CN117261102A - Die structure for encapsulating point gate of press - Google Patents
Die structure for encapsulating point gate of press Download PDFInfo
- Publication number
- CN117261102A CN117261102A CN202311016385.6A CN202311016385A CN117261102A CN 117261102 A CN117261102 A CN 117261102A CN 202311016385 A CN202311016385 A CN 202311016385A CN 117261102 A CN117261102 A CN 117261102A
- Authority
- CN
- China
- Prior art keywords
- upper die
- lower die
- die
- assembly
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 22
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 238000012356 Product development Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 15
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
Abstract
The invention discloses a die structure for packaging a point gate of a press, which comprises an upper die assembly, a lower die assembly and a middle plate assembly; the upper die assembly comprises an upper die frame, an upper die top plate, an upper die supporting column, an upper die needle plate and an upper die cavity strip, an upper die frame thimble, an upper die product thimble and an upper die reset rod are arranged on the upper die needle plate, the middle plate assembly comprises a middle plate, and middle plate lock catches are arranged on two sides of the middle plate to lock the upper die assembly with the middle plate assembly and lock the lower die assembly with the middle plate assembly; the lower die assembly comprises a lower die cavity strip base, a lower die top plate and a lower die needle plate, wherein a lower die frame thimble, a lower die runner thimble and a lower die reset rod are arranged on the lower die needle plate, and a lower die support column, a lower die cavity strip and a charging barrel mounting seat are arranged on the lower die cavity strip base. The invention greatly reduces the product development and production cost, greatly improves the product arrangement density, improves the production efficiency, saves the lead frame material and has no runner glue residue.
Description
Technical Field
The invention belongs to the technical field of packaging molds, and particularly relates to a mold structure capable of performing pin-point gate packaging on the lower surface of a semiconductor by using a common press.
Background
At present, in the preparation process of a semiconductor, when the surface of the semiconductor is packaged at a dispensing opening, a scheme is adopted, namely, a special press device for packaging the semiconductor is used, a customized die carrier and a die are matched, and the glue is injected from the upper surface of a product.
The disadvantages of this glue injection scheme are as follows:
1. the press equipment is special equipment, needs to be specially customized, cannot meet the requirement of injecting glue from the side surface of most semiconductor packaging products, and is high in price;
2. compared with the common die carrier and die in the current market, the special die carrier and die are high in price;
3. the special press and the die carrier have less market holding quantity, high maintenance cost and complex structure.
Disclosure of Invention
The invention aims to provide a die structure for point gate encapsulation of a press, which solves the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: a die structure for a press point gate package comprises an upper die assembly, a lower die assembly, and an intermediate plate assembly positioned between the upper die assembly and the lower die assembly;
the upper die assembly comprises an upper die frame, an upper die top plate, an upper die supporting column, an upper die needle plate and an upper die cavity strip, wherein an upper die frame thimble, an upper die product thimble and an upper die reset rod are arranged on the upper die needle plate, the upper die needle plate is fixedly connected with the upper die top plate, a limit ring is sleeved on the upper die reset rod, and the upper die supporting column and the upper die cavity strip are arranged on an upper die cavity strip base; the upper die frame ejector pin, the upper die product ejector pin and the upper die reset rod penetrate through the upper die cavity strip and the upper die cavity strip base, and the upper die reset rod is propped against the middle plate and is used for demolding and resetting; the upper die supporting columns penetrate through the upper die needle plate and the upper die top plate and are supported on the upper die frame, and grooves on two sides of the upper die frame clamp the upper die cavity strip base;
the middle plate assembly comprises a middle plate, middle plate lock catches are arranged on two sides of the middle plate, and the upper die assembly and the middle plate assembly and the lower die assembly and the middle plate assembly are locked through the middle plate lock catches;
the lower die assembly comprises a lower die cavity strip base, a lower die top plate and a lower die needle plate, wherein a lower die frame thimble, a lower die runner thimble and a lower die reset rod are arranged on the lower die needle plate, a lower die support column, a lower die cavity strip and a charging barrel mounting seat are arranged on the lower die cavity strip base, a charging barrel is arranged on the charging barrel mounting seat, the charging barrel penetrates through the lower die cavity strip base, the lower die needle plate and the lower die top plate and is in sliding fit with the injection head assembly, the lower die frame thimble, the lower die runner thimble and the lower die reset rod penetrate through the lower die cavity strip and the lower die cavity strip base, and the lower die reset rod penetrates through the middle plate to be propped against the upper die cavity strip for demolding and auxiliary reset; the lower mould support column is arranged on the lower mould cavity strip base, penetrates through the lower mould needle plate and the lower mould top plate, is supported on the lower mould frame, and simultaneously the grooves on two sides of the lower mould frame clamp the lower mould cavity strip base.
Preferably, both sides of the upper die frame and the lower die frame are respectively provided with a rotatable upper die claw and a rotatable lower die claw.
Preferably, the upper die assembly, the middle assembly and the lower die assembly are buckled and locked by an upper die claw, a middle plate lock catch and a lower die claw.
The invention has the technical effects and advantages that:
1. the die structure can be matched with a common MGP press and die carrier in the market, a special press and die carrier are not required to be purchased newly, the existing press and die carrier are not required to be modified, and the cost of new product development and mass production is greatly reduced.
2. By adopting the device, the automatic production can be realized by only adding a pneumatic or electric locking mechanism to the die carrier of the automatic packaging equipment.
3. The problem that the existing scheme can only carry out the injecting glue from the upper surface of the product, and air holes, gold wires are punched and bent and the like can be brought when part of special structural products are injected from the upper surface of the product is solved, the structure is used for carrying out the advancing glue from the lower surface of the product, and the structure is used for supplementing the existing injecting glue mode.
4. The position of a runner is not required to be reserved on the lead frame, so that the density of product arrangement is greatly improved, the production efficiency is improved, and the lead frame material is saved;
5. the pouring gate is automatically disconnected when the die is opened, the photoresist removing process is not needed to be added in the subsequent process, and the problem that the photoresist on the runner remains on the frame because the runner is not contacted with the frame is avoided.
Drawings
FIG. 1 is an initial state diagram of the present invention;
FIG. 2 is an open mold state diagram (upper finger) of the present invention;
FIG. 3 is a state diagram of a placement frame of the present invention;
FIG. 4 is a diagram showing the mold closing state of the present invention;
FIG. 5 is a state diagram of a switching knuckle of the present invention;
FIG. 6 is an open mold state diagram (lower finger) of the present invention;
FIG. 7 is a state diagram of the present invention for placing resin;
FIG. 8 is a diagram showing the mold closing state after resin placement according to the present invention;
FIG. 9 is a state diagram of the invention for starting the injection;
FIG. 10 is a state diagram of the invention for completing the injection;
FIG. 11 is a state diagram of the mold opening after the end of the injection of the present invention;
FIG. 12 is a flow channel ejection state diagram of the present invention;
FIG. 13 is a view showing the removal of the flow channel according to the present invention;
FIG. 14 is a view showing a state of cleaning the die surface according to the present invention;
FIGS. 15-16 are diagrams of the mold closing process of the present invention;
FIG. 17 is a schematic view of a switching knuckle of the present invention;
FIG. 18 is an open mold state diagram (upper finger) of the present invention;
FIG. 19 is a schematic view of a frame ejection of the present invention;
FIG. 20 is a schematic view of the frame of the present invention taken out;
FIG. 21 is a view showing a state of cleaning a die surface according to the present invention;
fig. 22 is a state diagram of the present invention to be used.
In the figure: the mold comprises an upper mold frame 1, an upper mold top plate 2, an upper mold frame thimble 3, an upper mold product thimble 4, an upper mold support column 5, an upper mold needle plate 6, an upper mold cavity bar 7, an intermediate plate 8, an upper mold cavity bar base 9, a limiting ring 10, an upper mold reset lever 11, an intermediate plate lock catch 12, an upper mold hook claw 13, a lower mold hook claw 14, a lower mold cavity bar base 15, a lower mold frame 16, a lower mold reset lever 17, a lower mold top plate 18, a lower mold support column 19, a lower mold needle plate 20, a feed cylinder 21, an injection head assembly 22, a feed cylinder mounting seat 23, a lower mold cavity bar 24, a lower mold frame thimble 25 and a lower mold runner thimble 26.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
One embodiment of a die structure for a press point gate package of the present invention is shown in fig. 1-22: comprises an upper die assembly, a lower die assembly and a middle plate assembly positioned between the upper die assembly and the lower die assembly;
the upper die assembly comprises an upper die frame 1, an upper die top plate 2, an upper die supporting column 5, an upper die needle plate 6 and an upper die cavity strip 7, wherein an upper die frame thimble 3, an upper die product thimble 4 and an upper die reset rod 11 are arranged on the upper die needle plate 6, the upper die needle plate 6 is fixedly connected with the upper die top plate 2, a limiting ring 10 is sleeved on the upper die reset rod 11, and the upper die supporting column 5 and the upper die cavity strip 7 are arranged on an upper die cavity strip base 9; the upper die frame thimble 3, the upper die product thimble 4 and the upper die reset rod 11 penetrate through the upper die cavity strip 7 and the upper die cavity strip base 9, and the upper die reset rod 11 is propped against the middle plate 8 for demoulding and reset; the upper die supporting columns 5 penetrate through the upper die needle plate 6 and the upper die top plate 2 and are supported on the upper die frame 1, and grooves on two sides of the upper die frame 1 clamp the upper die cavity strip base 9;
the middle plate assembly comprises a middle plate 8, middle plate lock catches 12 are arranged on two sides of the middle plate 8, and rotatable upper die claw 13 and lower die claw 14 are respectively arranged on two sides of the upper die frame 1 and the lower die frame 16; the upper die assembly, the middle assembly and the lower die assembly are buckled and locked by an upper die claw 13, a middle plate lock catch 12 and a lower die claw 14;
the lower die assembly comprises a lower die cavity bar base 15, a lower die top plate 18 and a lower die needle plate 20, a lower die frame thimble 25, a lower die runner thimble 26 and a lower die reset rod 17 are arranged on the lower die needle plate 20, a lower die support column 19, a lower die cavity bar 24 and a feed cylinder mounting seat 23 are arranged on the lower die cavity bar base 15, a feed cylinder 21 is arranged on the feed cylinder mounting seat 23, the feed cylinder penetrates through the lower die cavity bar base 15, the lower die needle plate 20 and the lower die top plate 18 and is in sliding fit with an injection head assembly 22, the lower die frame thimble 25, the lower die runner thimble 26 and the lower die reset rod 17 penetrate through the lower die cavity bar 24 and the lower die cavity bar base 15, and the lower die reset rod 17 penetrates through the middle plate 8 to be propped against the upper die cavity bar 7 for demoulding and auxiliary reset; the lower mold support columns 19 are mounted on the lower mold cavity bar base 15, pass through the lower mold needle plate 20 and the lower mold top plate 18, and are supported on the lower mold frame 16, and meanwhile grooves on two sides of the lower mold frame 16 clamp the lower mold cavity bar base 15.
The use process of the structure is as follows:
1. initial state (as shown in fig. 1): the lower die claw 14 is buckled with the middle plate lock catch 12 and locked with the middle plate lock catch, and the upper die claw 13 is in a disengaging state, so that the middle plate 8 is fixed with the lower die of the die;
2. mold opening (as shown in fig. 2): the lower die frame 16 descends to drive the lower die of the die and the middle plate 8 to synchronously descend; the upper die carrier 1 is internally provided with a spring which presses down the upper die top plate 2, so that the upper die needle plate 6 and the upper die top plate 2 drive the upper die frame ejector pins 3, the upper die product ejector pins 4, the upper die reset rod 11 and the like to eject synchronously until the upper die needle plate 6 is stopped after being limited by the limiting ring 10;
3. placement frame (as shown in FIG. 3): placing the frame on the surface of the intermediate plate 8 by means of a manual or automatic mechanism;
4. mold closing (as shown in fig. 4): the lower die frame 16 ascends to drive the lower die of the die and the middle plate 8 to synchronously ascend; the upper die reset rod 11 is propped against the middle plate 8 to overcome the spring force in the upper die frame 1, so that the upper die needle plate 6 and the upper die top plate 2 drive the upper die frame thimble 3, the upper die product thimble 4 and the like to retract until die assembly is completed;
5. switching claw (as shown in fig. 5): the lower die claw 14 is switched to a disengaged state, and the upper die claw 13 is buckled with the middle plate lock catch 12 and is locked with the middle plate lock catch, so that the middle plate 8 is fixed with the upper die of the die;
6. mold opening (as shown in fig. 6): the lower die frame 16 descends to drive the lower die of the die to synchronously descend;
7. resin placement (as shown in fig. 7): placing the resin in the cartridge 21 by a manual or automatic mechanism;
8. mold closing (as shown in fig. 8): the lower die frame 16 ascends to drive the lower die of the die to synchronously ascend until the die assembly is completed and then stops;
9. beginning the glue injection (as shown in fig. 9): the resin is heated and melted, and the injection head assembly 22 moves upwards under the pushing of the injection mechanism to perform glue injection;
10. complete glue injection (as shown in fig. 10): the injector head assembly 22 is pushed by the injection mechanism to go upwards until all cavities are fully filled; the resin begins to cure, and the injector head assembly 22 still applies pressure to the resin, maintaining the pressure until the resin is completely cured;
11. mold opening (as shown in fig. 11): the lower die frame 16 descends to drive the lower die of the die to synchronously descend; the lower die runner thimble 26 is provided with a barb-shaped structure, and resin is buckled with the barb-shaped structure after being filled, so that the runner is tightly attached to the lower die runner thimble 26 and cannot be separated; after the mold is opened, the runner is separated from the middle plate 8, and the gate is broken;
12. flow channel ejection (as shown in fig. 12): the lower die frame 16 continues to descend, and the lower die cavity strip 24 is driven to continue to descend; the fixed ejector rod is arranged on the equipment to prop against the lower die top plate 18, so that the equipment such as the lower die frame ejector pin 25, the lower die runner ejector pin 26, the lower die reset rod 17 and the like are stopped, and at the moment, the lower die cavity strip 24 and the lower die runner ejector pin 26 relatively move to eject and separate the runner relative to the lower die cavity strip 24;
13. take-out flow channel (as shown in fig. 13): taking the runner out of the lower die through a manual or automatic mechanism;
14. cleaning the die face (as shown in fig. 14): cleaning the upper and lower surfaces of the die by using a special tool;
15. start closing (as shown in fig. 15): the lower die frame 16 ascends, and the die starts to perform the reverse action of runner ejection until the reset of the lower die frame ejector pin 25, the lower die runner ejector pin 26, the lower die reset rod 17 and the like is completed;
16. continuing to mold (as shown in fig. 16): the lower die frame 16 continues to ascend, a fixed ejector rod is arranged on the equipment and is separated from the lower die top plate 18, and the lower die top plate 18 and lower die parts of other dies integrally ascend along with the lower die frame 16 until die assembly is completed;
17. switching claw (as shown in fig. 17): the upper die claw 13 is switched to a disengaged state, and the lower die claw 14 is buckled with the middle plate lock catch 12 and is locked with the middle plate lock catch, so that the middle plate 8 is fixed with the lower die of the die;
18. mold opening (as shown in fig. 18): the lower die frame 16 descends to drive the lower die of the die and the middle plate 8 to synchronously descend; the upper die carrier 1 is internally provided with a spring which presses down the upper die top plate 2, so that the upper die needle plate 6 and the upper die top plate 2 drive the upper die frame ejector pins 3, the upper die product ejector pins 4, the upper die reset rod 11 and the like to eject synchronously, and the upper die frame ejector pins 3 and the upper die product ejector pins 4 eject the packaged frame to separate the frame from the upper die of the die until the upper die needle plate 6 is stopped after being limited by the limiting ring 10; the lower die frame 16 continues to descend so that the upper die product thimble 4 is separated from the product;
19. frame ejection (as shown in fig. 19): the lower die frame 16 continues to descend to drive the middle plate 8 to continue to descend; the fixed ejector rod is arranged on the equipment to prop against the lower die top plate 18, so that the lower die frame ejector pins 25, the lower die runner ejector pins 26, the lower die reset rod 17 and other equipment are stopped, and at the moment, the middle plate 8 and the lower die frame ejector pins 25 relatively move to eject and separate the packaged frame relative to the middle plate 8;
20. take out frame (as shown in fig. 20): taking the packaged frame out of the lower die through a manual or automatic mechanism;
21. cleaning the die face (as shown in fig. 21): cleaning the upper and lower surfaces of the die by using a special tool;
22. enter the next production cycle (as shown in fig. 22): the lower die frame 16 goes upward, the die starts to perform the reverse action of frame ejection until the reset of the lower die frame ejector pins 25, the lower die runner ejector pins 26, the lower die reset rod 17 and the like is completed, the lower die frame 16 stops going upward, waits for the frame to be placed, and enters the next production cycle.
The applicant has further stated that the present invention is described by the above examples as to the implementation method and apparatus structure of the present invention, but the present invention is not limited to the above embodiments, i.e. it does not mean that the present invention must be implemented by the above methods and structures. It should be apparent to those skilled in the art that any modifications of the present invention, equivalent substitutions for the implementation method selected for the present invention, addition of steps, selection of specific modes, etc., fall within the scope of the present invention and the scope of the disclosure.
The present invention is not limited to the above embodiments, and all modes of achieving the object of the present invention by adopting the structure and method similar to those of the present invention are within the scope of the present invention.
Claims (3)
1. A mould structure for press point runner encapsulation, includes mould subassembly and lower mould subassembly, its characterized in that: the middle plate assembly is positioned between the upper die assembly and the lower die assembly;
the upper die assembly comprises an upper die frame (1), an upper die top plate (2), an upper die supporting column (5), an upper die needle plate (6) and an upper die cavity strip (7), wherein an upper die frame thimble (3), an upper die product thimble (4) and an upper die reset rod (11) are arranged on the upper die needle plate (6), the upper die needle plate (6) is fixedly connected with the upper die top plate (2), a limiting ring (10) is sleeved on the upper die reset rod (11), and the upper die supporting column (5) and the upper die cavity strip (7) are arranged on an upper die cavity strip base (9); the upper die frame thimble (3), the upper die product thimble (4) and the upper die reset rod (11) penetrate through the upper die cavity strip (7) and the upper die cavity strip base (9), and the upper die reset rod (11) is propped against the middle plate (8) and is used for demolding and resetting; the upper die supporting columns (5) penetrate through the upper die needle plate (6) and the upper die top plate (2) and are supported on the upper die frame (1), and grooves on two sides of the upper die frame (1) clamp the upper die cavity strip base (9);
the middle plate assembly comprises a middle plate (8), middle plate lock catches (12) are arranged on two sides of the middle plate (8), and the upper die assembly and the middle plate assembly and the lower die assembly and the middle plate assembly are locked through the middle plate lock catches (12);
the lower die assembly comprises a lower die cavity bar base (15), a lower die top plate (18) and a lower die needle plate (20), a lower die frame thimble (25), a lower die runner thimble (26) and a lower die reset rod (17) are arranged on the lower die needle plate (20), a lower die supporting column (19), a lower die cavity bar (24) and a charging barrel mounting seat (23) are arranged on the lower die cavity bar base (15), a charging barrel (21) is arranged on the charging barrel mounting seat (23), and penetrates through the lower die cavity bar base (15), the lower die needle plate (20) and the lower die top plate (18) and is in sliding fit with the injection head assembly (22), the lower die frame thimble (25), the lower die runner thimble (26) and the lower die reset rod (17) penetrate through the lower die cavity bar (24) and the lower die cavity bar base (15), and the lower die reset rod (17) penetrates through the middle plate (8) to be propped against the upper die cavity bar (7) for demoulding and auxiliary reset; the lower die support column (19) is arranged on the lower die cavity strip base (15), penetrates through the lower die needle plate (20) and the lower die top plate (18), is supported on the lower die frame (16), and meanwhile grooves on two sides of the lower die frame (16) clamp the lower die cavity strip base (15).
2. The mold structure for a press point gate package of claim 1, wherein: and two sides of the upper die frame (1) and the lower die frame (16) are respectively provided with a rotatable upper die claw (13) and a rotatable lower die claw (14).
3. The mold structure for a press point gate package of claim 2, wherein: the upper die assembly, the middle assembly and the lower die assembly are buckled and locked by an upper die claw (13), a middle plate lock catch (12) and a lower die claw (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311016385.6A CN117261102A (en) | 2023-08-14 | 2023-08-14 | Die structure for encapsulating point gate of press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311016385.6A CN117261102A (en) | 2023-08-14 | 2023-08-14 | Die structure for encapsulating point gate of press |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117261102A true CN117261102A (en) | 2023-12-22 |
Family
ID=89207180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311016385.6A Pending CN117261102A (en) | 2023-08-14 | 2023-08-14 | Die structure for encapsulating point gate of press |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117261102A (en) |
-
2023
- 2023-08-14 CN CN202311016385.6A patent/CN117261102A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4915607A (en) | Lead frame assembly for an integrated circuit molding system | |
| JPS5850582B2 (en) | Semiconductor encapsulation molding method and mold equipment | |
| US4812114A (en) | New IC molding process | |
| CN104960155B (en) | A kind of encapsulated template floating side ejection device mechanism and its encapsulation die | |
| CN117261102A (en) | Die structure for encapsulating point gate of press | |
| CN100369734C (en) | Method for operating injection molding apparatus | |
| CN208247345U (en) | A kind of hardware terminal encapsulation die with ejecting mechanism | |
| JP3947607B2 (en) | Transfer mold equipment | |
| CN109093955B (en) | Mold with three-time ejection mechanism and ejection method thereof | |
| JP3408599B2 (en) | Transfer mold equipment | |
| US5169586A (en) | Method of manufacturing resin-sealed type semiconductor device | |
| CN108527776B (en) | Injection molding die | |
| JPH0257006B2 (en) | ||
| CN107877776B (en) | Injection mold and injection molding method using same | |
| JP3633924B2 (en) | Resin molding equipment | |
| JP3897961B2 (en) | Resin molding equipment | |
| JPH01118421A (en) | Injection molding die | |
| JP3274835B2 (en) | Plunger replacement method and replacement structure for sealing mold | |
| CN220362876U (en) | Rubber mold forming device | |
| CN218576848U (en) | Mould with ejection mechanism | |
| JP2772489B2 (en) | Resin encapsulation molding device for electronic parts and jig for pushing ejector pin | |
| CN215039811U (en) | Injection mold for projector shell convenient to get material | |
| KR100964896B1 (en) | Injection molding machine enabling disk gate cutting | |
| CN109774074B (en) | Teacup cover injection mold with taper pin side core-pulling mechanism | |
| JP2538730Y2 (en) | Resin molding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |