CN117233602B - Aging detection method of crystal-piercing machine and crystal-piercing machine - Google Patents
Aging detection method of crystal-piercing machine and crystal-piercing machine Download PDFInfo
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Abstract
The application relates to a crystal-piercing machine aging detection method and a crystal-piercing machine. The aging detection method of the die bonder comprises the following steps: standard operation data of the crystal spining machine are obtained, wherein the standard operation data comprise standard current data and standard position data of a motor of the crystal spining machine; acquiring actual operation data of the crystal spining machine, wherein the actual operation data comprises actual current data and actual position data of the motor; calculating a position deviation value of the standard position data and the actual position data; when the position deviation value is smaller than or equal to a preset position deviation value, calculating the current deviation value of the standard current data and the actual current data; and determining the aging state of the crystal spining machine according to the current deviation value. According to the aging detection method of the die-piercing machine and the die-piercing machine, the aging state of the motor can be timely judged by acquiring the actual current data in real time and calculating the current deviation value between the actual current data and the standard current data, so that the flexibility and timeliness of detecting the aging state of the die-piercing machine are improved.
Description
Technical Field
The application relates to the technical field of integrated circuits, in particular to a crystal punch aging detection method and a crystal punch.
Background
In the process of transferring chips, a die bonder is often used. A large number of chips can be quickly transferred from the temporary substrate to the product substrate in the die bonder. After the operation of the crystal needling machine is carried out for a period of time, equipment such as a motor and the like of the crystal needling machine can be aged, so that the transfer efficiency of the chip is affected. In the prior art, the aging detection is usually carried out on the crystal punch in a fixed period, and the aging judgment hysteresis of the crystal punch can be caused by the detection method.
Disclosure of Invention
Accordingly, it is desirable to provide a method for detecting the aging state of a die bonder and a die bonder capable of detecting the aging state of the die bonder in real time.
In one aspect, the present application provides a method for detecting aging of a die bonder, the method comprising:
standard operation data of the crystal spining machine are obtained, wherein the standard operation data comprise standard current data of a motor of the crystal spining machine;
acquiring actual operation data of the crystal spinners, wherein the actual operation data comprises actual current data of the motor;
calculating a current deviation value of the standard current data and the actual current data;
and determining the aging state of the crystal spinners according to the current deviation value.
In one embodiment, the obtaining the standard operation data of the spinners includes:
calculating theoretical current data of the motor when the pricker of the pricker machine is positioned at a preset position;
controlling the crystal-piercing machine to perform crystal-piercing test, and obtaining test current data of the motor when a piercing needle of the crystal-piercing machine is positioned at the preset position;
and obtaining the standard current data based on the theoretical current data and the test current data.
In one embodiment, the calculating theoretical current data of the motor when the needle of the spinnerette is at a preset position includes:
obtaining the tip height of the lancet;
obtaining the reference surface height of a reference carrier of the crystal-piercing machine;
and calculating theoretical current data of the motor when the puncture needle is positioned at a preset position based on the needle point height and the reference plane height.
In one embodiment, the predetermined position is the position where the lancet is at the lowest point.
In one embodiment, the determining the aging state of the spinners according to the current deviation value includes:
and when the current deviation value is greater than or equal to a preset current deviation value, determining that the crystal-piercing machine is aged.
In one embodiment, when the current deviation value is greater than or equal to a preset current deviation value, determining that the die bonder is aged includes:
and when the current deviation value is greater than or equal to a preset current deviation value, sending an alarm that the crystal-piercing machine needs to be overhauled.
In one embodiment, the determining the aging state of the spinners according to the current deviation value includes:
and when the current deviation value is smaller than a preset current deviation value, determining that the crystal-piercing machine is not aged.
In one embodiment, the preset current bias value is less than three percent.
In one embodiment, the standard operating data includes standard trip data of the motor, and the actual operating data includes actual trip data of the motor.
In another aspect, the present application provides a die bonder comprising:
a needle;
the motor is connected with the puncture needle and used for controlling the puncture needle to move along a first direction and a second direction, and the first direction is perpendicular to the second direction;
a reference carrier positioned below the lancet, the reference carrier being parallel to the first direction and perpendicular to the second direction;
and the control device is connected with the motor and executes the crystal-piercing machine detection method.
According to the aging detection method of the crystal-piercing machine and the crystal-piercing machine, the aging state of the motor can be timely judged by acquiring the actual current data in real time and calculating the current deviation value between the actual current data and the standard current data, and the maintenance or replacement decision of the crystal-piercing machine is made according to the aging state of the motor, so that the flexibility and timeliness of detecting the aging state of the crystal-piercing machine are improved.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a die bonder according to one embodiment;
FIG. 2 is a schematic diagram of a die bonder according to another embodiment;
FIG. 3 is a flow chart of a method for burn-in detection of a die bonder according to one embodiment;
FIG. 4 is a schematic diagram of a detection curve provided in one embodiment;
FIG. 5 is a block diagram of an apparatus for inspecting burn-in of a die bonder in one embodiment.
Reference numerals illustrate: needle-100; a motor-110; a first motor-111; a second motor-112; and a connecting device 120.
Detailed Description
In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The aging detection method of the die bonder can be applied to a terminal environment. The terminal may be, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers.
In one embodiment, referring to fig. 1 and 2, a die bonder is provided. The die bonder comprises a needling needle 100, a motor 110, a reference carrier and a control device.
The lancet 100 is used to transfer chips on a temporary substrate to a reference stage therebelow. The pricker 100 is connected with the motor 110 through the connecting device 120, and the pricker machine controls the pricker 100 to move along the first direction and the second direction through the motor 110 so as to transfer the chip on the temporary substrate to the reference carrier. As an example, the first direction and the second direction are perpendicular, for example, the first direction may be a horizontal direction and the second direction may be a vertical direction, and at this time, the reference stage is parallel to the first direction and perpendicular to the second direction.
The motor 110 may include a first motor 111 and a second motor 112. For example, the first motor 111 controls the lancet 100 to move in a first direction and the second motor 112 controls the lancet 100 to move in a second direction. Referring to fig. 2, the first motor 111 may be a motor M1, and the second motor 112 may be a motor M2.
The control device of the crystal punch is connected with the motor 110 and is used for controlling the working state of the motor 110. As an example, the control device may be integrated in a terminal such as a personal computer or a notebook computer.
After the spining operation is performed for a period of time, the motor 110 or the connection device 120, etc. may be aged. By way of example, in operation of the lancet, the connecting means 120 receives tension from both the motor 110 and the lancet 100. The number of times the punch is used is increased once each time the punch 100 completes a punch down operation. Along with superposition of the operation speed and time of the crystal-piercing machine, the using times are continuously accumulated until the upper limit of the preset using times of the crystal-piercing machine is reached, and the crystal-piercing machine system prompts to replace the device so as to ensure stable mass production and processing of subsequent equipment.
The mechanical property change of the spinners may be small and not considered until the damage critical point is reached, but the connection device 120 of the spinners quickly changes very much once the critical point is reached, and the spinners need to be replaced.
Accordingly, in one embodiment, a method for detecting aging of a die bonder is provided for detecting the aging state of the motor 110 in real time. The aging detection method of the crystal punch can be applied to a control device of the crystal punch.
Referring to fig. 3, the method for detecting the aging of the die bonder includes the following steps:
step S100: standard operation data of the spinners are acquired, wherein the standard operation data comprise standard current data and standard position data of the motor 110 of the spinners.
Step S200: actual operation data of the die bonder is acquired, wherein the actual operation data comprises actual current data and actual position data of the motor 110.
Step S300: position deviation values of the standard position data and the actual position data are calculated.
Step S400: and when the position deviation value is smaller than or equal to a preset position deviation value, calculating the current deviation value of the standard current data and the actual current data.
Step S500: and determining the aging state of the crystal spining machine according to the current deviation value.
In step S100, the standard current data is the variation data of the current of the spinnerette motor 110 in the normal operation procedure. As an example, the standard current data may include data of the motor 110 in different strokes. For example, the standard current data includes data when the motor 110 controls the lancet 100 to move in the horizontal direction, and data when the motor 110 controls the lancet 100 to move in the vertical direction.
The standard operating data also includes standard position data for the motor 110 of the die bonder.
In step S200, the actual operation data is the change data of the current obtained when the motor 110 is monitored in real time. It will be appreciated that the actual operating data may also include data of the motor 110 during different strokes. At this time, the motor stroke in the actual operation data should correspond to the motor stroke in the standard current data.
Also, the actual operation data includes actual position data of the motor 110.
In step S300, the standard position data may be standard movement data when the motor 110 controls the movement of the lancet 100, and the actual operation data may be actual movement data when the motor 110 controls the movement of the lancet 100. Both the standard movement data and the actual movement data of the motor 110 can be the movement coordinates of the motor 110 as it controls the movement of the lancet 100.
The control means will control the movement of the lancet 100 by controlling the movement of the motor 110. At this time, a deviation may occur in the movement of the motor 110, that is, the standard position data and the actual position data may be different, resulting in the occurrence of a position deviation value.
In step S400, when the position deviation value is less than or equal to the preset position deviation value, it indicates that the accuracy of the movement of the motor 110 meets the requirement. At this time, the current deviation values of the standard current data and the actual current data are calculated again, and if the current deviation value is greater than or equal to the preset current deviation value, it is determined that the current deviation value is not caused by the accuracy of the movement of the motor 110, but is caused by the aging of the spinners.
When the position deviation value is greater than the preset position deviation value, it indicates that the accuracy of the movement of the motor 110 (e.g., the movement repeatability of the motor 110) is not satisfactory. At this time, if the current deviation value is equal to or greater than the preset current deviation value, it is also impossible to determine whether such current deviation value is caused by the accuracy of the movement of the motor 110 or by the aging of the die-piercing machine. Therefore, when the position deviation value is greater than the preset position deviation value, the subsequent steps can be omitted.
Referring to fig. 4, the actual current data may deviate from the standard current data. The current deviation value is used for measuring the deviation degree of the actual current data compared with the standard current data. For example, the current deviation value is a difference between actual current data and standard current data.
In step S500, the current deviation value reflects the aging state of the spinners. For example, the burn-in state of the die bonder may be the burn-in state of the motor 110 or the connection device 120.
As an example, when the current deviation value is greater than or equal to a preset current deviation value, the aging of the die-piercing machine is determined. And when the current deviation value is smaller than the preset current deviation value, determining that the crystal-piercing machine is not aged. The preset current offset value may be less than three percent. For example, the preset current bias value may be two percent.
In this embodiment, by acquiring actual current data in real time and calculating a current deviation value between the actual current data and standard current data, an aging state of the die-piercing machine can be timely determined, and a determination as to whether to repair or replace the die-piercing machine is made according to the aging state of the die-piercing machine. Compared with the prior art, the aging detection method of the crystal-piercing machine in the embodiment can monitor the crystal-piercing machine in real time, does not need to detect the crystal-piercing machine in a fixed detection period, and improves the flexibility and timeliness of detecting the aging state of the crystal-piercing machine.
In addition, in this embodiment, the actual current data may be obtained while the die attach machine works, that is, the actual current data may be the current data of each die attach machine work, so that the embodiment does not need to separately test the aging state of the structures such as the motor 110 or the connection device 120. Each time the crystal needling machine works, the crystal needling machine can be considered to be subjected to one-time aging detection, and a fixed detection period is not required to be set for the crystal needling machine, so that the working efficiency of the crystal needling machine is improved.
In addition, the actual running data comprises the stroke of the motor, so that the problem stroke section can be positioned by searching the stroke data of the motor where the current deviation value is located.
Meanwhile, in the embodiment, the position deviation value is calculated first, and when the position deviation value is smaller than or equal to the preset position deviation value, the current deviation values of the standard current data and the actual current data are calculated again, so that the possibility that the current deviation value is larger than or equal to the preset current deviation value due to the moving precision of the motor 110 is eliminated, and the aging of the crystal-piercing machine is misjudged.
The standard current data may be current loop data, and the standard position data may be position loop data, where the current loop curve corresponds to and fits to the position loop curve. In addition, since the amount of chips transferred by needling is very large, the operation of the present embodiment can be performed only for the first row, middle row and last row of needling transfer in the actual test process, so that not much system resources are occupied.
In one embodiment, step S500 includes:
step S510: and when the current deviation value is greater than or equal to a preset current deviation value, sending an alarm that the crystal-piercing machine needs to be overhauled.
When the current deviation value is equal to or greater than the preset current deviation value, it is considered that the constituent equipment of the spinners (e.g., the motor 110 of the spinners, etc.) need to be repaired or replaced. At this time, a control device (e.g., a server or the like) is provided to send an alarm to a client (e.g., a personal computer or the like) that the die bonder needs inspection. When the staff checks the alarm, the component equipment of the crystal-piercing machine can be quickly maintained or replaced.
As an example, the alert may be a prompt message in the client.
In one embodiment, step S100 includes:
step S110: theoretical current data of the motor 110 is calculated when the lancet 100 of the spining machine is located at a preset position.
Step S120: and controlling the crystal punching machine to perform crystal punching test, and obtaining test current data of the motor 110 when the needle 100 of the crystal punching machine is positioned at a preset position.
Step S130: based on the theoretical current data and the test current data, standard current data is obtained.
In step S110, theoretical current data of the motor 110 may be calculated by a corresponding formula. The theoretical current data may be calculated current data of the motor 110 with the lancet 100 at the lowest point.
In step S120, the spining machine is controlled to perform an actual spining test, and current data of the motor 110 when the needle 100 is at the lowest point is obtained.
In step S130, as an example, the theoretical current data may be slightly corrected based on the test current data, and the corrected theoretical current data may be used as the standard current data.
In another example, the average value of the theoretical current data and the test current data may be calculated as the standard current data.
In this embodiment, standard current data is obtained through theoretical current data and test current data, and the situation that the test current data and the theoretical current data may be different when the die-piercing machine actually works is considered. The standard current data obtained through calculation in the embodiment is more in line with the actual running condition of the crystal spinners.
In one embodiment, step S110 includes:
step S111: the tip height of the lancet 100 is obtained.
Step S112: and obtaining the reference surface height of the reference carrier of the crystal spining machine.
Step S113: based on the tip height and the reference plane height, theoretical current data of the motor 110 is calculated when the lancet 100 is located at a preset position.
In step S111, the obtaining of the tip height of the lancet 100 can be a height calibration of the tip. As an example, the die-piercing machine may be provided with a height calibration unit, and the height calibration of the needle tip is performed by the pressure sensor, and in this process, the calibration may be repeated three times for verification.
In step S112, the reference stage may have a gradient, and at this time, the laser sensor may be used to measure the height of the reference stage at multiple points, so as to calculate the reference plane height of the reference stage.
In step S113, theoretical current data for the motor 110 can be calculated based on the tip height and the reference plane height, and based on the trace fit, when the lancet 100 is at the lowest point.
It should be understood that, although the steps in the flowchart of fig. 3 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps in fig. 3 may include a plurality of steps or stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily sequential, but may be performed in rotation or alternatively with at least a portion of the steps or stages in other steps or other steps.
In one embodiment, as shown in fig. 5, a device for detecting aging of a die bonder is provided, and the device is embedded in a control device of the die bonder.
The aging detection device of the die bonder comprises:
the first obtaining module is configured to obtain standard operation data of the spining machine, where the standard operation data includes standard current data of the motor 110 of the spining machine.
The second obtaining module is configured to obtain actual operation data of the spining machine, where the actual operation data includes actual current data of the motor 110.
And the calculating module is used for calculating the current deviation value of the standard current data and the actual current data.
And the determining module is used for determining the aging state of the crystal spining machine according to the current deviation value.
For specific limitations on the device for detecting aging of the die-piercing machine, reference may be made to the above limitation on the method for detecting aging of the die-piercing machine, and the description thereof will not be repeated here. All or part of the modules in the aging detection device of the die bonder can be realized by software, hardware and a combination thereof. The above modules may be embedded in hardware or may be independent of a processor in the computer device, or may be stored in software in a memory in the computer device, so that the processor may call and execute operations corresponding to the above modules.
In one embodiment, a computer device is provided, which may be a terminal. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program, when executed by a processor, implements a method for burn-in detection for a die bonder. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.
In one embodiment, a computer device, a computer readable storage medium, a computer program product are provided, the computer device, the computer readable storage medium, the computer program product may implement the steps of:
step S100: standard operation data of the spinners are acquired, the standard operation data comprising standard current data of the motor 110 of the spinners.
Step S200: actual operation data of the die attach machine is obtained, and the actual operation data comprises actual current data of the motor 110.
Step S400: and calculating a current deviation value of the standard current data and the actual current data.
Step S500: and determining the aging state of the crystal spining machine according to the current deviation value.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. The method for detecting the aging of the die bonder is characterized by comprising the following steps of:
standard operation data of the crystal spining machine are obtained, wherein the standard operation data comprise standard current data and standard position data of a motor of the crystal spining machine;
acquiring actual operation data of the crystal spining machine, wherein the actual operation data comprises actual current data and actual position data of the motor;
calculating a position deviation value of the standard position data and the actual position data;
when the position deviation value is smaller than or equal to a preset position deviation value, calculating the current deviation value of the standard current data and the actual current data;
and determining the aging state of the crystal spinners according to the current deviation value.
2. The method of claim 1, wherein the obtaining standard operating data of the die-piercing machine comprises:
calculating theoretical current data of the motor when the pricker of the pricker machine is positioned at a preset position;
controlling the crystal-piercing machine to perform crystal-piercing test, and obtaining test current data of the motor when a piercing needle of the crystal-piercing machine is positioned at the preset position;
and obtaining the standard current data based on the theoretical current data and the test current data.
3. The method of claim 2, wherein calculating theoretical current data for the motor when the lancet of the lancing machine is in a preset position comprises:
obtaining the tip height of the lancet;
obtaining the reference surface height of a reference carrier of the crystal-piercing machine;
and calculating theoretical current data of the motor when the puncture needle is positioned at a preset position based on the needle point height and the reference plane height.
4. The method of claim 2, wherein the predetermined location is a location where the lancet is at a lowest point.
5. The method of claim 1, wherein determining the aging state of the die-piercing machine based on the current bias value comprises:
and when the current deviation value is greater than or equal to a preset current deviation value, determining that the crystal-piercing machine is aged.
6. The method of claim 5, wherein determining that the die attach machine is degraded when the current bias value is greater than or equal to a preset current bias value comprises:
and when the current deviation value is greater than or equal to a preset current deviation value, sending an alarm that the crystal-piercing machine needs to be overhauled.
7. The method of claim 1, wherein determining the aging state of the die-piercing machine based on the current bias value comprises:
and when the current deviation value is smaller than a preset current deviation value, determining that the crystal-piercing machine is not aged.
8. The method of any one of claims 5 or 7, wherein the preset current bias value is less than three percent.
9. The method of claim 1, wherein the standard operating data comprises standard trip data for the motor and the actual operating data comprises actual trip data for the motor.
10. A die bonder, comprising:
a needle;
the motor is connected with the puncture needle and used for controlling the puncture needle to move along a first direction and a second direction, and the first direction is perpendicular to the second direction;
a reference carrier positioned below the lancet, the reference carrier being parallel to the first direction and perpendicular to the second direction;
control means connected to the motor and performing the method for detecting a die-piercing machine according to any one of claims 1-9.
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