CN117253851A - High-efficiency semiconductor cutting and sorting method - Google Patents
High-efficiency semiconductor cutting and sorting method Download PDFInfo
- Publication number
- CN117253851A CN117253851A CN202311062942.8A CN202311062942A CN117253851A CN 117253851 A CN117253851 A CN 117253851A CN 202311062942 A CN202311062942 A CN 202311062942A CN 117253851 A CN117253851 A CN 117253851A
- Authority
- CN
- China
- Prior art keywords
- product
- linear driving
- driving module
- cutting
- sorting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000002950 deficient Effects 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 8
- 230000009977 dual effect Effects 0.000 claims description 7
- 238000007605 air drying Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- 230000000007 visual effect Effects 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
Abstract
The application discloses a high-efficiency semiconductor cutting and sorting method, which comprises a dicing saw and a sorting machine, wherein the cutting and sorting method comprises the following steps: putting a product to be cut into a dicing saw, performing regular calibration by the dicing saw, then dicing, cleaning, airing, putting the product on a working disc to be detected of a sorting machine, and collecting a product image and a corresponding theoretical characteristic position through an AOI detection system for automatic identification so as to judge whether a detection object meets the theoretical characteristic position; and then sorting and dishing by a manipulator and finally putting the materials into corresponding material boxes. The utility model discloses a through the double cutting main shaft, double cutting platform and the single vision detecting system and duplex operation dish that set up, double vertical straight line actuating mechanism, double AOI detecting system and double unloading mechanism, not only can effectively promote the circulation high-efficient cutting operation of dicing saw, can high-efficient promotion sorter's detection, select separately and the ability of sabot moreover to realize full automatic operation mode, greatly reduced human cost.
Description
Technical Field
The application relates to the field of semiconductor cutting and sorting, in particular to a high-efficiency semiconductor cutting and sorting method.
Background
The dicing saw is also called a wafer dicing saw, and is mainly used for dicing semiconductor wafers, integrated circuits, QFN, light emitting diodes, LED chips, solar cells, electronic substrates and the like, and is certainly also suitable for dicing materials including silicon, quartz, aluminum oxide, ferric oxide, gallium arsenide, lithium niobate, sapphire, glass and the like; and the products after being divided need to be sorted and classified. The existing sorting technology mainly utilizes amplifying equipment such as an electron microscope to detect welding spots, edge tightening, tightening angles, line marks and the like on particles on products, picks up defective products and good products, and then sorts and stores the defective products according to requirements. Taking a 200 x 100mm substrate with a single chip size of 1 x 3mm as an example, the number of chips on one substrate is as high as 5.2K on average. If the detection and separation are performed manually, the method is time-consuming and labor-consuming, has low efficiency, is easy to cause the reduction of the working efficiency of the cutting and separation operation, and is difficult to apply to the high-precision cutting and separation selection.
Disclosure of Invention
The purpose of the application is to provide a high-efficiency semiconductor cutting and sorting method to solve the problems of time and labor consumption and lower working efficiency of the existing manual detection and sorting operation.
In order to achieve the above purpose, the present application provides the following technical solutions:
a high efficiency semiconductor dicing sorting method comprising a dicing saw and a sorter, the method comprising the steps of:
s1: placing a product to be cut into a cutting platform of a dicing saw, detecting the position of a cutting channel on the product by a visual detection system in the dicing saw, and adjusting the position of the cutting channel of the product by the cutting platform to ensure that the product on the cutting platform is calibrated;
s2: a main shaft blade on the dicing saw is used for dicing the product cutting channel on the cutting platform, and after the product is diced, the product is taken out and cleaned;
s3, air-drying the cleaned product, putting the product on a working disc to be detected by a sorting machine after air-drying, and positioning the product by a special jig on the working disc;
s4: moving the working disc with the product to the lower part of the AOI detection system at one side by utilizing a longitudinal linear driving mechanism;
s5: the AOI detection system collects product images on the working disc through the image collection module, and automatically identifies the product images according to the collected images and the corresponding theoretical characteristic positions so as to judge whether the detected object meets the theoretical characteristic positions or not;
s6: after the detection is finished, the product is sent to one side by a longitudinal linear driving mechanism, and the product is grabbed into a corresponding blanking mechanism Tray by a first manipulator;
s7: the blanking mechanism moves the product to a blanking area on one side, and the product and a Tray are put into a corresponding material box on one side by a second manipulator;
s8: after the magazine is full, it is removed.
The technical scheme is realized and is used for realizing the processes of automatic cutting, sorting and dishing of products.
As a preferred solution of the present application, the dicing saw employs a dual cutting spindle, a dual cutting platform and a single vision inspection system.
The technical scheme is realized and is used for improving the circulating efficient cutting operation of the dicing saw.
As a preferred solution of the present application, the sorter employs a double working disc, a double longitudinal linear drive mechanism and a double AOI detection system.
The technical scheme is realized and is used for improving the circulating efficient sorting operation of the sorting machine.
As a preferable scheme of the application, the longitudinal linear driving mechanism adopts a linear driving module, and a sliding table on the linear driving module is connected with the working disc.
The linear driving module comprises a base, a linear guide rail, a servo motor, a screw rod, a coupler and the like, and drives the connected screw rod through the servo motor when in use, and the screw rod drives the working disc to linearly move on the linear guide rail through the sliding table by virtue of a screw rod nut.
As a preferred solution of the present application, the AOI detection system includes a CCD camera and a detection system connected to the CCD camera.
According to the technical scheme, the CCD camera shoots the product image, and the product image is automatically identified according to the acquired image and the corresponding characteristic position of the product in the detection system, so that whether the detection object meets the characteristic position of the product is judged.
As a preferred scheme of the application, the blanking mechanism comprises a linear driving module which is longitudinally arranged and a working disc which is arranged on the linear driving module and used for fixing a Tray disc; the linear driving module is provided with two linear driving modules, one linear driving module is used for discharging bad products, and the other linear driving module is used for discharging the bad products.
The technical scheme is realized and the method is respectively used for loading and unloading bad products and good products. Wherein, be provided with the vacuum suction hole that is used for fixed Tray on the working plate, and vacuum suction hole external vacuum air supply.
As a preferred scheme of this application, first manipulator includes spanned vertical sharp actuating mechanism with the first linear drive module of unloading mechanism and vertical locating second linear drive module on the first linear drive module, the bottom of second linear drive module is provided with the first vacuum chuck subassembly that snatchs the product.
The technical scheme is realized so as to realize the movement of the first vacuum chuck component in the transverse and vertical directions through the first linear driving module and the second linear driving module.
As a preferred scheme of this application, the second manipulator is including crossing the third linear drive module of unloading mechanism and vertically locating the fourth linear drive module of third linear drive module, vertically be provided with fifth linear drive module on the fourth linear drive module, the bottom of fifth linear drive module is provided with the second vacuum chuck subassembly that snatchs the Tray dish.
The technical scheme is realized so as to realize the movement of the second vacuum chuck component in the X-axis, Y-axis and Z-axis directions through the third linear driving module, the fourth linear driving module and the fifth linear driving module.
As a preferred scheme of the present application, the magazines include defective magazines, good magazines and Tray magazines.
According to the technical scheme, the defective product box is used for placing defective products, the good product box is used for placing the defective products, and the Tray box is used for stacking empty Tray.
The beneficial effects of this application are:
the utility model discloses a through the double cutting main shaft, double cutting platform and the single vision detecting system and duplex operation dish that set up, double vertical straight line actuating mechanism, double AOI detecting system and double unloading mechanism, not only can effectively promote the circulation high-efficient cutting operation of dicing saw, can high-efficient promotion sorter's detection, select separately and the ability of sabot moreover to realize full automatic operation mode, greatly reduced human cost.
Drawings
Fig. 1 is a schematic diagram of a method according to the present application.
Fig. 2 is a schematic structural diagram according to the present application.
In the figure: the automatic feeding device comprises a dicing saw 1, a cutting platform 101, a visual detection system 102, a sorting machine 2, a longitudinal linear driving mechanism 201, an AOI detection system 202, a first manipulator 203, a blanking mechanism 204, a second manipulator 205, a magazine 206 and an automatic feeding mechanism 3.
Description of the embodiments
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Examples
A high efficiency semiconductor dicing and sorting method, referring to fig. 1 and 2, comprising a dicing saw 1 for product dicing and a sorting machine 2 for cut products, the dicing and sorting method comprising the steps of:
step one: placing a product to be cut into a cutting platform 101 of the dicing saw 1, detecting the cutting path position on the product by a visual detection system 102 in the dicing saw 1, and adjusting the cutting path position of the product by the cutting platform 101 to enable the product on the cutting platform 101 to be subjected to normal calibration;
step two: the main shaft blade on the dicing saw 1 is used for dicing the product cutting path on the cutting platform 101, and after the product dicing is completed, the product is taken out and cleaned;
step three, air-drying the cleaned product, putting the product on a working disc to be detected of the sorting machine 2 after air-drying, and positioning the product by a special jig on the working disc;
step four: moving the working disc with the product to below one side AOI detection system 202 with a longitudinal linear drive mechanism 201 provided;
step five: the AOI detection system 202 collects the product image on the working disc through the image collection module, and automatically identifies according to the collected image and the corresponding theoretical characteristic position to judge whether the detected object meets the theoretical characteristic position;
step six: after the detection is finished, the product is sent to one side by the longitudinal linear driving mechanism 201, and the product is grabbed into a corresponding Tray of the blanking mechanism 204 by the first manipulator 203;
step seven: the blanking mechanism 204 moves the product to a blanking area on one side, and the second manipulator 205 puts the product into a corresponding material box 206 on one side together with a Tray;
step eight: the magazine 206 is removed after it is full.
The technical scheme is realized, and the dicing saw 1 and the sorting machine 2 adopt an automatic feeding mechanism 3 for realizing the automatic feeding process of products.
In this embodiment, in order to facilitate fixing the special jig on the working disc of the sorting machine 2, the high vacuum adsorption substrate is mounted on the working disc, and no film sticking is required, so that the technological processes of film sticking and de-gluing and the related cost are reduced.
In order to promote the cyclic and efficient cutting operation of the dicing saw 1. In the present embodiment, the dicing saw 1 employs a double cutting spindle, a double cutting stage 101, and a single vision inspection system 102.
In order to promote the cyclic efficient sorting operation of the sorting machine 2. In this embodiment, the sorter 2 employs a double working plate, a double longitudinal linear drive 201, and a double AOI detection system 202.
To facilitate linear movement of the working plate. In this embodiment, the longitudinal linear driving mechanism 201 adopts a linear driving module, and a sliding table on the linear driving module is connected with the working disc. The linear driving module consists of a base, a linear guide rail, a servo motor, a screw rod, a coupler and the like, the screw rod connected with the linear driving module is driven by the servo motor when in use, and the screw rod drives the working disc to linearly move on the linear guide rail through the sliding table by virtue of a screw rod nut.
To facilitate acquisition of images of the product. In this embodiment, AOI detection system 202 includes a CCD camera and a detection system coupled to the CCD camera. When the detection system is used, a CCD camera shoots a product image, and the product image is automatically identified according to the acquired image and the corresponding characteristic position of the product in the detection system, so as to judge whether the detection object meets the characteristic position of the product.
In order to facilitate the reject of the bad products and the sorting and the blanking of the good products. In this embodiment, the discharging mechanism 204 includes a linear driving module disposed longitudinally and a working disc disposed on the linear driving module for fixing the Tray disc; and two linear driving modules are arranged, wherein one linear driving module is used for discharging bad products, and the other linear driving module is used for discharging the bad products.
To facilitate the fixing of the Tray disk to the working disk. In this embodiment, a high vacuum suction substrate is provided on the work tray.
To facilitate gripping of the product and movement in both the lateral and vertical directions. In this embodiment, the first manipulator 203 includes a first linear driving module crossing the longitudinal linear driving mechanism and the discharging mechanism 204, and a second linear driving module vertically disposed on the first linear driving module, and a first vacuum chuck assembly for gripping a product is installed at the bottom of the second linear driving module; the first vacuum chuck assembly comprises a supporting plate connected to the second linear driving module and a chuck plate arranged at the bottom of the supporting plate and provided with a vacuum chuck, and the chuck plate is externally connected with a vacuum air source through an air pipe.
To facilitate grasping the Tray and movement in the X, Y and Z directions. In this embodiment, the second manipulator includes a third linear driving module crossing the blanking mechanism 204 and a fourth linear driving module longitudinally arranged on the third linear driving module, a fifth linear driving module is vertically installed on the fourth linear driving module, and a second vacuum chuck assembly for grabbing a Tray is installed at the bottom of the fifth linear driving module; the second vacuum chuck assembly comprises a supporting plate connected to the fifth linear driving module and a chuck plate arranged at the bottom of the supporting plate and provided with a vacuum chuck, and the chuck plate is externally connected with a vacuum air source through an air pipe. In actual use, the second robot may not only place the Tray with product into the magazine 206, but also place an empty Tray in the magazine 206 onto the working Tray.
To facilitate the sorting of bad products and good products and the handling of empty Tray trays. In this embodiment, the magazines 206 include defective magazines, good magazines, and Tray magazines; and the defective product box is used for placing defective products, the defective product box is used for placing the defective products, and the Tray box is used for stacking empty Tray.
Specifically, in actual use, the automatic feeding mechanism 3 puts the product to be diced on the cutting platform 101 of the dicing saw 1, the visual detection system 102 in the dicing saw 1 detects the position of the cutting channel on the product, the cutting platform 101 adjusts the position of the cutting channel of the product, the product on the cutting platform 101 is calibrated in a normal way, then the main shaft blade on the dicing saw 1 is used for dicing the cutting channel of the product on the cutting platform 101, after the product is diced, the product is taken out by the automatic feeding mechanism 3, cleaned and air-dried, and then the product is put on the working disc to be detected of the sorting machine 2 after air-dried, and is positioned by the special jig on the working disc, then, the working disc with the product is moved to the lower part of the AOI detection system 202 at one side by using the arranged longitudinal linear driving mechanism 201, the AOI detection system 202 collects the image of the product on the working disc through the image collection module, and automatically identifies according to the collected image and the corresponding theoretical characteristic position to judge whether the detected object meets the theoretical characteristic position, after the product is detected, the product is sent to one side by using the longitudinal linear driving mechanism 201, the product is grabbed into the Tray of the corresponding blanking mechanism 204 by using the first manipulator 203, the product is sent to the blanking area at one side by using the blanking mechanism 204, the product and the Tray of the product are put into the corresponding magazine 206 at one side by using the second manipulator 205, and after the magazine 206 is filled, the product is manually moved away. The defective product is placed in the NG blanking mechanism, the defective product is placed in the defective product magazine by the second manipulator, the defective product is placed in the OK blanking mechanism, the defective product is placed in the defective product magazine by the second manipulator 205, and after the product on the blanking mechanism 204 and the Tray are placed in the magazine 206 by the second manipulator 205, the empty Tray in the Tray magazine is placed on the corresponding blanking mechanism 204.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The high-efficiency semiconductor cutting and sorting method comprises a dicing saw and a sorting machine, and is characterized by comprising the following steps of:
s1: placing a product to be cut into a cutting platform of a dicing saw, detecting the position of a cutting channel on the product by a visual detection system in the dicing saw, and adjusting the position of the cutting channel of the product by the cutting platform to ensure that the product on the cutting platform is calibrated;
s2: a main shaft blade on the dicing saw is used for dicing the product cutting channel on the cutting platform, and after the product is diced, the product is taken out and cleaned;
s3, air-drying the cleaned product, putting the product on a working disc to be detected by a sorting machine after air-drying, and positioning the product by a special jig on the working disc;
s4: moving the working disc with the product to the lower part of the AOI detection system at one side by utilizing a longitudinal linear driving mechanism;
s5: the AOI detection system collects product images on the working disc through the image collection module, and automatically identifies the product images according to the collected images and the corresponding theoretical characteristic positions so as to judge whether the detected object meets the theoretical characteristic positions or not;
s6: after the detection is finished, the product is sent to one side by a longitudinal linear driving mechanism, and the product is grabbed into a corresponding blanking mechanism Tray by a first manipulator;
s7: the blanking mechanism moves the product to a blanking area on one side, and the product and a Tray are put into a corresponding material box on one side by a second manipulator;
s8: after the magazine is full, it is removed.
2. The method of claim 1, wherein the dicing saw employs dual dicing spindles, dual dicing platforms, and a single vision inspection system.
3. The method of claim 1, wherein the sorter employs a dual working disk, dual longitudinal linear drive mechanism and dual AOI detection system.
4. The method for cutting and sorting high-efficiency semiconductors according to claim 1, wherein the longitudinal linear driving mechanism adopts a linear driving module, and a sliding table on the linear driving module is connected with the working disc.
5. The method of claim 1, wherein the AOI inspection system comprises a CCD camera and an inspection system coupled to the CCD camera.
6. The high-efficiency semiconductor cutting and sorting method according to claim 1, wherein the blanking mechanism comprises a linear driving module arranged longitudinally and a working disc arranged on the linear driving module and used for fixing a Tray; the linear driving module is provided with two linear driving modules, one linear driving module is used for discharging bad products, and the other linear driving module is used for discharging the bad products.
7. The method of claim 1, wherein the first manipulator comprises a first linear driving module crossing the longitudinal linear driving mechanism and the blanking mechanism, and a second linear driving module vertically arranged on the first linear driving module, and a vacuum chuck assembly for grabbing products is arranged at the bottom of the second linear driving module.
8. The high-efficiency semiconductor cutting and sorting method according to claim 1, wherein the second manipulator comprises a third linear driving module crossing the blanking mechanism and a fourth linear driving module longitudinally arranged on the third linear driving module, a fifth linear driving module is vertically arranged on the fourth linear driving module, and a vacuum chuck assembly for grabbing a Tray is arranged at the bottom of the fifth linear driving module.
9. The method of claim 1, wherein the cassettes comprise defective cassettes, good cassettes, and Tray cassettes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311062942.8A CN117253851A (en) | 2023-08-23 | 2023-08-23 | High-efficiency semiconductor cutting and sorting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311062942.8A CN117253851A (en) | 2023-08-23 | 2023-08-23 | High-efficiency semiconductor cutting and sorting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117253851A true CN117253851A (en) | 2023-12-19 |
Family
ID=89130303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311062942.8A Pending CN117253851A (en) | 2023-08-23 | 2023-08-23 | High-efficiency semiconductor cutting and sorting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117253851A (en) |
-
2023
- 2023-08-23 CN CN202311062942.8A patent/CN117253851A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106981437B (en) | Sorting detection process and equipment for QFN-BGA semiconductor chip | |
| KR100596505B1 (en) | Sawing/Sorting Apparatus | |
| CN216094907U (en) | Sorting device for front-end integrated wafers of semiconductor equipment | |
| KR100982478B1 (en) | A sawing and sorting system for semiconducdtor package | |
| US20080101894A1 (en) | Singulation handler system for electronic packages | |
| KR100497506B1 (en) | Apparatus for Sawing Semiconductor Strip and Apparatus for Singulation of Semiconductor Package Having the Same | |
| CN112820683A (en) | Wafer chip product testing tape weaving equipment and processing method thereof | |
| KR101831256B1 (en) | Semiconductor Strip Align Apparatus And Semiconductor Strip Align Method Using The Same | |
| TWI310580B (en) | Ic pick-and-place apparatus | |
| CN114571650A (en) | Full-automatic semiconductor plastic packaging equipment and method | |
| TW202101640A (en) | Semiconductor manufacturing apparatus | |
| JP2001024003A (en) | Csp substrate dividing apparatus | |
| CN212071388U (en) | Full-automatic edge scraping machine | |
| CN117253851A (en) | High-efficiency semiconductor cutting and sorting method | |
| CN108940913B (en) | Flatness detection equipment | |
| CN114148753B (en) | Sheet workpiece feeding and discharging equipment | |
| CN114530398A (en) | High-precision glue ejecting, taking and placing equipment used after semiconductor module chip sputtering process | |
| KR101454320B1 (en) | Strip loading Apparatus for Semiconductor Package Manufacturing Equipment | |
| CN218333717U (en) | Automatic wafer carrying and testing device | |
| CN211404463U (en) | Automatic insert machine for silicon wafers | |
| CN114113125A (en) | Appearance defect detection equipment and detection method thereof | |
| CN114148752A (en) | Full-automatic production line for sheet-shaped workpieces | |
| CN111408990B (en) | Full-automatic edge scraping machine | |
| CN112791996A (en) | Automatic sorting system | |
| CN220971142U (en) | Laser processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |