CN117252141A - Fluid mechanics solver circuit thermal simulation method, device and storage medium - Google Patents
Fluid mechanics solver circuit thermal simulation method, device and storage medium Download PDFInfo
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- CN117252141A CN117252141A CN202311503836.9A CN202311503836A CN117252141A CN 117252141 A CN117252141 A CN 117252141A CN 202311503836 A CN202311503836 A CN 202311503836A CN 117252141 A CN117252141 A CN 117252141A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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Abstract
The invention relates to the technical field of circuit design, in particular to a method and a device for thermal simulation of a fluid mechanics solver circuit and a storage medium. A hydrodynamic solver circuit thermal simulation method, comprising: acquiring thermal power distribution data and a solver grid; obtaining a power unit position, a power unit size and a power unit power according to the thermal power distribution data, and obtaining a grid position and a grid size according to the solver grid; when the power unit position and the grid position meet the first matching condition and the power unit size and the grid size meet the second matching condition, assigning the power of the power unit to the solver grids and obtaining the power density of the solver grid of each solver grid; and (3) inputting the solver grid with the solver grid power density into a general hydrodynamic solver, and outputting a first thermal simulation image. According to the technical scheme, the general fluid mechanics solver can output the thermal simulation image according to the thermal power distribution data.
Description
Technical Field
The invention relates to the technical field of circuit design, in particular to a method and a device for thermal simulation of a fluid mechanics solver circuit and a storage medium.
Background
Printed Circuit Boards (PCBs) are an integral part of modern electronic devices. They are used in a wide variety of devices, ranging from smart phones to computers, automobiles, medical devices, and aerospace technology. The main function of the PCB is to provide connection and support between electronic components, as well as to provide electrical and mechanical support.
With the continuous development of electronic devices and the improvement of performance, the thermal management of PCBs has become more and more important, and in order to ensure the reliability of the normal operation of electronic devices, accurate analysis and simulation of the thermal characteristics of PCBs have to be performed, and solver thermal simulation technology has become an important tool for thermal management due to its high efficiency and accuracy, and a general fluid mechanics solver (CFD) is a numerical simulation tool widely used in the engineering field, which can simulate and analyze hydrodynamic problems by solving fluid motion equations, and also has excellent performance in many fields, but is not suitable for thermal simulation according to general data, resulting in failure of CFD to perform thermal simulation on PCBs according to thermal power distribution data (Powermap).
Disclosure of Invention
The invention solves the problem of providing a method for carrying out circuit board thermal simulation according to a hydrodynamic solver.
In order to solve the problems, the invention provides a method, a device and a storage medium for thermal simulation of a fluid mechanics solver circuit.
In a first aspect, the present invention provides a method for thermal simulation of a hydrodynamic solver circuit, comprising:
acquiring thermal power distribution data of a printed circuit board and a solver grid of a general hydrodynamic solver;
obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
when the power unit position and the grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, judging that the power unit and the solver grid are matched, and assigning the power unit power of the power unit to the solver grid to obtain the power of the solver grid;
determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
Inputting the solver grid with the solver grid power density into the universal hydrodynamic solver and outputting a first thermal simulation image of the printed circuit board.
Optionally, the power unit location includes power unit center point location coordinates; the grid position comprises grid center point position coordinates; the power cell location and the grid location satisfying a first matching condition, comprising:
determining a center point distance according to the position coordinates of the center points of the power units, the position coordinates of the center points of the grids and the distance relation;
when the center point distance is smaller than a first preset threshold value, judging that the power unit position and the grid position meet the first matching condition;
the distance relation satisfies:
；
wherein D is the center point distance, (X) 1 ，Y 1 ，Z 1 ) For the power cell center point position coordinates, (X) 2 ，Y 2 ，Z 2 ) And (5) the grid center point position coordinates.
Optionally, the power unit location includes power unit vertex location coordinates; the grid position comprises grid vertex position coordinates; the power cell size and the grid size satisfying a second matching condition, comprising:
determining the distance between each power unit vertex and all grid vertices according to the power unit vertex position coordinates of the power unit and the grid vertex position coordinates of the solver grid;
Taking all the distances as sphere diameters, determining sphere volumes according to the sphere diameters, and selecting the largest sphere volume to be determined as a reference volume;
obtaining a power unit volume according to the power unit size, and obtaining a grid volume according to the grid size;
obtaining a volume matching coefficient according to the power unit volume, the grid volume and the reference volume and volume relation;
when the volume matching coefficient is smaller than a second preset threshold value, judging that the power unit size and the grid size meet the second matching condition of the foot;
the volume relationship satisfies:
；
wherein λ is the volume matching coefficient, a is the power unit volume, B is the grid volume, and C is the reference volume.
Optionally, the obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data includes:
obtaining the power unit size, the power unit position information and the power distribution of the printed circuit board according to the thermal power distribution data;
determining a power unit area according to the power unit position information;
And determining the power unit power in the power unit area according to the power distribution of the printed circuit board and the power unit area.
Optionally, the method further comprises:
inputting the thermal power distribution data into an electronic heat dissipation solver, and outputting a second thermal simulation image;
and verifying the general fluid mechanics solver according to the comparison result of the second thermal simulation image and the first thermal simulation image.
Optionally, verifying the universal fluid mechanics solver according to the comparison result of the second thermal simulation image and the first thermal simulation image includes:
gray scale processing is carried out on the first thermal simulation image to obtain a first gray scale value of each pixel point in the first thermal simulation image, gray scale processing is carried out on the second thermal simulation image to obtain a second gray scale value of each pixel point of the second thermal simulation image, and the number of the pixel points of the first thermal simulation image is the same as that of the second thermal simulation image;
obtaining a verification coefficient according to all the first gray values, all the second gray values and the verification relation;
when the verification coefficient is smaller than a third preset threshold value, judging that the thermal simulation result of the general fluid mechanics solver is accurate;
Otherwise, judging that the thermal simulation result of the general fluid mechanics solver is abnormal.
Optionally, the check relation satisfies:
；
wherein k is the check coefficient, P i For the ith one of the first gray values of the first thermal simulation image, Q i And (3) the ith second gray value of the second thermal simulation image, and n is the number of pixels of the first thermal simulation image.
In a second aspect, a fluid mechanics solver circuit thermal simulation apparatus includes:
the acquisition module is used for acquiring thermal power distribution data of the printed circuit board and a solver grid of the universal hydrodynamic solver;
the processing module is used for obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
the matching module is used for judging that the power unit is matched with the solver grid when the power unit position and the grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, and assigning the power unit power of the power unit to the solver grid to obtain the power of the solver grid;
The operation module is used for determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
and the thermal simulation module is used for inputting the solver grid with the solver grid power density into the universal fluid mechanics solver and outputting a first thermal simulation image of the printed circuit board.
In a third aspect, an electronic device includes a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to implement the hydrodynamic solver circuit thermal simulation method according to the first aspect when executing the computer program.
In a fourth aspect, a computer readable storage medium has stored thereon a computer program which, when executed by a processor, implements the hydrodynamic solver circuit thermal simulation method according to the first aspect.
The hydrodynamic solver circuit thermal simulation method and device and the storage medium have the beneficial effects that: obtaining the power unit position, the power unit size and the power unit power of a power unit of the printed circuit board according to the obtained thermal power distribution data of the printed circuit board, obtaining the grid position and the grid size of a solver grid in the printed circuit board according to the solver grid, when the power unit position and the solver grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, indicating that the power unit and the solver grid coincide, namely the positions of the power unit and the solver grid in the printed circuit board are the same, and the areas contained in the printed circuit board are the same, further obtaining the power unit power corresponding to the power unit through the thermal power distribution data, assigning the power unit power to the solver grid successfully matched, namely assigning the power value in the thermal power distribution data to the solver grid of the general fluid mechanical solver, determining the power density of the solver according to the power value and the corresponding grid size, and finally inputting the solver with the power density of the solver grid into the general fluid mechanical solver, and outputting a thermal simulation image of the printed circuit board, namely the first thermal simulation image. The power values of the power units of the thermal power distribution data are assigned to the solver grid successfully matched with the power units, so that the universal fluid mechanics solver can perform thermal simulation on the printed circuit board according to the thermal power distribution data of the printed circuit board, the compatibility of the universal fluid mechanics solver is improved, the power values accurate in the thermal power distribution data can be obtained by the universal fluid mechanics solver grid through the first matching condition and the second matching condition, the assignment accuracy of the solver grid is further improved, and the accuracy of thermal simulation images output by the fluid mechanics solver according to the thermal power distribution data is further improved.
Drawings
Fig. 1 is a schematic flow chart of a thermal simulation method of a hydrodynamic solver circuit according to an embodiment of the invention.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. While the invention is susceptible of embodiment in the drawings, it is to be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the invention. It should be understood that the drawings and embodiments of the invention are for illustration purposes only and are not intended to limit the scope of the present invention.
It should be understood that the various steps recited in the method embodiments of the present invention may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the invention is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "alternative embodiments". Related definitions of other terms will be given in the description below. It should be noted that the terms "first," "second," and the like herein are merely used for distinguishing between different devices, modules, or units and not for limiting the order or interdependence of the functions performed by such devices, modules, or units.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise.
In the circuit thermal simulation method of the hydrodynamic solver of the embodiment, the thermal power distribution data includes a power distribution diagram file of the printed circuit board and a design file of the printed circuit board, and the power distribution diagram file includes specific power values describing power distribution and power supply conditions, namely, a heat source distribution condition of the printed circuit board and corresponding heat sources. The design file comprises the size of the circuit board and the layer height of the printed circuit board, namely the thickness of each layer of the printed circuit board, a space rectangular coordinate system is built according to the printed circuit board, for example, the starting point of the circuit board is taken as an origin, the layer height of the circuit board is placed along the positive direction of the Z axis, the length of the circuit board is placed along the positive direction of the X axis, the width of the circuit board is placed along the positive direction of the Y axis, the space position coordinate of each heat source in the printed circuit board can be obtained according to the heat source distribution condition of the printed circuit board and the space rectangular coordinate system, the power of each region can be calculated more accurately according to the specific space position coordinate, the power value of the corresponding region is obtained through calculation, and the thermal power distribution data further comprises information of power units which are divided in advance according to the grid division rule of the general hydrodynamic solver, and the information of the position information of the power units in the coordinate system and the size information of the power units. The solver grid is obtained in advance according to the grid size corresponding to the solver and the position information of each grid in the printed circuit board, wherein the grid size specifically comprises the length, the width and the height of the grid, and the height of the grid is matched with the layer height of the printed circuit board needing thermal simulation.
As shown in fig. 1, an embodiment of the present invention provides a thermal simulation method for a hydrodynamic solver circuit, including:
step S1, acquiring thermal power distribution data of a printed circuit board and a solver grid of a general hydrodynamic solver;
in particular, thermal power distribution data of a printed circuit board is obtained, the thermal power distribution data comprises a starting point position of the circuit board, a size of the printed circuit board and heat source distribution information of the printed circuit board, and further comprises power unit power, power unit position information and power unit size of power units which are divided in advance, wherein the position information is vertex position information of the power units which are divided in advance according to grids of a general hydrodynamic solver, the grid size unit in the general hydrodynamic solver is an inch, and the size of the printed circuit board is a millimeter due to a relatively general small size unit, therefore, the inches of the grids of the solver need to be converted into millimeters, then the division of the power units is carried out according to the converted size and the size information of the printed circuit board, and the vertex position coordinates of each power unit and the specific size corresponding to the power units are determined, for example, according to thermal power distribution data, the length of the first layer of the printed circuit board is 200mm, the width is 100mm, the thickness of each layer is 2mm and is determined to be high, a solver grid which is matched with the height of the printed circuit board layer is obtained, for example, according to the power unit size obtained by conversion of the general fluid mechanics solver grid is 2mm multiplied by 2mm, the converted size value is an integer, then the first layer of the printed circuit board is divided into 5000 power units according to the size, so that the position information of each power unit in the printed circuit board is obtained, because the conversion process may have difference, and the grids of the general fluid mechanics solver are not arranged in sequence, the power unit and the solver grid can be described to be identical in the area of the printed circuit board only when the power unit and the grid of the solver meet the matching condition, and the power value in the thermal power distribution data is used for accurately assigning a value to the general fluid mechanics solver, so that the solver can output an accurate thermal simulation image according to the assigned value.
Further, the position of the start point is the position coordinate of the start point of the printed circuit board in the space coordinate system, the position of the start point can be set as the original point coordinate, the thermal power distribution data also includes the information of the design file of the printed circuit board, such as the size information of the printed circuit board, the number of layers and the thickness of each layer, the coordinate of the printed circuit board in the Z axis can be obtained according to the thickness, taking a double-layer printed circuit board as an example, for example, the thickness of each layer is 2mm, the coordinate of the point of intersection of the first layer of the printed circuit board in the Z axis is (0, 2) relative to the start point, the coordinate of the point of intersection of the first layer of the printed circuit board in the X axis is (200,0,0), the coordinate of the point of intersection of the second layer of the vertex in the Z axis is (0, 4) relative to the first layer is superimposed on the first layer, the coordinate of the second layer of the point of the printed circuit board in the Z axis is (100 mm) and the length is arranged along the positive direction of the X axis according to the size of the printed circuit board, the length is arranged along the positive direction of the length, the printed circuit board is obtained, the coordinate of the point of the printed circuit board is obtained, the point of the printed circuit board is 200mm, the point of intersection of the printed circuit board is obtained relative position of the point in the X axis is 100mm, the right angle coordinate is exactly is the coordinate of the printed circuit board in the space coordinate is in the specific position of the space coordinate system, and the position is defined in the space coordinate is in the position of the printed circuit board is in the position of the printed circuit board.
Further, specific information data of a solver grid generated by the solver aiming at the printed circuit board is obtained through information of grids of the universal hydrodynamic solver, so that the size of the grid and position information of each grid relative to the printed circuit board, namely grid size and grid vertex position coordinates, can be obtained, the solver grid comprises specific size information of the grid, namely length, width and height of the grid, and the height is matched with the layer height of the printed circuit board.
Step S2, obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
specifically, the printed circuit board is divided into a plurality of power units according to grid information of the general hydrodynamic solver, the power unit positions, the power unit sizes and the power unit powers of the power units which are divided in advance are obtained according to thermal power data of the printed circuit board, the power unit positions are actual position information of the power units which are divided in the printed circuit board, namely, based on specific position coordinates in a space rectangular coordinate system constructed by the printed circuit board, the power unit sizes are actual size information of the grids which are divided, and the power unit powers are actual power values of the printed circuit board in each power unit area after the power units are divided.
Further, through the grid of the general fluid mechanics solver, the position information of each grid in the printed circuit board is obtained according to the size information of the printed circuit board, namely, the specific position coordinates in the space rectangular coordinate system constructed based on the printed circuit board, and the size of the grid is obtained according to the general fluid mechanics solver.
Step S3, when the power unit position and the grid position meet a first matching condition, and the power unit size and the grid size meet a second matching condition, judging that the power unit and the solver grid are matched, and assigning the power unit power of the power unit to the solver grid to obtain the solver grid power;
specifically, according to the positions of the power units of all the power units and the grid positions of all the solver grids, selecting the power units and the solver grids which meet the first matching condition, judging whether the second matching condition is met according to the sizes of the power units and the grid sizes of the solver grids which meet the first matching condition, and when the power units and the solver grids meet the first matching condition and the second matching condition at the same time, judging that the power units and the solver grids overlap, namely, the areas represented by the power units and the solver grids in the printed circuit overlap, and finally assigning the power of the power units to the solver grids, namely, determining the power of the power units as the power of the solver grids.
Step S4, determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
and S5, inputting the solver grid with the solver grid power density into the universal fluid mechanics solver, and outputting a first thermal simulation image of the printed circuit board.
Specifically, the length, width and height of the solver grid are obtained according to the size of the solver grid, the volume of the solver grid is obtained according to the length, width and height, the power of the solver grid corresponding to the solver grid is divided by the volume of the solver grid, so that the power density of the solver grid corresponding to the solver grid is obtained, the space distribution condition and the heat energy conduction performance of the power in the solver grid can be more intuitively reflected through the power density of the solver grid, the solver can analyze and calculate according to the power density of each solver grid, and therefore the accurate thermal simulation result of the position corresponding to the solver grid in the printed circuit board is obtained.
Further, all solver grids with power density are input into a general hydrodynamic solver, the solver carries out analysis and calculation through the power density in each solver grid, so that thermal characteristic parameters such as temperature distribution, heat flow distribution and the like of each position on the printed circuit board are obtained, the general hydrodynamic solver finally outputs a first thermal simulation image, the thermal simulation image is usually presented in the form of a color chart, the color of the image represents the temperature values of different positions in the printed circuit board, a high-temperature region is usually represented by red or yellow, and a low-temperature region is represented by blue or green, and an engineer can intuitively know the temperature distribution condition of an object through the color coding scheme.
In this embodiment, the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board are obtained according to the obtained thermal power distribution data of the printed circuit board, the grid position and the grid size of the solver grid in the printed circuit board are obtained according to the solver grid, when the power unit position and the solver grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, it is indicated that the power unit and the solver grid coincide, that is, the positions of the power unit and the solver grid in the printed circuit board are identical, and the areas contained in the printed circuit board are identical, further the power unit power corresponding to the power unit is obtained through the thermal power distribution data, the power unit power is assigned to the solver grid which is successfully matched, that is, the power value in the thermal power distribution data is assigned to the solver grid of the general fluid mechanical solver, the power density of the solver grid is determined according to the power value and the corresponding grid size, and finally the solver grid with the power density of the solver grid is input to the general fluid mechanical solver, and the thermal simulation image of the printed circuit board, that is the first thermal simulation image is output. The power values of the power units of the thermal power distribution data are assigned to the solver grid successfully matched with the power units, so that the universal fluid mechanics solver can perform thermal simulation on the printed circuit board according to the thermal power distribution data of the printed circuit board, the compatibility of the universal fluid mechanics solver is improved, the power values accurate in the thermal power distribution data can be obtained by the universal fluid mechanics solver grid through the first matching condition and the second matching condition, the assignment accuracy of the solver grid is further improved, and the accuracy of thermal simulation images output by the fluid mechanics solver according to the thermal power distribution data is further improved.
In an alternative embodiment, the power cell location includes power cell center point location coordinates; the grid position comprises grid center point position coordinates; the power cell location and the grid location satisfying a first matching condition, comprising:
determining a center point distance according to the position coordinates of the center points of the power units, the position coordinates of the center points of the grids and the distance relation;
when the center point distance is smaller than a first preset threshold value, judging that the power unit position and the grid position meet the first matching condition;
the distance relation satisfies:
；
wherein D is the center point distance, (X) 1 ，Y 1 ，Z 1 ) For the power cell center point position coordinates, (X) 2 ，Y 2 ，Z 2 ) And (5) the grid center point position coordinates.
Specifically, in a space rectangular coordinate system constructed according to thermal power distribution data of a printed circuit board, the corresponding position coordinates of the solver grid, namely the position coordinates of the central point of the solver grid and the position coordinates of the vertex of the solver grid, are obtained in the coordinate system through unit conversion, the distance between the central point of the power unit and the central point of the solver grid is determined according to the position coordinates of the central point of the power unit and the position coordinates of the central point of the grid, when the distance is smaller than a first preset threshold value, the deviation of the positions of the two central points is indicated to be in an acceptable range, and the difference between the power value obtained by the power unit and the corresponding actual power value of the solver grid in the printed circuit board does not influence the thermal simulation result of the universal hydrodynamic solver, so that the accuracy of assigning values to the solver grid according to the thermal power distribution data is further improved.
For example, a first preset threshold is set to 0.2, the power unit center point position coordinates are (0.1,0.2,0.1), the grid center point position coordinates are (0.1,0.3,0.1), and the center point distance is 0.1 according to the distance relation, wherein 0.1 is smaller than 0.2, which indicates that the power unit and solver grid meets the first matching condition.
In an alternative embodiment, the power cell location includes the power cell vertex location coordinates; the grid position comprises the grid vertex position coordinates; the power cell size and the grid size satisfying a second matching condition, comprising:
determining the distance between each power unit vertex and all grid vertices according to the power unit vertex position coordinates of the power unit and the grid vertex position coordinates of the solver grid;
taking all the distances as sphere diameters, determining sphere volumes according to the sphere diameters, and selecting the largest sphere volume to be determined as a reference volume;
obtaining the power unit volume according to the power unit size, and obtaining the grid volume according to the grid size;
obtaining a volume matching coefficient according to the power unit volume, the grid volume and the reference volume and volume relation;
When the volume matching coefficient is smaller than a second preset threshold value, judging that the power unit size and the grid size meet the second matching condition of the foot;
the volume relationship satisfies:
；
wherein λ is the volume matching coefficient, a is the power unit volume, B is the grid volume, and C is the reference volume.
Specifically, for example, the solver grid and the power unit of the general hydrodynamic solver are cubes, so that the power unit and the solver grid respectively have 8 vertexes, one power unit and one solver grid are matched through a small ball collision method, the 8 distance values corresponding to the 8 vertexes of the power unit are respectively determined according to the position coordinates of the vertex of the power unit and the position coordinates of the vertex of the 8 grids, the 8 distance values are calculated through the position coordinates of the vertex of the rest 7 power units and the position coordinates of the vertex of the 8 grids of the solver grid respectively, 8 groups of distance values are obtained for the 8 vertexes of the power unit, 64 distance values can be finally obtained, the largest distance value is determined as a diameter, the volume of a corresponding circle is calculated according to the diameter, the volume is determined as a reference volume for matching, or taking all distance values as diameters and calculating the volume of a circle, taking the largest volume as a reference volume, then respectively calculating the volume of a power unit according to the size of the power unit, calculating the volume of a solver grid according to the size of the grid, namely obtaining the corresponding volume according to the length, the width and the height in the size information, calculating the volume matching coefficient of the power unit and the solver grid through a volume relation, judging that the power unit and the solver grid meet a second matching condition when the volume matching coefficient is smaller than a second preset threshold value, further judging that the power unit and the solver grid are overlapped according to the vertex position relation of the power unit and the solver grid and the matching result of the volume relation, further improving the matching precision of the power unit and the solver grid through judging of the two matching conditions due to the fact that the size of a printed circuit board is generally smaller, when the first matching condition and the second matching condition are met at the same time, the position coincidence of the power unit and the solver grid in the printed circuit board can be accurately judged, even if errors exist, the positions are controlled within an acceptable range, the power value acquired by the general fluid mechanics solver according to the thermal power distribution data and the accuracy of the output thermal simulation result cannot be influenced, and finally the general fluid mechanics solver can perform thermal simulation on the printed circuit board according to the thermal power distribution data and output an accurate thermal simulation diagram.
In an alternative embodiment, the obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data includes:
obtaining the power unit size, the power unit position information and the power distribution of the printed circuit board according to the thermal power distribution data;
determining a power unit area according to the power unit position information;
and determining the power unit power in the power unit area according to the power distribution of the printed circuit board and the power unit area.
Specifically, according to the preset size and starting position of the power units, determining the position coordinates of each vertex position of each power unit in a coordinate system established based on a printed circuit board, wherein the starting point is taken as one vertex of a first power unit in the printed circuit board, the length, width and height of the power unit can be obtained according to the size of the power unit, the long side of the power unit is parallel to the X axis, the wide side of the power unit is parallel to the Y axis, the high side of the power unit is parallel to the Z axis, the starting point is translated along the positive direction of the X axis according to the length of the power unit, the intersection point of the power unit on the X axis is obtained, and similarly, the intersection point of the Y axis and the Z axis can be respectively obtained, for example, when the power unit is a cube with the side length of 2mm, the length of each side is 2mm, the starting position is the origin of coordinates, it is thus possible to obtain the intersection coordinates of the cell with respect to X, Y and Z axes as (2,0,0), (0,2,0) and (0, 2), respectively, and since the long and wide sides of the printed circuit board are parallel to the X and Y axes, respectively, the vertex coordinates of the cell on the XY plane as (2, 0) are obtained, and similarly, the vertex coordinates of the XZ plane as (2,0,2), the vertex coordinates of the YZ plane as (0,2,2), and the vertex coordinates on the XY plane are shifted up by 2mm in the positive direction of the Z axis, i.e., the height value of the power unit, the vertex coordinates in the coordinate system as (2, 2) are obtained, and since one vertex of the power unit is the starting position of the circuit board, the vertex coordinates as (0, 0) are finally obtained by the above method as coordinates of the 8 vertex positions of the power unit are (0), 0,0) (2,0,0) (0,2,0) (0,0,2) (2,2,0) (0,2,2) (2,0,2) (2,2,2).
Further, the distribution position information of each emitting element or heating circuit in the printed circuit board on the circuit board and the corresponding power value of the heating source, namely the heat source information of the printed circuit board are obtained through the thermal power distribution data, the power unit position information, namely the fixed point position coordinates of each power unit can be obtained according to the thermal power distribution data, the power unit size and the power distribution of the printed circuit board can be obtained, the space region contained in the printed circuit board of the power unit is determined according to the fixed point position coordinates of 8 power units, the total power value of the heating element in the space region, namely the power unit power is determined according to the corresponding heat source distribution information in the region, and if no heating element exists in the region, the corresponding power unit power is determined to be 0.
In this optional embodiment, a specific space area of the power unit in the printed circuit board is determined through the position information of the power unit, and an accurate power value of the space area is determined according to the power distribution condition of the space area combined with the printed circuit board, so that an accurate power unit power is obtained, and the power unit power is assigned to a corresponding solver grid, so that the general hydrodynamic solver can perform thermal simulation according to the assigned solver grid, and the accuracy of thermal simulation of the general hydrodynamic solver according to thermal power distribution data is improved.
In an alternative embodiment, the method further comprises:
inputting the thermal power distribution data into an electronic heat dissipation solver, and outputting a second thermal simulation image;
and verifying the general fluid mechanics solver according to the comparison result of the second thermal simulation image and the first thermal simulation image.
In an alternative embodiment, verifying the generic hydrodynamic solver based on the comparison of the second thermal simulation map and the first thermal simulation image includes:
gray scale processing is carried out on the first thermal simulation image to obtain a first gray scale value of each pixel point in the first thermal simulation image, gray scale processing is carried out on the second thermal simulation image to obtain a second gray scale value of each pixel point of the second thermal simulation image, and the number of the pixel points of the first thermal simulation image is the same as that of the second thermal simulation image;
obtaining a verification coefficient according to all the first gray values, all the second gray values and the verification relation;
when the verification coefficient is smaller than a third preset threshold value, judging that the thermal simulation result of the general fluid mechanics solver is accurate;
otherwise, judging that the thermal simulation result of the general fluid mechanics solver is abnormal.
In an alternative embodiment, the check relation satisfies:
；
wherein k is the check coefficient, P i For the ith one of the first gray values of the first thermal simulation image, Q i And (3) the ith second gray value of the second thermal simulation image, and n is the number of pixels of the first thermal simulation image.
The electronic heat dissipation solver is a special tool for carrying out thermal simulation on electronic equipment, is different from a general fluid mechanics solver, can support thermal power distribution data input of a printed circuit board and output accurate thermal simulation images, so that the accuracy of thermal simulation of the general fluid mechanics solver according to the thermal power distribution data can be judged by inputting the thermal power distribution data into the electronic heat dissipation solver, outputting a second thermal simulation image and according to a comparison result of the second thermal simulation image and a first thermal simulation image obtained by the general fluid mechanics solver.
Further, the first thermal simulation image and the second thermal simulation image are respectively subjected to gray processing, and the thermal simulation image reflects the heating temperature of the printed circuit board according to different colors, so that after gray processing, temperature information corresponding to different positions in the thermal simulation image can be obtained according to specific gray values, the image temperature information of the thermal simulation image is converted into numerical temperature information of gray values, the first gray value of each pixel point is obtained according to the gray image of the first thermal simulation image, the second gray value of each pixel point is obtained according to the gray image of the second thermal simulation image, the verification coefficient of the first thermal simulation image and the verification coefficient of the second thermal simulation image are obtained according to the verification relation, the verification coefficient is compared with a preset third preset threshold, when the verification coefficient is smaller than the third preset threshold, the first thermal simulation image is judged to be accurate, namely the thermal simulation image of the printed circuit board obtained through the universal fluid mechanics solver is basically the same as the thermal simulation image obtained through the electronic heat dissipation solver, the set thermal simulation requirement can be met, when the verification coefficient is larger than or equal to the third preset threshold, and the thermal mechanics image of the thermal simulation image is judged according to the fact that the thermal mechanics of the thermal circuit has different distribution of the thermal simulation image.
In this optional embodiment, the first thermal simulation image and the second thermal simulation image are compared, that is, the thermal simulation images obtained by performing thermal simulation on the general fluid mechanics solver and the electronic heat dissipation solver according to the thermal power distribution data are compared, and because the electronic heat dissipation solver is designed specifically for performing thermal simulation on the printed circuit board and supports directly performing thermal simulation on the printed circuit board according to the thermal power distribution data, the second thermal simulation image obtained by the electronic heat dissipation solver has higher precision and is closer to the actual heating condition of the printed circuit board, so that whether the thermal simulation result obtained by the general fluid mechanics solver according to the thermal power distribution data is accurate or not can be judged according to the comparison result of the first thermal simulation image and the second thermal simulation image.
The embodiment of the invention provides a circuit thermal simulation device of a fluid mechanics solver, which comprises:
the acquisition module is used for acquiring thermal power distribution data of the printed circuit board and a solver grid of the universal hydrodynamic solver;
the processing module is used for obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
The matching module is used for judging that the power unit is matched with the solver grid when the power unit position and the grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, and assigning the power unit power of the power unit to the solver grid to obtain the power of the solver grid;
the operation module is used for determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
and the thermal simulation module is used for inputting the solver grid with the solver grid power density into the universal fluid mechanics solver and outputting a first thermal simulation image of the printed circuit board.
The thermal simulation device for the fluid mechanics solver circuit has similar technical effects to those of the thermal simulation method for the fluid mechanics solver circuit, and the detailed description is omitted.
The embodiment of the invention provides an electronic device, which comprises a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to implement the hydrodynamic solver circuit thermal simulation method as described above when executing the computer program.
The electronic device in the embodiment of the invention has the technical effects similar to the thermal simulation method of the fluid mechanics solver circuit, and the description is omitted here.
The embodiment of the invention provides a computer readable storage medium, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, the fluid mechanics solver circuit thermal simulation method is realized.
The computer readable storage medium in the embodiment of the present invention has similar technical effects to those of the above-mentioned hydrodynamic solver circuit thermal simulation method, and will not be described herein.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), or the like. In this application, the units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment of the present invention. In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
Although the invention is disclosed above, the scope of the invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications will fall within the scope of the invention.
Claims (10)
1. A method of thermal simulation of a hydrodynamic solver circuit, comprising:
acquiring thermal power distribution data of a printed circuit board and a solver grid of a general hydrodynamic solver;
obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
when the power unit position and the grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, judging that the power unit and the solver grid are matched, and assigning the power unit power of the power unit to the solver grid to obtain the power of the solver grid;
determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
Inputting the solver grid with the solver grid power density into the universal hydrodynamic solver and outputting a first thermal simulation image of the printed circuit board.
2. The method of claim 1, wherein the power cell locations comprise power cell center point location coordinates; the grid position comprises grid center point position coordinates; the power cell location and the grid location satisfying a first matching condition, comprising:
determining a center point distance according to the position coordinates of the center points of the power units, the position coordinates of the center points of the grids and the distance relation;
when the center point distance is smaller than a first preset threshold value, judging that the power unit position and the grid position meet the first matching condition;
the distance relation satisfies:
；
wherein D is the center point distance, (X) 1 ，Y 1 ，Z 1 ) For the power cell center point position coordinates, (X) 2 ，Y 2 ，Z 2 ) And (5) the grid center point position coordinates.
3. The method of claim 1, wherein the power cell locations comprise power cell vertex location coordinates; the grid position comprises grid vertex position coordinates; the power cell size and the grid size satisfying a second matching condition, comprising:
Determining the distance between each power unit vertex and all grid vertices according to the power unit vertex position coordinates of the power unit and the grid vertex position coordinates of the solver grid;
taking all the distances as sphere diameters, determining sphere volumes according to the sphere diameters, and selecting the largest sphere volume to be determined as a reference volume;
obtaining a power unit volume according to the power unit size, and obtaining a grid volume according to the grid size;
obtaining a volume matching coefficient according to the power unit volume, the grid volume and the reference volume and volume relation;
when the volume matching coefficient is smaller than a second preset threshold value, judging that the power unit size and the grid size meet the second matching condition of the foot;
the volume relationship satisfies:
；
wherein λ is the volume matching coefficient, a is the power unit volume, B is the grid volume, and C is the reference volume.
4. The method of claim 1, wherein the deriving the power cell position, power cell size, and power cell power of the power cells of the printed circuit board from the thermal power distribution data comprises:
Obtaining the power unit size, the power unit position information and the power distribution of the printed circuit board according to the thermal power distribution data;
determining a power unit area according to the power unit position information;
and determining the power unit power in the power unit area according to the power distribution of the printed circuit board and the power unit area.
5. The method of hydrodynamic solver circuit thermal simulation of claim 1, further comprising:
inputting the thermal power distribution data into an electronic heat dissipation solver, and outputting a second thermal simulation image;
and verifying the general fluid mechanics solver according to the comparison result of the second thermal simulation image and the first thermal simulation image.
6. The method of claim 5, wherein verifying the generic fluid mechanics solver based on the comparison of the second thermal simulation map and the first thermal simulation image comprises:
gray scale processing is carried out on the first thermal simulation image to obtain a first gray scale value of each pixel point in the first thermal simulation image, gray scale processing is carried out on the second thermal simulation image to obtain a second gray scale value of each pixel point of the second thermal simulation image, and the number of the pixel points of the first thermal simulation image is the same as that of the second thermal simulation image;
Obtaining a verification coefficient according to all the first gray values, all the second gray values and the verification relation;
when the verification coefficient is smaller than a third preset threshold value, judging that the thermal simulation result of the general fluid mechanics solver is accurate;
otherwise, judging that the thermal simulation result of the general fluid mechanics solver is abnormal.
7. The method of hydrodynamic solver circuit thermal simulation of claim 6, wherein the verification relationship satisfies:
；
wherein k is the check coefficient, P i For the ith one of the first gray values of the first thermal simulation image, Q i And (3) the ith second gray value of the second thermal simulation image, and n is the number of pixels of the first thermal simulation image.
8. A hydrodynamic solver circuit thermal simulation device, comprising:
the acquisition module is used for acquiring thermal power distribution data of the printed circuit board and a solver grid of the universal hydrodynamic solver;
the processing module is used for obtaining the power unit position, the power unit size and the power unit power of the power unit of the printed circuit board according to the thermal power distribution data, and obtaining the grid position and the grid size of the solver grid in the printed circuit board according to the solver grid;
The matching module is used for judging that the power unit is matched with the solver grid when the power unit position and the grid position meet a first matching condition and the power unit size and the grid size meet a second matching condition, and assigning the power unit power of the power unit to the solver grid to obtain the power of the solver grid;
the operation module is used for determining the power density of the solver grid of each solver grid according to the power of the solver grid and the corresponding grid size;
and the thermal simulation module is used for inputting the solver grid with the solver grid power density into the universal fluid mechanics solver and outputting a first thermal simulation image of the printed circuit board.
9. An electronic device comprising a memory and a processor;
the memory is used for storing a computer program;
the processor, when executing the computer program, is configured to implement the hydrodynamic solver circuit thermal simulation method of any one of claims 1 to 7.
10. A computer readable storage medium, characterized in that the storage medium has stored thereon a computer program which, when executed by a processor, implements a method for thermal simulation of a hydrodynamic solver circuit according to any of claims 1 to 7.
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