of glue, 0.3-0.6 parts of diluent and 2-3 parts of solid particles are placed in a mixing tank and stirred evenly to obtain the particle-containing glue.

Optionally, the outer diameter of the solid particles is consistent with the preset distance.

Optionally, the step of placing the second inductor so that the connection surface of the second inductor is firmly connected to the isolation layer includes:

Align the second inductor so that the side surfaces of the second inductor are flush with the side surfaces corresponding to the first inductor and the connection surface of the first inductor is parallel to the connection surface of the second inductor, and The first inductor and the second inductor are made symmetrical about the center of the isolation layer.

This application also provides an inductor device, including a first inductor, a second inductor and an isolation layer. The connection surface of the first inductor and the second inductor are connected through the isolation layer. The first inductor and the second inductor are connected through the isolation layer. The distance between the second inductors is a preset distance.

Optionally, the isolation layer includes a spacer, a first adhesive layer and a second adhesive layer. The spacer is connected to the connection surface of the first inductor through the first adhesive layer. The board is connected to the connection surface of the second inductor through a second adhesive layer, and the thickness of the separator is consistent with the size of the preset spacing.

Optionally, the isolation layer includes a glue particle layer. The glue particle layer includes a glue layer and solid particles. The solid particles are embedded inside the glue layer. The outer diameter of the solid particles is consistent with the preset diameter. The spacing is the same size.

The beneficial effects of the inductance gap control method and inductance device provided by this application are:

The inductor gap control method of this application fixes the first inductor to facilitate the subsequent setting of an isolation layer on the first inductor; by setting an isolation layer on the connection surface of the first inductor and placing the second inductor, the connection surface of the second inductor is fixed Connect the isolation layer so that the first inductor and the second inductor are separated by a preset distance, so that there is a stable distance between the first inductor and the second inductor and a stable connection, avoiding the instability or instability of the distance between adjacent inductors. The electromagnetic interference caused by the seamless connection improves the stability and firmness of the inductor connection. The process is simple and requires fewer steps, the cost is lower, and the gap between the inductors is stably controlled.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.

Figure 1 is a flow chart of the inductance gap control method according to the embodiment of the present application;

Figure 2 is a flow chart of setting an isolation layer in the first implementation mode of the embodiment of the present application;

Figure 3 is a flow chart for placing a second inductor in the first implementation of the embodiment of the present application;

Figure 4 is a flow chart for setting an isolation layer in the second implementation mode of the embodiment of the present application;

Figure 5 is a flow chart for placing the second inductor in the second implementation of the embodiment of the present application;

Figure 6 is a schematic structural diagram of an inductor device according to an embodiment of the present application;

Figure 7 is a schematic diagram of the structure of the isolation layer in the first implementation mode of the embodiment of the present application;

FIG. 8 is a schematic diagram of the isolation layer structure in the second implementation mode of the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of this application. The following embodiments and their technical features may be combined with each other without conflict.

The following description of the embodiments will further help the public understand the present invention, but the specific embodiments given by the applicant cannot and should not be regarded as limiting the technical solution of the present invention. Any modification of components or technical features Definition.

This application provides an inductance gap control method. Referring to Figure 1, the inductance gap control method includes the steps:

S1: fixed first inductor;

S2: Set an isolation layer on the connection surface of the first inductor;

S3: Place the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer, so that the first inductor and the second inductor are separated by a preset distance.

In some embodiments, the preset spacing can be set to 0.1-0.5mm.

As an optional implementation mode of the present application, in step S2, the step of setting an isolation layer on the connection surface of the first inductor includes:

A spacer bonding operation or glue dispensing operation is performed on the connection surface of the first inductor to form an isolation layer.

In a first implementation manner of an embodiment of the present application, referring to Figure 2, the step of performing a spacer bonding operation or a glue dispensing operation on the connection surface of the first inductor to generate an isolation layer includes:

S21: Set a first adhesive layer on the connection surface of the first inductor or the side of the separator facing the first inductor;

S22: Connect the first adhesive layer to the first inductor and the separator.

In some embodiments, the separator is made of non-magnetic materials such as ceramics or films, and the two sides of the separator connected to the first inductor and the second inductor are parallel planes.

In some specific embodiments, the thickness of the separator is consistent with the preset interval, that is, the thickness of the separator can be 0.1-0.5 mm, and the required thickness of the separator can be flexibly selected according to inductor products of different sizes.

In some embodiments, after taking into account the tolerance of the first adhesive layer and the second adhesive layer, that is, taking into account the tolerance of the adhesive glue or tape, the tolerance of the thickness of the separator and the preset spacing may be ±0.02-0.05 mm.

In some specific embodiments, the connection surface size of the first inductor and the second inductor is 6×6 mm. In this case, a separator with a thickness of 0.2 mm can be selected as the isolation layer between the first inductor and the second inductor.

Further, referring to Figure 3, in step S3, after step S22, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

S31: Set a second adhesive layer on the side of the separator facing the second inductor or the connection surface of the second inductor;

S32: Connect the second adhesive layer to the separator and the second inductor.

In some embodiments, the first adhesive layer and the second adhesive layer include, but are not limited to, one of an adhesive layer formed of glue and double-sided tape.

In some specific embodiments, the above steps S1 to S3 can be simplified as:

After fixing the first inductor, spray glue evenly on the connecting surface of the first inductor or one side of the separator, and bond the first inductor and the separator through the glue;

After the glue is dry and the separator is fixed on the first inductor, spray glue on the other side of the separator or the connecting surface of the second inductor, bond the second inductor and the separator through the glue, and dry the glue through the baking step. So that the isolation layer stably connects the first inductor and the second inductor.

In the second implementation of the embodiment of the present application, referring to Figure 4, the step of performing a spacer operation or a glue dispensing operation on the connection surface of the first inductor to generate an isolation layer includes:

S23: Configure glue containing granules;

S24: Perform a glue dispensing operation on the connection surface of the first inductor, so that the granular glue is evenly laid on the connection surface of the first inductor to generate a glue particle layer;

S25: Dry and fix the glue particle layer to generate an isolation layer.

In some embodiments, the drying and fixing operation may be a drying operation.

Further, referring to Figure 5, in step S3, after step S25, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:

S31: Make the connection surface of the second inductor face the connection surface of the first inductor and closely contact the side of the isolation layer;

S32: Perform a baking operation to soften the isolation layer and bond the second inductor.

As an optional implementation mode of the present application, in step S23, the step of configuring particle-containing glue includes:

According to the mass components, place 1-2 parts of glue, 0.3-0.6 parts of diluent and 2-3 parts of solid particles in a mixing tank and stir evenly to obtain particle-containing glue. The diluent is used to maintain the viscosity of the particle-containing glue, and the first inductor and the second inductor can be stably bonded together with the glue; the solid particles are used to ensure the preset distance between the first inductor and the second inductor.

In some embodiments, the composition of the glue includes but is not limited to epoxy resin and silica; the solid particles include but is not limited to non-magnetic particles such as silica. The shape of the solid particles may be spherical, and the preset distance between the first inductor and the second inductor is controlled by the outer diameter of the solid particles.

In some embodiments, the solid particles may be composed of spherical particles with consistent outer diameters, or may be composed of several particles with inconsistent inner diameters. The outer diameter of the largest particle is consistent with the preset spacing, that is, 0.1-0.5 mm.

Under ideal circumstances, the above-mentioned particles are all uniform spherical particles to ensure the uniformity of the glue viscosity; in practical applications, due to process reasons, some small particles may not be particles, but the thickness of the resulting isolation layer and the spacing between the first inductor and the second inductor has no effect.

As an optional implementation mode of the present application, the outer diameter of the solid particles is consistent with the preset spacing.

Preferably, the isolation layer is generated by either of the above-mentioned bonding partition operations or dispensing operations, which improves applicability and selectability. In actual applications, the isolation layer can be generated according to the user's needs such as location and time. , economy and equipment flexibility to select appropriate operations to generate an isolation layer. Therefore, the inductance control method of this application has a wide range of applications and is suitable for many occasions.

As an optional implementation manner of the present application, the step of placing the second inductor so that the connection surface of the second inductor is connected to the fixed connection isolation layer includes:

Align the second inductor so that the side surfaces of the second inductor are flush with the corresponding side surfaces of the first inductor and the connection surface of the first inductor is parallel to the connection surface of the second inductor, and the first inductor and the second inductor are isolated from each other. The layer is symmetrical about its center.

In some embodiments, by fixing and aligning the first inductor and the second inductor, the same sides of the first inductor and the second inductor are on the same plane, and the two opposite connection surfaces are parallel to each other, and the isolation layer controls the two sides. The uniformity of the spacing between the inductors simplifies the process flow, improves efficiency, reduces costs, and ensures the stable operation of the inductor group.

This application also provides an inductor device. Referring to Figure 6, the inductor device includes a first inductor 1, a second inductor 2 and an isolation layer 3. The connection surface of the first inductor 1 and the second inductor 2 are connected through the isolation layer 3. The distance between the first inductor 1 and the second inductor 2 is a preset distance.

In some embodiments, the connection surface of the first inductor and the second inductor can be connected through an isolation layer through the inductor spacing control method of the present application, and the distance between the first inductor and the second inductor is a preset distance.

In the first implementation of the embodiment of the present application, referring to Figure 7, the isolation layer 3 includes a separator 31, a first adhesive layer 32 and a second adhesive layer 33;

The spacer 31 is bonded to the first inductor 1 through the first adhesive layer 32 and bonded to the second inductor 2 through the second adhesive layer 33 .

In some embodiments, the first adhesive layer 32 and the second adhesive layer 33 may be one of a glue adhesive layer or a double-sided tape.

In some embodiments, the separator 31 is made of non-magnetic materials such as ceramics or films, and the two sides of the separator 31 connected to the first inductor and the second inductor are parallel planes.

In some specific embodiments, the thickness of the separator 31 may be 0.1-0.5 mm, and the required thickness of the separator can be flexibly selected according to inductor products of different sizes.

In some embodiments, after taking into account the tolerance of the first adhesive layer 32 and the second adhesive layer 33, that is, taking into account the tolerance of the adhesive glue or tape, the tolerance between the thickness of the partition 31 and the preset spacing may be ± 0.02-0.05mm.

In the second implementation of the embodiment of the present application, referring to Figure 8, the isolation layer 3 includes several glue particle layers. The glue particle layer includes a glue layer 34, solid particles 35 and an adhesive (not shown in the figure). The solid The maximum outer diameter of the particles 35 is consistent with the preset distance.

In some embodiments, the composition of the glue layer 34 includes but is not limited to epoxy resin and silica. The glue layer 34 is a layered structure formed by solidifying liquefied glue. One side of the glue layer 34 is directly in contact with the first inductor 1 For bonding, the other side of the glue layer 35 is directly bonded to the second inductor 2 . , the solid particles are embedded in the glue layer 34. Solid particles 35 include, but are not limited to, non-magnetic particles such as silica. The shape of the solid particles 34 may be spherical, and the preset distance between the first inductor 1 and the second inductor 2 is controlled by the outer diameter of the solid particles 34 .

In some embodiments, the solid particles 34 may be composed of spherical particles with consistent outer diameters, or may be composed of several particles with inconsistent inner diameters. The outer diameter of the largest particle is consistent with the preset spacing, that is, the outer diameter of the largest particle. is 0.1-0.5mm.

In some embodiments, the side surfaces of the second inductor 2 are flush with the corresponding side surfaces of the first inductor and the connection surface of the first inductor 1 is parallel to the connection surface of the second inductor 2. The first inductor 1 and the second inductor 2 are about the isolation layer. center symmetry.

In some embodiments, the same side surfaces of the first inductor 1 and the second inductor 2 are on the same plane, and the two opposite connection surfaces are parallel to each other. The isolation layer 3 is used to control the uniformity of the spacing between the two inductors, simplifying the process. The process improves efficiency, reduces costs, and ensures the stable operation of the inductor group.

The advantages of the inductance gap control method and inductance device provided by this application are:

The inductor gap control method of this application fixes the first inductor to facilitate the subsequent setting of an isolation layer on the first inductor; by setting an isolation layer on the connection surface of the first inductor and placing the second inductor, the connection surface of the second inductor is fixed Connect the isolation layer so that the first inductor and the second inductor are separated by a preset distance, so that there is a stable distance between the first inductor and the second inductor and a stable connection, avoiding the instability or instability of the distance between adjacent inductors. The electromagnetic interference caused by the seamless connection improves the stability and firmness of the inductor connection. The process is simple and requires fewer steps, the cost is lower, and the gap between the inductors is stably controlled.

The above are only embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the description and drawings of the present application, such as the mutual exchange of technical features between the various embodiments. Combination, or direct or indirect application in other related technical fields, are all equally included in the scope of patent protection of this application.

Claims (12)

1. An inductance gap control method, comprising the steps of:

fixing a first inductor;

an isolation layer is arranged on the connection surface of the first inductor;

and placing a second inductor so that the connecting surface of the second inductor is fixedly connected with the isolation layer, so that a preset interval is reserved between the first inductor and the second inductor.

2. The inductance gap control method according to claim 1, wherein the step of providing an isolation layer on the connection face of the first inductance includes:

and performing a baffle bonding operation or a dispensing operation on the connecting surface of the first inductor to generate the isolation layer.

3. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:

a first bonding layer is arranged on the connecting surface of the first inductor or the side surface of the partition plate facing the first inductor, wherein the thickness of the partition plate is consistent with the preset interval;

the first adhesive layer is made to connect the first inductor and the separator.

4. The inductance gap control method of claim 3, wherein the step of positioning the second inductance such that the connection surface of the second inductance is fixedly connected to the isolation layer includes:

a second bonding layer is arranged on the side surface of the partition plate facing the second inductor or the connecting surface of the second inductor;

and connecting the second adhesive layer with the separator and the second inductor.

5. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:

preparing glue containing particles;

dispensing operation is carried out on the connecting surface of the first inductor, so that the granular glue is uniformly paved on the connecting surface of the first inductor to generate a glue granular layer;

and drying and fixing the glue particle layer to generate the isolation layer.

6. The inductance gap control method of claim 5, wherein the step of positioning a second inductance such that a connection surface of the second inductance is fixedly connected to the isolation layer includes:

the connecting surface of the second inductor is opposite to the connecting surface of the first inductor and is clung to the side surface of the isolation layer;

a baking operation is performed to soften the isolation layer and bond the second inductor.

7. The method of inductive gap control of claim 5, wherein the step of disposing a particle-containing glue comprises:

and placing 1-2 parts of glue and 0.3-0.6 part of solid particles of 2-3 parts of diluent into a stirring tank according to mass components, and stirring uniformly to obtain the glue containing particles.

8. The inductance gap control method of claim 7, wherein an outer diameter of the solid particles is consistent with the preset spacing.

9. The inductance gap control method according to claim 1, wherein the step of positioning the second inductance such that the connection face of the second inductance is fixedly connected to the isolation layer includes:

and carrying out alignment operation on the second inductor, so that the side surface of the second inductor is flush with the corresponding side surface of the first inductor, the connecting surface of the first inductor is parallel to the connecting surface of the second inductor, and the first inductor and the second inductor are symmetrical about the center of the isolation layer.

10. The inductance device is characterized by comprising a first inductance, a second inductance and an isolation layer, wherein the connection surface of the first inductance is connected with the second inductance through the isolation layer, and the distance between the first inductance and the second inductance is a preset distance.

11. The inductive device of claim 10, wherein said barrier layer comprises a spacer, a first adhesive layer and a second adhesive layer, said spacer being coupled to said first inductor coupling surface by said first adhesive layer, said spacer being coupled to said second inductor coupling surface by said second adhesive layer, said spacer having a thickness consistent with said predetermined spacing.

12. The inductive device of claim 10, wherein said isolation layer comprises a glue particle layer comprising a glue layer and solid particles embedded within said glue layer, said solid particles having an outer diameter consistent with said predetermined spacing.