CN117275897A - Inductance gap control method and inductance device - Google Patents
Inductance gap control method and inductance device Download PDFInfo
- Publication number
- CN117275897A CN117275897A CN202311404435.8A CN202311404435A CN117275897A CN 117275897 A CN117275897 A CN 117275897A CN 202311404435 A CN202311404435 A CN 202311404435A CN 117275897 A CN117275897 A CN 117275897A
- Authority
- CN
- China
- Prior art keywords
- inductor
- inductance
- isolation layer
- layer
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000002955 isolation Methods 0.000 claims abstract description 70
- 239000010410 layer Substances 0.000 claims description 94
- 239000003292 glue Substances 0.000 claims description 51
- 239000002245 particle Substances 0.000 claims description 49
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 23
- 238000005192 partition Methods 0.000 claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000003085 diluting agent Substances 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims 3
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000012798 spherical particle Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000006249 magnetic particle Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000005288 electromagnetic effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/263—Fastening parts of the core together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/303—Clamping coils, windings or parts thereof together
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The application discloses an inductance gap control method and an inductance device, wherein the inductance gap control method is characterized in that a first inductance is fixed so that an isolation layer is arranged on a subsequent first inductance; through set up the isolation layer on the junction surface of first inductance to place the junction surface fixed connection isolation layer of second inductance messenger second inductance, with the interval preset interval between messenger's first inductance and the second inductance, have stable interval and stable connection between messenger's first inductance and the second inductance, avoided between the adjacent inductance because the electromagnetic interference that unstable or seamless connection caused of distance has improved inductance connection stability and fastness, the simple process step is few, the cost is lower, the clearance between the stable control inductance.
Description
Technical Field
The application relates to the technical field of electronic devices, in particular to an inductance gap control method and an inductance device.
Background
Along with the rapid development of the automobile electronic industry, the automobile electronics start to develop towards regional and modularized development, and the functions required to be realized in the same module or region are rapidly increased. In order to achieve more functions, the number of electronic components required in the same size is also rapidly increased, and thus the miniaturization and modularization requirements of the electronic components are more urgent.
The power inductor is one of common electronic components, and is very easy to generate interference among a plurality of inductors when the distance between two or more inductors is unstable due to the electromagnetic effect of the inductor, so that the application is problematic.
When a plurality of inductors are arranged in the traditional device, interference is easy to occur when the distance between adjacent or a plurality of inductors is unstable, and the problems of performance degradation, failure and the like of an inductance group are easy to cause; there is also a problem in the prior art that two inductors are connected seamlessly to avoid the above problem, but when the inductor assembly is applied to an audio device, there is a problem of electromagnetic interference between windings of the two inductors under a high current condition.
Therefore, how to avoid electromagnetic interference or problems caused by adjacent or multiple inductors is a current urgent problem to be solved.
Disclosure of Invention
In view of this, the present application provides an inductance gap control method and an inductance device, so as to solve the problems of electromagnetic interference generated between a plurality of existing inductances and malfunction or performance degradation of an inductance group.
The application provides an inductance gap control method, which comprises the following steps:
fixing a first inductor;
an isolation layer is arranged on the connection surface of the first inductor;
and placing a second inductor so that the connecting surface of the second inductor is fixedly connected with the isolation layer, so that a preset interval is reserved between the first inductor and the second inductor.
Optionally, the step of disposing an isolation layer on the connection surface of the first inductor includes:
and performing a baffle bonding operation or a dispensing operation on the connecting surface of the first inductor to generate the isolation layer.
Optionally, the step of performing a spacer bonding operation or a dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:
a first bonding layer is arranged on the connecting surface of the first inductor or the side surface of the partition plate facing the first inductor, wherein the thickness of the partition plate is consistent with the preset interval;
the first adhesive layer is made to connect the first inductor and the separator.
Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected with the isolation layer includes:
a second bonding layer is arranged on the side surface of the partition plate facing the second inductor or the connecting surface of the second inductor;
and connecting the second adhesive layer with the separator and the second inductor.
Optionally, the step of performing a spacer bonding operation or a dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:
preparing glue containing particles;
dispensing operation is carried out on the connecting surface of the first inductor, so that the granular glue is uniformly paved on the connecting surface of the first inductor to generate a glue granular layer;
and drying and fixing the glue particle layer to generate the isolation layer.
Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected with the isolation layer includes:
the connecting surface of the second inductor is opposite to the connecting surface of the first inductor and is clung to the side surface of the isolation layer;
a baking operation is performed to soften the isolation layer and bond the second inductor.
Optionally, the step of configuring the particle-containing glue comprises:
and placing 1-2 parts of glue and 0.3-0.6 part of solid particles of 2-3 parts of diluent into a stirring tank according to mass components, and stirring uniformly to obtain the glue containing particles.
Optionally, the outer diameter of the solid particles is consistent with the preset spacing.
Optionally, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected with the isolation layer includes:
and carrying out alignment operation on the second inductor, so that the side surface of the second inductor is flush with the corresponding side surface of the first inductor, the connecting surface of the first inductor is parallel to the connecting surface of the second inductor, and the first inductor and the second inductor are symmetrical about the center of the isolation layer.
The application also provides an inductance device, including first inductance, second inductance and isolation layer, the connection face of first inductance with pass through between the second inductance the isolation layer is connected, first inductance with distance between the second inductance is the preset interval.
Optionally, the isolation layer includes baffle, first adhesive linkage and second adhesive linkage, the baffle passes through first adhesive linkage with the junction surface of first inductance, the baffle pass through the second adhesive linkage with the junction surface of second inductance is connected, the thickness of baffle with the size of predetermineeing the interval is unanimous.
Optionally, the isolation layer includes glue granule layer, glue granule layer includes glue layer and solid particle, solid particle inlays to be located inside the glue layer, the external diameter of solid particle with predetermine the size of interval unanimous.
The inductance gap control method and the inductance device provided by the application have the beneficial effects that:
according to the inductance gap control method, the first inductor is fixed so that an isolation layer is arranged on the first inductor; through set up the isolation layer on the junction surface of first inductance to place the junction surface fixed connection isolation layer of second inductance messenger second inductance, with the interval preset interval between messenger's first inductance and the second inductance, have stable interval and stable connection between messenger's first inductance and the second inductance, avoided between the adjacent inductance because the electromagnetic interference that unstable or seamless connection caused of distance has improved inductance connection stability and fastness, the simple process step is few, the cost is lower, the clearance between the stable control inductance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of an inductance gap control method of an embodiment of the present application;
FIG. 2 is a flow chart of providing an isolation layer in a first implementation of the present example;
fig. 3 is a flowchart of a placement of a second inductor in a first implementation of the embodiment of the present application;
FIG. 4 is a flow chart of providing an isolation layer in a second implementation of the present example;
fig. 5 is a flowchart of a second inductor placement in a second implementation of the embodiment of the present application;
fig. 6 is a schematic structural diagram of an inductance device according to an embodiment of the present application;
FIG. 7 is a schematic view of an isolation layer in a first implementation of the embodiment of the present application;
fig. 8 is a schematic view of a separator in a second implementation of the embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. The various embodiments described below and their technical features can be combined with each other without conflict.
The present invention will be more fully understood by the following description of embodiments, but the specific embodiments given by the applicant should not be or should not be construed as limiting the technical solution of the present invention, any definition of components or technical features.
The application provides an inductance gap control method, referring to fig. 1, the inductance gap control method includes the steps of:
s1: fixing a first inductor;
s2: an isolation layer is arranged on the connection surface of the first inductor;
s3: and placing the second inductor so that the connecting surface of the second inductor is fixedly connected with the isolation layer, so that a preset interval is formed between the first inductor and the second inductor.
In some embodiments, the preset spacing may be set to 0.1-0.5mm.
As an optional embodiment of the present application, in step S2, the step of disposing the isolation layer on the connection surface of the first inductor includes:
and performing a baffle bonding operation or a dispensing operation on the connecting surface of the first inductor to generate an isolation layer.
In a first implementation manner of the embodiment of the present application, referring to fig. 2, the step of performing a bonding spacer operation or a dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:
s21: a first bonding layer is arranged on the connecting surface of the first inductor or the side surface of the partition plate facing the first inductor;
s22: the first adhesive layer is made to connect the first inductor and the separator.
In some embodiments, the separator is made of non-magnetic materials such as ceramic or film, and two sides of the separator connected with the first inductor and the second inductor are parallel planes.
In some embodiments, the thickness of the separator is consistent with the preset interval, that is, the thickness of the separator can be 0.1-0.5mm, and the separator with the required thickness can be flexibly selected according to inductance products with different sizes.
In some embodiments, the thickness of the separator may have a tolerance of + -0.02-0.05 mm from the preset spacing, taking into account the tolerances of the first adhesive layer and the second adhesive layer, i.e., taking into account the tolerance of the adhesive glue or tape.
In some embodiments, the dimensions of the connection surfaces of the first inductor and the second inductor are 6×6mm, and a spacer with a thickness of 0.2mm may be selected as the isolation layer between the first inductor and the second inductor.
Further, referring to fig. 3, in step S3, after step S22, the step of placing the second inductor so that the connection surface of the second inductor is fixedly connected to the isolation layer includes:
s31: a second bonding layer is arranged on the side surface of the partition plate facing the second inductor or the connecting surface of the second inductor;
s32: the second adhesive layer is made to connect the separator and the second inductor.
In some embodiments, the first adhesive layer and the second adhesive layer include, but are not limited to, one of an adhesive layer formed of glue and a double-sided tape.
In some embodiments, the steps S1 to S3 may be simplified as follows:
after the first inductor is fixed, glue is uniformly sprayed on a connecting surface of the first inductor or one side surface of the partition board, and the first inductor and the partition board are bonded through the glue;
after the glue drying partition board is fixed on the first inductor, glue is sprayed on the other side surface of the partition board or the connecting surface of the second inductor, the second inductor and the partition board are bonded through the glue, and the glue is dried through a baking step, so that the isolation layer is stably connected with the first inductor and the second inductor.
In a second implementation manner of the embodiment of the present application, referring to fig. 4, the step of performing a bonding spacer operation or a dispensing operation on the connection surface of the first inductor to generate the isolation layer includes:
s23: preparing glue containing particles;
s24: dispensing operation is carried out on the connecting surface of the first inductor, so that the particle glue is uniformly paved on the connecting surface of the first inductor to generate a glue particle layer;
s25: and drying and fixing the glue particle layer to generate an isolation layer.
In some embodiments, the drying and fixing operation may be a drying operation.
Further, referring to fig. 5, in step S3, after step S25, the step of placing the second inductor such that the connection surface of the second inductor is fixedly connected to the isolation layer includes:
s31: the connecting surface of the second inductor is opposite to the connecting surface of the first inductor and is tightly attached to the side surface of the isolation layer;
s32: a baking operation is performed to soften the isolation layer and bond the second inductor.
As an optional embodiment of the present application, in step S23, the step of disposing the glue containing particles includes:
and placing 1-2 parts of glue and 0.3-0.6 part of solid particles of 2-3 parts of diluent into a stirring tank according to mass components, and stirring uniformly to obtain the glue containing particles. The viscosity of the glue containing particles is kept through the diluent, and the glue is matched with the glue to stably bond the first inductor and the second inductor; the preset distance between the first inductor and the second inductor is ensured by solid particles.
In some embodiments, the composition of the glue includes, but is not limited to, epoxy, silica; solid particles include, but are not limited to, non-magnetic particles such as silica. The shape of the solid particles may be spherical, and the preset spacing between the first inductor and the second inductor is controlled by the outer diameter of the solid particles.
In some embodiments, the solid particles may be spherical particles with uniform outer diameters, or may be a plurality of particles with non-uniform inner diameters, and the outer diameter of the particles with the maximum volume is consistent with a preset interval, namely, 0.1-0.5mm.
In an ideal case, the particles are spherical particles with uniform particles so as to ensure the uniformity of the viscosity of the glue; in practical applications, some small particles may not be particles due to the process, but do not affect the thickness of the resulting isolation layer and the spacing between the first and second inductors.
As an alternative embodiment of the present application, the outer diameter of the solid particles corresponds to the preset spacing.
Preferably, the isolation layer is generated through any one of the two operations of the bonding partition plate operation or the dispensing operation, so that the applicability and the selectivity are improved, and in practical application, the proper operation can be flexibly selected according to the requirements of users, such as the field, the time, the economy and the equipment, so that the isolation layer is generated.
As an optional embodiment of the present application, the step of placing the second inductor such that the connection surface of the second inductor is connected to the fixed connection isolation layer includes:
and carrying out alignment operation on the second inductor, so that the side surface of the second inductor is flush with the corresponding side surface of the first inductor, the connecting surface of the first inductor is parallel to the connecting surface of the second inductor, and the first inductor and the second inductor are symmetrical about the center of the isolation layer.
In some embodiments, through the fixing and aligning operation of the first inductor and the second inductor, the same side surfaces of the first inductor and the second inductor are in the same plane, and the two opposite connecting surfaces are parallel to each other, and the uniformity of the interval between the two inductors is controlled through the isolation layer, so that the process flow is simplified, the efficiency is improved, the cost is reduced, and the stable work of the inductor group is ensured.
The application still provides an inductance device, referring to fig. 6, the inductance device includes first inductance 1, second inductance 2 and isolation layer 3, connects through isolation layer 3 between the junction surface of first inductance 1 and the second inductance 2, and distance is the preset interval between first inductance 1 and the second inductance 2.
In some embodiments, the connection between the connection surface of the first inductor and the second inductor through the isolation layer may be achieved by the above-mentioned method for controlling the inductance interval, where the distance between the first inductor and the second inductor is a preset distance.
In the first implementation of the present example, referring to fig. 7, the separator 3 includes a separator 31, a first adhesive layer 32, and a second adhesive layer 33;
the separator 31 is bonded to the first inductor 1 via the first adhesive layer 32 and bonded to the second inductor 2 via the second adhesive layer 33.
In some embodiments, the first adhesive layer 32 and the second adhesive layer 33 may be one of a glue adhesive layer or a double-sided tape.
In some embodiments, the separator 31 is made of a non-magnetic material such as ceramic or film, and two sides of the separator 31 connected to the first inductor and the second inductor are parallel planes.
In some embodiments, the thickness of the spacer 31 may be 0.1-0.5mm, and the spacer with the required thickness is flexibly selected according to inductance products with different sizes.
In some embodiments, the thickness of the separator 31 may have a tolerance of + -0.02-0.05 mm from the preset distance, taking into account the tolerance of the first adhesive layer 32 and the second adhesive layer 33, i.e., taking into account the tolerance of the adhesive glue or tape.
In a second implementation of the present embodiment, referring to fig. 8, the isolation layer 3 includes several glue particle layers, each including a glue layer 34, solid particles 35 and an adhesive (not shown in the figure), and the maximum outer diameter of the solid particles 35 is consistent with the preset spacing.
In some embodiments, the composition of the glue layer 34 includes, but is not limited to, epoxy resin and silicon dioxide, and the glue layer 34 is a layered structure formed by solidifying liquefied glue, one side surface of the glue layer 34 is directly bonded to the first inductor 1, and the other side surface of the glue layer 35 is directly bonded to the second inductor 2. The solid particles are embedded within glue layer 34. Solid particles 35 include, but are not limited to, non-magnetic particles such as silica. The shape of the solid particles 34 may be spherical, and the preset spacing between the first inductor 1 and the second inductor 2 is controlled by the outer diameter of the solid particles 34.
In some embodiments, solid particles 34 may be composed of spherical particles having uniform outer diameters, or may be composed of particles having non-uniform inner diameters, with the largest volume of particles having an outer diameter that is consistent with the predetermined spacing, i.e., the largest volume of particles having an outer diameter of 0.1-0.5mm.
In some embodiments, the side surface of the second inductor 2 is flush with the corresponding side surface of the first inductor, and the connection surface of the first inductor 1 is parallel to the connection surface of the second inductor 2, and the first inductor 1 and the second inductor 2 are symmetrical about the center of the isolation layer.
In some embodiments, the same side surfaces of the first inductor 1 and the second inductor 2 are in the same plane, and the two opposite connection surfaces are parallel to each other, so that the uniformity of the distance between the two inductors is controlled through the isolation layer 3, the process flow is simplified, the efficiency is improved, the cost is reduced, and the stable operation of the inductor group is ensured.
The inductance gap control method and the inductance device provided by the application have the advantages that:
according to the inductance gap control method, the first inductor is fixed so that an isolation layer is arranged on the first inductor; through set up the isolation layer on the junction surface of first inductance to place the junction surface fixed connection isolation layer of second inductance messenger second inductance, with the interval preset interval between messenger's first inductance and the second inductance, have stable interval and stable connection between messenger's first inductance and the second inductance, avoided between the adjacent inductance because the electromagnetic interference that unstable or seamless connection caused of distance has improved inductance connection stability and fastness, the simple process step is few, the cost is lower, the clearance between the stable control inductance.
The foregoing embodiments are merely examples of the present application, and are not intended to limit the scope of the patent application, so that all equivalent structures or equivalent processes using the descriptions and the drawings of the present application, such as the combination of technical features of the embodiments, or direct or indirect application to other related technical fields, are included in the scope of the patent protection of the present application.
Claims (12)
1. An inductance gap control method, comprising the steps of:
fixing a first inductor;
an isolation layer is arranged on the connection surface of the first inductor;
and placing a second inductor so that the connecting surface of the second inductor is fixedly connected with the isolation layer, so that a preset interval is reserved between the first inductor and the second inductor.
2. The inductance gap control method according to claim 1, wherein the step of providing an isolation layer on the connection face of the first inductance includes:
and performing a baffle bonding operation or a dispensing operation on the connecting surface of the first inductor to generate the isolation layer.
3. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:
a first bonding layer is arranged on the connecting surface of the first inductor or the side surface of the partition plate facing the first inductor, wherein the thickness of the partition plate is consistent with the preset interval;
the first adhesive layer is made to connect the first inductor and the separator.
4. The inductance gap control method of claim 3, wherein the step of positioning the second inductance such that the connection surface of the second inductance is fixedly connected to the isolation layer includes:
a second bonding layer is arranged on the side surface of the partition plate facing the second inductor or the connecting surface of the second inductor;
and connecting the second adhesive layer with the separator and the second inductor.
5. The inductance gap control method of claim 2, wherein the step of bonding a separator or dispensing the connection surface of the first inductance to create the isolation layer comprises:
preparing glue containing particles;
dispensing operation is carried out on the connecting surface of the first inductor, so that the granular glue is uniformly paved on the connecting surface of the first inductor to generate a glue granular layer;
and drying and fixing the glue particle layer to generate the isolation layer.
6. The inductance gap control method of claim 5, wherein the step of positioning a second inductance such that a connection surface of the second inductance is fixedly connected to the isolation layer includes:
the connecting surface of the second inductor is opposite to the connecting surface of the first inductor and is clung to the side surface of the isolation layer;
a baking operation is performed to soften the isolation layer and bond the second inductor.
7. The method of inductive gap control of claim 5, wherein the step of disposing a particle-containing glue comprises:
and placing 1-2 parts of glue and 0.3-0.6 part of solid particles of 2-3 parts of diluent into a stirring tank according to mass components, and stirring uniformly to obtain the glue containing particles.
8. The inductance gap control method of claim 7, wherein an outer diameter of the solid particles is consistent with the preset spacing.
9. The inductance gap control method according to claim 1, wherein the step of positioning the second inductance such that the connection face of the second inductance is fixedly connected to the isolation layer includes:
and carrying out alignment operation on the second inductor, so that the side surface of the second inductor is flush with the corresponding side surface of the first inductor, the connecting surface of the first inductor is parallel to the connecting surface of the second inductor, and the first inductor and the second inductor are symmetrical about the center of the isolation layer.
10. The inductance device is characterized by comprising a first inductance, a second inductance and an isolation layer, wherein the connection surface of the first inductance is connected with the second inductance through the isolation layer, and the distance between the first inductance and the second inductance is a preset distance.
11. The inductive device of claim 10, wherein said barrier layer comprises a spacer, a first adhesive layer and a second adhesive layer, said spacer being coupled to said first inductor coupling surface by said first adhesive layer, said spacer being coupled to said second inductor coupling surface by said second adhesive layer, said spacer having a thickness consistent with said predetermined spacing.
12. The inductive device of claim 10, wherein said isolation layer comprises a glue particle layer comprising a glue layer and solid particles embedded within said glue layer, said solid particles having an outer diameter consistent with said predetermined spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311404435.8A CN117275897A (en) | 2023-10-26 | 2023-10-26 | Inductance gap control method and inductance device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311404435.8A CN117275897A (en) | 2023-10-26 | 2023-10-26 | Inductance gap control method and inductance device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117275897A true CN117275897A (en) | 2023-12-22 |
Family
ID=89206249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311404435.8A Pending CN117275897A (en) | 2023-10-26 | 2023-10-26 | Inductance gap control method and inductance device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117275897A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9859357B1 (en) * | 2016-07-14 | 2018-01-02 | International Business Machines Corporation | Magnetic inductor stacks with multilayer isolation layers |
| CN211699884U (en) * | 2019-12-06 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Heap heavy current inductance |
| CN211699886U (en) * | 2020-01-08 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Non-coupling inductance bar |
| CN113823491A (en) * | 2021-09-28 | 2021-12-21 | 深圳顺络电子股份有限公司 | Double-coil inductor and electronic equipment |
| CN115547669A (en) * | 2022-11-07 | 2022-12-30 | 横店集团东磁股份有限公司 | Coupling inductor manufacturing method and coupling inductor |
-
2023
- 2023-10-26 CN CN202311404435.8A patent/CN117275897A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9859357B1 (en) * | 2016-07-14 | 2018-01-02 | International Business Machines Corporation | Magnetic inductor stacks with multilayer isolation layers |
| CN211699884U (en) * | 2019-12-06 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Heap heavy current inductance |
| CN211699886U (en) * | 2020-01-08 | 2020-10-16 | 深圳市科达嘉电子有限公司 | Non-coupling inductance bar |
| CN113823491A (en) * | 2021-09-28 | 2021-12-21 | 深圳顺络电子股份有限公司 | Double-coil inductor and electronic equipment |
| CN115547669A (en) * | 2022-11-07 | 2022-12-30 | 横店集团东磁股份有限公司 | Coupling inductor manufacturing method and coupling inductor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110797172B (en) | Component carrier comprising an embedded inductor with inlay | |
| US10867888B2 (en) | Component carrier comprising at least one heat pipe and method for producing said component carrier | |
| Zhang et al. | High-density integration of high-frequency high-current point-of-load (POL) modules with planar inductors | |
| US8564092B2 (en) | Power convertor device and construction methods | |
| CN104756611A (en) | Method for producing a coil integrated in a substrate or applied to a substrate, and electronic device | |
| US20140266546A1 (en) | High Density Packaging for Efficient Power Processing with a Magnetic Part | |
| KR100828037B1 (en) | Magnetic element and method for the same | |
| CN213277740U (en) | Inductance assembly | |
| US5992005A (en) | Method of manufacturing a power magnetic device | |
| KR20150138199A (en) | Soft magnetic thermosetting adhesive film, magnetic film laminate circuit board, and position detection device | |
| CN107295746B (en) | Device carrier and method for manufacturing the same | |
| EP3355666B1 (en) | Semifinished product and method of manufacturing a component carrier | |
| CN107154301A (en) | Magnet assembly and its applicable power model | |
| CN208444728U (en) | Flat-plate transformer | |
| CN117275897A (en) | Inductance gap control method and inductance device | |
| CN109862721A (en) | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier | |
| CN110211782A (en) | Choke and receiving portion for choke | |
| CN103781273A (en) | Embedded metal-base PCB and processing method thereof | |
| TW201714394A (en) | Power converter and method for manufacturing the same | |
| CN116153638A (en) | Manufacturing method of planar transformer and planar transformer | |
| US10796845B2 (en) | Magnetic shunt assembly for magnetic shielding of a power device | |
| CN105513781A (en) | Coil type unit for wireless power transmission and manufacturing method of coil type unit for wireless power transmission | |
| CN114916129A (en) | Component carrier connected by staggered interconnection elements | |
| JP2012044163A (en) | Method for embedding electrical component | |
| US6138344A (en) | Methods of manufacturing a magnetic device and tool for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |