CN117253826B - High-precision packaging test machine for integrated circuit chip - Google Patents
High-precision packaging test machine for integrated circuit chip Download PDFInfo
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- CN117253826B CN117253826B CN202311507144.1A CN202311507144A CN117253826B CN 117253826 B CN117253826 B CN 117253826B CN 202311507144 A CN202311507144 A CN 202311507144A CN 117253826 B CN117253826 B CN 117253826B
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- push rod
- circuit chip
- slide rail
- fixedly connected
- controller
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000000428 dust Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 238000009423 ventilation Methods 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000000246 remedial effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a high-precision packaging test machine for an integrated circuit chip, which relates to the technical field of circuit chip packaging test machines and comprises a workbench and a controller, wherein a first sliding rail and a second sliding rail are respectively arranged on the upper side of the workbench, a second avoiding groove is formed in the middle of each of the first sliding rail and the second sliding rail, and a second push rod is arranged on the rear side of each of the first sliding rail and the front side of each of the second sliding rail.
Description
Technical Field
The invention relates to the technical field of circuit chip packaging test machines, in particular to a high-precision packaging test machine for an integrated circuit chip.
Background
The circuit chip package is a bridge for communicating the internal world of the chip with external circuits, a shell for installing a semiconductor integrated circuit chip plays roles of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and the bridge for communicating the internal world of the chip with the external circuits, namely, a joint on the chip is connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board. Therefore, packaging plays an important role for both CPU and other LSI integrated circuits.
The sliding rail of the existing circuit chip packaging test machine table is abnormal in parallelism of the sliding rail when the circuit chip is conveyed, pushing is abnormal, clamping is even caused, the sliding rail is often deviated due to long time, a fixing screw is loosened, so that the sliding rail angle is deviated, excessive dust on the surface is prevented from being required to be ensured during packaging, poor contact of interfaces of the chip caused by subsequent dust is prevented, and therefore, the circuit chip packaging test machine table capable of automatically adjusting the parallelism of the sliding rail and high in dust removal efficiency is very necessary.
Disclosure of Invention
The invention aims to provide a high-precision packaging test machine for an integrated circuit chip, which solves the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides an integrated circuit chip high accuracy encapsulation test machine platform, includes workstation and controller, the upside of workstation is equipped with first slide rail and second slide rail respectively, the centre of first slide rail and second slide rail all is equipped with the second and dodges the groove, and the upside of workstation all is equipped with the second push rod, the front and back side the output of second push rod stretches into the second of first slide rail and second slide rail respectively and dodges the groove and dodges groove and be connected with first slide rail and second slide rail bolt respectively, the second push rod all with workstation fixed connection, every the left side of second push rod all is equipped with first push rod, first push rod and workstation fixed connection, every the right side of second push rod all is equipped with the third push rod, third push rod and workstation fixed connection, the inside of first slide rail and second slide rail all is equipped with the spout, the front side left side fixedly connected with laser emitter of first slide rail, the left side fixedly connected with laser receiver of second slide rail, the inside photosensitive unit that is equipped with of laser receiver.
The right side of first slide rail and second slide rail is equipped with the fourth push rod, fourth push rod and workstation fixed connection, the output fixedly connected with ejector pad of fourth push rod, the distance of first push rod output to second push rod output is the same with the distance of third push rod output to second push rod output.
The right of the front side of the first slide rail and the right of the rear side of the second slide rail are fixedly connected with a second pressure sensor, the upper side of the slide groove of the first slide rail is provided with a first avoiding groove, the middle of the upper side of the first slide rail is fixedly connected with a motor, the output of motor runs through first groove upper wall of dodging, first inslot portion of dodging is equipped with the dog, dog and the output fixed connection of motor, one side fixedly connected with first pressure sensor of dog.
Still fixedly connected with fixed block in the middle of the upside of first slide rail, the inside of fixed block is equipped with the ventilation hole, the inside fixedly connected with humidity transducer in ventilation hole, one side of fixed block is equipped with the inclined plane, the front side fixedly connected with on inclined plane sprays the head, the inside fixedly connected with heater strip of injection head, the right side fixedly connected with air pump of fixed block, the input of air pump and the input fixed connection in ventilation hole, the input and the output fixed connection in ventilation hole of injection head.
Reinforcing plates are fixedly connected to the front side, the rear side, the left side and the right side of the workbench respectively, and rubber blocks are uniformly and fixedly connected to the lower side of the workbench.
The controller is fixedly connected to the upper right corner of the upper side of the workbench, a control module and a detection module are arranged in the controller, and the control module is in signal connection with the detection module.
The control module is in signal connection with the first push rod, the second push rod, the third push rod, the fourth push rod, the motor and the air pump, and the detection module is in signal connection with the first pressure sensor, the second pressure sensor, the laser emitter, the laser receiver and the humidity sensor.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the controller, the laser transmitter, the laser receiver, the first push rod and the third push rod are arranged, whether the first slide rail and the second slide rail are parallel or not is judged according to the quantity of the light source detected by the photosensitive unit of the laser receiver, so that when the first slide rail and the second slide rail have different inclination, different remedial measures are made by the controller, the first push rod and the third push rod, the situation that a circuit chip is stuck is effectively prevented, the packaging line is not stopped after abnormality is detected, and the effect of high packaging efficiency is achieved;
through being provided with laser emitter, laser receiver, air pump, jet head, make the jet head when blowing the dust removal to the circuit chip, judge the size of circuit chip according to the laser length of laser emitter transmission to adjust the air flow that the jet head blows out, adapt to the dust removal area of blowing of equidimension, reached the effect that dust collection efficiency is high.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the first and second sliding rails of the present invention;
FIG. 3 is an enlarged schematic view of region A of FIG. 1 in accordance with the present invention;
FIG. 4 is a partial cross-sectional view of a securing block of the present invention;
in the figure: 1. a work table; 2. a rubber block; 3. a first push rod; 4. a second push rod; 5. a third push rod; 6. a fourth push rod; 7. a controller; 8. a first slide rail; 9. a second slide rail; 10. a motor; 11. a stop block; 12. a first avoidance groove; 13. a fixed block; 14. a pushing block; 15. a first pressure sensor; 16. a laser receiver; 17. a laser emitter; 18. a second pressure sensor; 19. a humidity sensor; 20. a second avoidance groove; 21. a vent hole; 22. an air pump; 23. an ejection head; 24. a heating wire; 25. reinforcing plate.
Detailed Description
The technical scheme of the present invention is further described in non-limiting detail below with reference to the preferred embodiments and the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides an integrated circuit chip high accuracy encapsulation test machine platform, including workstation 1 and controller 7, the upside of workstation 1 is equipped with first slide rail 8 and second slide rail 9 respectively, the centre of first slide rail 8 and second slide rail 9 all is equipped with the second and dodges groove 20, the upside of workstation 1 all is equipped with second push rod 4 around the upper surface, the output of front and back side second push rod 4 stretches into the second of first slide rail 8 and second slide rail 9 respectively dodges groove 20 and with first slide rail 8 and second slide rail 9 bolted connection respectively, second push rod 4 all with workstation 1 fixed connection, the left side of every second push rod 4 all is equipped with first push rod 3, first push rod 3 and workstation 1 fixed connection, the right side of every second push rod 4 all is equipped with third push rod 5, third push rod 5 and workstation 1 fixed connection, the inside of first slide rail 8 and second slide rail 9 all is equipped with the spout, the front side left fixedly connected with laser receiver 16 of second slide rail 9, the inside 16 of laser receiver 16 is equipped with light-sensitive light emitter 16.
Specifically, the extension of the output end of the rear second push rod 4 is used for driving the first slide rail 8 to move forward, the extension of the output end of the front second push rod 4 is used for driving the second slide rail 9 to move backward, the retraction of the output end of the rear second push rod 4 is used for driving the first slide rail 8 to move backward, the retraction of the output end of the front second push rod 4 is used for driving the second slide rail 9 to move forward, the extension of the output end of the rear first push rod 3 is used for driving the left direction of the first slide rail 8 to move forward and the right direction of the first slide rail 8 to move forward, the extension of the output end of the front third push rod 5 is used for driving the right direction of the first slide rail 8 to move forward and the left direction of the first slide rail 9 to move forward, the laser emitter 17 is used for emitting laser to the laser receiver 16, the laser receiver 16 calculates the length value of the laser emitter 17 to emit the laser signal according to the time received laser, and the length value of the laser emitter 17 is converted to the laser receiver 7.
The right side of first slide rail 8 and second slide rail 9 is equipped with fourth push rod 6, and fourth push rod 6 and workstation 1 fixed connection, the output fixedly connected with ejector pad 14 of fourth push rod 6.
The distance from the output end of the first push rod 3 to the output end of the second push rod 4 is the same as the distance from the output end of the third push rod 5 to the output end of the second push rod 4.
Specifically, the extension of the fourth push rod 6 is used to push the circuit chip to slide leftwards, so that the circuit chip reaches the packaging area.
The right-hand second pressure sensor 18 of equal fixedly connected with in front side right-hand and the rear side right-hand of second slide rail 9 of first slide rail 8, the spout upside of first slide rail 8 is equipped with first groove 12 of dodging, fixedly connected with motor 10 in the middle of the upside of first slide rail 8, and the output of motor 10 runs through first groove 12 upper wall of dodging, and first groove 12 inside is equipped with dog 11 dodging, dog 11 and motor 10's output fixed connection, one side fixedly connected with first pressure sensor 15 of dog 11.
Specifically, when the circuit chip is placed between the two second pressure sensors 18 by the manipulator, the controller 7 controls the output ends of the front and rear second push rods 4 to extend to drive the first slide rail 8 to move forwards, the second slide rail 9 moves backwards, the two second pressure sensors 18 press two sides of the circuit chip, the second pressure sensors 18 are used for detecting pressure values when pressing the circuit chip and converting the pressure values into electric signals to be sent to the controller 7, so that whether the circuit chip is attached to the slide groove is judged, the rotation of the output end of the motor 10 is used for controlling the stop block 11 to rotate, when the circuit chip is required to be limited, the output end of the motor 10 rotates ninety degrees anticlockwise, when the circuit chip is packaged, the stop block 11 rotates ninety degrees clockwise, and enters the first avoiding groove 12 to return, the first pressure sensor 15 is used for detecting the pressure value of the circuit chip and converting the pressure value into the electric signals to be sent to the controller 7, so that whether the circuit chip reaches a specified packaging area is judged.
The middle of the upper side of the first sliding rail 8 is fixedly connected with a fixed block 13, a vent hole 21 is formed in the fixed block 13, a humidity sensor 19 is fixedly connected to the inside of the vent hole 21, an inclined plane is formed in one side of the fixed block 13, a spray head 23 is fixedly connected to the front side of the inclined plane, a heating wire 24 is fixedly connected to the inside of the spray head 23, an air pump 22 is fixedly connected to the right side of the fixed block 13, the input end of the air pump 22 is fixedly connected with the input end of the vent hole 21, and the input end of the spray head 23 is fixedly connected with the output end of the vent hole.
Specifically, the air pump 22 is used for extracting air into the vent hole 21, the humidity sensor 19 is used for detecting the air humidity value in the vent hole 21, and converting the humidity value into an electric signal to be sent to the controller 7, so as to judge whether the humidity value of the air can affect the circuit chip package, the jet head 23 is used for jetting the air in the vent hole 21 to the surface of the circuit chip, the heating wire 24 is used for heating the air passing through the jet head 23, and the effect of dehumidifying the air is achieved.
Reinforcing plates 25 are fixedly connected to the front side, the rear side, the left side and the right side of the workbench 1 respectively, and rubber blocks 2 are uniformly and fixedly connected to the lower side of the workbench 1.
Specifically, the reinforcing plate 25 is used for reinforcing the bearing capacity of the workbench 1, the rubber block 2 is used for reducing noise generated by shaking of the table, and the ground is prevented from being scratched when the bottom of the workbench 1 moves.
The controller 7 is fixedly connected to the upper right corner of the upper side of the workbench 1, a control module and a detection module are arranged in the controller 7, and the control module is in signal connection with the detection module.
The control module is in signal connection with the first push rod 3, the second push rod 4, the third push rod 5, the fourth push rod 6, the motor 10 and the air pump 22, and the detection module is in signal connection with the first pressure sensor 15, the second pressure sensor 18, the laser emitter 17, the laser receiver 16 and the humidity sensor 19.
The method comprises the following steps:
s1: the manipulator places the circuit chip between the two second pressure sensors 18, and judges whether the first slide rail 8 and the second slide rail 9 are parallel or not according to the quantity of the light sources detected by the photosensitive units of the laser receiver 16;
specifically, when the first slide rail 8 and the second slide rail 9 are completely parallel, 100% of light sources are received by the photosensitive unit of the laser receiver 16, when the first slide rail 8 and the second slide rail 9 are inclined within 1mm, 1% -99% of light sources are received by the photosensitive unit of the laser receiver 16, when the first slide rail 8 and the second slide rail 9 are completely inclined, 0% of light sources are received by the photosensitive unit of the laser receiver 16, when the controller 7 judges that the first slide rail 8 and the second slide rail 9 are completely parallel, the controller 7 opens the second push rod 4 to clamp a circuit chip, when the controller 7 judges that the first slide rail 8 and the second slide rail 9 are inclined within 1mm, the transmission of the circuit chip is not greatly influenced temporarily, the controller 7 alarms to remind a worker to check, and opens the second push rod 4 to clamp the circuit chip, when the controller 7 judges that the first slide rail 8 and the second slide rail 9 are completely inclined, the controller 7 indicates that great influence is caused on the conveying of the circuit chip at the moment, the controller 7 controls the output ends of the first push rod 3 and the third push rod 5 to extend to push the left side and the right side of the first slide rail 8 and the second slide rail 9 until 100% of light sources are received by the photosensitive units of the laser receiver 16, the output ends of the first push rod 3 and the third push rod 5 stop extending, an alarm inside the controller 7 sounds to remind a worker to check, the second push rod 4 is opened to clamp the circuit chip, and whether the first slide rail 8 and the second slide rail 9 are parallel is judged according to the quantity of the light sources detected by the photosensitive units of the laser receiver 16 through the controller 7, the laser emitter 17, the laser receiver 16, the first push rod 3 and the third push rod 5, so that the controller 7, the first push rod 3, when the first slide rail 8 and the second slide rail 9 are different in inclination, the third push rod 5 makes different remedial measures, so that the condition that a circuit chip is stuck is effectively prevented, the packaging line is not stopped after abnormality is detected, and the effect of high packaging efficiency is achieved.
S2: the output end of the second push rod 4 extends out to control the first slide rail 8 and the second slide rail 9 to clamp the circuit chip, and whether the circuit chip is attached to the slide groove is judged according to the pressure value detected by the second pressure sensor 18;
specifically, when the pressure value detected by the second pressure sensor 18 reaches 10pa, the circuit chip is judged to be attached to the chute, and when the controller 7 controls the output end of the second push rod 4 to continuously extend until the pressure value detected by the second pressure sensor 18 reaches 10pa, the controller 7 controls the output end of the second push rod 4 to stop extending, so that the effect of automatically attaching circuit chips with different sizes is achieved.
S3: the output end of the motor 10 rotates ninety degrees anticlockwise, the stop block 11 limits the circuit chip, the output end of the fourth push rod 6 extends out of the control push block 14 to push the circuit chip leftwards, and whether the circuit chip reaches the packaging area is judged according to the pressure value detected by the first pressure sensor 15;
specifically, when the pressure value detected by the first pressure sensor 15 reaches 5pa, the circuit chip is judged to reach the packaging area, and when the controller 7 controls the output end of the fourth push rod 6 to continuously extend until the pressure value detected by the second pressure sensor 18 reaches 5pa, the controller 7 controls the output end of the fourth push rod 6 to stop extending, so that the effect of automatically conveying the circuit chips with different sizes in place is achieved.
S4: the air pump 22 is turned on, the spray head 23 blows air to the surface of the circuit chip, dust on the surface is blown off, and whether the air needs to be heated or not is judged according to the air humidity detected by the humidity sensor 19;
specifically, let the air humidity detected by the humidity sensor 19 be S, the power of the heating wire 24 be divided into high power and low power, the greater the humidity of the air, the greater the heating power required, when S is less than or equal to 40%, the heating wire 24 is closed, the air pump 22 is opened, the spray head 23 blows air to the surface of the circuit chip, when 80% > S is greater than 40%, the heating wire 24 is opened with low power, the air pump 22 is opened, the heating wire 24 dehumidifies the passing air with low efficiency, the spray head 23 blows air to the surface of the circuit chip, the dust on the surface is blown off, when S is greater than or equal to 80%, the heating wire 24 is opened with high power, the air pump 22 is opened, the heating wire 24 dehumidifies the passing air with high efficiency, the spray head 23 blows air to the surface of the circuit chip, the dust on the surface is blown off, the humidity in the air is detected, thereby the spray head 23 blows and removes dust on the surface of the circuit chip, and the heating power of the heating wire 24 is automatically adjusted according to the air humidity, thereby achieving the effects of high efficiency of heating and dehumidification.
S5: when the jet head 23 blows and removes dust to the circuit chip, the size of the circuit chip is judged according to the laser length emitted by the laser emitter 17, so that the air flow blown out by the jet head 23 is adjusted;
specifically, let the laser length of laser emitter 17 transmission be J, the power of air pump 22 divide into 30w, 60w, 90w, because the bigger the circuit chip, the bigger the required area of blowing dust removal just needs to be, therefore, when J is less than or equal to 1cm, controller 7 judges that the circuit chip is little chip, air pump 22 open power is 30w, jet head 23 carries out the inefficiency to the circuit chip surface and blows out the dust on surface, when 1cm < J < 5cm, controller 7 judges that the circuit chip is medium chip, air pump 22 open power is 60w, jet head 23 carries out normal blowing to the circuit chip surface, blow out the dust on surface, when J is less than or equal to 5cm, controller 7 judges that the circuit chip is big chip, air pump 22 open power is 90w, jet head 23 carries out high efficiency to the circuit chip surface, blow out the dust removal on the surface, through being provided with laser 17, laser receiver 16, air pump 22, jet head 23, when blowing dust removal to the circuit chip, the length of laser emitter 17 is judged, the normal blowing of jet head 23 carries out the blowing out, the dust removal effect of the big chip is reached, the different air flow rates of blowing dust removal has been adjusted, thereby the high air flow rate of blowing dust removal has been reached.
S6: after dust is removed, the circuit chip is packaged by the manipulator;
s7: after the circuit chip is packaged, the output end of the motor 10 rotates ninety degrees clockwise, the stop block 11 returns to the inside of the first avoiding groove 12, the output end of the fourth push rod 6 pushes the circuit chip out of the first slide rail 8 and the second slide rail 9, and the next flow is entered.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Finally, it should be pointed out that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting. Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides an integrated circuit chip high accuracy encapsulation test board, includes workstation (1) and controller (7), the upside of workstation (1) is equipped with first slide rail (8) and second slide rail (9) respectively, the centre of first slide rail (8) and second slide rail (9) all is equipped with second and dodges groove (20), the front and back side of the upper surface of workstation (1) all is equipped with second push rod (4), front and back side second push rod (4)'s output stretches into first slide rail (8) and second slide rail (9) respectively second dodge groove (20) and with first slide rail (8) and second slide rail (9) bolted connection respectively, second push rod (4) all with workstation (1) fixed connection, every second push rod (4)'s left side all is equipped with first push rod (3), first push rod (3) and workstation (1) fixed connection, every second push rod (4)'s right side all is equipped with third push rod (5), third push rod (5) and first slide rail (8) and second slide rail (9) fixed connection, laser emitter (16) in the side of first push rod (1) and the side of first slide rail (9), a photosensitive unit is arranged inside the laser receiver (16);
the extension of the output end of the rear side second push rod (4) is used for driving the first slide rail (8) to move forwards, the extension of the output end of the front side second push rod (4) is used for driving the second slide rail (9) to move backwards, the retraction of the output end of the rear side second push rod (4) is used for driving the first slide rail (8) to move backwards, the retraction of the output end of the front side second push rod (4) is used for driving the second slide rail (9) to move forwards, the extension of the output end of the rear side first push rod (3) is used for driving the left side of the first slide rail (8) to move forwards and the right side of the first slide rail (8) to move forwards, the extension of the output end of the front side first push rod (3) is used for driving the left side of the second slide rail (9) to move forwards and the left side of the second slide rail (9) to move forwards;
and judging whether the first slide rail (8) and the second slide rail (9) are parallel or not according to the quantity of the light sources detected by the photosensitive unit of the laser receiver (16).
2. The integrated circuit chip high-precision packaging test machine according to claim 1, wherein: the right side of first slide rail (8) and second slide rail (9) is equipped with fourth push rod (6), fourth push rod (6) and workstation (1) fixed connection, the output fixedly connected with ejector pad (14) of fourth push rod (6), the distance of first push rod (3) output to second push rod (4) output is the same with the distance of third push rod (5) output to second push rod (4) output.
3. The integrated circuit chip high-precision packaging test machine according to claim 2, wherein: the novel intelligent anti-collision device is characterized in that the right of the front side of the first sliding rail (8) and the right of the rear side of the second sliding rail (9) are fixedly connected with a second pressure sensor (18), the upper side of a sliding groove of the first sliding rail (8) is provided with a first avoiding groove (12), a motor (10) is fixedly connected in the middle of the upper side of the first sliding rail (8), the output end of the motor (10) penetrates through the upper wall of the first avoiding groove (12), a stop block (11) is arranged in the first avoiding groove (12), the stop block (11) is fixedly connected with the output end of the motor (10), and one side of the stop block (11) is fixedly connected with a first pressure sensor (15).
4. The integrated circuit chip high-precision packaging test machine according to claim 3, wherein: still fixedly connected with fixed block (13) in the middle of the upside of first slide rail (8), the inside of fixed block (13) is equipped with ventilation hole (21), the inside fixedly connected with humidity transducer (19) of ventilation hole (21), one side of fixed block (13) is equipped with the inclined plane, the front side fixedly connected with on inclined plane sprays head (23), the inside fixedly connected with heater strip (24) of spraying head (23), the right side fixedly connected with air pump (22) of fixed block (13), the input of air pump (22) and the input fixed connection of ventilation hole (21), the input of spraying head (23) and the output fixed connection of ventilation hole.
5. The integrated circuit chip high precision packaging test machine according to claim 4, wherein: reinforcing plates (25) are fixedly connected to the front side, the rear side, the left side and the right side of the workbench (1), and rubber blocks (2) are uniformly and fixedly connected to the lower side of the workbench (1).
6. The integrated circuit chip high-precision packaging test machine according to claim 5, wherein: the controller (7) is fixedly connected to the upper right corner of the workbench (1), a control module and a detection module are arranged in the controller (7), and the control module is in signal connection with the detection module.
7. The integrated circuit chip high-precision packaging test machine according to claim 6, wherein: the control module is in signal connection with the first push rod (3), the second push rod (4), the third push rod (5), the fourth push rod (6), the motor (10) and the air pump (22), and the detection module is in signal connection with the first pressure sensor (15), the second pressure sensor (18), the laser transmitter (17), the laser receiver (16) and the humidity sensor (19).
8. The method for using the integrated circuit chip high-precision packaging test machine according to claim 7, wherein the method comprises the following steps: the method comprises the following steps:
s1: the manipulator places the circuit chip in the middle of the two second pressure sensors (18), and judges whether the first slide rail (8) and the second slide rail (9) are parallel or not according to the quantity of the light sources detected by the photosensitive units of the laser receiver (16);
s2: the output end of the second push rod (4) extends out to control the first slide rail (8) and the second slide rail (9) to clamp the circuit chip, and whether the circuit chip is attached to the slide groove is judged according to the pressure value detected by the second pressure sensor (18);
s3: the output end of the motor (10) rotates ninety degrees anticlockwise, the stop block (11) limits the circuit chip, the output end of the fourth push rod (6) extends out of the control push block (14) to push the circuit chip leftwards, and whether the circuit chip reaches the packaging area is judged according to the pressure value detected by the first pressure sensor (15);
s4: the air pump (22) is turned on, the spray head (23) blows air to the surface of the circuit chip, dust on the surface is blown off, and whether the air needs to be heated or not is judged according to the air humidity detected by the humidity sensor (19);
s5: when the jet head (23) blows and removes dust to the circuit chip, the size of the circuit chip is judged according to the laser length emitted by the laser emitter (17), so that the air flow blown by the jet head (23) is adjusted;
s6: after dust is removed, the circuit chip is packaged by the manipulator;
s7: after the circuit chip is packaged, the output end of the motor (10) rotates ninety degrees clockwise, the stop block (11) returns to the inside of the first avoiding groove (12), the output end of the fourth push rod (6) pushes the circuit chip out of the first slide rail (8) and the second slide rail (9), and the next flow is entered.
9. The method for using the integrated circuit chip high-precision packaging test machine according to claim 8, wherein the method comprises the following steps: the method for detecting parallelism by S1 is as follows:
when the first sliding rail (8) and the second sliding rail (9) are arranged in parallel, the photosensitive unit of the laser receiver (16) receives 100% of light sources, when the first sliding rail (8) and the second sliding rail (9) incline within 1mm, the photosensitive unit of the laser receiver (16) receives 1% -99% of light sources, when the first sliding rail (8) and the second sliding rail (9) incline completely, the photosensitive unit of the laser receiver (16) receives 0% of light sources, when the controller (7) judges that the first sliding rail (8) and the second sliding rail (9) are completely parallel, the controller (7) opens the second push rod (4) to clamp a circuit chip, when the controller (7) judges that the first sliding rail (8) and the second sliding rail (9) incline within 1mm, the transmission of the circuit chip is not greatly influenced temporarily, the controller (7) alarms to remind workers to check, and opens the second push rod (4) to clamp the circuit chip, when the controller (7) judges that the first sliding rail (8) and the second sliding rail (9) incline completely, the first push rod (8) and the second push the circuit chip (9) completely, the first push rod (3) out of the circuit chip is greatly, the first push rod (5) and the second push rod (9) until the second push rod (5) and the circuit chip is completely pushed out of the circuit chip, the first push the second push rod (3) and the second push the circuit (5) to the circuit chip completely, the second push the circuit chip is greatly when the first push the second rod (8 and the second push the second rod (9) and the second push the second rod (5), the output ends of the first push rod (3) and the third push rod (5) stop extending, the controller (7) alarms inside to remind a worker to check, and the second push rod (4) is opened to clamp the circuit chip.
10. The method for using the integrated circuit chip high-precision packaging test machine according to claim 8, wherein the method comprises the following steps:
the method for adjusting the air flow in S5 is as follows:
the laser length of the laser emitted by the laser emitter (17) is J, the power of the air pump (22) is divided into 30w, 60w and 90w, and the larger the circuit chip is, the larger the required blowing dust removing area is, the larger the required air flow is, therefore, when J is less than or equal to 1cm, the controller (7) judges that the circuit chip is a small chip, the opening power of the air pump (22) is 30w, the ejector (23) blows air at low efficiency to the surface of the circuit chip, the dust on the surface is blown off, when J is less than 1cm and less than 5cm, the controller (7) judges that the circuit chip is a medium chip, the opening power of the air pump (22) is 60w, the ejector (23) blows air to the surface of the circuit chip normally, the dust on the surface is blown off, when J is more than or equal to 5cm, the controller (7) judges that the circuit chip is a large chip, the opening power of the air pump (22) is 90w, the ejector (23) blows air at high efficiency to the surface of the circuit chip.
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